UCC27524A Dual 5-A Gate Driver PDF

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UCC27524A
SLUSBP4B – AUGUST 2013 – REVISED OCTOBER 2014
UCC27524A Dual 5-A, High-Speed, Low-Side Gate Driver With Negative Input Voltage
Capability
1 Features 3 Description
•
1 Industry-Standard Pin Out The UCC27524A device is a dual-channel, high-
speed, low-side, gate-driver device capable of
• Two Independent Gate-Drive Channels effectively driving MOSFET and IGBT power
• 5-A Peak Source and Sink-Drive Current switches. The UCC27524A is a variant of the
• Independent-Enable Function for Each Output UCC2752x family. The UCC27524A adds the ability
• TTL and CMOS Compatible Logic Threshold to handle –5 V directly at the input pins for increased
robustness. The UCC27524A is a dual non-inverting
Independent of Supply Voltage
driver. Using a design that inherently minimizes
• Hysteretic-Logic Thresholds for High Noise shoot-through current, the UCC27524A is capable of
Immunity delivering high-peak current pulses of up to 5-A
• Ability to Handle Negative Voltages (–5 V) at source and 5-A sink into capacitive loads along with
Inputs rail-to-rail drive capability and extremely small
propagation delay typically 13 ns. In addition, the
• Inputs and Enable Pin-Voltage Levels Not drivers feature matched internal propagation delays
Restricted by VDD Pin Bias Supply Voltage between the two channels which are very well suited
• 4.5 to 18-V Single-Supply Range for applications requiring dual-gate drives with critical
• Outputs Held Low During VDD-UVLO (Ensures timing, such as synchronous rectifiers. This also
Glitch-Free Operation at Power Up and Power enables connecting two channels in parallel to
Down) effectively increase current-drive capability or driving
two switches in parallel with a single input signal. The
• Fast Propagation Delays (13-ns Typical) input pin thresholds are based on TTL and CMOS
• Fast Rise and Fall Times (7-ns and 6-ns Typical) compatible low-voltage logic, which is fixed and
• 1-ns Typical Delay Matching Between 2-Channels independent of the VDD supply voltage. Wide
hysteresis between the high and low thresholds offers
• Two Outputs are Paralleled for Higher Drive excellent noise immunity.
Current
• Outputs Held in Low When Inputs Floating Device Information(1)
• SOIC-8, HVSSOP-8 PowerPAD™ Package PART NUMBER PACKAGE BODY SIZE (NOM)
Options SOIC (8) 4.90 mm x 3.91 mm
UCC27524A
• Operating Temperature Range of –40 to 140°C HVSSOP (8) 3.00 mm x 3.00 mm
(1) For all available packages, see the orderable addendum at
2 Applications the end of the datasheet.
• Switch-Mode Power Supplies

Dual Non-Inverting Inputs
• DC-to-DC Converters
• Motor Control, Solar Power
• Gate Drive for Emerging Wide Band-Gap Power
Devices Such as GaN
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
UCC27524A
SLUSBP4B – AUGUST 2013 – REVISED OCTOBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.2 Functional Block Diagram ....................................... 12
2 Applications ........................................................... 1 8.3 Feature Description................................................. 12
3 Description ............................................................. 1 8.4 Device Functional Modes........................................ 17
4 Revision History..................................................... 2 9 Applications and Implementation ...................... 18
9.1 Application Information............................................ 18
5 Description (Continued) ........................................ 3
9.2 Typical Application .................................................. 18
6 Pin Configuration and Functions ......................... 3
10 Power Supply Recommendations ..................... 23
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
7.2 Handling Ratings....................................................... 4
11.2 Layout Example .................................................... 24
7.3 Recommended Operating Conditions....................... 4
11.3 Thermal Protection................................................ 24
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6 12 Device and Documentation Support ................. 26
7.6 Switching Characteristics .......................................... 6 12.1 Trademarks ........................................................... 26
7.7 Typical Characteristics .............................................. 8 12.2 Electrostatic Discharge Caution ............................ 26
12.3 Glossary ................................................................ 26
8 Detailed Description ............................................ 11
8.1 Overview ................................................................. 11 13 Mechanical, Packaging, and Orderable
Information ........................................................... 26
4 Revision History
Changes from Revision A (August 2013) to Revision B Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Changes from Original (August 2013) to Revision A Page
• Changed marketing status from Product Preview to Production Data. .................................................................................. 1

• Changed Enable voltage, ENA and ENB minimum from 0 to –2. .......................................................................................... 4
2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: UCC27524A

UCC27524A
www.ti.com SLUSBP4B – AUGUST 2013 – REVISED OCTOBER 2014
5 Description (Continued)
For safety purpose, internal pull-up and pull-down resistors on the input pins of the UCC27524A ensure that
outputs are held LOW when input pins are in floating condition. UCC27524A features Enable pins (ENA and
ENB) to have better control of the operation of the driver applications. The pins are internally pulled up to VDD
for active-high logic and are left open for standard operation.
UCC27524A family of devices are available in SOIC-8 (D), VSSOP-8 with exposed pad (DGN) packages.
6 Pin Configuration and Functions
8-Pin
D, DGN Package
Top View
ENA 1 8 ENB
INA 2 7 OUTA
GND 3 6 VDD
INB 4 5 OUTB
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
ENA 1 I Enable input for Channel A: ENA is biased LOW to disable the Channel A output regardless of the
INA state. ENA is biased HIGH or left floating to enable the Channel A output. ENA is allowed to
float; hence the pin-to-pin compatibility with the UCC2732X N/C pin.
ENB 8 I Enable input for Channel B: ENB is biased LOW to disables the Channel B output regardless of the
INB state. ENB is biased HIGH or left floating to enable Channel B output. ENB is allowed to float
hence; the pin-to-pin compatibility with the UCC2752A N/C pin.
GND 3 - Ground: All signals are referenced to this pin.
INA 2 I Input to Channel A: INA is the non-inverting input in the UCC27524A device. OUTA is held LOW if
INA is unbiased or floating.
INB 4 I Input to Channel B: INB is the non-inverting input in the UCC27524A device. OUTB is held LOW if
INB is unbiased or floating.
OUTA 7 O Output of Channel A
OUTB 5 O Output of Channel B
VDD 6 I Bias supply input
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3

UCC27524A
7 Specifications
7.1 Absolute Maximum Ratings (1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage range VDD –0.3 20 V
DC –0.3 VDD + 0.3 V
OUTA, OUTB voltage
Repetitive pulse < 200 ns (3) –2 VDD + 0.3 V
Output continuous source/sink current IOUT_DC 0.3 A
Output pulsed source/sink current (0.5 µs) IOUT_pulsed 5 A
INA, INB, ENA, ENB voltage (4) –5 20 V
Operating virtual junction temperature, TJ range –40 150 °C
Soldering, 10 seconds 300 °C
Lead temperature
Reflow 260 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See
Packaging Section of the datasheet for thermal limitations and considerations of packages.
(3) Values are verified by characterization on bench.
(4) The maximum voltage on the Input and Enable pins is not restricted by the voltage on the VDD pin.
7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–4000 4000
pins (1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification
–1000 1000
JESD22-C101, all pins (2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions

MIN TYP MAX UNIT
Supply voltage range, VDD 4.5 12 18 V
Operating junction temperature range –40 140 °C
Input voltage, INA, INB –2 18
V
Enable voltage, ENA and ENB –2 18

UCC27524A
7.4 Thermal Information

UCC27524A UCC27524A
THERMAL METRIC SOIC (D) MSOP (DGN) (1) UNIT
8 PINS 8 PINS
θJA Junction-to-ambient thermal resistance (2) 130.9 71.8
θJCtop Junction-to-case (top) thermal resistance (3) 80.0 65.6
(4)
θJB Junction-to-board thermal resistance 71.4 7.4
°C/W
ψJT Junction-to-top characterization parameter (5) 21.9 7.4
ψJB Junction-to-board characterization parameter (6) 70.9 31.5
θJCbot Junction-to-case (bottom) thermal resistance (7) n/a 19.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer

UCC27524A
7.5 Electrical Characteristics

VDD = 12 V, TA = TJ = –40 °C to 140 °C, 1-µF capacitor from VDD to GND. Currents are positive into, negative out of the
specified terminal (unless otherwise noted,)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
BIAS CURRENTS
VDD = 3.4 V,
INA = VDD, 55 110 175
Startup current, INB = VDD
IDD(off) (based on UCC27524 Input μA
configuration) VDD = 3.4 V,
INA = GND, 25 75 145
INB = GND
UNDER VOLTAGE LOCKOUT (UVLO)
TJ = 25 °C 3.91 4.2 4.5
VON Supply start threshold
TJ = –40 °C to 140 °C 3.7 4.2 4.65
Minimum operating voltage V
VOFF 3.4 3.9 4.4
after supply start
VDD_H Supply voltage hysteresis 0.2 0.3 0.5
INPUTS (INA, INB, INA+, INA–, INB+, INB–), UCC27524A (D, DGN)
Output high for non-inverting input pins
VIN_H Input signal high threshold 1.9 2.1 2.3
Output low for inverting input pins
Output low for non-inverting input pins V
VIN_L Input signal low threshold 1 1.2 1.4
Output high for inverting input pins
VIN_HYS Input hysteresis 0.7 0.9 1.1
OUTPUTS (OUTA, OUTB)
ISNK/SRC Sink/source peak current (1) CLOAD = 0.22 µF, FSW = 1 kHz ±5 A
VDD-VOH High output voltage IOUT = –10 mA 0.075
V
VOL Low output voltage IOUT = 10 mA 0.01
ROH Output pullup resistance (2) IOUT = –10 mA 2.5 5 7.5 Ω
ROL Output pulldown resistance IOUT = 10 mA 0.15 0.5 1 Ω
(1) Ensured by design.

(2) ROH represents on-resistance of only the P-Channel MOSFET device in the pullup structure of the UCC27524A output stage.
7.6 Switching Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tR Rise time (1) CLOAD = 1.8 nF 7 18
tF Fall time (1) CLOAD = 1.8 nF 6 10
INA = INB, OUTA and OUTB at 50%
tM Delay matching between 2 channels 1 4
transition point
ns
Minimum input pulse width that
tPW 15 25
changes the output state
tD1, tD2 Input to output propagation delay (1) CLOAD = 1.8 nF, 5-V input pulse 6 13 23
tD3, tD4 EN to output propagation delay (1) CLOAD = 1.8 nF, 5-V enable pulse 6 13 23
(1) See the timing diagrams in Figure 1 and Figure 2

UCC27524A
High
Input
Low
High
Enable
Low
90%
Output
10%
tD3 tD4 UDG-11217
Figure 1. Enable Function

(For Non-Inverting Input-Driver Operation)
High
Input
Low
High
Enable
Low
90%
Output
10%
tD1 tD2 UDG-11219
Figure 2. Non-Inverting Input-Driver Operation

UCC27524A
7.7 Typical Characteristics
4
Input=VDD
0.14 Input=GND
Operating Supply Current (mA)

Startup Current (mA)
0.12 3.5
0.1
3
VDD = 12 V
0.08 fSW = 500 kHz
CL = 500 pF
VDD=3.4V
0.06 2.5
−50 0 50 100 150 −50 0 50 100 150
Temperature (°C) G001
Figure 3. Start-Up Current vs Temperature Figure 4. Operating Supply Current vs Temperature

(Outputs Switching)
0.6 5
Input=GND UVLO Rising
Input=VDD UVLO Falling
0.5 4.5
Supply Current (mA)
UVLO Threshold (V)

0.4 4
0.3 3.5
Enable=12 V
VDD = 12 V
0.2 3
−50 0 50 100 150 −50 0 50 100 150
Figure 5. Supply Current vs Temperature (Outputs In DC Figure 6. UVLO Threshold vs Temperature

On/Off Condition)
2.5 2.5
2 2
Enable Threshold (V)
Input Threshold (V)
VDD = 12 V VDD = 12 V
1.5 1.5
1 1
Input High Threshold Enable High Threshold

Input Low Threshold Enable Low Threshold
0.5 0.5
−50 0 50 100 150 −50 0 50 100 150
Figure 7. Input Threshold vs Temperature Figure 8. Enable Threshold vs Temperature

UCC27524A
Typical Characteristics (continued)

7 1
VDD = 12 V VDD = 12 V
Output Pull−down Resistance (Ω)

IOUT = −10 mA IOUT = 10 mA
Output Pull−up Resistance (Ω)
6 0.8
5 0.6
4 0.4
3 0.2
−50 0 50 100 150 −50 0 50 100 150
Figure 9. Output Pullup Resistance vs Temperature Figure 10. Output Pulldown Resistance vs Temperature
10 9
VDD = 12 V VDD = 12 V
CLOAD = 1.8 nF CLOAD = 1.8 nF
9
8
Rise Time (ns)
Fall Time (ns)

8
7
7
6
6
5 5
−50 0 50 100 150 −50 0 50 100 150
Figure 11. Rise Time vs Temperature Figure 12. Fall Time vs Temperature
18 18
Input to Output Propagation Delay (ns)
Turn−on EN to Output High

EN to Output Propagation Delay (ns)
Turn−off EN to Output Low

16 16
14 14
12 12
10 10
VDD = 12 V VDD = 12 V
8 8
−50 0 50 100 150 −50 0 50 100 150
Figure 13. Input to Output Propagation Delay vs Figure 14. En to Output Propagation Delay vs Temperature
Temperature

UCC27524A
Typical Characteristics (continued)

60 22
VDD = 4.5 V Input to Output On delay
VDD = 12 V Input to Ouptut Off Delay
Operating Supply Current (mA)
50
VDD = 15 V EN to Output On Delay
Propagation Delays (ns)

18 EN to Output Off Delay
40
CLOAD = 1.8 nF
Both channels switching
30 14
20
10
10
CLOAD = 1.8 nF
0 6
0 100 200 300 400 500 600 700 800 900 1000 4 8 12 16 20
Frequency (kHz) G013 Supply Voltage (V) G014
Figure 15. Operating Supply Current vs Frequency Figure 16. Propagation Delays vs Supply Voltage
18 10
14 8
Rise Time (ns)
Fall Time (ns)

10 6
6 4
4 8 12 16 20 4 8 12 16 20
Supply Voltage (V) G015 Supply Voltage (V) G016
Figure 17. Rise Time vs Supply Voltage Figure 18. Fall Time vs Supply Voltage
2.5
Enable High Threshold VDD = 4.5 V
Enable Low Threshold
2
Enable Threshold (V)
1.5
0.5
−50 0 50 100 150
Figure 19. Enable Threshold vs Temperature

UCC27524A
8 Detailed Description
8.1 Overview
The UCC27524A device represents Texas Instruments’ latest generation of dual-channel low-side high-speed
gate-driver devices featuring a 5-A source and sink current capability, industry best-in-class switching
characteristics, and a host of other features listed in Table 1 all of which combine to ensure efficient, robust and
reliable operation in high-frequency switching power circuits.
Table 1. UCC27524A Features and Benefits

FEATURE BENEFIT
Best-in-class 13-ns (typ) propagation delay Extremely low-pulse transmission distortion
Ease of paralleling outputs for higher (2 times) current capability,
1-ns (typ) delay matching between channels
ease of driving parallel-power switches
Expanded VDD Operating range of 4.5 to 18 V
Expanded operating temperature range of –40 °C to +140 °C Flexibility in system design
(See Electrical Characteristics table)
Outputs are held Low in UVLO condition, which ensures predictable,
VDD UVLO Protection
glitch-free operation at power-up and power-down
Safety feature, especially useful in passing abnormal condition tests
Outputs held Low when input pins (INx) in floating condition
during safety certification
Pin-to-pin compatibility with the UCC27324 device from Texas
Outputs enable when enable pins (ENx) in floating condition Instruments, in designs where Pin 1 and Pin 8 are in floating
condition
Enhanced noise immunity, while retaining compatibility with
CMOS/TTL compatible input and enable threshold with wide
microcontroller logic-level input signals (3.3 V, 5 V) optimized for
hysteresis
digital power
Ability of input and enable pins to handle voltage levels not restricted System simplification, especially related to auxiliary bias supply
by VDD pin bias voltage architecture
Ability to handle –5 VDC (max) at input pins Increased robustness in noisy environments

UCC27524A
8.2 Functional Block Diagram
VDD VDD
200 kW 200 kW
ENA 1 8 ENB
VDD
INA OUTA
2 7
400 kW VDD
VDD
VDD
UVLO
GND 3 6
VDD
INB OUTB
4 5
400 kW
8.3 Feature Description

8.3.1 Operating Supply Current
The UCC27524A products feature very low quiescent IDD currents. The typical operating-supply current in UVLO
state and fully-on state (under static and switching conditions) are summarized in Figure 3, Figure 4 and
Figure 5. The IDD current when the device is fully on and outputs are in a static state (DC high or DC low, see
Figure 4) represents lowest quiescent IDD current when all the internal logic circuits of the device are fully
operational. The total supply current is the sum of the quiescent IDD current, the average IOUT current because of
switching, and finally any current related to pullup resistors on the enable pins and inverting input pins. For
example when the inverting input pins are pulled low additional current is drawn from the VDD supply through the
pullup resistors (see though ). Knowing the operating frequency (fSW) and the MOSFET gate (QG) charge at the
drive voltage being used, the average IOUT current can be calculated as product of QG and fSW.
A complete characterization of the IDD current as a function of switching frequency at different VDD bias voltages
under 1.8-nF switching load in both channels is provided in Figure 15. The strikingly linear variation and close
correlation with theoretical value of average IOUT indicates negligible shoot-through inside the gate-driver device
attesting to its high-speed characteristics.
8.3.2 Input Stage

The input pins of UCC27524A gate-driver devices are based on a TTL and CMOS compatible input-threshold
logic that is independent of the VDD supply voltage. With typically high threshold = 2.1 V and typically low
threshold = 1.2 V, the logic level thresholds are conveniently driven with PWM control signals derived from 3.3-V
and 5-V digital power-controller devices. Wider hysteresis (typ 0.9 V) offers enhanced noise immunity compared
to traditional TTL logic implementations, where the hysteresis is typically less than 0.5 V. UCC27524A devices
also feature tight control of the input pin threshold voltage levels which eases system design considerations and
ensures stable operation across temperature (refer to Figure 7). The very low input capacitance on these pins
reduces loading and increases switching speed.

UCC27524A
Feature Description (continued)

The UCC27524A device features an important safety feature wherein, whenever any of the input pins is in a
floating condition, the output of the respective channel is held in the low state. This is achieved using GND
pulldown resistors on all the non-inverting input pins (INA, INB), as shown in the device block diagrams.
The input stage of each driver is driven by a signal with a short rise or fall time. This condition is satisfied in
typical power supply applications, where the input signals are provided by a PWM controller or logic gates with
fast transition times (<200 ns) with a slow changing input voltage, the output of the driver may switch repeatedly
at a high frequency. While the wide hysteresis offered in UCC27524A definitely alleviates this concern over most
other TTL input threshold devices, extra care is necessary in these implementations. If limiting the rise or fall
times to the power device is the primary goal, then an external resistance is highly recommended between the
output of the driver and the power device. This external resistor has the additional benefit of reducing part of the
gate-charge related power dissipation in the gate driver device package and transferring it into the external
resistor itself.
8.3.3 Enable Function

The enable function is an extremely beneficial feature in gate-driver devices especially for certain applications
such as synchronous rectification where the driver outputs disable in light-load conditions to prevent negative
current circulation and to improve light-load efficiency.
UCC27524A device is provided with independent enable pins ENx for exclusive control of each driver-channel
operation. The enable pins are based on a non-inverting configuration (active-high operation). Thus when ENx
pins are driven high the drivers are enabled and when ENx pins are driven low the drivers are disabled. Like the
input pins, the enable pins are also based on a TTL and CMOS compatible input-threshold logic that is
independent of the supply voltage and are effectively controlled using logic signals from 3.3-V and 5-V
microcontrollers. The UCC27524A devices also feature tight control of the Enable-function threshold-voltage
levels which eases system design considerations and ensures stable operation across temperature (refer to
Figure 8). The ENx pins are internally pulled up to VDD using pullup resistors as a result of which the outputs of
the device are enabled in the default state. Hence the ENx pins are left floating or Not Connected (N/C) for
standard operation, where the enable feature is not needed. Essentially, this floating allows the UCC27524A
device to be pin-to-pin compatible with TI’s previous generation of drivers (UCC27323, UCC27324, and
UCC27325 respectively), where Pin 1 and Pin 8 are N/C pins. If the channel A and Channel B inputs and outputs
are connected in parallel to increase the driver current capacity, ENA and ENB are connected and driven
together.
8.3.4 Output Stage

The UCC27524A device output stage features a unique architecture on the pullup structure which delivers the
highest peak-source current when it is most needed during the Miller plateau region of the power-switch turnon
transition (when the power switch drain or collector voltage experiences dV/dt). The output stage pullup structure
features a P-Channel MOSFET and an additional N-Channel MOSFET in parallel. The function of the N-Channel
MOSFET is to provide a brief boost in the peak sourcing current enabling fast turnon. This is accomplished by
briefly turning-on the N-Channel MOSFET during a narrow instant when the output is changing state from Low to
High.

UCC27524A
VCC
ROH
RNMOS, Pull Up
Gate
Voltage OUT
Input Signal Anti Shoot-
Boost
Through
Circuitry Narrow Pulse at
each Turn On
R OL
Figure 20. UCC27524A Gate Driver Output Structure
The ROH parameter (see Electrical Characteristics) is a DC measurement and it is representative of the on-
resistance of the P-Channel device only. This is because the N-Channel device is held in the off state in DC
condition and is turned-on only for a narrow instant when output changes state from low to high. Note that
effective resistance of the UCC27524A pullup stage during the turnon instant is much lower than what is
represented by ROH parameter.
The pulldown structure in the UCC27524A device is simply composed of a N-Channel MOSFET. The ROL
parameter (see Electrical Characteristics), which is also a DC measurement, is representative of the impedance
of the pulldown stage in the device. In the UCC27524A device, the effective resistance of the hybrid pullup
structure during turnon is estimated to be approximately 1.5 × ROL, estimated based on design considerations.
Each output stage in the UCC27524A device is capable of supplying 5-A peak source and 5-A peak sink current
pulses. The output voltage swings between VDD and GND providing rail-to-rail operation, thanks to the MOS-
output stage which delivers very low drop-out. The presence of the MOSFET-body diodes also offers low
impedance to switching overshoots and undershoots which means that in many cases, external Schottky-diode
clamps may be eliminated. The outputs of these drivers are designed to withstand 500-mA reverse current
without either damage to the device or logic malfunction.
The UCC27524A device is particularly suited for dual-polarity, symmetrical drive-gate transformer applications
where the primary winding of transformer driven by OUTA and OUTB, with inputs INA and INB being driven
complementary to each other. This situation is because of the extremely low drop-out offered by the MOS output
stage of these devices, both during high (VOH) and low (VOL) states along with the low impedance of the driver
output stage, all of which allow alleviate concerns regarding transformer demagnetization and flux imbalance.
The low propagation delays also ensure accurate reset for high-frequency applications.
For applications that have zero voltage switching during power MOSFET turnon or turnoff interval, the driver
supplies high-peak current for fast switching even though the miller plateau is not present. This situation often
occurs in synchronous rectifier applications because the body diode is generally conducting before power
MOSFET is switched on.

UCC27524A

8.3.5 Low Propagation Delays And Tightly Matched Outputs
The UCC27524A driver device features a best in class, 13-ns (typical) propagation delay between input and
output which goes to offer the lowest level of pulse-transmission distortion available in the industry for high
frequency switching applications. For example in synchronous rectifier applications, the SR MOSFETs are driven
with very low distortion when a single driver device is used to drive both the SR MOSFETs. Further, the driver
devices also feature an extremely accurate, 1-ns (typical) matched internal-propagation delays between the two
channels which is beneficial for applications requiring dual gate drives with critical timing. For example in a PFC
application, a pair of paralleled MOSFETs can be driven independently using each output channel, which the
inputs of both channels are driven by a common control signal from the PFC controller device. In this case the 1-
ns delay matching ensures that the paralleled MOSFETs are driven in a simultaneous fashion with the minimum
of turnon delay difference. Yet another benefit of the tight matching between the two channels is that the two
channels are connected together to effectively increase current drive capability, for example A and B channels
may be combined into a single driver by connecting the INA and INB inputs together and the OUTA and OUTB
outputs together. Then, a single signal controls the paralleled combination.
Caution must be exercised when directly connecting OUTA and OUTB pins together because there is the
possibility that any delay between the two channels during turnon or turnoff may result in shoot-through current
conduction as shown in Figure 21. While the two channels are inherently very well matched (4-ns Max
propagation delay), note that there may be differences in the input threshold voltage level between the two
channels which causes the delay between the two outputs especially when slow dV/dt input signals are
employed. The following guidelines are recommended whenever the two driver channels are paralleled using
direct connections between OUTA and OUTB along with INA and INB:
• Use very fast dV/dt input signals (20 V/µs or greater) on INA and INB pins to minimize impact of differences
in input thresholds causing delays between the channels.
• INA and INB connections must be made as close to the device pins as possible.
Wherever possible, a safe practice would be to add an option in the design to have gate resistors in series with
OUTA and OUTB. This allows the option to use 0-Ω resistors for paralleling outputs directly or to add appropriate
series resistances to limit shoot-through current, should it become necessary.
VDD VDD
200 kW 200 kW
ENA 1 8 ENB
VDD ISHOOT-THROUGH
Slow Input Signal INA OUTA

2 7
VIN_H
(Channel B)
400 kW VDD
VIN_H
(Channel A) VDD
VDD
UVLO
GND 3 6
VDD
INB OUTB
4 5
400 kW
Figure 21. Slow Input Signal Can Cause Shoot-Through Between Channels During Paralleling
(Recommended DV/DT is 20 V/Μs or Higher)

UCC27524A
Figure 22. Turnon Propagation Delay Figure 23. Turnon Rise Time
(CL = 1.8 nF, VDD = 12 V) (CL = 1.8 nF, VDD = 12 V)
Figure 24. . Turnoff Propagation Delay Figure 25. Turnoff Fall Time

UCC27524A
8.4 Device Functional Modes

Table 2. Device Logic Table
UCC27524A
ENA ENB INA INB OUTA OUTB
H H L L L L
H H L H L H
H H H L H L
H H H H H H
L L Any Any L L
(1) (1)
Any Any x x L L
x (1) x (1) L L L L
x (1) x (1) L H L H
x (1) x (1) H L H L
(1)
x x (1) H H H H
(1) Floating condition.

UCC27524A
9 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information

High-current gate-driver devices are required in switching power applications for a variety of reasons. In order to
effect the fast switching of power devices and reduce associated switching-power losses, a powerful gate-driver
device employs between the PWM output of control devices and the gates of the power semiconductor devices.
Further, gate-driver devices are indispensable when it is not feasible for the PWM controller device to directly
drive the gates of the switching devices. With the advent of digital power, this situation is often encountered
because the PWM signal from the digital controller is often a 3.3-V logic signal which is not capable of effectively
turning on a power switch. A level-shifting circuitry is required to boost the 3.3-V signal to the gate-drive voltage
(such as 12 V) in order to fully turn on the power device and minimize conduction losses. Traditional buffer-drive
circuits based on NPN/PNP bipolar transistors in a totem-pole arrangement, as emitter-follower configurations,
prove inadequate with digital power because the traditional buffer-drive circuits lack level-shifting capability.
Gate-driver devices effectively combine both the level-shifting and buffer-drive functions. Gate-driver devices also
find other needs such as minimizing the effect of high-frequency switching noise by locating the high-current
driver physically close to the power switch, driving gate-drive transformers and controlling floating power-device
gates, reducing power dissipation and thermal stress in controller devices by moving gate-charge power losses
into the controller. Finally, emerging wide band-gap power-device technologies such as GaN based switches,
which are capable of supporting very high switching frequency operation, are driving special requirements in
terms of gate-drive capability. These requirements include operation at low VDD voltages (5 V or lower), low
propagation delays, tight delay matching and availability in compact, low-inductance packages with good thermal
capability. In summary, gate-driver devices are an extremely important component in switching power combining
benefits of high-performance, low-cost, component-count, board-space reduction, and simplified system design.
9.2 Typical Application

ENB
UCC27524A
ENA 1 ENA ENB 8
INA 2 INA OUTA 7
3 GND VDD 6 V+
GND
INB 4 INB OUTB 5
GND
GND UDG-11225
Figure 26. UCC27524A Typical Application Diagram

UCC27524A
Typical Application (continued)

9.2.1 Design Requirements
When selecting the proper gate driver device for an end application, some desiring considerations must be
evaluated first in order to make the most appropriate selection. Among these considerations are VDD, UVLO,
Drive current and power dissipation.
9.2.2 Detailed Design Procedure
9.2.2.1 VDD and Undervoltage Lockout

The UCC27524A device has an internal undervoltage-lockout (UVLO) protection feature on the VDD pin supply
circuit blocks. When VDD is rising and the level is still below UVLO threshold, this circuit holds the output low,
regardless of the status of the inputs. The UVLO is typically 4.25 V with 350-mV typical hysteresis. This
hysteresis prevents chatter when low VDD supply voltages have noise from the power supply and also when
there are droops in the VDD bias voltage when the system commences switching and there is a sudden increase
in IDD. The capability to operate at low voltage levels such as below 5 V, along with best in class switching
characteristics, is especially suited for driving emerging GaN power semiconductor devices.
For example, at power up, the UCC27524A driver-device output remains low until the VDD voltage reaches the
UVLO threshold if enable pin is active or floating. The magnitude of the OUT signal rises with VDD until steady-
state VDD is reached. The non-inverting operation in Figure 27 shows that the output remains low until the UVLO
threshold is reached, and then the output is in-phase with the input. The inverting operation in shows that the
output remains low until the UVLO threshold is reached, and then the output is out-phase with the input.
Because the device draws current from the VDD pin to bias all internal circuits, for the best high-speed circuit
performance, two VDD bypass capacitors are recommended to prevent noise problems. The use of surface
mount components is highly recommended. A 0.1-μF ceramic capacitor must be located as close as possible to
the VDD to GND pins of the gate-driver device. In addition, a larger capacitor (such as 1-μF) with relatively low
ESR must be connected in parallel and close proximity, in order to help deliver the high-current peaks required
by the load. The parallel combination of capacitors presents a low impedance characteristic for the expected
current levels and switching frequencies in the application.
VDD Threshold
VDD
EN
IN
OUT
UDG-11228
Figure 27. Power-Up Non-Inverting Driver

UCC27524A

9.2.2.2 Drive Current and Power Dissipation
The UCC27524A driver is capable of delivering 5-A of current to a MOSFET gate for a period of several-hundred
nanoseconds at VDD = 12 V. High peak current is required to turn the device ON quickly. Then, to turn the
device OFF, the driver is required to sink a similar amount of current to ground which repeats at the operating
frequency of the power device. The power dissipated in the gate driver device package depends on the following
factors:
• Gate charge required of the power MOSFET (usually a function of the drive voltage VGS, which is very close
to input bias supply voltage VDD due to low VOH drop-out)
• Switching frequency
• Use of external gate resistors
Because UCC27524A features very low quiescent currents and internal logic to eliminate any shoot-through in
the output driver stage, their effect on the power dissipation within the gate driver can be safely assumed to be
negligible.
When a driver device is tested with a discrete, capacitive load calculating the power that is required from the bias
supply is fairly simple. The energy that must be transferred from the bias supply to charge the capacitor is given
by Equation 1.
1
EG = CLOAD VDD2
2
where
• CLOAD is the load capacitor
• VDD2 is the bias voltage feeding the driver (1)
There is an equal amount of energy dissipated when the capacitor is charged. This leads to a total power loss
given by Equation 2.
PG = CLOAD VDD2 fSW
where
• fSW is the switching frequency (2)
With VDD = 12 V, CLOAD = 10 nF and fSW = 300 kHz the power loss is calculated with Equation 3
PG = 10nF ´ 12 V 2 ´ 300kHz = 0.432 W (3)

UCC27524A

The switching load presented by a power MOSFET is converted to an equivalent capacitance by examining the
gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus the
added charge needed to swing the drain voltage of the power device as it switches between the ON and OFF
states. Most manufacturers provide specifications that provide the typical and maximum gate charge, in nC, to
switch the device under specified conditions. Using the gate charge Qg, the power that must be dissipated when
charging a capacitor is determined which by using the equivalence Qg = CLOADVDD to provide Equation 4 for
power:
PG = CLOAD VDD2 fSW = Qg VDD fSW
(4)
Assuming that the UCC27524A device is driving power MOSFET with 60 nC of gate charge (Qg = 60 nC at VDD =
12 V) on each output, the gate charge related power loss is calculated with Equation 5.
PG = 2 x 60nC ´ 12 V ´ 300kHz = 0.432 W (5)
This power PG is dissipated in the resistive elements of the circuit when the MOSFET turns on or turns off. Half
of the total power is dissipated when the load capacitor is charged during turnon, and the other half is dissipated
when the load capacitor is discharged during turnoff. When no external gate resistor is employed between the
driver and MOSFET/IGBT, this power is completely dissipated inside the driver package. With the use of external
gate drive resistors, the power dissipation is shared between the internal resistance of driver and external gate
resistor in accordance to the ratio of the resistances (more power dissipated in the higher resistance component).
Based on this simplified analysis, the driver power dissipation during switching is calculated as follows (see
Equation 6):
æ ROFF RON ö
PSW = 0.5 ´ QG ´ VDD ´ fSW ´ ç + ÷
R
è OFF + R GATE R ON + R GATE ø
where
• ROFF = ROL
• RON (effective resistance of pullup structure) = 1.5 x ROL (6)
In addition to the above gate-charge related power dissipation, additional dissipation in the driver is related to the
power associated with the quiescent bias current consumed by the device to bias all internal circuits such as
input stage (with pullup and pulldown resistors), enable, and UVLO sections. As shown in Figure 4, the quiescent
current is less than 0.6 mA even in the highest case. The quiescent power dissipation is calculated easily with
Equation 7.
PQ = IDD VDD (7)
Assuming , IDD = 6 mA, the power loss is:
PQ = 0.6 mA ´ 12 V = 7.2mW (8)
Clearly, this power loss is insignificant compared to gate charge related power dissipation calculated earlier.
With a 12-V supply, the bias current is estimated as follows, with an additional 0.6-mA overhead for the
quiescent consumption:
P 0.432 W
IDD ~ G = = 0.036 A
VDD 12 V (9)
9.2.3 Application Curve

Figure 28 and Figure 29 show the typical switching characteristics of the UCC27524A device.

UCC27524A
Figure 28. Typical Turnon Waveform Figure 29. Typical Turnoff Waveform

UCC27524A
10 Power Supply Recommendations

The bias supply voltage range for which the UCC27524A device is rated to operate is from 4.5 V to 18 V. The
lower end of this range is governed by the internal undervoltage-lockout (UVLO) protection feature on the VDD
pin supply circuit blocks. Whenever the driver is in UVLO condition when the VDD pin voltage is below the VON
supply start threshold, this feature holds the output low, regardless of the status of the inputs. The upper end of
this range is driven by the 20-V absolute maximum voltage rating of the VDD pin of the device (which is a stress
rating). Keeping a 2-V margin to allow for transient voltage spikes, the maximum recommended voltage for the
VDD pin is 18 V.
The UVLO protection feature also involves a hysteresis function. This means that when the VDD pin bias voltage
has exceeded the threshold voltage and device begins to operate, and if the voltage drops, then the device
continues to deliver normal functionality unless the voltage drop exceeds the hysteresis specification VDD_H.
Therefore, ensuring that, while operating at or near the 4.5-V range, the voltage ripple on the auxiliary power
supply output is smaller than the hysteresis specification of the device is important to avoid triggering device
shutdown. During system shutdown, the device operation continues until the VDD pin voltage has dropped below
the VOFF threshold which must be accounted for while evaluating system shutdown timing design requirements.
Likewise, at system startup, the device does not begin operation until the VDD pin voltage has exceeded above
the VON threshold.
The quiescent current consumed by the internal circuit blocks of the device is supplied through the VDD pin.
Although this fact is well known, recognizing that the charge for source current pulses delivered by the OUTA/B
pin is also supplied through the same VDD pin is important. As a result, every time a current is sourced out of the
output pins, a corresponding current pulse is delivered into the device through the VVDDDD pin. Thus ensuring
that local bypass capacitors are provided between the VDD and GND pins and located as close to the device as
possible for the purpose of decoupling is important. A low ESR, ceramic surface mount capacitor is a must. TI
recommends having 2 capacitors; a 100-nF ceramic surface-mount capacitor which can be nudged very close to
the pins of the device and another surface-mount capacitor of few microfarads added in parallel.
11 Layout
11.1 Layout Guidelines

Proper PCB layout is extremely important in a high-current fast-switching circuit to provide appropriate device
operation and design robustness. The UCC27524A gate driver incorporates short propagation delays and
powerful output stages capable of delivering large current peaks with very fast rise and fall times at the gate of
power MOSFET to facilitate voltage transitions very quickly. At higher VDD voltages, the peak current capability
is even higher (5-A peak current is at VDD = 12 V). Very high di/dt causes unacceptable ringing if the trace
lengths and impedances are not well controlled. The following circuit layout guidelines are strongly recommended
when designing with these high-speed drivers.
• Locate the driver device as close as possible to power device in order to minimize the length of high-current
traces between the output pins and the gate of the power device.
• Locate the VDD bypass capacitors between VDD and GND as close as possible to the driver with minimal
trace length to improve the noise filtering. These capacitors support high peak current being drawn from VDD
during turnon of power MOSFET. The use of low inductance surface-mounted-device (SMD) components
such as chip resistors and chip capacitors is highly recommended.
• The turnon and turnoff current loop paths (driver device, power MOSFET and VDD bypass capacitor) must be
minimized as much as possible in order to keep the stray inductance to a minimum. High di/dt is established
in these loops at two instances during turnon and turnoff transients which induces significant voltage
transients on the output pin of the driver device and Gate of the power MOSFET.
• Wherever possible, parallel the source and return traces to take advantage of flux cancellation
• Separate power traces and signal traces, such as output and input signals.
• Star-point grounding is a good way to minimize noise coupling from one current loop to another. The GND of
the driver is connected to the other circuit nodes such as source of power MOSFET and ground of PWM
controller at one, single point. The connected paths must be as short as possible to reduce inductance and
be as wide as possible to reduce resistance.
• Use a ground plane to provide noise shielding. Fast rise and fall times at OUT may corrupt the input signals
during transition. The ground plane must not be a conduction path for any current loop. Instead the ground

UCC27524A
Layout Guidelines (continued)

plane must be connected to the star-point with one single trace to establish the ground potential. In addition
to noise shielding, the ground plane can help in power dissipation as well
• In noisy environments, tying inputs of an unused channel of the UCC27524A device to VDD (in case of INx+)
or GND (in case of INX–) using short traces in order to ensure that the output is enabled and to prevent noise
from causing malfunction in the output may be necessary.
• Exercise caution when replacing the UCC2732x/UCC2742x devices with the UCC27524A device:
– The UCC27524A device is a much stronger gate driver (5-A peak current versus 4-A peak current).
– The UCC27524A device is a much faster gate driver (13-ns/13-ns rise and fall propagation delay versus
25-ns/35-ns rise and fall propagation delay).
11.2 Layout Example
Figure 30. UCC27524A Layout Example
11.3 Thermal Protection

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal
characteristics of the device package. In order for a gate driver device to be useful over a particular temperature
range the package must allow for the efficient removal of the heat produced while keeping the junction
temperature within rated limits. For detailed information regarding the thermal information table, please refer to
Application Note from Texas Instruments entitled, IC Package Thermal Metrics (SPRA953).

UCC27524A
Thermal Protection (continued)

Among the different package options available for the UCC27524A device, power dissipation capability of the
DGN package is of particular mention. The MSOP PowerPAD-8 (DGN) package offers a means of removing the
heat from the semiconductor junction through the bottom of the package. This package offers an exposed
thermal pad at the base of the package. This pad is soldered to the copper on the printed circuit board directly
underneath the device package, reducing the thermal resistance to a very low value. This allows a significant
improvement in heat-sinking over that available in the D package. The printed circuit board must be designed
with thermal lands and thermal vias to complete the heat removal subsystem. Note that the exposed pads in the
MSOP-8 (PowerPAD) package are not directly connected to any leads of the package, however, the PowerPAD
is electrically and thermally connected to the substrate of the device which is the ground of the device. TI
recommends to externally connect the exposed pads to GND in PCB layout for better EMI immunity.

UCC27524A
12 Device and Documentation Support

12.1 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
UCC27524AD ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 140 27524A
UCC27524ADGN ACTIVE HVSSOP DGN 8 80 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 140 524A
UCC27524ADGNR ACTIVE HVSSOP DGN 8 2500 RoHS & Green NIPDAUAG Level-1-260C-UNLIM -40 to 140 524A
UCC27524ADR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 140 27524A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UCC27524A :
• Automotive: UCC27524A-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCC27524ADGNR HVSSOP DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
UCC27524ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
Pack Materials-Page 1
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC27524ADGNR HVSSOP DGN 8 2500 364.0 364.0 27.0
UCC27524ADR SOIC D 8 2500 356.0 356.0 35.0
TUBE
T - Tube
height L - Tube length
W - Tube
width
B - Alignment groove width

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
UCC27524AD D SOIC 8 75 506.6 8 3940 4.32
UCC27524ADGN DGN HVSSOP 8 80 330 6.55 500 2.88
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X
SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
GENERIC PACKAGE VIEW
DGN 8 PowerPAD VSSOP - 1.1 mm max height
3 x 3, 0.65 mm pitch SMALL OUTLINE PACKAGE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225482/A
www.ti.com
PACKAGE OUTLINE
TM
DGN0008G SCALE 4.000
PowerPAD VSSOP - 1.1 mm max height
SMALL OUTLINE PACKAGE
C
5.05
A TYP
4.75 0.1 C
PIN 1 INDEX AREA SEATING
PLANE
6X 0.65
8
1
2X
3.1
1.95
2.9
NOTE 3
4
5 0.38
8X
0.25
3.1 0.13 C A B
B
2.9
NOTE 4
0.23
0.13
SEE DETAIL A
EXPOSED THERMAL PAD
4
5
0.25
GAGE PLANE
2.15
1.95 9 1.1 MAX
8
1 0.7 0.15
0 -8 0.4 0.05
DETAIL A
A 20
1.846
TYPICAL
1.646
4225480/B 12/2022
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
DGN0008G PowerPAD VSSOP - 1.1 mm max height
(2)
NOTE 9
METAL COVERED
BY SOLDER MASK (1.57)
SYMM SOLDER MASK
DEFINED PAD
8X (1.4) (R0.05) TYP
8
8X (0.45) 1
(3)
9 SYMM NOTE 9
(1.89)
6X (0.65) (1.22)
5
4
( 0.2) TYP
VIA (0.55) SEE DETAILS
(4.4)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 15X
SOLDER MASK METAL UNDER SOLDER MASK

METAL
OPENING SOLDER MASK OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
15.000
4225480/B 12/2022
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
9. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
DGN0008G PowerPAD VSSOP - 1.1 mm max height
(1.57)
BASED ON
0.125 THICK
STENCIL
SYMM
8X (1.4) (R0.05) TYP
8
8X (0.45) 1
(1.89)
SYMM BASED ON
0.125 THICK
STENCIL
6X (0.65)
4 5
METAL COVERED SEE TABLE FOR

BY SOLDER MASK DIFFERENT OPENINGS
(4.4) FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE

EXPOSED PAD 9:
100% PRINTED SOLDER COVERAGE BY AREA
SCALE: 15X
STENCIL SOLDER STENCIL

THICKNESS OPENING
0.1 1.76 X 2.11
0.125 1.57 X 1.89 (SHOWN)
0.15 1.43 X 1.73
0.175 1.33 X 1.60
4225480/B 12/2022
NOTES: (continued)
10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
11. Board assembly site may have different recommendations for stencil design.
www.ti.com
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
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These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
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• Switch-Mode Power Supplies

Changes from Original (August 2013) to Revision A Page

• Changed marketing status from Product Preview to Production Data. .................................................................................. 1

2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: UCC27524A

6 Pin Configuration and Functions

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3

7.2 Handling Ratings

7.3 Recommended Operating Conditions

4 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: UCC27524A

7.4 Thermal Information

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7.5 Electrical Characteristics

(1) Ensured by design.

7.6 Switching Characteristics

(1) See the timing diagrams in Figure 1 and Figure 2

6 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: UCC27524A

tD3 tD4 UDG-11217

Figure 1. Enable Function

tD1 tD2 UDG-11219

Figure 2. Non-Inverting Input-Driver Operation

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 7

7.7 Typical Characteristics

Operating Supply Current (mA)

Figure 3. Start-Up Current vs Temperature Figure 4. Operating Supply Current vs Temperature

UVLO Threshold (V)

Figure 5. Supply Current vs Temperature (Outputs In DC Figure 6. UVLO Threshold vs Temperature

Input High Threshold Enable High Threshold

Figure 7. Input Threshold vs Temperature Figure 8. Enable Threshold vs Temperature

8 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: UCC27524A

Typical Characteristics (continued)

Output Pull−down Resistance (Ω)

Fall Time (ns)

Turn−on EN to Output High

Turn−off EN to Output Low

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 9

Typical Characteristics (continued)

Propagation Delays (ns)

Fall Time (ns)

Figure 19. Enable Threshold vs Temperature

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Product Folder Links: UCC27524A

Table 1. UCC27524A Features and Benefits

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8.2 Functional Block Diagram

8.3 Feature Description

8.3.2 Input Stage

12 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: UCC27524A

Feature Description (continued)

8.3.3 Enable Function

8.3.4 Output Stage

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 13

Feature Description (continued)