LM 2588
LM 2588
LM 2588
LM2588
SNVS117E – APRIL 1998 – REVISED JUNE 2019
Flyback Regulator
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM2588
SNVS117E – APRIL 1998 – REVISED JUNE 2019 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.2 Functional Block Diagram ....................................... 12
2 Typical Applications .............................................. 1 7.3 Feature Description................................................. 12
3 Description ............................................................. 1 8 Application and Implementation ........................ 18
4 Revision History..................................................... 2 8.1 Application Information............................................ 18
8.2 Typical Applications ............................................... 18
5 Pin Configurations................................................. 3
8.3 System Examples ................................................... 28
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 9 Layout ................................................................... 29
9.1 Layout Guidelines ................................................... 29
6.2 ESD Ratings.............................................................. 4
9.2 Layout Example ...................................................... 29
6.3 Recommended Operating Ratings............................ 4
9.3 Heat Sink/Thermal Considerations ......................... 29
6.4 Electrical Characteristics: 3.3 V ................................ 5
6.5 Electrical Characteristics: 5 V ................................... 5 10 Device and Documentation Support ................. 31
6.6 Electrical Characteristics: 12 V ................................. 6 10.1 Device Support...................................................... 31
6.7 Electrical Characteristics: Adjustable ........................ 6 10.2 Receiving Notification of Documentation Updates 31
6.8 Electrical Characteristics: All Output Voltage Versions 10.3 Community Resources.......................................... 31
...................................................................................7 10.4 Trademarks ........................................................... 31
6.9 Typical Characteristics .............................................. 9 10.5 Electrostatic Discharge Caution ............................ 32
7 Detailed Description ............................................ 12 10.6 Glossary ................................................................ 32
7.1 Overview ................................................................. 12 11 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
5 Pin Configurations
NDZ Package
7-Pin TO-220
Top View, Bent, Staggered Leads
KTW Package
7-Pin DDPAK/TO-263
Top View
NDZ Package
7-Pin TO-220
Side View; Bent, Staggered Leads
KTW Package
7-Pin DDPAK/TO-263
Side View
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2)
See
Input Voltage −0.4V ≤ VIN ≤ 45V
Switch Voltage −0.4V ≤ VSW ≤ 65V
Switch Current (3) Internally Limited
Compensation Pin Voltage −0.4V ≤ VCOMP ≤ 2.4V
Feedback Pin Voltage −0.4V ≤ VFB ≤ 2 VOUT
ON /OFF Pin Voltage −0.4V ≤ VSH ≤ 6V
Sync Pin Voltage −0.4V ≤ VSYNC ≤ 2V
Power Dissipation (4) Internally Limited
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 10 sec.) 260°C
Maximum Junction Temperature (4) 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. These ratings apply when the current is
limited to less than 1.2 mA for pins 1, 2, 3, and 6. Operating ratings indicate conditions for which the device is intended to be functional,
but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the
Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.
(3) Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the
LM2588 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 5A. However,
output current is internally limited when the LM2588 is used as a flyback regulator (see the section for more information).
(4) The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance
(θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction
temperature of the device: PD × θJA + TA(MAX) ≥ TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the
device is less than: PD ≤ [TJ(MAX) − TA(MAX)]/θJA. When calculating the maximum allowable power dissipation, derate the maximum
junction temperature—this ensures a margin of safety in the thermal design.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2588 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2588 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2588 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the
LM2588 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.
(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(3) A 1.0 MΩ resistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.
(1)
6.8 Electrical Characteristics: All Output Voltage Versions
Specifications with standard type face are for TJ = 25°C, and those in bold type face apply over full Operating Temperature
Range. Unless otherwise specified, VIN = 5V.
PARAMETER TEST CONDITIONS TYP MIN MAX UNIT
IS Input Supply Current Switch Off (2) 11 15.5/16.5 mA
ISWITCH = 3.0A 85 140/165 mA
IS/D Shutdown Input VSH = 3V
16 100/300 μA
Supply Current
VUV Input Supply RLOAD = 100Ω
3.30 3.05 3.75 V
Undervoltage Lockout
fO Oscillator Frequency Measured at Switch Pin
RLOAD = 100Ω, VCOMP = 1.0V 100 85/75 115/125 kHz
Freq. Adj. Pin Open (Pin 1)
RSET = 22 kΩ 200 kHz
fSC Short-Circuit Frequency Measured at Switch Pin
25 kHz
RLOAD = 100Ω
VFEEDBACK = 1.15V
VEAO Error Amplifier Output Upper Limit (3) 2.8 2.6/2.4 V
Swing
Lower Limit (2) 0.25 0.40/0.55 V
IEAO Error Amp Output See (4) 165 110/70 260/320 μA
Current (Source or
Sink)
ISS Soft Start Current VFEEDBACK = 0.92V
11.0 8.0/7.0 17.0/19.0 μA
VCOMP = 1.0V
DMAX Maximum Duty Cycle RLOAD = 100Ω (3) 98 93/90 %
IL Switch Leakage Switch Off
15 300/600 μA
Current VSWITCH = 60V
VSUS Switch Sustaining dV/dT = 1.5V/ns 65 V
Voltage
VSAT Switch Saturation ISWITCH = 5.0A 0.7 1.1/1.4 V
Voltage
ICL NPN Switch Current 6.5 5.0 9.5 A
Limit
VSTH Synchronization FSYNC = 200 kHz
0.75 0.625/0.40 0.875/1.00 V
Threshold Voltage VCOMP = 1V, VIN = 5V
ISYNC Synchronization VIN = 5V
100 200 μA
Pin Current VCOMP = 1V, VSYNC = VSTH
VSHTH ON /OFF Pin (Pin 1) VCOMP = 1V (5)
1.6 1.0/0.8 2.2/2.4 V
Threshold Voltage
ISH ON /OFF Pin (Pin 1) VCOMP = 1V
40 15/10 65/75 μA
Current VSH = VSHTH
(1) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using
standard Statistical Quality Control (SQC) methods.
(2) To measure this parameter, the feedback voltage is set to a high value, depending on the output version of the device, to force the error
amplifier output low and the switch off.
(3) To measure this parameter, the feedback voltage is set to a low value, depending on the output version of the device, to force the error
amplifier output high and the switch on.
(4) To measure the worst-case error amplifier output current, the LM2588 is tested with the feedback voltage set to its low value (specified
in Note 3 under the Electrical Characteristics: All Output Voltage Versions (1) table) and at its high value (specified in Note 2 under the
Electrical Characteristics: All Output Voltage Versions (1) table).
(5) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency
adjust circuit will begin operation (see Figure 20).
Copyright © 1998–2019, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM2588
LM2588
SNVS117E – APRIL 1998 – REVISED JUNE 2019 www.ti.com
(1)
Electrical Characteristics: All Output Voltage Versions (continued)
Specifications with standard type face are for TJ = 25°C, and those in bold type face apply over full Operating Temperature
Range. Unless otherwise specified, VIN = 5V.
PARAMETER TEST CONDITIONS TYP MIN MAX UNIT
θJA Thermal Resistance NDZ Package, Junction to Ambient (6) 65
θJA NDZ Package, Junction to Ambient (7) 45
θJC NDZ Package, Junction to Case 2
θJA KTW Package, Junction to Ambient (8) 56 °C/W
θJA KTW Package, Junction to Ambient (9) 35
θJA KTW Package, Junction to 26
θJC Ambient (10) 2
KTW Package, Junction to Case
(6) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PC board with minimum copper area.
(7) Junction to ambient thermal resistance (no external heat sink) for the 7 lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(8) Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the
same size as the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(9) Junction to ambient thermal resistance01242001 for the 7 lead TO-263 mounted horizontally against a PC board area of 0.4896 square
inches (3.6 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper.
(10) Junction to ambient thermal resistance for the 7 lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square
inches (7.4 times the area of the TO-263 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area will reduce thermal
resistance further. See the thermal model in Switchers Made Simple® software.
Figure 3. ΔReference Voltage vs Supply Voltage Figure 4. Supply Current vs Switch Current
Figure 5. Current Limit vs Temperature Figure 6. Feedback Pin Bias Current vs Temperature
Figure 9. Oscillator Frequency vs Temperature Figure 10. Error Amp Transconductance vs Temperature
Figure 11. Error Amp Voltage Gain vs Temperature Figure 12. Short Circuit Frequency vs Temperature
Figure 13. Shutdown Supply Current vs Temperature Figure 14. ON /Off Pin Current vs Voltage
7 Detailed Description
7.1 Overview
The LM2588 series of regulators are monolithic integrated circuits specifically designed for flyback, step-up
(boost), and forward converter applications. The device is available in 4 different output voltage versions: 3.3 V,
5 V, 12 V, and adjustable. Requiring a minimum number of external components, these regulators are cost
effective, and simple to use. Included in the datasheet are typical circuits of boost and flyback regulators. Also
listed are selector guides for diodes and capacitors and a family of standard inductors and flyback transformers
designed to work with these switching regulators.
For Fixed Versions 3.3V, R1 = 3.4k, R2 = 2k5.0V, R1 = 6.15k, R2 = 2k12V, R1 = 8.73k, R2 = 1kFor Adj. VersionR1 =
Short (0Ω), R2 = Open
As shown in Figure 16, the LM2588 can be used as a flyback regulator by using a minimum number of external
components. The switching waveforms of this regulator are shown in Figure 18. Typical characteristics observed
during the operation of this circuit are shown in Figure 19.
By adding a small number of external components (as shown in Figure 17), the LM2588 can be used to produce
a regulated output voltage that is greater than the applied input voltage. The switching waveforms observed
during the operation of this circuit are shown in . Typical performance of this regulator is shown in .
The scope photo in Figure 22 shows a LM2588 12V Boost Regulator synchronized to a 200-kHz signal. There is
a 700 ns delay between the falling edge of the sync signal and the turning on of the switch.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
(1) Coilcraft Inc.,: Phone: (800) 322-26451102 Silver Lake Road, Cary, IL 60013: Fax: (708) 639-1469European Headquarters, 21
Napier Place: Phone: +44 1236 730 595Wardpark North, Cumbernauld, Scotland G68 0LL: Fax: +44 1236 730 627
(2) Pulse Engineering Inc.,: Phone: (619) 674-810012220 World Trade Drive, San Diego, CA 92128: Fax: (619) 674-8262European
Headquarters, Dunmore Road: Phone: +353 93 24 107Tuam, Co. Galway, Ireland: Fax: +353 93 24 459
(3) Renco Electronics Inc.,: Phone: (800) 645-582860 Jeffryn Blvd. East, Deer Park, NY 11729: Fax: (516) 586-5562
(4) Schott Corp.,: Phone: (612) 475-11731000 Parkers Lane Road, Wayzata, MN 55391: Fax: (612) 475-1786
In certain circuits, there exists a voltage spike, VLL, superimposed on top of the steady-state voltage (see
Figure 18, waveform A). Usually, this voltage spike is caused by the transformer leakage inductance and/or the
output rectifier recovery time. To “clamp” the voltage at the switch from exceeding its maximum value, a transient
suppressor in series with a diode is inserted across the transformer primary (as shown in the circuit in Figure 16
and other flyback regulator circuits throughout the datasheet). The schematic in Figure 24 shows another method
of clamping the switch voltage. A single voltage transient suppressor (the SA51A) is inserted at the switch pin.
This method clamps the total voltage across the switch, not just the voltage across the primary.
If poor circuit layout techniques are used (see the section), negative voltage transients may appear on the Switch
pin (pin 5). Applying a negative voltage (with respect to the IC's ground) to any monolithic IC pin causes erratic
and unpredictable operation of that IC. This holds true for the LM2588 IC as well. When used in a flyback
regulator, the voltage at the Switch pin (pin 5) can go negative when the switch turns on. The “ringing” voltage at
the switch pin is caused by the output diode capacitance and the transformer leakage inductance forming a
resonant circuit at the secondary(ies). The resonant circuit generates the “ringing” voltage, which gets reflected
back through the transformer to the switch pin. There are two common methods to avoid this problem. One is to
add an RC snubber around the output rectifier(s), as in Figure 24. The values of the resistor and the capacitor
must be chosen so that the voltage at the Switch pin does not drop below −0.4 V. The resistor may range in
value between 10Ω and 1 kΩ, and the capacitor will vary from 0.001 μF to 0.1 μF. Adding a snubber will (slightly)
reduce the efficiency of the overall circuit.
The other method to reduce or eliminate the “ringing” is to insert a Schottky diode clamp between pins 5 and 4
(ground), also shown in Figure 24. This prevents the voltage at pin 5 from dropping below −0.4 V. The reverse
voltage rating of the diode must be greater than the switch off voltage.
(5)
Theoretically, the maximum output voltage can be as large as desired—just keep increasing the turns ratio of the
transformer. However, there exists some physical limitations that prevent the turns ratio, and thus the output
voltage, from increasing to infinity. The physical limitations are capacitances and inductances in the LM2588
switch, the output diode(s), and the transformer—such as reverse recovery time of the output diode (mentioned
above).
8.2.1.2.6 Stability
All current-mode controlled regulators can suffer from an instability, known as subharmonic oscillation, if they
operate with a duty cycle above 50%. To eliminate subharmonic oscillations, a minimum value of inductance is
required to ensure stability for all boost and flyback regulators. The minimum inductance is given by:
where
• VSAT is the switch saturation voltage and can be found in Typical Characteristics (6)
*The LM2588 requires a heat sink in these applications. The size of the heat sink will depend on the maximum
ambient temperature. To calculate the thermal resistance of the IC and the size of the heat sink needed, see the Heat
Sink/Thermal Considerations section in Layout.
(1) Coilcraft Inc.,: Phone: (800) 322-26451102 Silver Lake Road, Cary, IL 60013: Fax: (708) 639-1469European Headquarters, 21
Napier Place: Phone: +44 1236 730 595Wardpark North, Cumbernauld, Scotland G68 0LL: Fax: +44 1236 730 627
(2) Pulse Engineering Inc.,: Phone: (619) 674-810012220 World Trade Drive, San Diego, CA 92128: Fax: (619) 674-8262European
Headquarters, Dunmore Road: Phone: +353 93 24 107Tuam, Co. Galway, Ireland: Fax: +353 93 24 459
(3) Renco Electronics Inc.,: Phone: (800) 645-582860 Jeffryn Blvd. East, Deer Park, NY 11729: Fax: (516) 586-5562
(4) Schott Corp.,: Phone: (612) 475-11731000 Parkers Lane Road, Wayzata, MN 55391: Fax: (612) 475-1786
9 Layout
(7)
VIN is the minimum input voltage, VOUT is the output voltage, N is the transformer turns ratio, D is the duty cycle,
and ILOAD is the maximum load current (and ∑ILOAD is the sum of the maximum load currents for multiple-output
flyback regulators). The duty cycle is given by:
Boost:
where
• VF is the forward biased voltage of the diode and is typically 0.5V for Schottky diodes and 0.8V for fast
recovery diodes
• VSAT is the switch saturation voltage and can be found in the Characteristic Curves. (8)
When no heat sink is used, the junction temperature rise is:
ΔTJ = PD • θJA. (9)
Adding the junction temperature rise to the maximum ambient temperature gives the actual operating junction
temperature:
TJ = ΔTJ + TA. (10)
If the operating junction temperature exceeds the maximum junction temperatue in item 3 above, then a heat
sink is required. When using a heat sink, the junction temperature rise can be determined by the following:
ΔTJ = PD • (θJC + θInterface + θHeat Sink) (11)
Again, the operating junction temperature will be:
TJ = ΔTJ + TA (12)
As before, if the maximum junction temperature is exceeded, a larger heat sink is required (one that has a lower
thermal resistance).
Included in the Switchers Made Simple™ design software is a more precise (non-linear) thermal model that can
be used to determine junction temperature with different input-output parameters or different component values.
It can also calculate the heat sink thermal resistance required to maintain the regulator junction temperature
below the maximum operating temperature.
10.4 Trademarks
Switchers Made Simple, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
Switchers Made Simple is a registered trademark of dcl_owner.
All other trademarks are the property of their respective owners.
10.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 30-Sep-2021
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2021
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
MECHANICAL DATA
NDZ0007B
TA07B (Rev E)
www.ti.com
MECHANICAL DATA
KTW0007B
TS7B (Rev E)
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated