Amplifier Transistors: NPN Silicon
Amplifier Transistors: NPN Silicon
Amplifier Transistors: NPN Silicon
com
Amplifier Transistors
NPN Silicon
MAXIMUM RATINGS
Rating Symbol Value Unit
1
Collector–Emitter Voltage VCEO 40 Vdc 2
3
Collector–Base Voltage VCBO 75 Vdc
Emitter–Base Voltage VEBO 6.0 Vdc CASE 29–11, STYLE 17
TO–92 (TO–226AA)
Collector Current — Continuous IC 600 mAdc
Total Device Dissipation @ TA = 25°C PD 625 mW
Derate above 25°C 5.0 mW/°C
Total Device Dissipation @ TC = 25°C PD 1.5 Watts
Derate above 25°C 12 mW/°C
COLLECTOR
Operating and Storage Junction TJ, Tstg –55 to +150 °C 1
Temperature Range
THERMAL CHARACTERISTICS 2
BASE
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RJA 200 °C/W
3
Thermal Resistance, Junction to Case RJC 83.3 °C/W EMITTER
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage
www.DataSheet4U.com V(BR)CEO 40 — Vdc
(IC = 10 mAdc, IB = 0)
Collector–Base Breakdown Voltage V(BR)CBO 75 — Vdc
(IC = 10 Adc, IE = 0)
Emitter–Base Breakdown Voltage V(BR)EBO 6.0 — Vdc
(IE = 10 Adc, IC = 0)
Collector Cutoff Current ICEX — 10 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
Collector Cutoff Current ICBO µAdc
(VCB = 60 Vdc, IE = 0) — 0.01
(VCB = 60 Vdc, IE = 0, TA = 150°C) — 10
Emitter Cutoff Current IEBO — 10 nAdc
(VEB = 3.0 Vdc, IC = 0)
Collector Cutoff Current ICEO — 10 nAdc
(VCE = 10 V)
Base Cutoff Current IBEX — 20 nAdc
(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
ON CHARACTERISTICS
DC Current Gain hFE —
(IC = 0.1 mAdc, VCE = 10 Vdc) 35 —
(IC = 1.0 mAdc, VCE = 10 Vdc) 50 —
(IC = 10 mAdc, VCE = 10 Vdc) 75 —
(IC = 10 mAdc, VCE = 10 Vdc, TA = –55°C) 35 —
(IC = 150 mAdc, VCE = 10 Vdc)(1) 100 300
(IC = 150 mAdc, VCE = 1.0 Vdc)(1) 50 —
(IC = 500 mAdc, VCE = 10 Vdc)(1) 40 —
Collector–Emitter Saturation Voltage(1) VCE(sat) Vdc
(IC = 150 mAdc, IB = 15 mAdc) — 0.3
(IC = 500 mAdc, IB = 50 mAdc) — 1.0
Base–Emitter Saturation Voltage(1) VBE(sat) Vdc
(IC = 150 mAdc, IB = 15 mAdc) 0.6 1.2
(IC = 500 mAdc, IB = 50 mAdc) — 2.0
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product(2) fT 300 — MHz
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)
Output Capacitance Cobo — 8.0 pF
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance Cibo — 25 pF
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Input Impedance hie kΩ
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 2.0 8.0
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 0.25 1.25
Voltage Feedback Ratio hre X 10–4
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) — 8.0
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) — 4.0
Small–Signal Current Gain hfe —
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 50 300
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 75 375
Output Admittance hoe mhos
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 5.0 35
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(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz) 25 200
Collector Base Time Constant rb′Cc — 150 ps
(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz)
Noise Figure NF — 4.0 dB
(IC = 100 Adc, VCE = 10 Vdc, RS = 1.0 kΩ, f = 1.0 kHz)
SWITCHING CHARACTERISTICS
Delay Time (VCC = 30 Vdc, VBE(off) = –2.0
2.0 Vdc, td — 10 ns
Rise Time IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1) tr — 25 ns
Storage Time (VCC = 30 Vdc, IC = 150 mAdc, ts — 225 ns
IB1 = IB2 = 15 mAdc)
Ad ) (Fi
(Figure 2)
Fall Time tf — 60 ns
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2
Q2N2222
+30 V +30 V
1.0 to 100 µs, 1.0 to 100 µs, 200
200 +16 V
+16 V DUTY CYCLE ≈ 2.0% DUTY CYCLE ≈ 2.0%
0 0
1 kΩ -14 V 1k CS* < 10 pF
-2 V CS* < 10 pF
< 2 ns < 20 ns
1N914
1000
700
500 TJ = 125°C
300
hFE , DC CURRENT GAIN
200
25°C
100
70
-55°C
50
30 VCE = 1.0 V
20 VCE = 10 V
10
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 300 500 700 1.0 k
IC, COLLECTOR CURRENT (mA)
1.0
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0.8
0.4
0.2
0
0.005 0.01 0.02 0.03 0.05 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10 20 30 50
IB, BASE CURRENT (mA)
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3
Q2N2222
200 500
IC/IB = 10 VCC = 30 V
300 IC/IB = 10
100 TJ = 25°C
200 t′s = ts - 1/8 tf IB1 = IB2
70 tr @ VCC = 30 V
50 TJ = 25°C
td @ VEB(off) = 2.0 V
100
30 td @ VEB(off) = 0
t, TIME (ns)
t, TIME (ns)
70
20 tf
50
30
10
7.0 20
5.0
10
3.0 7.0
2.0 5.0
5.0 7.0 10 20 30 50 70 100 200 300 500 5.0 7.0 10 20 30 50 70 100 200 300 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
10 10
RS = OPTIMUM f = 1.0 kHz
IC = 1.0 mA, RS = 150 Ω RS = SOURCE
8.0 RS = RESISTANCE 8.0
500 µA, RS = 200 Ω IC = 50 µA
NF, NOISE FIGURE (dB)
4.0 4.0
2.0 2.0
0 0
0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 50 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k 100 k
f, FREQUENCY (kHz) RS, SOURCE RESISTANCE (OHMS)
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30 500
VCE = 20 V
20 TJ = 25°C
300
Ceb
CAPACITANCE (pF)
10 200
7.0
5.0
100
Ccb
3.0 70
2.0 50
0.1 0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10 20 30 50 1.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100
REVERSE VOLTAGE (VOLTS) IC, COLLECTOR CURRENT (mA)
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4
Q2N2222
1.0 +0.5
TJ = 25°C
1.0 V -0.5
0.6
VBE(on) @ VCE = 10 V -1.0
0.4
-1.5
0.2
-2.0 RVB for VBE
VCE(sat) @ IC/IB = 10
0 -2.5
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1.0 k 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500
IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA)
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5
Q2N2222
PACKAGE DIMENSIONS
TO–92 (TO–226)
CASE 29–11
ISSUE AL
NOTES:
A B 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
P BEYOND DIMENSION K MINIMUM.
L
SEATING INCHES MILLIMETERS
PLANE K DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
X X D G 0.045 0.055 1.15 1.39
G H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
H J K 0.500 --- 12.70 ---
L 0.250 --- 6.35 ---
V C N 0.080 0.105 2.04 2.66
P --- 0.100 --- 2.54
SECTION X–X R 0.115 --- 2.93 ---
1 N V 0.135 --- 3.43 ---
N
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
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6