+ Chelton: V/Uhf Receiver TYPE 707-I SERIAL Nos. 1 - 100

CHELTON (ELECTROSTATICS) LIMITED
COMPONENTMAINTENANCE MANUAL
PUBLICATION No 707-l
V/UHF RECEIVER
TYPE 707-I
SERIAL Nos. 1 - 100
COMPONENT MAINTENANCE MANUAL
'This Manual complies with British

Civil Airworthiness Requirements,
Section A, Chapters A5-3. The
technical accuracy of this manual
has been verified ad certifiea
correct.
Date: 26th July llf96
CAA Design Approval No DAI/2613/48
RESTRICTION ON USE, DUPLICATION OR

DISCLOSURE OF PROPRIETARY INFORMATION
This documentcontainsinformationproprietarytochelton (Electrostatics)

Limited of Fieldhouse Lane. Marlow. Buckinghamshire. SL7 1LR UK ("CEL").
This document is supplied by CEL in connection with the maintenance
andlor repair ofthe componentcs) identified above by or on behalf of the
purchaser of such component(s) from CEL. Any disclosure, use or
duplication ofthis document or of any oftheinformation contained herein
for other than the specific purpose for which it was supplied by CEL-is
expressly prohibited except as CEL may otherwise agree in writing.
15th. June 1995
(ELECTROSTATICS) LIMITED
\ Fieldhouse Lane Marlow Buckinghamshire SL7 1LR England
:+ CHELToN
Telephone: 01628 472072 Telex: 849363 Fax. 01628 482255
--I 5
0 Chelton (Electrostatics) Ltd
23-12-09
RECORD OF PERMANENTREVISIONS
Incorporated under CAA Design Approval No. DAI/2613/48
Retain this record of Permanent Revisions at the front of the manual immediately
following the title page. On receipt of the Permanent Revision, revise as detailed
inthe letter oftransmittaland record theincorporation ofthe revision or amendment
on this sheet. The introduction of data by permanent revision or amendments not
certified in accordance with British Civil Airworthiness Requirements Chapter AS-3,
Will invalidate the initial certification on the title page of the manual relative
to the part revised. Permanent revisions which have been certified by the approved
Design Organisation other than that applicable to the initial certification must be
recorded on separate record sheets.
Permanent Revision Insertion Entered

Number Date BY
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RECORD OF TEMPORARYREVISIONS
Incorporated under CAA Design Approval No. DAI/2613/48
Retain this record of Temporary Revisions at the front of the manual immediately
following the Record of Permanent Revisions. On receipt of the Temposary Revision,
revise as detailed in the letter of transmittal and record the incorporation of the
revision or amendment on this sheet. The introduction of data by temporary revision
or amendments not certified in accordance with British Civil Airworthiness
Requirements Chapter As-3. Will invalidate the initial certification on the title
page of the manual relative to the part revised. Temporary revisions or amendments
which have been certified by the approved Design Organisation other than that
applicable to the initial certification must be recorded on separate record sheets.
> Cancelled
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23-12-O July 26196
SERVICE BULLETIN J.rSy
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LIST OF EFFECTIVE PAGE$
SUBJECT
Title Page ... ... ... ... .. * ... July 26196
Record of Permanent Revisions ... .. . *.. Page 1 July 26196
Record of Temporary Revisions ... ... . .. Page 1 July 26196
Service Bulletin List ... ... ... ... Page 1 July 26196
List of Effective Pages . . . ... ... ... Page 1 July 26196

Page 2 July 26196
Table of Contents ... ... ... ... ... Page 1 July 26196
>
Text and Illustrations ... ... ... ... Page 2 July 26196
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CHELT~N (ELECTROSTATICS) LIMITED
T OF EFFECTIVE PAGES (cont'd)
SUBJECT
Illustrated Parts List ... ... ... ... Page 1001 July 26196
Page 1002 July 26196
Page 1003 July 26/96
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Page 2
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cmLToN (ELECTROSTATICS) LIMITED
PUBLICATION No. 707-l
TABLE OF CONTENTS
Para.
Description, Operation and Data ... ... ... ... . .. ... 1
Disassembly ... ... ... ... .. . .. . ... 2
Cleaning ... ... ... ... . .. . .. ... 3
InspectionlCheck ... ... ... ... ... ... ... 4
Repair ... ... ... ... ... . .. ... 5
Assembly > ... ... ... ... .. . . .. ... 6
Fits and Clearances ... ... *. . . .. ... ... ... 7
Testing ... ... ... ... ... .. . ... 8
Trouble Shooting ... ... ... ... ... . .. ... 9
Storage Instructions ... . .. ... ... ... ... ... 10
Special Tools, Fixtures and Test Equipment ... ... . .. ... 11
Illustrated Parts List ... ... ... ... ... .. . ... 12
0 Chelton (Electrostatics) Ltd Table of Contents

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mEmoN (ELECTROSTATICS) LIMITED
1. DESCRIPTION, OPERATION AND DATA
NOTE: The details in this manual apply to units Type 707-l Serial Nos 1 to 100
inclusive.
A. Description
Figure 1 shows the general assembly of the receiver.
The Type 707-l V/UHFReceiver is a frequency synthesized receiverwhich forms part

of a broadband DF or Homing System. It provides a dedicated AM output for DF or
Homing purposes and a dedicated speech output.
Thereceiverisbuiltona sub-assembly,themaininterwireassembly.housedwithin
an aluminium case. The sub-assembly consists of three printed circuit boards,
a front and a back plate, a set of rails and interna1 wiring. The three printed
circuit boards are each supported on a pair of rails fixed between the front and
back plates
Electrical connections to the receiver are made via a multipin connecter and a
coaxial connecter mounted on the front plate of the sub assembly. At the rear
of the front plate, the connectors are housed in an aluminium enclosure which has
feed through filters mounted in its back face. Connections from the multipin
connecter arefedviathese feedthrough filtersintothe receiver. This provision
together with the shielding afforded by the receiver housing serves to proofthe
receiver for conducted and radiated electromagnetic interference.
Two aluminium strips, having holes at each end. are attached to the underside of
the case for mounting purposes.
Allaluminiumpartsarealocromed and finished externallyinmattblackepoxypaint

to DEF STAN 80-161 except for the mounting surfaces. An identification plate is
fixed to the front plate.
B. Operation
Refer to block diagram Figure 2.
The receiver ci .rcuit compr ises three printed c ircuit boards. Their operation is
as follows:
(1) RF PCB
RF signals received atthe RF input connecter are passed via a Diode Limiter.
through a four way Diode Switch to either a Low Noise Pre-amplifier or one
of three Pin Diode Attenuator. The choice of path depends on the received
signal amplitude level. The output from either the amplifier or the
attenuatoris fed via aDiode Switchto one of four bandpassTracking Filters.
These filters are arranged as sub-octave filters and are distributed across
the receiver frequency range. After the RF signal has passed through the
selected filter, it is routed via a Diode Switchthenthrough an RF Amplifier
and a further Diode Switch to one of a second bank of four bandpass Tracking
Filters generally similar to the first. The output from the chosen second
bandpass filter is routed via a Diode Switch to the Synthesizer PCB.

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Selection of signal paths andtuning oftheTracking Filtersis achieved under
microprocessor control. The control voltage for the Tracking Filters is
derived fromaD-AConvertor ontheDigital&Audio PCBvia abuffer amplifier
on the Synthesizer PCB.
(2) Synthesizer PCB
The signal from the RF PCB is fed to the First Mixer where it is mixed with
the First Local Oscillator signal and converted to the first IF signal. The
First Local Oscillator signal is incremented in 250kHz steps and provides
pre-selection of the required signal frequency. One of two frequencies is
used for the first IF frequency. The two frequencies are selected under
microprocessor control depending on the selected RF frequency. The first
IF signal is then passed via a Buffer Amplifier to the First IF Filter where
it is bandwidth limited to supress spurious responses and to confer
selectivityto the receiver. The output fromthe First IF Filter is fed into
the Secon?d Mixer where it is mixed with the Second Local Oscillator Signal
to produce the second IF signal. The Second Local Oscillator signal is
incremented in either 5kHz. 10kHz or 12.5kHz steps and is used to determine
the nominal channel spacing of the radio. The output of the Second Mixer
is then passed through a Diode Switch to the Second IF Filter. The Second
IF Filter has two separate IF bandwidth paths which are switched under
microprocessor control to allow for reception of either broad or narrowband
signals. TO ensure correct impedancematchingboth ofthese Second IF Filters
have Buffer Amplifiers at their inputs and outputs. The output from the
selected Second IF Filter is then routed via a Diode Switch to the Digital
Sr Audio PCB.
(3) Digital & Audio PCB
The IF output from the Synthesizer PCB is split and fed to the AM Detector
circuitblock and the FM Detector circuitblock, each of which is based upon
an integrated circuit containing an IF amplifier, third mixer, noise
filtering, interna1 AGC levelling as wellas the detector itself. An output
from the Third Local Oscillator, of frequency 10.245 MHz derived from a
crystal. is fed to both these integrated circuits, resulting in a final
frequency before detection of 455 kHz.
The audio outputs fromthe AM and FM Detectors are fed to pair of Solid State
Switches where they may be selected for onward transfer to the broadband DF
audio output and the narrowband speech output.
The speech output is fed to a narrow passband AF Filter via a digital

potentiometer which is used to control the audio output level and provide
a muting facility.
An additional logarithmic Signal Strength Indicator (SSI) output from the

FM detector is also fed into the A-D Converter and is used to measure the
received signal strength and hence provide an AGC output to control the gain
of the receiver. Temperature compensation of the AGC is provided by a
Thermistor connected to a third input of the A-D convertor.
@ Chelton (Electrostatics) Ltd

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Control of the receiver is performed by a dedicated 8 BIT Microcontroller.
This Microcontroller interfaces with a remote controlunitvia an RS 422 data
bus. Al1 commands and responses between the control unit and the receiver
take place over this data bus. The Microcontroller and its associated
firmware provide the necessary signals to control the operation of the
receiver.
The basic system functions provided by the Microcontroller are to read in

thefrequencyfromthedatabus andtunebothsynthesizerloopstotherequired
frequencies. Switching signals are also generated which Will Select the
correct RF and IF filters for the desired frequency of operation. The
Microcontroller by monitoring the A-D Converter and external Press to
Talk (PTT) input is able to control the gain of the system and provide the
necessary AGC and muting signals to ensure these remain constant and muted
when required.
Various iystem parameters are monitored, including synthesizer lock.

received signal strength and power supply tolerance. providing these are
satisfactory a BIT okay signal is generated.
Al1 interna1 power supplies for the receiver are derived from a single +28V dc
supply which is regulated locally to the required rail voltage. It is fed via
the Digital and Audio PCB where it is regulated to +12V dc nominal and +5V dc
nominal. It is also fed to the Synthesizer PCB where it is regulated to +18V dc
nominal, +12Vdc nominaland +5V dc nominal. The RF PCBis fed with+12V dc nominal
from the Synthesizer PCB and +5V dc nominal from the Digital and Audio PCB. The
+5V dc nominal feed is used to generate a -5V dc nominal voltage which is used
internally on the RF PCB and is also supplied to the Synthesizer PCB.

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CHELToN (ELECTROSTATIC~) LIMITED
C. Data
Equipment: V/UHFReceiver Type 707-1SerialNos. lto 100
Frequency Range: 30.000 to 407.000MHz
Input VSWR at Tuned Frequency: <3.0:1
Frequency Control: RS 422
Channel Spacing: 5kHz. 10kHz. 12.5kHz
IF Bandwidth >+GkHz @ 13dB

<f20kHz @ <60dB
Adjacent Channel Rejection: >40dB @ f25kHz

>60dB @ f50kHz
Image Rejection >60dB
IF Rejection: >80dB @ 1st IF

>80dB @ 2nd IF
>80dB @ 3rd IF
Spurious Response Rejection: >60dB DC to 1GHz
Speech Audio Bandwidth: 3dB bandwidth 300Hz to 3kHz minimum
AM Sensitivity (Speech Output): >lOdB (S+N)/N for 2.5pV PD RF modulated 30% at

1kHz
Output, AM Speech Audio: 1.5VRMSnominalacross 600Rfor 80%modulation

at IkHz, RF level = 1mV PD
FM Sensitivity (Speech Output): >lOdB (S+N)/N for l.OpV PD RF, 5kHz deviation
at 1kHz AF
Output. FM Speech Audio: 1.5V RMS nominal across 6OOQ, 5kHz deviation
at 1kHz AF, RF level = 1mV PD
DF Audio Bandwidth: 3dB bandwidth 100Hz to 5kHz minimum
AM Sensitivity (DF Output): >lOdB (S+N)/N for 5.Opv PD RF modulated 30% at

1kHz
Output, DF Audio: 700mVRMSnominalacross lknfor 30%modulation

at IkHz. RF level = 1mV PD
AGC Performance: AM audio output constant within It3dB from

2 .S/JV to 250mV PD
Third Order Intermodulation: Two signais of <25mV PD at RF I/P Will not

produce a product of >l/.rV equivalent input

of the information contained herein 1s subjectto the
PUBLICATION No. 707-I
Blocking (De-sensing): Any signal within the band 30 - 407MHz of Up
to 75mV PD Will cause <ldB reduction of
sensitivity at the tuned frequency
Squelch. Signal Present: 0.5pV to 3pV +3dB across the band
(Presettable range)
Power Supply Requirement: 28V dc @ 6OOmAnominal
Multipin connecter: PT02E-16-26P
CO-axial connecter: TNC female
Connecter Assignment:
Jl Pin A BIT
B Spare
C +28 V dc Supply Input
, D Press to Talk
E Speech Audio Output -
F Speech Audio Qutput +
G 28 V Return/Ground
H Signal Present
J Spare
K RS 422 Control Rx+
L RS 422 Control Rx-
M Spare
N Spare
P RS 422 Control TX+
R RS 422 Control Tx-
S Ground
T Spare
U DF Audio Output
V Ground
w Ground
X Reserved
Y Ground
z Spare
Spare
E Spare
C Spare
52 RF Input
Dimensions: 97mm x 160mm x 194mm nominal, including

connectors
Weight: 2kg nominal
Paint finish: Black matt epoxy to DEF STAN 80-161

Unpainted areas---treated with chromate film
conversion to DEF STAN 03-18

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the
23-12-09 Ju.~y'Z9:
CHELToN (ELECTR~STATICS) LIMITED
2. DISASSEMBLY
CAUTION: TIIIS UNIT-CONTAINS STATIC SENSITIVE DEVICES
m: The following dismantling procedures are to be carried out only as necessary

to rectify any defect established by performingthe functionaltest detailed
in paragraph 8, TESTING. NO special tools are required for dismantling the
unit. Removal of the case assembly allows a general visual examination of
the interior electronics.
A. Removal of Case assembly.
Refer to IPL Figure 1 and IPL Table 1.
(1) Remove the 6 pan head screws (15) and washers (20) securing the mainframe
interwire assembly (10) to the Case assembly (5).
(2) Remove the mainframe interwire assembly and '0' ring (50) from the case
assembly.
(3) Retain the screws. washers and '0' ring.
B. Removal of RF PCB.
Refer to Figure 3. IPL Figure 1 and IPL Table 1.
(1) Carry out the operations detailed in paragraph 2A.
(2) On the RF PCB (255) carefully unsolder the wiring to terminals P2 to P14,
see Figure 3.
(3) Remove the 9 pan head screws (260), crinkle washers (265) and plain
washers (270) securing the RF PCB to the PCB mounting rails (310). (320)
and (330). Retain the screws and washers.
(4) Remove the RF PCB from the mainframe interwire assembly (10).
C. Removal of IC1 andfor IC2.
The procedures for removalof ICl and IC2 are ident>cal. the following paragraphs
detail the removal of ICl, to remove 1c2 the same procedure should be used except
read IC2 for ICl.
Refer to Figure 4, IPL Figure 1 and IPL Table 1.
(2) On the Synthesizer PCB (235) carefully unsolder the feed table (340) to
terminals P20 and P22, see Figure 4.
washers (270) securingtheRFPCB (255)tothePCBmounting rails (310). (320)
0 Chelton (Electrostat\cs) Ltd

Use. duplxcatmn or disclosure ofthis document or any
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CHELT.ON (ELECTROSTATICS) LIMITED
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Figure 4 - Synthesizer PCB

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(4) Raise the RF PCB and support to allow access to the Synthesizer PCB, take
tare not to damage the wiring. _
(5) Remove the 2 pan head screws (360) and crinkle washers (365) securing the
Digital &Audio PCBmounting rails (310) tothe rear plate sub assembly (355).
Retain the screws and washers.
(6) Remove the 2 pan head screws (45) securing the Digital & Audio PCB mounting
rails (310) to the front plate machining (30). Retain the screws.
(7) Remove the pan head screw (215) and crinkle washer (230) securing the
Digital &Audio PCBheatsinktotheinnerlid machined (60). Retainthe screw
and washer.
(8) Slacken a11 remaining screws (360) on rear plate sub assembly and (40)
and (45) on front plate machining.
(9) SwiveltheDigital&Audio PCB (205)through 90' onthe PCBmounting rail (320)

and support, take tare not to damage the wiring.
(10) Remove the pan head screw (375), crinkle washer (380) and full nut (385)
securing ICl (370) and insulating kit (390) to the rear plate sub
assembly (355). Retain the screw. washer and nut.
(11) Carefully unsolder ICl and remove with the insulating kit from the
Synthesizer PCB.
(12) Retain the insulating kit.
D. Removal of Synthesizer PCB.
(1) Carry outthe operations detailed inparagraph 2Cto remove ICland IC2 (370).
(2) On the Synthesizer PCB carefully unsolder the wiringto terminals PI to PlO,
P12 to P17, P19. P21. P23 and P24, see Figure 4.
(3) Remove the 2 pan head screws (290) > crinkle washers (295) and plain
washers (300) and lift off the plate heatsink (285) with heatsink
machined (275) attached and spacers (305). Retain the heatsink, screws,
washers and spacers.
washers (250) securingthe Synthesizer PCBtothe PCBmountingrails (315). (325)
(5) Remove the Synthesizer PCB from the mainframe interwire assembly (10).

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P8. P il and P33 are not used
Figure 5 - Digital and Audio PCB - Topside
Figure 6 - Front Plate Inner Lid Interior

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E. Removal of Digital & Audio PCB.
(2) Remove the 2 pan head screws (360) and crinkle washers (365) securing the
Digital&Audio PCBmountingrails (310)tothe rear plate sub assembly (355).
(3) Remove the 2 pan head screws (45) securing the Digital & Audio PCB mounting
rails (310) to the front plate machining (30). Retain the screws.
Digital &Audio PCBheatsinktotheinner lid machined (60). Retainthe screw
and washer.
(5) Slacken a11 remaining screws (360) on rear plate sub assembly and (40)
and (45) on front plate machining to allow the Digital & Audio PCB (205) to
be swivelled through 90' on the PCB mounting rail (320). take tare not to
damage the wiring.
(6) On the Digital & Audio PCB carefully unsolder the wiring to terminals Pl to
P7, P9. PlO, P12 to P32 and P34 to P36, see Figure 5.
(7) Remove the 3 pan head screws (210). crinkle washers (220) and plain
washers (225) securingtheDigital&Audio PCBtothe PCBmountingrail (320).
(8) Remove the Digital & Audio PCB from the mainframe interwire assembly (10).
(9) Remove the 6 pan head screws (210). crinkle washers (220) and plain
washers (225) securing the PCB mounting rails (310) to the Digital & Audio
PCB. Retain the screws, washers and mounting rails.
F. Removal of DC connecter assembly
(1) Carry out the operations detailed in paragrabh 2A.
and washer.
(3) Remove the 3 pan head screws (40) and 6 pan head screws (45) securing the
front plate & connecter assembly (25) tothe mainframe wiring assembly (10).
(4) Li£t off the fr.lnt plate & connecter assembly and separate the front plate
machining (30) from the inner lid assembly (55) and support, take tare not
to damage the wiring.

use. duplicationor disclosure ofthis document or any
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cmL~0~ (ELEcTRoSTATICS) LIMITED
(5) Carefully unsolder the wiring fromthe inner lid assembly (55) terminals FCI
to FCll and ETl, see Figure 6.
(6) Remove the countersunk screw (190). crinkle washer (195) and full nut (200)
securing the 'P' clip (185) to the inner lid machined (60) and remove the
'P' clip from the wiring harness. Retain the 'P' clip, screw. washer and
nut.
(7) Remove the full nut (165). crinkle washer (160) and plain washer (155)
securing the 'P' clip (150) to the front plate machining (30) and remove the
'Pr clip from the wiring harness. Retain the 'P' clip, nut and washers.
(8) Remove the 4 pan head screws (110) securingthe connecter Jland gasket (115)
to the front plate machining and withdrawthe connecter and wiring if still
attached. noting its route. Retain the gasket and screws.
G. Removal of RF,connector assembly
and washer.
(3) Remove the 2 pan head screws (40) and 6 pan head screws (45) securing the
front plate & connecter assembly (25) to the mainframewiring assembly (10).
(4) Li£t off the front plate & connecter assembly and separate the front plate
machining (30) from the inner lid assembly (55) and support, take tare not
to damage the wiring.
(5) Carefully unsolder the coaxial table (125) from the RF PCB terminals Pli and
P12. see Figure 3.
(6) Remove the full nut (165). crinkle washer (160) and plain washer (155)
securing the 'P' clip (150) to the front plate machining (30). Retain the
'P' clip, nut and washers.
(7) Remove the 3 pan head screws (135) and pan head screw (140) securing the
connecter J2 and gasket (145) to the front plate machining and withdraw the
connecter and coaxial table still attached. noting its route. Retain the
gasket and screws.

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3. CLEANING
Clean a11 parts with industrial methylated spirits, any alcohol based cleaning
solvent or recognised printed circuit board cleaning agent.
I?lQTE: Do not use commercial blue pigmented spirits or corrosive cleaning agents.
4. INSPECTION/CHECK
A. Inspect a11 metal parts for:

(1) Cleanliness
(2) Corrosion
(3) Distortion
(4) Denting
(5) Cracks
(6) Serviceability of screw threads
(7) Security,of items not dismantled
B. Inspect a11 non-metal parts for:

(1) Cracking. cuts or abrasions
(2) Perishing or other deterioration
(3) Security of mounting
C. Make detailed inspection of:

(1) Connectors Jl and 52 for correct fit. Evidence of cracking and security of
or damage to pins.
(2) Case for distortion, mounting holes for damage.
(3) Front Plate for distortion and correct fit, label for legibility.
(4) Rear Plate for distortion and correct fit.

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5. REPAIR
Repair is limited to replacement of PCBs. connectors. wiring. integrated circuits

ICl and IC2 and local restoration ofthe protective finish using a matt black epoxy
paintto DEF STAN 80-161. Al1 screws and nuts with defectivethreads mustbe renewed.
Assemble a11 screws and nuts with Loctite grade 242. Solder connections are to be
made using resin cored solder to BS441 Grade K 60140 tinllead.
6. ASSEMBLY
CAUTION: THIS UNIT CONTAINS STATIC SENSITIVE DEVICES.
IYFXE: No special tools are required during assembly.
Materials required:
(1) Loctite Grade 242e.
(2) Resin corad solder BS441 Grade K 60140 tinllead.
(3) Resin and hardener CPC 19.
(4) 24SWG tinned copper wire
Equivalent substitutes may be used in place of materials listed.
A. Replacement of RF connecter assembly
Refer to Figure 3. Table 1, IPL Figure 1 and IPL Table 1.
(1) Feed the coaxial table (120) through the gasket (145) and the hole in the
front plate machining (30).
(2) Place the connecter 52 and the gasket in position and secure using 3 panhead
screws (135) and pan head screw (140) ensuringthatthe screw (140) is fitted
in the top right position.
(3) Fit the 'P' clip (150) over the DC connecter assembly (100) wiring harness
and securetothe frontplatemachining (30)usingplainwasher (155). crinkle
washer (160) and full nut (165).
(4) Pass the coaxial table from RF connecter 52 along the route noted in
paragraph 2G.
(5) Carefully solder the coaxial table to the RF PCB terminals Pli and P12. see
Figure 3 and Table 1.
(6) Fitthe front plate machining (30) to the inner lid assembly (55) and support
in position on the mainframe wiring assembly (lO), take tare not to damage
the wiring. Secure using 3 pan head screws (40) and 6 pan head screws (45).
(7) Carry out the operations detailed in paragraph 6G.

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PUBLICATION No. 707-1
TABLE 1 - WIRING INFORMATION
FROM Wire Colour/ Signal/Remarks

Connecter
Front Plate
Inner Lid -
Front Plate
Connectors Connections
Front Plate
Inner Lid -
Connections
P26 Yellow PTT
P5 Grey/Yellow BIT
Blue/Yellow DE Audio O/P
P2 Black No.5 Ground-
Black No.6 Ground

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TABLE 1 - WIRING INFORMATION (CONTINUED)
Wire Colourl Signal/Remarks

Connecter
Audio PCB

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CHELToN (ELECTROSTATICS) LrMITED
B. Replacement of DC connecter assembly
Refer to Figure 6. Table 1, IPL Figure 1 and IPL Table 1.
(1) Feed the DC connecter assembly (100) wiring harness throughthe gasket (115)
and the hole in the front plate machining (30).
(2) Placethe connecter Jl and the gasket in position and secure using4 panhead
screws (110).
(3) Lay the DC connecter assembly wiring harness from DC connecter Jl along the
route noted in paragraph 2F.
(4) Fitthe 'P' clip (150) overtheDCconnectorassemblywiringharness and secure

tothe screw (140) onthe frontplatemachining (30) usingplainwasher (155).
crinkle washer (160) and full nut (165).
(5) Fitthe 'P' clip (150) overtheDCconnectorassemblywiringharness and secure

tothe inner lid machined (60) using countersunk screw (190). crinklewasher
(195) and full nut (200).
(6) Carefully solder the wiring to the inner lid assembly (55) terminals FCl to
FCll and ETl. see Figure 6 and Table 1.
(7) Fit together the front plate machining (30) and the inner lid assembly (55)
and support in position on the mainframe wiring assembly (10), take tare not
to damage the wiring. Secure using 3 pan head screws (40) and 6 pan head
screws (45).
(8) Secure the digital & audio PCB heatsinkto the inner lid machined (60) using
the pan head screw (215) and crinkle washer (230).
C. Replacement of Digital & Audio PCB.
Refer to Figure 4, Figure 5. Table 1. IPL Figure 1 and IPL Table 1.
(1) Ensure that the screws securing ICl and IC2 to the heatsink on the Digital
6 Audio PCB (205) are finger tight. see Figure 5.
(2) Secure the PCB mounting rails (310) to the Digital & Audio PCB using 6 pan
head screws (210), crinkle washers (220) and plain washers (225).
(3) Fit the Digital &Audio PCB into the mainframe interwire assembly (10). take
tare not to damage the wiring.
(4) Secure the Digital & Audio PCB to the PCB mounting rail (320) using 3 pan
head screws (210). crinkle washers (220) and plain washers (225).
(5) If the original PCB is being fitted, on the Digital 6 Audio PCB carefully
solder the wiring to terminals Pl to P7, P9, P10. P12 to P32 and P34 to P36.
see Figure 5 and Table 1.

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(6) If a new Digital and Audio PCB is being fitted:
(a) On the Digital & Audio PCB carefully solder the wiring to terminals Pl.
P2, p5to P7. P9. P10. P12to P32 and P34to P36, seeFigure5 and Table 1.
Ensure that the wiring to P3 and P4 is not connected.
(b) Carefully unsolder the coaxial table from the Synthesizer PCB (230)
terminals P20 and P22, see Figure 4 and Table 1.
(c) Carry out the tests detailed in paragraphs 8C and 8E(l).
(d) On the Digital & Audio PCB carefully solder the wiring to terminals P3
and P4. see Figure 5 and Table 1.
(e) Carry out the tests detailed in paragraphs 8E(2).
(f) On thé Synthesizer PCB carefully solder the wiring to terminals P20 and
P22. see Figure 4 and Table 1.
(g) Carry out the tests detailed in paragraphs 8E(2).
(7) Swivel the Digital & Audio PCB into the mainframe interwire assembly. onthe
PCB mounting rail (320). take tare not to damage the wiring.
(8) Secure the Digital & Audio PCB mounting rails (310) to the front plate
machining (30) using 2 pan head screws (45).
(9) Secure the Digital & Audio PCB mounting rails (310) to the rear plate sub
assembly (355) usina, the 2 pan head screws (360) and crinkle washers (365).
(10) Tighten a11 remaining screws (360) on rear plate sub assembly and (40)
(11) Secure the Digital & Audio PCB heatsinkto the inner lid machined (60) using
(12) Applynutlocktothe screws securing ICland IC2totheheatsink ontheDigita1

& Audio PCB and tighten.

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CHELToN (ELECTROSTATICS) LIMITED
D. Replacement of Synthesizer PCB
Refer to Figure 4, Table 1, IPL Figure 1 and IPL Table 1.
(1) Ifanewsynthesizer PCB (235) isbeing fitted. ensurethatonthe Synthesizer

PCB, see Figure 4. the links LKl to LK5 are not fitted and LK6 is fitted.
(2) Fit the Synthesizer PCB into the mainframe interwire assembly (10).
(3) Secure the Synthesizer PCB to the PCB mounting rails (315). (325) and (335)
using 7 panhead screws (240). crinklewashers (245) and plainwashers (250).
(4) Fit the plate heatsink (285) with heatsink machined (275) attached over IC9
on the Synthesizer PCB, see Figure 4. and secure using 2 spacers (305). pan
head screws (290). crinkle washers (295). plain washers (300).
(5) If the original PCB is being fitted:

,
(a) On the Synthesizer PCB carefully solder the wiring to terminals Pl to
PlO. P12 to P17. P19, P21. P23 and P24. see Figure 4 and Table 1.
(b) Carry out the operations detailed in paragraph 6E.
(6) If a new Synthesizer PCB is being fitted:
(a) On the Synthesizer PCB carefully solder the wiring to terminals Pl to

PlO, P12 to P17. P19 and P21, see Figure 4 and Table 1. Ensure that
the wiring to P23 and P24 is not connected.
(b) Carry outthe operations detailed inparagraph 6E(l) and (2)to partially
replace ICl and IC2 (370).
(c) Carry out the tests detailed in paragraphs 8C to 8E(l).
(d) Fit and solder links LKl to LK5 to the Synthesizer PCB. see Figure 4,
using 24SWG tinned copper wire.
(e) On the Synthesizer PCB carefully solder the wiringto terminals P23 and
P24. see Figure 4 and Table 1.
(f) Carry out the tests detailed in paragraphs 8E(2).
(g) Carry out the operations detailed in paragraph 6E(3) to (9) to complete
the replacement of ICl and IC2 except for fitting of the Case
assembly (5).
(h) Carry out the tests detailed in paragraphs 8E(3).
(j) Carry out the operations detailed in paragraph 6G.

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cHELToN (ELECTROSTATICS) LIMITED
COMPONENTMAINTENANCEMANUAL
E. Replacement of ICl and/or IC2.
The procedures for replacement of ICl and IC2 are identical, the following
paragraphs detailthe replacementof ICl, to replace IC2 the same procedure should
be used except read IC2 for ICl.
(1) Insert ICl (370) connections intothethrough platedholesinthe Synthesizer

PCB (235) and secure ICl with insulating kit (390) to the rear plate sub
assembly (355) using pan head screw (375), crinkle washer (380) and full
nut (385).
(2) Carefully solder ICl to the Synthesizer PCB (235). see Figure 4, trim ICl
connections as necessary.
(3) Swivel the Digital & Audio PCB (205) into the mainframe interwire assembly,
on the PCB mounting rail (320). take tare not to damage the wiring.
NOTE: It may be necessary to slacken the screws securing ICl and IC2 to the
heatsink on the Digital & Audio PCB, in order to avoid damage to the
heatsink in the following operations.
(4) Secure the Digital & Audio PCB heatsinkto the inner lid machined (60) using
(5) Secure the Digital & Audio PCB mounting rails (310) to the front plate
machining (30) using 2 pan head screws (45).
(6) Secure the Digital & Audio PCB mounting rails (310) to the rear plate sub
assembly (355) using the 2 pan head screws (360) and crinkle washers (365).
(7) Tighten a11 remaining screws (360) on rear plate sub assembly and (40)
(8) Ifnecessary. applynutlocktothe screws securing ICland IC2totheheatsink

on the Digital & Audio PCB and tighten.
(9) Lower the RF PCB (255) onto the PCB mounting rails (310). (320) and (330).
take tare not to damage the wiring, and secure using 9 pan head screws (260),
crinkle washers (265) and plain washers (270).
(10) On the Synthesizer PCB carefully solder the feed table (340) to terminals
P20 and P22. see Figure 4 and Table 1.

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F. Replacement of RF PCB.
Refer to Figure 3, Table 1. IPL Figure 1 and IPL Table 1.
(1) Fit the RF PCB (255) into the mainframe interwire assembly (10).
(2) Securethe RF PCBtothe PCBmounting rails (310)) (320) and (330) using 9 pan
head screws (260). crinkle washers (265) and plain washers (270).
(3) OntheRF PCB carefully solderthewiringtoterminals P2to P14. see Figure 3

and Table 1.
G. Replacement of Case assembly.
(1) Fit '0' ring (50) into the groove in the front plate machining (30)
(2) Fitthemainframeintertiire assembly (10) intothe Case assembly (5) ensuring

correct orientation.
(3) Securethemainframeinterwire assemblytothe Case assemblyusing 6 panhead

screws (15) and washers (20).
(4) If any of the three PCBs have been replaced carry out the tests detailed in
paragraph 8F and 8B. otherwise carry outthetests detailed in paragraph 8B.
7. FITS AND CLEARANCES
Not applicable

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8. TESTING
Thetest procedure detailed in paragraph 8B should be performed as a confidence test

of the complete unit. The procedures detailed in paragraphs 8C to 8F should only
be performed as specified during assembly, paragraph 6. and trouble shooting,
paragraph 9.
A. These test procedures require the use of the following test equipment.
(1) Power Supply Unit (PSU) to provide 28V dc at l.OA.
(2) Ammeter to measure dc current in the range 500mA to 1A.
(3) Digital Voltmeter (DVM) to measure dc voltages in the range 0 to 28V.
(4) Oscilloscope to display audio frequency sinewaves of amplitude inthe range

0 to 5.OV peak to peak.
(5) Signal Generator. with IEEE interface, Hewlett Packard HP8656B.
(6) Spectrum/Network Analyser, Rhode and Schwarz FSAS.
(7) IBM Compatible Persona1 Computer (PC).
(8) Audio Analyser, Hewlett Packard 8903B.
(9) BNC T Piece.
(10) 1kR BNC Termination.
(11) 600R BNC Termination.
(12) Receiver Test Set, Chelton Type No.QB152/12.
(13) Floppy disc containingthe Type 707-l test software, Chelton Drg. NO. 19332.
(14) Floppy disc containing the Type 707-l calibration software, Chelton
Drg. No. 19364.
(15) Test Cable. Chelton Drg. No. 29440.
NOTE: Alternative test equipment may be used by agreement with the inspecting
authority.

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B. Overall Unit Test
(1) Connect the UUT to the test equipment as shown in Figure 7.
(2) Set the PSU output voltage to +28.0 + l.OV. current limit to l.OA and switch
onthe PSU, temporarily connectthe ammeterin series withthe PSU and ensure
that the current drawn is not greater than 600mA. Set the PSU current limit
to 600mA.
(3) Switch on the PC, load the test software, Chelton Drg. No. 19332. according
to the instructions provided and run AUTOTEST.
(4) Respond to the prompts as displayed on the PC screen. The tests Will then
be performed automatically.
(5) Check that the results displayed during the tests are as follows:
,
PARAMETER TEST CONDITIONS REQUIRED VALUE
Audio Output Level RF ImV, 30MHz AM. 1.2 to 1.8V rms

(Speech. 6OOn Load) modulated 80% at 1kHz
RF lmV, 30MHz FM. 1.2 to 1.8V rms

modulated 5kHz at 1kHz
Audio Output Level RF ImV, 30MHz AM, 0.6 to 0.9mV rms

(Homing, 1wZ Load) modulated 80% at 1kHz
AGC Performance RF 2.5j.lV to 250mV. 30MHz AM, +3.0dB

(Speech Audio Output) modulated 80% at 1kHz
AM Sensitivity (S+N) /N, 2lOdB

(Speech Audio Output) RF 30MHz to 406.025MHz.
2.5pV. AM. modulated 30%
at 1kHz
FM Sensitivity (S+N) /N 2lOdB

(Speech Audio Output) RF 30MHz to 406.025MHz.
l.OpV. FM, modulated 5kHz
at 1kHz
Adjacent Channel Rejection RF 121.5MHz f 50kHz and 260dB

243MHz rt 50kHz
Image rejection RF 121.5 to 142.9MHz and 260dB

243 to 264.4MHz

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28V PSU
+ -
GREEN
3EE
TERMINATION
O/P
TEST CABLE
DRG. NO. 29440
r
MOD I/P JI
1
O/F J2
SIGNAL L
GENERATOR UNIT UNDER TEST
Figure 7 - Overall Unit Test, Audio Level Adjustment and Calibration Set Up
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C. Prel .iminary Vo ltage/Current Test
NOTE: The followingtests areto be performed only as directed during assembly.

paragraph 6
(2) Set the PSU outputvoltage to +28.0? l.OV, current limit to l.OA and switch
onthe PSU, temporarily connect the ammeter in series withthe PSU and ensure
that the current drawn is not greater than 600mA. Set the PSU current limit
to 600mA.
(3) Using the DVM monitor the voltages at the points listed below relative to
Jl Pin G. in each case check that the voltage is within the limits stated.
See Figures 3. 4 and 5 for PCB component locations:
m VOLTAGE
>
RF P2 11 to 13v
P3 4.5 to 5.5v
P5 -4.5 to -5.5v
Synthesizer P7 27 to 29V
C3 +ve end 18 to 19V
P9 11 to 13v
TP7 4.5 to 5.5v
P19 -4.5 to -5.5
Digital & Audio P9 27 to 29V
IC2 Pin 2 11 to 13v
ICl Pin 3 4.5 to 5.5v
(4) Switch off the PSU.
D. Synthesizer PCB Tests
NOTES:l. The followingtests aretobe performed onlyas directed duringassembly.

paragraph 6.
2. Refer to Figure 4 for location of components on the Synthesizer PCB.
(1) Preparation
(a) On the Synthesizer PCB ensure that VRl is set fully clockwise and that
the cores of TlO. Tll. T12 and T13 are at the top of their formers.
(b) On the Digital & Audio PCB, see Figure 5. ensure that VRl. VR2, VR3 and
VR5 are set fully clockwise.
(c) Set the PSU output voltage to +28.0 k l.OV, current limit to 600mA and
switch on the PSU.
(d) Connect the Oscilloscope, set to dc at 5V per division, between the UUT
Synthesizer PCB TP2 and ground.
(e) Connect the FSAS Analyser inputbetween the UUT Synthesizer PCB LK5 end
B and ground.

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CmLToN (ELECTROSTATICS) LIMITED
QB152/12 I I-. ai-
n DF \ \ I
TEST CABLE
DRG. NO. 29440
J2
UNIT UNDER TEST
Figure 8 - Synthesizer PCB TPsts and Digital & Audio PCB Detector Tests Set Up
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(f) Switch on the PC, load the test software. Chelton Drg. No. 19332.
according to the instructions provided and run HELPTEST.
(g) Ensurethatamenuentitled 707-1TestHelp Programappears onthescreen.
(h) Enterthe diagnostic modebypressing 'D' onthe keyboard. Atthe prompt

enter a frequency of 30MHz. Ensure that the receiver parameters are
displayed on the PC screen.
(2) First Local Oscillator Alignment
(a) Set the First Local Oscillator to band 1 top frequency by pressing '2'
on the keyboard. Ensure that the displayed parameters are updated.
(b) Check that the Oscilloscope displays an ac voltage with a positive

reference.
(c) Adjust VRl on the Synthesizer PCB until the tuning voltage settles down
to a dc levelthenturn VRla further one and ahalfturns anticlockwise.
(d) AdjustT12 onthe Synthesizer PCB untilthe dc level onthe Oscilloscope

is 16V.
(e) Set the Synthesizer PCB to band 1 bottom frequency by pressing '1' on
the keyboard. Ensurethatthe displayed parameters are updated andthat
the dc level displayed on the oscilloscope is 3V rt 1V.
(f) Set the Synthesizer PCB to band 2 top frequency by pressing '4' on the
keyboard. Ensure that the displayed parameters are updated.
(g) Adjust TlO on the UUT Synthesizer PCB until the dc level on the
Oscilloscope is 16V.
(h) Set the Synthesizer PCB to band 3 bottom frequency by pressing '3' on
the keyboard. Ensurethat the displayed parameters are updated andthat
the dc level displayed on the oscilloscope is 3V + 1V.
(j) Set the Synthesizer PCB to band 3 top frequency by pressing '6' on the
keyboard. Ensure that the displayed parameters are updated.
(k) Adjust Tll on the UUT Synthesizer PCB until the dc level on the
(m) Set the Synthesizer PCB to band 5 bottom frequency by pressing '5' on
the dc level displayed on the oscilloscope is 3V * 1V.
(n) Set the Synthesizer PCB to band 4 top frequency by pressing '8' on the
keyboard. Ensure that the displayed parameters are-updated.
(p) Adjust T13 on the UUT Synthesizer PCB until the dc level on the

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(q) Set the Synthesizer PCB to band 1 bottom frequency by pressing '1' on
the dc level displayed on the oscilloscope is 3~ 4 1V.
(r) Set the FSAS Analyser controls as follows:
Control * .
Mode Analyser
Centre frequency 94.5MHz
Frequency span 100kHz
Reference level +15dBm
Resolution BW 100Hz
Al1 other controls to AUTO.
(s) Set the First Local Oscillator to band 1 bottom frequency by pressing
'1' , on the keyboard. Ensure that the displayed parameters are updated.
(t) Check that the Analyser screen displays a fairly clean waveform with
a power level of not less than +5dBm and noise/spurious signals not
greater than -75dBc over the frequency range flOkHz to +50kHz from the
fundamental.
(u) Repeat paragraphs (s) and (t) for the following Analyser centre
frequencies and pressing the appropriate key:
Centre Frequency !&y

134.75MHz 2 (Band 1 top)
135.OMHz 3 (Band 2 bottom)
190.0MHz 5 (Band 3 bottom)
270.OMHz 7 (Band 4 bottom)
(3) Second Local Oscillator Alignment
(a) Transfer the Oscilloscope, set to dc at 1V per division, to betweenthe

Synthesizer PCB TP1 and ground.
(b) Transfer the FSAS Analyser input to between the Synthesizer PCB LK3 end
B and ground.
(c) Set the Second Local Oscillator to band 2 top frequency by pressing 'Q'
(d) Adjust T9 on the Synthesizer PCB until the Oscilloscope displays a dc

level of 2.5V.
(e) Set the Second Local Oscillator to band 1 top frequency by pressing 'E'

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cmLToN (ELECTROSTATICS) LIMITED
(f) Adjust VC3 on the UUT Synthesizer PCB until the Oscilloscope displays
a dc level of 2.5V.
(g) Disconnect the Oscilloscope as it Will interfere with the measurements

which follow.
(h) Set the FSAS Analyser controls as follows:
Çontrol . .
osition
Mode Analyser
Reference level +15dBm
Resolution BW 100Hz
(j) Set ;he Second Local Oscillator to band 2 top frequency by pressing 'Q'
(k) Check that the output power level displayed on the analyser screen is
not greater than +lOdBm.
(m) Repeat paragraphs (j) and (k) for the following Analyser centre
frequencies and pressing the appropriate key:
Centre Freauency &.y

63.555MHz W (Band 2 bottom)
50.2MHz E (Band 1 top)
49.555MHz R (Band 1 bottom)
(4) First Intermediate Frequency Filter Alignment
(a) Set the FSAS Analyser controls as follows:
Control Position
Mode ScalarlNetwork
Output power -2odBm
Reference line -1OdBm
Reference level - lodm
Centre frequency 5OMHz
Frequency span 100MHz
(b) Ensure that the Oscilloscope is disconnected from the UUT.
(c) Disconnect the FSAS Analyser input and connect flying coaxial leads to
the Analyser input and the Tracking Generator output.
(d) Temporarily connect the flying leads together and adjust the analyser
gain to normalise the power loss of the leads across the frequency band
0 to 100MHz.

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cm3LToN (ELECTROSTATICS) LIMITED
(e) Connect the FSAS Analyser input between the Synthesizer PCB LK2 end A
and ground.
(f) Connect the FSAS Tracking generator input between the Synthesizer PCB
LKl end B and ground.
(g) Set the Second Local Oscillator to band 2 top frequency by pressing 'Q'
(h) On the Analyser obtain a marker and set it to 75MHz.
(j) Carefully adjust T5 and T6 on the Synthesizer PCB in order to peak the
response displayed on the analyser at 75MHz.
(k) Onthe Analyser obtaina DELTAmarkerand setitto 53.6MHz (i.e. 75 minus

21.4HMz).
(m) AdjufstVC2 onthe Synthesizer PCB for maximum rejection ofthe response
displayed on the analyser at the DELTA marker (53.6MHz).
(n) Set the Second Local Oscillator to band 1 top frequency by pressing 'E'
(p) On the Analyser obtain a marker and set it to 40MHz.
(q) Carefully adjust T3 and T4 on the Synthesizer PCB in order to peak the
response displayed on the analyser at 40MHz.
(r) Onthe Analyser obtain a DELTAmarker and set itto 61.4MHz (i.e. 40 plus
21.4MHz).
(s) Adjust VCl on the UUT Synthesizer PCB for maximum rejection of the
response displayed on the analyser at the DELTA marker (61.4MHz).
(5) Second Intermediate Frequency Filter Alignment
(a) Set the FSAS Analyser controls as follows:
Control Position
Mode Scalar/Network
Output power -2OdBm
Reference line -2OdBm
Reference level -5dBm
Level range 10dB
(b) Ensure that the Oscilloscope is disconnected from the UUT.
(c) Disconnect the FSAS Analyser input and connect flying coaxial leads to
the Analyser input and the Tracking Generator output.

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CmLToN (ELEGTROSTATICS) LIMITED
(d) Temporarily connect the flying leads together and adjust the analyser
gain to normalise the power loss of the leads across the frequency band
10.65 to 10.75MHz.
te> Connect the FSAS Analyser input between the Synthesizer PCB P23 and
ground.
(f) Connect the FSAS Tracking Generator input between the Synthesizer PCB
LK4 end A and ground.
(g) Press 'Enter' onthe keyboard to return to the 707-1Test Help Programme
menu.
th) Set the Synthesizer PCB IF Bandwidth by pressing 'B' on the keyboard
repeatedly until the PC screen displays B/W Wide.
tj) Carefully adjust Tl and T2 on the Synthesizer PCB until the response
dispiayed on the analyser is as flat as possible.
(k) Check that the output power level is not reduced by more than 3dB over
the frequency range 10.688MHz to 10.712MHz.
(ml Set the Synthesizer PCB IF Bandwidth by pressing 'B' on the keyboard
ensure that the PC screen displays B/W Narrow.
(n) Carefully adjust T7 and T8 on the Synthesizer PCB until the response
displayed on the analyser is as flat as possible.
(P) Check that the output power level is not reduced by more than 3dB over
the frequency range 10.694MHz to 10.706MHz.
(6) Completion of tests
Switch off and disconnect the test equipment.
E. Digital & Audio PCB Tests
NOTES:l. The followingtests areto be performed onlyas directed duringassembly,

paragraph 6.
2. RefertoFigure5 forlocationofcomponentsontheDigitaland Audio PCB.
(1) Detector Alignment at 10.7MHz
(a) Connect the UUT to the test equipment as shown in Figure 8.
(b) Set the PSU output voltage to +28.0 $I l.OV. current limit to 600mA and
switch on the PSU.
(c) Connectthe Oscilloscope, setto dc at5V per division. totheTest Cable

COMMSflyinglead viathe BNCT Pieceand connectthe 600RBNCTermination
to the free end of the T Piece.

of the information
restrictions
contained
on the txtle
herein 1s subject
page of thls
to the
document. 23-12-09 $a2:/::
(d) Connect the Signal Generator output between the UUT Digital & Audio PCB
~3 and P4, ground.
(e) Switch on the PC, load the test software, Chelton Drg. NO. 19332.
(f) Ensurethatamenuentitled 707-1TestHelp Programappears onthescreen.
(g) Set the Signal Generator frequency to 10.7MHz. output level to -4OdBm
and modulation off.
(h) Press '?' on the keyboard to display on the PC screen a sequence of

numerical values, updated in real time and representing the unsigned
signal level output from the UUT.
(j) Adjust T3 on the Digital & Audio PCB for minimum number displayed on
the,PC screen, relating to maximum output.
(k) Return the PC screen to the 707-l Test Help Programme menu by pressing
'ESC' on the keyboard.
(m) Set the Digital & Audio PCB Detection Mode to FM by pressing 'M' on
the keyboard repeatedly until the PC screen displays FM mode.
(n) Set the Signal Generator frequency to 10.7MHz. output level to -40dBm
and modulation to 25kHz deviation at 1kHz.
(p) Adjust T2 on the Digital & Audio PCB to centralize the distortion of
the maximum sinewave displayed on the Oscilloscope.
(q) Set the Digital & Audio PCB Detection Mode to AM by pressing 'M' on the
keyboard and ensure that the PC screen displays AM mode.
(r) Adjust Tl on the Digital 6 Audio PCB for maximum rejection of the FM
response displayed on the Oscilloscope (i.e. at 2kHz output).
(s) Display onthe PC screen a numericalvalue, updated in realtime. related

to the signal level output fromthe UUT by pressing '?' on the keyboard.
(t) Set the Signal Generator frequency to 10.7MHz output level to -8OdBm
and modulation off.
(u) Adjust VRl on the Digital & Audio PCB until an output level of 80dBm
is displayed on the PC screen.
(v) Set the Signal Generator output level to -4OdBm.
(w) Adjust VR5 on the Digital & Audio PCB until an output level of 40dBm
(x) Repeat paragraphs (t) to (w) until no further adjustment is necessary.

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cmmoN (ELECTROSTATICS) LINITED
(y) Set the Signal Generator output to each of the following levels in turn
and checkthat in each case the output level displayed on the PC screen
is within the limits stated:
Signal Generator Output (dBm) Displayed Level (dBm)

-100 98 to 102dBm
-90 88 to 92dBm
-80 78 to 82dBm
-70 68 to 72dBm
-60 58 to 62dBm
-50 48 to 52dBm
-40 38 to 42dBm
-30 28 to 32dBm
(z) Return the PC screen to displaying the 707-l Test Help Programme menu
by pressing 'ESC' on the keyboard.
(aa) Swi;ch off and disconnect the test equipment.
(2) Detector Alignment at 30MHz
(a) Connect the UUT to the test equipment as shown in Figure 8.
(b) Set the PSU output voltage to +28.0 & l.OV, current limit to 600mA and
switch on the PSU.
(cl Connectthe Oscilloscope, setto dc at5Vper division, totheTest Cable

COMMSflyinglead viatheBNCT Pieceand connectthe GOOQBNCTermination
to the free end of the T Piece.
(d) Connect the Signal Generator output between the UUT Synthesizer PCB
P20 and P22, ground.
Ce) Switch on the PC, load the test software, Chelton Drg. No. 19332.
(f) Ensure thatamenuentitled 707-1TestHelp Programappears onthescreen.
Cg) Set the Signal Generator frequency to 30MHz output level to -4OdBm and
modulation to off.
(h) Tune the UUT to 30MHz as indicated on the PC screen by pressing 'T'
on the keyboard then entering a frequency of 30.0MHz.
(j) Press '?' on the keyboard to display on the PC screen a sequence of

numerical values. updated in real time and representing the unsigned
signal level output from the UUT.
(k) Adjust VRl on the Digital & Audio PCB until an output level of 40dBm
Cm) Switch off and disconnect the test equipment.

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(3) Audio Output Level Adjustment
(a) Connect the UUT to the test equipment as shown in Figure 7. except use
the Test Cable DF flying lead in place of the COMMSflying lead and the
1kQ Termination in place of the 600RTermination.
(b) Set the PSU output voltage to +28.0 & l.OV, current limit to 600mA and
switch on the PSU.
(c) Switch on the PC, load the test software, Chelton Drg. No. 19332.
(d) Ensurethatamenuentitled 707-1TestHelp Programappears onthescreen.
(e) Enter the tuning mode by pressing 'T' on the keyboard. At the prompt
enter a frequency of 30MHz and press 'Return' to return to the 707-l
Tes$ Help Programme menu.
(f) Set the Signal Generator frequency to 30.0MHz. output level to 1mV and
modulation to AM. 30% at 1kHz.
(g) Set the Digital & Audio PCB Detection Mode to AM by pressing 'M' on the
keyboard. Ensure that the PC screen displays AM mode.
(h) Usekeys 'Z' (increase tens). 'X' (increaseunits), 'C' (decreasetens)

and 'V' (decrease units) on the keyboard to tune the output level
displayed on the audio analyser to maximum.
(j) Carefully adjust VR3 on the Digital & Audio PCB until the output level
displayed on the audio analyser is 0.75V rms.
(k) Disconnect the Test Cable DF flying lead and connect the COMMSflying
lead in its place.
(m) Set the Signal Generator frequency to 30.0MHz. output level to 1mV and
modulation to AM. 80% at 1kHz.
(n) Use keys '+' (increase) and '-' (decrease) on the keyboard to adjust
the output level displayed on the audio analyser to within the limits
1.2 to 1.8V rms.
(p) Set the Signal Generator frequency to 30.0MHz. output level to 1mV and
modulation to FM. 5kHz at 1kHz deviation.
(q) Set the Digital 6 Audio PCB Detection Mode to FM by pressing 'M' on the
keyboard. Ensure that the PC screen displays FM mode.
(r) Carefully adjust VR2 on the Digital 6 Audio PCB until the output level
displayed on the audio analyser is 1.5~ rms.
(s) Switch off and disconnect the test equipment.

Use. duplicationor dlsclosure ofthis document or any
ofthe mformatlon
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the title
herem 1s subject
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F. Unit Calibration
NOTES: The followingtests are to be performed only as directed during assembly.

paragraph 6.
Beforethe unitcanbeused as a radioitmusthaveitstuningvoltages and received

signal strength indicator (RSSI) calibrated as follows:
(2) Setthe PSU outputvoltage to +28.0 rt l.OV. current limit to 600mA and switch
on the PSU.
(3) Switch on the PC, load the calibration software, Chelton Drg. No. 19364.
according to the instructions provided and run CALIBRATE.
(4) Ensure thft a menu entitled 707-l Calibration Program appears on the screen.
(5) Startthetuningvolts calibration procedureby pressing 'T' onthe keyboard.
(6) The program Will then run through the tuning volts calibration procedure
automatically taking approximately two hours.
(7) Start the signal strength indicator output voltage calibration procedure by
pressing 'L' on the keyboard.
(8) The programwillthen runthroughthesignalstrengthindicator outputvoltage

calibration procedure automatically taking approximately half an hour.
(9) Switch off and disconnect the test equipment.

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CHELToN (ELECTROSTATICS) LIMITED
9. TROUBLE SHOOTING
Iftheunitfailsthetestsdetailedinparagraph8B. faultfindingshouldbeperformed
by first checking. by reference to Table 1. and repairing if necessary the interna1
wiring and then by substitution of the items listed below. After repair the
appropriate test procedures of paragraph 8 must be carried out as directed during
the replacement procedures detailed in paragraph 6.
Item Replaced Tests Required
Title Paragraphs
WiringlConnectors Overall Test 8B
IC1 andlor IC2 Overall Test 8B
Synthesizér PCB Preliminary Voltage/Current Test 8C

Synthesizer PCB Tests 8D
Digital & Audio PCB Tests 8E
Unit Calibration 8F
Overall Test 8B
Digital and Audio PCB Preliminary Voltage/Current Test 8C

Digital & Audio PCB Tests 8E
Unit Calibration 8F
Overall Test 8B
RF PCB Preliminary VoltagefCurrent Test 8C

Unit Calibration 8F
Overall Test 8B
lO.STORAGE INSTRUCTIONS
A. N'en available. use the manufacturers packing materials. If these are not
available. pack the unit as follows:
(1) Fit protective caps over connectors Jl and 52.
(2) Place the unit in a suitable moisture resistant pack and seal.
(3) Attach a label to the storage pack providing the following information:
(a) Unit type and serial number

(b) Date oflastmaintenanceloverhaulcheckor receiptfromthemanufacturer
(c) Date when unit is next to be tested
(d) Note of specific actions taken during maintenanceloverhaul
B. Storage life is expected to be 20 years when packed as above. It is recommended

that a unit in store be removed and tested at intervals not exceeding 3 years.

ofthe InformatIon
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11. SPECIAL TOOLS, FIXTURES AND TEST EQUIPMENT
A. No special tools or fixtures are required to service this equipment.
B. Special test equipment required is as follows:
(1) Test software. Chelton Drg. No. 19332.
(2) Calibration test software, Chelton Drg. No. 19364.
(3) Test Cable. Chelton Drg. No. 29440.

Use:duplication or disclosure ofthis document or any
ofthe information
restrxct1ons
contained
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herein 1s subJectto
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document. 23-I Z-09 Jul;"%;:
ILLUSTRATED PARTS LIST
V/UHF RECEIVER
TYPES 707-l
SERIAL Nos. 1 to 100

Use. duplication or dlsclosure ofthis document or any
of the Information contalned herein 1s subject to the 23-j 2-09 JL;;e2%k
CIELTON (ELECTROSTATICS) LIMITED
12. ILLUSTRATED PARTS LIST
330
235
210
335
2L5
250
315
210
220
80
'140 60'
\
135
ITEM 55 ASSEMBLY '200
Figure 1 - V/UHF Receiver Type 707-l Serial Nos. 1 to 100

Use. duplication or disclosure ofthls document or any
ofthe mformation contained herem is sub3ectto the
restrictions on the txtle page of this document.
TABLE 1
V/UHF RECEIVER PART No. 707-l Serial Nos. 1 to 100
FIG PART AIRLINE NOMENCLATURE

ITEM NUMBER PART No 1234567
l-l 707- 1 V/UHF RECEIVER Serial Nos 1 to 100

5 12334 . CASE ASSEMBLY
-10 24971 MAINFRAME INTERWIRE ASSEMBLY
;WIRING USE ITEMS 415-620 AS REQD)
ATTACHING PARTS
15 8112-1001 . SCREW PAN HD M3 x 6
20 8312-1005 . WASHER BONDED SEAL
* * *
25 24973 . . FRONT PLATE & CONNECTORASSEMBLY
30 24736 . . . FRONT PLATE MACHINING
35 12216 . . . SPACER
ATTACHING PARTS
40 8112-1001 . . SCREW PAN HD M3 x 6
45 8112-1011 . . SCREW PAN HD M3 x 26
* * *
50 1235912 . * . 0 RING
55 24975 . . . INNER LID ASSEMBLY
60 24737 . . . . INNER LID MACHINED
65 8019-0052 . . . . FILTERCON 5000pF
70 8019-0133 . . . . FILTERCON 100pF
75 8019-0065 . . . . FILTERCON 1200pF
80 8612-4002 . . . . SOLDER TAG
ATTACHING PARTS
85 8112-1002 . . . . SCREW PAN HD M3 x 8
90 8212-1001 . . . . NUT FULL M3
* * *
95 122671 . . . . INSULATOR LEAD THROUGH
100 24976 DC CONNECTORASSEMBLY
~~RING USE ITEM~ 420-620 As REQD)
105 8014-0038 . . . . CONNECTOR26 WAY PLUG Jl
ATTACHING PARTS
110 8112-1002 . . . SCREW PAN HD M3 x 8
* * *
115 13246 . . . GASKET
120 23584 . . . RF CONNECTORASSEMBLY
125 8015-0117 . . . . CABLE COAXIAL
130 8013-0227 . . . . RF CONNECTORTNC FEMALE 52
ATTACHING PARTS
135 8111-1003 . . . SCREW PAN HD M2.5 x 8
140 8111-1028 . . . SCREW PAN HD M2.5 x 14
* * *
145 .3242 . . . GASKET

ofthe information contained herein is subject to the
TABLE 1 (CONTINUED)
7IG PART AIRLINE NOMENCLATURE 3FF UNITS

ITEM NUMBER PART No 1234567 'ODE ER ASSY
150 8021-0013 . . . P CLIP 1

ATTACHING PARTS
155 8312-2002 . . . WASHER PLAIN M3 1
160 8311-2001 . . . WASHER CRINKLE M2.5 1
165 8211-1001 . . . NUT FULL M2.5
* * *
170 8021-0013 . . . P CLIP 1
ATTACHING PARTS
175 8112-1002 . . . SCREW PAN HD M3 x 8 1
180 8312-2001 . . . WASHER CRINKLE M3 1
* * *
185 8021-0013 . . . P CLIP 1
ATTACHING PARTS
190 8112-1015 . . . SCREWCSK HD M3 x 8 1
195 8312-2001 . . . WASHER CRINKLE M3 1
200 8212-1001 . . . NUT FULL M3 1
* * *
205 2495 9 . . DIGITAL & AUDIO PCB (707-l) 1
ATTACHING PARTS
210 8110-1005 . . SCREW PAN HD M2 x 10 9
215 8112-1002 . . SCREW PAN HEAD M3 x 8 1
220 8310-2001 . . WASHER CRINKLE M2 9
225 8310-1001 . . WASHER PLAIN M2 9
230 8312-2001 . . WASHER CRINKLE M3 1
* * *
235 28211 . . SYNTHESIZER PCB 1
ATTACHING PARTS
240 8110-1005 . . SCREW PAN HD M2 x 10 7
245 8310-2001 . . WASHER CRINKLE M2 7
250 8310-1001 . . WASHER PLAIN M2 7
* * *
255 24803 . . RF PCB 1
ATTACHING PARTS
260 8110-1005 . . SCREW PAN HD M2 x 10 9
265 8310-2001 . . WASHER CRINKLE M2 9
270 8310-1001 . . WASHER PLAIN M2 9
* * *
275 28584 . . HEATSINK MACHINED 1
ATTACHING PARTS
280 8164-1001 . . SCREW CSK HD 4-40UNC x 3/16" 1
* * *
Chelton (Electrostatics) Ltd

Use. duplication orilisclosure ofthis document or any Page 1004
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oti the title
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page of this
to the
document. 23-12-09 July 26196
TABLE 1 (CONTINUED)
FIG PART AIRLINE NOMENCLATURE EFF UNITS

ITEM NUMBER PART No 1234567 :ODE 'ER ASSY
285 28585 . . PLATE HEATSINK 1

ATTACHING PARTS
290 8110-1008 . . SCREW PAN HD M2 x 16 2
295 8310-2001 . . WASHERCRINKLE M2 2
300 8310-1001 . . WASHER PLAIN M2 2
* * *
305 13101-054 . . SPACER 2
310 12219-A . * PCB MOUNTING RAIL 3
315 12219-c . . PCB MOUNTING RAIL 1
320 12339-l . . PCB MOUNTINGRAIL 2
325 24992 . . PCB MOUNTINGRAIL 1
330 25026-A . . PCB MOUNTING RAIL 1
335 25026-B . . PCB MOUNTINGRAIL 1
-340 25029 . . FEED CABLE 1
-345 25030 . . FEED CABLE 1
350 24974 . . REAR PLATE ASSEMBLY 1
355 24735 . . . REAR PLATE SUB ASSEMBLY 1
ATTACHING PARTS
360 8112-1001 . . SCREW PAN HD M3 x 6 9
365 8312-2001 . . WASHER CRINKLE M3 9
* * *
370 24990-3 . . . INTEGRATED CIRCUIT ICl. IC2 2
ATTACHING PARTS
375 8112-1002 . . . SCREW PAN HD M3 x 8 2
380 8312-2001 . . . WASHERCRINKLE M3 2
385 8212-1001 . . . NUT FULL M3 2
* * *
390 8021-0183 . . . INSULATING KIT 2
-395 8018-0013 . LOCTITE NUTLOCK GRADE 242 AR
-400 8018-0073 . ADHESIVE CPC 19 AR
-405 8018-0179 . LOCKING COMPOUND AR
-410 8021-0149 . VARNISH AR
-415 8015-0203-01 . WIRE PTFE 7/0.2 BLACK AR
-420 8015-0203-02 .WIRE PTFE 7/0.2 BROWN AR
-425 8015-0203-03 . WIRE PTFE 7/0.2 RED AR
-430 8015-0203-04 . WIRE PTFE 7/0.2 PINK AR
-435 8015-0203-05 .WIRE PTFE 710.2 ORANGE AR
-440 8015-0203-06 . WIRE PTFE 7/0.2 YELLOW AR
-445 8015-0203-OE . WIRE PTFE 7/0.2 BLACK AR
-450 8015-0203-09 . WIRE PTFE 7/0.2 VIOLET AR
-455 8015-0203-11 . WIRE PTFE 7/0.2 WHITE AR
-460 8015-0203-21 . WIRE PTFE 7/0.2 RED/WHITE AR
-465 8015-0203-22 . WIRE PTFE 7/0.2 WHITE ORANGE AR
-470 8015-0203-23 . WIRE PTFE 7/0.2 WHITE/BLACK AR
( Chelton (Electrostatics) Ltd

Use. duplication or disclosure ofthis document oc any
of the Information contamed herein 1s sublect to the 23-j 2-09 JE;;e26:86
TABLE 1 (CONTINUED)
l- l-
FIG PART AIRLINE NOMENCLATURE EFF UNITS
ITEM NUMBER PART No 1234567 :ODE 'ER ASSY
-475 8015-0203-24 .WIRE PTFE 710.2 BLUE/YELLOW AR

-480 8015-0203-25 . WIRE PTFE 710.2 GREY/YELLOW AR
-485 8015-0203-26 .WIRE PTFE 710.2 RED/GREEN AR
-490 8015-0203-27 . WIRE PTFE 710.2 YELLOW/ORANGE AR
-495 8015-0203-28 . WIRE PTFE 710.2 RED/YELLOW AR
-500 8015-0203-29 . WIRE PTFE 7/0.2 GREY/BLACK AR
-505 8015-0203-30 . WIRE PTFE 710.2 PINK/BLACK AR
-510 8015-0203-31 .WIRE PTFE 710.2 RED/BLACK AR
-515 8015-0203-32 . WIRE PTFE 710.2 BROWN/RED AR
-520 8015-0203-33 . WIRE PTFE 710.2 RED/BLUE AR
-525 8015-0203-34 .WIRE PTFE 710.2 VIOLET/RED AR
-530 8015-0203-36 .WIRE PTFE 7/0.2 BLUE/GREY AR
-535 8015-0203-40 .WIRE PTFE 710.2 WHITE/GREY AR
-540 8015-0203-42 . WIRE PTFE 710.2 GREY/BROWN AR
-545 8015-0203-45 . WIRE PTFE 710.2 ORANGEIGREEN AR
-550 8015-0203-46 . WIRE PTFE 710.2 ORANGEIBLACK AR
-555 8015-0203-47 . WIRE PTFE 710.2 ORANGEIBROWN AR
-560 8015-0203-48 . WIRE PTFE 710.2 GREY/RED AR
-565 8015 -0203 -49 . WIRE PTFE 710.2 GREY/GREEN AR
-570 8015-0340-01 . SLEEVE MARKER BROWN '1' 1
-575 8015-0340-02 . SLEEVE MARKER RED '2' 2
-580 8015-0340-03 . SLEEVE MARKER ORANGE '3' 2
-585 8015-0340-04 . SLEEVE MARKER YELLOW '4' 1
-590 8015-0340-05 . SLEEVE MARKER GREEN '5' 1
-595 8015-0340-06 . SLEEVE MARKER BLUE '6' 1
-600 8015-0340-07 . SLEEVE MARKER VIOLET '7' 1
-605 8015-0340-08 . SLEEVE MARKER GREY '8' 1
-610 8018-0010-11 . SLEEVING HEATSHRINK AR
-615 8018-0112-33 . SLEEVING AR
-620 8021-0134 . LACING TAPE AR
Chelton (Electrostatics) Ltd

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CHELTON (ELECTROSTATICS) LIMITED

COMPONENT MAINTENANCE MANUAL

'This Manual complies with British

Date: 26th July llf96

CAA Design Approval No DAI/2613/48

RESTRICTION ON USE, DUPLICATION OR

This documentcontainsinformationproprietarytochelton (Electrostatics)

0 Chelton (Electrostatics) Ltd

Incorporated under CAA Design Approval No. DAI/2613/48

Permanent Revision Insertion Entered

0 Chelton (Electrostatics) Ltd Record of Permanent Revisions

Incorporated under CAA Design Approval No. DAI/2613/48

0 Chelton (Electrostatics) Ltd Record of Temporary Revisions

SERVICE BULLETIN J.rSy

Service Revision Date Incorporated

@ Chelton (Electrostatics) Ltd Service Bulletin List

Title Page ... ... ... ... .. * ... July 26196

Record of Permanent Revisions ... .. . *.. Page 1 July 26196

Record of Temporary Revisions ... ... . .. Page 1 July 26196

List of Effective Pages . . . ... ... ... Page 1 July 26196

0 Chelton (Electrostatics) Ltd List of-Effective Pages

0 Chelton (Electrostatics) Ltd List of Effective Pages

Description, Operation and Data ... ... ... ... . .. ... 1

Disassembly ... ... ... ... .. . .. . ... 2

Cleaning ... ... ... ... . .. . .. ... 3

InspectionlCheck ... ... ... ... ... ... ... 4

Repair ... ... ... ... ... . .. ... 5

Assembly > ... ... ... ... .. . . .. ... 6

Fits and Clearances ... ... *. . . .. ... ... ... 7

Testing ... ... ... ... ... .. . ... 8

Trouble Shooting ... ... ... ... ... . .. ... 9

Storage Instructions ... . .. ... ... ... ... ... 10

Special Tools, Fixtures and Test Equipment ... ... . .. ... 11

Illustrated Parts List ... ... ... ... ... .. . ... 12

0 Chelton (Electrostatics) Ltd Table of Contents

Figure 1 shows the general assembly of the receiver.

The Type 707-l V/UHFReceiver is a frequency synthesized receiverwhich forms part

Allaluminiumpartsarealocromed and finished externallyinmattblackepoxypaint

Refer to block diagram Figure 2.

0 Chelton (Electrostatics) Ltd

Figure 1 - V/UHF Receiver Types 707-l Serial Nos. 1 to 100

0 Chelton (Electrostatics) Ltd

(2) Synthesizer PCB

(3) Digital & Audio PCB

The speech output is fed to a narrow passband AF Filter via a digital

An additional logarithmic Signal Strength Indicator (SSI) output from the

@ Chelton (Electrostatics) Ltd

The basic system functions provided by the Microcontroller are to read in

Various iystem parameters are monitored, including synthesizer lock.

@ Chelton (Electrostatics) Ltd

Equipment: V/UHFReceiver Type 707-1SerialNos. lto 100

Frequency Range: 30.000 to 407.000MHz

Input VSWR at Tuned Frequency: <3.0:1

Frequency Control: RS 422