Ci RT3606 Placa PC
Ci RT3606 Placa PC
Ci RT3606 Placa PC
RT3606BC
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UGATEA1
PHASEA1
LGATEA1
BOOTA1
UGATE1
UGATE2
PHASE1
PHASE2
LGATE1
LGATE2
PWMA2
BOOT1
BOOT2
QW : WQFN-60L 7x7 (W-Type)
PVCC
NC
Lead Plating System
G : Green (Halogen Free and Pb Free) 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46
PWM3 1 45 PS4_Dr
Note : PGOOD 2 44 DVD
Richtek products are : TONSET 3 43 TONSETA
TSEN 4 42 TSENA
RoHS compliant and compatible with the current require- ISEN3P 5 41 ISENA1N
ISEN3N 6 40 ISENA1P
ments of IPC/JEDEC J-STD-020.
ISEN1N 7 39 NC
Suitable for use in SnPb or Pb-free soldering processes. ISEN1P 8 GND 38 ISENA2P
ISEN2P 9 37 ISENA2N
ISEN2N 10 36 FBA
FB 11 35 COMPA
Marking Information COMP 12 34 VSENA
RT3606BCGQW : Product Number VSEN 13 33 RGNDA
RGND 14 61 32 IBIAS
RT3606BC YMDNN : Date Code
SET1 15 31 NC
GQW 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
YMDNN
SET2
SET3
SETA1
SETA2
IMONA
VDIO
VCLK
OFSA/PSYS
IMON
VREF
VR_HOT
ALERT
EN
VCC
OFSM
WQFN-60L 7x7
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Controller Power Supply. Connect this pin to 5V and place a decoupling capacitor
30 VCC
2.2F at least. The decoupling capacitor is placed as close VR controller as possible.
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OFSA/PSYS
VR_HOT
PGOOD
VSENM
PS4_Dr
VSENA
TSENA
ALERT
SETA1
SETA2
OFSM
TSEN
VCLK
SET1
SET2
SET3
VDIO
DVD
VCC
EN
IMONI_M
IMONI_A UVLO
GND
MUX MUX
ADC ADC
SVID Interface
Configuration Registers IC1_M Loop Control Protection
Control Logic IC2_M Logic
IC3_M
Current Mirror DAC IC4_M
VID_M VID_A IC1_A
2V +
IBIASI IC2_A PS_M PS_A
IBIAS - DVIDTH_X VR address
IC3_A
DVIDWIDTH_X H/L fSW ramp OV_X/NV_X/
OCS_M
QR_X DVID SR OC_PER_X/OC_SUM_X
OCS_A
QRWIDTH_X Disable DVID compensation
OCS_TH_X Decrease GTV/SA ramp (only in 1-phase)
From Control Logic DVID SR RSET_X Zero load-line
DVIDTH_M ICCMAX_X Anti-OVS TONSET
RGND DVIDWIDTH_M OCP_PER_X Anti-OVS behavior
DAC
AI gain PWM3
ERROR PSYS function
Soft-Start & Slew Rate VSET_M AMP PWM
Control + Offset CMP
+
FB - Cancellation PWM1 PVCC
+ - PS_M TON
COMP GEN BOOT1
QRTH_M PWM2
Current Mirror UGATE1
QRWIDTH_M
ISEN1P + 1/3 PHASE1
IC1_M
ISEN1N - +
IB1_M GM LGATE1
VREF -
Current Mirror RSET_M BOOT2
ISEN2P + Current Balance Driver UGATE2
IC2_M
ISEN2N - PHASE2
IB2_M IMON Filter IMONI_M
IB1_M IB2_M IB3_M LGATE2
Current Mirror
ISEN3P + PWMA1 BOOTA1
IC3_M
ISEN3N - Anti-OVS UGATEA1
IB3_M
+ PHASEA1
OCS_M
IMON OCS_TH_M - Anti-OVS behavior LGATEA1
IMONA +
OCS_A
OCS_TH_A -
VREFI +
-
VREF
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Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
V CORE
V CORE
(300mV/Div)
(300mV/Div)
PGOOD
PGOOD (1V/Div)
(1V/Div)
UGATE1 UGATE1
(10V/Div) (10V/Div)
EN EN
(1V/Div) (1V/Div)
VIN = 12V, No Load, VID = 0.8V, SET2 pin tied to 5V VIN = 12V, No Load, VID = 0.8V, SET2 pin tied to 5V
V CORE
(200mV/Div)
PGOOD V CORE
(1V/Div) (500mV/Div)
PGOOD
UGATE1
(1V/Div)
(20V/Div)
UGATE1
(20V/Div)
I LOAD
(60A/Div) LGATE1
(10V/Div)
VIN = 12V, VID = 0.9V
V CORE V CORE
VCLK VCLK
VCLK VCLK
(1V/Div) (1V/Div)
V CORE VDIO V CORE VDIO
(200mV/Div) (200mV/Div)
VDIO VDIO
(1V/Div) (1V/Div)
ALERT ALERT
ALERT VIN = 12V, VID = 0.6V to 0.9V, ALERT VIN = 12V, VID = 0.9V to 0.6V,
(1V/Div) Slew Rate = Slow, S-line (1V/Div) Slew Rate = Slow, S-line
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V CORE
V CORE
VCLK VCLK
VCLK VLCK
(1V/Div) UGATE1
(1V/Div)
V CORE VDIO
(200mV/Div) UGATE1
(20V/Div) LGATE1
VDIO
(1V/Div)
ALERT LGATE1
ALERT VIN = 12V, VID = 0.6V to 0.9V, (5V/Div)
(1V/Div) Slew Rate = Fast, S-line V CORE VIN = 12V, VID = 0.9V, PS0 to PS2, ILOAD = 1A
(20mV/Div)
Time (10μs/Div) Time (50μs/Div)
V CORE
VCLK
VLCK UGATE1
(1V/Div)
VTSEN
UGATE1 (500mV/Div)
(20V/Div)
LGATE1
LGATE1
(5V/Div) VR_HOT
(1V/Div) VIN = 12V, VTSEN Sweep from 1V to 2V
V CORE VIN = 12V, VID = 0.9V, PS2 to PS0, ILOAD = 1A
(20mV/Div)
Time (50μs/Div) Time (5ms/Div)
2.0
VAXG
VIMON (V)
(300mV/Div)
1.5
PGOOD
(1V/Div)
1.0
UG_GT1
(10V/Div)
0.5
EN
(1V/Div) VIN = 12V, No Load, VID = 0.8V, SET2 pin tied to 5V
0.0
0 20 40 60 80 100 Time (500μs/Div)
Load Current (A)
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VAXG
PGOOD VAXG
VAXG
VAXG
VCLK VCLK
VCLK VCLK
(1V/Div) (1V/Div)
VAXG VDIO VAXG VDIO
(200mV/Div) (200mV/Div)
VDIO VDIO
(1V/Div) (1V/Div)
ALERT ALERT
ALERT VIN = 12V, VID = 0.9V to 0.6V, ALERT VIN = 12V, VID = 0.6V to 0.9V,
(1V/Div) Slew Rate = Slow, S-line (1V/Div) Slew Rate = Fast, S-line
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VAXG
VAXG
VCLK VCLK
VLCK UGATE1 VLCK UGATE1
(1V/Div) (1V/Div)
UG_GT1 UG_GT1
(20V/Div) (20V/Div)
LGATE1 LGATE1
LG_GT1 LG_GT1
(5V/Div) (5V/Div)
VAXG VIN = 12V, VID = 0.9V, PS0 to PS2, ILOAD = 1A VAXG VIN = 12V, VID = 0.9V, PS2 to PS0, ILOAD = 1A
(20mV/Div) (20mV/Div)
Time (50μs/Div) Time (50μs/Div)
2.0
VIMONA (V)
1.5
VTSENA
(500mV/Div) 1.0
0.5
VR_HOT
(1V/Div) VIN = 12V, VTSENA Sweep from 1V to 2V
0.0
Time (5ms/Div) 0 20 40 60 80 100
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Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Inductor current
Phase node
UGATE
LGATE
Inductor
current signal
UGATE
LGATE
Figure 3. (a)
Inductor
current signal
UGATE
LGATE
Figure 3. (b)
Figure 3. G-NAVPTM operation in DEM. (a) : The load is lighter, output capacitor discharge slope is smaller and the
switching frequency is lower. (b) : The load is increasing, output capacitor discharge slope is increased and switching
frequency is increased, too.
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Table 3. SET3 Pin Setting for VR Address, Enable Zero Load-line, Enable Anti-overshoot Function,
Anti-overshoot Behavior, and Current Gain AI
VSET3 R2 V
REF AHTI_OVS AI
R1 R2 VR Address Zero Load Line ANTI_OVS
Behavior GAIN
Min Typical Max Unit
0.000 10.948 21.896 mV 1X
High-Low-Floating
25.024 35.973 46.921 mV 2X
Disable
50.049 60.997 71.945 mV 1X
High-Floating
75.073 86.022 96.970 mV CORE : With LL 2X
100.098 111.046 121.994 mV AXG : With LL 1X
High-Low-Floating
125.122 136.070 147.019 mV 2X
Enable
150.147 161.095 172.043 mV 1X
High-Floating
175.171 186.119 197.067 mV CORE : 00 2X
200.196 211.144 222.092 mV AXG : 01 1X
High-Low-Floating
225.220 236.168 247.116 mV 2X
Disable
250.244 261.193 272.141 mV 1X
High-Floating
275.269 286.217 297.165 mV CORE : With LL 2X
300.293 311.241 322.190 mV AXG : W/O LL 1X
High-Low-Floating
325.318 336.266 347.214 mV 2X
Enable
350.342 361.290 372.239 mV 1X
High-Floating
375.367 386.315 397.263 mV 2X
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Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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NO Load Offset (Platform) Where Fsw(MAX) is the maximum switching frequency, VID1
The CORE VR features no load offset function which is the typical VID of application, VIN(MAX) is the maximum
provides the possibility of wide range positive offset of application input voltage, IccTDC is the thermal design
current of application, N is the phase number. The
RON_HS,max is the maximum equivalent high-side RDS(ON),
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In the RT3606BC, the current signal is used for load-line IMON ISEN1N +
ISEN1P
I DCR
ISENxN LX
RCSx IL3
L DCR
Where Lx/DCR = RXCX is held. The method can get high VREF
efficiency performance, but DCR value will be drifted by R C
compensation.
In RT3606BC design, the resistance of RCSx is restricted Figure 13. Total Current Sense Method
to 680Ω; moreover, the error of RCSx is recommended to Load-Line Setting (Droop)
be 1% or smaller. The G-NAVPTM topology can set load-line (droop) via the
ILx VCORE
current loop and the voltage loop, the load-line is a slope
LX DCR between load current ICC and output voltage VCORE as
shown Figure 14. Figure 15 shows the voltage control
RX CX
ISENxN
and current loop. By using the both loops, the load-line
ISENxP
+ (droop) can be set easily. The load-line set equation is :
- ISENxN RCSx 1 DCR R
EQ
AI 3 RCS
RLL
AV
R2
m
Figure 12. Lossless Current Sense Method R1
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VID
-
R and the precision voltage reference are referred to RGND
C
ISEN1N + ISEN2N + RNTC for accurate remote sensing.
ISEN[1:3]P ISEN3N
+
IMON CPU VCC_SENSE
RCS
- VREF
ISEN[1:3]N
VOUT
REQ
FB R1
-
EA
Figure 15. Voltage Loop and Current Loop + COUT
+
VID
-
Compensator Design RGND R2
C1 1 COUT ESR
R1 π fSW C2
R2
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Charge current
L
VIN
Q1 CO1 CO2
Q2
Gate
Driver RESR
CPU
Ai
Induced charge C2 Output voltage
current signal
R2 C1
CCRCOT
VIN COMP - R1
-
VID tON + EA
+ IDROOP
VID
VID Transition
DVID_Width
(SET2)
DVID_Threshold
(SET1)
RT3606BC provide a DVID compensation function. A virtual charge current signal can be established by the SET1/SET2
pins to cancel the real induced charge current signal and the virtual charge current signal is defined in Figure 19. Figure
20 shows the operation of canceling droop effect. A virtual charge current signal is established first and then VID signal
plus virtual charge current signal to be generated on the FB pin. Hence, an induced charge current signal flows to R1
and is cancelled to reduce droop effect.
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L
VIN
Q1 CO1 CO2
Q2 Output voltage
Gate
Driver RESR
CPU
Ai C2
Induced charge
current signal C1
R2
CCRCOT
IDROOP
VIN COMP - R1
-
VID tON + EA Virtual Charge Current
+
DVID Event
Virtual Charge
Current SET1
Generator
Table 6 show the DVID_Threshold on the SET1 pin with internal 80μA current source and Table 7 describes DVID_Width
settings in SET2 pin with external voltage divider. For example, 39.67mV DVID_Threshold (SR = 11.25mV/μs) / 119mV
DVID_threshold (SR = 33.75mV/μs) and 36μs DVID_Width are designed (OCP sets as 110% ICCMAX, RSET sets as
133% low frequency ramp / 200% high frequency ramp). According to the Table 6 and Table 7, the DVID_Threshold set
voltage should be between 0.4254V to 0.4473V and the DVID_Width set voltage should be between 1.051V to 1.073V.
Please note that a high accuracy resistor is needed for this setting, < 1% error tolerance is recommended.
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VCOMP
Load
Noise Margin
w/ ramp compensation Figure 22. Quick Response Mechanism
IMON-VREF
The output voltage signal behavior needs to be detected
so that QR mechanism can be trigged. The output voltage
signal is via a remote sense line to connect at VSEN pin
VCOMP
that is shown in Figure 23. The QR mechanism needs to
set QR width and QR threshold. Both definitions are shown
in Figure 22. A proper QR mechanism set can meet different
Figure 21. Ramp Compensation
applications. SET2 can set QR threshold and QR width
For the RT3606BC, the ramp compensation also needs by internal current source 80μA with multi-function pin
to be considered during mode transition from PS0/1 to setting mechanism.
PS2. For achieving smooth mode transition into PS2, a
QR_TH
proper ramp compensation design is necessary. Since
QR Pulse VSEN
+
-
-
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VCORE
IL1
L1 DCR1
VREF
REQ R1 C1
ISEN1P
IMON ISEN1N +
RNTC
- ISEN1N 680
IL2
0.6V - L2 DCR2
+
1/3
R2 C2
-
COMP + ISEN2N ISEN2P
+ +
- ISEN2N 680
IL3
L3 DCR3
R3 C3
ISEN3N ISEN3P
+
- ISEN3N 680
Figure 24 shows the whole current loop structure. The current loop plays an important role in RT3606BC that can decide
ACLL performance, DCLL accuracy and ICCMAX accuracy. For ACLL performance, the correct compensator design is
assumed, if RC network time constant matches inductor time constant LX / DCRX, an expected load transient waveform
can be designed. If RXCX network time constant is larger than inductor time constant LX / DCRX, VCORE waveform has a
sluggish droop during load transient. If RXCX network is smaller than inductor time constant LX / DCRX, a worst VCORE
waveform will sag to create an undershooting to fail the specification. Figure 25 shows the variety RXCX constant
corresponding to the output waveforms.
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R (RNTCTR +RIMON3 )
RIMON1 = K TR IMON2
RIMON2 +RNTCTR +RIMON3
Lx
R x Cx >
DCR x 2
VCORE [KR3 +KR3 (RNTCTL +RNTCTR )
IOUT x RLL RIMON2 =
+RNTCTLRNTCTR ]α TL
On time setting : Using the specification, TON is SET1 resistor network design : First the ICCMAX is
design as 90A. Next, OCP threshold is designed as
RTON 4.73p 1.2
TON ( VDAC 1.2) 246n 1.5 x ICCMAX. Last, DVID compensation parameters
VIN VDAC
need to be decided. The DVID_TH can be calculated as
The on time setting resistor RTON = 483kΩ
following equation
VDVID_TH = LL COUT dVID
dt
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= 100kΩ which β = 4485. When temperature is 100°C, VCC SVID VID + VID_REF
++ DAC
the RNTC (100!) = 4.85kΩ. Then R2 = 8.8kΩ can be Register
calculated. R1
OFSA/PSYS PIN Offset
ADC Register
R2
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- ISENA1N RCSA
DCR LA VID
1/3
+
-
ILA2 R
L DCR C RNTC
RNTC ISENA[1:2]P ISENA1N + ISENA2N
+
REQA R C
- IMONA VREF
RCS ISENA[1:2]N
ISENA2N ISENA2P
+ REQA
- ISENA2N RCSA
VID
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CPU VCCAXG_SENSE
VOUTA
FBA R1
-
EA
+ COUTA
+
VID
-
RGNDA R2
CPU VSSAXG_SENSE
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VSETA1 R2 3.2V
R1 R2 ICCMAXA Unit
Min Typical Max Unit
0.000 3.128 6.256 mV 0 A
12.512 15.640 18.768 mV 2 A
25.024 28.152 31.281 mV 4 A
37.537 40.665 43.793 mV 6 A
50.049 53.177 56.305 mV 8 A
62.561 65.689 68.817 mV 10 A
75.073 78.201 81.329 mV 12 A
87.586 90.714 93.842 mV 14 A
100.098 103.226 106.354 mV 16 A
112.610 115.738 118.866 mV 18 A
125.122 128.250 131.378 mV 20 A
137.634 140.762 143.891 mV 22 A
150.147 153.275 156.403 mV 24 A
162.659 165.787 168.915 mV 26 A
175.171 178.299 181.427 mV 28 A
187.683 190.811 193.939 mV 30 A
200.196 203.324 206.452 mV 32 A
212.708 215.836 218.964 mV 34 A
225.220 228.348 231.476 mV 36 A
237.732 240.860 243.988 mV 38 A
250.244 253.372 256.500 mV 40 A
262.757 265.885 269.013 mV 42 A
275.269 278.397 281.525 mV 44 A
287.781 290.909 294.037 mV 46 A
300.293 303.421 306.549 mV 48 A
312.805 315.934 319.062 mV 50 A
325.318 328.446 331.574 mV 52 A
337.830 340.958 344.086 mV 54 A
350.342 353.470 356.598 mV 56 A
362.854 365.982 369.110 mV 58 A
375.367 378.495 381.623 mV 60 A
387.879 391.007 394.135 mV 62 A
400.391 403.519 406.647 mV 64 A
412.903 416.031 419.159 mV 66 A
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R1 R2
VSETA1 = 80Α DVID_Threshold
R1+R2
OCP = %ICCMAX
DVID SR DVID SR
Min Typical Max Unit
= 11.25mV/s = 33.75mV/s
0.000 10.948 21.896 mV NA
25.024 35.973 46.921 mV 110%
50.049 60.997 71.945 mV 120%
75.073 86.022 96.970 mV 130%
18.33mV 55mV
100.098 111.046 121.994 mV 140%
125.122 136.070 147.019 mV 150%
150.147 161.095 172.043 mV 160%
175.171 186.119 197.067 mV NA
200.196 211.144 222.092 mV NA
225.220 236.168 247.116 mV 110%
250.244 261.193 272.141 mV 120%
275.269 286.217 297.165 mV 130%
29mV 87mV
300.293 311.241 322.190 mV 140%
325.318 336.266 347.214 mV 150%
350.342 361.290 372.239 mV 160%
375.367 386.315 397.263 mV NA
400.391 411.339 422.287 mV NA
425.415 436.364 447.312 mV 110%
450.440 461.388 472.336 mV 120%
475.464 486.413 497.361 mV 130%
39.67mV 119mV
500.489 511.437 522.385 mV 140%
525.513 536.461 547.410 mV 150%
550.538 561.486 572.434 mV 160%
575.562 586.510 597.458 mV NA
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+
-
-
Generation CMP
+
Circuit
w/ ramp compensation
Noise Margin
QR_width
IMONA-VREF
VCOMPA
For example, QR threshold 20mV/10mV at PS0/PS1 and
2.22 x TON QR width are set. According to the Table 12,
Figure 33. Ramp Compensation the set voltage should be between 0.4504V and 0.4723V.
Please note that a high accuracy resistor is needed for
For the RT3606BC, the ramp compensation also needs this setting accuracy, < 1% error tolerance is
to be considered during mode transition from PS0/1 to recommended. In the Table 12, there are some
PS2. For achieving smooth mode transition into PS2, a “NA”marks in QRWIDTH section. It means that user
proper ramp compensation design is necessary. Since should not use it to avoid the possibility of shift digital
the ramp compensation needs to be proportional to the code due to tolerance concern.
on-time, then RAMP is set as
F
133% S
400k
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Where ILA1 + ILA2 are output current and the definitions of Negative Voltage Protection
DCR, RCSA and REQA can refer to Figure 28. Since the OVP latch continuously turns on all low-side
MOSFETs of the VR, the VR will suffer negative output
Over Current Protection
voltage. When the VSENA detects a voltage below −0.07V
RT3606BC provides the Over Current Protection (OCP)
after triggering OVP, the VR triggers NVP to turn off all
which is set by the SETA1 pin in AXG VR. The OCP
low-side MOSFETs of the VR while the high-side
threshold setting can refer to ICCMAXA current in the Table
MOSFETs remain off. After triggering NVP, if the output
9. For example, if ICCMAXA is set as 120A, user can set
voltage rises above 0V, the OVP latch restarts to turn on
voltage by using the external voltage divider on SETA1
all low-side MOSFETs. Therefore, the output voltage may
pin as 0.759V typically. If 156A OCP (130% x ICCMAX)
bounce between 0V and −0.07V due to OVP latch and
threshold and DVID_TH (SR = 11.25mV/μs) = 39.67mV /
NVP triggering. The NVP function will be active only after
DVID_TH (SR = 33.75mV/μs) = 119mV will be set.
OVP is triggered.
According to Table 10, the set voltage should be between
0.4755V and 0.4974V. When output current is higher than
the OCP threshold, OCP is latched with a 40μs delay to
prevent false trigger. Besides, the OCP function is masked
when dynamic VID transient occurs, and soft-start period.
And the OCP function will re-active after 46μs of DVID or
soft-start alert is asserted.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
ISENA1P
IMONA ISENA1N +
RNTC
- ISENA1N 680
ILA2
0.6V - LA2 DCR2
+
1/3
R2 C2
-
COMPA + ISENA2N ISENA2P
+ +
- ISENA2N 680
Figure 35 shows the whole current loop structure. The Design Step
current loop plays an important role in the RT3606BC that The RT3606BC excel based design tool is available. Users
can decide ACLL performance, DCLL accuracy and can contact your Richtek representative to get the
ICCMAXA accuracy. For ACLL performance, the correct spreadsheet. Three main design procedures for RT3606BC
compensator design is assumed, if RC network time design, first step is initial settings, second step is loop
constant matches inductor time constant LAX / DCRX, an design and the last step is protection settings. The
expected load transient waveform can be designed. If RXCX following design example is to explain RT3606BC design
network time constant is larger than inductor time constant procedure :
LAX / DCRX, VAXG waveform has a sluggish droop during
load transient. If RXCX network is smaller than inductor VAXG Specification
time constant LAX /DCRX, a worst VAXG waveform will sag Input Voltage 12V
to create an undershooting to fail the specification. No. of Phases 2
For DCLL performance and ICCMAXA accuracy, since the Vboot 0.9V
copper wire of inductor has a positive temperature ICCMAX 76A
coefficient, when temperature goes high in the heavy load ICC-DY 42A
condition, DCR value goes large simultaneously. A resistor
ICC-TDC 45A
network with NTC thermistor compensation connecting
between the IMONA to REF pins is necessary, to Load Line 3.1m
compensate the positive temperature coefficient of inductor Fast Slew Rate 10mV/s
DCR. The design flow is as presented in current loop Max Switching
400kHz
design in details of CORE VR. Frequency
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
OVP protections : When the VSENA pin voltage is SET3 resistor network design : Based on table13
350mV more than VID, the OVP will be latched. When information, the two equations can be listed as following
VSENA pin voltage is 350mV less than VID, the UVP R2
0.060 3.2V
will be latched. R1 R2
R1 R2
TSEN and VR_HOT design : Using the following equation 0.261 80Α
R1 R2
to calculate related resistances for VR_HOT setting.
R1 = 171.3kΩ, R2 = 3.32kΩ.
VTSENA 80 A RA1// RA2 R ANTC (100C)
Thermal Considerations
For continuous operation, do not exceed absolute resistance, θJA. The derating curve in Figure 36 allows
maximum junction temperature. The maximum power the designer to see the effect of rising ambient temperature
dissipation depends on the thermal resistance of the IC on the maximum power dissipation.
package, PCB layout, rate of surrounding airflow, and
4.5
difference between junction and ambient temperature. The Four-Layer PCB
Maximum Power Dissipation (W)1
4.0
maximum power dissipation can be calculated by the
following formula : 3.5
3.0
PD(MAX) = (TJ(MAX) − TA) / θJA
2.5
where TJ(MAX) is the maximum junction temperature, TA is
2.0
the ambient temperature, and θJA is the junction to ambient
1.5
thermal resistance.
1.0
For recommended operating condition specifications, the
0.5
maximum junction temperature is 125°C. The junction to
0.0
ambient thermal resistance, θJA, is layout dependent. For
0 25 50 75 100 125
WQFN-60L 7x7 package, the thermal resistance, θJA, is
Ambient Temperature (°C)
25.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. The maximum power dissipation at TA = 25°C Figure 36. Derating Curve of Maximum Power
can be calculated by the following formula : Dissipation
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
1 1
2 2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Copyright © 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
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