DS6585C 01
DS6585C 01
DS6585C 01
RT6585C
selection pin, SKIPSEL, to select Diode-Emulation Mode 5V/3.3V LDOs with 100mA Output Current
(DEM) or Audio Skipping Mode (ASM). Other features 1% Accuracy on 3.3V LDO Output
include on-board power-up sequencing, a power-good Internal Frequency Setting
output, internal soft-start, and soft-discharge output that 500kHz/600kHz (CH1/CH2)
VIN UGATE2
RT6585C
BOOT2
UGATE1
PHASE2 VOUT2
BOOT1
LGATE2
VOUT1 PHASE1
LGATE1 FB2
CS1
BYP1 CS2
LDO5 5V
FB1
Off
GND
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
SKIPSEL
UGATE1
PHASE1
BOOT1
3-Cell and 4-Cell Li+ Battery-Powered Devices
EN1
Ordering Information 20 19 18 17 16
CS1 1 15 LGATE1
RT6585C
FB1 2 14 BYP1
Package Type LDO3 3 GND 13 LDO5
FB2 4 21 12 VIN
QW : WQFN-20L 3x3 (W-Type)
CS2 5 11 LGATE2
Lead Plating System 6 7 8 9 10
PGOOD
EN2
PHASE2
BOOT2
UGATE2
Note :
Richtek products are :
WQFN-20L 3x3
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020. Marking Information
Suitable for use in SnPb or Pb-free soldering processes. RE= : Product Code
RE=YM YMDNN : Date Code
DNN
BOOT1 BOOT2
UGATE1 UGATE2
PHASE1 PHASE2
LDO5 LDO5
Channel 1 Channel 2
Buck Buck
Controller Controller
LGATE1 LGATE2
FB1 FB2
CS1 CS2
PGOOD
GND
SKIPSEL
SW5 Threshold
BYP1 Power-On EN1
Sequence
Clear Fault Latch EN2
LDO5 BYP1
VIN
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Note 2. θJA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-
thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. θJC is measured at the
exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precautions are recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
21 (Exposed Pad)
GND
* : Optional
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Efficiency (%)
VIN = 7.4V
VIN = 11.1V 75
85 VIN = 11.1V
VIN = 14.8V 70 VIN = 14.8V
VIN = 20.5V 65 VIN = 20.5V
80
60
75 55
50
70 45
DEM, EN1 = LDO3, EN2 = 0V, BYP1 on 40 DEM, EN1 = 0V, EN2 = LDO3, BYP1 on
65 35
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Output Current (A) Output Current (A)
VOUT1 Switching Frequency vs. Output Current VOUT2 Switching Frequency vs. Output Current
600 700
DEM, EN1 = LDO3, EN2 = 0V, BYP1 on DEM, EN1 = 0V, EN2 = LDO3, BYP1 on
Switching Frequency (kHz)1
600
Switching Frequency (kHz)1
500
VIN = 19V
500 VIN = 19V
VIN = 11.1V
400 VIN = 11.1V
VIN = 7.4V
VIN = 7.4V
400
300
300
200
200
100
100
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Output Current (A) Output Current (A)
VOUT1 Switching Frequency vs. Input Voltage VOUT2 Switching Frequency vs. Input Voltage
600 700
Switching Frequency (kHz)1
600
Switching Frequency (kHz)1
500
500
400
400
300
300
200
200
100
100
DEM, EN1 = LDO3, EN2 = 0V, IOUT1 = 6A, BYP1 on DEM, EN1 = 0V, EN2 = LDO3, IOUT2 = 6A, BYP1 on
0 0
5 7 9 11 13 15 17 19 21 23 25 5 7 9 11 13 15 17 19 21 23 25
Input Voltage (V) Input Voltage (V)
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VOUT1 Output Voltage vs. Output Current VOUT2 Output Voltage vs. Output Current
5.05 3.33
5.04
5.03 3.32
Output Voltage (V)
5.018 3.298
5.016 3.296
5.014 3.294
VLDO5 (V)
VLDO3 (V)
5.012 3.292
5.010 3.290
5.008 3.288
5.006 3.286
5.004 3.284
5.002 3.282
DEM, VIN = 12V, EN1 = LDO3, EN2 = 0V, BYP1 off DEM, VIN = 12V, EN1 = 0V, EN2 = LDO3, BYP1 off
5.000 3.280
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
ILDO5 (mA) ILDO3 (mA)
Quiescent Current vs. Input Voltage BYP1 Supply Current vs. Input Voltage
30 160
25 150
Quiescent Current (µA)
20 140
15 130
10 120
5 110
DEM, EN1 = EN2 = LDO3, BYP1 on DEM, EN1 = EN2 = LDO3, BYP1 on
0 100
5 7 9 11 13 15 17 19 21 23 25 5 7 9 11 13 15 17 19 21 23 25
Input Voltage (V) Input Voltage (V)
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VOUT1 VOUT1
(5V/Div) (5V/Div)
VOUT2 VOUT2
(5V/Div) (5V/Div)
LDO5 LDO5
(5V/Div) (5V/Div)
DEM, EN1 = EN2 = LDO3, VIN = 12V, No Load DEM, EN1 = EN2 = LDO3, VIN = 12V, No Load
VOUT1 Load Transient Response at DEM VOUT1 Load Transient Response at ASM
EN1 = LDO3, EN2 = 0V, VIN = 12V, IOUT1 = 0A to 6A EN1 = LDO3, EN2 = 0V, VIN = 12V, IOUT1 = 0A to 6A
UGATE1
UGATE1
(20V/Div)
(20V/Div)
LGATE1 LGATE1
(5V/Div) (5V/Div)
IOUT1 IOUT1
(5A/Div) (5A/Div)
VOUT1 VOUT1
(50mV/Div) (50mV/Div)
VOUT2 Load Transient Response at DEM VOUT2 Load Transient Response at ASM
EN1 = 0V, EN2 = LDO3, VIN = 12V, IOUT1 = 0A to 6A EN1 = 0V, EN2 = LDO3, VIN = 12V, IOUT1 = 0A to 6A
UGATE1 UGATE1
(20V/Div) (20V/Div)
LGATE1 LGATE1
(5V/Div) (5V/Div)
IOUT1 IOUT1
(5A/Div) (5A/Div)
VOUT1 VOUT1
(50mV/Div) (50mV/Div)
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VOUT1
(5V/Div)
VOUT1 IL1
(2V/Div) (10A/Div)
PGOOD UGATE1
(5V/Div) (20V/Div)
LGATE1 LGATE1
(5V/Div) (5V/Div)
DEM, EN1 = EN2 = LDO3, VIN = 12V, No Load DEM, EN1 = EN2 = LDO3, VIN = 12V
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
LDO3
LDO5
EN threshold
Start-Up Time
EN1
Soft-Start Time
5V VOUT
EN threshold
EN2
Start-Up Time
3.3V VOUT
PGOOD
Soft-Start Time PGOOD
Delay
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Four-Layer PCB
3.5 Drain of low-side MOSFET and high voltage side of the
inductor, should be as short and wide as possible.
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0 25 50 75 100 125
Ambient Temperature (°C)
Layout Considerations
Layout is very important in high frequency switching
converter design. Improper PCB layout can radiate
excessive noise and contribute to the converter’s
instability. Certain points must be considered before
starting a layout with the RT6585C.
Place the filter capacitor close to the IC, within 12mm
(0.5 inch) if possible.
Keep current limit setting network as close as possible
to the IC. Routing of the network should avoid coupling
to high-voltage switching node.
Connections from the drivers to the respective gate of
the high-side or the low-side MOSFET should be as
short as possible to reduce stray inductance. Use
0.65mm (25 mils) or wider trace.
All sensitive analog traces and components such as
FBx, PGOOD, and should be placed away from high
voltage switching nodes such as PHASEx, LGATEx,
UGATEx, or BOOTx nodes to avoid coupling. Use
internal layer(s) as ground plane(s) and shield the
feedback trace from power traces and components.
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
1 1
2 2
DETAIL A
Pin #1 ID and Tie Bar Mark Options
Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.