P-Channel Switch: Symbol Parameter Ratings Units

J270
J270
P-Channel Switch
• This device is designed for low level analog switching sample and hold
circuits and chopper stabilized amplifiers.
• Sourced from process 88.
1
TO-92
1. Drain 2. Gate 3. Source
Absolute Maximum Ratings* Ta=25°C unless otherwise noted

Symbol Parameter Ratings Units
VDG Drain-Gate Voltage -30 V
VGS Gate-Source Voltage 30 V
IGF Forward Gate Current 50 mA
TJ, TSTG Operating and Storage Junction Temperature Range -55 ~ 150 °C
* This ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1) These rating are based on a maximum junction temperature of 150 degrees C.
2) These are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Electrical Characteristics Ta=25°C unless otherwise noted

Symbol Parameter Test Condition Min. Max. Units
Off Characteristics
V(BR)GSS Gate-Source Breakdwon Voltage IG = -1.0µA, VDS = 0 30 V
IGSS Gate Reverse Current VGS = -20V, VDS = 0 200 pA
VGS(off) Gate-Source Cutoff Voltage VDS = -15V, ID = 1.0nA 0.5 2.0 V
On Characteristics
IDSS Zero-Gate Voltage Drain Current * VDS = -15V, VGS = 0 -2.0 -15 mA
Small Signal Characteristics
gfs Forward Transferconductance VGS = 0V, VDS = 15V, f = 1.0kHz 6000 15000 µmhos
goss Common- Source Output Conductance VGS = 0V, VDS = 15V, f = 1.0kHz 200 µmhos
Thermal Characteristics TA=25°C unless otherwise noted

Symbol Parameter Max. Units
PD Total Device Dissipation 350 mW
Derate above 25°C 2.8 mW/°C
RθJC Thermal Resistance, Junction to Case 125 °C/W
RθJA Thermal Resistance, Junction to Ambient 357 °C/W
©2003 Fairchild Semiconductor Corporation Rev. A, July 2003

J270
Package Dimensions
TO-92
+0.25
4.58 –0.15
4.58 ±0.20
0.46 ±0.10
14.47 ±0.40
+0.10
1.27TYP 1.27TYP 0.38 –0.05
[1.27 ±0.20] [1.27 ±0.20]
3.60 ±0.20
3.86MAX
(0.25)
+0.10
0.38 –0.05
1.02 ±0.10
(R2.29)
Dimensions in Millimeters
©2003 Fairchild Semiconductor Corporation Rev. A, July 2003

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™ FACT™ ImpliedDisconnect™ PACMAN™ SPM™

ActiveArray™ FACT Quiet Series™ ISOPLANAR™ POP™ Stealth™
Bottomless™ FAST® LittleFET™ Power247™ SuperSOT™-3
CoolFET™ FASTr™ MicroFET™ PowerTrench® SuperSOT™-6
CROSSVOLT™ FRFET™ MicroPak™ QFET® SuperSOT™-8
DOME™ GlobalOptoisolator™ MICROWIRE™ QS™ SyncFET™
EcoSPARK™ GTO™ MSX™ QT Optoelectronics™ TinyLogic®
E2CMOS™ HiSeC™ MSXPro™ Quiet Series™ TruTranslation™
EnSigna™ I2C™ OCX™ RapidConfigure™ UHC™
Across the board. Around the world.™ OCXPro™ RapidConnect™ UltraFET®
The Power Franchise™ OPTOLOGIC® SILENT SWITCHER® VCX™
Programmable Active Droop™ OPTOPLANAR™ SMART START™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems 2. A critical component is any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, or (c) whose failure to perform reasonably expected to cause the failure of the life support
when properly used in accordance with instructions for use device or system, or to affect its safety or effectiveness.
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
PRODUCT STATUS DEFINITIONS

Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In This datasheet contains the design specifications for
Design product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2003 Fairchild Semiconductor Corporation Rev. I3

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J270

1. Drain 2. Gate 3. Source

Absolute Maximum Ratings* Ta=25°C unless otherwise noted

Electrical Characteristics Ta=25°C unless otherwise noted

Thermal Characteristics TA=25°C unless otherwise noted

©2003 Fairchild Semiconductor Corporation Rev. A, July 2003

©2003 Fairchild Semiconductor Corporation Rev. A, July 2003

ACEx™ FACT™ ImpliedDisconnect™ PACMAN™ SPM™

LIFE SUPPORT POLICY

PRODUCT STATUS DEFINITIONS

Datasheet Identification Product Status Definition

Preliminary First Production This datasheet contains preliminary data, and

Obsolete Not In Production This datasheet contains specifications on a product

©2003 Fairchild Semiconductor Corporation Rev. I3

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