CSA8000 Series Communications Signal Analyzers &amp TDS8000 ...

Service Manual
CSA8000 Series
Communications Signal Analyzers
TDS8000 Series
Digital Sampling Oscilloscopes
071-0438-04
Warning
The servicing instructions are for use by qualified
personnel only. To avoid personal injury, do not
perform any servicing unless you are qualified to
do so. Refer to all safety summaries prior to
performing service.
www.tektronix.com
Copyright © Tektronix, Inc. All rights reserved.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication supercedes
that in all previously published material. Specifications and price change privileges reserved.
Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

WARRANTY
Tektronix warrants that the products that it manufactures and sells will be free from defects in materials and workmanship
for a period of one (1) year from the date of shipment. If this product proves defective during its warranty period,
Tektronix, at its option, will either repair the defective product without charge for parts and labor, or provide a replacement
in exchange for the defective product.
This warranty applies only to products returned to the designated Tektronix depot or the Tektronix authorized
representative from which the product was originally purchased. For products returned to other locations, Customer will be
assessed an applicable service charge. The preceding limitation shall not apply within the European Economic Area, where
products may be returned for warranty service to the nearest designated service depot regardless of the place of purchase.
In order to obtain service under this warranty, Customer must provide the applicable office of Tektronix or its authorized
representative with notice of the defect before the expiration of the warranty period and make suitable arrangements for the
performance of service. Customer shall be responsible for packaging and shipping the defective product to the service
center designated by Tektronix or its representative, with shipping charges prepaid. Tektronix or its representative shall pay
for the return of the product to Customer. Customer shall be responsible for paying any associated taxes or duties.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty:
a) to repair damage resulting from attempts by personnel other than Tektronix representatives to install, repair or service
the product;
b) to repair damage resulting from improper use or connection to incompatible equipment;
c) to repair any damage or malfunction caused by the use of non-Tektronix supplies or consumables;
d) to repair a product that has been modified or integrated with other products when the effect of such modification or
integration increases the time or difficulty of servicing the product; or
e) to repair damage or malfunction resulting from failure to perform user maintenance and cleaning at the frequency and
as prescribed in the user manual (if applicable).
THE ABOVE WARRANTIES ARE GIVEN BY TEKTRONIX WITH RESPECT TO THIS PRODUCT IN LIEU OF ANY OTHER
WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY IMPLIED WARRANTIES OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. TEKTRONIX’ RESPONSIBILITY TO REPAIR OR
REPLACE DEFECTIVE PRODUCTS IS THE SOLE AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR
BREACH OF THIS WARRANTY. TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT,
SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE
VENDOR HAS ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
Table of Contents
General Safety Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv

Service Safety Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
Preface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
Manual Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
Manual Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xix
Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xx
Contacting Tektronix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xxi
System Specifications
Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-- 11
80E00 Electrical Sampling Modules Specifications . . . . . . . . . . . . . . 1--13
80C00 Optical Sampling Modules Specifications . . . . . . . . . . . . . . . . 1--19
80A01 Trigger Prescale Preamplifier Module Specifications . . . . . . 1--57
Installation
Check the Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 1
Site Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 1
Operating Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 1
Rackmount Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 2
Install the Sampling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 2
Check Your Sampling Module Manual(s) . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 2
Maximum Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 3
Connect the Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 4
Power On the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 6
Powering Off the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 7
Software Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 8
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 8
Software Release Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 8
Operating System Reinstallation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 8
System Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 9
Windows Safe Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 10
Operating Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2--11
Documentation Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 12
User Interface Map - Complete Control and Display . . . . . . . . . . . . . . . . . . . . 2-- 14
Front Panel Map - Quick Access to Most Often Used Features . . . . . . . . . . . . 2-- 15
Display Map - Single Graticule View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 16
Front Panel I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 16
Rear Panel I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 17
How to Use Online Help . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 18
CSA8000 & TDS8000 Series Instruments and Sampling Modules i

Table of Contents
80E00 Electrical Sampling Module Operation . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 24

Signal Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 24
Channel Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 25
TEKPROBE Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 25
TDR On Indicator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 25
80C00 Optical Sampling Module Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 26
Attenuating Optical Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 27
Channel Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 27
Optical Input Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 27
Clock Recovery Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 28
Hold-Down Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 28
80A01 Trigger Prescale Preamplifier Module Operation . . . . . . . . . . . . . . . . . 2-- 28
Signal Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 29
Theory of Operation
Logic Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 1
Mainframe Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 1
Input Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 1
Display Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 2
Front Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 2
Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 2
Low Voltage Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 2
Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 3
Electrical Sampling Modules Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 3
80E04 Electrical TDR/Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 4
Optical Sampling Modules Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 4
80C01 Optical Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 6
80C07B Optical Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 9
80C08B Optical Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 10
80C08C Optical Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 10
80A01 Trigger Prescale Preamplifier Modules . . . . . . . . . . . . . . . . . . . . . . . . . 3-- 12
Performance Verification Procedures

Brief Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--3
Perform the Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 3
Perform the Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 5
ii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Table of Contents
Perform the Functional Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 7

Verify Electrical Input Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 7
Verify Optical Input Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 10
Verify the Time Bases Work . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 13
Perform Gated Trigger Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 18
Perform the Hardware and Operating System Tests . . . . . . . . . . . . . . . . . . . . . 4-- 24
QA+Win32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 24
Checking the Cooling Fan Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 25
Checking the Hardware and Operating System . . . . . . . . . . . . . . . . . . . . . 4-- 26
Performance Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--29
Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 30
Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 31
CSA8000/TDS8000 Test Records . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 34
CSA8000/TDS8000 Main-Instrument Test Record . . . . . . . . . . . . . . . . . . . . . . 4-- 35
CSA8000B/TDS8000B Main-Instrument Test Record . . . . . . . . . . . . . . . . . . . 4-- 36
80E00 Electrical Modules Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 37
80C00 Optical Modules Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 42
Main Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--63
Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 63
Time Interval Accuracy, Short-- Term Optimized and Locked-to-Internal
10-MHz Reference Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 64
External Direct Trigger Level Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 67
External Direct Trigger Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 69
External Direct-Trigger Delay Jitter, Short-Term Optimized and
Locked-to-Internal 10-MHz Reference Modes . . . . . . . . . . . . . . . . . . . . . . 4-- 72
External Prescaled Trigger Delay Jitter, Short-Term Optimized Mode and
Locked-to-Internal 10-MHz Reference Mode . . . . . . . . . . . . . . . . . . . . . . 4-- 77
External Prescaled Trigger Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 80
DC Calibration Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 83
Electrical Sampling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--85
Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 85
Input Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 86
DC Voltage Measurement Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 88
Random Noise, Displayed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 94
Rise Time (80E02, 80E03, & 80E04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 96
Analog Bandwidth (80E01) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 99
Power-Reference Characterization Setup . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 99
Ref.-Characterization Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 100
Adapter-Characterization Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 101
Adapter-Characterization Measurements . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 101
80E01 Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 104
50 MHz - 50 GHz Analog Bandwidth (80E06) . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 107
SNA & Autotester Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 107
Power-Meter/Power Sensor Zero/Cal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 109
Measure the Power In . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 109
Adapter Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 110
80E06 HF Setup and Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 112
CSA8000 & TDS8000 Series Instruments and Sampling Modules iii

Table of Contents
50 GHz - 65 GHz Analog Bandwidth (80E06) . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 117

SNA & Reflectometer Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 117
Power-Meter/Power Sensor Zero/Cal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 120
Measure the Power In . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 121
Adapter Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 123
80E06 HF Setup and Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 125
TDR-System Reflected Rise Time (80E04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 129
TDR-System Step Response Aberrations (80E04) . . . . . . . . . . . . . . . . . . . . . . 4-- 131
Optical Sampling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--137
Dark Level & Vertical Equivalent Optical Noise . . . . . . . . . . . . . . . . . . . . . . . 4-- 138
Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 139
Minimum Optical Bandwidth & Reference Receiver Frequency Response . . . 4-- 146
80C01-- 80C09 and 80C11 Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 148
Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 151
80C10 Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 161
Tunable Laser Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 161
Integrated Rise Time and Aberrations Check . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 168
Clock Recovery Optical Sensitivity Range and Recovered Clock
Timing Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 174
Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 177
80A01 Trigger Prescale Limiting Preamplifier Module . . . . . . . . . . . 4--185
Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 185
System Trigger Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 186
Adjustment Procedures
Adjustment Interval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 1
Adjustment Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 1
Adjustment After Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 1
Required Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 2
Instrumentation Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 2
Main Instrument Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 3
DC Calibrator Adjust . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 3
DC Calibrator Adjust Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 4
Internal 10 MHz Adjust . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-- 5
Maintenance
Preventing ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 1
Inspection and Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 2
General Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 2
Flat Panel Display Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 2
Exterior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 3
Interior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 4
Removal and Installation Procedures . . . . . . . . . . . . . . . . . . . . . . . . . 6--7
Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 7
iv CSA8000 & TDS8000 Series Instruments and Sampling Modules

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Procedures for External Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 9

Front-Panel Knobs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 9
Trim and Carrying Handle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 10
Bottom Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 11
Covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 13
Line Fuses and AC power cord connector . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 16
Procedures for Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 21
Front Panel Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 21
Front Panel Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 23
Front Panel Keypad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 24
Display Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 25
Display Adapter Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 27
Standby/On Switch Flex Circuit Removal . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 29
Floppy Disk Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 31
Hard Disk Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 32
CD Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 34
Fan Assembly Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 35
Front and Rear Power Distribution Boards . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 37
Low-Voltage Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 38
NLX Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 40
Microprocessor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 43
PC Processor Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 45
Acquisition Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 47
Large Module Interface Circuit Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 52
Module Slot Doors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 53
Electrical Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 62
Exchanging the Electrical Sampling Module . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 63
Replacing the sampling module chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 63
Reinstalling exchange module serial number . . . . . . . . . . . . . . . . . . . . . . . 6-- 63
Optical Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 64
80A01 Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 65
Troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--67
Check for Common Problems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 67
Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 70
Isolating Failures between the 80E0X/80C0X Modules or the Mainframe . . . 6-- 70
Isolating to a Board if Power Will Not Come Up . . . . . . . . . . . . . . . . . . . . 6-- 71
Checking the Power Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 72
If the instrument Will Not Boot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 73
Booting Into Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 74
PPC and NLX PC Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 74
Power-On Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 74
QAPlus/Win . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 74
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 75
Firmware Updates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 75
After Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 76
Installing the Instrument Model and Serial Number . . . . . . . . . . . . . . . . . . . . . 6-- 76
Update/Restore the NLX Board CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 77
Repackaging Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--79
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 79
Shipping to the Service Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 79
CSA8000 & TDS8000 Series Instruments and Sampling Modules v

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Options and Accessories

Standard Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-- 2
Optional Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-- 3
Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7-- 4
Electrical Parts List

Electrical Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8--1
Diagrams
Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-- 1
CSA8000 and TDS8000 Series Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . 9-- 2
Electrical Sampling Modules Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 9-- 3
Optical Sampling Modules Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-- 4
80A01 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-- 24
Mechanical Parts List

Parts Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-- 1
Module Servicing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-- 1
Using the Replaceable Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10-- 2
vi CSA8000 & TDS8000 Series Instruments and Sampling Modules

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List of Figures
Figure 2--1: Compartments for sampling modules . . . . . . . . . . . . . . . 2--3

Figure 2--2: Maximum inputs in three configurations . . . . . . . . . . . . 2--3
Figure 2--3: Locations of peripheral connectors on rear panel . . . . . 2--5
Figure 2--4: Line fuse and power cord connector locations,
rear panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2--6
Figure 2--5: On/Standby switch location . . . . . . . . . . . . . . . . . . . . . . . 2--7
Figure 2--6: Sampling module, 80E04 shown . . . . . . . . . . . . . . . . . . . 2--24
Figure 2--7: Sampling module, 80C01-CR shown . . . . . . . . . . . . . . . . 2--27
Figure 2--8: 80A01 module front panel . . . . . . . . . . . . . . . . . . . . . . . . 2--29
Figure 4--1: Compensation dialog box . . . . . . . . . . . . . . . . . . . . . . . . . 4--5

Figure 4--2: Hookup for electrical functional tests . . . . . . . . . . . . . . . 4--8
Figure 4--3: Channel button location . . . . . . . . . . . . . . . . . . . . . . . . . . 4--8
Figure 4--5: Optical channel verification . . . . . . . . . . . . . . . . . . . . . . . 4--12
Figure 4--6: Hookup for the time base tests . . . . . . . . . . . . . . . . . . . . . 4--13
Figure 4--8: Main time base verification . . . . . . . . . . . . . . . . . . . . . . . 4--16
Figure 4--9: Mag time base verification . . . . . . . . . . . . . . . . . . . . . . . . 4--17
Figure 4--10: Hookup for the gated trigger tests . . . . . . . . . . . . . . . . . 4--19
Figure 4--11: Channel button location . . . . . . . . . . . . . . . . . . . . . . . . . 4--20
Figure 4--12: Signal triggered . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--21
Figure 4--13: Signal not triggered (signal frozen) . . . . . . . . . . . . . . . . 4--22
Figure 4--14: Signal not triggered (no waveform) . . . . . . . . . . . . . . . . 4--23
Figure 4--15: Signal triggered . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--24
Figure 4--16: Time interval accuracy test hookup . . . . . . . . . . . . . . . 4--64
Figure 4--17: External direct trigger test hookup . . . . . . . . . . . . . . . . 4--67
Figure 4--18: External direct trigger sensitivity test hookup . . . . . . . 4--70
Figure 4--19: External direct trigger jitter test hookup . . . . . . . . . . . 4--72
Figure 4--20: External prescaled test hookup . . . . . . . . . . . . . . . . . . . 4--78
Figure 4--21: External prescaled trigger sensitivity test hookup . . . . 4--80
Figure 4--22: Hookup for DC calibration test . . . . . . . . . . . . . . . . . . . 4--84
Figure 4--23: Input impedance test hookup . . . . . . . . . . . . . . . . . . . . . 4--86
Figure 4--24: Vertical DC accuracy test hookup . . . . . . . . . . . . . . . . . 4--89
Figure 4--25: Rise Time hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--96
CSA8000 & TDS8000 Series Instruments and Sampling Modules vii

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Figure 4--26: Power-reference hookup . . . . . . . . . . . . . . . . . . . . . . . . . 4--100

Figure 4--27: Adapter characterization hookup . . . . . . . . . . . . . . . . . 4--101
Figure 4--28: Measure reference signals . . . . . . . . . . . . . . . . . . . . . . . . 4--102
Figure 4--29: 80E01 reference signals hookup . . . . . . . . . . . . . . . . . . . 4--104
Figure 4--30: SNA/Autotester Characterization . . . . . . . . . . . . . . . . . 4--108
Figure 4--31: Power-reference characterization hookup . . . . . . . . . . 4--109
Figure 4--32: Hookup to measure Power in . . . . . . . . . . . . . . . . . . . . . 4--110
Figure 4--33: No Adapter hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--111
Figure 4--34: Adapter--loss hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--112
Figure 4--35: 80E06 HF response hookup . . . . . . . . . . . . . . . . . . . . . . 4--113
Figure 4--36: SNA/Waveguide Characterization . . . . . . . . . . . . . . . . . 4--119
Figure 4--37: Power-reference characterization hookup . . . . . . . . . . 4--121
Figure 4--38: Hookup to measure Power-in . . . . . . . . . . . . . . . . . . . . . 4--122
Figure 4--39: Adapter--loss hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--124
Figure 4--40: 80E06 HF response hookup . . . . . . . . . . . . . . . . . . . . . . 4--125
Figure 4--41: TDR reflected rise time hookup . . . . . . . . . . . . . . . . . . . 4--129
Figure 4--42: TDR system step response aberrations hookup . . . . . . 4--131
Figure 4--43: Dark level and vertical equivalent optical noise
test hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--138
Figure 4--44: Minimum optical bandwidth and reference receiver
frequency response hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--149
Figure 4--45: Proper positioning of the impulse for optimum
curve download . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--152
Figure 4--46: Hookup for heterodyne test . . . . . . . . . . . . . . . . . . . . . . 4--162
Figure 4--47: Setup used for Heterodyne sweep . . . . . . . . . . . . . . . . . 4--164
Figure 4--48: Integrated rise time and aberrations hookup . . . . . . . . 4--169
Figure 4--49: Clock recovery optical sensitivity range and
recovered clock timing jitter hookup . . . . . . . . . . . . . . . . . . . . . . . 4--175
Figure 4--50: Display example (clock signal not synchronized
with the data rate input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--180
Figure 4--51: Display example (clock signal synchronized with
the data rate input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--183
Figure 4--52: Display example (zoomed in at the crossing point) . . . 4--184
Figure 4--53: 80A00 test hookup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--187
Figure 5--1: Adjustment setup using the DMM . . . . . . . . . . . . . . . . . . 5--3

Figure 5--2: Adjustment setup using the signal generator . . . . . . . . . 5--5
Figure 6--1: Knob removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--9

Figure 6--2: Trim removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--11
viii CSA8000 & TDS8000 Series Instruments and Sampling Modules

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Figure 6--3: Bottom cover removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--12

Figure 6--4: Cover removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--14
Figure 6--5: Cover removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--15
Figure 6--6: Line fuses and line cord removal . . . . . . . . . . . . . . . . . . . 6--17
Figure 6--7: External modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--18
Figure 6--8: Internal modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--19
Figure 6--9: Acquisition modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--20
Figure 6--10: Front panel assembly removal . . . . . . . . . . . . . . . . . . . . 6--22
Figure 6--11: J1 flex cable connector removal . . . . . . . . . . . . . . . . . . . 6--23
Figure 6--12: Front panel board & keyboard removal . . . . . . . . . . . . 6--24
Figure 6--13: Display removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--26
Figure 6--14: Touch panel & LCD assembly removal . . . . . . . . . . . . 6--27
Figure 6--15: Display adaptor board removal . . . . . . . . . . . . . . . . . . . 6--28
Figure 6--16: Connector clip assembly . . . . . . . . . . . . . . . . . . . . . . . . . 6--28
Figure 6--17: Standby/On switch flex circuit removal . . . . . . . . . . . . 6--30
Figure 6--18: Floppy disk drive removal . . . . . . . . . . . . . . . . . . . . . . . 6--31
Figure 6--19: Hard drive disk removal . . . . . . . . . . . . . . . . . . . . . . . . . 6--33
Figure 6--20: Removing the hard disk drive from the cartridge . . . . 6--33
Figure 6--21: CD drive & bracket removal . . . . . . . . . . . . . . . . . . . . . 6--35
Figure 6--22: Fan assembly removal . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--36
Figure 6--23: Front & rear power distribution board removal . . . . . 6--37
Figure 6--24: Low-voltage power supply removal . . . . . . . . . . . . . . . . 6--39
Figure 6--25: NLX assembly removal . . . . . . . . . . . . . . . . . . . . . . . . . . 6--41
Figure 6--26: Riser adapter & NLX board removal . . . . . . . . . . . . . . 6--42
Figure 6--27: Microprocessor removal . . . . . . . . . . . . . . . . . . . . . . . . . 6--44
Figure 6--28: Processor board removal . . . . . . . . . . . . . . . . . . . . . . . . 6--46
Figure 6--29: T-10 screws and threaded posts . . . . . . . . . . . . . . . . . . . 6--48
Figure 6--30: Acquisition circuit board assembly removal (8000) . . . 6--50
Figure 6--31: Acquisition circuit board assembly removal (8000B) . 6--51
Figure 6--32: Large module interface circuit board removal . . . . . . . 6--53
Figure 6--33: Small and Large module chassis removal . . . . . . . . . . . 6--55
Figure 6--34: Module door spring removal . . . . . . . . . . . . . . . . . . . . . 6--57
Figure 6--35: Module slot door removal . . . . . . . . . . . . . . . . . . . . . . . . 6--58
Figure 6--36: Module ejector handles removal . . . . . . . . . . . . . . . . . . 6--60
Figure 6--37: Spring arm position . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--61
Figure 6--38: Electrical module hardware removal . . . . . . . . . . . . . . 6--62
Figure 6--39: Optical module cover removal . . . . . . . . . . . . . . . . . . . . 6--64
Figure 6--40: 80A01 parts removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--65
CSA8000 & TDS8000 Series Instruments and Sampling Modules ix

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Figure 6--41: Location of power-on and over current LEDs . . . . . . . 6--71

Figure 6--42: Location of debug pins . . . . . . . . . . . . . . . . . . . . . . . . . . 6--72
Figure 6--43: Connectors J1 and J2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--73
Figure 9--1: Block diagram for CSA8000 and TDS8000 Series

Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--2
Figure 9--2: Block diagram for the 80E00 Series Electrical
Sampling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--3
Figure 9--3: 80C01 Optical sampling block diagram . . . . . . . . . . . . . 9--4
Figure 9--4: 80C01 Optical sampling with clock recovery block
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--5
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--7
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--9
Figure 9--10: 80C04 Optical sampling block diagram with
clock recovery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--11
Figure 9--11: 80C05 Optical sampling block diagram . . . . . . . . . . . . 9--12
Figure 9--13: 80C07 and 80C07B Optical sampling block
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--14
Figure 9--14: 80C07 and 80C07B Optical sampling with CR1
clock recovery block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--15
Figure 9--15: 80C08/80C08B/80C08C Optical sampling block
diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--16
Figure 9--16: 80C08/80C08B/80C08C Optical sampling with
CR1, CR2, & CR4 clock recovery block diagram . . . . . . . . . . . . 9--17
Figure 9--18: 80C09 Optical sampling with CR1 clock recovery
block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--19
option block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--21
Figure 9--22: 80C11 Optical sampling with CR2 and CR3
clock recovery option block diagram . . . . . . . . . . . . . . . . . . . . . . 9--22
option block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--23
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Table of Contents
Figure 9--24: 80A01 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--24
Figure 10--1: External parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--7

Figure 10--2: Front panel and drives . . . . . . . . . . . . . . . . . . . . . . . . . . 10--10
Figure 10--3: Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--13
Figure 10--4: Acquisition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--15
Figure 10--5: Coaxial cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--17
Figure 10--6: Electrical modules (80E01, 80E02, 80E03,
and 80E04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--19
Figure 10--7: 80E06 module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--20
Figure 10--8: Optical modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--21
Figure 10--9: 80A01 module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--22
Figure 10--10: Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--25
CSA8000 & TDS8000 Series Instruments and Sampling Modules xi

Table of Contents
List of Tables
Table 1--1: System -- Signal acquisition . . . . . . . . . . . . . . . . . . . . . . . 1--1

Table 1--2: System -- Timebase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1--2
Table 1--3: System -- Trigger . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1--3
Table 1--4: CSA8000 and TDS8000 -- Power consumption and
cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1--6
Table 1--5: CSA8000 and TDS8000 -- Display . . . . . . . . . . . . . . . . . . 1--7
Table 1--6: CSA8000B and TDS8000B -- Ports . . . . . . . . . . . . . . . . . 1--7
Table 1--7: CSA8000 and TDS8000 -- Data storage . . . . . . . . . . . . . . 1--8
Table 1--8: CSA8000 and TDS8000 -- Mechanical . . . . . . . . . . . . . . . 1--9
Table 1--9: System -- Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . 1--10
Table 1--10: Certifications and compliances . . . . . . . . . . . . . . . . . . . . 1--11
Table 1--11: Electrical sampling modules -- Descriptions . . . . . . . . . 1--13
Table 1--12: Electrical sampling modules -- Signal acquisition . . . . 1--14
Table 1--13: Electrical sampling module (80E04) -- TDR system . . . 1--16
Table 1--14: Electrical sampling modules -- Timebase system . . . . . 1--17
Table 1--15: Electrical sampling modules -- Power consumption . . . 1--17
Table 1--16: Electrical sampling modules -- Mechanical . . . . . . . . . . 1--18
Table 1--17: Optical modules -- Descriptions . . . . . . . . . . . . . . . . . . . 1--20
Table 1--18: Optical modules -- Acquisition . . . . . . . . . . . . . . . . . . . . 1--22
Table 1--19: Optical Power Meter . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1--46
Table 1--20: Optical modules -- Clock recovery options
(CR, CR1, CR2, CR3, and CR4) . . . . . . . . . . . . . . . . . . . . . . . . . . 1--46
Table 1--21: Optical modules -- Mechanical . . . . . . . . . . . . . . . . . . . . 1--54
Table 1--22: Optical modules -- Environmental . . . . . . . . . . . . . . . . . 1--55
Table 1--23: Module characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 1--57
Table 1--24: Environmental specifications . . . . . . . . . . . . . . . . . . . . . 1--58
Table 1--25: Mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . 1--58
Table 2--1: Additional accessory connection information . . . . . . . . . 2--4

Table 2--2: Line fuses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2--6
Table 2--3: Application software version required . . . . . . . . . . . . . . . 2--26
Table 3--1: Module optical/electrical split . . . . . . . . . . . . . . . . . . . . . . 3--6
Table 4--1: Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--31

80E00 Test Record . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--37
xii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Table of Contents
Table 4--2: DC Voltage measurement accuracy . . . . . . . . . . . . . . . . . 4--90

Table 4--3: Data for calculation of gain and linearity . . . . . . . . . . . . 4--93
Table 4--4: Computed rise time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--98
Table 4--5: Power reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--100
Table 4--6: DUT (device under test) reference response . . . . . . . . . . 4--103
Table 4--7: 80E06 bandwidth response (50 MHz -- 50 GHz) . . . . . . . 4--115
Table 4--8: 80E06 bandwidth response (55 GHz -- 65 GHz) . . . . . . . 4--128
Table 4--9: Application software version required . . . . . . . . . . . . . . . 4--137
Table 4--10: Dark level and vertical equivalent optical noise
limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--141
Table 4--11: Minimum optical bandwidth limits . . . . . . . . . . . . . . . . 4--153
Table 4--12: Reference receiver frequency response limits . . . . . . . . 4--155
Table 4--13: Reference receiver frequency response limits . . . . . . . . 4--167
Table 4--14: Minimum limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--172
Table 4--15: Aberrations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--172
Table 4--16: Clock recovery settings . . . . . . . . . . . . . . . . . . . . . . . . . . 4--177
Table 4--17: Clock recovery settings & jitter limits . . . . . . . . . . . . . . 4--181
Table 5--1: Adjustments required for module replaced . . . . . . . . . . . 5--1

Table 5--2: Required equipment and materials . . . . . . . . . . . . . . . . . 5--2
Table 6--1: External inspection check list . . . . . . . . . . . . . . . . . . . . . . 6--3

Table 6--2: Internal inspection check list . . . . . . . . . . . . . . . . . . . . . . 6--4
Table 6--3: Tools required for module removal . . . . . . . . . . . . . . . . . 6--8
Table 6--4: Failure symptoms and possible causes . . . . . . . . . . . . . . . 6--67
Table 6--5: Power supply voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--73
Table 6--6: Action required for module replaced . . . . . . . . . . . . . . . . 6--76
Table 7--1: Available sampling modules . . . . . . . . . . . . . . . . . . . . . . . 7--1

Table 7--2: Standard accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7--2
Table 7--3: Optional accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7--3
CSA8000 & TDS8000 Series Instruments and Sampling Modules xiii

Table of Contents
xiv CSA8000 & TDS8000 Series Instruments and Sampling Modules

General Safety Summary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it. To avoid potential hazards, use this
product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of the system. Read
the General Safety Summary in other system manuals for warnings and cautions
related to operating the system.
To Avoid Fire or Use Proper Power Cord. Use only the power cord specified for this product and
Personal Injury certified for the country of use. Power cord needed only in the mainframe, not
modules.
Connect and Disconnect Properly. Do not connect or disconnect probes or test

leads while they are connected to a voltage source.
Ground the Product. The mainframe is grounded through the grounding
conductor of the power cord. To avoid electric shock, the grounding conductor
must be connected to earth ground. Before making connections to the input or
output terminals of the product, ensure that the product is properly grounded.
Ground the Product. The modules are indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to the
input or output terminals of the product, ensure that the product is properly
grounded.
Observe All Terminal Ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Do Not Operate Without Covers. Do not operate this product with covers or panels
removed.
Use Proper Fuse. Use only the fuse type and rating specified for this product.
Avoid Exposed Circuitry. Do not touch exposed connections and components
when power is present.
Wear Eye Protection. Wear eye protection if exposure to high-intensity rays or
laser radiation exists.
Do Not Operate With Suspected Failures. If you suspect there is damage to this
product, have it inspected by qualified service personnel.
CSA8000 & TDS8000 Series Instruments and Sampling Modules xv

General Safety Summary
Do Not Operate in Wet/Damp Conditions.

Do Not Operate in an Explosive Atmosphere.
Keep Product Surfaces Clean and Dry.
Provide Proper Ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Symbols and Terms Terms in this Manual. These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result

in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in

damage to this product or other property.
Terms on the Product. These terms may appear on the product:

DANGER indicates an injury hazard immediately accessible as you read the
marking.
WARNING indicates an injury hazard not immediately accessible as you read the
marking.
CAUTION indicates a hazard to property including the product.
Symbols on the Product. The following symbols may appear on the product:
CAUTION WARNING Protective Ground

Refer to Manual High Voltage (Earth) Terminal
Mains Disconnected Mains Connected Standby

OFF (Power) ON (Power)
xvi CSA8000 & TDS8000 Series Instruments and Sampling Modules

Service Safety Summary
Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
CSA8000 & TDS8000 Series Instruments and Sampling Modules xvii

Service Safety Summary
xviii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Preface
This is the service manual for the:
H CSA8000 and CSA8000B Communications Signal Analyzers,

H TDS8000 and TDS8000B Digital Sampling Oscilloscopes, and
H the sampling and other modules that install in both instruments.
Read this preface to learn how this manual is structured, what conventions it
uses, and where you can find other information related to servicing this product.
Read the Introduction following this preface for safety and other important
background information needed before servicing this product.
NOTE. This manual includes information for the CSA8000/TDS8000 and

CSA8000B/TDS 8000B instruments.
Manual Structure
This manual is divided into chapters, which are made up of related subordinate
topics. These topics can be cross referenced as sections.
Be sure to read the introductions to all procedures. These introductions provide
important information needed to do the service correctly, safely, and efficiently.
Manual Conventions
This manual uses certain conventions that you should become familiar with
before attempting service.
Modules Throughout this manual, the term module appears. A module is composed of
electrical and mechanical assemblies, circuit cards, interconnecting cables, and a
user-accessible front panel. “Sampling modules,” such as electrical sampling and
optical sampling modules, refer to products.
Replaceable Parts This manual refers to any field-replaceable assembly or mechanical part by its
name or generically as a replaceable part. In general, a replaceable part is any
circuit board or assembly, such as a hard disk drive, or a mechanical part, such as
I/O port connectors, that is listed in the replaceable parts list of Chapter 10.
Safety Symbols and terms related to safety appear in the General Safety Summary found
at the beginning of this manual.
CSA8000 & TDS8000 Series Instruments and Sampling Modules xix

Preface
Related Documentation
The following documents relate to the instruments this service manual supports:
H CSA8000B and TDS8000B User manual. Tektronix part number
071-1099-XX.
H CSA8000B and TDS8000B Reference manual. Tektronix part number
071-1096-XX.
H 80E01, 80E02, 80E03, 80E04, and 80E06 Electrical Sampling Modules

User manual. Tektronix part number 071-0434-XX.
H 80C00 Series Optical Sampling Modules User manual. Tektronix part
number 071-0435-XX.
H CSA8000/TDS8000 Rackmount Kit Instructions. Tektronix part number
071-0696-XX.
H Communication Signal Analyzer and Digital Sampling Oscilloscope Service

manual. Tektronix part number 071-0438-XX.
H CSA8000 and TDS8000 Online Help. Installed with the application software
and accessed from the instrument Help menu.
H CSA8000 & TDS8000 Programmer Guide. An online document accessed
from the instrument Help menu.
H 80A01 Trigger Prescale Limiting Preamplifier Module. Tektronix part
number 071-0873-XX.
H TDR Z-Meas Application Online Help. Ships with this product on a separate
CD. Provides information about this TDR Impedance Measuring application
that implements the TDR calibration procedures specified by the
IPC TM-650 test method.
H Fast NRZ Application Online Help. Ships with this product on a separate
CD. Provides information about this application that improves throughput
for optical eye-pattern mask testing.
xx CSA8000 & TDS8000 Series Instruments and Sampling Modules

Preface
Contacting Tektronix
Phone 1-800-833-9200*
Address Tektronix, Inc.

Department or name (if known)
14200 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
Web site www.tektronix.com
Sales support 1-800-833-9200, select option 1*
Service support 1-800-833-9200, select option 2*
Technical support Email: techsupport@tektronix.com

1-800-833-9200, select option 3*
6:00 a.m. - 5:00 p.m. Pacific time
* This phone number is toll free in North America. After office hours, please leave a
voice mail message.
Outside North America, contact a Tektronix sales office or distributor; see the
Tektronix web site for a list of offices.
CSA8000 & TDS8000 Series Instruments and Sampling Modules xxi

Preface
xxii CSA8000 & TDS8000 Series Instruments and Sampling Modules

All specifications apply to the instrument and sampling modules. unless noted
otherwise. To meet specifications, three conditions must first be met:
H The instrument must have been calibrated/adjusted at an ambient tempera-

ture between +10 _C and +40 _C.
H The instrument must have been operating continuously for 20 minutes within
the operating temperature range specified.
H The instrument must be in an environment with temperature, altitude,
humidity, and vibration with the operating limits described in these
specifications.
NOTE. “Sampling Interface” refers to both the small module compartments and
the large module compartments, unless otherwise specified.
Table 1- 1: System - Signal acquisition

Description Characteristics
Number of input 8 acquisition channels, maximum
channels
Number of small 4 compartments, for a total of 8 channels1
sampling module
compartments
Number of large 2 compartments, for a total of 2 channels
sampling module
compartments
Small Sampling Tekprobe-Sampling Level 3. Hot switching is not permitted on this
Module Interface interface.
Large Sampling Tekprobe-Sampling Level 3. Hot switching is not permitted on this
Module Interface interface.
1 Total channels ≤ 8.
CSA8000 & TDS8000 Series Instruments and Sampling Modules 1- 1

Table 1- 2: System - Timebase

Sampling rate DC-200 kHz maximum, dictated by trigger rate and actual holdoff
setting. If trigger rate is less than the maximum, or the requested
holdoff exceeds the minimum, the trigger rate and/or holdoff will dictate
the sampling rate.
Record length1 20, 50, 100, 250, 500, 1000, 2000 and 4000 samples.
Horizontal scale 1 ps/div to 5 ms/div in 1, 2, 5 steps or 1 ps increments. Maximum

g
range record lengths apply at certain ranges (per table, below).
Scale set to an integer multiple of: Maximum record length
1 ps/div 1000
2 ps/div 2000
4 ps/div 4000
Horizontal position 50 ms maximum.
range
Horizontal resolution 10 fs minimum
Horizontal position 8000 instrument: 1 ps minimum
setting resolution 8000B instrument: 0.1 ps minimum
Horizontal modes2 Two modes, Short Term Optimized and Locked to 10 MHz Reference.
The 10 MHz reference may be internal or external.
n Time interval ac- Strobe placement accuracy for a given horizontal interval and position
curacy, short term on same strobe line per table below. (Contribution from 80E04
optimized
p mode sampling module is included in specification.)
Range Time Interval Accuracy
≤ 20 ps/div 1 ps + 1% of interval
≥ 21 ps/div 8 ps + 0.1% of interval
n Time interval ac- Strobe placement accuracy for a given horizontal interval and position
curacy, locked to in- on same strobe line per table below. Contribution from 80E04 sampling
ternal 100 MHz refer- module is included in specification.
ence mode2 Range Time Interval Accuracy
≤ 20 ps/div 1 ps + 1% of interval
≥ 21 ps/div 8 ps + 0.01% of interval
Horizontal deskew - 500 ps to +100 ns on any individual channel in 1 ps increments.
range and resolution
1 The total number of samples contained in a single acquired waveform record
(memory length in IEEE 1057, 2.2.1).
2 80E02 sampling module is included in this specification.
1- 2 CSA8000 & TDS8000 Series Instruments and Sampling Modules

Table 1- 3: System - Trigger

Trigger sources External Direct Edge Trigger, External Prescaled Trigger, Internal Clock
Trigger, and Clock Recovery (with appropriately equipped optical
modules)
Auto/normal mode Normal mode: wait for trigger
Auto mode: Trigger automatically generated after 100 ms time-out
Slope + or - select Edge + mode: Triggers on positive-slewing edge
Edge - mode: Triggers on negative-slewing edge
High frequency on/off High Frequency ON mode: Removes trigger hysteresis and improves
select sensitivity. Should be used when trigger slew rate exceeds 1 V/ns.
High Frequency OFF mode: Retains trigger hysteresis and improves
noise rejection at low slew rates.
Metastability Reject Metastability Reject On mode: Upon detection of trigger and holdoff
On/Off select collision, time base will reject the sampled point.
Metastability Reject Off mode: Allows metastable points caused by
trigger/holdoff collisions to display.
Gated Trigger ±5 V maximum.
See the Gated Trigger Input descriptions, beginning on page 1-- 7.
Variable trigger hold Adjustable 5 s to 50 ms in 0.5 ns increments. When External
off range and resolu- Prescaled Trigger mode is used, holdoff period applies to the Prescaled
tion circuit output.
External direct trigger Direct edge triggering on signal applied to dedicated front panel
capabilities and connector with Holdoff, Level Adjust, Auto/Normal, High Frequency
conditions On/Off, and Enhanced Triggering On/Off controls.
External direct trigger specifications apply only under the condition that
no other trigger signal is applied to respective connectors.
Short term optimized mode and locked to internal 10 MHz reference
specifications only apply under the condition that there is no external
10 MHz reference applied to the front panel connector.
External direct trigger 50 Ω input resistance, DC coupled only
input characteristics1
External direct trigger ±1.5 V (DC + peak AC) maximum input voltage
input range
External direct trigger 1 Vpp
maximum operating
trigger signal2
External direct trigger Adjustable between ±1.0 V
level range
n External direct 100 mV, DC-3 GHz
trigger sensitivity3

Table 1- 3: System - Trigger (cont.)

External direct 50 mV typical, DC-4 GHz
trigger sensitivity
External direct trigger 1 mV
level resolution
n External direct 50 mV + 0.10 x level
trigger level accuracy
n External direct 8000 instrument: 1.5 ps RMS + 10 ppm of horizontal position, or better
trigger delay jitter, 8000B instrument: 1.2 ps RMS + 10 ppm of horizontal position, or
short term optimized better
mode
External direct trigger 8000 instrument: 1.0 ps RMS + 5 ppm of horizontal position, typical
delay jitter, short term 8000B instrument: 800fs RMS + 5 ppm of horizontal position, typical
optimized mode (typi-
cal)
n External direct 8000 instrument: 2.5 ps RMS + 0.10 ppm of horizontal position, or
delay jitter, locked to better
internal 10 MHz refer- 8000B instrument: 2.5 ps RMS + 0.04 ppm of horizontal position, or
ence mode better
External direct delay 8000 instrument: 1.6 ps RMS + 0.05 ppm of horizontal position, typical
jitter, locked to inter- 8000B instrument: 1.6 ps RMS + 0.01 ppm of horizontal position,
nal 10 MHz reference typical
mode (typical)
External direct trigger 167 ps, typical
minimum pulse width
External direct trigger Enhanced triggering on: Zero, typical
metastability
External direct trigger Tekprobe-SMA, Levels 1 and 2. Hot switching is permitted on this real
real time accessory time accessory interface.
interface
External prescaled Prescaled triggering on signal applied to dedicated front panel
trigger capabilities connector with Holdoff, Auto/Normal, Metastability Reject On/Off.
and conditions
External prescaled trigger specifications apply only under the condition
that no other trigger source is applied to respective connectors.
Short term optimized mode and locked to internal 10 MHz reference
specifications only apply under the condition that there is no external
10 MHz reference applied to the front panel connector.
External prescaled 50 Ω AC coupled input resistance; divide-by-eight prescaler ratio, fixed
trigger input charac- level zero volts
teristics
External prescaled ±2.5 Vpp
trigger absolute maxi-
mum input

Table 1- 3: System - Trigger (cont.)

n External pprescaled The limits are as follows:
trigger sensitivity Frequency range Sensitivity
2-3 GHz 800 mVpp
3 10 GHz
3-10 600 mVpp
External prescaled Frequency range Sensitivity
trigger sensitivity (typ-
(typ
ical) 10-12.5 GHz 1000 mVpp, typical4
n External prescaled 8000 instrument: 1.5 ps RMS + 10 ppm of horizontal position, or better
trigger delay jitter, 8000B instrument: 1.3 ps RMS + 10 ppm of horizontal position, or
Short term optimized better
mode
External prescaled 8000 instrument: 1.0 ps RMS + 5 ppm of horizontal position, typical
trigger delay jitter, 8000B instrument: 0.9 ps RMS + 5 ppm of horizontal position, typical
Short term optimized
mode (Typical)
n External prescaled 8000 instrument: 2.5 ps RMS + 0.10 ppm of horizontal position, or
delay jitter, locked to better
internal 10 MHz refer- 8000B instrument: 2.5 ps RMS + 0.04 ppm of horizontal position, or
ence mode better
External prescaled 8000 instrument: 1.6 ps RMS + 0.05 ppm of horizontal position, typical
delay jitter, locked to 8000B instrument: 1.6 ps RMS + 0.01 ppm of horizontal position,
internal 10 MHz refer- typical
ence mode (Typical)
External prescaled Enhanced Triggering: Zero, typical
trigger metastability
Internal clock trigger Rate selectable at 25, 50, 100, and 200 kHz internally and is provided
rates to the trigger, to the TDR stimulus drives in the small sampling module
interfaces, and to the Internal Clock Out connector on the front panel.
1 The input resistance at the external direct trigger input and the maximum input
voltage.
2 Maximum signal input for maintaining calibrated time base operation.
3 Section 4.10.2 in IEEE standard number 1057. The minimum signal levels required
for stable edge triggering of an acquisition.
4 The 80A01 accessory is designed to allow users to enhance performance.

Table 1- 4: CSA8000 and TDS8000 - Power consumption and cooling

Specifications Characteristics
Power requirements 8000: 275 watts (fully loaded); 160 watts (mainframe alone with no
modules)
8000B: 240 watts (fully loaded); 160 watts (mainframe alone with no
modules)
An example of a “fully loaded” mainframe for these characteristic loads
has installed optical modules, electrical modules, and active probes
comprised of 1x80C02-CR, 1x80C04-CR2, 3x80E04, 1x80A01, and
7xP6209.
There is typically a slight ±10 W deviation in the dissipation for various
line conditions ranging from 48 Hz through 400 Hz as well as operating
ambient temperature.
Source voltage and Range for the line voltage needed to power the instrument within which
frequency the instrument meets its performance requirements.
100-240 V RMS ±10%, 50/60 Hz
115 V RMS ±10%, 400 Hz
CAT II
Fuse rating Current and voltage ratings and type of the fuse used to fuse the
source line voltage.
Two sizes can be used:
(0.25 x 1.25 inch size): UL 198G & CSA C22.2, No. 59 Fast acting:
8 Amp, 250 V; Tek part number 159-0046-00, BUSSMAN part number
ABC-8, LITTLEFUSE part number 314008
(5 x 20 mm size): IEC 127, sheet 1, fast acting “F”, high breaking
capacity, 6.3 Amp, 250 V; Tek part number none, BUSSMAN part
number GDA ±6.3, LITTLEFUSE part number 21606.3
Cooling requirements Six fans with speed regulated by internal temperature sensors.
A 2” (51 mm) clearance must be maintained on the left side and right
side of the instrument, and a 0.75” (19mm) clearance must be
maintained on the bottom of the instrument for forced air flow. It should
never be operated on a bench with the feet removed, nor have any
object placed nearby where it may be drawn against the air vents.
No clearance is required on the front, back, and top.

Table 1- 5: CSA8000 and TDS8000 - Display

Display type 211.2 mm (wide) x 1.58.4 mm (high), 264 mm (10.4 inch) diagonal,
liquid crystal active matrix color display (LCD).
Display resolution 640 horizontal by 480 vertical pixels.
Pixel pitch Pixels are 0.33 mm (horizontal) and 0.22 mm (vertical)
Table 1- 6: CSA8000B and TDS8000B - Ports

Video outputs Two 15-pin D-subminiature connectors on the rear panel. Useable to
connect external monitors that provide a duplicate of the primary
display and/or a second monitor on which to view other applications.
Support at least the basic requirements of the PC99 specification.
Parallel port 25-pin D-subminature connector on the rear panel. Supports the
(IEEE 1284) following modes:
H Standard mode, output only
H Bi-directional, PS/2 compatible
H Bi-directional Enhanced Parallel Port (IEEE 1284 standard, Mode
1 or Mode 2, v1.7)
H Bi-directional high speed Extended Capabilities Port (ECP)
Serial port 9-pin D-subminature serial-port connector using NS16C550 compatible
UARTs supporting transfer speeds up to 115.2 kbits/sec.
PS/2 Keyboard and PS/2 compatible keyboard and mouse connectors.
Mouse Interface
LAN interface RJ-45 LAN connector supporting 10 base-T and 100 base-T
External audio con- External audio jacks for MIC IN and LINE OUT
nectors
USB interface One USB connector (the second USB is disabled because of internal
use)
GPIB interface Complies with IEEE 488.2
Gated Trigger Input - A TTL logic 1 enables triggers to be accepted
Logic Polarity A TTL logic 0 disables all triggering
(Option GT equipped
8000B instruments A pull-up resistor is present to hold the input high (enable triggers)
only) when no control signal is present.
Gated Trigger Input - ±5 V maximum

Maximum Non-de-
struct Input Levels
(Option GT equipped
8000B instruments
only)

Table 1- 6: CSA8000B and TDS8000B - Ports (cont.)

Gated Trigger Input - 3 trigger cycles, where each cycle is defined as (holdoff time + trigger
Enable-to-Acquire latency). For example:
Delay
(Option GT equipped With holdoff set to its minimum 5 s setting, and a 2.500 GHz clock
8000B instruments signal applied to the External Direct Trigger input (a period of 400 ps),
only) the Enable-to-Acquire delay is approximated as 3 x (5 s + 0.0004 s)
= 15.0012 s.
The Enable-to-Acquire delay is the amount of time after the Gated
Trigger has been enabled (the level goes from TTL LOW to HIGH)
when the first valid sample is retained by the system as the beginning
of the waveform record length. When the Gated Trigger is enabled and
triggers begin to occur, the system will reject the first three samples to
avoid system recovery conditions. Once the first three points have been
discarded, then the next valid trigger cycle will be the first point of the
record section.
Gated Trigger Input - The system checks the status of the gated Trigger approximately once
Maximum Disable per holdoff and re-arm cycle. If the Gated Trigger is disabled
Time immediately after this system check, it will allow nominally a maximum
(Option GT equipped time of (holdoff + trigger period) to elapsed before the checking for the
8000B instruments status of the Gated Trigger input, recognizing the disable condition, and
only) halting any further sampling of the signal.
Internal clock trigger Square wave out from 50 Ω. back termination synchronized to the TDR
out internal clock drive signal. Refer to Trigger System - Internal Clock.
Typical performance into 50 Ω termination:
- 0.20 to +0.20 V low level
+0.90 to +1.10 V high level
n DC calibration DC voltage from low impedance drive, programmable to 1 mV over
output ±1.25 V range maximum. Accuracy is 0.2 mV + 0.1% into 50 Ω.
DC calibration output, Typical Accuracy is 0.2 mV + 0.1% into 50 Ω.
typical
External 10 MHz ±5 V maximum
reference input
Table 1- 7: CSA8000 and TDS8000 - Data storage

Floppy disk drive 3.5 in floppy disk, 1.44 Mbyte, compatable with DOS 3.3 or later format
capacity for storing reference waveforms, image files, and instrument setups.
Hard disk drive 8000: 10 Gbytes
capacity 8000B: 20 Gbytes

Table 1- 8: CSA8000 and TDS8000 - Mechanical

Construction material Chassis: Aluminum alloy
Cosmetic covers: PC/ABS thermoplastic
Front panel: Aluminum alloy with PC/thermoplastic overlay
Module doors: Nickel plated stainless steel
Bottom cover: Vinyl clad sheet metal
Circuit boards: Glass-laminate.
Cabinet: Aluminum.
Weight CSA8000B and TDS8000B:
19.5 kg (43.0 lb.) (no keyboard, no mouse, no top pouch, no power
cord, and no modules or front shield installed
22.0 kg (48.5 lb.) (keyboard, mouse, top pouch, power cord, front
shield installed, and no modules installed)
CSA8000 and TDS8000:
19.73 kg (43.5 lb.) (no keyboard, no mouse, no top pouch, no power
cord, and no modules or front shield installed
22.23 kg (49.0 lb.) (keyboard, mouse, top pouch, power cord, front
shield installed, and no modules installed)
Overall dimensions Height: 343 mm (13.5 in.)
Width: 457 mm (18.0 in.)
Depth: 419 mm (16.5 in.)
The dimensions do not include feet, rack mount kit, or protruding
connectors.
Overall mass, pack- 36.3 kg (80 lb. 1 oz.)
aged product
Overall dimensions, Height: 622 mm (24.5 in.)
packaged product
Width: 711 mm (28.0 in.)
Depth: 787 mm (31.0 in.)

Table 1- 9: System - Environmental

Dynamics1 Random vibration (operating):
0.22 g rms, from 5 to 500 Hz, 10 minutes each axis, (3 axis,
30 minutes total).
Random vibration (nonoperating):
2.28 g rms, from 5 to 500 Hz, 10 minutes each axis, (3 axis,
30 minutes total).
Atmospherics1 Temperature:
Operating: +10 °C to +40 °C
Nonoperating: - 22 °C to +60 °C
Relative humidity:
Operating: 20% to 80%, with a maximum wet bulb temperature of
29 °C at or below +50 °C (upper limits derates to 25% relative humidity
at +50 °C, non-condensing)
Nonoperating (no floppy disk in floppy drive): 5% to 90%, with a
maximum wet bulb temperature of 29 °C at or below +60 °C (upper
limits derates to 20% relative humidity at +60 °C, non-condensing)
Altitude:
Operating: 3,048 m (10,000 ft.)
Nonoperating: 12,190 m (40,000 ft.)
1 Environmental specifications apply to all properly installed modules unless noted
otherwise.

Certifications
NOTE. Certifications apply to all properly installed modules unless noted otherwise.
Table 1- 10: Certifications and compliances
Category Standards or description

EC Declaration of Conformity - Meets intent of Directive 89/336/EEC for Electromagnetic Compatibility when configured with
EMC sampling head modules designed for use with this instrument as identified in this manual.
Compliance was demonstrated to the following specifications as listed in the Official Journal of the
European Union:
EN 61326 EMC requirements for Class A electrical equipment for
measurement, control and laboratory use.
IEC 61000-- 4-- 2 Electrostatic discharge immunity (Performance criterion B)1
IEC 61000-- 4-- 3 RF electromagnetic field immunity (Performance criterion A)1,2
IEC 61000-- 4-- 4 Electrical fast transient / burst immunity (Performance criterion B)1
IEC 61000-- 4-- 5 Power line surge immunity (Performance criterion B)1
IEC 61000-- 4-- 6 Conducted RF immunity (Performance criterion A)1
IEC 61000-- 4-- 11 Voltage dips and interruptions immunity (Performance criterion B)1
EN 61000-- 3-- 2 AC power line harmonic emissions
Australia / New Zealand Complies with EMC provision of Radiocommunications Act per the following standard(s):
Declaration of Conformity -
EMC AS/NZS 2064.1/2 Industrial, Scientific, and Medical Equipment: 1992
General Compliance To ensure compliance with EMC requirements, only high quality shielded cables having a reliable,
continuous outer shield (braid & foil) with full coverage, low impedance connections to shielded
connector housings at both ends should be connected to this product.
EC Declaration of Conformity - Compliance was demonstrated to the following specification as listed in the Official Journal of the
Low Voltage
g European Communities:
Low Voltage Directive 73/23/EEC, amended by 93/68/EEC
EN 61010-1/A2:1995 Safety requirements for electrical equipment for measurement
control and laboratory use.
U.S. Nationally Recognized UL3111-1 Standard for electrical measuring and test equipment.
Testing Laboratory Listing
mainframe
Canadian Certification CAN/CSA C22.2 No. 1010.1 Safety requirements for electrical equipment for measurement,
mainframe control, and laboratory use.
Installation (Overvoltage) Terminals on this product may have different installation (overvoltage) category designations. The
Category
g y Descriptions
p installation categories are:
CAT III Distribution-level mains (usually permanently connected). Equipment at this level is
typically in a fixed industrial location.
CAT II Local-level mains (wall sockets). Equipment at this level includes appliances, portable
tools, and similar products. Equipment is usually cord-connected.
CAT I Secondary (signal level) or battery operated circuits of electronic equipment.

Table 1- 10: Certifications and compliances (cont.)
Category Standards or description

Pollution Degree Descriptions A measure of the contaminates that could occur in the environment around and within a product.
Typically the internal environment inside a product is considered to be the same as the external.
Products should be used only in the environment for which they are rated.
Pollution Degree 2 Normally only dry, nonconductive pollution occurs. Occasionally a
temporary conductivity that is caused by condensation must be
expected. This location is a typical office/home environment.
Temporary condensation occurs only when the product is out of
service.
Equipment Type Test and measuring
Safety Class Class 1 (as defined in IEC 61010-1, Annex H) - grounded product
Overvoltage Category Overvoltage Category II (as defined in IEC 61010-1, Annex J)
Pollution Degree Descriptions Pollution Degree 2 (as defined in IEC 61010-1). Note: Rated for indoor use only.
1 Performance Criteria C for USB keyboard and mouse. Note that operation of the USB keyboard and mouse can be
restored by unplugging and then reconnecting the USB connector at the rear panel of the main instrument.
2 Horizontal timing susceptibility of the optical sampling modules and their internal clock recovery trigger signals usually
increase the horizontal timing jitter when external electromagnetic fields are applied. For fields up to 3 V/m, the increase
in the horizontal high-frequency RMS jitter is typically less than 3 ps RMS of jitter, added using the square-root-of-the-
sum-of-the-squares method. An example follows:
If an 80C01-CR operating in clock-recovery trigger mode exhibits 3.5 ps RMS of edge jitter, with no EMC field applied and
for an ideal jitterless input, then for applied fields up to 3 V/m the edge jitter, degradation would typically result in a total
RMS jitter of:
Jitter ≤ Ꭹ3.5ps 2 + 3ps 2 = 4.61ps

80E00 Electrical Sampling Modules Specifications
This section contains specifications for the 80E01, 80E02, 80E03, 80E04, and
80E06 Sampling Modules. All specifications are guaranteed unless noted as
“typical.” Typical specifications are provided for your convenience but are not
guaranteed. Specifications that are marked with the n symbol are checked in
Performance Verification in the service manual.
All specifications apply to all models of sampling module unless noted
otherwise. To meet specifications, three conditions must first be met:
humidity, and vibration within the operating limits described in these
specifications
NOTE. “Sampling Interface” refers to both the electrical sampling module

interface and the optical module interface, unless otherwise specified.
Table 1- 11: Electrical sampling modules - Descriptions

Sampling module Description
80E01 1 channel 50 GHz (7 ps risetime) bandwidth, 50 Ω sampling module.
80E02 2 channel 12.5 GHz (28 ps risetime) bandwidth, 50 Ω, low noise
sampling module.
80E03 2 channel 20 GHz (17.5 ps risetime) bandwidth, 50 Ω sampling
module.
80E04 2 channel 20 GHz (17.5 ps risetime) bandwidth, 50 Ω TDR/sampling
module with 35 ps single ended, common mode, and differential TDR
capability.
80E06 1 channel 70 GHz (5.0 ps risetime) bandwidth, 50 Ω sampling module.

Table 1- 12: Electrical sampling modules - Signal acquisition

Real time accessory Tekprobe-- SMA interface is provided through the electrical
interface sampling-module interface, one per vertical channel.
Channel input
p Sampling module Input connector
connector 80E02, 80E03, 80E04 Precision 3.5 mm female
connector.
80E01 Precision 2.4 mm female
connector (2.4 mm male to
2.92 mm (K) female adapter,
015-0703-xx, is supplied).
80E06 Precision 1.85 mm female
connector (V) (2.4 mm male to
2.92 mm (K) female adapter,
015-0703-xx, is supplied).
Number of input
p Sampling module Channels
channels
80E01, 80E06 1
80E02, 80E03, 80E04: 2
n Input impedance 50 Ω ±0.5 Ω
Vertical dynamic 1 Vpp (offset ±500 mV)
range
Vertical operating ±1.6 V

range1, maximum
Vertical nondestruct Sampling module Maximum input
range 2
80E01, 80E06 2.0 V (DC+peak AC)
(Maximum input
voltage) 80E02, 80E03, 80E04 3.0 V (DC+peak AC)
Vertical number of 14 bits full scale
digitized bits
Vertical sensitivity The range of available full scale input settings.
range3
10 mV to 1 V full scale
Compensation ±5_ C about temperature where compensation was performed. If
temperature range compartment is changed on the mainframe, a sampling module
extender is employed, or the length of the sampling module extender is
changed, the channel must be recompensated.
n DC voltage ±2 mV ±0.007 (assigned offset)
accuracy, single point, ±0.02 (vertical value - assigned offset)
within 5_C of
compensated
temperature
n DC vertical ±10 mV
voltage deviation from
linear least squares fit

Table 1- 12: Electrical sampling modules - Signal acquisition (cont.)

n Rise time4 Sampling module Rise time
80E01 ≤ 7 ps, typical
80E02 ≤ 28 ps
80E03 and 80E04 ≤ 17.5 ps
80E06 ≤ 5.0 ps, typical
n Analog bandwidth5 Sampling module Bandwidth
80A01 Trigger Prescale Preampli- 50 GHz
fier Module
80E02 12.5 GHz, typical
80E03 and 80E04 20 GHz, typical
80E06 65 GHz
70 GHz, typical
Stepp response
p Sampling module Aberrations, step transition6
aberrations7, typical ±3% or less over the zone 10 ns
80E02, 80E03 and 80E04
to 20 ps before step transition
+10%, - 5% or less for the first
300 ps following step transition
±3% or less over the zone
300 ps to 5 ns following step
transition
±1% or less over the zone 5 ns
to 100 ns following step transition
±0.5% after 100 ns following
step transition
80E01 ±3% or less over the zone 10 ns
to 20 ps before step transition
+12%, - 5% or less for the first
300 ps following step transition
+5.5%, - 3% or less over the zone
300 ps to 3 ns following step
transition
±1% or less over the zone 3 ns
to 100 ns following step transition
±0.5% after 100 ns following
step transition
Step response 80E06 + 5% or less for the first 300 ps
overshoot7, typical following step transition

Table 1- 12: Electrical sampling modules - Signal acquisition (cont.)

n Random noise,, Sampling module Noise
displayed 80E01 ≤ 2.3 mVRMS
1.8 mVRMS, typical
80E02 ≤ 800 mVRMS
400 VRMS, typical
80E03 and 80E04 ≤ 1.2 mVRMS
600 VRMS, typical
80E06 ≤ 2.4 mVRMS
≤ 1.8 mVRMS, typical
Offset range1 ±1.6 V
1 Vertical operating range defines the maximum range over which the offset plus peak
input signal can operate. The offset may be limited as a function of vertical
sensitivity and dynamic range, such that no signal exceeding the maximum
operating range can be displayed.
2 Vertical nondestruct range defines the maximum range over which offset plus peak
input signal can operate without irreversible damage to the instrument. Operation to
instrument specification is not guarantied outside of the vertical operating range.
3 Input Signal Ranges in IEEE std 1057, section 2.2.1.
4 IEEE std 1057, section 4.8.2, Transition Duration of Step Response. The 80E01 rise
time is calculated from the 0.35 bandwidth-risetime product. The 80E06 rise time is
calculated from the 0.35 typical bandwidth-risetime product.
5 IEEE std 1057, section 4.6, Analog Bandwidth.
6 IEEE std 1057, section 4.8.4, Overshoot and Precursors. Step transition occurs at the
point of minimum radius of the waveform curvature, after the 50% amplitude point of
the step leading edge.
7 When tested using a V-connector equipped 50-ohm, ultrafast PIN Photodetector with
greater than 50 GHz bandwidth, which is driven by an ultrafast, mode-locked impulse
laser (for example, the Calmar FPL-01).
8 Because the 2.4 mm connector of this adapter will mechanically interface with the
1.85 mm connector of the 80E06, it serves as a 1.85 mm-to-2.92 mm connector for
the 80E06 module.
Table 1- 13: Electrical sampling module (80E04) - TDR system

Number of TDR 2, one per channel
channels
TDR polarity and Positive polarity, negative polarity, and TDR off are independently
operation mode selectable for each channel.
selections

Table 1- 13: Electrical sampling module (80E04) - TDR system (cont.)

Maximum input Do not apply input voltage during TDR operation.
voltage
TDR amplitude 250 mV each polarity, typical
n TDR system ≤ 35 ps each polarity
reflected rise time1
TDR system incident 28 ps, typical
rise time
TDR step maximum 200 kHz
repetition rate
n TDR system step ±3% or less over the zone 10 ns to 20 ps before step transition
response aberrations2
+10%, - 5% or less typical for the first 400 ps following step transition
±3% or less over the zone 400 ps to 5 ns following step transition
±1% or less after 5 ns following step transition
1 IEEE std 1057, section 4.8.2, transition duration of step response.
2 IEEE std 1057, section 4.8.4, overshoot and precursors.
Table 1- 14: Electrical sampling modules - Timebase system

Sampling rate DC-200 kHz maximum.
Horizontal position ≤19 ns, no extender cable present, external direct trigger operation.
range, minimum
(deskew adjust range
between channels)
Table 1- 15: Electrical sampling modules - Power consumption

Power dissipation
p Sampling module Power dissipation
80E01 1.1 W
80E02, 80E03 1.8 W
80E04 3.2 W
80E06 2.4 W

Table 1- 16: Electrical sampling modules - Mechanical

Weight (unpackaged) 0.4 kg (13 oz.)
Overall dimensions Height: 25 mm (1.0 in)
Width: 79 mm (3.1 in)
Depth: 135 mm (5.3 in)
Does not include connectors, connector savers, connector covers, push
buttons, or lock-down hardware protruding from the front or rear panels.
Construction material Chassis: aluminum alloy
Front panel: plastic laminate
Circuit boards: glass-laminate
Cabinet: aluminum
NOTE. For Environmental specifications and Certifications, refer to Tables 1--9

and 1--10 in the System Specifications section.

80C00 Optical Sampling Modules Specifications
This section contains specifications for the 80C00 Series Optical Modules. All
specifications are guaranteed unless noted as “typical.” Typical specifications are
provided for your convenience but are not guaranteed. Except for limits noted
“typical,” specifications that are marked with the n symbol are checked in the
Performance Verification section of the service manual.
All specifications apply to all 80C00 Series Optical Modules listed in unless
noted otherwise. To meet specifications, three conditions must first be met:
H Vertical compensation must have been performed with the module installed
in the same compartment used when the compensation was performed.
Ambient temperature must be within ±2 _C of the compensation tempera-
ture.

specifications
NOTE. “Sampling Interface” refers to both the electrical sampling module

interface and the optical module interface, unless otherwise specified.

Table 1- 17: Optical modules - Descriptions

Name Characteristics
80C01 Long wavelength 1100 nm - 1650 nm. Unamplified O/E converter with
two user-selectable optical bandwidths:
12.5 GHz,
>20 GHz,
or three user-selectable reference receiver responses:
OC-12/STM-4 for 622.08 Mb/s SONET/SDH standards,
OC-48/STM-16 for 2.488 Gb/s SONET/SDH standards, and
OC-192/STM-64 for 9.953 Gb/s SONET/SDH standards.
three user-selectable optical bandwidths:
12.5 GHz
20 GHz,
30 GHz,
or one user-selectable reference receiver response:
OC-192/STM-64 for 9.953 Gb/s Sonet/SDH standards.
80C03 Broad wavelength 700 nm - 1650 nm. Amplified O/E converter with
optical bandwidth of 2.5 GHz. The 2.5 Gb/s, OC-48/STM-16, and
2.0 GHz modes all use a physical path that has OC-48/STM-16
reference receiver type response. Two other selectable reference
receiver responses:
FC1063 for the 1.0625 Gb/s fibre channel standard and
GBE for the 1.25 Gb/s gigabit ethernet standard.
80C04 Long wavelength 1100 nm - 1650 nm unamplified. Unamplified O/E
converter with two user-selectable optical bandwidths:
20 GHz,
30 GHz,
or two user-selectable reference receiver responses:
OC-192/STM-64 for 9.953 Gb/s Sonet/SDH standards
10.664 Gb/s ITU-T Recommendation G.975 standard
80C05 Long wavelength 1520 nm - 1580 nm unamplified. Three user-select-
able optical bandwidths:
20 GHz
30 GHz
40 GHz,
or one reference receiver response:
80C06 Long wavelength 1520 nm - 1580 nm. O/E converter unamplified,
55 GHz optical sampler accepts high power optical signals typical for
RZ signaling. Particularly well-suited for 40 Gb/s RZ telecom
applications, as well as general purpose optical component testing.
80C07 Broad wavelength 700 nm - 1650 nm. Amplified O/E converter with
optical bandwidth of 2.5 GHz. The OC-48 and 2.5 GHz modes all use a
physical path that has OC-48 reference receiver type response. There
are three user-selectable reference receiver responses:
OC-48/STM-16
OC-3/STM-1
OC-12/STM-4

Table 1- 17: Optical modules - Descriptions (cont.)

80C07B Broad wavelength 700 nm - 1650 nm. Amplified O/E converter with
optical bandwidth of 2.5 GHz. The OC-48, 2GBE, INFINIBAND, and
2.5 GHz modes all use a physical path that has OC-48 reference
receiver type response. There are eight user-selectable reference
receiver responses:
OC-3 / STM-1
OC-12 / STM-4
OC-48 / STM-16
ENET1250 / GBE
ENET2500 / 2GBE
INFINIBAND
FC1063 / FC
FC2125 / 2FC
80C08 Broad wavelength 700 nm-1650 nm. Amplified O/E converter with
maximum optical bandwidth (in combination with the internal electrical
sampler) of 10 GHz. There are two data rate receiver setups
selectable:
10GBASE-W for 9.95328 Gb/s
10GBASE-R for 10.3125 Gb/s
80C08B Broad wavelength 700 nm-1650 nm. Amplified O/E converter with
sampler) of 9.5 GHz. There are four user-selectable reference receiver
responses:
10GBASE-W for 9.95328 Gb/s 10 Gb/s Ethernet standard
10GBASE-R for 10.3125 Gb/s 10 Gb/s Ethernet FEC standard
10GFC for 10.51875 Gb/s 10 Gb/s FibreChannel standard
80C08C Broad wavelength 700 nm-1650 nm. Amplified O/E converter with
sampler) of >9.5 GHz. There are five user-selectable reference
receiver responses:
10GBASE-W for 9.95328 Gb/s 10 Gb/s Ethernet standard
10GBASE-R for 10.3125 Gb/s 10 Gb/s Ethernet FEC standard
10GBE FEC for 11.0957 Gb/s
10GFC for 10.51875 Gb/s 10 Gb/s FibreChannel standard
or two data filters:
G.975 FEC 10.66423 Gb/s
G.709 FEC 10.709225 Gb/s
20 GHz,
30 GHz,

Table 1- 17: Optical modules - Descriptions (cont.)

80C10 Long wavelength 1310 nm and 1550 nm. Unamplified O/E converter
with two user-selectable optical bandwidths:
30 GHz,
65 GHz,
20 GHz,
30 GHz,
or with five user-selectable reference receiver responses:
10GBase-- W for 10 Gb Ethernet 9.95338 Gb/s
10GBase-- R 10.3125
10GBE FEC 11.0957
10GFC for 10G Fibre Channel 10.51875
or two data filters:
G.975 FEC 10.66423 Gb/s
G.709 FEC 10.709225 Gb/s
Table 1- 18: Optical modules - Acquisition

Number of input 1 optical
channels
Internal fiber
diameter1
80C01, 80C02, 9 m/125 m single mode
80C04, 80C05,
80C06, 80C09,
80C10, 80C11
80C03, 80C07, 62.5 m (Corning 62.5/125 CPC6 specs) multimode (compatible with
80C07B, 80C08, single-mode fiber)
80C08B, cladding: 125 m,
80C08C buffer: 900 m
Fiber connector Rifocs UCI (universal connector interface) male connector

Table 1- 18: Optical modules - Acquisition (cont.)

Optical return loss
80C01, 80C02, >30 dB for single-mode fiber
80C04, 80C05,
80C06, 80C09,
80C10, 80C11
80C03, 80C07, >14 dB for multimode fiber
80C07B, 80C08, >24 dB for single-mode fiber
80C08B,
80C08C
Absolute maximum
nondestructive optical
input2
80C01, 80C02, 5 mW average power; 10 mW peak power at wavelength with highest
80C03, 80C04, relative responsivity.
80C07, 80C07B,
80C09, 80C11
80C05, 80C10 20 mW average power; 60 mW power at wavelength with highest
relative responsivity.
80C06 20 mW average power; 60 mW power at wavelength with highest
80C08, 80C08B, 1 mW average power; 10 mW peak power at wavelength with highest
80C08C relative responsivity.
Maximum operating
ranges11
80C01, 80C02, 0 to 10 mW displayed limits, not including offset.
80C04, 80C09
80C03, 80C07, 0 to 1 mW displayed limits, not including offset.
80C07B
80C05 0 to 30 mW displayed limits, not including offset. However, signal limit
is 10 mW average optical power, 20 mW displayed peak power at
wavelength with highest relative responsivity.
80C06 0 to 60 mW displayed limits, including offset, which may be coerced to
above 4 mW/div to ensure this is attained, and respecting that the
signal limit is 15 mW average optical power, 30 mW displayed peak
power at wavelength with highest relative responsivity.
80C08, 80C08B, 0 to 2 mW displayed limits, not including offset.
80C08C
80C10 0 to 30 mW displayed limits, not including offset.
80C11 5 mW average power; 10mW peak power at wavelength with highest
Optical input powers below non-destruct levels may exceed saturation
and compression limits of the particular plug-in.


Effective wavelength
range3, typical
80C01, 80C02, 1100 nm to 1650 nm
80C04, 80C09,
80C11
80C03, 80C07, 700 nm to 1650 nm
80C07B, 80C08,
80C08B,
80C08C
80C05, 80C06 1520 nm to 1580 nm
80C10 1550 nm: 1520 nm to 1580 nm
1310 nm: 1290 nm to 1330 nm
Calibrated
wavelengths
80C01, 80C02, 1550 nm and 1310 nm ±20 nm
80C04, 80C09,
80C10, 80C11
80C03, 80C07, 1550 nm, 1310 nm, 850 nm, and 780 nm (all ±20 nm)
80C07B, 80C08,
80C08B,
80C08C
80C05, 80C06 1550 nm ±20 nm


n Dark level To achieve these levels, perform a dark level compensation, keep the
trigger rate and vertical offset at the same settings as they were during
the compensation, and if the ambient temperature changes more than
1 °C, perform another dark level compensation.
80C01 OC-12/STM-4, OC-48/STM-16, <10 W ±2%(vertical offset)
OC-192/STM-64, 12.5 GHz
20 GHz <10 W ±4%(vertical offset)
80C02 OC-192/STM-64, 12.5 GHz <10 W ±2%(vertical offset)
20 GHz, 30 GHz <10 W ±4%(vertical offset)
80C03, 80C07, All settings <500 nW ±2%(vertical offset)
80C07B
80C04 OC-192/STM-64, 10.66 Gb/s <10 W ±2%(vertical offset)
80C05 OC-192/STM-64 <10 W ±2%(vertical offset)
20 GHz, 30 GHz, 40 GHz <30 W ±4%(vertical offset)
80C06 50 GHz <25 W ±4%(vertical offset)
80C08, 80C08B, All settings <1.0 W ±2%(vertical offset)
80C08C
80C09 OC-192/STM-64, 10.71 Gb/s <10 W ±2%(vertical offset)
80C10 65 GHz ±[25 W + 0.04 × |vertical offset|]
1550 nm
65 GHz ±[35 W + 0.04 × |vertical offset|]
1310 nm
80C11 OC-192, 10.71 Gb/s, 10.71 Gb/s, <10 W ±2%(vertical offset)
10GBASE-W, 10GBASE-R,
10GBE FEC, 10GFC


Main-instrument
display vertical scale
factors Maximum Minimum
80C01, 80C02, 1 mW per division 10 W per division
80C04, 80C09,
80C11
80C03, 80C07, 100 W per division 1 W per division
80C07B
80C05 3 mW per division 30 W per division
80C08, 80C08B, 200 W per division 2 W per division
80C08C
Full scale vertical on the display of the main instrument is 10 divisions.
Maximum full scale and minimum full scale are therefore 10 times the
values listed above. Vertical scale is adjustable in a 1-2-5 sequence.
Between those settings, the scale can be adjusted in smaller
increments.
Vertical offset range
80C01 ±8 mW offset relative to center of waveform display
(5 divisions from either top or bottom of waveform display)
80C02, 80C04, ±6 mW offset relative to center of waveform display
80C09, 80C11 (5 divisions from either top or bottom of waveform display)
80C05, 80C10 ±15 mW offset relative to center of waveform display
(5 divisions from either top or bottom of waveform display) (typical)
80C07, 80C07B ±1 mW offset relative to center of waveform display
80C08, 80C08B, ±4 mW offset relative to center of waveform display
80C08C (5 divisions from either top or bottom of waveform display)


DC vertical accuracy4,
typical Setting Accuracy
80C01, 80C03, All settings ±25 W ±2% of [(vertical value)
80C07, 80C07B, - (vertical offset)]
80C08, 80C08B,
80C08C
80C02 12.5 GHz, OC-192/STM-64 ±25 W ±2% of [(vertical value)
- (vertical offset)]
20 GHz ±25 W ±4% of [(vertical value)
80C04 10.66 Gb/s, OC-192/STM-64 ±25 W ±2% of [(vertical value)
80C05 OC-192/STM-64 ±25 W ±2% of [(vertical value)
80C06 50 GHz ±120 W ±6% of [(vertical
value) - (vertical offset)]
80C09 10.71 Gb/s, OC-192/STM-64 ±25 W ±2% of [(vertical value)
80C10 30 GHz ±25 W ±4% of [(vertical value)
39 Gb/s, OC-768/STM-256, ±25 W ±6% of [(vertical value)
43 Gb/s (G.709), FEC43.02 Gb/s - (vertical offset)]
65 GHz setting ±25 W ±8% of [(vertical value)


80C11 OC-192, 10.66Gb/s, 10.71Gb/s, ±25 uW ±2% of [(vertical
10Gbase-W, 10Gbase-R, reading) - (vertical offset)]
10GBE FEC, 10GFC
20 GHz ±25 uW ±4% of [(vertical
reading) - (vertical offset)]
30 GHz ±25 uW ±6% of [(vertical
reading) - (vertical offset)]
DC vertical difference The accuracy of the difference between two cursors in the vertical scale
accuracyy4, typical
yp of the same channel.
Setting Accuracy
80C01 12.5 GHz, OC-192/STM-64, ±2% of [difference reading]
OC-48/STM-16, OC-12/STM-4
20 GHz ±4% of [difference reading]
80C02 12.5 GHz, OC-192/STM-64 ±2% of [difference reading]
80C03, 80C07, All settings ±2% of [difference reading]
80C07B
80C04 10.66 Gb/s, OC-192/STM-64 ±2% of [difference reading]
80C05 OC-192/STM-64 ±2% of [difference reading]
80C06, 80C08, All settings ±2% of [difference reading]
80C08B,
80C08C
80C09 10.71 Gb/s, OC-192/STM-64 ±2% of [difference reading]
30 GHz ±6% of [difference reading]]
80C10 30 GHz ±4% of [difference reading]
39 Gb/s, OC-768/STM-256, ±6% of [difference reading]
43 Gb/s, FEC43.02


80C11 OC-192, 10.66 Gb/s, 10.71 Gb/s, ±2% of [difference reading]
10Gbase-W, 10Gbase-R,
10GBE FEC, 10GFC
Offset capabilities Open loop. User assigned, fixed offset value is applied to channel.
n Minimum optical
bandwidth5 Setting Bandwidth
80C01 20 GHz >20 GHz
12.5 GHz >12.5 GHz
80C02 30 GHz >28 GHz
>30 GHz, typical7
20 GHz >20 GHz
12.5 GHz >12.5 GHz
80C02-CR 30 GHz >28 GHz
>29 GHz, typical7
80C03 2.5 GHz >2.3 GHz, typical
80C04 30 GHz >28 GHz
>30 GHz, typical7
20 GHz >20 GHz
80C04-CR1, 30 GHz >28 GHz7
80C04-CR2 >29 GHz, typical7
80C05 20 GHz >20 GHz
30 GHz >30 GHz
40 GHz >40 GHz, typical
80C06 55 GHz6 >55 GHz, typical
80C07, 80C07B 2.5 GHz >2.3 GHz, typical
80C08, 80C08B, 10 GHz >9 GHz
80C08C >10 GHz, typical
80C09 30 GHz >30 GHz, typical7
20 GHz >20 GHz
80C09-CR1 30 GHz >29 GHz, typical7
80C09, 30 GHz >28 GHz7
80C09-CR1
80C10 30 GHz >30 GHz
65 GHz >65 GHz


80C11,, 20 GHz >20 GHz
80C11-CR 30 GHz >28 GHz
>30 GHz (typical)
Rise time, typical
For peak optical
signal input which
creates <2 mWpp
modulation depth.
80C01 OC-12/STM-4 750 ps ±50 ps
OC-48/STM-16 187 ps ±15 ps
OC-192/STM-64 47 ps ±10 ps
12.5 GHz <40 ps
20 GHz <25 ps
80C02 30 GHz <16 ps
20 GHz <25 ps
12.5 GHz <40 ps
OC-192/STM-64 47 ps ±10 ps
80C04 30 GHz <16 ps
20 GHz <25 ps
10.66 Gb/s 44 ps ±10 ps
OC-192/STM-64 47 ps ±10 ps
80C05 40 GHz <12 ps
30 GHz <16 ps
20 GHz <25 ps
OC-192/STM-64 47 ps ±10 ps
80C06 50 GHz <9.6 ps
80C09 30 GHz <16 ps
20 GHz <25 ps
10.71 Gb/s, OC-192/STM-64 44 ps ±10 ps
80C10 65 GHz 7.4 ps
30 GHz 16 ps
OC-768/STM-256 12 ps
G.709 43 Gb/s 11.2 ps


80C11 30 GHz <16 ps
20 GHz <25 ps
OC-192, 47 ps ±10 ps
10Gbase-W,
10Gbase-R,
10GBE FEC,
10GFC
10.66 Gb/s, 44 ps ±10 ps
10.71 Gb/s
Rise time, typical
For ppeak optical
p
signal input which
creates <200 Wpp
modulation depth. Setting Rise Time
80C03 FC1063 440 ps ±35 ps
GBE 373 ps ±30 ps
OC-48/STM-16 187 ps ±15 ps
80C07 OC-3 3.0 ns ±170 ps
OC-12 750 ps ±50 ps
OC-48 187 ps ±15 ps
80C07B OC-3 3.0 ns ±170 ps
OC-12 750 ps ±50 ps
ENET1250 373 ps ±30 ps
FC1063 440 ps ±35 ps
FC2125 220 ps ±18 ps
OC-48, 187 ps ±15 ps
ENET2500,
INFINIBAND,
2.5 GHz


Rise time, typical
For peak optical
signal input which
creates < 500 Wpp
modulation depth. Setting Rise Time
80C08 10 GHz <50 ps
10GBASE-W,
10GBASE W, 47 ps ±10 ps
10GBASE-R
80C08B 10 GHz <50 ps
10GBASE-W, 47 ps ±10 ps
10GBASE R,
10GBASE-R,
OC-192/STM-64,
OC 192/STM 64,
10GFC
80C08C 10 GHz <50 ps
10GBASE-W, 47 ps ±10 ps
10GBASE-R,
OC-192/STM-64,
10GFC,
10GBE FEC
Time domain vertical
response aberrations,
typical
For peak optical
signal input
< 5 mWp-p except for
80C03 and 80C07
which creates
200 Wpp modulation
depth. Setting Aberrations
80C01 OC-12/STM-4, <5%
OC-48/STM-16
OC-192/STM-64, <10%
12.5 GHz
20 GHz <15%
80C02 OC-192/STM-64 <10%
12.5 GHz <15%
20 GHz <20%
30 GHz <30%
80C03 All settings <5% p-p


80C04 OC-192/STM-64, 10.66 Gb/s <10%
20 GHz <20%
30 GHz <30%
80C07, 80C07B All settings <5% (typical)
80C09 OC-192/STM-64, 10.71 Gb/s <10%
20 GHz <20%
30 GHz <30%
80C11 OC-192, 10.66Gb/s, 10.71Gb/s, <10%
10Gbase-W, 10Gbase-R,
10GBE FEC, 10GFC
20 GHz <20%
30 GHz <30%
typical
For peak optical
signal input
< 10 mWp-p. Setting Aberrations
80C05 OC-192/STM-64 <5%
20 GHz, 30 GHz <10%
40 GHz <15%
80C06 50 GHz <5% (typical)
<10% (maximum)
typical
For peak optical
signal input
80C08, 80C08B, All settings <10% (typical)
80C08C


n Time domain
vertical response
aberrations, typical
For peak optical
signal input
80C10 OC-768/STM-256, <5% (maximum)
FEC43.02 Gb/s, <3% (typical)
30 GHz
65 GHz <10% (maximum)
<5% (typical)
n Vertical equivalent
optical noise
(maximum and
typical)8 Setting Noise
80C01 OC-12/STM-4, OC-48/STM-16 <12 Wrms (maximum)
OC-192/STM-64, 12.5 GHz <8 Wrms (typical)
20 GHz <25 Wrms (maximum)
<15 Wrms (typical)
80C01-CR OC-12/STM-4, OC-48/STM-16 <15 Wrms (maximum)
OC-192/STM-64, 12.5 GHz <10 Wrms (typical)
<15 Wrms (typical)
80C02 OC-192/STM-64, 12.5 GHz <10 Wrms (maximum)
<6 Wrms (typical)
<10 Wrms (typical)
30 GHz <30 Wrms7 (maximum)
<20 Wrms (typical)
80C02-CR OC-192/STM-64, 12.5 GHz <12 Wrms (maximum)
<7 Wrms (typical)
<15 Wrms (typical)
<30 Wrms (typical)
80C03, FC1063, GBE <1 Wrms (maximum)
80C03-CR <0.75 Wrms (typical)
OC-48/STM-16 <1.5 Wrms (maximum)
<1 Wrms (typical)


80C04 OC-192/STM-64, <10 Wrms (maximum)
FEC 10.66 Gb/s <6 Wrms (typical)
<10 Wrms (typical)
<20 Wrms (typical)
80C04-CR1, OC-192/STM-64 <12 Wrms (maximum)
80C04-CR2 <7 Wrms (typical)
<15 Wrms (typical)
<30 Wrms (typical)
80C05 OC-192/STM-64 <15 Wrms (maximum)
<10 Wrms (typical)
<15 Wrms (typical)
<25 Wrms (typical)
<50 Wrms (typical)
80C06 50 GHz <192 Wrms (maximum)
<150 Wrms (typical)
80C07 OC-3/STM-1, OC-12/STM-4 <1 Wrms (maximum)
<0.50 Wrms (typical)
OC-48/STM-16 <1.5 Wrms (maximum)
80C07B12 OC-3/STM-1, OC-12/STM-4, <1 Wrms (maximum)
ENET1250, FC1063 <0.50 Wrms (typical)
FC2125 <1.5 Wrms (maximum)
OC-48/STM-4, ENET2500, <1.5 Wrms (maximum)
INFINIBAND, 2.5 GHz <0.70 Wrms (typical)
80C08, 80C08B All settings <5 Wrms (maximum)
(no clock <2.5 Wrms (typical)
recovery)
80C08-CR1, All settings <5.5 Wrms (maximum)
80C08B-CR1 <3.0 Wrms (typical)
80C08B-CR2


80C08C All settings 1310 nm, <3.0 Wrms (maximum)
((no clock 1550 nm <1.7 Wrms (typical)
recovery))
850 mm <5.0 Wrms (maximum)
<3.0 Wrms (typical)
780 nm <6.0 Wrms (maximum)
<3.5 Wrms (typical)
80C08C-CR1, All settings 1310 nm, <3.5 Wrms (maximum)
80C08C-CR2 1550 nm <1.9 Wrms (typical)
80C08C-CR4
C C CR
<3.3 Wrms (typical)
<3.9 Wrms (typical)
80C09 OC-192/STM-64, <10 Wrms (maximum)
FEC 10.71 Gb/s <6 Wrms (typical)
<15 Wrms (typical)
<20 Wrms (typical)
80C09-CR1, OC-192/STM-64, <10 Wrms (maximum)
80C09-CR2 FEC 10.71 Gb/s <7 Wrms (typical)
<15 Wrms (typical)
<30 Wrms (typical)
80C10 OC-768/ 1310 nm <110 Wrms (maximum)
STM-256 <75 Wrms (typical)
43.02 Gb/s 1550 nm <60 Wrms (maximum)
FEC <40 Wrms (typical)
30 GHz 1310 nm <90 Wrms (maximum)
<55 Wrms (typical)
1550 nm <50 Wrms (maximum)
<30 Wrms (typical)
65 GHz 1310 nm <220 Wrms (maximum)
<150 Wrms (typical)
1550 nm <120 Wrms (maximum)
<85 Wrms (typical)


80C11 OC-192, 10.66Gb/s, 10.71Gb/s, <8 Wrms (maximum)
(no clock 10Gbase-W, 10Gbase-R, <5.5 Wrms (typical)
recovery)
y) 10GBE FEC, 10GFC
<10 Wrms (typical)
(Warranted at ambient <20 Wrms (typical)
temperatures below 30 _C only)
80C11-CR1, OC-192, 10.66Gb/s, 10.71Gb/s, <9 Wrms (maximum)
80C11-CR2, 10Gbase-W, 10Gbase-R, <6 Wrms (typical)
80C11-CR3,, 10GBE FEC, 10GFC
80C11-CR4
C CR
<11 Wrms (typical)
(Warranted at ambient <25 Wrms (typical)
temperatures below 30 _C only)
n OC-3/STM-1 In the 155.52 Mb/s NRZ setting, the scalar frequency response is
155 Mb/s Reference verified to fall within fourth-order Bessel-Thompson reference receiver
Receiver setting boundary limits.
frequency response7
The OC-3/STM-1 nominal scalar frequency response matches the
ITU 155.52 Reference Receiver Nominal curve with the following
tolerance:
(MHz) Lower (dB) Upper
Frequency Nominal
0.000 - 0.50 0.00 0.50
23.33 - 0.61 - 0.11 0.39
46.65 - 0.95 - 0.45 0.05
69.98 - 1.52 - 1.02 - 0.52
93.30 - 2.36 - 1.86 - 1.36
116.7 - 3.50 - 3.00 - 2.50
140.0 - 5.67 - 4.51 - 3.35
155.5 - 7.25 - 5.71 - 4.17
163.3 - 8.08 - 6.37 - 4.66
186.6 - 10.74 - 8.54 - 6.35
209.9 - 13.55 - 10.93 - 8.31
233.3 - 16.41 - 13.41 - 10.41


n OC-12/STM-4 In the 622.08 Mb/s NRZ setting, the scalar frequency response is
622 Mb/s Reference verified to fall within fourth-order Bessel-Thompson reference receiver
Receiver setting boundary limits.
frequency response7
The OC-12/STM-4 nominal scalar frequency response matches the
ITU 622.08 Reference Receiver Nominal curve with the following
tolerance:
Frequency Nominal
0.000 - 0.50 0.00 0.50
93.3 - 0.61 - 0.11 0.39
186.6 - 0.95 - 0.45 0.05
279.9 - 1.52 - 1.02 - 0.52
373.2 - 2.36 - 1.86 - 1.36
466.7 - 3.50 - 3.00 - 2.50
559.9 - 5.67 - 4.51 - 3.35
622.1 - 7.25 - 5.71 - 4.17
653.2 - 8.08 - 6.37 - 4.66
746.5 - 10.74 - 8.54 - 6.35
839.8 - 13.55 - 10.93 - 8.31
933.1 - 16.41 - 13.41 - 10.4
n OC-48/STM-16 Scalar frequency response falls within industry standard,
2.488 Gb/s Reference Bessel-Thompson reference receiver boundary limits.
Receiver setting
frequency response7 SONET OC-48/STM-16 frequency response boundary limits are
described in ITU-T G.957 Tables I.1 and I.2. For convenience, the
scalar frequency response of the output amplitude (for sinusoidal swept
optical input) has been interpreted from the Bessel-Thompson transfer
function and listed below:
Frequency Nominal
0.000 - 0.50 0.00 0.50
373.3 - 0.61 - 0.11 0.39
746.5 - 0.95 - 0.45 0.05
1119.7 - 1.52 - 1.02 - 0.52
1493.1 - 2.36 - 1.86 - 1.36
1866.3 - 3.50 - 3.00 - 2.50
2239.5 - 5.67 - 4.51 - 3.35
2488.3 - 7.25 - 5.71 - 4.17
2612.8 - 8.08 - 6.37 - 4.66
2986.0 - 10.74 - 8.54 - 6.35
3359.3 - 13.55 - 10.93 - 8.31
3732.6 - 16.41 - 13.41 - 10.41


n OC-192/STM-64 Scalar frequency response falls within industry standard,
Receiver setting
frequency response7 Tektronix manufactures and tests the 80C01, 80C02, 80C04, 80C05,
80C0810, 80C09, and 80C1110 optical modules using 10 Gb reference
receivers to have a new superior and tighter tolerance OC-192/STM-64
Reference Receiver response. ITU experts recently agreed on the
minimum performance specifications for 10 Gbit/s (STM-64/OC-192)
optical reference receivers (San Antonio ITU Study Group 15 February
2000). These specifications are used to establish system
interoperability and test conformance of optical interfaces to draft ITU-T
Recommendation G.691 which is scheduled to be completed in
April 2000 (see ITU table A.1/G.691 from the WD 16-48 document from
Study Group 15 dated February 2000).
For convenience, the scalar frequency response of the output
amplitude (for sinusoidal swept optical input) has been interpreted from
the published Bessel-Thompson transfer function and listed below:
(MHz) (dB)
Frequency Lower Nominal Upper
0.000 - 0.85 0.00 0.85
1493.2 - 0.96 - 0.11 0.74
2986.0 - 1.30 - 0.45 0.40
4478.8 - 1.87 - 1.02 0.17
5972.4 - 2.71 - 1.86 - 1.01
7465.0 - 3.86 - 3.00 - 2.16
8958.0 - 6.19 - 4.51 - 2.83
9953.28 - 7.87 - 5.71 - 3.55
10451.2 - 8.75 - 6.37 - 3.99
11944.0 - 11.53 - 8.54 - 5.56
13437.2 - 14.45 - 10.93 - 7.41
14930.4 - 17.41 - 13.41 - 9.41


n OC-768/STM-256 Bessel-- Thompson Scalar Frequency Response curve for margin
39.813 Gb/s testing and tolerance at various frequencies; based on ±1.00 DC to
Reference Receiver 0.75x(data rate) and ±5.0dB at 1.5x(data rate).
setting frequency
response7 NOTE. The table below is a discrete list of some specific values that
are commonly listed in ITU standards; curve and tolerances are
actually a continuous function.
(GHz) (dB)
0 - 1.00 0 0.50
5.97 - 1.10 - 0.10 0.40
11.94 - 1.45 - 0.45 0.05
17.92 - 2.02 - 1.02 - 0.52
23.89 - 2.86 - 1.86 - 1.36
29.86 - 4.00 - 3.00 - 2.50
35.83 - 5.96 - 4.51 - 3.33
39.81 - 7.42 - 5.71 - 4.15
41.80 - 8.20 - 6.37 - 4.62
44.79 - 9.42 - 7.42 - 5.42
47.78 - 11.22 - 8.54 - 5.87
53.75 - 14.83 - 10.93 - 7.03
59.72 - 18.41 - 13.41 - 8.41
n 10GBASE-W For convenience, the scalar frequency response of the output
Reference Receiver amplitude (for sinusoidal swept optical input) has been interpreted from
setting frequency the published Bessel-Thompson transfer function for 10.00000 Gb/s
response7 reference receivers (as specified for the 9.95328 Gb/s rate of the
10GBASE-W) and listed below:
n 10GBASE-R
Reference Receiver
setting frequency
response7
(MHz) (dB)
n 10GBE FEC Frequency Lower Nominal Upper
R f
Reference R
Receiver
i
setting frequency 0 - 0.85 0.00 0.85
response7 1500 - 0.96 - 0.11 0.74
3000 - 1.30 - 0.45 0.40
n 10GFC Reference 4500 - 1.87 - 1.02 0.17
Receiver setting 6000 - 2.71 - 1.86 - 1.01
frequency response7 7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
n 10.66 Data Filter 10000 - 7.87 - 5.71 - 3.55
setting frequency 10500 - 8.75 - 6.37 - 3.99
response7 12000 - 11.53 - 8.54 - 5.56
n 10.709 Data Filter 13500 - 14.45 - 10.93 - 7.41
setting frequency 15000 - 17.41 - 13.41 - 9.41
response7


n 10.66 Gb/s This Reference Receiver is essentially identical to that for the OC-192
Reference Receiver 9.95328 Gb/s rate with the following changes: the frequency scale for
setting frequency the tolerance curves and nominal - 3 dB breakpoints are scaled linearly
response7 by the ratio of (10.664 Gb/s)/(9.95328 Gb/s); for example: the
9.953 Gb/s reference receiver has a nominal - 3 dB response at
0.75 × 9.95328 GHz = 7.465 GHz. This 10.66 Gb reference receiver
has a nominal - 3 dB response at (10.664/9.95328) × 7.465 GHz
= 7.998 GHz.
the published Bessel-Thompson transfer function, the frequencies
scaled as described above, and then listed below:
(MHz) (dB)
0 - 0.85 0 0.85
1599.8 - 0.96 - 0.11 0.74
3199.2 - 1.30 - 0.45 0.40
4798.6 - 1.87 - 1.02 - 0.17
6398.9 - 2.71 - 1.86 - 1.01
7998.0 - 3.86 - 3.00 - 2.16
9597.7 - 6.19 - 4.51 - 2.83
10664.0 - 7.87 - 5.71 - 3.55
11197.5 - 8.75 - 6.37 - 3.99
12796.9 - 11.53 - 8.54 - 5.56
14396.7 - 14.45 - 10.93 - 7.41
15996.5 - 17.41 - 13.41 - 9.41


n 10.71 Gb/s This Reference Receiver is essentially identical to that for the OC-192
Reference Receiver 9.95328 Gb/s rate with the following changes: the frequency scale for
setting frequency the tolerance curves and nominal - 3 dB breakpoints are scaled linearly
response7 by the ratio of (10.709 Gb/s)/(9.95328 Gb/s); for example: the
9.953 Gb/s reference receiver has a nominal - 3 dB response at
0.75 × 9.95328 GHz = 7.465 GHz. This 10.71 Gb reference receiver
has a nominal - 3 dB response at (10.709/9.95328) × 7.465 GHz =
8.032 GHz.
the published Bessel-Thompson transfer function, the frequencies
scaled as described above, and then listed below:
(MHz) (dB)
0 - 0.85 0 0.85
1606.6 - 0.96 - 0.11 0.74
3212.8 - 1.30 - 0.45 0.40
4819.0 - 1.87 - 1.02 - 0.17
6426.0 - 2.71 - 1.86 - 1.01
8032.0 - 3.86 - 3.00 - 2.16
9638.4 - 6.19 - 4.51 - 2.83
10709.2 - 7.87 - 5.71 - 3.55
11245.0 - 8.75 - 6.37 - 3.99
12851.1 - 11.53 - 8.54 - 5.56
14457.7 - 14.45 - 10.93 - 7.41
16064.4 - 17.41 - 13.41 - 9.41
n FEC 43.02 Gb/s The forward error correction method defined in ITU-T standard G.709
Reference Receiver creates an additional overhead upon a standard OC-768 (STM256)
setting frequency 40 Gb/s data stream in which the data rate is effectively increased by a
response7 ratio of 255/236. Table 7-- 1 in G.709 standard lists this explicit serial
data rate on the physical layer.
(GHz) (dB)
0 - 1.00 0 0.50
6.45 - 1.10 - 0.10 0.40
12.90 - 1.45 - 0.45 0.05
19.36 - 2.02 - 1.02 - 0.52
25.81 - 2.86 - 1.86 - 1.36
32.26 - 4.00 - 3.00 - 2.50
38.71 - 5.96 - 4.51 - 3.33
43.02 - 7.42 - 5.71 - 4.15
45.17 - 8.20 - 6.37 - 4.62
48.40 - 9.42 - 7.42 - 5.42
51.63 - 11.22 - 8.54 - 5.87
58.08 - 14.83 - 10.93 - 7.03
64.53 - 18.41 - 13.41 - 8.41


n ENET2500 Scalar frequency response falls within industry standard,
(2 GBE) 2.50 Gb/s Bessel-Thompson reference receiver boundary limits.
Reference Receiver
setting frequency 2.50 Gb/s frequency response boundary limits are derived by simply
response7 scaling all frequency values by 2X as described in IEEE 802.3z section
38.6.5 (this section refers to ITU G.957 for tolerances). For
convenience, the scalar frequency response of the output amplitude
(for sinusoidal swept optical input) has been interpreted from the
Bessel-Thompson transfer function and listed below:
(MHz) (dB)
0.000 - 0.50 0.00 0.50
375 - 0.61 - 0.11 0.39
750 - 0.95 - 0.45 0.05
1125 - 1.52 - 1.02 - 0.52
1500 - 2.36 - 1.86 - 1.36
1875 - 3.50 - 3.00 - 2.50
2250 - 5.67 - 4.51 - 3.35
2500 - 7.25 - 5.71 - 4.17
2625 - 8.08 - 6.37 - 4.66
3000 - 10.74 - 8.54 - 6.35
3375 - 13.55 - 10.93 - 8.31
3750 - 16.41 - 13.41 - 10.41
n ENET1250 (GBE) Scalar frequency response falls within industry standard,
Receiver setting
frequency response7 1.250 Gb/s frequency response boundary limits are described in IEEE
802.3z section 38.6.5 (this section refers to ITU G.957 for tolerances).
the Bessel-Thompson transfer function and listed below:
(MHz) (dB)
0.000 - 0.50 0.00 0.50
187.5 - 0.61 - 0.11 0.39
375 - 0.95 - 0.45 0.05
562.5 - 1.52 - 1.02 - 0.52
750 - 2.36 - 1.86 - 1.36
937.5 - 3.50 - 3.00 - 2.50
1125 - 5.67 - 4.51 - 3.35
1250 - 7.25 - 5.71 - 4.17
1312.5 - 8.08 - 6.37 - 4.66
1500 - 10.74 - 8.54 - 6.35
1687.5 - 13.55 - 10.93 - 8.31
1875 - 16.41 - 13.41 - 10.41


n FC1063 In FC1063 setting, scalar frequency response falls within industry
(1.0625 Gb/s) standard, Bessel-- Thompson reference receiver boundary limits.
Reference Receiver
setting frequency Fiber Channel frequency response boundary limits are described in
response7 ANSI FC-- PC. For convenience, the scalar frequency response of the
output amplitude (for sinusoidal swept optical input) has been
interpreted from the published Bessel-- Thompson transfer function and
listed below:
(MHz) (dB)
0.000 - 0.50 0.00 0.50
159.5 - 0.61 - 0.11 0.39
318.9 - 0.95 - 0.45 0.05
478.4 - 1.52 - 1.02 - 0.52
637.9 - 2.36 - 1.86 - 1.36
797.4 - 3.50 - 3.00 - 2.50
956.8 - 5.67 - 4.51 - 3.35
1063 - 7.25 - 5.71 - 4.17
1116 - 8.08 - 6.37 - 4.66
1275 - 10.74 - 8.54 - 6.35
1435 - 13.55 - 10.93 - 8.31
1595 - 16.41 - 13.41 - 10.41
n FC2125 In FC2125 setting, scalar frequency response falls within industry
(2.125 Gb/s) standard, Bessel-Thompson reference receiver boundary limits.
Reference Receiver
setting frequency 2G FiberChannel frequency response boundary limits are described in
response7 ANSI FC-- PC. For convenience, the scalar frequency response of the
output amplitude (for sinusoidal swept optical input) has been
interpreted from the published Bessel-Thompson transfer function and
listed below:
(MHz) (dB)
0.000 - 0.50 0.00 0.50
318.8 - 0.61 - 0.11 0.39
637.5 - 0.95 - 0.45 0.05
956.3 - 1.52 - 1.02 - 0.52
1275 - 2.36 - 1.86 - 1.36
1594 - 3.50 - 3.00 - 2.50
1913 - 5.67 - 4.51 - 3.35
2125 - 7.25 - 5.71 - 4.17
2231 - 8.08 - 6.37 - 4.65
2550 - 10.74 - 8.54 - 6.35
2869 - 13.55 - 10.93 - 8.31
3188 - 16.41 - 13.41 - 10.41

1 Single-mode fiber (Corning SMF-28 specs).

2 The optical input powers below nondestructive levels may exceed saturation and
compression limits of the module.
3 The optical wavelengths that the product accepts and still provides a reasonable
(25% of peak optimum) wavelength conversion gain.
4 Vertical accuracy specifications are referenced to an internal optical power meter
reading for a given optical input, and limited to a temperature range within ±5 _C of
previous channel compensation and an ambient temperature within 20 _C to 35 _C.
5 Optical bandwidth is the frequency at which the responsivity of the optical to
electrical conversion process is reduced by 50% (6 dB).
6 Optical bandwidth of the 50 GHz module is defined as (0.48/risetime).
7 This specification is limited to the instrument operating in an ambient temperature
between +20 _C and +30 _C. Nominal freq response is specified for optical input
signals of modulation magnitude such that 2mWpp (200 uWpp for 80C03 and 80C07;
500 uWpp for 80C08) or less signal is applied at the sampler input.
8 The optical channel noise with no optical noise input (Dark Level).
9 Clock recovery versions reduce the power reaching the vertical channel (splitter to
clock recovery produces loss). Therefore, the non-clock recovery modules more
closely exhibit the typical noise performance.
10 The factory calibration and verification of these tolerances are performed in a stable
ambient environment of +25 _C ±2 _C. The module is specified to perform within
these tolerances over an operating temperature range of +20 _C and +30 _C.
11 Certain performance characteristics such as reference receiver and filter settings
may have more restricted power levels in order to maintain guaranteed performance.
12 The 80C07B optical noise specifications given are for the 1310 nm wavelength
setting. The noise at wavelength setting 780 nm is typically increased by a factor of
2.0. The noise at 850 nm is typically increased by a factor of 1.6. The noise at
1550 nm is typically the same as at 1310 nm.

Table 1- 19: Optical Power Meter

Optical power meter
range
80C01, 80C02, +4 dBm to - 30 dBm, typical
80C03, 80C04,
80C07, 80C07B,
80C09, 80C11
80C05, 80C06, +13 dBm to - 21 dBm, typical
80C10
80C08, 80C08B, +0 dBm to - 30 dBm, typical
80C08C
Optical power meter 5% of reading + connector uncertainty for either 780 nm (80C03
accuracy, typical 80C07, 80C07B, 80C08, 80C08B, 80C08C, 80C11), 850 nm (80C03,
80C07, 80C07B, 80C08, 80C08B, 80C08C, 80C11), 1310 nm, or
1550 nm ±20 nm, typical
Table 1- 20: Optical modules - Clock recovery options (CR, CR1, CR2, CR3, and
CR4)
Effective wavelength
range (clock recovery
path)
80C01, 80C02, 1270 nm to 1600 nm
80C04, 80C09
80C03, 80C07, 700 nm to 1650 nm
80C07B, 80C08,
80C08B, 80C08C
80C11 1270 nm to 1600 nm

CR4) (cont.)
Operating data rates5
80C01-CR 622.08 Mb/s ±1000 ppm (OC-12/STM-4)
2.48832 Gb/s ±1000 ppm (OC-48/STM-16)
80C02-CR 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
80C03-CR 1.0625 Gb/s ±1000 ppm (FC1063)
1.2500 Gb/s ±1000 ppm (GBE)
2.48832 Gb/s ±1000 ppm (OC-48/STM-16)
2.5000 Gb/s ±1000 ppm (2X GBE)
80C04-CR1 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
80C04-CR2 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
10.664 Gb/s ±1000 ppm (OC-192 FEC)
80C07-CR1 155.52 Mb/s ±1000 ppm (OC-3/STM-1)
622.08 Mb/s ±1000 ppm (OC-12/STM-4)
2488.32 Mb/s ±1000 ppm (OC-48/STM-16)
80C07B-CR1 155.52 Mb/s 1000 ppm (OC-3/STM-1)
622.08 Mb/s 1000 ppm (OC-12/STM-4)
1062.5 Mb/s ±1000 ppm (FC1063/FC)
1250 Mb/s ±1000 ppm (ENET1250/GBE)
2125 Mb/s ±1000 ppm (FC2125/2FC)
2488.32 Mb/s ±1000 ppm (OC-48/STM-16)
2500 Mb/s ±1000 ppm (ENET2500/2GBE)
2500 Mb/s ±1000 ppm (Infiniband)
2666.06 Mb/s ±1000 ppm (OC-48-- FEC)
80C08-CR1 9.95328 Gb/s ±1000 ppm (10GBASE-- W)
10.3125 Gb/s ±1000 ppm (10GBASE-- R)
80C08B-CR1 9.95328 Gb/s ±1000 ppm (10GBASE-- W)
10.3125 Gb/s ±1000 ppm (10GBASE-- R)
80C08B-CR2 10.3125 Gb/s ±1000 ppm (10GBASE-- R)
10.51875 Gb/s ±1000 ppm (10GFC)

CR4) (cont.)
80C08C-CR1 9.95328 Gb/s ±1000 ppm (10GBASE-- W)
10.3125 Gb/s ±1000 ppm (10GBASE-- R)
80C08C-CR2 10.3125 Gb/s ±1000 ppm (10GBASE-- R)
10.51875 Gb/s ±1000 ppm (10GFC)
80C08C-CR4 Continuous from 9.8 Gb/s to 12.6 Gb/s
(User must enter the bit rate into the main instrument with an accuracy
better than 1000 ppm)
Pre-defined selections at 9.95338 Gb/s, 10.3125 Gb/s,
10.51875 Gb/s, 10.66423 Gb/s, 10.709225 Gb/s, 11.0957 Gb/s
(The input bit rate must be within 1000 ppm of the selected rate)
80C09-CR1 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
10.709 Gb/s ±1000 ppm (FEC)
80C11-CR1 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
80C11-CR2 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
10.66423 Gb/s ±1000 ppm (10Gb FEC)
80C11-CR3 9.95328 Gb/s ±1000 ppm (OC-192/STM-64)
10.70922 Gb/s ±1000 ppm (G.709 FEC)
80C11-CR4 Continuous from 9.8 Gb/s to 12.6 Gb/s
(User must enter the bit rate into the main instrument with an accuracy
better than 1000 ppm)
Pre-defined selections at 9.95338 Gb/s, 10.3125 Gb/s,
10.51875 Gb/s, 10.66423 Gb/s, 10.709225 Gb/s, 11.0957 Gb/s
(The input bit rate must be within 1000 ppm of the selected rate)
For the 80C02-CR and 80C04-CR1 modules, the incoming data stream must be of
non-return-to-zero format (NRZ) and must have a data sequence content which provides
both isolated 1s and multi-consecutive mark sequences (that is 2,3,4 and so forth logical
1s in a consecutive row). NOTE: a fixed pattern of 10101010. . . does not meet the data
sequence content:. The 80C02-CR and 80C04-CR1 clock recovery functions may not
properly lock to such a pattern. The 80C02-CR and 80C04-CR1 will, however, typically lock
to a 11001100. . . pattern (this is equivalent to a 2.48832 GHz optical square wave).5
n Optical sensitivity
range, clock recovery
(optical input power)1 Maximum Minimum
80C01 + 5.0 dBm (3.16 mW), typical - 10.0 dBm (100 W), typical
80C02 +7.0 dBm (5.0 mW), typical - 10.0 dBm (100 W), typical
- 7.5 dBm, warranted
80C03 - 4.0 dBm (400 W), warranted - 16.0 dBm (25 W), warranted
80C04 +7.0 dBm (5.0 mW), typical - 10.0 dBm (100 W), typical
80C07 - 4.0 dBm (400 W), warranted - 16.0 dBm (25 W), warranted

CR4) (cont.)
80C08-CR1/CR2 +0.0 dBm (1.0 mW, all - 13.0 dBm (50 W, 1310 nm,
wavelengths), warranted 1550 nm), warranted
80C08B-CR1/
CR2 - 15.0 dBm (32 W, 1310 nm,
1550 nm), typical
- 12.0 dBm (64 W, 780 nm,
850 nm), typical
80C08C-CR4 +0.0 dBm (1.0 mW), typical 1550 nm, 1310 nm
Bit Rate: 9.8 Gb/s to 11.25 Gb/s
AOP @ (OMA)8
ER≥8.2 dB7
- 15 dBm - 12.3 dBm
typical typical
- 13 dBm - 11.3 dBm
warranted6 warranted6
1550 nm, 1310 nm
(AOP @ (OMA)8
ER≥8.2 dB)7
- 12.5 dBm - 10.8 dBm
typical typical
- 11.5 dBm - 9.8 dBm
850 nm, 780 nm
AOP @ (OMA)8
ER≥8.2 dB7
- 12 dBm - 9.3 dBm
typical typical
- 10 dBm - 8.3 dBm
850 nm, 780 nm
(AOP @ (OMA)8
ER≥8.2 dB)7
- 9.5 dBm - 7.8 dBm
typical typical
- 8.5 dBm - 6.8 dBm
80C09 +7 dBm (5.0 mW), typical - 10.0 dBm (100 W), typical

CR4) (cont.)
80C11-CR1/-CR2/ +7 dBm (5.0 mW), typical - 10.0 dBm (100 W), typical
-CR3 - 7.5 dBm, warranted6
80C11-CR4 +7 dBm (5.0 mW), typical Bit Rate: 9.8 Gb/s to 11.25 Gb/s
AOP @ (OMA)8
ER≥8.2 dB7
- 12 dBm - 10.3 dBm
typical typical
- 9 dBm - 7.3 dBm
(AOP @ (OMA)8
ER≥8.2 dB)7
- 10.5 dBm - 8.8 dBm
typical typical
- 7.5 dBm - 5.8 dBm
Clock and data
electrical output
amplitudes2
80C01 >300 mVpp, typical
80C02 Serial DATA output >700 mVpp, typical
Serial CLOCK output 1.5 Vpp, typical
1/16th CLOCK output 600 mVpp, typical
80C03 Serial DATA output >350 mVpp, typical
Serial CLOCK output >350 mVpp, typical
80C04-CR1 Serial DATA output >700 mVpp, typical
Serial CLOCK output 1.5 Vpp, typical
80C04-CR2 Serial CLOCK output 1.5 Vpp, typical
80C07,, 80C07B Serial CLOCK output 450 mVpp, typical
Serial DATA output 450 mVpp, typical
80C08 Serial CLOCK output 1.0 Vpp, typical
80C08B Serial CLOCK output 1.0 Vpp, typical

CR4) (cont.)
80C08C-CR1// Serial CLOCK output 1.0 Vpp, typical
-CR2 1/16th CLOCK output 600 mVpp, typical
80C08C-CR4 Serial CLOCK output 800 mVpp, typical
80C09 Serial CLOCK output 1.5 Vpp, typical
80C11-CR1 Serial DATA output >700 mVpp, typical
Serial CLOCK output 900 mVpp, typical
80C11-CR2// Serial CLOCK output 1.5 Vpp, typical
-CR3
80C11-CR4 Serial CLOCK output 800 mVpp, typical
Clock and data rise
time and fall times2
80C01 Serial DATA output <30 ps
Serial CLOCK output <30 ps
1/16th CLOCK output <300 ps
80C04-CR2 Serial CLOCK output <30 ps
80C07B Serial DATA output <150 ps
80C08 Serial CLOCK output <30 ps
80C08B
80C08C 1/16th CLOCK output <300 ps

CR4) (cont.)
Jitter Transfer
Bandwidth5
80C04-CR2 8 MHz maximum
5 MHz minimum
80C09-CR1 7 MHz typical
80C11-CR1
80C11-CR2
80C11-CR3
80C08B-CR1, 4 MHz maximum
80C08B-CR2 2 MHz minimum
80C08C-CR1,
80C08C-CR2
80C08C-CR4 4 MHz maximum
2 MHz minimum
1 MHz typical
80C11-CR4 4 MHz Maximum
1 MHz Minimum
2 MHz Typical
nRecovered clock
timing jitter3, 4
80C01 <8.0 ps rms maximum
<4.0 ps rms typical
<1.0 ps rms typical5
<4.0 ps rms typical
80C07 OC-3 setting <32.0 ps rms maximum
OC-12 setting <8.0 ps rms maximum

CR4) (cont.)
80C07B OC-3 setting <32.0 ps rms maximum
<12.0 ps rms typical
FC1063 (FC) setting <4.0 ps rms typical
ENET1250 (GBE) setting
FC2125 (2FC) setting <6.0 ps rms maximum
<3.0 ps rms typical
OC-48-FEC setting <2.2 ps rms typical
ENET2500 (2GBE) setting
INFINIBAND setting
80C08, 80C08B, <2.0 ps rms maximum
80C08C <1.0 ps rms typical5
1 These powers are the average optical input coupled into the external Optical
Sampling Module optical input connector. The range is defined for recovered clock,
a 50% duty cycle of the incoming NRZ data (also referred to as 50% mark density), a
PRBS pattern of 223- 1, and an extinction ratio of ≥8.2 dB (at eye center).
2 Output is 50 Ω AC coupled: specification is for output amplitude at the bulkhead
outputs and does not include RF loss of attached cables.
3 The clock jitter is applicable to both the external electrical output and the system
jitter experienced when the recovered clock is the source of the waveform trigger for
the system.
4 Jitter performance of the system while using the optical module clock recovery as
the trigger source is warranted only while no active signal is applied to the main
instrument’s External Trigger (or Prescaler) input.
5 Internal use for trigger results in a total system jitter of
≥ Ꭹsum of squares
therefore, the displayed waveform may normally exhibit :
Ꭹmainframe jitter +OCR jitter
2 2
6 Sensitivity is only warranted for operating ambient temperatures below +30 _C.
7 The AOP (Average Optical Power) range is defined for recovered clock that has a
resulting jitter that is less than the specified maximum, a 50% duty cycle of the
incoming data (also referred to as 50% mark density), a PRBS pattern of 223 - 1, and
an extinction ratio of ≥8.2 dB (at eye center).

8 The OMA (Optical Modulation Amplitude) input level is defined as (PHIGH - PLOW).
For an extinction ratio of 8.2, the OMA is 1.47 × AOP or AOP(dBm) + 1.68 dB.
9 The acceptable signal types and patterns for the specified modules are:
Module NRZ RZ 1010 . . .
80C02-CR, 80C04-CR1 Y N N
80C03-CR, 80C07-CR, 80C07B-CR1 Y N Y
80C04-CR2, 80C08-CR1, 80C08B-CR1, Y Y Y
80C08B-CR2, 80C09-CR1
Table 1- 21: Optical modules - Mechanical

Construction material Chassis parts constructed of aluminum alloy; front panel constructed of
plastic laminate; circuit boards constructed of glass-laminate. Cabinet
is aluminum.
Weight
80C01 1.13 kg (2.50 lbs)
1.34 kg (2.95 lbs) (with clock recovery)
80C02 0.95 kg (2.10 lbs)
80C03 1.13 kg (2.50 lbs)
80C04 0.95 kg (2.10 lbs)
80C05 0.95 kg (2.10 lbs)
80C06 0.95 kg (2.10 lbs)
80C07 1.13 kg (2.50 lbs)
80C07B 0.95 kg (2.10 lbs)
80C08 0.95 kg (2.10 lbs)
80C08B 0.95 kg (2.10 lbs)
80C08C 0.95 kg (2.10 lbs)
80C09 0.95 kg (2.10 lbs)
80C10 0.95 kg (2.10 lbs)

Table 1- 21: Optical modules - Mechanical (cont.)

80C11 0.95 kg (2.1 lbs)
Overall dimensions Height: 25.6 mm (1.0 in)
Width: 166.7 mm (6.5 in)
Depth: 307.7 mm (12.0 in)
Table 1- 22: Optical modules - Environmental

Temperature
p Installed and operating +10 _C to +40 _C
Reference receivers frequency +20 _C to +30 _C
response tolerances, 30 GHz
mode, and Optical power meter
accuracy
Installed and non-operating - 22 _C to +60 _C
Humidity Installed and operating 20% to 80% relative humidity with
a maximum wet bulb temperature
of 29 _CC at or below +40 _C,
C,
(upper limit derates to 45%
relative humidity at +40 _C)
non-condensing.
Reference receivers frequency +20 _C to +30 _C
response tolerances
Optical power meter accuracy +20 _C (80% RH) to +30 _C
(80% RH)
Installed and non-operating 5% to 90% relative humidity with
a maximum wet bulb temperature
of 29 _C at or below +60 _C,
(upper limit derates to 20%
relative humidity at +60 _C)
non-condensing.
Altitude: installed Operating 3,048 m (10,000 feet).
Non-operating 12,190 m (40,000 feet)



80A01 Trigger Prescale Preamplifier Module Specifications
This section contains specifications for the 80A01 Trigger Prescale Preamplifier
Module. All specifications are guaranteed unless noted as “typical.” To meet
specifications, three conditions must first be met:

ture between +20_ C and +30_ C.
H The oscilloscope must have been operating continuously for 20 minutes
within the operating temperature range specified.
specifications.
Table 1- 23: Module characteristics

Mainframe interface Tekprobe-Sampling, Level 3. Hot switching is not permitted.
Input and output Female SMA
connectors
Input power1 - 10 dBm to +5 dBm, AC coupled
Output power +10 dBm maximum saturation
Frequency range 8 GHz to 14 GHz (typical)
80A01 Enhancement ≤200 mV System Prescale Trigger Sensitivity2
to Trigger Sensitivity
Output voltage3 8-12.5 GHz, input voltage 200 mVpk-pk to 1 Vpk-pk: >800 mVpk-pk
12.5-14 GHz, input voltage 200 mVpk-pk to 1 Vpk-pk: ≥1 Vpk-pk (typical)
Input/output 50 Ω AC coupled (typical)
impedance
Input/output VSWR 2.0:1 maximum from 8-14 GHz (typical)
Power requirements 2.35 W
Maximum input volt- 1.1 Vpk-pk
age swing
Noise figure 5 dB maximum
1 See Input Voltage Swing specification for more information.
2 The minimum level of signal applied to the input of an 80A01 that has its output
connected to the Trigger Prescale input of the main instrument. A coaxial cable
Tektronix part number 015-0560-00 is recommended for the connection from the
80A01 output to the Trigger Prescale input of the instrument.
3 Amplifier functions to 14 GHz but prescale trigger is nominally limited to 12.5 GHz
for 200 mVpk-pk sensitivity.

80A01 Trigger Prescale Preamplifier Module Specifications
Table 1- 24: Environmental specifications
Specification Characteristics
Temperature Operating: +10 °C to +40 °C
Humidity Non-operating: 5% to 90% relative humidity
Operating: 20% to 80% relative humidity
Table 1- 25: Mechanical specifications

Weight 0.37 kg (13 oz.)
Overall dimensions Height: 24 mm (0.95 in)
Width: 74 mm (2.90 in)
Depth: 114 mm (4.95 in)
Does not include connectors, connector savers, connector covers, push
buttons, or lock-down hardware protruding from the front or rear panels.
Construction material Chassis: aluminum alloy
Front panel: plastic laminate
Circuit boards: glass-laminate
Cabinet: aluminum


Installation
NOTE. The information found in this section is a subset of the Installation

section found in the CSA8000B & TDS8000B User manual.
This section covers installation of the instrument, addressing the following

topics:
H Check the Environment Requirements on page 2--1
H Install the Sampling Modules on page 2--2
H Connect the Peripherals on page 2--4
H Power On the Instrument on page 2--6
H Powering Off the Instrument on page 2--7
The basic operating software is already installed on the hard disk. If reinstalla-
tion of software becomes needed, see the following topic:
H Software Installation on page 2--8
Check the Environmental Requirements

Read this section before attempting any installation procedures. This section
describes site considerations, power requirements, and ground connections for
your instrument.
Site Considerations The instrument is designed to operate on a bench or on a cart in the normal
position (on the bottom feet). For proper cooling, at least two inches (5.1 cm) of
clearance is recommended on the sides of the instrument.
You can also operate the instrument while it rests on its rear feet. Make sure that
you properly route any cables coming out of the rear of the instrument to avoid
damaging them.
CAUTION. Keep the bottom of the instrument clear of obstructions to ensure

proper cooling.
Operating Requirements Specifications in chapter 1 list the operating requirements for the instrument.
Power source and temperature, humidity, and altitude are listed.

Installation
Rackmount Requirements If this instrument is rackmounted, see the TDS8000 & CSA8000 Rackmount
Instructions for additional site considerations or operating requirements. This
document ships with the Option 1R (rackmount kit).
Install the Sampling Modules
CAUTION. Do not install or remove any sampling modules while the instrument is
powered on.
Always power the instrument down before attempting to remove or insert any
sampling module.
WARNING. Sampling modules are inherently vulnerable to static damage. Always

observe static-safe procedures and cautions as outlined in your sampling module
user manual.
Check Your Sampling The sampling modules ship with the appropriate sampling-module user manual.
Module Manual(s) Read these manuals for instructions on how to install your sampling modules.
NOTE. To find sampling module user manuals, check in the appendices of the
CSA8000B & TDS8000B User Manual. Users are instructed to insert their
sampling-module user manuals there.
NOTE. After first installing a sampling module(s) or after moving a sampling

module from one compartment to another, you should run compensation from the
Utilities menu to ensure the instrument meets its accuracy specifications. You
must run a compensation (accessed from the Utilities menu) whenever the
extender configuration is changed from that present at the last compensation. In
short, if you install or remove an 80E00 extender, run a compensation. If you
exchange a extender for one of a different length, run a compensation. For
instructions on running a compensation, see Perform the Compensation on
page 4--5.
Figure 2--1 shows compartments for both large and small sampling modules,
along with the plug-in connector for the ESD wrist strap that you must use to
install and remove these modules.

Installation
Large-module compartments (2)
Small-module compartments (4)
Connect ESD wrist strap here
Figure 2- 1: Compartments for sampling modules
Maximum Configuration You can install up to two large sampling modules and four small modules for a
maximum of 10 inputs. Of these 10 inputs, only eight inputs can be active at one
time (see Figure 2--2, top two configurations). Also, note that installing a single
large module in either compartment disables the first small-module compart-
ment. This configuration (see Figure 2--2, bottom configuration) limits the input
count to seven—one from the large, six from the small compartments.
CH 1 CH 2
Eight channels: Two large modules and
three small modules
N.A.1 N.A. CH 3 CH 4 CH 5 CH 6 CH 7 CH 8
N.A. N.A.
Eight channels: No large and four
small modules
CH 1 CH 2 CH 3 CH 4 CH 5 CH 6 CH 7 CH 8
CH 1/N.A. CH 2/N.A.
Seven channels: One large module,
installed in either compartment,
and three small modules N.A. N.A. CH 3 CH 4 CH 5 CH 6 CH 7 CH 8
1Not Available
Figure 2- 2: Maximum inputs in three configurations
Install probes, cables, and other connection accessories to your sampling

modules as appropriate for your application and sampling module. Again,
consult your sampling-module and connection-accessory manuals. Continue with
the next section after installing the sampling modules.

Installation
Connect the Peripherals

The peripheral connections are mostly the same as those you would make on a
personal computer. The connection points are shown in Figure 2--3. See
Table 2--1 on page 2--4 for additional connection information.
WARNING. Before installing peripheral accessories to connectors (mouse, keyboard,

etc.), power down the instrument. See Powering Off the Instrument on page 2--7.
Table 2- 1: Additional accessory connection information
Item Description
Monitor If you use a non-standard monitor, you may need to change the the
Windows-98 display settings to achieve the proper resolution for your
monitor.
Printer Connect the printer to the EPP (enhanced parallel port) connector directly. If
your printer has a DB-25 connector, use the adapter cable that came with
your printer to connect to the EPP connector.
Rackmount Refer to the CSA8000 & TDS8000 Rackmount Installation Instructions for
information on installing the rackmount kit.
Other Refer to the Application release notes (readme.txt) in the C:\Program
Files\TDSCSA8000\System directory of the instrument for possible
additional accessory installation information not covered in this manual.

Installation
Description..........................Icon/Label Locations
Monitor.............
Printer......................
RS-232.................
Network.............................
PS2 mouse1,2.......................
PS2 keyboard1,2...............
.
USB................................
Audio line out.......................
Audio line in........................
Removable hard drive.....................
CD drive.........................
GPIB...........
Monitor....................
Card slot...........
Gated trigger...........
1Product ships with a USB keyboard, that plugs into the USB port, and a USB mouse that plugs into the back of the keyboard
1Note: Some instruments ship with the keyboard and mouse ports reversed .
Figure 2- 3: Locations of peripheral connectors on rear panel

Installation
Power On the Instrument

Follow these steps to power on the instrument for the first time.
1. Check that the line fuses are correct for your application. Both fuses must be
the same rating and type. Fuse types require a unique cap and fuseholder. See
Table 2--2 and Figure 2--4.
Table 2- 2: Line fuses
Cap & fuseholder

Fuse type Rating Fuse part number part number
0.25 x 1.250 inch 8 A, fast blow, 250 V 159-0046-00 200-2264-00
5 x 20 mm 6.3 A, fast blow, 250 V 159-0381-00 200-2265-00
Power switch Fuses AC power
Figure 2- 4: Line fuse and power cord connector locations, rear panel
CAUTION. Connect the keyboard, mouse, and other accessories before applying
power to the product. Connecting the accessories after powering on the
instrument can damage the accessories. Two exceptions are the USB keyboard
and mouse that ships with the instrument. Both can be plugged or unplugged
without first turning power off.
2. Connect the keyboard and mouse, observing the caution above. Note that the
instrument ships with a USB keyboard, which plugs into the USB port (see
Figure 2--3 on page 2--5 for location) and a USB mouse, which plugs into
the back of the USB keyboard.
NOTE. Connection of the keyboard and mouse is optional. You can operate most
features without them, using the front-panel controls and the touchscreen.
3. Connect the power cord.

4. If you have an external monitor, connect the power cord and power on the
monitor.

Installation
5. Turn the Power switch on at the rear panel. (See Figure 2--4 on page 2--6 for
switch location.)
6. Push the On/Standby switch to power on the instrument (see Figure 2--5 for
the switch location).
Switch
Figure 2- 5: On/Standby switch location
7. Wait for the boot routine and low-level self test to complete.
8. Follow any instructions on the screen.

The internal setup software will automatically configure your instrument and
install all required devices, depending on the installed accessories.
Powering Off the Instrument

The instrument has a built-in soft power-down function that safely powers down
the instrument when you push the On/Standby button. You do not need to close
the UI application or Windows 98 before using the On/Standby button.
To completely remove power to the instrument, first soft power-down the
instrument using the On/Standby button, and then set the power switch on the
rear panel to off.
You can restore the UI application to the screen by clicking its button in the
Windows Task bar.

Installation
Software Installation
This section describes how to install the system software found on the 8000
Series OS Rebuild CDs that accompany this product. The instrument ships with
the product software installed, so only perform these procedures if reinstallation
becomes necessary.
Description The product software comprises two parts:

H Window 98. Windows 98 comes preinstalled on the instrument. Windows 98
is the operating system on which the user-interface application of this
product runs. The System Rebuild CD, which can be used to rebuild the
instrument hard drive, includes the Window 98 operating system installation.
If you need to reinstall Windows 98, you may be able to do so without
rebuilding the instrument hard drive. See Operating System Reinstallation on
page 2--8 for more information.
H User Interface (UI) Application. The UI application complements the

hardware controls of the front panel, allowing complete set up of all
instrument features. The System Rebuild CD includes the UI application
installation as part of a complete hard drive rebuild.
Software Release Notes Read the software release notes README.TXT ASCII file if present on the
System Rebuild CD before performing any installation procedures. This file
contains additional installation and operation information that supercedes other
product documentation.
To view the README.TXT file, open the Notepad Windows accessory and open
the file on the System Rebuild CD. After installation, you can also read the copy
from a directory on the product:
C:\Programs Files\TDSCSA8000\System
Operating System Use the following procedure if reinstalling Windows 98 becomes necessary.
Reinstallation
NOTE. Only do the reinstall if Windows 98 is missing or corrupted.
There are two possibilities for reinstall:

H The instrument can reboot from the hard drive; if so, reinstall windows using
the emergency startup disk and the procedure Windows 98 Reinstall Only on
page 2--9.
H The instrument cannot reboot from the hard drive or you do not have an
emergency startup disk available. In either case, you must rebuild your hard

Installation
drive using the procedure System Hard Drive Rebuild on page 2--9. Any
files or programs you have installed will be lost.
Windows 98 Reinstall Only. If you can reboot from the instrument hard drive and
you have your emergency startup disk, you can reinstall Windows 98 from the
hard drive. This procedure is preferred over rebuilding the hard drive, since the
rebuild rewrites the entire hard drive.
1. Power off the instrument. Use the On/Standby switch if possible; if not, use
the principle power switch found at the back of the instrument.
2. If a keyboard is not connected to the instrument, connect it.
3. Insert your emergency startup disk in the instrument floppy drive.
4. Power on the instrument. Make sure the principle power switch at the back
of the instrument is set on. Push the On/Standby switch on the front panel.
5. The instrument should now boot from the emergency startup disk and
present you with a selection menu. Use the arrow and enter keys to choose
Start the computer without CDROM support.
6. At the a:\ prompt, type c:. Then type cd windows\options\cabs.
7. Type setup. Follow the instructions on screen.
NOTE. At the a:\ prompt, you can type help at anytime to read a file that may be
helpful in getting the Windows 98 operating system up and running.
System Hard Drive Rebuild. If you cannot reboot from the instrument hard drive,
you must rebuild the instrument hard drive. This process will return the hard disk
to the its original condition present when the instrument shipped.
Since data and programs you may have installed are lost with this rebuild, you
should do the Windows 98 Reinstall Only procedure instead if you can. (See
Windows 98 Reinstall Only on page 2--9.)
If you must rebuild the system hard drive, use the System Rebuild CD that
shipped with the instrument. Follow the instructions in the booklet found in the
CD case.
System Diagnostics In case of instrument problems, you may wish to run the system diagnostics. If
so, see the procedure Perform the Diagnostics, on page 4--3.

Installation
Windows Safe Mode If the instrument is turned off before the operating system boots, or if you’ve
installed a third-party product with a driver incompatible with instrument start
up, Windows 98 will open in Safe mode. The touchscreen will be inoperable;
therefore, you must install the standard-accessory mouse and keyboard to operate
the instrument.
When you have finished investigating and removed any barrier to Windows
start-up, you can reboot. If the instrument no longer boots to Safe mode, you can
remove the keyboard and mouse if desired.

Operating Instructions
Before doing service, read the following operating instructions. These instruc-
tions are at the level appropriate for servicing these instrument, and assume you
are familiar with Microsoft Windows-based products.
NOTE. These are not comprehensive operating instructions; consult the documen-
tation map that follows to find other sources of operating instructions.
Additional instructions are integrated into the service procedures found in later
sections of this manual. For instance, the procedures found in the section
Performance Verification contain instructions for making the front-panel settings
required to check each instrument characteristic included there. Also, the general
instructions for operating these instrument’s internal diagnostic routines are
found in Chapter 6, Maintenance. You may also find the Product Description in
Chapter 1 useful for understanding how the instrument functions.
NOTE. Instructions for powering on and off of this instrument and installing its
software are found in the section Installation, which precedes this section.
CSA8000 & TDS8000 Series Instruments and Sampling Modules 2-- 11

Documentation Map
The instrument ships with documents individually tailored to address different
aspects or parts of the product features and interface. These documents may be of
use for some service tasks; the table below cross references each document to the
instrument features and interfaces it supports. See Related Documentation, on
page xx, for part numbers of printed documents.
To read about... Refer to these documents: Description
Installation, Specification, & Operation Main User Manual Read the Reference for a quick overview of
(overviews) Quick Reference Manual instrument features and their usage.
Read the User Manual for general information
about your instrument — procedures on how to
put it into service, specifications of its perfor-
mance, maps of its user interface controls,
overviews and background on its features.
For more detailed usage information, see Online
Help System, below.
All about the Sampling Modules Electrical Sampling, Optical Read these manuals for complete information
Sampling, or Other Module1 about the sampling modules you purchased —
User Manual how to install them in the instrument, how to use
them, and how to protect them from ESD.
Depending on the modules ordered, one or more
of these manuals ship with this product. Insert
these manuals in back of the main user manual.
In Depth Operation and UI Help Online Help System Access online help from the instrument for
context-sensitive information on virtually all
controls and elements on screen.
Online help includes a setup guide of proce-
dures for applying all instrument functions. See
How to Use Online Help on page 2--18.
GPIB Commands Online Programmers Guide Access this online guide from the instrument
from its Help menu. Quickly find the syntax for
<Space> <NR3 any command, and copy the command if
> desired. Read about communication, error
? handling, and other information on GPIB usage.
2-- 12 CSA8000 & TDS8000 Series Instruments and Sampling Modules

To read about... Refer to these documents: Description
Analysis and Connectivity Tools Oscilloscope Analysis and These documents help you use various
(8000B only) Connectivity Made Easy connectivity and analysis tools that you can
install. See Analysis and Connectivity Support in
TekVISA Programming the instrument online help (described above) for
VXIplug&play Driver Help more information. Note that earlier instrument
models (TDS8000 and CSA8000) do not ship
TekVISA Excel Toolbar Help with these tools.
TDR Z-Meas Application Online Help
Fast NRZ Application Online Help
1 Modules other than sampling modules, such as the 80A01 Trigger Prescale Preamplifier Module User Manual, also have
individual user manuals that insert in the main user manual.

User Interface Map - Complete Control and Display

Menu Bar: Access to data I/O, Status Bar. Trigger status
printing, online help system, and waveform count
and set-up functions
Tool Bar: Handy access to
key features, including the
setup dialogs, acquisition
modes, triggering modes,
and online help
Readout Bar. Toggle
Measurements Bar: Quick
individual readouts on
access to the automated
and off by clicking its
measurements by category;
button
click measurement buttons to
measure the selected A Readout. Right click
waveform any readout to display a
Display: Live, reference, and short-cut menu providing
math waveforms display handy access to
here, along with cursors, often-used setup controls
masks, etc. to analyze them and properties for the
feature associated with
Waveform Bar: Access the readout
to waveform selection
Readouts: Display up
(click), waveform position
to five readouts in this
(drag), and waveform
area, selectable from
properties (right-click)
the Readout Bar
Controls Bar: Quick access
to waveforms and timebases
for display, and to their scale,
offset, and position controls
for adjustment

Front Panel Map - Quick Access to Most Often Used Features

Turn knob to adjust most control fields in setup dialogs.
Press the Select button to switch among fields. Press the Fine
button to toggle between normal and fine adjustment.
Press to start and stop acquisition or clear all
channel waveforms at once.
Press a Menu button to quickly access the setup dialog

for its control group for more detailed set up.
Press to display measurement cursors and set the knob

and Fine (adjust) and Select buttons to control them.
Press to quickly return to instrument-default

control settings.
Press to automatically set up the instrument

controls based on selected channels.
Press to access print dialog for printing the display.
Press to display the cluster of Setup Dialogs for comprehensive

set up of the instrument.
Press to toggle the touch screen on and off. Use the touch
screen to control UI when you haven’t installed a mouse.
Select a waveform type, Channel, Reference, or Math, to display

or adjust on screen (selected button lights).
Press to display and select a waveform not yet displayed;

press to select among displayed waveforms;
press again to turn a selected waveform off.
Button lights indicate displayed and selected waveforms.
Press to display and select a time base view not

selected, or to select among displayed views;
press selected timebase again to toggle it off
(except Main which is always on).
Turn knobs to vertically scale, position,

and offset selected waveform.
Turn knobs to Horizontally scale, position,

and set record length of selected waveform.
Use controls to set trigger level and

lights to monitor trigger state.

Display Map - Single Graticule View

Drag cursors to measure
waveforms on screen.
Drag the Horizontal Reference to move

the point around which horizontal
scaling expands and contracts the
waveforms.
Drag the Waveform Icon

vertically to position waveform.
Right click on a waveform or its

icon for handy access to often
used setup controls and
properties.
Drag ground reference icon to add

offset to a waveform.
Drag across the waveform area to
zoom the boxed waveform segment
to full screen width.
Front Panel I/O Map
Floppy disk drive accessible

from Windows 98
Compartments for large

modules, up to two
INTERNAL CLOCK OUTPUT
channels
DC CALIBRATION OUTPUT
Compartments for small
modules, up to eight EXTERNAL 10 MHZ REFERENCE INPUT
channels
ANTISTATIC CONNECTION for
wrist strap, 1 MΩ to ground TRIGGER TRIGGER TRIGGER
PRESCALE DIRECT PROBE
input input POWER

Rear Panel I/O Map
Removable hard disk drive to provide

individual environment for each user or to
secure data, press to release
CDROM drive accessible from

Windows 98, press to open
USB connector for mouse or

keyboard and mouse
PS-2 connectors for mouse and
keyboard
Upper SVGA port to connect a second

monitor for side-by-side display
Lower VGA port to connect a
monitor for oscilloscope display
Parallel port (Centronics) to

connect printer or other device
GPIB port to connect to controller
RJ-45 connector to connect to network
COM1 serial port
Card Bus slots for two PCMCIA type-1

cards, two type-2 cards, or one type-3 card
TRIGGER GATE (TTL)

How to Use Online Help

A major part of documentation for the instrument you are servicing is the online
help system. If your instrument is running, you may be able to use online help to
quickly get operating information. To access, use the procedure steps that follow:
Overview To use the online help Control elements & resources
Prerequisites 1. The instrument must be powered up and running.
H See Installation, page 2--1.
For a brief 2. Move your mouse pointer and let it rest over a control;
description of that is, a menu name, a menu item, tool-bar button,
controls tool-bar readout, etc.
When you perform this step, the help system pops up a
short definition or a label of the control. See right.
For a more 3. Click the What’s This? button in the main display or in a
robust dialog box. The button varies in form as shown at right.
description After clicking, the mouse pointer changes to the following
icon:
4. Now click the control you want described. A bubble pops

up describing the control. See below.
What’s This? button for main display
What’s This? button for dialog boxes

Overview To use the online help (Cont.) Control elements & resources
For in depth, 5. Most dialog boxes, whether setup or other types, have a
contextual Help button as shown right. Click the button to open the
overviews help system with an overview of the dialog box that’s
currently displayed. See below.
Click or touch here

To dig deeper 6. You can search for in depth help using methods with
which most users of PCs are familiar: from the
application menu bar, select Help, and then select
Contents & Index. See right.
7. From the online help finder (see below), choose from the
three tabs.
8. Click the book icons to expose topic titles, and then

click a topic to highlight it. Click the Display button to
open the topic in a help window.

For instruction 9. You can display step-by-step setup instructions for

procedures setups you want to make: From the application menu bar,
select Help, and then select Setup Guide. See right.
10. Select a procedure from the list that displays. The
procedure will display in a help window that is sized and
located to minimize interference with the controls needed
to perform it. See below.

To enable full- 11. If you cannot find the information in the Contents or Index
text search tabs of the online finder, you may want to enable full text
search: From the application menu bar, select Help, and
then select Contents & Index. See right.
12. From the online help finder (see below), choose the
Find tab.
13. Choose the method for word list generation and

select next or finish. Once the word list generation
finishes, future accesses of the find tab will
.
immediately access a pane for searching with full
text search without requiring the word to be
regenerated.

To Access Oper- 14. Click the minimize button to reduce the User Interface Click to Minimize to the toolbar
ating System Application to an icon on the operating system toolbar.
Help See upper right.
15. Click the Start button to pop up the Start menu, and
then select Help from the menu. See lower right. The
online help for the Windows operating system
displays.
16. When your done with the online help, you can dismiss
it. To restore the user interface application to the
screen, click its icon in the tool bar.
Tip. To switch between online help and the applica-
tion, you can hold down the ALT key while you press
Tab repeatedly to alternate between bringing help to
the front and the application.
Click for
Windows 98
Help
End of Procedure

80E00 Electrical Sampling Module Operation
tation map on page 2-- 12 to find other sources of operating instructions.
Each sampling module contains two identical input channels (80E01 and 80E06
each have one channel). This section describes channel controls, connectors, and
indicators. Figure 2--6 shows the front panel of the sampling module and
identifies the buttons, lights, and connectors.
CAUTION. To prevent damage to your sampling module or instrument, do not

apply a voltage outside the Maximum Input Voltage (see page 1-- 14) for your
sampling module.
To prevent electrostatic damage to the instrument and sampling modules, follow
the precautions described in this manual and the manuals accompanying your
instrument.
Always use a wrist strap (provided with your instrument) when handling
sampling modules or making signal connections.
The input circuitry in your sampling module is very susceptible to damage from
overdrive signals and electrostatic discharge. Never apply a DC or peak voltage
greater than the Maximum Input Voltage (see page 1--14) of your sampling
module. Only operate the instrument and sampling module in a static-controlled
environment.
Channel indicator
SELECT channel button light (yellow)
TEKPROBE connector
TDR on indicator (80E04)
Hold-down screw
Signal connector
Left channel Right channel
Figure 2-- 6: Sampling module, 80E04 shown
Signal Connector The input signal connectors for each channel let you connect signals that you
want to sample. To acquire a signal, connect the signal to the sampling module
through the Signal Connector input.

Connector Care. Never attach a cable to a sampling-module connector if the cable

has a worn or damaged connector because you may damage the sampling-module
connector. Use extra care when attaching or removing a cable from the connec-
tors. Turn only the nut, not the cable. When attaching a cable to a sampling-mod-
ule connector, align the connectors carefully before turning the nut. Use light
finger pressure to make this initial connection. Then tighten the nut lightly with a
torque wrench.
For more information see Connector and Adapter Care Requirements in the
80E00 Electrical Sampling Modules User Manual.
If the sampling-module connectors will receive heavy use, such as in a produc-
tion environment, you should install adapters (such as a Tektronix part number
015-0549-xx for 3.5 mm connectors) on the sampling module to make connec-
tions to the device under test.
Channel Selection Each channel has a SELECT channel button and a yellow channel light. The
button operates as follows:
H If the yellow channel light is on, the channel is acquiring a waveform.
H If you press the button and the channel is not currently being acquired (for
any channel or math waveform), then the instrument activates (turns on) the
channel.
H If you press the button and the channel is currently active as a channel
waveform, then the instrument selects the channel waveform.
H If the channel waveform is already selected when you press the channel
button, the instrument turns the channel off.
TEKPROBE Connector The TEKPROBE connector provides support for accessories requiring
TEKPROBE SMA support at levels 1 and 2. The connector provides power and
control to attached accessories, by the main instrument.
TDR On Indicator On modules with TDR capability, the red TDR ON light indicates whether the
step generator is sending out a step through the signal connector. The main
instrument turns this on or off.

80C00 Optical Sampling Module Operation

These are not comprehensive operating instructions; consult the documentation
map on page 2--12 to find other sources of operating instructions.
Proper operation of the sampling modules requires that the appropriate TDS8000
and CSA8000 application software is installed on the main instrument. The
versions according to the specific module are shown in the following table. To
display the version installed, select About TDS/CSA8000 from the Help menu of
the main instrument.
Table 2-- 3: Application software version required
TDS/CSA8000 application
Modules software version
80C01, 80C01-CR,
80C01 80C01-CR 1 0 0 or greater
1.0.0
80C02 80C02-CR,
80C02, 80C02 CR
80C03 80C03-CR
80C03, 80C03 CR
80C04 80C04-CR1
80C04, 80C04 CR1 11.1.0
1 0 or greater
80C04-CR2, 1.2.0 or greater
80C05
80C05,
80C06
80C07, 80C07-CR1, 1.3.0 or greater
80C08, 80C08-CR1,
80C09, 80C09-CR1
80C08B, 80C08B-CR1, 80C08B-CR2, 1.4.0 or greater
80C10
80C11, 80C11-CR1, 80C11-CR2, 80C11-CR3, 80C11-CR4, 1.5.0 or greater
80C08C, 80C08C-CR1, 80C08C-CR2, 80C08C-CR4,
80C07B, 80C07B-CR1
CAUTION. To avoid damaging your optical sampling module, handle your optical
sampling module carefully at all times and take the following precautions:
Do not drop your sampling optical since damage and misalignment of the
photodiode optical assembly can result. Store the sampling optical in a secure
location when not in use.
Replace the protective cap on the input connector when the sampling optical is
not in use.
To prevent loss of optical power or damage to the optical connectors, keep the
connectors clean at all times. Also insure that all connectors and jumpers
attached to the inputs are clean prior to insertion.

Attenuating Optical To keep the optical input power to an appropriate level, it may be necessary to
Signals attenuate the optical signal.
CAUTION. To avoid damaging the optical input of the sampling optical, to

maintain the levels within performance range, and to avoid clipping, attenuate
optical signals to less than 5 mW average power or 10 mW peak power at the
wavelength with highest relative responsivity.
80C03 modules can have deteriorated response for signals larger than 200 Wpp,
and the vertical response will eventually saturate for levels approaching 1 mW.
The optical sampling module front panel is shown in Figure 2--7.
Channel Selection Each channel has a SELECT channel button and a yellow channel light. The
button operates as follows:
H If the yellow channel light is on, the channel is acquiring a waveform.
H If you press the button and the channel is not currently being acquired (for
any channel or math waveform), then the instrument activates (turns on) the
channel.
H If you press the button and the channel is currently active as a channel
waveform, then the instrument selects the channel waveform.
H If the channel waveform is already selected when you press the channel
button, the instrument turns the channel off.
Hold-down Channel indicator Clock recovery outputs

screws (2) light (yellow) (optional)
UCI optical SELECT

input connector channel button
Figure 2-- 7: Sampling module, 80C01-CR shown
Optical Input Connector The optical input connector uses a universal connector interface (UCI) that
allows use of many standard fiber-optic female connector styles. Some of the

standard UCI interfaces supported are FC, ST, SC, and DIN. (Refer to a current
Tektronix catalog for details.)
Clock Recovery Outputs Optional clock and data-recovery circuitry provides clock and data outputs; the
recovered clock is also internally routed to the main-instrument trigger circuit.
The circuitry also provides front-panel outputs: normal and complemented clock,
and normal and complemented data (80C02 has data, clock, and 1/16 clock
outputs). Use 50 Ω terminations, provided with your optical sampling module, on
unused outputs.
You can disable the internal recovered clock from being used as the main
instrument trigger by selecting external or internal clock triggering; select the
recovered clock rate without actually selecting recovered clock as the trigger
source in order to activate the front-panel clock recovery signals.
Hold-Down Screws Hold-down screws secure the sampling optical module to the main instrument.
Once the hold-down screws are loosened, use the eject levers to remove the
sampling optical module from a powered-down main instrument. Indicators on
the hold-down screws point in the direction that the latch is pointing.
80A01 Trigger Prescale Preamplifier Module Operation
tation map on page 2-- 12 to find other sources of operating instructions.
This module is a one channel preamplifier module that can be installed in a small
module compartment of a CSA8000 or TDS8000 Digital Sampling Oscilloscope.
The 80A01 is designed to increase the sensitivity of the prescale trigger input of
these oscilloscopes to ≤200 mVpk-pk.
CAUTION. To prevent damage to your module or instrument, do not apply a

signal outside the Maximum Input Voltage Swing for your module.
To prevent electrostatic damage to the instrument and sampling modules, follow
the precautions described in this manual and the manuals accompanying your
instrument.
Always use a wrist strap (provided with your instrument) when handling modules
or making signal connections.
The input circuitry in your module is very susceptible to damage from overdrive
signals and electrostatic discharge. Never apply a DC or peak voltage greater

than the Maximum Input Voltage Swing (see page 1--14) of your module. Only
operate the instrument and module in a static-controlled environment.
TRIGGER PRESCALE
LIMITING PREAMPLIFIER 8-14 GHZ
Hold-down screw OUTPUT INPUT POWER
AC COUPLED
50 Ω
1.1 V pk-pk MAX
Output connector Input connector
Figure 2-- 8: 80A01 module front panel
Signal Connector Connect a trigger signal that you need to preamplify to the input connector.
Connect the preamplified output signal from the output connector to the prescale
trigger input of the oscilloscope.
Connector Care. Refer to Connector Care on page 2--25.


Theory of Operation
This chapter describes the electrical operation of the instrument and sampling
modules. The diagrams in Chapter 9 show the interconnections of the major
circuit blocks.
Logic Conventions
The instrument contains many digital logic circuits. This manual refers to these
circuits with standard logic symbols and terms. Unless otherwise stated, all logic
functions are described using the positive-logic convention: the more positive of
the two logic levels is the high (1) state, and the more negative level is the low
(0) state. Signal states may also be described as “true” meaning their active state
or “false” meaning their nonactive state. The specific voltages that constitute a
high or low state vary among the electronic devices.
Mainframe Overview
This mainframe overview describes the basic operation of each functional circuit
block as shown in Figure 9--1 on page 9--2.
General The instrument control system is a dual Wintel/PowerPC based processor board.
The platform features VGA resolution flat-panel display, transparent touch
screen and user front-panel with direct access to commonly used scope functions.
The instrument is also equipped with a mouse pointing device to facilitate access
to more advanced scope functions
Input Signal Path A signal enters the instrument through a direct coaxial connection to the input
connector on a sampling module, or a real time probe connected to the sampling
module channel.
Acquisition System. The acquisition system conditions the input signals, samples
them, converts them to digital signals, and controls the acquisition process under
direction of the processor system. The acquisition system includes the multi-
source trigger, acquisition timebase, and acquisition mode generation and control
circuitry. The acquisition board is located in the bottom compartment of the
instrument and can accommodate four dual-channel sampling Plug-ins, two
one-channel optical plug-ins and a trigger/holdoff subsystem. Up to 8 vertical
channels are accommodated simultaneously. Channels 1 and 2 are either large or
small slots. The presence of an module in one or both large slots displaces the
small slot functionality in the leftmost Channel 1 - Channel 2 small slot. The

Theory of Operation
external trigger and all small slot channels feature a Tekprobe Level 2 probe
power connector for additional front end signal conditioning functions like high
input-impedance real-time probes.
Processor System. The processor system contains a dual Wintel/PowerPC. The

basic instrument configuration supports up to eight channels labeled Ch1 through
Ch 8, provides two external trigger inputs for direct and prescaled triggering
through built--in prescaler and is able to support two optional internal trigger
sources associated with the large slot channels mapped onto electrical channels 1
and 2.
Display Panel Color LCD display Active-matrix touch panel.
Display System. The display system sends the text and waveform information to
the display panel.
Touch Panel. The Display board sends information to the processor. Any changes
in their settings are reported to the processor system.
Front Panel The front panel board reads the front-panel switches and knob sensors. Any
changes in their settings are reported to the processor system. The front panel
board also turns the LEDs on and off and generates the bell signal.
Front-panel menu switches are also read by the PPC processor board. The
processor sends any changes in menu selections to the processor system. The
ON/STBY switch is one of the menu switches. However, it is not read by the
front panel board, but passes through the front panel board to the low voltage
power supply.
Rear Panel The hard drive and CD Rom provides access to stored waveform data and to load
software to customized your instrument with your measurement needs. The
GPIB allows for external control of the instrument.
You can make hardcopies on the GPIB and RS-232 ports. Other ports from the
front panel board: PC cardbus x 2 and cal adjust lock.
Outputs from the NLX board: SVGA, USB (1), sound, serial, parallel, Ethernet,
mouse, keyboard.
Low Voltage Power Supply The low voltage power supply is a switching power converter with active power
factor control. It supplies power to all of the circuitry in the instrument.
The principal POWER switch, located on the rear panel, controls all power to the
instrument including the Low Voltage Power Supply. The ON/STBY switch,

Theory of Operation
located on the front panel, also controls all of the power to the instrument except
for part of the circuitry in the Low Voltage Power Supply.
The power supply sends a power fail (~PF) warning to the processor system if
the power is going down.
Fans The fan assembly provides forced air cooling for the instrument. The fans are
controlled by the PPC processor.
Electrical Sampling Modules Overview

The 80E01 and 80E06 are one-channel sampling modules, 50 GHz and 70 GHz,
respectively; the 80E02, 80E03, and 80E04 are two-channel modules, 12.5 GHz,
20 GHz, and 20 GHz samplers, respectively. The 80E01 module has a 7 ps rise
time, the 80E02 has a 28 ps rise time, the 80E03and 80E04 modules have a
17.5 ps rise time, and the 80E06 has a 5.0 ps rise time.
For the 80E02 and 80E03, a single strobe delivered from the instrument
mainframe to both acquisition channels controls the timing of the strobe
assertion to both channels. If channel-to-channel deskew is zero, the sampling
coincidence between channels is very close. Acquisition deskew function is
carried out by making separate acquisitions over individual acquisition windows.
For the 80E01 and 80E06, an individual strobe delivered from the instrument
mainframe to the acquisition channel controls the timing of the strobe assertion
to the channel. Acquisition deskew function is carried out by moving the strobe
timing for the channel to a unique acquisition window.
Each electrical channel features a Tekprobe Level 2 probe power connector for
attachment of a real time probe. The control of this probe is a mainframe
function.
All module calibration signals are derived from a 2.5 V precision voltage
reference internal to the sampling module. Settings derived from this reference
are stored in a non-volatile EEPROM in the sampling module, although the
responsibility for the execution of these settings is with the mainframe.
For major functional circuit blocks refer to Figure 9--2 on page 9--3.

Theory of Operation
80E04 Electrical The 80E04 TDR/Sampling module is a two-channel, low noise, 17.5 ps rise time
TDR/Sampling Module sampler. Each channel is also capable of generating its own Time Domain
Reflectometry (TDR) step. The 80E04 sampling module risetime is 17.5 ps.
For the 80E04 a single strobe delivered from the instrument mainframe to both
acquisition channels controls the timing of the strobe assertion to both channels.
If channel-to-channel deskew is zero, the sampling coincidence between
channels is very close. Acquisition deskew function is carried out by making
separate acquisitions over acquisition windows.
Each electrical channel features a Tekprobe Level 2 probe power connector for
attachment of a real time probe. The control of this probe is a mainframe
function.
All module calibration signals are derived from a 2.5 V precision voltage
reference internal to the sampling module. Settings derived from this reference
are stored in a non-volatile EEPROM in the sampling module, although the
responsibility for the execution of these settings is with the mainframe.
When used in the acquisition mode (that is, with the TDR step generator turned
off) each channel functions as a normal sampling input. Both channels are
strobed simultaneously from a single strobe generator contained within the
sampling module, so time coincidence between the two channels is stable.
In the TDR mode, a fast rise time step is generated internally for each channel
and applied to the input signal path for that channel. The acquisition portion of
the TDR/sampling module remains functional for monitoring the primary step
and its reflected components. The sampling module provides two self- contained
TDR channels. The polarity of the output step can be selected independently for
each channel. This allows differential or common mode testing of two coupled
lines as well as independent testing of isolated lines.
Optical Sampling Modules Overview

80C0X and 80C0X-CR optical modules share the same mechanical package and
are built with a common circuit board. Different functionality within the modules
(current and future modules) is achieved by installing different O/E modules,
filters and clock recovery boards along with setting the sampler bandwidth as
demanded. The key features supported in the module are:
H A one channel, low noise, adjustable bandwidth sampler allowing multiple
bandwidth settings for optimizing noise versus bandwidth demands.
H An amplified or non-amplified O/E converter.

Theory of Operation
H Support for internal RF switches in the signal path with a straight-through

path and two hardware-filtered reference receiver paths between the O/E
converter and the sampler.
H An average optical power meter.
H Integral clock recovery option with internal coaxial connection to the
mainframe trigger, front panel clock and data output (not all have data).
H I2C communication with the mainframe for identification, control and
calibration/compensation storage.
The “system response” depends on all of the components in the signal path from
the front panel to the sampler. Bandwidth and reference receiver responses are
calibrated at the factory with a sub-picosecond optical impulse applied to the
front panel connector or with an optical heterodyne system. This insures that all
components are included, but also means that components can not be replaced
without performing calibration.
Compensation performs a DC transfer curve characterization for each bandwidth/
reference receiver setting. The curve data is stored in the module’s EEPROM and
used to generate a look-up table in the mainframe. This data corrects for
linearity, gain and offset errors in the sampler.
Reference receivers can be created in any of the following ways:
H A hardware filter inserted between the O/E and the sampler and dominates
the response.
H No filter is used, but the sampler’s bandwidth is adjusted.
H The O/E bandwidth is adjusted and dominates the response.
Information about the available bandwidth and reference receiver selections, and
the method used to set the bandwidth for the optical modules starts on
page 3--6.
The power monitor is a second measure of the photodiode current that is
independent of the sampler signal path. Analog circuitry continuously senses the
current flowing into the bias side of the photodiode. The signal is amplified by a
programmable gain amplifier and input to an 8 bit AD converter. The AD
converter and amplifier are controlled through the I2C interface. Compensation
performs two functions in the power meter: First, two offset inputs are adjusted
in the amplifier so that the signal stays in range for all of the gain settings. Next,
offset is measured for all gain settings and stored so it can be subtracted from the
raw measured current. Because the measurements are made through independent
paths the power monitor is useful in debugging module/mainframe problems.
The main board of the module only provides power and control bits to the clock
recovery board. A small fraction of the input signal is split off and applied to the

Theory of Operation
clock recovery components. The type of splitter for each module is shown in
Table 3--1.
Table 3- 1: Module optical/electrical split
Module Optical Split Electrical Split

C01 n
C02 n
C03 n
C04 n
C07 n
C07B n
C08 n
C08B n
C08C n
C09 n
C11 n
The recovered clock is routed in coaxial cable through the rear connector of the
module to the Optical Front End board in the mainframe. The Optical Front End
board has a switch that selects which modules clock will be applied to the
trigger. The control signal for that switch comes from the optical module.
80C01 Optical Sampling The 80C01 module supports conformance testing of long wavelength
Module (1100-1650 nm) signals at 622, 2488, and 9953 Mb/s as well as general purpose
testing up to 20 GHz optical bandwidth. Bandwidth and reference receiver
calibration is performed with a sub-picosecond optical impulse and a fourier
transform method.
H OC12: The electrical sampler is adjusted to approximately 7.5 GHz (--3 dB)
bandwidth and signal is routed through a hardware filter designed to result in
the combined system having an OC12 (STM-4) Reference Receiver
response.
H OC48: The electrical sampler is adjusted to 7.5 GHz (--3 dB) bandwidth and
signal is routed through a hardware filter designed to result in the combined
system having an OC48 (STM-16) Reference Receiver response. These
adjustments must be made at the factory.
H OC192: The electrical sampler is adjusted to give the desired response, and
signal is not routed through any filter (signal is sent through the straight-
through path). The sampler bandwidth and response is optimized during the

Theory of Operation
calibration such that the combined system will have an OC192 (STM-64)
Reference Receiver response.
H 12.5 GHz: The sampler bandwidth and response is set during the calibration
such that the combined system will have an Optical Bandwidth (--6 dB)
>12.5 GHz.
H 20 GHz: The sampler bandwidth and response is set during the calibration
>20 GHz.
For major functional circuit blocks refer to Figures 9--3 and 9--4 beginning on
page 9--4.
80C02 Optical Sampling The 80C02 module is optimized for testing of long-wavelength (1100-1650 nm)
Module signals at (9.953 Gb/s) SONET OC-192 / SDH STM-64 standards. With its high
optical bandwidth (>30 GHz) it is also well suited to general purpose high-per-
formance optical component testing.
H OC192: The electrical sampler is adjusted to give the desired response, and
signal is not routed through any filter (signal is sent through the straight-
through path). The sampler bandwidth and response is optimized during the
calibration such that the combined system will have an OC192 (STM-64)
Reference Receiver response.
H 12.5 GHz: The sampler bandwidth and response is set during the calibration
>12.5 GHz.
>20 GHz.
>30 GHz.
page 9--6.
80C03 Optical Sampling The 80C03 module supports conformance testing of both short and long
Module bandwidth (700-1650 nm) signals at 1.063, 1.250, and 2.488 Mb/s as well as
general purpose testing with >2.3 GHz optical bandwidth. Its amplified optical to
electrical converter design enables the user to examine very low-level optical
signals.
H OC48: The electrical sampler is adjusted to approximately 12.5 GHz (--3 dB)
bandwidth and signal is not routed through any filter (signal is sent through

Theory of Operation
the straight-through path). The O/E converter is designed by the vendor to

match the OC48 reference receiver response curve. The span adjustment
provides limited adjustment of the frequency response. It is adjusted at the
factory so that the combined system will have an OC48 (STM-64) Reference
Receiver response. This mode is synonymous with the 2.3 GHz maximum
bandwidth setting.
H FC1063: The electrical sampler is adjusted and O/E converter span voltage
are the same values as in the OC48 mode. The signal is routed through a
hardware filter designed to result in the combined system having an FC1063
(1.0625 Gb/s Fibre Channel) Reference Receiver response.
H GBE: The electrical sampler is adjusted and O/E converter span voltage are
the same values as in the OC48 mode. The signal is routed through a
hardware filter designed to result in the combined system having an GBE
(1.25 Gb/s Gigabit Ethernet) Reference Receiver response.
The 80C03 module can be configured with clock recovery that supports Fibre
Channel 1063 (1.063 Gb/s) and OC-48 / STM-16 (2.488 Gb/s) standards.
For major functional circuit blocks refer to Figure 9--7 and 9--8 beginning on
page 9--8.
80C04 Optical Sampling The 80C04 module is optimized for testing of long wavelength (1100--1650 nm)
Module signals at either 9.953 Gb/s or 10.664 Gb/s. With its high optical bandwidth
>28 GHz, it is also well suited to general-purpose, high-performance optical
component testing.
H OC192 or 10.664 Gb/s: The electrical sampler is adjusted to give the desired
response, and signal is not routed through any filter (signal is sent through
the straight-through path). The sampler bandwidth and response is optimized
during the calibration such that the combined system will have an OC192
(STM-64) or 10.66 Gb Reference Receiver response.
>20 GHz.
>28 GHz.
The 80C04 can be optionally configured with clock recovery (Opt. CR-1) that
supports 9.953 Gb/s telecom standards.
page 9--10.

Theory of Operation
80C05 Optical Sampling The 80C05 module is designed to test long wavelength (1520--1580 nm) signals.
Module This module is intended to be used as a test and measurement tool for high
bandwidth telecommunications with its high optical bandwidth >40 GHz.
H OC192: There is one Reference Receiver setup selectable for 9.95328 Gb/s
SONET/SDH standard.
H There is no clock recovery option available.
H 55 GHz: There is only a single bandwidth selection available, no Reference
Receiver setups selectable.
80C07 Optical Sampling The 80C07 module is designed to test both long and short wavelength
Module (700--1650 nm) signals. This module is intended to be used as a test and
measurement tool for high bandwidth telecommunications with its high optical
bandwidth >2.3 GHz.
H Filtered rates are OC-3, OC-12; unfiltered rate is OC-48.
H There is clock recovery option available (155/622/2488 Multi-rate)
For major functional circuit blocks refer to Figures 9--13 and 9--14 on page 9--14.
80C07B Optical Sampling The 80C07B module is designed to test both long and short wavelength
bandwidth >2.3 GHz.
H Supported standards or data filtering rates include OC--3, OC--12, OC-48,
ENET2500/2GBE, GBE, FC1063, FC2125, and Infiniband.
H Clock recovery options are available
(155/622/1063/1250/2125/2488/2500/2666)
For major functional circuit blocks refer to Figures 9--13 and 9--14 on page 9--14.

Theory of Operation
80C08 Optical Sampling The 80C08 module is designed to test both long and short wavelength
bandwidth >9.0 GHz.
H 10.0 GHz: No filter is used and the sampler bandwidth is adjusted; the O/E
bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s
Multi--rate).
H There is clock recovery option available (9.953/10.3125 Gb/s Multi-rate).
page 9--16.
80C08B Optical Sampling The 80C08B module is designed to test both long and short wavelength
bandwidth >9.5 GHz.
bandwidth is adjusted and dominates the response (9.953/10.3125 Gb/s
Multi-rate).
H There is clock recovery option available (9.953/10.3125/10.51875 Gb/s
Multi-rate).
page 9--16.
80C08C Optical Sampling The 80C08C module is designed to test both long and short wavelength
bandwidth >10 GHz.
bandwidth is adjusted and dominates the response
(9.953/10.3125/10.518/10.66/10.709/11.1 Gb/s).
H Clock recovery options are available (9.953/10.3125/10.518 Gb/s and
Continuous-rate from 9.8 Gb/s to 12.6 Gb/s).
page 9--16.

Theory of Operation
H Supported standards or data filtering rates include OC-192 and FEC10.709.
H Clock recovery options are available (OC-192 and FEC10.709)
page 9--18.
80C10 Optical Sampling The 80C10 module is designed to test long wavelength (1310 and 1550 nm)
Module signals. This module is intended to be used as a test and measurement tool for
high bandwidth telecommunications with its high optical bandwidth >65 GHz.
H Supported standards or data filtering rates include OC-768 and FEC43.02
(G.709).
>30 GHz.
>65 GHz.
H Supported standards or data filtering rates include
9.953/10.31/10.518/10.66/10.71/11.1 Gb/s.
H Clock recovery options are available (9.953/10.66/10.71 Gb/s and Continu-

ous-rate from 9.8 Gb/s to 12.6 Gb/s)
For major functional circuit blocks refer to Figures 9--20, 9--21, 9--22, and 9--23
beginning on page 9--20.

Theory of Operation
80A01 Trigger Prescale Preamplifier Modules

The 80A01 module is designed to increase the sensitivity of the prescale trigger
input of the CSA8000/TDS8000 instruments to ≤200 mVpk-pk.
The major function block of the module is a high sensitivity, high gain RF
amplifier. The input and output to this amplifier are routed to two identical
SMA, female connectors, labelled Input and Output at the module front panel.
The module receives power from the main instrument through a single connector
at the rear of the module. The power LED indicates the module is receiving
power through the interface connector.

Two types of Performance Verification procedures can be performed on this

product: Brief Procedures and the more extensive Performance Tests. You may
not need to perform all of these procedures, depending on what you want to
accomplish:
H To rapidly confirm that the instrument functions and was adjusted properly,
just do the Perform the Diagnostics and Perform the Compensation
procedures, found under Brief procedures beginning on page 4--3.
Advantages: These procedures are quick to do, require no external
equipment or signal sources, and perform extensive functional and accuracy
testing to provide high confidence that the instrument will perform properly.
They can be used as a quick check before making a series of important
measurements.
H To further check functionality, first do the procedures just mentioned, and
then do the procedure Perform the Functional Tests, found under Brief
Procedures on page 4--7.
Advantages: These procedures require minimal additional time to perform,
require no additional equipment other than connection hardware, and more
completely test the internal hardware of the instrument. They can be used to
quickly determine if the instrument is suitable for putting into service, such
as when it is first received.
H If more extensive confirmation of performance is desired, do the Perfor-
mance Tests, beginning on page 4--29, after doing the procedures just
referenced.
Advantages: These procedures add direct checking of warranted specifica-
tions. They require more time to perform and suitable test equipment is
required. (See Equipment Required beginning on page 4--31).
If you are not familiar with operating this instrument, read the
CSA8000/TDS8000 or the CSA8000/TDS8000B user manuals. These manuals
contain instructions that will acquaint you with the use of the front-panel
controls and the menu system.
STOP. The procedures throughout this chapter contain instructions based on the
menus and controls supported by the version 1.3 release and later of the
instrument firmware. The procedures will work for earlier versions of software,
but some control and menu names will vary slightly.


Brief Procedures
There are three procedures in this section that provide a quick way to confirm
basic functionality and proper adjustment:
H Perform the Diagnostics

H Perform the Compensation
H Perform the Functional Tests
These procedures require little or no test equipment; see the description on
page 4--1 for information on when to use these procedures.
NOTE. The procedures that follow contain instructions based on the menus and
controls supported by the version 1.3 release and later of the instrument
firmware. The procedures will work for earlier versions of software, but the
control and menu names may vary slightly.
Perform the Diagnostics

Do the following steps to run the internal routines that confirm basic functional-
ity and proper adjustment.
Equipment required None

Prerequisites First, all sampling modules to be diagnosed must be installed as
outlined in their user manuals.
Second, power on the instrument and allow a 20 minute warm-up
before doing this procedure.
1. Set up the instrument: From the application menu bar, select Utilities, and
then select Diagnostics. The Diagnostics dialog box displays. See below.

Brief Procedures
2. Select a diagnostics suite:

a. In the dialog box, click the Subsystem Level tab.
b. Select the all the entries by clicking the first entry Control Proc and
dragging down to select the rest. All entries should be highlighted as
shown above.
c. In the Run box, leave Loop and Halt on Failure unchecked.
3. Verify that the diagnostic suite passes:
a. Click the Run button to execute the diagnostics.
b. The diagnostics may take several minutes to complete. Verify that Pass
appears as Status in the dialog box when the diagnostics complete.
c. If instead an error number appears as Status, rerun the diagnostics. If
Fail status continues after rerunning compensation and you have allowed
warm up to occur, the module or main instrument may need service.
End of Procedure

Brief Procedures
Perform the Compensation

Performing a vertical compensation will maximize the accuracy of the automatic
measurements you take. This procedure uses internal routines to optimize the
vertical offset, gain, and linearity.
Equipment required For sampling modules:

H 50 Ω terminations on all electrical module channels (Tektronix
part number 015-1022-xx).
H Dust covers on all optical module channels.
The sampling modules ship from Tektronix with the proper termina-
tions and dust covers installed.
Prerequisites First, all sampling modules to be compensated must be installed as
outlined in their user manuals.
Second, power on the instrument and allow a 20 minute warm-up
before doing this procedure.
1. Run the compensation routines:

a. From the application menu bar, select Utilities, and then select Com-
pensation.
In the Compensation dialog box, the main instrument (mainframe) and
sampling modules are listed. The temperature change from the last
compensation is also listed. See Figure 4--1 on page 4--5.
Click to select compensate
Choose all as targets
Click to start compensation
Figure 4- 1: Compensation dialog box

Brief Procedures
b. Wait until the Status for all items you wish to compensate changes from
Warm Up to Pass, Fail, or Comp Req’d.
c. Under Select Action, click the Compensate option button.
d. From the top pulldown list, choose All (default selection) to select the
main instrument and all its modules as targets to compensate.
e. Click the Execute button to begin the compensation.

f. Follow the instructions to disconnect inputs and install terminations that
will appear on screen; be sure to follow static precautions (see the user
manual for your sampling module) when following these instructions.
NOTE. Failing to install the 50 ohm terminations on 80E00 sampling-module

input connectors can yield erroneous compensation failures or results.
2. Verify that the compensation routines pass:

a. The compensation may take several minutes to complete. Verify that
Pass appears as Status for the main instrument and for all sampling
modules listed in the Compensation dialog box when compensation
completes.
b. If instead Fail appears as Status, rerun the compensation. If Fail status
continues after rerunning compensation and you have allowed warm up
to occur, the module or main instrument may need service.
c. If you want to save the compensation constants generated by this
compensation, click the Save option button under Select Action. Click
the Execute button to save the compensation.
End of Procedure

Brief Procedures
Perform the Functional Tests

These procedures use the DC CALIBRATION OUTPUT and the INTERNAL
CLOCK OUTPUT connectors to further verify that the instrument functions
properly. An SMA cable is required to do these test procedures.
The purpose of these procedures is to confirm that the instrument functions
properly. The equipment required is intentionally kept to a minimum.
STOP. These procedures verify functions; that is, they verify that the instrument
features operate. They do not verify that they operate within limits; therefore, do
not interpret any quantities cited (such as “about five horizontal divisions”) as
limits.
STOP. DO NOT make changes to the front-panel settings that are not called out
in the procedures. Each verification procedure will require you to set the
instrument to default settings before verifying functions. If you make changes to
these settings, other than those called out in the procedure, you may obtain
invalid results. In this case, go back to step 1 and repeat the procedure.
Verify Electrical Input Install the test hookup and preset the instrument controls:
Channels
Equipment required One SMA cable, such as Tektronix part number 174-1427-00
Prerequisites At least one electrical (80E00 series) sampling module must be
installed as outlined in its user manual.
1. Initialize the instrument: Push the front-panel DEFAULT SETUP button and
click Yes in the confirmation dialog box.
2. Set the Trigger System: In the UI application toolbar, select Internal Clock
from the Trig list box as shown below.
3. Hook up the signal source: Connect the SMA cable from the DC CALIBRA-
TION output to the channel input that you want to test as shown in
Figure 4--2.

Brief Procedures
CSA8000/TDS8000
SMA cable from DC calibration

output to 80E00 C3 input
Figure 4- 2: Hookup for electrical functional tests
4. Set the DC CALIBRATOR OUTPUT:

a. Push the Vertical MENU front-panel button. This displays the Vert Setup
dialog box.
NOTE. When an optical module is installed, the optical setup dialog box displays
by default. Click the Basic button to display the basic dialog box.
b. Enter a level of 200 mV in the DC CAL box.

c. Push the Vertical MENU front-panel button again to dismiss the Vert
Setup dialog box.
5. Select the channel to test: Push the channel button for the channel you want
to test. The button lights and the channel display comes on. See Figure 4--3.
Channel
buttons
Figure 4- 3: Channel button location

Brief Procedures
6. Verify that the channel is operational: Confirm that the following statements
are true:
H The vertical scale readout for the channel under test shows a setting of
100 mV, and a DC level is at about 2 divisions above center screen.
H The front-panel vertical POSITION knob (for the channel you are
testing) moves the DC offset level up and down the screen when rotated.
Return the DC level to 2 divisions above center screen before continuing.
H Turning the vertical SCALE knob to 50 mV changes the amplitude of
the DC level to about 4 divisions above center screen, and returning the
knob to 100 mV returns the amplitude to about 2 divisions above center
screen.
7. Verify that the channel acquires in all acquisition modes: Push the
front-panel button Acquisition MENU to display the Acq Setup dialog box.
Click each of the three acquisition modes, and confirm that the following
statements are true:
H Sample mode displays an actively acquiring waveform on-screen. (Note
that there is a small amount of noise present on the DC level).
H Average mode displays an actively acquiring waveform on-screen with
the noise reduced.
H Envelope mode displays an actively acquiring waveform on-screen with

the upper and lower extremes of the noise displayed.
8. Verify the DC accuracy compensation: Do the following substeps:
a. Select Measurement from the Setup menu. In the Meas Setup dialog box
that displays:
H Select as Source the channel under test. For example, select Main C3
for channel 3.
H Select Meas1.
H Set the Select Meas menu to Pulse > Amplitude > Mean.
b. Push the Vertical MENU front-panel button. This switches to the Vert
Setup dialog box.
c. Set the Vertical Scale, Vertical Offset, and DC Calibration Output to the
levels shown in the first row of the table that follows.
d. In Measurement readout on screen, verify that the Mean measurement
for the channel under test falls within the limits given in the table.

Brief Procedures
e. Repeat steps c and d for each row in the table.
Limits
Vertical Scale Vertical Offset DC CAL Output
(mV/div) (mV) (mV) Minimum (mV) Maximum (mV)
100 - 1000.0 - 1000.0 - 1009.0 - 991.0
100 0.0 - 450 - 461.0 - 439.0
100 0.0 0 - 2.0 2.0
100 0.0 450 439.0 461.0
100 1000.0 1000.0 991.0 1009.0
9. Test all channels: Repeat steps 3 through 8 until all input channels are
verified.
10. Remove the test hookup: Disconnect the SMA cable from the channel input
and the DC CALIBRATION output.
Verify Optical Input This verification is done without an input signal.

Channels
Prerequisites At least one optical (80C00 series) sampling module must be installed
as outlined in its user manual.
1. Initialize the instrument: Push the front-panel DEFAULT SETUP button.

2. Set the Trigger System: In the UI application toolbar, select Internal Clock
3. Select the channel to test: Push the channel button for the channel you want
to test. The button lights amber and the channel displays. See Figure 4--4.

Brief Procedures
Channel
buttons
4. Verify that the channel is operational: Confirm that the following statements
are true.
H A baseline trace displays at about center screen (see Figure 4--5 on page
4--12) and the vertical scale readout for the channel under test shows a
setting as follows:
H 80C01, 80C02, 80C04, 80C09, and 80C11: 1 mW
80C03: 100 W
80C05: 3 mW
80C06: 6 mW
80C07, and 80C07B: 100 W
80C08, 80C08B, and 80C08C: 200 W
80C10: 3 mW
H The front-panel Vertical POSITION knob (for the channel you are
testing) moves the signal up and down the screen when rotated. Return
the baseline trace to center screen before continuing.
H Turning the Vertical OFFSET front-panel knob counterclockwise offsets
the baseline towards the bottom of the screen, turning the knob
clockwise offsets the baseline towards the top of the screen, and
returning the knob to 0.000 offset returns the baseline to center screen.

Brief Procedures
NOTE. If the position knob was set to 0.000, you can confirm this in the Vertical
menu (use Basic button in the dialog box).
Baseline
Vertical offset
Control bar
Vertical offset
setting
Figure 4- 5: Optical channel verification
5. Verify that the channel acquires in all acquisition modes: Push the
front-panel button Acquisition MENU to display the Acq Setup dialog box.
Click each of the three acquisition modes and confirm that the following
statements are true:
H Sample mode displays an actively acquiring waveform on-screen. (Note

that there may be a small amount of noise present on the baseline level).
H Average mode displays an actively acquiring waveform on-screen with
any noise present reduced.
H Envelope mode displays an actively acquiring waveform on-screen with
the upper and lower extremes of the noise displayed.
6. Close Acquisition setup dialog box: Push the Acquisition MENU button to
close the Acq setup dialog box.

Brief Procedures
7. Test all channels: Repeat steps 3 through 5 until all optical input channels
are verified.
Verify theTime Bases After verifying the channels, you can now verify that the time bases function.
Work This verification is done using a front-panel signal.
Equipment required One SMA cable, such as Tektronix part number 174-1427-00.
One 10x SMA attenuator, such as Tektronix part number 015-1003-00
One electrical (80E00-series) sampling module
Prerequisites None

2. Hook up the signal source: Connect the SMA cable from the Internal Clock
output through a 10x attenuator to any 80E00 sampling module input
channel as shown in Figure 4--6.
CSA8000/TDS8000
SMA cable from

INTERNAL CLOCK
10x Attenuator
Figure 4- 6: Hookup for the time base tests
3. Set up the instrument:

a. Push the Trigger MENU front-panel button to display the Trig Setup
dialog box.
b. Click Internal Clock under Trigger Source in the Trig Setup dialog
box. The Internal Clock rate should be set to 200 kHz.
c. Push the Trigger MENU front-panel button again to dismiss the Trig
Setup dialog box.
d. Push the channel button for the channel you connected to in step 2. The
button lights and the channel display comes on. See Figure 4--7 on
pa ge 4--14.

Brief Procedures
e. Turn the Vertical SCALE knob to set the vertical scale to 20 mV/div.
The channel scale readout is displayed in the Control bar at the bottom
of the graticule.
Channel
buttons
4. Set the time base: Set the Horizontal SCALE to 1 s/div. The horizontal
scale readout is displayed in the Control bar at the bottom of the graticule.
a. Select Display in the Setup menu and set the display for Normal and
Show Vectors (enable) in the Disp Setup dialog box.
b. Rotate vertical OFFSET knob counterclockwise so that the base of the
square wave is about 2 divisions below the center graticule.
NOTE. Otherwise no vertical trace will be seen for rise and fall.

Brief Procedures
5. Verify that the Main time base operates: Confirm the following statements
are true:
H One period of the internal clock signal (a square wave) is about five
horizontal divisions on-screen. See Figure 4--8 on page 4--16.
NOTE. At some temperatures, there may be extraneous data points beyond the
first half cycle when viewing the front-panel Internal Clock output (as is done in
this step). This behavior may also occur when viewing multiple cycles in TDR
mode. In both cases, this behavior is normal.
H Rotating the Horizontal SCALE knob clockwise expands the waveform

on-screen (more horizontal divisions per waveform period), counter-
clockwise rotation contracts it, and returning the horizontal scale to
1 s/div returns the period to about five divisions. Leave the time base
set to 1 us/div.
H The horizontal POSITION knob positions the signal left and right
on-screen when rotated.
NOTE. The signal will not move past the minimum position setting.

Brief Procedures
Internal clock
signal
Control bar
Vertical scale Horizontal

setting scale setting
Figure 4- 8: Main time base verification

Brief Procedures
6. Set up the Mag1 time base:

a. Push the Horizontal View MAG1 button on the front panel. The Mag1
time base view will display under the Main time base view.
b. Set the Horizontal SCALE to 1 s/div. The horizontal scale readout is
displayed in the Control bar at the bottom of the graticule and is now
reading out the scale of the Mag1 time base view.
7. Verify that the Mag1 time base operates: Confirm the following statements.
H The brackets on the Main View waveform (top graticule) are a full-
screen width apart (10-divisions). See Figure 4--9 on page the 4--17.
H One period of the internal clock signal (a square wave) in the Mag view
(bottom graticule) is about five horizontal divisions on-screen. (Matches
the waveform in the top graticule.) See Figure 4--9.
H Rotating the Horizontal SCALE knob clockwise to 500 ns/div expands
the waveform in the bottom graticule to double the period (about
10-horizontal divisions per waveform period) and returning the
Horizontal SCALE knob to 1 s/div returns the period to about five
divisions. Leave the Horizontal Scale set to 1 us/div.
Left Mag time base marker Right Mag time base marker
Main time base view
Mag time base view
Figure 4- 9: Mag time base verification

Brief Procedures
8. Verify that the Mag2 time base operates:

a. Push the Mag1 button to remove the display of the Mag1 time base.
b. Perform steps 6 and 7, but use the Mag2 button instead of the Mag1.
Perform Gated Trigger This test verifies that the Gated Trigger (GT Option) function. This test is done
Test using a front-panel signal and a rear-panel TTL connection.
Equipment required One 50 Ω BNC cable, such as Tektronix part number 174-1341-00
One SMA cable, such as Tektronix part number 174-1427-00
One 50 Ω terminator cap, such as Tektronix part number 011-0049-00.
One SMA 10X attenuator, SMA connector, such as Tektronix part
number 015-1003-00
Four electrical (80E00-series) sampling modules.
Prerequisites This test applies only to instruments that include option GT.

2. Push the channel 3 button to select it. The button lights and the channel
display comes on. See Figure 4--11 on page 4--20.
3. Hook up the signal source: Connect the SMA cable from the Internal Clock
output through a 10x attenuator to 80E00 sampling module input channel 3
as shown in Figure 4--10 on page 4--19. Connect BNC cable to External Gate
input at rear panel.

Brief Procedures
Rear panel
CSA8000/TDS8000
TRIGGER
GATE (TTL)
SMA cable from
INTERNAL CLOCK
10x Attenuator
BNC cable attached to TRIGGER

GATE (TTL) on the rear panel
Figure 4- 10: Hookup for the gated trigger tests
4. Set up the instrument:

a. Push the Trigger MENU front-panel button to display the Trig Setup
dialog box.
b. Click Internal Clock under Trigger Source in the Trig Setup dialog
box. The Internal Clock rate should be set to 200kHz.
c. Verify that the Gated Trigger option in Enhanced Triggering section is
selected (check box is checked).
d. Turn the Vertical SCALE knob to set the vertical scale to 50 mV/div.
The channel scale readout is displayed in the Control bar at the bottom
of the graticule.

Brief Procedures
Channel
buttons
5. Set the time base: Set the Horizontal SCALE to 2 s/div. The horizontal
scale readout is displayed in the Control bar at the bottom of the graticule.
6. From the Setup menu, select Display. Set the display for Normal and Show
Vectors (enable) in the dialog box.
7. Push the Horizontal MENU button; the Mode in All Timebases must be set
to Lock to Int. 10MHz.
8. Verify that Triggering occurs: Verify signal is triggered with waveform
on-screen. See Figure 4--12 on page 4--21.

Brief Procedures
Triggered signal indicator
Internal
clock
signal
Control
bar

Figure 4- 12: Signal triggered
9. Disable trigger: Install 50 Ω terminator cap to the end of the cable that is
attached to the rear-panel gated trigger BNC. See Figure 4--10 on page 4--19.
10. Verify that the Gated Trigger functions: Verify signal is not triggered (gate
disabled). Signal freezes on the screen above to indicate triggering has
stopped. See Figure 4--13 on page 4--22. Note the Not Trigd indication at the
top of the window.
a. Push the CLEAR DATA button.

b. Verify signal is not triggered with no waveform on-screen. See Figure
4--14 on page 4--23. Note the Not Trigd indication at the top of the
window.

Brief Procedures
Untriggered signal indicator
Control
bar
Vertical scale setting Horizontal scale setting
Figure 4- 13: Signal not triggered (signal frozen)

Brief Procedures
Untriggered signal indicator
Control
bar

Figure 4- 14: Signal not triggered (no waveform)
11. Verify that the Gated Trigger enables triggering: Disconnect 50 Ω termina-
tor cap from the end of the cable. Verify signal is triggered (gate enabled)
with waveform on-screen. See Figure 4--15 on page 4--24.
12. Disconnect the test hook up.

Brief Procedures
Triggered signal indicator
Internal
clock
signal
Control
bar
Vertical scale setting Horizontal scale setting
Figure 4- 15: Signal triggered
NOTE. For additional information, see the Perform the Functional Tests topic in
the Product Description chapter of the CSA8000B & TDS8000B User Manual.
End of Functional Test Procedures
Perform the Hardware and Operating System Tests

These procedures verify the instrument hardware functions. A diagnostics
program called QA+Win32 is used to make the verifications. No equipment is
required.
QA+Win32 QA+Win32 is a comprehensive software application used to check and verify the
operation of the PC hardware in the portable mainframe. This procedure uses
QA+Win32 to verify the instrument hardware. To run QA+Win32, you must
have either a working keyboard or a working mouse or other pointing device and
have Windows 98 running.

Brief Procedures
CAUTION. Before running the QA+Win32 tests, be aware of the following

problems and work-arounds.
H The QA+Win32 discrete memory test fails if the system being tested
contains more than 16 megabytes of RAM.
Since your product ships with more than 16 megabytes of RAM, please
follow the procedure for Checking the Hardware and Operating System on
page 4--26.
NOTE. Do not run the memory test from the Memory icon.
H The QA+Win32 hard drive test may report an incorrect number of tracks and
cylinders for your hard drive.
This is an internal mapping problem, but has no effect on the results of the
test. Bad sectors on your hard drive are still found and marked.
H The QA+Win32 keyboard test does not respond correctly to keys used by
Windows 98.
Keyboards made for use with Windows contain two or three keys specific to
that operating system. These are usually located on either side of the space
bar. QA+Win32 does not trap these keys when performing the keyboard test.
Do not press them.
Checking the Cooling Fan Power on the instrument and visually inspect the left side panel of the instrument
Operation to verify that all six cooling fans are rotating.

Prerequisites The instrument must be powered on and running.

Brief Procedures
Checking the Hardware To perform a minimal check of the hardware and Windows 98 operating system
and Operating System of this instrument, perform this procedure to run QA+Win32 diagnostics from
the Windows 98 Start menu.

Prerequisites A mouse and keyboard must be connected to the instrument and it
must be powered on.
1. Push the RUN/STOP front-panel button to stop acquisition.
2. Use CTRL-ALT-DEL to close the TDS/CSA8000 application.

3. Click Start, then select Programs, and then Sykes Diagnostics in the Start
Menu. Finally, click QA+Win32.
NOTE. You may experience a delay before the program starts.
4. Click Tools on the menu bar, then click Customize Test...

5. Click Default and exit this dialog by clicking OK.
6. Select and execute the following tests individually by clicking on the test
buttons (see the illustration on page 4--27) one at a time (see note) and
clicking Start:
a. COM Ports
b. LPT Ports
c. System Board
d. System Info
e. USB
f. Video
NOTE. A test button is not highlighted until you select it. As you select the button
for each test (tool tip appears when you point to the button), a highlight box
appears around the button. When you click Start, the button blinks until the test
is complete and the highlight box changes color to indicate the test is complete.

Brief Procedures
Follow any instructions appearing on the screen.

7. Check test results in scrollable results listing in the Test Results window of
the QAPlus test window. All tests should pass.
8. Close the QA+Win32 diagnostics by selecting Exit in the File menu or click
the Control Box (X) in upper right corner.
9. You can restart the TDS/CSA8000 product software application by clicking
Start, then selecting Restart from the Shutdown Windows dialog box.
End of Procedure

Brief Procedures

Performance Tests
This chapter contains performance verification procedures for the specifications

marked with the n symbol. The following equipment, or a suitable equivalent,
is required to complete these procedures.
The procedures are arranged in three sections: Main Instrument, Electrical

Sampling Modules, Optical Sampling Modules, and the 80A01 Trigger Prescale
Limiting Preamplifier Module. They check all the characteristics that are
designated as checked in Specifications.
To check a system consisting of a main instrument with electrical and/or optical
modules, do the performance test procedures for the installed products in these
sections:
H Main Instrument
H 80E00 Electrical Sampling Modules
H 80C00 Optical Sampling Modules
To check a main instrument as an independent product:
H Do the main instrument tests using a two-channel 80E00-series module that
has passed the tests in 80E00 Electrical Sampling Modules (page 4--85).
When performing the time interval accuracy and trigger delay jitter tests,
check each channel of each small-module slot.
H In addition, to confirm that a main instrument can properly compensate all
channels in all modules in all main instrument slots, do the DC Voltage
Measurement Accuracy check (page 4--88) using the tested two-channel
80E00-series module. Perform this check for each channel of each small-
module slot.
H Be sure to run the instrument compensation routine with the tested module
installed each time you move the module to a new slot.
To check an electrical or optical module as an independent product, do the tests
in 80E00 Electrical Sampling Module or 80C00 Optical Sampling Modules,
using a main instrument that has passed the process just described for checking a
main instrument as an independent product.

Performance Tests
NOTE. Checking main instruments and modules as independent products checks

both products independently for all measured specifications, except for DC
voltage accuracy of main instruments and of 80E00 modules. The procedures do
check that DC compensation is functioning properly, so it is highly probable that
any combination of a main instrument and electrical module that passed testing
as independent products will meet the system DC voltage accuracy specifica-
tions.
The Brief Procedures section of this manual includes a DC accuracy check to
support verification by users that their specific combination of main instrument
and electrical module meets system specifications. This test uses the main
instrument DC Calibration Output and does not require external test generators.
Prerequisites
The tests in this section comprise an extensive, valid confirmation of perfor-
mance and functionality when the following requirements are met:
H The cabinet must be installed on the instrument.
H You must have performed and passed the procedure Perform the Diagnos-
tics, found on page 4--3, and the procedure Perform the Functional Tests,
found on page 4--7.
H A compensation must have been done within the recommended calibration
interval and at a temperature within ±2_ C of the present operating tempera-
ture. (If, at the time you did the procedures Perform the Diagnostics and
Perform the Functional Tests, you also did the Perform the Compensation
procedure (page 4--5) consider this prerequisite met).
H The instrument must have been last adjusted at an ambient temperature
between +20_ C and +30_ C, must have been operating for a warm-up
period of at least 20 minutes, and must be operating at an ambient tempera-
tures as follows.
H Observe all safety rules, especially regarding voltage hazards.
These procedures cover all instrument models. Please disregard checks that do
not apply to the specific model you are testing.

Performance Tests
Equipment Required
Procedures starting on page 4--63 use external, traceable signal sources to
directly check warranted characteristics. Table 4--1 lists the required equipment.
Table 4- 1: Equipment Required
Item number and description Minimum requirements Part number or model

1. Adapter (80E01 and 80E06 only) 2.4 mm, male-to-male connectors HP11900A
2. Adapter (80E01 and 80E06 only) 2.4 mm, female-to-female connectors HP11900B
3. Adapter (Qty. 2) SMA female to BNC male connectors Tektronix part number 015-0572-00
4. Adapter (Qty. 2) BNC to dual banana plugs Tektronix part number 103-0090-00
5. Adapter SMA “T” 1 male to 2 SMA female Tektronix part number 015-1016-00
6. Adapter (Qty. 2) BNC to dual banana plugs Tektronix part number 103-0095-00
7. Attenuator (80E01 only) 10 dB, female to male SMA connectors HP8490D with option 10
8. Attenuator 2X attenuator 50 Ω, SMA connectors Tektronix part number 015-1001-00
9. Attenuator, optical 30 mm, 10 dB, single-mode, FC to FC, female to Tektronix part number 119-5118-00
male
10. Airline (80E04 only) 50 Ω, airline Maury Microwave model number 8042D
11. Cable, delay, coaxial Coaxial cable, 50 Ω, 500 ps, with 3.5 mm, male Tektronix part number 015-0564-00
each end, 6.0 inch length
12. Cable, delay, coaxial Coaxial cable, 50 Ω., 2 ns delay, with SMA male Tektronix part number 015-0560-00
each end
13. Cable, fiber-optic Qty.2 Single-mode, 2 m, FC/PC to FC/PC Tektronix part number 174-1910-00
14. Cable, coaxial (80A01 only)(Qty. 2) 50 Ω, 4 ns delay, with SMA male at each end Tektronix part number 015-0561-00
15. Cable, coaxial (80A01 only) 50 Ω, 1 ns delay, with SMA male at each end Tektronix part number 015-0562-00
16. Cable, special (80E01 and 80E06 Phase and power stability Gore-Tex FE0BM0BM025.0
only)
17. Cable, coaxial (Qty. 2) 50 Ω, 20 in (0.5 m), male-to-male SMA Tektronix part number 174-1427-00
connectors
18. Cable, coaxial 50 Ω, 39.37 in (1.0 m), male-to-male SMA Tektronix part number 174-1341-00
connectors
50 Ω, 60 in (1.5 m), male-to-male SMA Tektronix part number 174-1428-00
connectors
19. Cable, Precision 50 Ω Coaxial 50 Ω, 36 in, male-to-male BNC connectors Tektronix part number 012-0482-00
(80E06 only)
20. Calibration step generator Calibration fixture, sampling module cal unit Tektronix part number 067-1338-0X
21. Digital multimeter Four wire ohm meter. <0.25% accuracy for volt Keithley 2000-20
and ohm measurements
22. DC power supply Variable amplitude to ±104 V; accuracy to 0.1% Data Precision 8200
23. Laser transmitter 2.5 Gb/s SONET/SDH laser transmitter JDS Uniphase Model 420B

Performance Tests
Table 4- 1: Equipment Required (cont.)

24. Optical attenuator, variable Single-mode input and output, 0 to 60 dB Tektronix part number OA5002
25. Optical Impulser 1550 nm impulse Calmar FPL-01 Optical Impulser
26. Optical Wavelength Meter 0.001 nm resolution Advantest Q8326
27. Power meter (80E01 only) Power meter Anritsu-Wilton ML2437A
28. Power sensor (80E01 only) Power sensor w/attached cable Anritsu-Wilton ML2425A
29. Power divider 50 Ω, 3 SMA female connectors Tektronix part number 015-0565-00
30. Terminator, cap Shorting, 34 GHz, precision 3.5 mm, female Tektronix part number 011-0150-00
31. Terminator 50 Ω, coaxial terminator, K male Anritsu-Wiltron 28K50
32. Terminator, cap Cap, short circuit 3.5 mm, SMA male Tektronix part number 015-1020-00
33. Synthesized signal generator Signal generator 50 MHz to 50 GHz Anritsu-Wiltron 69187B
34. Sampling module Tektronix 80C02 Sampling Module Tektronix 80C02 Sampling Module
35. Photodetector >1 GHz bandwidth Picometrix P-- 15B
36. Polarization-maintaining fiber Polarization Isolation <-- 24 dB CIRL Model 904P (50/50)
coupler
37. Polarization-maintaining fiber Polarization Isolation <-- 24 dB CIRL Model 904PS (5/95)
coupler
38. PM fiber jumper cable FC/APC and FC/PC connector Tempo-Camarillo part number
2M2L-- 1P5-- 1.5
39. SMA fiber jumper cable FC/APC and FC/PC connector Fiber Instrument Sales, Inc., part
number S3-- 77AS-- 1.5-- FIS
40. Pulse pattern generator >10 Gb/s pulse pattern generator Advantest D3186 12 Gb/s Pulse Pattern
Generator
41. Terminator, cap Cap, 50 Ω, 0.5 W, SMA male Tektronix part number 015-1022-01
42. Real-time oscilloscope 500 MHz bandwidth Tektronix TDS520 or 540
43. Tunable ECL laser (Qty. 2) See Tunable Laser Requirements on page 4-- 161. New Focus tunable ECL lasers (2),
Model 6528-HP or 6538-HP
44. Scalar Network Analyzer (80E06 10 MHz to 50 GHz. Must use specified equipment. Anritsu 54177A
only)
45. SWR Autotester (80E06 only) 10 MHz to 50 GHz. Must use specified equipment. Anritsu 560-- 98V5
46. Reflectometer (80E06 only) 50 GHz to 65 GHz. Must use specified equipment. Oleson R15RFT (specify OML DC
power cable to dual banana plug)
47. Power meter (80E06 only) Must use specified equipment. Agilent E4417A Power Meter
48. Power sensor (80E06 only) 50 MHz to 50 GHz. Must use specified equipment. Agilent 8487A Power Sensor,
2002-- 07-- 31
49. RF Power Detector (80E06 only) 10 MHz - 50 GHz. Must use specified equipment. Anritsu RF Detector, 560-- 7VA50
50. Power sensor (80E06 only) Waveguide Power Sensor. Must use specified Agilent V8486A
equipment.

Performance Tests
Table 4- 1: Equipment Required (cont.)

51. Open/Short (80E06 only) DC to 50 GHz. Must use specified equipment. Anritzu 22V50 Open and Short
52. Adapter (80E06 only) WR15 (Waveguide)-- to-- 1.85 mm male Anritzu 35WR15V
connectors, 50 GHz to 65 GHz. Must use
specified equipment.
53. Adapter (80E06 only) WR15 (Waveguide)-- to-- 1.85 mm female Anritzu 35WR15VF
connectors, 50 GHz to 65 GHz. Must use
specified equipment
54. Waveguide section (80E06 only) Straight Section, 50 GHz - 75 GHz, 4 inch length, Millitech SRW-- 15-- RO400
round flanged. Must use specified equipment.
55. Attenuator (80E06 only) (Qty. 2) 6 dB attenuator, DC to 50 GHz, 2.4 mm Agilent 8490D, option 006
connectors
56. 80E00 Series Extender (2 meter) Special extender cable for use with 80E00 Series Tektronix part number 012-1569-00
modules

Performance Tests
CSA8000/TDS8000 Test Records

This section contains test records that you can use to record the outcome of your
performance verification checks. Because some of the specifications differ,
where applicable, a separate form is provided for both the TDS/CSA8000 and
the TDS/CSA8000B instrument. Four records exist:
H TDS/CSA8000 Main Instrumen: Checks the main frame.
H TDS/CSA8000B Main Instrument: Checks the B version of the main frame.
H 80E00 Electrical Sampling Modules: Checks all supported models of

electrical sampling modules.
H 80C00 Optical Sampling Modules: Checks all supported models of optical
sampling modules.
Do not enter values into these records; rather make copies of the records and
enter test results on the copies.
The test records provide entries for all checks found in the Performance Tests
procedures.

Performance Tests
CSA8000/TDS8000 Main-Instrument Test Record

For each channel tested, photocopy this page, and record the performance test
results for your CSA8000/TDS8000 main-instrument test record.
CSA8000/TDS8000 Test Record Channel:____.
Instrument Model: V CSA8000 V TDS8000

Instrument Serial Number: Certificate Number:
Date of Calibration: Technician:
Performance Test Minimum Incoming Outgoing Maximum

Time interval accuracy, short term optimized mode
Horizontal Position Set to: 19 ns 0.991 ns 1.009 ns
100 ns 0.991 ns 1.009 ns
1 s 0.991 ns 1.009 ns
Time interval accuracy, locked to internal
10 MHz reference mode
100 ns 0.9919 ns 1.0081 ns
1 s 0.9919 ns 1.0081 ns
External direct trigger delay jitter, short term
optimized mode
Horizontal Position Set to: 19 ns none 1.7 ps
100 ns none 2.5 ps
1 s none 11.5 ps
External direct delay jitter, locked to internal
100 ns none 2.5 ps
1 s none 2.6 ps
External prescaled trigger delay jitter, Short term
optimized mode
External prescaled delay jitter, locked to internal 10 MHz
reference mode
DC Calibration Output
Set to: +1.0V +0.9988 V +1.0012 V

0.0V - 0.2 mV +0.2 mV
- 1.0V - 1.0012 V - 0.9988 V

Performance Tests
CSA8000B/TDS8000B Main-Instrument Test Record

For each channel tested, photocopy this page, and record the performance test
results for CSA8000B/TDS8000B main-instrument test record.
CSA8000B/TDS8000B Test Record Channel:____.
Instrument Model: V CSA8000B V TDS8000B

Instrument Serial Number: Certificate Number:

Time interval accuracy, short term optimized mode
100 ns 0.991 ns 1.009 ns
1 s 0.991 ns 1.009 ns
Time interval accuracy, locked to internal
100 ns 0.9919 ns 1.0081 ns
1 s 0.9919 ns 1.0081 ns
External direct trigger delay jitter, short term
optimized mode
100 ns none 2.2 ps
1 s none 11.2 ps
External direct delay jitter, locked to internal
100 ns none 2.5 ps
1 s none 2.5 ps
External prescaled trigger delay jitter, Short term
optimized mode
External prescaled delay jitter, locked to internal 10 MHz
reference mode
Set to: +1.0V +0.9988 V +1.0012 V

0.0V - 0.2 mV +0.2 mV
- 1.0V - 1.0012 V - 0.9988 V

Performance Tests
80E00 Electrical Modules Test Record

Photocopy this and the next three pages, and use them to record the performance
test results for your 80E00 Test Record.
Note that the designations C1 and C2 (channel 1/channel 2) in the test record
may become C3/C4, C5/C6, or C7/CH8, depending on which compartment in
the main instrument the module is installed.
80E00 Test Record
Module Model: V 80E01 V 80E02 V 80E03 V 80E04 V 80E06

Module Serial Number: Certificate Number:

Input Impedance
C1 Impedance 49.5 Ω 50.5 Ω

Baseline (80E04 only) - 1 mV 1 mV
C2 Impedance 49.5 Ω 50.5 Ω
Baseline (80E04 only) - 1 mV 1 mV
DC Voltage accuracy, single point, within 5_C of
compensated temperature
C1 @ 100 mV/diV
Offset: Input level:
- 1100 mV - 1550 mV - 18.7 mV +18.7 mV
- 1100 mV - 1350 mV - 14.7 mV +14.7 mV
- 1100 mV - 1100 mV - 9.7 mV +9.7 mV
- 1100 mV - 850 mV - 14.7 mV +14.7 mV
- 1100 mV - 650 mV - 18.7 mV +18.7 mV
0 mV - 450 mV - 11 mV +11 mV
0 mV - 250 mV - 7 mV +7 mV
0 mV 0 mV - 2 mV +2 mV
0 mV +250 mV - 7 mV +7 mV
0 mV +450 mV - 11 mV +11 mV
+1100 mV +650 mV - 18.7 mV +18.7 mV
+1100 mV +850 mV - 14.7 mV +14.7 mV
+1100 mV +1100 mV - 9.7 mV +9.7 mV
+1100 mV +1350 mV - 14.7 mV +14.7 mV
+1100 mV +1550 mV - 18.7 mV +18.7 mV

Performance Tests
80E00 Test Record (cont.)

C2 @ 100 mV/diV
Offset: Input level:
- 1100 mV - 1550 mV - 18.7 mV +18.7 mV
- 1100 mV - 1350 mV - 14.7 mV +14.7 mV
- 1100 mV - 1100 mV - 9.7 mV +9.7 mV
- 1100 mV - 850 mV - 14.7 mV +14.7 mV
- 1100 mV - 650 mV - 18.7 mV +18.7 mV
0 mV - 450 mV - 11 mV +11 mV
0 mV - 250 mV - 7 mV +7 mV
0 mV 0 mV - 2 mV +2 mV
0 mV +250 mV - 7 mV +7 mV
0 mV +450 mV - 11 mV +11 mV
+1100 mV +650 mV - 18.7 mV +18.7 mV
+1100 mV +850 mV - 14.7 mV +14.7 mV
+1100 mV +1100 mV - 9.7 mV +9.7 mV
+1100 mV +1350 mV - 14.7 mV +14.7 mV
+1100 mV +1550 mV - 18.7 mV +18.7 mV
DC Vertical Voltage deviation from linear least squares fit
C1 Set the Vin:

- 450 mV - 10 mV +10 mV
- 350 mV - 10 mV +10 mV
- 250 mV - 10 mV +10 mV
- 150 mV - 10 mV +10 mV
- 50 mV - 10 mV +10 mV
+50 mV - 10 mV +10 mV
+150 mV - 10 mV +10 mV
+250 mV - 10 mV +10 mV
+350 mV - 10 mV +10 mV
+450 mV - 10 mV +10 mV

Performance Tests

C2 Set the Vin:
- 450 mV - 10 mV +10 mV
- 350 mV - 10 mV +10 mV
- 250 mV - 10 mV +10 mV
- 150 mV - 10 mV +10 mV
- 50 mV - 10 mV +10 mV
+50 mV - 10 mV +10 mV
+150 mV - 10 mV +10 mV
+250 mV - 10 mV +10 mV
+350 mV - 10 mV +10 mV
+450 mV - 10 mV +10 mV
Rise time
80E02 C1 none 28 ps
C2 none 28 ps
80E03 C1 none 17.5 ps
C2 none 17.5 ps
80E041 C1 none 17.5 ps
C2 none 17.5 ps
Analog Bandwidth (80E01)
C1 to 50 GHz
Max power (50 MHz ref) none +3 dB
Min power (50 MHz ref) - 3 dB
C1 to 65 GHz
Max power (50 MHz ref) none +3 dB
Min power (50 MHz ref) - 3 dB

Performance Tests

Random Noise Displayed
80E01 C1 Vert scale: 2 mV none 2.3 mV

80E02 C1 Vert scale: 1 mV none 800 V
C2 Vert scale: 1 mV none 800 V
C2 Vert scale: 1 mV none 1.2 mV
C2 Vert scale: 1 mV none 1.2 mV
TDR system reflected rise time (80E04 models only)
C1 TDR Polarity set to + none 35 ps

TDR Polarity set to - none 35 ps
C2 TDR Polarity set to + none 35 ps
TDR Polarity set to - none 35 ps
TDR system step response aberrations (80E04 models only)
C1 positive polarity
zone: from - 10 ns to - 20 ps2 - 3% +3%
zone: from 400 ps to 5 ns3 - 3% +3%
zone: from 5 ns on3 - 1% +1%
negative polarity
zone: from - 10 ns to - 20 ps2 - 3% +3%

Performance Tests

C2 positive polarity
zone: from - 10 ns to - 20 ps2 - 3% +3%
negative polarity
zone: from - 10 ns to - 20 ps2 - 3% +3%
1 The rise time of the 80E02, 80E03, 80E04, and 80E06 module is computed from the measured rise time. See the
procedure.
2 Before step transition.
3 After step transition.

Performance Tests
80C00 Optical Modules Test Record

Photocopy this and the next three pages, and use them to record the performance
test results for your 80C00 Test Record.
80C00 Test Record
Module Model: V 80C01 V 80C02 V 80C03 V 80C04 V 80C05 V 80C06 V 80C07 V 80C07B
V 80C08 V 80C08B V 80C08C V 80C09 V 80C10 V 80C11
Module Serial Number: Certificate Number:
Temperature: RH %:

Dark level
80C01 C1 at 100 W
OC-12/STM-4 - 10 W +10 W
OC-48/STM-16 - 10 W +10 W
OC-192/STM-64 - 10 W +10 W
12.5 GHz - 10 W +10 W
20 GHz - 10 W +10 W
80C02 C1 at 100 W
OC-192/STM-64 - 10 W +10 W
12.5 GHz - 10 W +10 W
20 GHz - 10 W +10 W
30 GHz - 10 W +10 W
80C03 C1 at 5
W FC1063 - 500 nW +500 nW
GBE - 500 nW +500 nW
OC-48/STM-16 - 500 nW +500 nW
80C04 C1 at 100 W
OC-192/STM-64 - 10 W +10 W
FEC10664 - 10 W +10 W
20 GHz - 10 W +10 W
30 GHz - 10 W +10 W
80C05 C1 at 100 W
OC-12/STM-4 - 10 W +10 W
20 GHz - 30 W +30 W
30 GHz - 30 W +30 W
40 GHz - 30 W +30 W
80C06 C1 at 200 W 50 GHz - 25 W +25 W
80C07 C1 at 5
W OC-3/STM-1 - 500 nW +500 nW
OC-12/STM-4 - 500 nW +500 nW
OC-48/STM-16 - 500 nW +500 nW

Performance Tests
80C00 Test Record (cont.)

80C07B C1 at 5
W OC-3/STM-1 - 500 nW +500 nW
OC-12/STM-4 - 500 nW +500 nW
OC-48/STM-16 - 500 nW +500 nW
FC1063 - 500 nW +500 nW
FC2125 - 500 nW +500 nW
ENET1250 - 500 nW +500 nW
ENET2500 - 500 nW +500 nW
INFINIBAND - 500 nW +500 nW
2.5 GHz - 500 nW +500 nW
80C08 C1 at 1
W 10 GHz - 1.0 W +1.0 W
10GBASE-W - 1.0 W +1.0 W
10GBASE-R - 1.0 W +1.0 W
80C08B C1 at 1
W 10 GHz - 1.0 W +1.0 W
10GBASE-W - 1.0 W +1.0 W
10GBASE-R - 1.0 W +1.0 W
OC-192/STM-64 - 1.0 W +1.0 W
10GFC - 1.0 W +1.0 W
80C08C C1 at 1
W 10 GHz - 1.0 W +1.0 W
10GBASE-W - 1.0 W +1.0 W
10GBASE-R - 1.0 W +1.0 W
OC-192/STM-64 - 1.0 W +1.0 W
10GFC - 1.0 W +1.0 W
10GBE FEC - 1.0 W +1.0 W
80C09 C1 at 100 W
OC-192/STM-64 - 10 W +10 W
10.71 Gb/s - 10 W +10 W
20 GHz - 10 W +10 W
30 GHz - 10 W +10 W
80C10 C1 at 25 W
OC-768/STM-256 - 25 W +25 W
1550 nm FEC43.02 Gb/s - 25 W +25 W
30 GHz - 25 W +25 W
65 GHz - 25 W +25 W
80C10 C1 at 35 W
OC-768/STM-256 - 35 W +35 W
1310 nm FEC43.02 Gb/s - 35 W +35 W
30 GHz - 35 W +35 W
65 GHz - 35 W +35 W

Performance Tests

80C11 C1 at at 100
W OC-192/STM-64 - 10 W +10 W
10.66 Gb/s - 10 W +10 W
10.71 Gb/s - 10 W +10 W
10Gbase-W - 10 W +10 W
10Gbase-R - 10 W +10 W
10GBE FEC - 10 W +10 W
10GFC - 10 W +10 W
20 GHz - 10 W +10 W
30 GHz - 10 W +10 W
Vertical equivalent optical noise
80C01 C1 at 100 W
OC-12/STM-4 none 12 Wrms
Clock Recovery none 15 Wrms
12.5 GHz none 12 Wrms
20 GHz none 25 Wrms
80C02 C1 at 100 W
12.5 GHz none 10 Wrms
20 GHz none 15 Wrms
30 GHz none 30 Wrms
80C03 C1 at 5
W FC1063 none 1.0 Wrms
Clock Recovery none 1.0 Wrms
GBE none 1.0 Wrms
OC-48/STM-16 none 1.5 Wrms

Performance Tests

80C04 C1 at 100 W
OC-- 192/STM-64 none 10 Wrms
FEC10664 none 10 Wrms
20 GHz none 15 Wrms
30 GHz none 30 Wrms
80C05 C1 at 100 W
20 GHz none 25 Wrms
30 GHz none 35 Wrms
40 GHz none 70 Wrms
80C06 C1 at 200 W
50 GHz none 192 Wrms
80C07 C1 at 5
W OC-3/STM-1 none 1.0 Wrms

Performance Tests

80C07B C1 at 5
W 1310 nm OC-3/STM-1 none 1.0 Wrms
FC1063 none 1.0 Wrms
ENET1250 none 1.0 Wrms
INFINIBAND none 1.5 Wrms
2.5 GHz none 1.5 Wrms
80C07B C1 at 5

Performance Tests

80C07B C1 at 5
80C07B C1 at 5

Performance Tests

80C08 C1 at 5
W 1310 nm 10 GHz none 3.0 Wrms
10GBASE-W none 3.0 Wrms
10GBASE-R none 3.0 Wrms
1550 nm 10 GHz none 3.0 Wrms
Clock Recovery none 3.5Wrms
Clock Recovery none 3.5Wrms

Performance Tests

80C08B C1 at 5
10GFC none 3.0 Wrms
10GFC none 3.0 Wrms
10GFC none 5.0 Wrms

Performance Tests

10GFC none 6.0 Wrms
80C08C C1 at 5
10GFC none 3.0 Wrms
10GBE FEC none 3.0 Wrms
10.66 Gb/s none 3.0 Wrms

Performance Tests

10GFC none 3.0 Wrms
10GFC none 5.0 Wrms

Performance Tests

10GFC none 6.0 Wrms
80C09 C1 at 10 W
FEC10712 none 10 Wrms
20 GHz none 15 Wrms
30 GHz none 30 Wrms
80C10 C1 at 25 W
1550 nm OC-768/STM-256 none 60 Wrms
43.02 Gb/s FEC none 60 Wrms
30 GHz none 50 Wrms
1310 nm OC-768/STM-256 none 110 Wrms
43.02 Gb/s FEC none 110 Wrms
30 GHz none 90 Wrms

Performance Tests

80C11 C1 at 10 W
20 GHz none 14 Wrms
30 GHz none 30 Wrms
Minimum Optical bandwidth
80C01 Bandwidth Setting:

g 20 GHz 20 GHz none
12.5 GHz 12.5 GHz none
20 GHz 20 GHz none
>12.5 GHz 12.5 GHz none
20 GHz 20 GHz none
30 GHz 30 GHz none
20 GHz 20 GHz none
80C07 Bandwidth Setting: 2 GHz 2.3 GHz none
80C07B Bandwidth Setting: 2.5 GHz 2.3 GHz none
80C08 Bandwidth Setting: 10 GHz 9.5 GHz none
80C08B Bandwidth Setting: 10 GHz 9.5 GHz none
80C08C Bandwidth Setting: 10 GHz 9.5 GHz none
20 GHz 20 GHz none
30 GHz 30 GHz none
30 GHz 28 GHz none

Performance Tests

OC-3/STM-1 155 Mb/s Reference Receiver setting frequency
response (80C07 and 80C07B modules only)
Frequency (MHz): 0.000 Nominal response (dB) 0.00 - 0.50 0.50
23.3 - 0.11 - 0.61 0.39
46.65 - 0.45 - 0.95 0.05
69.98 - 1.02 - 1.52 - 0.52
93.3 - 1.86 - 2.36 - 1.36
116.7 - 3.00 - 3.50 - 2.50
140.0 - 4.51 - 5.67 - 3.35
155.5 - 5.71 - 7.25 - 4.17
163.3 - 6.37 - 8.08 - 4.66
186.6 - 8.54 - 10.74 - 6.35
209.9 - 10.93 - 13.55 - 8.31
233.3 - 13.41 - 16.41 - 10.41
OC-12/STM-4 622 Mb/s Reference Receiver setting frequency
response (80C01, 80C07 and 80C07B modules only)
93.3 - 0.11 - 0.61 0.39
186.6 - 0.45 - 0.95 0.05
279.9 - 1.02 - 1.52 - 0.52
373.2 - 1.86 - 2.36 - 1.36
466.7 - 3.00 - 3.50 - 2.50
559.9 - 4.51 - 5.67 - 3.35
622.1 - 5.71 - 7.25 - 4.17
653.2 - 6.37 - 8.08 - 4.66
746.5 - 8.54 - 10.74 - 6.35
839.8 - 10.93 - 13.55 - 8.31
933.1 - 13.41 - 16.41 - 10.41

Performance Tests

OC48/STM-16 2.488 Gb/s Reference Receiver setting frequency
response (80C01, 80C03, 80C07, and 80C07B modules only)
373.3 - 0.11 - 0.61 0.39
746.5 - 0.45 - 0.95 0.05
1119.7 - 1.02 - 1.52 - 0.52
1493.1 - 1.86 - 2.36 - 1.36
1866.3 - 3.00 - 3.50 - 2.50
2239.5 - 4.51 - 5.67 - 3.35
2488.3 - 5.71 - 7.25 - 4.17
2612.8 - 6.37 - 8.08 - 4.66
2986.0 - 8.54 - 10.74 - 6.35
3359.3 - 10.93 - 13.55 - 8.31
3732.6 - 13.41 - 16.41 - 10.41
OC192/STM-64 9.953 Gb/s Reference Receiver setting frequency
response (80C01, 80C02, 80C04, 80C05, 80C08B, 80C08C,
80C09, and 80C11 modules only)
1493.2 - 0.11 - 0.96 +0.74
2986.0 - 0.45 - 1.30 +0.40
4478.8 - 1.02 - 1.87 +0.17
5972.4 - 1.86 - 2.71 - 1.01
7465.0 - 3.00 - 3.86 - 2.16
8958.0 - 4.51 - 6.19 - 2.83
9953.28 - 5.71 - 7.87 - 3.55
10451.2 - 6.37 - 8.75 - 3.99
11944.0 - 8.54 - 11.53 - 5.56
13437.2 - 10.93 - 14.45 - 7.41
14930.4 - 13.41 - 17.41 - 9.41

Performance Tests

OC768/STM-256 39.813 Gb/s Reference Receiver setting
frequency response (80C10 module only)
Frequency (MHz): 0.000 Nominal response (dB) 0.00 - 1.00 +0.50
5.97 - 0.10 - 1.10 +0.40
11.94 - 0.45 - 1.45 +0.05
17.92 - 1.02 - 2.02 - 0.52
23.89 - 1.86 - 2.86 - 1.36
29.86 - 3.00 - 4.00 - 2.50
35.83 - 4.51 - 5.96 - 3.33
39.81 - 5.71 - 7.42 - 4.15
41.80 - 6.37 - 8.20 - 4.62
44.79 - 7.42 - 9.42 - 5.42
47.78 - 8.54 - 11.22 - 5.87
53.75 - 10.93 - 14.83 - 7.03
59.72 - 13.41 - 18.41 - 8.41
FEC43.02 Gb/s G.709 FEC Reference Receiver setting frequency
response (80C10 module only)
Frequency (MHz): 0.000 Nominal response (dB) 0.00 - 1.00 +0.50
6.45 - 0.10 - 1.10 +0.40
12.90 - 0.45 - 1.45 +0.05
19.36 - 1.02 - 2.02 - 0.52
25.81 - 1.86 - 2.86 - 1.36
32.26 - 3.00 - 4.00 - 2.50
38.71 - 4.51 - 5.96 - 3.33
43.02 - 5.71 - 7.42 - 4.15
45.17 - 6.37 - 8.20 - 4.62
48.40 - 7.42 - 9.42 - 5.42
51.63 - 8.54 - 11.22 - 5.87
58.08 - 10.93 - 14.83 - 7.03
64.53 - 13.41 - 18.41 - 8.41

Performance Tests

10.66 Reference Receiver setting frequency response (80C04 and
80C11 modules only)
1599.8 - 0.11 - 0.96 +0.74
3199.2 - 0.45 - 1.30 +0.40
4798.6 - 1.02 - 1.87 +0.17
6398.9 - 1.86 - 2.71 - 1.01
7998.0 - 3.00 - 3.86 - 2.16
9597.7 - 4.51 - 6.19 - 2.83
10664.0 - 5.71 - 7.87 - 3.55
11197.5 - 6.37 - 8.75 - 3.99
12796.9 - 8.54 - 11.53 - 5.56
14396.7 - 10.93 - 14.45 - 7.41
15996.5 - 13.41 - 17.41 - 9.41
ENET2500 (2 GBE) 2.50 Gb/s Reference Receiver setting
frequency response (80C03 and 80C07B modules only)
375 - 0.11 - 0.61 0.39
750 - 0.45 - 0.95 0.05
1125 - 1.02 - 1.52 - 0.52
1500 - 1.86 - 2.36 - 1.36
1875 - 3.00 - 3.50 - 2.50
2250 - 4.51 - 5.67 - 3.35
2500 - 5.71 - 7.25 - 4.17
2625 - 6.37 - 8.08 - 4.66
3000 - 8.54 - 10.74 - 6.35
3375 - 10.93 - 13.55 - 8.31
3750 - 13.41 - 16.41 - 10.41

Performance Tests

ENET1250 (GBE) 1.25 Gb/s Reference Receiver setting
frequency response (80C03 and 80C07B modules only)
187.5 - 0.11 - 0.61 0.39
375 - 0.45 - 0.95 0.05
562.5 - 1.02 - 1.52 - 0.52
750 - 1.86 - 2.36 - 1.36
937.5 - 3.00 - 3.50 - 2.50
1125 - 4.51 - 5.67 - 3.35
1250 - 5.71 - 7.25 - 4.17
1312.5 - 6.37 - 8.08 - 4.66
1500 - 8.54 - 10.74 - 6.35
1687.5 - 10.93 - 13.55 - 8.31
1875 - 13.41 - 16.41 - 10.41
FC1063 (1.0625 Gb/s) Reference Receiver setting frequency
response (80C03 and 80C07B modules only)
159.5 - 0.11 - 0.61 0.39
318.9 - 0.45 - 0.95 0.05
478.4 - 1.02 - 1.52 - 0.52
637.9 - 1.86 - 2.36 - 1.36
797.4 - 3.00 - 3.50 - 2.50
956.8 - 4.51 - 5.67 - 3.35
1063 - 5.71 - 7.25 - 4.17
1116 - 6.37 - 8.08 - 4.66
1275 - 8.54 - 10.74 - 6.35
1435 - 10.93 - 13.55 - 8.31
1595 - 13.41 - 16.41 - 10.41

Performance Tests

FC2125 (2.125 Gb/s) Reference Receiver setting frequency
response (80C07B module only)
318.8 - 0.11 - 0.61 0.39
637.5 - 0.45 - 0.95 0.05
956.3 - 1.02 - 1.52 - 0.52
1275 - 1.86 - 2.36 - 1.36
1594 - 3.00 - 3.50 - 2.50
1913 - 4.51 - 5.67 - 3.35
2125 - 5.71 - 7.25 - 4.17
2231 - 6.37 - 8.08 - 4.66
2550 - 8.54 - 10.74 - 6.35
2869 - 10.93 - 13.55 - 8.31
3188 - 13.41 - 16.41 - 10.41
10.71 Gb/s Reference Receiver setting frequency response
(80C09 and 80C11 modules only)
1606.6 - 0.11 - 0.96 +0.74
3212.8 - 0.45 - 1.30 +0.40
4819.0 - 1.02 - 1.87 +0.17
6426.0 - 1.86 - 2.71 - 1.01
8032.0 - 3.00 - 3.86 - 2.16
9638.4 - 4.51 - 6.19 - 2.83
10709.2 - 5.71 - 7.87 - 3.55
11245.0 - 6.37 - 8.75 - 3.99
12851.1 - 8.54 - 11.53 - 5.56
14457.7 - 10.93 - 14.45 - 7.41
16064.4 - 13.41 - 17.41 - 9.41

Performance Tests

10BASE-W ((9.95328 Gb/s) Reference Receiver setting frequency
response (80C08, 80C08B, 80C08C, and 80C11 modules only)
10BASE-R (10.3125 Gb/s) Reference Receiver setting frequency
response (80C08, 80C08B, 80C08C, and 80C11 modules only)
10GBE FEC (11.0957 Gb/s) Reference Receiver setting frequency
response (80C08C and 80C11 modules only)
10GFC (10.51875 Gb/s) Reference Receiver setting frequency
response (80C08B, 80C08C, and 80C11 modules only)
10.66 Gb/s Data Filter (80C08C module only)
10.709 Gb/s Data Filter (80C08C module only)
1500 - 0.11 - 0.96 +0.74
3000 - 0.45 - 1.30 +0.40
4500 - 1.02 - 1.87 +0.17
6000 - 1.86 - 2.71 - 1.01
7500 - 3.00 - 3.86 - 2.16
9000 - 4.51 - 6.19 - 2.83
10000 - 5.71 - 7.87 - 3.55
10500 - 6.37 - 8.75 - 3.99
12000 - 8.54 - 11.53 - 5.56
13500 - 10.93 - 14.45 - 7.41
15000 - 13.41 - 17.41 - 9.41

Performance Tests

Recovered clock timing jitter
80C01-CR Rate: OC-12 Horz Scale: 500 ps none 8 ps RMS

Rate: OC-48 Horz Scale: 100 ps none 8 ps RMS
80C03-CR Rate: FC-1063 Horz Scale: 200 ps none 8 ps RMS
Rate: GBE Horz Scale: 200 ps none 8 ps RMS
Rate: 2.5 GB/s Horz Scale: 100 ps none 8 ps RMS
80C07-CR Rate: OC-3 Horz Scale: 1 ns none 32 ps RMS
80C07B-CR OC-3/STM-1 Horz Scale: 1 ns none 32 ps RMS
OC-12/STM-4 Horz Scale: 500 ps none 8 ps RMS
OC-48/STM-16 Horz Scale: 100 ps none 4 ps RMS
FC1063 Horz Scale: 200 ps none 8 ps RMS
FC2125 Horz Scale: 100 ps none 6 ps RMS
ENET1250 Horz Scale: 200 ps none 8 ps RMS
ENET2500 Horz Scale: 100 ps none 4 ps RMS
INFINIBAND Horz Scale: 100 ps none 4 ps RMS
Rate: 10GBASE-W Horz Scale: 20 ps none 2 ps RMS
Rate: 10GBASE-R Horz Scale: 20 ps none 2 ps RMS
80C08B-CR1 Rate: OC-192 Horz Scale: 20 ps none 2 ps RMS
80C08B-CR2 Rate: 10GBASE-R Horz Scale: 20 ps none 2 ps RMS
Rate: 10GFC Horz Scale: 20 ps none 2 ps RMS
80C08C-CR1 Rate: OC-192 Horz Scale: 20 ps none 2 ps RMS
80C08C-CR2 Rate: 10GBASE-R Horz Scale: 20 ps none 2 ps RMS
Rate: 10GFC Horz Scale: 20 ps none 2 ps RMS
80C09-CR1 Rate: OC-192 Horz Scale: 20 ps none 2 ps RMS
Rate: FEC10.71 Gb/s Horz Scale: 20 ps none 2 ps RMS

Performance Tests

Rate: 10Gb FEC Horz Scale: 20 ps none 2 ps RMS
Rate: G.709 FEC Horz Scale: 20 ps none 2 ps RMS
Aberrations (peak to peak)
80C05 Filter or Bandwidth 40 GHz none 15%

30 GHz none 10%
20 GHz none 10%
OC-192 none 5%
80C06 Bandwidth 50 GHz none 10%
80C10 Filter or Bandwidth OC-768 none 5%
FEC 43.02 Gb/s none 5%
30 GHz none 5%
65 GHz none 10%

Main Instrument
These procedures check those characteristics that relate to the main instrument
(system) that are listed as checked under System in Specifications. Refer to
Table 1--1 on page 1--1.
Prerequisites
Be sure you have performed the Prerequisites on page 4--30 before doing any
procedures in this section.
NOTE. Use a torque wrench when connecting the terminators, adapters,

attenuator, and power sensor in this setup. Use 8 0.3 inch pounds of torque.
NOTE. To perform the External direct trigger delay jitter, short-term optimized
and locked to internal 10 MHz reference modes procedure you must upgrade to
product software version 1.2.43 or higher. (Upgrade 1.2.43 is available as a
download). You can determine the software version of the instrument under test
by selecting About TDS/CSA8000 in the Help menu on screen. For upgrade
information see “Contacting Tektronix” on page xxi.
STOP. Throughout these procedures, when steps call for the display of setup
dialog boxes, you can display them from the Setup menu in the menu bar at the
top of the screen. These procedures assume you will display and dismiss the
setup dialog boxes as needed.
STOP. The procedures that follow contain instructions based on the menus and

Main Instrument
Time Interval Accuracy, Short- Term Optimized and Locked-to-Internal 10-MHz

Reference Modes
Equipment required Synthesized signal generator (Item 33)

0.5 meter precision SMA cable (Item 17)
Power divider (Item 29)
80E0X sampling module
Prerequisites As listed under Prerequisites on page 4-- 30.
Setup Install the test hookup:

1. Install the 80E0X module into the left-most small module compartment of
the TDS8000 or CSA8000 instrument (see Figure 4--16 on page 4--64).
2. Connect the synthesized signal generator to a 1.0 meter cable.
3. Connect the remaining end of the 1.0 meter cable to a 50 Ω SMA power
divider. Connect two 0.5 meter cables to the two remaining SMA power
divider connectors.
4. Connect one of the 0.5 meter cables to Channel 1 of the 80E0X module.
Connect the remaining 0.5 meter cable to the TRIGGER DIRECT INPUT.
CSA8000/TDS8000
Synthesized signal generator
Channel 1
1.0 Meter precision cable

RF output
TRIGGER
0.5 Meter precision cables DIRECT
INPUT
Power divider
Figure 4- 16: Time interval accuracy test hookup
5. Set the synthesized signal generator frequency to 1 GHz.

Main Instrument
6. Set the Synthesized output to 800 mV peak to peak (400 mV displayed)

7. Set up the CSA8000/TDS8000 as follows:
a. Select Default Setup from the Utilities menu on the menu bar at top of
display.
b. Select C1 from the Waveform Selector menu on the controls bar at the
bottom of the display (left corner).
c. In the Trig Setup dialog box:
H select External Direct.
H select Metastability Reject.
H select Auto Mode.
d. In the Vert Setup dialog box:
H set Scale to 100 mV/division.
H set Offset to 0.
e. In the Horz Setup dialog box:
H set Scale to 200 ps/division.

H set Horizontal Reference to 0%.
H set Position to 19 ns.
H set All Timebases Mode to Short Term Jitter.
f. In the Acq Setup dialog box, set Acquisition Mode to Average.
Test Follow this procedure to make the time interval accuracy check:
1. In the Meas Setup dialog box:
a. select Meas 1, check On, and make sure the Source 1 button is selected.
b. make sure both the channel under test and Pulse are selected in the
Source tab, and then choose Select Meas > Pulse -- Amplitude >
Amplitude.
c. select Meas 2, check On, and make sure the Source 1 button is selected.
d. make sure both the channel under test and Pulse are selected in the
Source tab, and then choose Select Meas > Pulse -- Timing > Period.
2. Adjust the synthesizer signal generator level until the amplitude measure-
ment readout on the instrument screen indicates the amplitude is 400 mV.

Main Instrument
3. Verify the period measurement readout indicates the period is 1 ns 9 ps.

4. In the Horz Setup dialog box, set All Timebases Mode to Lock to Int.
10 MHz.
5. Verify the period measurement readout indicates the period is 1 ns 8.1 ps.
6. In the Horz Setup dialog box: set All Timebases Mode to Short Term Jitter.
7. Set the Horizontal Position to 100 ns, and then repeat steps 3 through 6.
8. Set the Horizontal Position to 1s, and then repeat steps 3 through 6.
9. Repeat the setup (from step 7e) and the test for all channels for all 80E00
series modules installed.
End of Procedure

Main Instrument
External Direct Trigger Level Accuracy

These procedures check those characteristics that relate to the system trigger and
are listed as checked under Warranted Characteristics in Specifications. Refer to


the TDS8000 or CSA8000 instrument (see Figure 4--17).
divider connectors.
CSA8000/TDS8000
Channel 1

RF output
TRIGGER
0.5 Meter precision cables DIRECT INPUT
Power divider
Figure 4- 17: External direct trigger test hookup

Main Instrument
5. Set the synthesized signal generator frequency to 2.5 GHz (400 ps period).
6. Set the synthesized output to 1600 mV peak-to-peak (800 mV displayed).

display.
H select Auto Mode.

H set Offset to 0.

Test Follow this procedure to make the direct trigger level accuracy check:
a. Select Meas 1, check On, and make sure the Source 1 button is selected.
b. Make sure both the channel under test and Pulse are selected in the
Source tab.
c. Choose Select Meas > Pulse - Amplitude > Amplitude.

Main Instrument
NOTE. A stable trigger is one that is consistent; that is, one that results in a
uniform, regular display triggered on the selected slope (positive or negative).
This display should not have its trigger point switching between opposite slopes,
nor should it roll across the screen. The following step represents approximately
180° phase shift. Verify that the trigger is operating (stable).
3. Set the slope to negative and verify the trigger is operating and that the
waveform position changes by 184 ps to 216 ps.
4. Set the slope back to positive.
5. In the Trig Setup dialog box:
a. Under Enhanced Triggering, set Metastability Reject to off (unchecked).
Verify that the trigger is operating.
b. Under Enhanced Triggering, set Metastability Reject to on (checked),
and set High Frequency Triggering to on (checked).
Verify that the trigger is operating.
c. Under Level, adjust the trigger level between --100 mV to +100 mV.
Verify the waveform position changes between 25 ps and 40 ps as the
level is changed between +100 mV to --100 mV. (With positive slope,
the waveform shifts to the right.)
End of Procedure
External Direct Trigger Sensitivity



Main Instrument

divider connectors.
CSA8000/TDS8000
Channel 1

RF output
TRIGGER
Power divider
Figure 4- 18: External direct trigger sensitivity test hookup
5. Set the synthesized signal generator frequency to 2.5 GHz (400 ps period).
6. Set the synthesized output to 400 mV peak-to-peak (200 mV displayed)

7. Make the following settings to the CSA8000/TDS8000:
display.


Main Instrument
H select Auto Mode.

H set Offset to 0.

Test Follow this procedure to make the direct trigger sensitivity check:
Amplitude.
c. Select Meas 2, check On, and make sure the Source 1 button is selected.
d. Make sure both the channel under test and Pulse are selected in the
Source tab, and then choose Select Meas > Pulse -- Timing > Frequency.
3. Set the signal generator frequency to 100 MHz.
4. Adjust the Horizontal Scale to allow at least two full periods to be displayed.
5. Verify that the frequency read out on the instrument screen is within 10%
from the true value.
6. Set the signal generator frequency to each of the following values, adjust the
horizontal scale to the corresponding sec/div setting, and repeat
steps 4 and 5:
H 800 MHz at 500 ps/division
H 1 GHz at 500 ps/division
End of Procedure

Main Instrument
External Direct-Trigger Delay Jitter, Short-Term Optimized and

Locked-to-Internal 10-MHz Reference Modes
Table 1--3, page 1--3.


divider connectors.
CSA8000/TDS8000
Channel 1

RF output
TRIGGER
Power divider
Figure 4- 19: External direct trigger jitter test hookup

Main Instrument
5. Set the synthesized signal generator frequency to 2.5 GHz.
6. Set the Synthesized output to 1.6 V peak-to-peak (800 mV peak-to-peak
displayed)

display.
H select Auto Mode.
H set Offset to 0.
H set Record Length to 2000.
H set All Timebase Mode to Short Term Jitter.
Test Follow this procedure to make the direct trigger delay jitter check:
NOTE. To use this procedure you must upgrade to product software ver-
sion 1.2.43 or higher. (Upgrade 1.2.43 is available as a download). You can
determine the software version of the instrument under test by selecting About
TDS/CSA8000 in the Help menu on screen. For upgrade information see
“Contacting Tektronix” on page xxi.

Main Instrument

a. Select Meas 1, and make sure the Source 1 button is selected.
Amplitude.
c. Select Meas 2, and make sure the Source 1 button is selected.

Source tab, and then choose Select Meas > Pulse - Timing > RMS Jitter.
Dismiss any database notification that pops up.
e. Check the Use Wfm Database box in the Source tab.
2. In the Wfm Database dialog box, check Display Database.
NOTE. The CSA8000/TDS8000 will select whichever of the two databases that is
not in use. Turn on Display Database for the database that shows the current
channel in the Source box. Deselect Database On for the other database.
3. Set the Horizontal Scale to 20 ps/division, and position the rising edge until
it goes through the center of the display (where the center horizontal and
vertical graticules cross).
4. Set the Vertical Scale to 5 mV/division.
5. In the Acq Setup dialog box, set Stop After to Condition and set the Number
of Acquisitions to 400. See the CSA8000B & TDS8000B User Manual for
information on setting acquisition modes.
6. Press CLEAR DATA, and then press the RUN/STOP button. The instrument
will acquire 400 acquisitions and stop. This takes a couple of seconds.
7. Verify that the RMS Jitter read out on the instrument screen is less than:
H 8000B instrument: 1.4 ps
H 8000 instrument: 1.7 ps
8. In the Horiz dialog box, set All Timebases Mode to Lock Int. 10 MHz.
9. In the Acq Setup dialog box:
a. Set Stop After to Run/Stop Button Only.
b. Press RUN/STOP until it toggles to green in color. Position the rising
edge until it goes through the center of the display.
c. Set Stop After to Condition.

Main Instrument
10. Press CLEAR DATA, press RUN/STOP, and wait for it to stop.
11. Verify that the RMS Jitter read out is less than 2.5 ps.
12. In the Horizontal Setup dialog box:
a. Set Timebase > Position to 100 ns.

b. Set All Timebases Mode to Short Term Jitter.

15. Verify that the the RMS Jitter read out is less than:
16. In the Horizontal Setup dialog box, set All Timebases Mode to
Lock Int. 10 MHz.

19. Verify that the the RMS Jitter read out is less than 2.5 ps.
20. In the Horizontal Setup dialog box:
a. Set Timebase > Position to 1 s.
b. Set All Timebases Mode to Short Term Jitter.

Main Instrument



24. In the Horizontal Setup dialog box, set All Timebases Mode to
Lock Int. 10 MHz.

28. Repeat the setup (step 7) and the test for all channels for all 80E00 series
modules installed.
29. In Acq Setup dialog box, set Stop After to Run/Stop Button Only when
finished.
End of Procedure

Main Instrument
External Prescaled Trigger Delay Jitter, Short-Term Optimized Mode and

Locked-to-Internal 10-MHz Reference Mode
These procedures check those characteristics that relate to the system timebase
and are listed as checked under Warranted Characteristics in Specifications.
Refer to Table 1--2, page 1--2.


divider connectors.
Connect the remaining 0.5 meter cable to the TRIGGER PRESCALE
INPUT.

Main Instrument
CSA8000/TDS8000
Channel 1

RF output
TRIGGER
0.5 Meter PRESCALE
precision cables INPUT
Power divider
Figure 4- 20: External prescaled test hookup
5. Set the synthesized signal generator frequency to 2.5 GHz.

6. Set the Synthesized output to 1600 mV peak-to-peak (800 mV displayed)
display.
H select External Prescaler.

H select Auto Mode.
H set Offset to 0.



Main Instrument
Test Follow this procedure to make the external prescale check:

Amplitude.
c. Check the Use Wfm Database box in the Source tab.
d. Select Meas 2, check On, and make sure the Source 1 button is selected.
e. Make sure both the channel under test and Pulse are selected in the
Source tab, and then choose Select Meas > Pulse - Timing > RMS Jitter.
Dismiss any database notification that pops up.
f. Check the Use Wfm Database box in the Source tab.
2. In the Wfm Database dialog box, check Display Database.
4. In the Horiz dialog box:
a. Set the Horizontal Scale to 20 ps/division and position the rising edge
until it goes through the center line of the display.
Verify that the the RMS Jitter read out on the instrument screen is less
than:

b. Under All Timebases, set Mode to Lock Int. 10 MHz and position the
rising edge until it goes through the center of the display (crossing of the
center horizontal and vertical graticule).
Verify that the RMS Jitter is less than 2.5 ps.
5. Repeat the setup (step 7) and test for all channels in all 80E00 series
modules installed.
End of Procedure

Main Instrument
External Prescaled Trigger Sensitivity



divider connectors.
CSA8000/TDS8000
Channel 1

RF output
TRIGGER
0.5 Meter PRESCALE
precision cables INPUT
Power divider
Figure 4- 21: External prescaled trigger sensitivity test hookup

Main Instrument
Connect the remaining 0.5 meter cable to the TRIGGER PRESCALE
INPUT.
5. Set the synthesized signal generator frequency to 2 GHz (500 ps period).
6. Set the synthesized output to 1600 mV peak-to-peak (800 mV displayed)

display.
H select External Prescaler.
H select Auto Mode.
H set Offset to 0.
Test Follow this procedure to make the prescaled trigger sensitivity check:
Amplitude.

Main Instrument
Source tab, and then choose Select Meas > Pulse -- Timing > Frequency.
2. Set the signal generator frequency to 2.0 GHz.
ment readout on the instrument screen indicates the amplitude is 800 mV for
the 2 GHz check. For the 3, 5, and 10 GHz checks adjust for 600 mV.
4. Adjust the Horizontal Scale to allow two full periods to be displayed.
5. Verify that the frequency read out on the instrument screen is within 10%
from the true value.
6. Set the signal generator frequency to each of the following frequencies and
the horizontal scale to the corresponding sec/div, and repeat steps 3
through 5:
End of Procedure

Main Instrument
These procedures check those characteristics that relate to the DC calibration
output and are listed as checked under Warranted Characteristics in Specifica-
tions. Refer to Table 1--6, page 1--7. Refer to Table 4--1 on page 4--31 for the
equipment list.
Equipment required Digital multimeter, such as the Keithley 2000-20 (Item 21)
SMA “T” 1 male to 2 SMA female (Item 5)
Cap, 50 Ω, 0.5 W, SMA male (Item 41)
50 Ω, 39.37 in (1.0m), male-to-male SMA connectors (Item 18)
SMA female to BNC male connectors (Item 3)
BNC to banana plug adapter 103-- 0095-- 00 (Item 6)
Prerequisites At least one electrical (80E00 series) sampling module must be
installed as outlined in its user manual.

1. Initialize the instrument: Push the front-panel DEFAULT SETUP button and
click Yes in the confirmation dialog box.
2. Set the Trigger System: In the UI application toolbar, select External Direct
3. Hook up the signal source: Connect the SMA male connector of the
T-connector (Item 5) to the DC CALIBRATION output on the
CSA8000/TDS8000 front panel as shown in Figure 4--22.
4. Connect the SMA 50 Ω terminator (Item 41) to one of the Female legs of the
T-connector.
5. Connect one end of a 50 Ω SMA coax cable (Item 18) to the other leg of the
T-connector.

Main Instrument
6. Connect the other end of the 50 Ω SMA coax cable (Item 18) to to a digital
multimeter (DMM) (Item 21) using a SMA BNC adapter (Item 3) and a
BNC to banana plug adapter (Item 6).
7. Set the multimeter to read DC volts.
CSA8000/TDS8000
DC
CALIBRATION
SMA BNC
output
adapter
Digital multimeter
--
BNC to banana
50 Ω
plug adapter
50 Ω SMA coaxial cable Terminator
T-- connector
Figure 4- 22: Hookup for DC calibration test
Test Follow this procedure to make the DC calibration output check:

1. Set the DC CALIBRATOR OUTPUT:
a. Push the Vertical MENU front-panel button. This displays the Vert Setup
dialog box.
b. Set the amplitude in the DC CAL box to each of the following settings
and record the DMM readings in the test record.
H +1.0 V
H 0.0 V
H --1.0 V
2. Check the readings against the limits in the test records.

3. Push the Vertical MENU front-panel button again to dismiss the Vert Setup
dialog box.
4. Remove the test hookup: Disconnect the cable and connectors and the DMM
from the DC CALIBRATION output.

Electrical Sampling Modules
These procedures check those characteristics that relate to the electrical sampling
modules and are listed as checked specifications. Refer to Table 1--11 on
page 1--13.
Prerequisites
Be sure you have performed the following prerequisites and the Prerequisites on
page 4--30 before doing any procedures in this section.
H Install the 80E0X modules in one of the electrical sampling slots in the
CSA8000 or TDS8000 instrument.
H Check 80E0X module push buttons: Push the select buttons channels 1 and 2
and observe that the yellow indicators lights to Power on. Push them again
and observe that the lights turn off.
NOTE. Use a calibrated torque wrench when connecting the terminators,

adapters, attenuator, and power sensor in this setup. Use 8 0.3 inch pounds of
torque.

Input Impedance
These procedures check those characteristics that relate to the signal acquisition
Equipment required Digital multimeter (Item 21)

Cable, coaxial 50 Ω, 20 in (0.5m), male-to-male SMA (Item 17)
Adapter, SMA female to BNC male connectors (Item 3)
Adapter, BNC to dual banana plugs (Item 4)
Prerequisites As listed on page 4-- 30 and under Prerequisites on page 4-- 85.

2. Connect the Digital multimeter to Channel 1 of the 80E0X module. See
Figure 4--23.
CSA8000/TDS8000
Digital
multimeter
-- +
Channel 1
Figure 4- 23: Input impedance test hookup

a. Select C1 from the Waveform Selector menu on the controls bar at the
b. In the Trig Setup dialog box, select Internal Clock (200 kHz).
c. In the Vert Setup dialog box, set Offset to 0.0 V.

d. In the Horz Setup dialog box:

H set Scale to 2 ns/division.
H set Position to 0 (this will revert to a minimum non-zero value).

e. In the Acq Setup dialog box, set Acquisition Mode to Sample.
Test Follow this procedure to make the input impedance check:

1. Set the Digital multimeter to the ohm mode.
2. Record InputR reading on the Digital multimeter.
3. Reverse polarity and record InputR reading on the Digital multimeter.
4. Check average of InputR and InputR reverse ≤ 50.5 Ω and ≥ 49.5 Ω.
5. 80E04 Only: Set the Digital multimeter to volt mode at the minimum range
(≤ 100 mV).
6. 80E04 Only: Record reading on the Digital multimeter as baseline voltage.
7. 80E04 Only: Check baseline voltage for ≤ 1 mV. Enter value on test
record.
8. Make the following settings, and then repeat steps 1 through 7 to check
channel 2.
a. Select the next channel to test (if any) from the Waveform Selector menu
on the controls bar at the bottom of the display (left corner).
b. In the Vert Setup dialog box, set Offset to 0.0 V.
End of Procedure

DC Voltage Measurement Accuracy

Equipment required Digital Multimeter (Item 21)

DC Power Supply (Item 22)
SMA “T”, male to 2 SMA female (Item 5)
Two 50 Ω, precision coaxial cables, SMA connectors (Item 17)
Adapter, SMA female to BNC male connectors (Item 3)
Adapter, BNC to dual banana plugs (Item 4)
WARNING. Improper operation of the DC Power Supply may create a shock

hazard.
CAUTION. To avoid damage to the electrical module, do not exceed 2 volts input.

1. Perform instrument and module compensation, see Perform the Compensa-
tion on page 4--1.
2. Set the output of a DC power supply to off or 0 volts.
3. Connect a SMA T to Channel 1 of the sampling module.
4. Connect a 50 Ω precision coaxial cable to one side of the SMA T. Connect a
50 Ω precision coaxial cable to the remaining side of the SMA T. See
Figure 4--24.
5. Connect one 50 Ω precision coaxial cable to the output of a DC power

supply through a dual-banana connector. Connect the remaining 50 Ω
precision coaxial cable to a digital multimeter. See Figure 4--24.

CSA8000/TDS8000
Digital
multimeter
DC power supply
-- + -- +
Channel 1
Output
SMA “T” 50 Ω Precision cable
50 Ω Precision cable
Figure 4- 24: Vertical DC accuracy test hookup

b. In the Trig Setup dialog box, set Trigger Source to Internal Clock.
c. In the Acq Setup dialog box:
H set Acquisition Mode to Average, 32 samples.
H under Stop After, check the Condition box, and select Average
Complete from the pull down menu.

e. In the Meas Setup dialog box:

H select Meas 1, check On, and make sure the Source 1 button is
selected.
H make sure both the channel under test and Pulse are selected in the
Mean.
f. In the Vert Setup dialog box:
H set Offset to --1100 mV.
Table 4- 2: DC Voltage measurement accuracy
DC power supply settings Offset settings Accuracy limits

- 1550 mV - 1100 mV ±18.7 mV
- 1350 mV - 1100 mV ±14.7 mV
- 1100 mV - 1100 mV ±9.7 mV
- 850 mV - 1100 mV ±14.7 mV
- 650 mV - 1100 mV ±18.7 mV
- 450 mV 0 mV ±11 mV
- 250 mV 0 mV ±7 mV
0 mV 0 mV ±2 mV
+250 mV 0 mV ±7 mV
+450 mV 0 mV ±11 mV
+650 mV +1100 mV ±18.7 mV
+850 mV +1100 mV ±14.7 mV
+1100 mV +1100 mV ±9.7 mV
+1350 mV +1100 mV ±14.7 mV
+1550 mV +1100 mV ±18.7 mV
Test Follow this procedure to make the Vertical DC accuracy checks:

1. Select the DC supply voltage to the settings listed in Table 4--2, page 4--90.
2. Press the CLEAR DATA button on the front panel.
3. Press the RUN/STOP button on the front panel.

4. Record input voltage reading on the digital multimeter.

5. Record the voltage for the Mean measurement displayed on the

CSA8000/TDS8000 screen.
6. Calculate DC voltage accuracy: error = input V -- meas V.
7. CHECK that the error calculated in step 6 is within the limits listed
Table 4--2 for the associated vertical scale and offset and DC voltage
settings. Enter the value on test record.
8. Repeat steps 1 through 7 until all DC voltage and offset settings, listed in
Table 4--2, are checked for the channel under test.
9. Change all settings in the setup to Channel 2, and then repeat steps 1 through
7 until all DC voltage settings and offset settings, listed in Table 4--2, are
checked.
End of Procedure
Test Follow this procedure to make the DC vertical voltage accuracy, single point,
compensated checks:
The gain of the 80E00 is equal to the slope of a regression line of the paired
measurement readings in Table 4--3, with the Vin values plotted along the x axis,
and the measured values plotted along the Y axis.
Linear least squares fit algorithm:
y=ax +b where
a=(nSxy --Sx Sy ) / (nSxx --Sx ^2)
b=(Sxx Sy --Sxy Sx ) / (nSxx --Sx ^2)
x=abscissa (controlled value)
y=ordinate (measured value)
Sx =Sum(x)
Sxx =Sum(x 2)
Sxy =Sum(xy)
Sy =Sum(y)
n=number of points
b. In the Acq Setup dialog box:

c. In the Vert Setup dialog box:
H set Offset to 0 mV.

d. In the Meas Setup dialog box:

selected.
Mean.
2. Set the Vin = --450 mV.
3. Read DVM measurement and record it in the Input Vin and the x columns,
4. Read mean measurement and record it in the Measured V, mV and y columns,
Table 4--3 .
5. Repeat steps 2-3 for all other Vin.
6. Calculate Sx, Sxx, Sy, and Sxy, for each setting:
a. Copy the Input Vin value to x column.
b. Copy the Measured V, mV value to y column.
c. Calculate x2 and record in x 2 column.
d. Calculate xy and record in xy column.
e. Add the up the x. x 2. y and xy columns and record the sums in the Sx , Sxx ,
Sy and Sxy columns.
7. Calculate a, b.
a. Calculate a = (see algorithm on page 4--91)
b. Calculate b = (see algorithm on page 4--91)
8. Calculate Y = ax+b for all x.

9. Calculate the deviation of Measured V -- Y for all x.

Table 4- 3: Data for calculation of gain and linearity
Input Vin Measured lower upper

Vin mV V, mV x x2 y xy Y = ax+b Deviation limit limit
- 450 - 10 +10
- 350 - 10 +10
- 250 - 10 +10
- 150 - 10 +10
- 50 - 10 +10
50 - 10 +10
150 - 10 +10
250 - 10 +10
350 - 10 +10
450 - 10 +10
- 10 +10
n Sx Sxx Sy Sxy
10. Change all settings in the setup to Channel 2, and then repeat steps 1 through
9 until all DC vertical voltage accuracy, single point, compensated calcula-
tions listed in Table 4--3 on page 4--93 are checked.
End of Procedure

Random Noise, Displayed

Equipment required No external equipment required

Setup No test equipment hook up is required.

b. In the Trig Setup dialog box, set Trigger Source to Internal Clock
(200 kHz).
H set Acquisition Mode to Sample.
H under Stop After, check Condition and select Number of Acquisi-
tions from the pull down menu. Enter 96 for the number of
acquisitions.
H set Record length to 1000 points.

e. In the Vert Setup dialog box:
H set Scale to 2 mV/division if testing with an 80E01 or 80E06

module; set to 1 mV/division for all other modules.
H set Offset to 0 mV.
Test Follow this procedure to make the Random noise checks:

1. WfmDatabase menu, click Display Database, select C1
2. Histogram menu, select vertical, Enable Histogram.

3. Position the right and left side histogram window to the cover all the
horizontal divisions.
4. Position the top histogram window three divisions above the center line.
5. Position the bottom histogram window three divisions below the center line.

8. Record the noise V STD DEV reading.
9. Check noise V for the tested:
H 80E01 ≤ 2.3 mV.
H 80E02 ≤ 800 V.
H 80E03 ≤ 1.2 mV.

H 80E04 ≤ 1.2 mV.
H 80E06≤ 2.4 mV.
10. Repeat steps 1 through 7 for channel 2.
End of Procedure

Rise Time (80E02, 80E03, & 80E04)

Equipment required Step generator (Item 20)

One 50 Ω, precision coaxial cable, SMA connectors (Item 17)

the TDS8000 or CSA8000 instrument. See Figure 4--25.
2. Connect one end of a 50 Ω coaxial cable to the INTERNAL CLOCK
OUTPUT of the CSA8000/TDS8000. Connect the remaining end to the
TRIGGER INPUT of a step generator.
3. Connect the OUTPUT of the Step generator to Channel 1 of the sampling
module. See Figure 4--25. Turn on the step generator.
CSA8000/TDS8000
Step generator
Channel 1
Internal clock output

Step Trigger
generator input
remote head 50 Ω cable
Figure 4- 25: Rise Time hookup

a. Press the DEFAULT Setup button.
bottom of the display (left corner) or press the Channel 1 push button on
the front panel.

c. In the Trig Setup dialog box set Source to Internal Clock (200 kHz).
d. In the Acq Setup dialog box:
H under Stop After, check Condition and select Average Complete

from the pull down menu.
H set Record Length to 2000 points.
H set Scale to 2 s/division.
f. In the Meas Setup dialog box:

selected.
High.
selected.
Low.
selected.
Source tab, and then choose Select Meas > Pulse -- Timing > Rise
Time.
H with Meas 3 selected, turn on (check) Statistics (check box at bottom

of dialog box) and set Weighting to 500.
Test Follow this procedure to make the rise time accuracy checks:
3. Several cycles of a pulsed waveform should be displayed.

4. In the Meas Setup dialog box for Meas3 (Rise):

a. click the HiLo tab.
b. turn off (uncheck) Track High and Track Low.
c. set High to measured High value (in the Measurement box at the right of
the display).
d. set Low to the measured Low value.
e. turn on (check) Annotations. There should be four dashed horizontal
lines, with the top and bottom lines superimposed on the high and low
levels of the waveform, showing that the high and low references are
properly set for rise time measurement.
f. turn off (uncheck) Annotations.

5. In the Acq Setup dialog box, set Stop After to Run/Stop Button Only.
6. Press the CLEAR DATA button.
7. Press the RUN/STOP button to start acquisition.
8. Use the knobs in the front panel HORIZONTAL section to change the Scale
to 10 ps/division, while adjusting the Position to keep the first rising edge of
the step waveform centered on the display.
9. Press CLEAR DATA.
10. After about 20 seconds, note the Mean value of the Rise measurement. This
is T sys, the system rise time which is a combination of the step generator
and the 80E0X module rise times.
11. Calculate T mod , the 80E0X module rise time as follows:
Tmod = T 2sys - T2gen
Where T gen is the step generator rise time.

12. Check that T mod meets the tolerances in Table 4--4.
13. Repeat the Setup and Test sections for Channel 2.
Table 4- 4: Computed rise time
Module T (computed)
80E02 ≤ 28 ps
80E03, 80E04 ≤ 17.5 ps
End of Procedure


Refer to Table 1--12, page 1--14. This check has two procedures that characterizes
the reference signals. The last procedure characterizes the 80E01 sampling
module.

Power meter (Item 27)
Power sensor (Item 28)
Adapter, 2.4mm male-to-male (Item 1)
Adapter, 2.4mm female-to-female (Item 2)
Attenuator,10 dB pad (Item 7)
Cable, special, power/phase stability (Item 16)
Power-Reference Install the test hookup to measure the power reference:

Characterization Setup
1. Connect the 10 dB attenuator to the Synthesized signal generator. Connect

the remaining end to the power sensor. Connect the power sensor to the
power meter. See Figure 4--26 on page 4--100.


Power sensor
w/attached cable
RF output
10dB Attenuator
Power meter
Figure 4- 26: Power-reference hookup
Ref.-Characterization Follow this procedure to characterize the reference signals:

Measurements
1. Set the Synthesized signal generator to 0 dBm.
Table 4- 5: Power reference
Reference Level Reference level with 2.4 mm female to

Frequency dBm adapters dBm female adapter loss dB
50 MHz
4 GHz
8 GHz
12 GHz
16 GHz
20 GHz
24 GHz
28 GHz
32 GHz
36 GHz
40 GHz
44 GHz
48 GHz
50 GHz

2. Set the signal frequency and the power meter frequency to each of the
frequencies listed in the Frequency column, Table 4--5.
3. Record the readings on the power meter in the Reference Level dBm column.
Adapter-Characterization Install the test hookup to characterize the adapter:

Setup
1. Connect the 10 dB attenuator to the Synthesized signal generator. Connect
the remaining end of the cable to the 10dB attenuator. Connect the remaining
end of the 10 dB attenuator to a 2.4 mm female-to-female adapter. Connect
the remaining end of the 2.4 mm female-to-female adapter to the power
sensor. Connect the remaining end of the power sensor to the power meter.
See Figure 4--27 on page 4--101.
RF output
10dB Attenuator
2.4 mm Male-to-male adapter

2.4 mm Female-to-female adapter
Power sensor w/attached cable
Power meter
Figure 4- 27: Adapter characterization hookup
Adapter-Characterization Follow this procedure to characterize the reference level with the adapters:
Measurements
frequencies listed in the Frequency column, Table 4--5 on page 4--100.
2. Record the readings on the power meter in the Reference level with the
adapters dBm column, Table 4--5 on page 4--100.
3. Calculate and record the 2.4 mm female-to-female adapter loss dB in
Table 4--5 on page 4--100 for all frequencies listed as follows:
((Reference level with adapters dBm) -- (Reference level dBm)) /2

Setup Install the test hookup to measure reference signals:
NOTE. Use a torque wrench while connecting the adapters, power sensor in this
setup. Use 8 0.3 inch pounds of torque.
1. Connect the cable to the Synthesized signal generator. Connect the remaining
end of the cable to the 10dB attenuator.
2. Connect the remaining end of the 10 dB attenuator to a 2.4 mm female-to-fe-
male adapter. Connect the remaining end of the 2.4 mm female-to-female
adapter to the power sensor. Connect the remaining end of the power sensor
to the power meter. See Figure 4--28 on page 4--102.
Cable, special, power/phase stability
RF output
10dB Attenuator
Power sensor w/attached cable
Power meter
Figure 4- 28: Measure reference signals
3. Set the synthesized signal generator to +3 dBm.

5. Adjust the RF signal level until the reading on the power meter as close to
--9 dBm as possible.
6. Record the Synthesized signal generator set level reading in the Reference
RF set level dBm column, Table 4--6 on page 4--103.

7. Record the Power meter reading in the Measured RF level dBm column,
8. Calculate and record the Reference RF level in Table 4--6 for all frequencies
listed as follows:
(Measured RF level) -- (2.4mm female-to-female adapter loss dB) column, in
Table 4- 6: DUT (device under test) reference response
Reference Measured
set level RF level Reference 80E01 mea- DUT
Frequency dBm dBm RF level sured level response
50 MHz
4 GHz
8 GHz
12 GHz
16 GHz
20 GHz
24 GHz
28 GHz
32 GHz
36 GHz
40 GHz
44 GHz
48 GHz
50 GHz

80E01 Test Setup Install the test hookup to measure the 80E01 performance:
1. Install the 80E01 module into the left-most small module compartment of
2. Connect one end of the cable to the Synthesized signal generator. Connect
the remaining end of the cable to the 10dB attenuator.
3. Connect the remaining end of the 10 dB attenuator to the 80E01 sampling

module. See Figure 4--29 on page 4--104.
NOTE. Use a torque wrench while connecting the adapters, power sensor in this
setup. Use 8 0.3 inch pounds of torque.
CSA8000/TDS8000
Channel 1
RF output 10dB Attenuator
Cable, special, power/phase stability
Figure 4- 29: 80E01 reference signals hookup
b. In the Trig Setup dialog box set Source to Internal Clock (200 kHz).
H set Acquisition Mode to Envelope.




H set Offset to 0.
Test Follow this procedure for the 80E01 sampling module reference signals:
a. select Meas 1, check On, and make sure the Source 1 button is selected.
b. make sure both the channel under test and Pulse are selected in the
Amplitude.
2. Set the RF signal frequency listed in the Frequency column, Table 4--6 on
page 4--103.
3. Set the RF signal level listed in the Reference Set Level dBm column,
Table 4--6.
4. In the Horz Setup dialog box, set the CSA8000/TDS8000 Horizontal Scale
to (1/Frequency), where Frequency is the RF signal frequency.
5. Press the CLEAR DATA button on the front panel of the
CSA8000/TDS8000.
6. Press the RUN/STOP button on the front panel of the CSA8000/TDS8000.
7. Record amplitude reading readout and use the value as AMPLITUDE (Volts)
in the step that follows.
8. Convert Volts to dBm as follows:

Vp=(AMPLITUDE/2)
Vrms=Vp/SQRT (2)
P1=Vrms*Vrms/50
dBm=10*log(P1/0.001)
9. Record dBm in the 80E01 Measured level column, Table 4--6 on page 4--103.

10. Repeat steps 2 through 9 for all frequencies listed in the Frequency column,
11. Calculate the DUT response as the difference between the 80E01 Measured
level column and the Reference RF level column in Table 4--6 as:
(80E01 Measured level) -- (Reference RF level)
Record the calculation results in the DUT Response column Table 4--6 on
page 4--103.
12. Calculate all frequencies listed in the Frequency column, Table 4--6 on
page 4--103.
13. Find the maximum and minimum power points between the 50 MHz and
50 GHz points in the DUT Response column, Table 4--6 on page 4--103.
14. The maximum power minus the power at 50 MHz should be less than
+3.0 dB. The minimum power minus the power at 50 MHz should be greater
than --3.0 dB. The specification is 3.0 dB referenced to the 50 MHz.
End of Procedure

50 MHz - 50 GHz Analog Bandwidth (80E06)

and that are listed as checked under Warranted Characteristics in Specifications.
This check first characterizes and compensates test equipment, and then
measures and records the power of the reference and the loss due to the adapters
used. At the end, it measures and computes the 80E06 bandwidth response.
NOTE. This procedure checks the lower bandwidth of the 80E06 module. It tests
the 50 MHz to 50 GHz frequencies. The procedure 50 GHz -- 65 GHz Analog
bandwidth on page 4--117 checks the upper bandwidths.
Equipment required Scalar network analyzer (SNA) (Item 44)

SWR Autotester (Item 45)
Power sensor (Item 48)
Power detector (Item 49)
Open/Short (Item 51)
Adapter, 2.4 mm male-to-male (Item 1)
Adapter, 2.4 mm female-to-female (Item 2)
Attenuator,6 dB pad, Qty. 2 (Item 55)
Cable, coaxial, Qty. 2 (Item (Item 17)
Cable, 80E00 Series Extender (Item 56)
SNA & Autotester Do the following steps to store reflected reference levels in the Scalar Network
Characterization Analyzer (SNA):

1. Refer to Figure 4--30 as you perform the following substeps:

a. Connect the RF output of the SNA to the input of the Autotester through
a 50 Ω, cable (Item 21).

b. Connect the reflected SWR output cable of the Auto Tester to Input B of
the SNA.
c. Connect the open end of the Open/Short directly to the DUT port of the
SWR Autotester.
Scalar network analyzer (SNA)
Input B RF output
DUT port Reflected
SWR
Auto
tester
Open and short RF input

(reverse connection when
instructed in step 4)
Figure 4- 30: SNA/Autotester Characterization
2. Set the SNA as follows:

H Output level +1 dBm
H Frequency Multiplier 1 (Default)
H Frequency Span 10 MHz to 50 GHz
H No. of Averages 8
H Channel 1 Off
H Channel 2 Input B
H Channel 2 Meas/ Mode Return Loss

3. Press the Calibration key to calibrate the SNA to the Autotester.
4. Follow the instructions on the SNA screen to complete the calibration.
5. Save the Cal/Setup in Memory Location 1.
6. Disconnect the test equipment from the SNA.

Power-Meter/Power Follow this procedure to zero and calibrate the Power sensor to the Power meter:
Sensor Zero/Cal
1. Before turning on the Power meter, connect the Power sensor to the Power
Ref output of the Power meter. See Figure 4--31.
2. Connect the attached cable end of the Power sensor to the channel input of
the Power meter. See Figure 4--31.
3. Turn on the power meter, and Zero and Cal the Power meter to the Power
sensor. See the user manual that came with your Power meter for Zero and
Cal instructions.
Power sensor
w/attached cable
Power meter
Ch A
Figure 4- 31: Power-reference characterization hookup
Measure the Power In Follow this procedure to measure the power in of each SNA reference signal at
each frequency.
a. Connect the cable end of the Power sensor to the input channel of the
power meter.
b. Connect the Power sensor to the DUT port of the Autotester.
c. Connect the RF output of the SNA to the input of the Autotester through
a cable.
d. Connect the output of the Autotester to Input B of the SNA through a
cable.

Scalar network analyzer (SNA) Power meter
Power sensor Input B Ch A

w/attached cable Reflected RF output
SWR
Auto
tester
RF
input
DUT port
Figure 4- 32: Hookup to measure Power in
2. On the SNA, recall the Setup/Cal from Memory Location 1.

3. Set the SNA Frequency Span to 0 Hz to set the SNA to single frequency
mode.
4. Do all of the following substeps for each frequency listed in the Frequency
column, Table 4--7 on page 4--115:
a. Set the SNA signal frequency and the Power meter frequency to a
frequency listed in the Frequency column.
b. Turn Trace Hold on the SNA to On.
c. Record the reading on the power meter in the Reference Level column.
d. Turn Trace Hold on the SNA to Off.
5. Disconnect the test hookup.
Adapter Characterization Do the following procedure to derive the power loss of the adapters:

a. Connect two 6 dB attenuators together.
b. Connect the Power detector to one end of the attenuators; connect the
cable end of the Power detector to input A.
c. Connect the remaining end of the attenuators to the RF output of the
SNA. See Figure 4--33.

RF output
6 dB Attenuators
Input A
Power detector
Figure 4- 33: No Adapter hookup

H Frequency Multiplier 1
H Frequency Span 0.01 to 50 GHz
H No. of Averages 8
H Channel 2 Off
H Channel 1 Input A
H Channel 2 Meas/ Mode Transmission
3. Press the Calibration key to calibrate the SNA to the Autotester.
4. Follow the instructions on the SNA screen to complete the calibration.
a. Connect the one end of a 2.4 mm male-to-male adapter to one end of a
2.4 mm female-to-female adapter.
b. Install the set of combined adapters between the two 6 dB attenuators as
is shown in the Figure 4--34.

RF output
6 dB Attenuator
Input A 2.4 mm Male-to-male adapter
6 dB Attenuator
Power detector
Figure 4- 34: Adapter- loss hookup
6. Start the SNA measurement as follows:

a. Press select to start measurement
b. Press the Cursor On/Off key to turn on the cursor reading.
c. Set the Frequency Span to 0 Hz.
7. Set the signal frequency of the SNA to each of the frequencies listed in the
Frequency column, Table 4--7 on page 4--115.
8. Read the power loss from the SNA screen and record it for each frequency in
the Adapter Loss column, Table 4--7 on page 4--115.
80E06 HF Setup and Test Do the following procedure to set up and test the 80E06 HF Response.


a. Install the Extender into the leftmost slot of the CSA8000/TDS8000
instrument as shown.
b. Connect the other end of the Extender to the 80E06 to be tested.
c. Connect one end of a 2.4 mm female-to-female adapter to the DUT port
on the Autotester.

d. Connect the remaining end 2.4 mm female-to-female adapter to the input

channel of the 80E06.
e. Connect the RF output of the SNA to the input of the Autotester through
a 50 Ω, cable (Item 56).
CSA8000/TDS8000
Channel 1 Input B
Reflected RF output
DUT port SWR
80E00 Extender Auto
80E06
tester
Cable, special,
RF power/phase
input stability
2.4 mm Male-to-male adapter
Figure 4- 35: 80E06 HF response hookup
f. Connect the Reflected SWR output cable of the Autotester to the Input B
of the SNA.
b. In the Trig Setup dialog box, set Source to Internal Clock (200 kHz).

tions from the pull down menu.
H set the Number of Acquisitions count to 64.


H set set scale to 100 ps/div

H set Scale to 100 mV/division (default)

H set Offset to 0 mV (default)
f. In the Measurements Setup dialog box:
H select Meas1.
H in the Source tab, select Main C1, and select Pulse under Signal
Type.
H click Select Meas, and select Pulse--Amplitude, and then Amplitude,
in the menus that display.
H check the On box next to Meas1.
H Recall the Setup/Cal stored in Memory Location 1.
H Frequency Span 0 Hz, to put it in single frequency mode
4. Perform the following substeps for all frequencies listed in the Frequency
a. Set the SNA signal frequency to the first of the frequencies listed in the
b. In the Horz Setup dialog box, set the CSA8000/TDS8000 Horizontal
Scale to (1/Frequency), where Frequency is the RF signal frequency.
c. Turn Trace Hold on the SNA to On.
d. Press the CLEAR DATA button on the front panel of the

CSA8000/TDS8000.
e. Press the RUN/STOP button on the front panel of the
CSA8000/TDS8000.

f. Record amplitude reading readout and use the value as AMPLITUDE

(Volts) in the substep g. that follows.
g. Convert Volts to dBm as follows:
Vp=(AMPLITUDE/2)
Vrms=Vp/SQRT (2)
P1=Vrms*Vrms/50
dBm=10*log(P1/0.001)
h. Record dBm in the Measured level column, Table 4--7 on page 4--115.
i. Turn Trace Hold on the SNA to Off.
a. Calculate the 80E06 response as the difference between the Measured
level column and the sum of the Reference level column and 1/2 the
Adapter Loss column in Table 4--6 as:
80E06 resp. = (Measured level) -- (Reference level + Adapter Loss/2)
b. Record the calculation results in the 80E06 response column Table 4--7
on page 4--115.
50 GHz points in the 80E06 response column, Table 4--7 on page 4--115.
7. Check that the following statements are true (the specification is 3.0 dB
referenced to the 50 MHz):
H The maximum power minus the power at 50 MHz is less than +3.0 dB.
H The minimum power minus the power at 50 MHz is greater than
--3.0 dB.
Table 4- 7: 80E06 bandwidth response (50 MHz - 50 GHz)
Frequency1 Reference level Adapter loss Measured level 80E06 response

50 MHz
4 GHz
8 GHz
12 GHz
16 GHz
20 GHz

Table 4- 7: 80E06 bandwidth response (50 MHz - 50 GHz) (cont.)
Frequency1 Reference level Adapter loss Measured level 80E06 response

24 GHz
28 GHz
32 GHz
36 GHz
40 GHz
44 GHz
48 GHz
50 GHz
1 Frequencies above 50 GHz for the 80E06 module are tested in the next procedure.
End of Procedure

50 GHz - 65 GHz Analog Bandwidth (80E06)

This procedure checks the upper bandwidth of the 80E06 module. It tests the
>50 GHz to 65 GHz frequencies.
NOTE. This procedure checks the upper bandwidth of the 80E06 module. It tests
the >50 GHz to 65 GHz frequencies. The procedure 50 MHz -- 50 GHz Analog
bandwidth on page 4--107 checks the lower bandwidths.
Equipment required Scalar network analyzer (SNA) (Item 44)

Reflectometer, with OML DC power cable to dual banana plug
(Item 46)
Waveguide power sensor (Item 48)
Waveguide section (Item 54)
Adapter, Wave Guide-to-1.85 mm male (Item 52)
Adapter, Wave Guide-to-1.85 mm female (Item 53)
Cable, coaxial (Item 17)
Cable, BNC (Item 19)
Cable, 80E00 Series Extender (Item 56)
BNC to banana adapter (Item 4)
You must have performed the procedure 50 MHz - 50 GHz Analog
Bandwidth (80E06) on page 4-- 107.
SNA & Reflectometer Do the following steps to store reflected reference levels in the SNA:
Characterization
1. Refer to Figure 4--36 as you perform the following steps:

a. Connect the output of a +12 V power supply to the dual-banana plug end
of the OLM DC power cable.

b. Connect the remaining end of the OLM DC power cable to the +12 V
input of the Reflectometer.
c. Connect the RF output of the SNA to a Wave Guide-to-1.85 mm female
adapter. Connect a 50 Ω, cable from the adapter to the the RF input of
the Reflectometer.
d. Connect the Reflection output of the Reflectometer to Input B of the
SNA through an Aritsu 560--10BX--2 cable.
e. Connect the Ref output of the Reflectometer to External Level input of

the SNA the through a 50 Ω, BNC cable.
f. Connect one end of a Waveguide section to the DUT port of the
Reflectometer.
g. Connect the Waveguide short directly to the remaining end of the
Waveguide.

+ 12 V Power supply
Dual
banana
to BNC
+ - + -
Scalar network analyzer (SNA) RF output
To external level
input on rear panel
Waveguide Input B Waveguide

short DUT port Reflectometer adapter
(female)
(side view)
Reflectometer rear (Out) to

panel connection detail input B
(In) from
Reflection Ref +12 V DC
RF output
To +12 V power
supply To external
In
level input on
rear panel (use
BNC cable)
Input B From RF output
To external level
input on rear panel
Figure 4- 36: SNA/Waveguide Characterization


H Frequency Span 50 GHz to 65 GHz

H No. of Averages 8
H Leveling External
H Channel 1 Off
H Channel 2 Input B
H Channel 2 Meas/ Mode Return Loss
3. Press the Calibration key to start calibrating the SNA to the Reflectometer.
4. Follow the instructions on the SNA screen to complete the calibration, with
the following exception: leave the Waveguide short connected to the
Waveguide section throughout calibration. Ignore the instruction on screen to
connect a Waveguide open.
5. Save the Cal/Setup in Memory Location 2.
6. Leave the test equipment hooked up for use in later steps. You will use it
when you do the steps under Measure the Power In.
Power-Meter/Power Follow this procedure to zero and calibrate the Waveguide power sensor to the
Sensor Zero/Cal Power meter:
1. Connect the Waveguide power sensor to the Power Ref output of the Power
meter. See Figure 4--37.
2. Connect the attached cable end of the Waveguide power sensor to the
channel input of the Power meter. See Figure 4--37.
3. Zero and Cal the Power meter to the Waveguide power sensor.

Waveguide power sensor

w/attached cable
Power meter
Ch B
Figure 4- 37: Power-reference characterization hookup
Measure the Power In Follow this procedure to measure the power in of each SNA reference signal at
each frequency.
a. Start with the test hookup as was left from step 6 on page 4--120.
b. Remove the Waveguide short from the Waveguide section.
c. Connect the Waveguide power sensor directly to the Waveguide section.
d. Connect the attached cable of the Waveguide power sensor to the Ch B
input of the Power meter.

+ 12 V Power supply
Dual
banana
to BNC
+ - + -
To external
level input on
Power meter Scalar network analyzer rear panel
Ch B
Input B RF
DUT port Reflectometer output
Waveguide power sensor
(side view)
Reflectometer rear (Out) to

panel connection detail input B
(In) from
Reflection Ref +12 V DC RF output
To +12 V power
In
To external level
supply
input on rear panel
To external level
input on rear panel
Figure 4- 38: Hookup to measure Power-in

mode.
column, Table 4--7 on page 4--115.
a. Set the SNA signal frequency and the Power meter frequency to each of
the frequencies listed in the Frequency column, Table 4--8 on
page 4--128.
b. In the Horz Setup dialog box, set the CSA8000/TDS8000 Horizontal
Scale to (1/Frequency), where Frequency is the RF signal frequency.

c. Turn Trace Hold on the SNA to On.

d. Record the reading on the power meter in the Reference Level column.
e. Turn Trace Hold on the SNA to Off.
5. Leave the test equipment hooked up for use in the steps under Adapter
Characterization.
Adapter Characterization Do the following procedure to derive the power loss of the adapters:
a. Start with the test hookup as left from step 5 in the last procedure.
b. Disconnect the Waveguide power sensor from the Waveguide section.
c. Connect the 1.85 mm end of a Waveguide-to-1.85 mm female adapter to
the 1.85 mm end of a Waveguide-to-1, 85 mm male adapter.
d. Install the set of combined adapters between the Waveguide power
sensor and the Waveguide section as is shown in Figure 4--39.

+ 12 V Power supply
Dual
banana to
BNC
+ - + -
Solar network To external

Power meter analyzer level input on
rear panel
Ch B Input B
RF
Waveguide DUT port Reflectometer output
adapter (male) (side view)
Waveguide
power sensor
(Out) to
Reflectometer rear
input B
Waveguide panel connection detail
(In) from
adapter Reflection Ref +12 V DC RF output
(female)
To +12 V To external level
In power input on rear panel
supply
To external level
input on rear panel
Figure 4- 39: Adapter- loss hookup
a. Set the signal frequency and the power meter frequency to each of the

c. Read the power loss from the SNA screen, and record it for each
frequency in the Adapter Loss column, Table 4--8 on page 4--128.
d. Turn Trace Hold on the SNA to Off.

3. Disconnect the Waveguide adapters (separating them from each other), the
Waveguide power sensor, and the Power meter from the test hookup. Leave
the remaining of the test hookup intact for use in the next procedure.
80E06 HF Setup and Test Do the following procedure to set up and test the 80E06 HF Response.

attenuator, and Waveguide power sensor in this setup. Use 8 0.3 inch pounds
of torque.

a. Start with the test hookup as left from step 3 in the last procedure.
+ 12 V Power supply
Dual
CSA8000/TDS8000 banana
to BNC
+ - + -
Scalar network To external

analyzer level input on
rear panel
Channel 1 Input B
RF
80E00 Waveguide Reflectometer output
Extender adapter (side view)
(male)
DUT port
Reflectometer (Out) to
80E06 rear panel input B
connection detail (In) from
Reflection Ref +12 V DC RF output
To +12 V To external level
In power input on rear
supply panel

To external level
input on rear panel
Figure 4- 40: 80E06 HF response hookup

b. Install the 80E00 Extender in the leftmost slot of the

CSA8000/TDS8000 instrument.
c. Connect the cable end of the 80E00 Extender to the 80E06 to be tested.
d. Connect the one end of a Waveguide-to-1.85 mm male adapter to the
input channel of the 80E06 to be tested. Connect the other end to the
Waveguide section.
b. In the Trig Setup dialog box, set Source to Internal Clock (200 kHz).

tions from the pull down menu.
H Set the Number of Acquisitions count to 64.

H set set scale to 100 ps/div

H set Scale to 100 mV/division (default)

H set Offset to 0 mV (default)
f. In the Measurements Setup dialog box:
H select Meas1.
H in the Source tab, select Main C1, and select Pulse under Signal
Type.
H click Select Meas, and select Pulse--Amplitude, and then Amplitude,
in the menus that display.
H check the On box next to Meas1.


mode.
a. Set the SNA signal frequency to the first of the frequencies listed in the
c. Press the CLEAR DATA button on the front panel of the
CSA8000/TDS8000.
d. Press the RUN/STOP button on the front panel of the
CSA8000/TDS8000.
e. Record amplitude reading readout and use the value as AMPLITUDE

(Volts) in the substep g. that follows.
f. Convert Volts to dBm as follows:
Vp=(AMPLITUDE/2)
Vrms=Vp/SQRT (2)
P1=Vrms*Vrms/50
dBm=10*log(P1/0.001)
g. Record dBm in the Measured level column, Table 4--8 on page 4--128.
h. Turn Trace Hold on the SNA to Off.
a. Calculate the Adapter Loss as the difference between the Reference level
(with adapters) column and the Reference level (no adapters) column in
Table 4--8:
Adapter Loss = (Ref level with adapters) -- (Ref level no adapters)

b. Record the calculation results in the Adapter Loss column of Table 4--8.
c. Calculate the 80E06 response using the values in the Measured level
column and the Reference level column in Table 4--8 as:
80E06 Response = (Measured level) -- (Ref level with no adapters +

Adapter Loss/2)

80E06 Response = (Measured level) -- (Ref level with adapters +

Adapter
Loss/2) (Measuredlevel) − (Reflevelwithadapters) + (AdapterLoss) ÷ 2
d. Record the calculation results in the 80E06 Response column Table 4--8
on page 4--128.
65 GHz points in the 90E06 Response column, Table 4--8 on page 4--128.
Table 4- 8: 80E06 bandwidth response (55 GHz - 65 GHz)
Reference Reference
level (no level (with Measured 80E06
Frequency adapters) adapters) Adapter loss level response
55 GHz
60 GHz
65 GHz
8. Note the power at 50 MHz calculated as the 80E06 response recorded in

Table 4--7 on page 4--115 of the procedure 50 MHz --50 GHz Analog
bandwidth (80E06). You will use the 50 MHz power in the next step.
9. Find the maximum power and minimum power in the 80E06 response
column of Table 4--8. Check that the following statements are true (the
specification is 3.0 dB referenced to the 50 MHz):
H The maximum power minus the 50 MHz power is less than +3.0 dB.
H The minimum power minus the 50 MHz power is greater than --3.0 dB.
End of Procedure

TDR-System Reflected Rise Time (80E04)

These procedures check those characteristics that relate to the TDR system
(80E04 only) and are listed as checked under Warranted Characteristics in
Specifications. Refer to Table 1--13, page 1--16.
Equipment required Airline (Item 10)

Terminator, cap, shorting (Item 32)

1. Connect a shorting terminator cap to the female connector of the airline. See
Figure 4--41.
2. Connect the airline to channel 1 of the module.
CSA8000/TDS8000
Channel 1
Airline
Shorting cap
Figure 4- 41: TDR reflected rise time hookup
3. Press the DEFAULT SETUP button on the CSA8000/TDS8000 front panel.

a. In the TDR Setup dialog box, click on C1 Preset.
b. There should be a positive pulse, about 1 ns long for a 10 cm airline. The
reflection from the short is located at the falling edge of the pulse. This
is the edge to be measured. Adjust the horizontal position knob to bring
the falling edge to the center vertical graticule.

c. In the Horz Setup dialog box:

H set Scale to 500 ps/division, while using the horizontal position knob
to keep the falling edge centered.
d. In the Acq Setup dialog box:

e. In the Meas Setup dialog box:
H select Meas 1, check On, and make sure Source 1 button is selected.
Source tab, and then choose Select Meas > Pulse -- Timing> Fall
Time.
Test Follow this procedure to make the fall time checks:

1. Press the CLEAR DATA button on the CSA8000/TDS8000 front panel.
2. Press the RUN/STOP button on the CSA8000/TDS8000 front panel.
3. Check that the measured fall time (reflected rise time) is ≤35 ps, for the
positive edge polarity.
4. In the TDR Setup dialog box change C1 polarity to negative edge (pictured
as a falling slope).
NOTE. Since this display is in units of rho (ρ), the waveform will not invert when
the edge polarity is changed, so the waveform will not appear to change
significantly.
5. Press the CLEAR DATA button.

6. Press the RUN/STOP button.
7. Check that the measured fall time (reflected rise time) is ≤35 ps, for the
negative edge polarity.
8. Repeat the Setup and Test sections for channel 2.
End of Procedure

TDR-System Step Response Aberrations (80E04)

These procedures check those characteristics that relate to the TDR system
(80E04 only) and are listed as checked under Warranted Characteristics in
Specifications. Refer to Table 1--13, page 1--16.
Equipment required Terminator, 50 Ω coaxial terminator, K male (Item 31)


1. Install the 80E04 module into the left small module compartment of the
CSA8000/TDS8000.
2. Check the aberrations of channel 1, positive TDR polarity as follows:
3. Connect a 50 Ω coaxial terminator to channel 1. See Figure 4--41.
NOTE. To minimize extraneous aberrations, use the recommended terminator

listed in the above Equipment required table; item 7.
CSA8000/TDS8000
Channel 1 50 Ω
termination
Figure 4- 42: TDR system step response aberrations hookup
4. Press the DEFAULT SETUP button on the CSA8000/TDS8000 front panel.

a. In the TDR Setup dialog box click on C1 Preset.

b. In the Acq Setup dialog box set the Acquisition Mode to Average, 128
samples.

c. In the Horz Setup dialog box:

H set Position to 1 s.

d. In the Meas Setup dialog box:
selected.
Source tab, and then choose Select Meas > Pulse -- Amplitude>
Mean.
e. Record for later use the High measurement value in mρ, making sure to
take down the proper sign. This will be used as HiRef, the high reference
level for aberration measurements. The low reference level is
-1.0 ρ (rho).
Test Follow this procedure to make the aberration checks:

1. Check aberrations in the range of 10 ns to 20 ps before the edge (aberrations
within ±3%.
a. Set the Horizontal Position to 0 (minimum).
b. Change the Horizontal Scale to 50 ps/division while adjusting Horizon-
tal Position to keep the rising edge of the first step waveform on screen.
c. Press the front panel FINE button to turn it on.
d. Adjust the Horizontal Position knob so the waveform crosses the center
vertical graticule at the 10% (amplitude) point of the rising edge. Since
the waveform is 2 major divisions high at 500 mρ/div, the waveform
should be crossing the center vertical graticule at 9 minor divisions
below the center horizontal graticule. This defines the ending reference
point for pre-transition aberration measurements.
e. Press the FINE button to turn it off.

f. In the Meas Setup dialog box:

selected.
Source tab, and then choose Select Meas > Pulse -- Amplitude>
Max.
H select the Region tab.
H set Gate G2 to 46%.
H turn Gates on (check).
g. In the Meas Setup dialog box:
selected.
Source tab, and then choose Select Meas > Pulse -- Amplitude> Min.
H select the Region tab.
H set Gate G2 to 46%.
H set Gates on (check).
h. The Max and Min measurements are now set to include the region of
250 ps to 20 ps before the edge. The aberration specification over this
region is ±3%, which is ±30 mρ for a 1 ρ step. Since the reference is
--1 ρ, the Max and Min values should be within --1.030 to --0.970 ρ to
meet the ±3% specification.
i. Calculate and take down for later use the peak aberrations in percent
using the formulas (with Max and Min in mρ units, not ρ):
H positive aberration (%) = (1000+Max) * 0.1
H negative aberration (%) = (1000+Min) * 0.1
For example: if Max = -989 mρ and Min = -1.003 ρ,

positive aberration (%) = (1000 + (-989)) * 0.1 = +1.1
negative aberration (%) = (1000 + (-1003)) * 0.1 = -0.3
NOTE. The aberration can have either a positive or negative sign. Both
aberrations could have the same sign when the waveform does not cross the
reference line in the region being checked.

j. In the Horz Setup dialog box:

H set Horizontal Scale to 2 ns/division.
k. In the Meas Setup dialog box for Meas2 (Region tab selected), set Gate
G2 to 49%.
l. Select Meas1, set Gate G2 to 49%.
m. The Max and Min measurements are now set to include the region of
10 ns to 200 ps before the edge. As before, the aberration specification
over this region is ±3%, so the Max and Min values should be within
--1.030 to -0.970 ρ.
n. Calculate the peak aberrations in percent using the formulas (with Max
and Min in mρ units, not ρ):
H positive aberration (%) = (1000+Max) * 0.1
H negative aberration (%) = (1000+Min) * 0.1
o. Check that the aberrations for the entire 10 ns to 20 ps region before the
edge (from steps i and n) are within ±3%. If recording data on the Test
Record, enter the largest (positive or negative) value.
2. Check aberrations in the range of 400 ps to 5 ns after the edge (aberrations
within ±3%).
a. Change the Horizontal Scale to 50 ps/division while adjusting Horizon-
tal Position to keep the rising edge of the step waveform centered on the
display.
b. Press the front panel FINE button to turn it on.
c. Adjust the Horizontal Position knob so the waveform crosses the center
vertical graticule at the 90% (amplitude) point of the rising edge. The
waveform should be crossing the center vertical graticule at 1 minor
division below the center horizontal graticule. This defines the beginning
reference for post-transition aberration measurements.
d. Press the front panel FINE button to turn it off.

H set Horizontal Scale to 1 ns/division.

f. In the Meas Setup dialog box, for Meas1:

H Set G1 to 54%.
H Set G2 to 100%.
g. In the Meas Setup dialog box, for Meas2:

H Set G1 to 54%.
H Set G2 to 100%.
h. The Max and Min measurements are now set to include the region of
400 ps to 5 ns after the edge. The aberration specification over this
region is ±3%, which is ±30 mρ for a 1 ρ step. The reference level is
HiRef, from step 5e on page 4--132 of the setup procedure.
i. Calculate the peak aberrations in percent using the formulas (with Max,
Min, and HiRef in mρ, not ρ):
H positive aberration (%) = (Max - HiRef) * 0.1
H negative aberration (%) = (Min - HiRef) * 0.1
For example: if Max = +11 mρ and HiRef = -5 mρ,
positive aberration (%) = (+11 -(-5)) * 0.1 = +1.6
j. Check that the aberrations calculate in step i for the 400 ps to 5 ns region
after the edge are within ±3%. If recording data on the Test Record,
enter the largest (positive or negative) value.
3. Check the range >5 ns after the edge (aberrations within ±1%).
a. Change the Horizontal Scale to 10 ns/division.

b. Adjust Horizontal Position so waveform rising edge is at the second
vertical graticule (assuming that first graticule is the left edge of
display).
c. In the Meas Setup dialog box for Meas2, set Gate G1 to 15%.
d. In the Meas Setup dialog box for Meas1, set Gate G1 to 15%.
e. The Max and Min measurements are now set to include the region of
5 ns to 90 ns after the edge. The aberration specification over this region
is ±1%, which is ±10 mρ for a 1 ρ step. The reference level is HiRef,
from step 5e on page 4--132 of the setup procedure.

f. Calculate the peak aberrations in percent using the formulas (with Max,
Min, and HiRef in mρ, not ρ):
H positive aberration (%) = (Max - HiRef) * 0.1
H negative aberration (%) = (Min - HiRef) * 0.1
g. Check that the aberrations calculated in step f for the region >5 ns after
the edge are within ±1%. If recording data on the Test Record, record
the largest (positive or negative) value.
4. Repeat the Setup and Test procedures for the TDR negative edge polarity. To
do this check, select negative edge polarity after selecting TDR Preset in
Setup step 5a on page 4--131. No other changes to the procedures are needed,
since in rho (ρ) mode the display does not invert when the TDR edge
polarity is changed.
5. Repeat the Setup and Test procedures for channel 2, both polarities.
End of Procedure

Optical Sampling Modules
The following performance verification procedures for the optical sampling

modules check the characteristics that are shown as checked specifications
(n symbol) in Table 1--18 and Table 1--20 of the Optical Modules Specifications
starting on page 1--22.
Be sure you have performed the appropriate Prerequisites on page 4--30 before
doing any procedures in this section.
controls supported by the release versions 1.3 and later of the instrument
Proper operation of the optical sampling modules requires that the appropriate
TDS8000/CSA8000 application software is installed. The versions according to
the specific module are shown in Table 4--9.
Table 4- 9: Application software version required
Modules1 Software version

80C01, 80C02, 80C03 1.0.0 or greater
80C04, 80C04-CR1 1.1.0 or greater
80C04-CR2, 80C05, 80C06 1.2.0 or greater
80C07, 80C08, 80C09 1.3.0 or greater
80C08B, 80C10 1.4.0 or greater
80C07B, 80C08C, 80C11 1.5.0 or greater
1 Applies to all clock recovery options unless noted otherwise.

Dark Level & Vertical Equivalent Optical Noise

This procedure checks the dark level, which is the offset in the optical channel
caused by thermal variations or finite leakage current. This procedure also checks
the vertical equivalent optical noise. The checks are made with vertical offset set
to zero and no optical signal input to the optical sampling module (dustcap
installed on the OPTICAL INPUT).
Equipment required CSA8000/TDS8000

Terminator, 50 Ω coaxial, SMA male (item 31); used with optical
sampling modules with clock recovery (CR)
Prerequisites See page 4-- 30.
Setup Install the test hookup and preset the CSA8000/TDS8000 controls:
1. Install the 80C0X Optical Sampling Module into Channel 1 of the TDS8000
or CSA8000 instrument (see Figure 4--43).
CSA8000/TDS8000
80C0X Optical
sampling module
Figure 4- 43: Dark level and vertical equivalent optical noise test hookup
2. Install the black, fibre-optic dustcap onto the OPTICAL INPUT connector of
the optical sampling module.
3. If the optical sampling module has clock recovery, install 50 Ω terminations
on the outputs.
4. Press the DEFAULT SETUP button on the TDS8000 or CSA8000 front

panel. Click Yes in the dialog box that appears.
5. Select C1 for the waveform source (use the waveform selector button in the
lower left corner of the application display).
6. In the Trig Setup dialog box, select Internal Clock for the Trigger Source.

NOTE. If the Scale, Position, and Channel Offset control boxes are not displayed
in the following step, click the Basic button in the lower left part of the Vert
Setup dialog box.
7. In the Vert Setup dialog box, do the following:

a. Set the Scale to one of the following values:
H 100 W/div for an 80C01, 80C02, 80C04, 80C05, 80C09, and
80C11 Optical Sampling Module
H 5 W/div for an 80C03, 80C07, and 80C07B Optical Sampling

Module
H 200 W/div for an 80C06 and 80C10 Optical Sampling Module
H 1 W/div for an 80C08, 80C08B, and 80C08C Optical Sampling
Module
b. Set Position to 0.0div.
c. Set Channel Offset to 0.0W.
8. In the Horiz Setup dialog box do the following:
a. Set Scale to 1.000 ns/div.
b. Set Record Length to 500.
9. In the Hist Setup dialog box, do the following:
a. Select Main C1 as the Source.
b. Check Enable Histogram.
c. Select Vertical
d. Close the Hist Setup dialog box.
Procedure Follow this procedure to make the Dark Level and Vertical Equivalent Optical
Noise checks:
1. In the Utilities menu, select System Properties. Check that the Mainframe
Current On-Time is greater than 0.33 hours (20 minutes).
NOTE. The values in System Properties dialog box do not update while the
dialog box is open. Close the dialog box and reopen it to get updated values.
2. Close the System Properties dialog box.

3. In the Utilities menu, select Compensation.

4. Make the following selections in the Compensation dialog box:
a. Under Select Action, select Compensate.
b. Select Module.
c. Select Ch1.
5. Click Execute, and then click OK to the message box that appears.
6. Wait until the compensation is completed (hour glass cursor reverts back to
arrow cursor). It is recommended that you store this compensation result in
the module as the Stored User values. To store the compensation results in
the module, do the following procedure:
a. In the Select Action section of the Compensation dialog box, select
Save.
b. In the Storage section, make sure User is selected.
c. Click the Execute button. This saves the compensation results in the
module.
7. Click Close to close the Compensation dialog box.

8. In the Vert Setup dialog box, click the Optical>> button. This displays fields
for setting up the vertical optical parameters.
9. Select a bandwidth or filter in the Vert Setup dialog box.
10. Press the CLEAR DATA button on the TDS8000 or CSA8000 front panel.
NOTE. If the Vert Setup dialog box covers the Histogram statistics readout at the
right side of the display, click in the Setups title bar and drag the dialog box to
the left until you can see the Histogram statistics.
11. After a few seconds, note the Mean and the Std Dev results displayed on the
right side of the display for the selected bandwidth or filter. The mean of the
histogram is the dark level value and the standard deviation of the histogram
is the maximum RMS vertical equivalent optical noise value. Compare these
values to the bandwidth or filter, mean, and standard deviation listed in
Table 4--10 for the optical sampling module that you are testing.
12. Repeat steps 9 through 11 for each bandwidth and filter available for the
optical sampling module. Refer to Table 4--10.

NOTE. The filter and bandwidth settings for the optical sampling module you are
testing are selected from the Filter or Bandwidth control boxes in the Vert Setup
dialog box.
End of Procedure
Table 4- 10: Dark level and vertical equivalent optical noise limits
Vertical equivalent optical

Optical noise
sampling
module Bandwidth or filter Dark level Without CR With CR
80C01 OC-12/STM-4 <10 W <12 WRMS <15 WRMS
OC-48/STM-16 <10 W <12 WRMS <15 WRMS
OC-192/STM-64 <10 W <12 WRMS <15 WRMS
12.5 GHz <10 W <12 WRMS <15 WRMS
20 GHz <10 W <25 WRMS <25 WRMS
12.5 GHz <10 W <10 WRMS <12 WRMS
80C03 FC1063 <500 nW <1 WRMS <1 WRMS
GBE <500 nW <1 WRMS <1 WRMS
OC-48/STM-16/2.5 Gb <500 nW <1.5 WRMS <1.5 WRMS
10.66 <10 W <10 WRMS <12 WRMS
80C06 50 GHz <25 W <192 WRMS <192 WRMS

Table 4- 10: Dark level and vertical equivalent optical noise limits (cont.)

Optical noise
sampling
80C07 2 GHz <500 nW N/A N/A
OC-3/STM-1 <500 nW <1 WRMS <1 WRMS
OC-12/STM-4 <500 nW <1 WRMS <1 WRMS
OC-48/STM-16 <500 nW <1.5 WRMS <1.5 WRMS
80C07B OC-3/STM-1 <500 nW <1 WRMS <1 WRMS
(1310 nm andd
1550 nm) OC-12/STM-4 <500 nW <1 WRMS <1 WRMS
FC1063 <500 nW <1 WRMS <1 WRMS
FC2125 <500 nW <1.5 WRMS <1.5 WRMS
ENET1250 <500 nW <1 WRMS <1 WRMS
ENET2500 <500 nW <1.5 WRMS <1.5 WRMS
INFINIBAND <500 nW <1.5 WRMS <1.5 WRMS
2.5 GHz <500 nW <1.5 WRMS <1.5 WRMS
80C07B OC-3/STM-1 <500 nW <1.6 WRMS <1.6 WRMS
(850 nm))
FC1063 <500 nW <1.6 WRMS <1.6 WRMS
FC2125 <500 nW <2.4 WRMS <2.4 WRMS
ENET1250 <500 nW <1.6 WRMS <1.6 WRMS
ENET2500 <500 nW <2.4 WRMS <2.4 WRMS
2.5 GHz <500 nW <2.4 WRMS <2.4 WRMS


Optical noise
sampling
80C07B OC-3/STM-1 <500 nW <2.0 WRMS <2.0 WRMS
(780 nm))
FC1063 <500 nW <2.0 WRMS <2.0 WRMS
FC2125 <500 nW <3.0 WRMS <3.0 WRMS
ENET1250 <500 nW <2.0 WRMS <2.0 WRMS
ENET2500 <500 nW <3.0 WRMS <3.0 WRMS
2.5 GHz <500 nW <3.0 WRMS <3.0 WRMS
80C08 10GBASE-- W <1 W <3.0 WRMS <3.5 WRMS
(1310 nm andd
1550 nm) 10GBASE-- R <1 W <3.0 WRMS <3.5 WRMS
10 GHz <1 W <3.0 WRMS <3.5 WRMS
(850 nm))
10GBASE-- R <1 W <5.0 WRMS <5.5 WRMS
10 GHz <1 W <5.0 WRMS <5.5 WRMS
(780 nm))
10 GHz <1 W <6.0 WRMS <6.6 WRMS
80C08B 10GBASE-- W <1 W <3.0 WRMS <3.5 WRMS
(1310 nm andd
10 GHz <1 W <3.0 WRMS <3.5 WRMS
OC-192/STM-64 <1 W <3.0 WRMS <3.5 WRMS
10GFC <1 W <3.0 WRMS <3.5 WRMS
(850 nm))
10 GHz <1 W <5.0 WRMS <5.5 WRMS
OC-192/STM-64 <1 W <5.0 WRMS <5.5 WRMS


Optical noise
sampling
(780 nm))
10 GHz <1 W <6.0 WRMS <6.6 WRMS
OC-192/STM-64 <1 W <6.0 WRMS <6.6 WRMS
80C08C 10GBASE-- W <1 W <3.0 WRMS <3.5 WRMS
(1310 nm andd
10 GHz <1 W <3.0 WRMS <3.5 WRMS
OC-192/STM-64 <1 W <3.0 WRMS <3.5 WRMS
10GBE <1 W <3.0 WRMS <3.5 WRMS
10.66 Data Filter <1 W <3.0 WRMS <3.5 WRMS
(850 nm))
10 GHz <1 W <5.0 WRMS <5.5 WRMS
OC-192/STM-64 <1 W <5.0 WRMS <5.5 WRMS
(780 nm))
10 GHz <1 W <6.0 WRMS <6.6 WRMS
OC-192/STM-64 <1 W <6.0 WRMS <6.6 WRMS


Optical noise
sampling
10.71 Gb/s <10 W <10 WRMS <12 WRMS
80C10 OC-768/STM-256 <25 W <60 WRMS n/a
1550 nm
FEC43.0184 Gb/s FEC <25 W <60 WRMS n/a
30 GHz <25 W <50 WRMS n/a
65 GHz <25 W <120 WRMS n/a
80C10 OC-768/STM-256 <35 W <110 WRMS n/a
1310 nm
FEC43.0184 Gb/s FEC <35 W <110 WRMS n/a
30 GHz <35 W <90 WRMS n/a
65 GHz <35 W <220 WRMS n/a
10.66 Gb/s <10 W <8 WRMS <9 WRMS
10.71 Gb/s <10 W <8 WRMS <9 WRMS
10GBASE-W <10 W <8 WRMS <9 WRMS
10GBASE-R <10 W <8 WRMS <9 WRMS
10GBE FEC <10 W <8 WRMS <9 WRMS
10GFC <10 W <8 WRMS <9 WRMS

Minimum Optical Bandwidth & Reference Receiver Frequency Response

Before performing the checks for minimum optical bandwidth and reference
receiver frequency response, you need to have an understanding of what optical
bandwidth is and how it is measured.
Traditionally, the bandwidth of a device or system is defined as the frequency at
which the power out of the same device or system is one half as compared with a
frequency near DC. In the voltage domain, the power dissipated into a resistive
load (for example, a 50 Ω termination of a sampler) is the VRMS2/R where VRMS
is the RMS of the voltage swing seen at the resistive load, and R is the resistance
value. A logarithmic scale using decibels is typically used to describe a
frequency dependent response of a system.
A value expressed in terms of a decibel relative to a reference is defined as:
dB = 10 × log Ꮛreference
value Ꮠ
For electrical bandwidths, the power ratio is used so:
dB = 10 × log ᏋPower
Power
Ꮠ
DC
f
when
Power f
=1
Power DC 2

10 × log 1 = –3 dB
2
In terms of voltage, and resistance, the bandwidth is expressed as:
− 3 dB = 10 ×
 
Vf 2
log  
R
 
VDC 2
R
where Vf is the RMS of the voltage swing response at the bandwidth frequency
and VDC is the RMS voltage swing response at a frequency approaching DC.
Further math yields that Vf = 0.707 ¢VDC. The expression is simplified by the
cancellation of the R and the movement of the squared term inside the log
expression to a multiple outside the log expression:
 
log  = 2 × 10 × log Ꮛ
Vf 2
R
V f
Ꮠ = 20 × log ᏋVV Ꮠ
f
 VDC 2
R
V DC DC

therefore at
Vf
− 3 dB = 0.707
V DC
In the CSA8000 and TDS8000 instruments, the vertical units displayed for an
optical module are not in voltage, but are in watts, which is a unit of power. The
O/E converter inside the module outputs a voltage swing whose amplitude is
linearly dependent on the incoming optical power swing. In this condition the
voltage applied at the electrical sampler already represents Optical Power in its
linear form (as opposed to having to square the voltage and divide by R). For the
optical sampling modules, then, the bandwidth where the displayed optical
power is one half that approaching DC is:
dB = 10 × log ᏋPower
Power
Ꮠ = –3 dB
f
DC
The Vf in such a system is one half (0.5) the VDC as opposed to 0.707. The
optical bandwidth, therefore, corresponds to the traditional electrical bandwidth
at --6 dB. During testing of optical modules via impulse testing, the resulting
impulse waveform is converted to frequency via Fourier transform, and the
bandwidth is defined as:
− 3 dB = 10 × log Ꮛvertical swing @ frequency

vertical swing @ DC
Ꮠ
This definition is used for 2.3 GHz, 2.5 GHz, 12.5 GHz, 20 GHz, 30 GHz,
40 GHz, 50 GHz and 65 GHz bandwidth settings.
During reference receiver curve calculation, however, the definition is changed to
match the industry standard definition, which was authored assuming electrical
bandwidths where:
− 3 dB = 20 × log Ꮛvertical swing @ frequency

vertical swing @ DC
Ꮠ
This definition is used for all NRZ reference receiver settings in all the modules.

80C01- 80C09 and 80C11 This procedure checks the minimum optical bandwidths and the reference
Procedure receiver frequency responses of all 80C0X Optical Sampling Module except the
80C10. To test the minimum optical bandwidths and the reference receiver
frequency response of 80C10 module, skip to 80C10 Procedure on page 4--161.
NOTE. To optimize performance, make sure that all connections are clean and
secure and that all components of the system are in good condition. Optical fiber
can gradually degrade the system performance as it is repeatedly flexed over
time.
Equipment required Tektronix CSA8000/TDS8000

Calmar FPL-01 optical impulser (item 25)
Tektronix OA5002 variable optical attenuator (item 24)
Single-mode fiber-optic cable, 2 m, FC to FC connectors (item 13)
Optical attenuator, 10 dB, FC-FC, female-male connectors (item 9)
Cable, coaxial, 1 m, male to male SMA connectors (item 18)
Prerequisites See page 4-- 30
Before performing this procedure, be sure you have completed the Dark level &
Vertical Equivalent Optical Noise procedure on page 4--138.
NOTE. Because of interpolation errors in the FFT calculation of the impulse

response, the 80C06 module is not tested like the other modules in this section.
Instead, we integrate the impulse response to generate a step and then measure
the 10% to 90% risetime of this step response. For the 80C06, go to the
Integrated Rise Time and Aberrations Check on page 4--168.
Setup Install the test hookup (see Figure 4--44) and preset the CSA8000/TDS8000
controls:
or CSA8000 instrument.

GPIB cable
CSA8000/TDS8000
80C0X Controller
Rear
trigger
Optical impulse generator Variable optical attenuator
OPTICAL OPTICAL OPTICAL

10dB Optical OUTPUT INPUT
INPUT OUTPUT TRIGGER
attenuator DIRECT
DIRECT
Fiber-optic cable Fiber-optic cable
50 Ω Coaxial cable
Figure 4- 44: Minimum optical bandwidth and reference receiver frequency response hookup
2. Connect the 10 dB optical attenuator to the output of the optical impulse

generator.
3. Connect a fiber-optic cable between the 10 dB optical attenuator and the
input of the OA5002 variable optical attenuator.
4. Connect a fiber-optic cable between the output of the variable optical

attenuator and the OPTICAL INPUT of the optical sampling module.
5. Connect a 50 Ω coaxial cable from the rear trigger (SYN) on the optical
impulse generator to the TRIGGER DIRECT input on the TDS8000 or
CSA8000.
6. Start with about 30 dB of attenuation on the variable attenuator.
NOTE. To avoid dispersing the narrow optical impulse signal, keep all fiber
lengths as short as possible. Lengths that are 2 to 3 meters long are acceptable.
7. Press the SELECT ON/OFF button on the 80C0X Optical Sampling Module
so that the adjacent indicator lights. This turns on Channel 1 (C1) on the
80C0X-CR Optical Sampling Module.
8. In the Setup menu, select Acquire and make the following changes in the
Acq Setup dialog box:
a. Select Average as the acquisition mode.

b. Set the number of samples to 64 Samples

9. In the Trig Setup dialog box, do the following:

a. Select External Direct for the trigger source.
b. Select Auto for Mode.
c. Select the rising edge for Slope.

d. Click the Set to 50% button to set the trigger point midway on the rising
signal.
10. In the Horiz Setup dialog box, do the following;
a. Set the Scale to 1.000 ns/div. (This setting will make it easier to initially
locate the optical pulse later in the procedure.)
b. Set the Position to 18.000 ns. (This setting will make it easier to locate
the first optical pulse later in the procedure.)
c. Set the Record Length to 2000.
11. In the Disp Setup dialog box, do the following:

a. In the Style section, select Normal.
b. Check Show Vectors.
in the following step, click the Basic>> button in the lower left part of the Vert
Setup dialog box.
12. In the Vert Setup dialog box, do the the following:

a. Set the Scale to 500.0 W/div or a lower setting if 500.0 W is not
available.
b. Set Position to 0.0 div.

c. Set Channel Offset to 0.0 W.
d. Click the Optical>> button in the lower left part of the Vert Setup dialog
box.
e. Set Wavelength to 1550 nm.

f. Set the Bandwidth or Filter to the highest bandwidth setting available for
the optical sampling module that you are testing:
H 80C01 Filter to None Bandwidth to 20.000 GHz

H 80C03 Filter to None Bandwidth 2 GHz


H 80C07B Filter to None Bandwidth to 2.5 GHz
H 80C08B Filter to None Bandwidth to 10.000 GHz

H 80C08C Filter to None Bandwidth to 10.000 GHz
g. Position the cursor in the title bar of the Setups dialog box and drag the
box to the right side of the display.
13. Use the Horizontal POSITION control to position the impulse at the first
horizontal division. (This ensures that post-impulse aberrations are included
in the record.) See Figure 4--45.
14. Adjust the attenuation of the variable optical attenuator as follows:
H If you are testing an 80C01, 80C02, 80C04, 80C09, or 80C11 Optical
Sampling Module, adjust it until it produces an impulse pulse amplitude
of 1.5 mWp-p to 2.5 mWp-p.
H If you are testing an 80C03, 80C07, 80C07B, 80C08, 80C08B, or
80C08C Optical Sampling Module, adjust the attenuator until a
200 Wp-p pulse amplitude is achieved.
H If you are testing an 80C05 optical sampling module, adjust the
attenuator until a 10 mW p-p pulse amplitude is achieved.
Procedure Follow this procedure to make the minimum optical bandwidth and reference
receiver frequency response checks:
NOTE. The minimum optical bandwidth is not checked for the 80C03 Optical
Sampling Module. If testing this module, go to step 10 in this procedure and
continue with this procedure to check the reference receiver frequency responses.
1. Use the Horizontal POSITION control to position the impulse at the first
horizontal division. (This ensures that post-impulse aberrations are included
in the record.) See Figure 4--45.

You may experience signal jitter if you try to display a signal that is not the
first impulse and is late in relation to time zero.
2. Adjust the Horizontal SCALE control so that the width of the impulse at its
base is approximately 1/4 to 3/4 of a horizontal division on the display. See
Figure 4--45.
NOTE. If the width of the impulse is much greater than 3/4 of a horizontal
division, the resulting Fourier transform will not have enough frequency
resolution; if the width is much smaller than 1/4 of a horizontal division, the
amount of samples that fall on the impulse may be too coarse, resulting in
quantum errors in the resulting Fourier transform.
Figure 4- 45: Proper positioning of the impulse for optimum curve download

3. Using a controller (such as a PC, Macintosh, or workstation) attached to the

TDS8000 or CSA8000 instrument via GPIB, download the waveform.
NOTE. Alternatively, you can use the Save Waveform, Copy Waveform, or a
network connection to transfer a waveform curve to a spreadsheet, ASCII file, or
other application. Refer to the CSA8000 Communications Signal Analyzer &
TDS8000 Digital Sampling Oscilloscope User Manual for more information
about these methods of transferring waveform data.
4. Using the available controller software, such as Labview, perform a Fourier

Transform on the waveform; this transforms the time-domain impulse
response to a scalar frequency response.
5. Normalize the Fourier Transform result such that DC or low frequency is
0 dB.
6. Plot the frequency response.
7. Check that the optical sampling module meets the performance requirements
for the bandwidth setting chosen.
8. Repeat steps 1 through 7 for the remaining bandwidth settings for the optical
module under test (refer to Table 4--11 for the settings that match the module
model).
Table 4- 11: Minimum optical bandwidth limits
Optical sampling module Bandwidth setting Bandwidth limit

80C01 20 GHz >20 GHz
12.5 GHz >12.5 GHz
80C02 30 GHz >28 GHz
20 GHz >20 GHz
12.5 GHz >12.5 GHz
80C04 30 GHz >28 GHz
20 GHz >20 GHz
80C05 40 GHz >40 GHz
30 GHz >30 GHz
20 GHz >20 GHz
80C07 2.0 GHz >2.3 GHz
80C07B 2.5 GHz >2.3 GHz
80C08 10.0 GHz >9.5 GHz
80C08B 10.0 GHz >9.5 GHz

Table 4- 11: Minimum optical bandwidth limits (cont.)
Optical sampling module Bandwidth setting Bandwidth limit

80C08C 10.0 GHz >9.5 GHz
80C09 30 GHz >28 GHz
20 GHz >20 GHz
80C11 30 GHz >28 GHz
20 GHz >20 GHz
9. In the Vert Setup dialog box, select a Filter (see the Table 4--12 for filters
available for the various optical sampling modules).
10. Do steps 1 through 6.
11. Refer to Table 4--12 and check that the optical sampling module meets the
limits listed for the tested filter.
12. Repeat steps 9 through 11 for each of the filters available for the optical
sampling module that you are testing.
End of Procedure

Table 4- 12: Reference receiver frequency response limits
Optical
sampling module Filter Limits
80C07, 80C07B OC-3/STM-1 (MHz) (dB)
0.000 - 0.50 0.00 0.50
23.33 - 0.61 - 0.11 0.39
46.65 - 0.95 - 0.45 0.05
69.98 - 1.52 - 1.02 - 0.52
93.30 - 2.36 - 1.86 - 1.36
116.7 - 3.50 - 3.00 - 2.50
140.0 - 5.67 - 4.51 - 3.35
155.5 - 7.25 - 5.71 - 4.17
163.3 - 8.08 - 6.37 - 4.66
186.6 - 10.74 - 8.54 - 6.35
209.9 - 13.55 - 10.93 - 8.31
233.3 - 16.41 - 13.41 - 10.41
80C01, 80C07, OC-12/STM-4 (MHz) (dB)
80C07B Frequency Lower Nominal Upper
0.000 - 0.50 0.00 +0.50
93.3 - 0.61 - 0.11 +0.39
186.6 - 0.95 - 0.45 +0.05
279.9 - 1.52 - 1.02 - 0.52
373.2 - 2.36 - 1.86 - 1.36
466.7 - 3.50 - 3.00 - 2.50
559.9 - 5.67 - 4.51 - 3.35
622.1 - 7.25 - 5.71 - 4.17
653.2 - 8.08 - 6.37 - 4.66
746.5 - 10.74 - 8.54 - 6.35
839.8 - 13.55 - 10.93 - 8.31
933.1 - 16.41 - 13.41 - 10.41
80C01, 80C03, OC-48/STM-16 (MHz) (dB)
80C07, 80C07B Frequency Lower Nominal Upper
0.000 - 0.50 0.00 +0.50
373.3 - 0.61 - 0.11 +0.39
746.5 - 0.95 - 0.45 +0.05
1119.7 - 1.52 - 1.02 - 0.52
1493.1 - 2.36 - 1.86 - 1.36
1866.3 - 3.50 - 3.00 - 2.50
2239.5 - 5.67 - 4.51 - 3.35
2488.3 - 7.25 - 5.71 - 4.17
2612.8 - 8.08 - 6.37 - 4.66
2986.0 - 10.74 - 8.54 - 6.35
3359.3 - 13.55 - 10.93 - 8.31
3732.6 - 16.41 - 13.41 - 10.41

Table 4- 12: Reference receiver frequency response limits (cont.)
Optical
80C01, 80C02, OC-192/STM-64 (MHz) (dB)
80C04, 80C05, Frequency Lower Nominal Upper
80C08B, 80C08C, 0.000 - 0.85 0.00 +0.85
80C09, 80C11 1493.2 - 0.96 - 0.11 +0.74
2986.0 - 1.30 - 0.45 +0.40
4478.8 - 1.87 - 1.02 - 0.17
5972.4 - 2.71 - 1.86 - 1.01
7465.0 - 3.86 - 3.00 - 2.16
8958.0 - 6.19 - 4.51 - 2.83
9953.28 - 7.87 - 5.71 - 3.55
10451.2 - 8.75 - 6.37 - 3.99
11944.0 - 11.53 - 8.54 - 5.56
13437.2 - 14.45 - 10.93 - 7.41
14930.4 - 17.41 - 13.41 - 9.41
80C04, 80C11 10.66 (MHz) (dB)
0.000 - 0.85 0.00 +0.85
1599.8 - 0.96 - 0.11 +0.74
3199.2 - 1.30 - 0.45 +0.40
4798.6 - 1.87 - 1.02 +0.17
6398.9 - 2.71 - 1.86 - 1.01
7998.0 - 3.86 - 3.00 - 2.16
9597.7 - 6.19 - 4.51 - 2.83
10664.0 - 7.87 - 5.71 - 3.55
11197.5 - 8.75 - 6.37 - 3.99
12796.9 - 11.53 - 8.54 - 5.56
14396.7 - 14.45 - 10.93 - 7.41
15996.5 - 17.41 - 13.41 - 9.41
80C03, 80C07B ENET2500 (2 GBE) (MHz) (dB)
2.50 Gb/s Frequency Lower Nominal upper
0.000 - 0.50 0.00 +0.50
375 - 0.61 - 0.11 +0.39
750 - 0.95 - 0.45 +0.05
1125 - 1.52 - 1.02 - 0.52
1500 - 2.36 - 1.86 - 1.36
1875 - 3.50 - 3.00 - 2.50
2250 - 5.67 - 4.51 - 3.35
2500 - 7.25 - 5.71 - 4.17
2625 - 8.08 - 6.37 - 4.66
3000 - 10.74 - 8.54 - 6.35
3375 - 13.55 - 10.93 - 8.31
3750 - 16.41 - 13.41 - 10.41

Optical
80C03, 80C07B ENET1250 (GBE) (MHz) (dB)
1.25 Gb/s Frequency Lower Nominal Upper
0.000 - 0.50 0.00 +0.50
187.5 - 0.61 - 0.11 +0.39
375 - 0.95 - 0.45 +0.05
562.5 - 1.52 - 1.02 - 0.52
750 - 2.36 - 1.86 - 1.36
937.5 - 3.50 - 3.00 - 2.50
1125 - 5.67 - 4.51 - 3.35
1250 - 7.25 - 5.71 - 4.17
1312.5 - 8.08 - 6.37 - 4.66
1500 - 10.74 - 8.54 - 6.35
1687.5 - 13.55 - 10.93 - 8.31
1875 - 16.41 - 13.41 - 10.41
80C03, 80C07B FC1063 (MHz) (dB)
0.000 - 0.50 0.00 +0.50
159.5 - 0.61 - 0.11 +0.39
318.9 - 0.95 - 0.45 +0.05
478.4 - 1.52 - 1.02 - 0.52
637.9 - 2.36 - 1.86 - 1.36
797.4 - 3.50 - 3.00 - 2.50
956.8 - 5.67 - 4.51 - 3.35
1063 - 7.25 - 5.71 - 4.17
1116 - 8.08 - 6.37 - 4.66
1275 - 10.74 - 8.54 - 6.35
1435 - 13.55 - 10.93 - 8.31
1595 - 16.41 - 13.41 - 10.41
80C07B FC2125 (MHz) (dB)
0.000 - 0.50 0.00 0.50
318.8 - 0.61 - 0.11 0.39
637.5 - 0.95 - 0.45 0.05
956.3 - 1.52 - 1.02 - 0.52
1275 - 2.36 - 1.86 - 1.36
1594 - 3.50 - 3.00 - 2.50
1913 - 5.67 - 4.51 - 3.35
2125 - 7.25 - 5.71 - 4.17
2231 - 8.08 - 6.37 - 4.66
2550 - 10.74 - 8.54 - 6.35
2869 - 13.55 - 10.93 - 8.31
3188 - 16.41 - 13.41 - 10.41

Optical
80C09, 80C11 10.71 Gb/s (MHz) (dB)
0.000 - 0.85 0.00 +0.85
1606.6 - 0.96 - 0.11 +0.74
3212.8 - 1.30 - 0.45 +0.40
4819.0 - 1.87 - 1.02 - 0.17
6426.0 - 2.71 - 1.86 - 1.01
8032.0 - 3.86 - 3.00 - 2.16
9638.4 - 6.19 - 4.51 - 2.83
10709.2 - 7.87 - 5.71 - 3.55
11245.0 - 8.75 - 6.37 - 3.99
12851.1 - 11.53 - 8.54 - 5.56
14457.7 - 14.45 - 10.93 - 7.41
16064.4 - 17.41 - 13.41 - 9.41
80C08, 80C08B, 10GBASE-W (MHz) (dB)
80C08C, 80C11 Frequency Lower Nominal Upper
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41
80C08, 80C08B, 10GBASE-R (MHz) (dB)
80C08C, 80C11 Frequency Lower Nominal upper
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41

Optical
80C08C, 80C11 10GBE (MHz) (dB)
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41
80C08B, 80C08C, 10GFC (MHz) (dB)
80C11 Frequency Lower Nominal Upper
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41

Optical
80C08C 10.66 Data Filter (MHz) (dB)
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41
80C08C 10.709 Data Filter (MHz) (dB)
0.000 - 0.85 0.00 +0.85
1500 - 0.96 - 0.11 +0.74
3000 - 1.30 - 0.45 +0.40
4500 - 1.87 - 1.02 - 0.17
6000 - 2.71 - 1.86 - 1.01
7500 - 3.86 - 3.00 - 2.16
9000 - 6.19 - 4.51 - 2.83
10000 - 7.87 - 5.71 - 3.55
10500 - 8.75 - 6.37 - 3.99
12000 - 11.53 - 8.54 - 5.56
13500 - 14.45 - 10.93 - 7.41
15000 - 17.41 - 13.41 - 9.41

80C10 Procedure This procedure checks the minimum optical bandwidths and the reference
receiver frequency responses of the 80C10 Optical Sampling Module only. To
test bandwidths and responses minimum of all other optical sampling modules,
skip this procedure and do the 80C01--80C09 and 80C11 Procedure on
page 4--148 instead.
Equipment required Tektronix CSA8000B/TDS8000B

Tunable ECL lasers (Qty. 2) (Item 43) See Tunable Laser Require-
ments, below
Wavelength meter (Item 26)
Polarization Maintaining fiber coupler (50/50) (Item 36)
Polarization Maintaining tap coupler (90/10) (Item 37)
PM fiber jumper cable (FC/APC and FC/PC connector) (Item 38)
SMA fiber jumper cable (FC/APC and FC/PC connector) (Item 39)
Tektronix 500 MHz real-time scope (Item 42)
Photodetector, >1GHz bandwidth (Item 35)
Prerequisites See page 4-- 30.
Tunable Laser The lasers used for this test meet the following requirements:
Requirements
H The lasers must be a tunable External Cavity Laser (ECLs), which has a
narrow linewidth and high side-mode suppression ratio (>50 dB) that result
in single frequency emission.
H The lasers must have an absolute wavelength accuracy of <1 pm, where the
wavelength of the sweep laser is measured during the sweep using a high
precision optical wavelength meter1. The sweep laser must be mode-hop free
over the sweep range.
H The lasers must be matched to each other for polarization and power, in
order to achieve near 100% modulation. For example:
H align the axis of polarization of the two lasers at the input to the module
under test with an extinction ratio of > 20 dB. To do so, use lasers with
Polarization-Maintaining (PM) output fibers and use PM fibers and PM
components in the entire setup.
H adjust the power of the lasers to be equal at the input to the module
under test. See step 7.
1 For the optical wavelength meter, the relative accuracy and display resolution must be 1 pm
(wavelengths are vacuum values).

Setup Install the test hookups, and preset the CSA8000/TDS8000 controls:
1. Install the 80C10 Optical Sampling Module into Channel 1 of the TDS8000
or CSA8000 series instrument.
Wavelength meter Real-- time scope (or RF

spectrum analyzer)
PM splitter
Laser 1
∆f GPIB
O/E
f 1 = f 2 + ∆f
Laser 2 CSA8000/TDS8000
f2
λ = 1.55 m PM coupler
80C10 Sampling
module under test
GPIB
GPIB
Figure 4- 46: Hookup for heterodyne test
2. Make sure the module under test is properly compensated. See Perform the
Compensation on page 4--5.
time.
3. Connect a PM fiber--optic cable between the OPTICAL output of the Laser 1

and the PM splitter. Connect the input of the PM splitter to the OPTICAL
output of laser 1.
4. Connect the 5% output of the PM splitter to the wavelength meter; connect
the other output of the PM splitter to the PM coupler.
5. Connect a PM fiber--optic cable between the OPTICAL output of the Laser 2
and the PM coupler. Connect the second input of the PM coupler to the
OPTICAL output of laser 2.

6. Connect one output of the PM coupler to the O/E converter on the real--time
scope or RF spectrum analyzer; connect the other output of the PM coupler
to the 80C10 module in the CSA8000B.
7. Verify the following settings on both Laser 1 and Laser 2:
H Instantaneous Laser linewidth: < 300 kHz.
H Side-mode suppression ratio: > 50 dB.

H Power stability is < 0.025 dB during the duration of sweep and over
wavelength range of sweep. This needs to be verified before continuing
this procedure. If the lasers do not meet this specification, apply
correction values (see note).
NOTE. If lasers do not meet power stability or sweep flatness requirement:

H In performing steps 3 and 4 on page 4--165, at each frequency point
(including the DC reference point) record the mean value from the histogram
statistics: mi
H The corrected normalized response values (dB) are calculated using (also
see the equation in step 6b on page 4--166):
ᏋᎩ
R
f i = 10· log
σ i 2 − σ b 2 m0
·
σ 0 2 − σ b 2 mi
Ꮠ
H Adjust the power of each laser so that the powers are equal and so that
average input to the module under test is 1.75 -- 2 mW (this setting
results in a modulation amplitude of 7 -- 8 mW).
8. Press the DEFAULT SETUP button on the TDS8000 or CSA8000 front
panel. Click Yes in the dialog box that appears.
9. Select C1 for the waveform source (use the waveform selector button in the
lower left corner of the application display).
10. In the Trig Setup dialog box, select Internal Clock for the Trigger Source.
Use the default 200 kHz setting.
11. Set the Acq Mode to Sample in the instrument tool bar.
in the following step, click the Basic button in the lower left corner of the Vert
Setup dialog box.

12. In the Vert Setup dialog box, do the following steps, use the default settings.
13. In the Horiz Setup dialog box, set the Scale to 1.000 ns/div.
14. In the Hist Setup dialog box, do the following steps:
a. Select Main C1 as the Source.

b. Check Enable Histogram.
c. Select Vertical (limits are 0-100%).
d. Close the Hist Setup dialog box.

e. See the setup illustration in Figure 4--47 on page 4--164.
Figure 4- 47: Setup used for Heterodyne sweep
Test Follow this procedure to test the 80C10:
NOTE. The values in System Properties dialog box do not update while the
dialog box is open. Close the dialog box and reopen it to get updated values.

1. Set lasers to the DC starting point at (1550 nm):

a. Adjust laser wavelengths to within 0.5 pm of each other by monitoring
the beat note directly on the real-time scope. See Figure 4--46 on
page 4--162.
b. Adjust laser wavelengths until the beat frequency is <65 MHz, and
record the frequency fDC. This is the DC reference point.
2. For Vertical scale:

a. Set the vertical position to zero.
b. Record the mean and peak-to-peak value from the histogram statistics.
c. Set vertical offset to the mean value.

d. Adjust the vertical scale so that the peak-to-peak amplitude covers about
95% of the vertical range.
3. Record DC reference values (see note in the setup on page 4--163):
a. Press Clear Data.
b. Acquire a histogram with 250,000 hits.
c. Record the standard deviation from the histogram statistics: σ0.
d. Record the wavelength of the sweep laser: λ0.
4. Perform the frequency sweep to at least 1.5 x bandwidth. The recommended
frequency step size is 1 GHz (≅ 8 pm laser step size). For each frequency
point, perform the following steps (see note in the setup on page 4--163):
a. Step to and park sweep laser at next wavelength.
b. Allow the laser to stabilize.
c. Press Clear Data.

d. Acquire a histogram with 250,000 hits.
e. Record the standard deviation from the histogram statistics: σi
f. Record the wavelength of the sweep laser: λi
5. Record background standard deviation (due to laser and sampling module
noise).
a. Set laser detuning to ≥750 GHz.
b. Clear the data.

c. Acquire a histogram with 250,000 hits.

d. Record the standard deviation from the histogram statistics: σb
6. Calculate the normalized frequency response curve:
a. The frequency values are given by:
Ꮛ Ꮠ
f i = c· 1 − 1 + fDC
λi λ0
where c=2.9979 x 108 m/s (vacuum speed of light)
b. The corresponding response values (dB) normalized to the lowest

frequency point (=“DC”) are given by:
ᏋᎩ
R(f i) = 10· log
σi 2 − σ b 2
σ0 2 − σ b 2
Ꮠ
7. Check that the optical bandwidth is greater than or equal to that stated below
for each bandwidth setting.
a. The optical bandwidth is determined by the frequency point where the
response curve crosses the --3 dB line. The limits follow:
Bandwidth setting Bandwidth limit

30 GHz >30 GHz
65 GHz >60 GHz
You select the bandwidth settings for the module under test from the
Bandwidth control box in the Vert Setup dialog box.
b. For Optical Reference Receivers the frequency response curves and
Bessel--Thompson tolerances are plotted on an electrical power scale
(20log) by convention. In this case, the response values given in 6b)
have to be multiplied by a factor of 2.
8. In the Vert Setup dialog box, select a Filter using the Filter control (see
Table 4--13 for filters available).
9. Perform steps 1 through 6.

10. Refer to Table 4--13 and check that the optical sampling module meets the
limits listed for the tested filter.
11. Repeat steps 9 through 11 for each of the filters available for the 80C10
module.

Table 4- 13: Reference receiver frequency response limits
Reference receiver Frequency response limits

OC768/STM-256 (MHz) (dB)
39.813 Gb/s Frequency Lower Nominal Upper
0.000 - 1.00 0.00 +0.50
5.97 - 1.10 - 0.10 +0.40
11.94 - 1.45 - 0.45 +0.05
17.92 - 2.02 - 1.02 - 0.52
23.89 - 2.86 - 1.86 - 1.36
29.86 - 4.00 - 3.00 - 2.50
35.83 - 5.96 - 4.51 - 3.33
39.81 - 7.42 - 5.71 - 4.15
41.80 - 8.20 - 6.37 - 4.62
44.79 - 9.42 - 7.42 - 5.42
47.78 - 11.22 - 8.54 - 5.87
53.75 - 14.83 - 10.93 - 7.03
59.72 - 18.41 - 13.41 - 8.41
FEC43.02 Gb/s (MHz) (dB)
G.709 Frequency Lower Nominal Upper
0.000 - 1.00 0.00 +0.50
6.45 - 1.10 - 0.10 +0.40
12.90 - 1.45 - 0.45 +0.05
19.36 - 2.02 - 1.02 - 0.52
25.81 - 2.86 - 1.86 - 1.36
32.26 - 4.00 - 3.00 - 2.50
38.71 - 5.96 - 4.51 - 3.33
43.02 - 7.42 - 5.71 - 4.15
45.17 - 8.20 - 6.37 - 4.62
48.40 - 9.42 - 7.42 - 5.42
51.63 - 11.22 - 8.54 - 5.87
58.08 - 14.83 - 10.93 - 7.03
64.53 - 18.41 - 13.41 - 8.41
End of Procedure

Integrated Rise Time and Aberrations Check

This procedure checks the integrated rise time of an 80C06 Optical Sampling
Module and the aberrations of an 80C05, 80C06, or 80C10 Optical Sampling
Module.
time.
Equipment required Tektronix CSA8000/TDS8000Calmar FPL-01 optical impulser

(item 25)
Cable, coaxial, 1 m, male to male SMA connectors (item 18)
Setup Install the test hookup (see Figure 4--48 on page 4--169) and preset the
CSA8000/TDS8000 controls:
2. Connect a fiber-optic cable between the output of the optical impulse
generator and the input of the OA5002 variable optical attenuator.
3. Connect a fiber-optic cable between the output of the OA5002 variable
optical attenuator and the optical input of the optical sampling module.
4. Connect a 50 Ω coaxial cable from the rear trigger (SYN) on the optical
impulse generator to the TRIGGER DIRECT input on the TDS8000 or
CSA8000.
5. Start with about 30 dB of attenuation on the variable attenuator.
NOTE. To avoid dispersing the narrow optical impulse signal, keep all fiber
lengths as short as possible. Lengths that are 2 to 3 meters long are acceptable.

GPIB cable
CSA8000/TDS8000
80C0X Controller
Rear
trigger
Optical impulser generator Variable optical attenuator
OPTICAL OPTICAL OPTICAL

OUTPUT INPUT
INPUT OUTPUT TRIGGER
DIRECT
DIRECT
Fiber-optic cable Fiber-optic cable
Figure 4- 48: Integrated rise time and aberrations hookup
6. Press the SELECT ON/OFF button on the optical sampling module so that
the adjacent indicator lights. This turns on Channel 1 (C1) on the module.
7. In the Setup menu, select Acquire and make the following changes in the
Acq Setup dialog box:
a. Select Sample as the acquisition mode.

8. In the Trig Setup dialog box, do the following:
a. Select External Direct for the trigger source.
b. Select Normal for Mode.
c. Select the rising edge for Slope.
d. Click the Set to 50% button to set the trigger point midway on the rising
signal.
9. In the Horiz Setup dialog box, do the following:

a. Set the Scale to 1.000 ns/div. (This setting will make it easier to initially
locate the optical pulse later in the procedure.)
b. Set the Position to 30.000 ns. (This setting will make it easier to locate
the first optical pulse later in the procedure.)
c. Set the Record Length to 2000.
d. Set the timebase to short term jitter.

10. In the Disp Setup dialog box, do the following:

a. In the Style section, select Normal.
b. Check Show Vectors.
11. In the Vert Setup dialog box, do the the following:

a. Set the Scale to 500.0 W/div.
b. Set Position to 0.0 div.
c. Set Channel Offset to 0.0 W.

d. Click the Optical>> button in the lower left part of the Vert Setup dialog
box.
e. Set Wavelength to 1550 nm.
f. Set the Bandwidth to:
H 40 GHz for 80C05
H 50 GHz for 80C06
H 65 GHz for 80C10

12. Use the Horizontal POSITION control to position the impulse at the second
horizontal division.
13. Use the Horizontal POSITION and SCALE controls to:
H For 80C05 or 80C10, decrease the Horizontal SCALE to 40 ps/div
H For 80C06, decrease the Horizontal SCALE to 20 ps/div
H Position the impulse at the second horizontal division.
14. Use the Vertical SCALE control to increase the vertical scale to 2 mW/div.
15. Adjust the attenuation of the variable optical attenuator to an impulse
amplitude of 14 mW p-p to 16 mW p-p.
16. Select Meas Dialog box and make the following changes:
b. Make sure both Main C1 and Pulse are selected in the Source tab, and
then choose Select Meas > Pulse -- Amplitude > Mean.
c. Click the Region tab.
d. Enter 0% for G1 and 5% for G2. Check the On box to turn Gates on.

17. Press the MATH button on the front panel. (This will bring up the menu to
define math functions on the waveforms.)
18. Using the supplied symbols in the menu, enter the following formula:
100*Avg(Intg(C1-Meas1))
19. In the Num Avgs field enter 100.
20. Check the box M1 On.

21. Click OK at the bottom of the menu.
NOTE. For an 80C05 or 80C10 module skip steps 22 and 23.
22. Select Meas Dialog box and make the following changes:
b. Select Main M1 (Math 1) as the source and Pulse as signal type in the
Source tab, and then choose Select Meas > Pulse -- Timing > Rise Time.
NOTE. The Main M1 rise-time measurement displayed in the right-hand margin.
23. Set the bandwidth and note the risetime measurement displayed in the
right-hand margin according to the following:
H 80C06 Bandwidth 50 GHz Rise Time 9.6 ps (typical)

24. Adjust the attenuator until the displayed amplitude of the impulse is 4 mW.
Adjust the Horizontal position until the impulse peak is at the second
division.
25. Select the Meas Dialog box and make the following changes:
b. Select Main M1 (Math 1) as the source and Pulse as signal type in the
Source tab, and then choose Select Meas > Pulse -- Amplitude> Pk--Pk.
d. Select Main M1 (Math 1) as the source and Pulse as signal type in the
Source tab, and then choose Select Meas > Pulse -- Amplitude> Pk--Pk.
e. Click the Region tab. Turn the gates on by checking the box next to On.

f. Adjust G1 and G2 as follows:

H For 80C05 or 80C06, increase G1 until it is immediately to the left
of the peak of the first rising edge, which should be approximately at
the second division. Move G2 until the time difference between G1
and G2 is 5 times the rise time from the rising edge. See Table 4--14
that follows for the time difference between G1 and G2 for the
different bandwidth and filter settings.
H For 80C10, increase G1 until it is 15 ps after the 50% point of the
rising edge. Move G2 until the time difference between G1 and G2
is 10 times the rise time from the rising edge. See Table 4--14 that
follows for the time difference between G1 and G2 for the different
bandwidth and filter settings.
Table 4- 14: Minimum limits
Optical sampling module Bandwidth/filter setting Time difference

80C05 40 GHz G2-- G1 = 65 ps (5 x 13 ps)
30 GHz G2-- G1 = 85 ps (5 x 17 ps)
20 GHz G2-- G1 = 125 ps (5 x 25 ps)
OC192 G2-- G1 = 235 ps (5 x 47 ps)
80C06 50 GHz G2-- G1 = 48 ps (5 x 9.6 ps)
80C10 65 GHz G2-- G1 = 74 ps (10 x 7.4 ps)
30 GHz G2-- G1 = 160 ps (10 x 16 ps)
OC768 G2-- G1 = 120 ps (10 x 12 ps)
FEC43.02 G2-- G1 = 112 ps (10 x 11.2 ps)
26. To calculate the Time Domain Vertical Response Aberrations, divide

Measurement 4 by Measurement 3 and multiply by 100. The aberration
limits for the 80C05, 80C06, and 80C10 modules are listed in Table 4--15.
Table 4- 15: Aberrations
Optical sampling module Bandwidth/filter setting Aberrations

80C05 40 GHz <15%
30 GHz <10%
20 GHz <10%
OC192 <5%
80C06 50 GHz <10%

Table 4- 15: Aberrations (cont.)
Optical sampling module Bandwidth/filter setting Aberrations

80C10 65 GHz <10%
30 GHz <5%
FEC43.02 <5%
OC768 <5%

Clock Recovery Optical Sensitivity Range and Recovered Clock Timing Jitter
This procedure checks the clock recovery optical sensitivity range and the
recovered clock timing jitter on Optical Sampling Modules that are equipped
with clock recovery options.
Equipment required Tektronix CSA8000/TDS8000

Tektronix 80E02 Sampling Module (item 34)
Advantest D3186 12 Gb Pattern Generator (item 40)
Optical Transmitter and Receiver (item 23)
Attenuator, 2X (6 dB pad), 50 Ω, SMA (item 8)
Cable, coaxial, 2 ns delay SMA, male connector on each end
(item 12)
Setup Install the test hookup (see Figure 4--49) and preset the CSA8000/TDS8000
controls:
2. Install the 80E02 Sampling Module into Channels 3 and 4 of the TDS8000
or CSA8000 instrument. (Channel 1 and Channel 2 are disabled when an
optical sampling module is installed in the upper Channel 1.)
3. Install 2X SMA electrical attenuators on the inputs of the 80E02 Sampling
Module (to prevent saturation).
4. Connect a less than 2 ns delay, 50 Ω coaxial cable between the 1/32 CLK
signal output of the pattern generator and the TRIGGER DIRECT connector
on the TDS8000 or CSA8000.
5. Connect a less than 2 ns delay, 50 Ω coaxial cable between the DATA output
of the pattern generator and the DIGITAL IN DC-COUPLED input on the
laser transmitter.
6. Connect a single-mode fiber-optic cable between the OPTICAL output of the
laser transmitter and the OPTICAL INPUT on the variable optical attenuator.

OPTICAL
INPUT
OA5002 attenuator
OPTICAL
OUTPUT
OI1125
transmitter
Fiber-optic cables
12 Gb Pattern OPTICAL
OUTPUT CSA8000/TDS8000
generator
TRIGGER DIRECT
DC-COUPLED
2X Attenuators
DATA CLOCK
CLOCK
OUTPUT OUTPUT
OUTPUT
DATA
INPUT
DATA
1/32 CLK 50 Ω Coaxial cable
Figure 4- 49: Clock recovery optical sensitivity range and recovered clock timing jitter hookup
7. Connect a single-mode fiber-optic cable between the OPTICAL OUTPUT of

the variable optical attenuator and the OPTICAL INPUT of the 80C0X-CR
Optical Sampling Module.
8. Connect a less than 2 ns delay, 50 Ω coaxial cable between the CLOCK
OUTPUT of the 80C0X-CR Optical Sampling Module and the Channel 3
input on the 80E02 Sampling Module.
9. Connect a less than 2 ns delay, 50 Ω coaxial cable between the DATA

OUTPUT of the 80C0X-CR Optical Sampling Module and the Channel 4
input on the 80E02 Sampling Module.

10. The D3186 Pulse Pattern Generator must use its own reference clock. Set the
following data signal parameters on the pattern generator:
H AC coupled
H DATA output mode --2 V
H Amplitude 0.700 V
H Offset --1.00 V
H PRBS23 pattern
H NRZ data format

H Balanced duty cycle (crossing set to the default 50% level)
H Data rate to 2.48832 Gb/s (the data rate will be changed, depending on
each specific data rate to be tested later in the procedure)
11. Set the variable optical attenuator for minimum attenuation.
12. Allow the TDS8000 or CSA8000 and its modules to warm up for at least
20 minutes in an environment that has had less than 1 °C variation through-
out the warm-up cycle.
13. Press the DEFAULT SETUP button on the TDS8000 or CSA8000 instru-
ment.
14. Press the SELECT ON/OFF button on the 80C0X Optical Sampling Module
so that the adjacent indicator lights. This turns on Channel 1 (C1) on the
80C0X-CR Optical Sampling Module.
15. Press the SELECT ON/OFF button on the 80E02 Sampling Module so that
the adjacent indicator lights. This turns on Channel 3 (C3), which displays
the CLOCK signal.
16. From the Setup Menu, select the Trig Setup dialog box. Make the following
changes:
a. Select External Direct as the Trigger Source.
b. In the Level section, click the Set to 50% button.
c. Select positive edge for the Slope.
17. Select the Meas Setup dialog box. Make the following changes:
b. Make sure both Main C1 and NRZ are selected in the Source tab, and
then choose Select Meas > NRZ -- Amplitude > Average Optical Power.

18. Select the Vert Setup dialog box and make the following changes:
a. Select C1 for Waveform.
b. Set the Wavelength to match the wavelength of the laser transmitter.
19. Select the Wfm Database Setup dialog box.

a. In the Database1 section, select Main C3 as the Source.
b. Check On for Database1.
20. Select the Meas Setup dialog box and make the following changes:
b. Select both Main C3 and NRZ in the Source tab, and then choose Select
Meas > NRZ -- Timing> RMS Jitter.
c. Check the Use Wfm Database selection.
Procedure Follow this procedure to make the clock recovery optical sensitivity range and
recovered clock timing jitter checks:
1. In the Trig Setup dialog box, select the clock recovery rate for C1 that you
want to test (see Table 4--16).
NOTE. Leave External Direct selected as the Trigger Source, even though you are
selecting a rate other than None. In this preliminary setup, the clock recovery
circuitry is enabled for the 80C0X-CR Optical Sampling Module, but the
TDS8000 or CSA8000 instrument timebase receives its trigger events from the
TRIGGER DIRECT input signal and not the actual recovered clock.
2. Set the data rate of the D3186 Pulse Pattern Generator to the rate setting for
the clock recovery rate that you selected in step 1 (see Table 4--16).
3. Adjust the Horizontal SCALE control on the front panel of the TDS8000 or
CSA8000 instrument to the setting listed in the table for the clock recovery
rate that you selected in step 1 (see Table 4--16).
Table 4- 16: Clock recovery settings
Optical sampling Clock recovery TDS8000 or CSA8000

module rate D3186 rate setting scale setting
80C01-CR OC-12 0.62208 Gb/s 500 ps/div
OC-48 2.48832 Gb/s 100 ps/div
80C02-CR OC-- 192 9.95328 Gb/s 50 ps/div

Table 4- 16: Clock recovery settings (cont.)

80C03-CR FC-1063 1.0625 Gb/s 200 ps/div
GBE 1.2500 Gb/s 200 ps/div
OC-48 2.48832 Gb/s 100 ps/div
2.5 Gb/s 2.5000 Gb/s 100 ps/div
80C04-CR1 OC-- 192 9.95328 Gb/s 50 ps/div
80C04-CR2 OC-- 192 9.95328 Gb/s 50 ps/div
FEC10.6646 10.6646 Gb/s 50 ps/div
80C07-CR OC-3 0.15552 Gb/s 1 ns
OC-12 0.62208 Gb/s 500 ps/div
OC-48 2.48832 Gb/s 100 ps/div
80C07B-CR OC-3 0.15552 Gb/s 1 ns
OC-12 0.62208 Gb/s 500 ps/div
OC-48 2.48832 Gb/s 100 ps/div
FC1063 1.0625 Gb/s 200 ps/div
GBE 1.25 Gb/s 200 ps/div
FC2125 2.125 Gb/s 100 ps/div
2GBE 2.5 Gb/s 100 ps/div
Infiniband 2.5 Gb/s 100 ps/div
80C08-CR 10GBASE-- W 9.95328 Gb/s 50 ps/div
10GBASE-- R 10.3125 Gb/s 50 ps/div
80C08B-CR1 10GBASE-- W 9.95328 Gb/s 50 ps/div
80C08B-CR2 10GFC 10.51875 Gb/s 50 ps/div
80C08C-CR1 10GBASE-- W 9.95328 Gb/s 50 ps/div
80C08C-CR2 10GFC 10.51875 Gb/s 50 ps/div
80C08C-CR4 Continuous 9.8 Gb/s to 12.6 Gb/s 50 ps/div

Table 4- 16: Clock recovery settings (cont.)

80C09-CR1 FEC10.71 10.799225 Gb/s 50 ps/div
OC-- 192 9.95328 Gb/s 50 ps/div
80C11-CR1 OC-- 192 9.95328 Gb/s 50 ps/div
80C11-CR2 OC-- 192 9.95328 Gb/s 50 ps/div
10.66 FEC 10.66423 Gb/s 50 ps/div
80C11-CR3 OC-- 192 9.95328 Gb/s 50 ps/div
FEC10.71 10.709225 Gb/s 50 ps/div
80C011-CR4 Continuous 9.8 Gb/s to 12.6 Gb/s 50 ps/div
At this point in the procedure, the TDS8000 or CSA8000 instrument is triggered

from the 1/32 clock from the D3186 Pulse Pattern Generator. The clock signal
from the 80C0X-CR Optical Sampling Module that is connected to C3 on the
80E02 Sampling Module should be synchronous with the signal from the pulse
pattern generator (see Figure 4--51).
If the signals are not synchronous (see Figure 4--50), check that the D3186 data
rate is set to a data rate that matches the clock recovery rate set for the 80C0X-
CR Optical Sampling Module (see Table 4--16).

Example of the display when the clock signal from the Optical Sampling Module is
not synchronous with the data rate input. Note the unstable (“washed out”) clock
signal. Compare this with Figure 4-- 51, in which the clock signal is synchronized.
Figure 4- 50: Display example (clock signal not synchronized with the data rate
input)
4. Once you have verified that the recovered clock signal (C3) is locked with
the incoming data, select the Trig Setup dialog box, and select Clock
Recovery as the Trigger Source.
5. Do the following substeps to check the clock recovery optical sensitivity
range:
a. Find the module under test listed in Table 4--17.
b. Adjust the variable optical attenuator until the Average Optical Power
(AOP) measurement for C1 matches the value given in the AOP Meas.
Max column for the module under test.
c. Check that the clock signal remains stable.

d. Adjust the variable optical attenuator until the Average Optical Power
(AOP) measurement for C1 matches the value given in the AOP Meas.
Min column for the module under test.
e. Check that the clock signal remains stable.

Table 4- 17: Clock recovery settings & jitter limits
Max RMS
Module & clock recovery rate Max optical power Min optical power Jitter
80C01-CR OC-12 Not specified, set to Not specified, set to 8 ps
dBm (125 W)
- 99.00 dB W) dBm (125 W)
- 99.00 dB W)
OC-48
80C02-CR OC-- 192 Not specified, set to - 7.5 dBm (178 W) 2 ps
- 7.5 dBm (178 W)
80C03-CR FC-1063 - 4dBm (400uW) - 16.0 dBm (100 uW) 8 ps
GBE
OC-48
2.5 Gb/s
80C04-CR1 OC-- 192 +7.0 dBm (5 mW) - 10.0 dBm (100 uW) 2.0 ps
80C04-CR2 OC-- 192 +7.0 dBm (5 mW) - 10.0 dBm (100 uW) 2.0 ps
FEC10.6646
80C07-CR OC-3 - 4 dBm (400 uW) - 16.0 dBm (25 uW) 32.0 ps
OC-12 8.0 ps
OC-48 4.0 ps
80C07B-CR OC-3 - 4 dBm (400 uW) - 16.0 dBm (25 uW) 32.0 ps
OC-12 ((All wavelengths)
g ) (
(1550 nm and 8.0 ps
OC-48 1310 nm)) 4.0 ps
FC1063 8.0 ps
FC2125 3.0 ps
ENET1250 8.0 ps
ENET2500 4.0 ps
INFINIBAND 4.0 ps
OC-192
80C08-CR 10GBASE-- W +0.0 dBm ((1 mW)) - 15 dBm ((32 uW)) 2.0 pps
10GBASE-- R
80C08B-CR1 OC-192 +0.0 dBm (1 mW) - 15 dBm (32 uW) 2.0 ps
10GBASE-- W
10GBASE-- R
80C08B-CR2 10GFC +0.0 dBm (1 mW) - 15 dBm (32 uW) 2.0 ps
10GBASE-- R

Table 4- 17: Clock recovery settings & jitter limits (cont.)
Max RMS
Module & clock recovery rate Max optical power Min optical power Jitter
80C08C-CR1 OC-192 +0.0 dBm (1 mW) - 15 dBm (32 uW) 2.0 ps
10GBASE-- W
10GBASE-- R
80C08C-CR2 10GFC +0.0 dBm (1 mW) - 15 dBm (32 uW) 2.0 ps
10GBASE-- R
80C09-CR1 FEC10.799225 Not specified, set to - 7.5 dBm (178 W) 2.0 ps
- 7.5 dBm ( 178 W)
80C11-CR1 OC-192 +7.0 dBm (5 mW) - 10.0 dBm (100 uW) 2.0 ps
10Gb FEC
G.709 FEC
6. Do the following substeps to check recovered clock timing jitter:

a. If you are checking an 80C01 or an 80C03 module, set the Average
Optical Power (AOP) to 125 W (--9.0 dBm); otherwise, leave the AOP
set as was set for step 5d on page 4--180.
b. Zoom into the 50% crossing point of the first rising edge on the C3
clock signal until the Horizontal SCALE is 10 ps/div and the Vertical
SCALE is 10 mV/div. See Figure 4--52.
NOTE. You can most easily zoom in on the 50% crossing point by click dragging
a rectangle around this edge (using the mouse), and then using the SCALE and
FINE control knobs to adjust the settings to 10 mV/div and 10 ps/div.
c. Check that the RMS jitter measurement for C3 is less than or equal to
the value given in the maximum RMS jitter column of Table 4--17.
d. Repeat this procedure from step 1 to check the recovered clock optical
sensitivity and timing jitter for each of the clock recovery rates of the
optical sampling module you are testing. See Table 4--16.
End of Procedure

Example of the display when the clock signal from the Optical Sampling Module is
synchronous with the data rate input from the pulse pattern generator. Note the
stable clock signal waveform. Compare this with Figure 4-- 50, in which the clock
signal is not synchronized.
Figure 4- 51: Display example (clock signal synchronized with the data rate input)

Example of the display zoomed in to 10 mV/div and 10 ps/div at the crossing point
(50%) on the recovered clock signal (C3)
Figure 4- 52: Display example (zoomed in at the crossing point)
End of Procedure

80A01 Trigger Prescale Limiting Preamplifier Module
These procedures check those characteristics that relate to 80A01 module and are
listed as checked specifications. Refer to Table 1--11 on page 1--13.
controls supported by the version 1.3 release of the instrument firmware. The
procedures will work for earlier versions of software, but the control and menu
names may vary slightly.
Prerequisites
Be sure you have performed the following prerequisites and the Prerequisites on
page 4--30 before doing any procedures in this section.
H Install the 80A01 module in left most of the small compartments in the front
panel of the CSA8000 or TDS8000 instrument.
H Install a 80E0X module in the small module compartment immediately to
the right of the installed 80A01 module.
NOTE. Use a calibrated torque wrench when connecting the terminators,

adapters, attenuator, and power sensor in this setup. Use 8 0.3 inch pounds of
torque.

System Trigger Sensitivity

Equipment required Cable, coaxial 50 Ω, 20 in (0.5m), male-to-male SMA (Item 14)

Cable, coaxial 50 Ω , male-to-male SMA (Item 15)
Attenuator, 6 dB, female to male SMA connectors (item 8)
Generator, sinewave (Item 33)

1. Install the 80A01 module into the left-most small module compartment of
2. Install an 80E00 module into the small module compartment next to the
80A01 module of the TDS8000 or CSA8000 instrument (see Figure 4--53).
3. Connect a coaxial cable to the output of the 80A01 module.
4. Connect the other end of the cable to the 6 dB attenuator (item 22).
5. Connect the 6 db attenuator to Channel 3 of the 80E0x module.
6. In the Vertical Setup menu, set external attenuation to 6dB for Channel 3.
7. Set the signal generator to output a sinewave at 8 GHz and 0 dBm.

8. Connect the RF output of the signal generator (item 13) to Channel 4 of the
80E0x module using a coaxial cable.
9. Set the TDS8000 to trigger on Internal Clock.
10. Set Measurement 1 to measure Amplitude with Channel 4 as the source.
11. Adjust the amplitude of the RF signal generator until Measurement 1 reads
200 mVpp.
12. Disconnect the coaxial cable from the 80E0x Channel 4 input, and move it to
the 80A01 input.
13. Change Measurement 1 to measure Amplitude with Channel 3 as the source.

CSA8000/TDS8000
RF output
80A01 Out to TRIGGER

80E0x Ch3 PRESCALE INPUT
Figure 4- 53: 80A00 test hookup
Test Follow this procedure to make the enhanced trigger sensitivity check:
1. Repeat the sinewave amplitude adjustment and 80A01 output amplitude
measurement at each frequency in the list that follows.
2. For each frequency in the list that follows, check that the amplitude readout
is as listed.
Frequency setting Meas. amp. readout

8 GHz ≥ 800 mV
9 GHz ≥ 800 mV
10 GHz ≥ 800 mV
11 GHz ≥ 800 mV
12 GHz ≥ 800 mV
End of Procedure


This chapter contains an adjustment procedure for your instrument. The purpose
of this procedure is to return the instrument conformance to its specifications.
Adjustment Interval
The voltage and timing references inside the instrument are very stable over time
and should not need routine adjustment. The only time you should perform the
Adjustment Procedures is if the instrument fails any of the Mainframe perfor-
mance verification checks starting on page 4--63.
Adjustment Environment
The instrument must be adjusted in a 20 °C to 30 °C ambient temperature
environment. The instrument and signal source must warm up at least 20 minutes
in this environment before you begin the adjustment procedure.
Adjustment After Repair

After removal and replacement of a module due to electrical failure, you must
either perform the adjustment procedure or not, depending on the module
replaced. See Table 5--1.
Table 5- 1: Adjustments required for module

replaced
Module replaced Adjustment required

Front panel assembly No
Acquisition board Yes
Processor board No
NLX processor assembly No
Display panel or display No
system
Power supply No
Interconnect boards No
Fans No

Required Equipment
The adjustment procedure requires the specific test equipment and materials
listed in Table 5--2.
Table 5- 2: Required equipment and materials
Category Specific equipment required Quantity

Signal source Signal generator 50 MHz to 1 GHz, ≤1 ppm 1 ea
frequency accuracy
Meter Digital Multimeter, with 6.5 plus digits 1 ea
Instrument controller PC-compatible computer with National Instruments 1 ea
(only one of these GPIB Controller card and software, running Windows
configurations
g 95/98 or NT
required)
i d)
National Instruments USB GPIB Controller card for 1 ea
Windows 98 and National Instruments NI-488.2 for
Windows software (to install in the instrument) 1
Divider Power, 50 Ω, SMA “T”. male Tektronix 015-0565-00 1 ea
Adapter SMA “T”, male to 2 SMA female Tektronix part 1 ea
number 015-1016-00
Adapter SMA male to BNC female, Tektronix part number 1 ea
015-0554-00
Adapter BNC to dual banana plug, Tektronix part number 1 ea
103-0095-00
Coaxial cables 50 Ω, male-to-male SMA connectors 3 ea
GPIB cables GPIB cable, 1 m minimum length, Tektronix part 1 ea
number 002-0991-01
1 Depending on other USB devices attached to the instrument, a USB hub may also
be required. Consult your National Instruments documentation for more
information.
Instrumentation Setup
Set the National Instruments GPIB Interface command software to allow GPIB
communications between the PC controller and CSA8000/TDS8000, device
under test (DUT).
Before you can execute the adjustment program, you need to set up and
configure the instrumentation. Make connections according to the following
diagrams. See Figure 5--1.
To perform this procedure you must have the specific equipment listed in
Table 5--2.

Main Instrument Adjustments

Once the instrumentation is connected and GPIB configured, allow the instru-
mentation to warm up for at least 20 minutes before starting the DC Calibrator
Adjust procedures.
GPIB cable
CSA8000/TDS8000
Controller
Digital
50 Ω multimeter
Terminator
-- +
DC CALIBRATION
OUTPUT SMA “T”
Figure 5- 1: Adjustment setup using the DMM
DC Calibrator Adjust Connect the instrument to a DMM as shown in Figure 5--1.

1. Run the compensation routine, described in Brief Procedures section on
page 4--5.
2. Enter the following GPIB command to verify communication between the
controller and DUT.
*IDN?
Should respond with Tektronix and Firmware Version.
3. Enter the following GPIB command to turn the instrument’s cal constant
protection off:
SYST:PROT OFF
4. Enter the following GPIB command to set the instrument’s DC calibrator

offset cal constant to 0:
CALCOMP:DOUBLE “DcCalOffsetAdj”,0.0
5. Wait 8 seconds then enter the following GPIB command to set the
instrument’s DC calibrator Lsb cal constant to 1.0:
CALCOMP:DOUBLE “DcCalLsbAdj”,1.0

6. Wait 8 seconds then enter the following GPIB command to set the
instrument’s DC calibrator output to 0 Volts:
CALIBRATE:DCCALIBRATOR 0.0
Record DMM reading.
7. Enter the following GPIB command to set the instrument’s DC calibrator
offset cal constant to --1 * DMM reading:
CALCOMP:DOUBLE “DcCalOffsetAdj”,(-1.0 * the DMM
reading)
Example: CALCOMP:DOUBLE “DcCalOffsetAdj”, 3.2e-4
8. Enter the following GPIB command to set the instrument’s calibrator to
1.0 V:
Record the DMM reading (reading1).
9. Enter the following GPIB command to set the instrument’s calibrator to
--1.0 V:
CALIBRATE:DCCALIBRATOR -1.0
Record the DMM reading (reading2).
Calculate cal constant as follows:
( –1.0 * Reading2 + Reading1 )
2
10. Enter the following GPIB command to set the instrument’s calibrator Lsb cal
constant:
CALCOMP:DOUBLE “DcCalLsbAdj”,calculated result from Step 9.
11. Wait 8 seconds then enter the following GPIB command to save the DC
adjustments as follows:
CAL:SAVE:FACT:MAI
protection on:
SYST:PROT ON
DC Calibrator Adjust To verify that the DC calibration adjustment was successful complete the
Verification following procedures:
1. Set the instrument’s DC calibrator to --1.0 V and verify as follows:
CALIBRATE:DCCALIBRATOR -1.0
2. Verify that the DMM reads --1.0 V 1 mV
3. Set the instrument’s DC calibrator to 1.0 V and verify as follows:
4. Verify that the DMM reads 1.0 V 1 mV

5. Set the instrument’s DC calibrator to 0.0 V and verify as follows:

6. Verify that the DMM reads 0.0 V 0.1 mV
GPIB cable
CSA8000/TDS8000
Controller
TRIGGER DIRECT INPUT
Channel 1
50 Ω Power divider
Figure 5- 2: Adjustment setup using the signal generator
Internal 10 MHz Adjust Connect the instrument to a signal generator as shown in Figure 5--2.
Setup Set the signal generator as follows:
H Frequency to 1 GHz
H Amplitude to 1.0 V peak to peak
H Output to on
Preset the CSA8000/TDS8000 controls:
NOTE. CSA8000/TDS8000 settings; Acquisition, Horizontal, Measurement,

Trigger, or Vertical menus are located in the Setups dialog, which can be popped
up by selecting the Setup Menu.
H Select C1 in the Waveform Selector.

H Acquisition menu, Acquisition to, Average, 64 samples.
H Horizontal menu, Timebase, Scale to 250 ps/division.
H Horizontal menu, All Timebases Mode, Lock to Int 10MHz.
H Measurement menu, Select Meas, Timing, + Cross.
H Measurement menu, select Statistics.

protection off:
SYST:PROT OFF
2. Set the calibration value to default by sending the following GPIB com-
mand:
CALCOMP:DOUBLE “Internal10MHzRefFreq”,10e6
3. Click Run/Stop (button should be green).
4. Measurement menu, click Show Stats.
5. Record target value = (Mean value +1 s); where Mean is from the
Statistics window.
6. Horizontal menu, Timebase, Position, enter target value recorded in step 5.
7. Click Run/Stop (button should be gray).
8. Measurement menu, click Clear Stats.
9. Click Run/Stop (button should be green), wait 8 seconds then click Run/Stop
again (button should be gray).
10. Using the present Mean value from the Statistics window, and the
target value calculated in step 5,. Calculate the error and the new cal
constant:
Error = (mean -- target value) / 1 s
New Cal Const = Error * 10e6 + 10e6
11. Input the new calibration constant into the instrument by sending the
following GPIB command:
CALCOMP:DOUBLE “Internal10MHzRefFreq”, New Cal Const where
New Cal Const is from Step 10.
12. Wait 8 seconds then save the mainframe factory calibration constants by
entering the following GPIB commands:
CAL:SAVE:FACT:MAI
13. Update the mainframe calibration time/date/temperature stamp by entering
the following GPIB command:
CAL:UPDATEINFO:MAI
protection on:
SYST:PROT ON
End of Procedure

Maintenance
This section contains the information needed to do periodic and corrective

maintenance on the Mainframe, Sampling Heads and Optical modules. The
following subsections are included:
H Preparation. Introduction plus general information on preventing damage to

internal modules when doing maintenance.
H Inspection and Cleaning. Information and procedures for inspecting the
instrument and cleaning its external and internal modules.
H Removal and Installation Procedures. Procedures for the removal of
defective modules and replacement of new or repaired modules. Also
included is a procedure for disassembly of the instrument for cleaning.
H Troubleshooting. Information for isolating failed modules. Included are

instructions for operating the instrument’s internal diagnostic routines and
troubleshooting trees. Most of the trees make use of these internal diagnostic
routines to speed fault isolation to a module.
Preventing ESD
Before servicing this product, read the Safety Summary and Introduction at the
front of the manual and the ESD information below.
CAUTION. Static discharge can damage any semiconductor component in this

instrument.
When performing any service which requires internal access to the instrument,
adhere to the following precautions to avoid damaging internal modules and their
components due to electrostatic discharge (ESD).
1. Minimize handling of static-sensitive circuit boards and components.
2. Transport and store static-sensitive modules in their static protected
containers or on a metal rail. Label any package that contains static-sensitive
boards.
3. Discharge the static voltage from your body by wearing a grounded antistatic
wrist strap while handling these modules. Do service of static-sensitive
modules only at a static-free work station.
4. Nothing capable of generating or holding a static charge should be allowed
on the work station surface.

Maintenance
5. Handle circuit boards by the edges when possible.

6. Do not slide the circuit boards over any surface.
7. Avoid handling circuit boards in areas that have a floor or work-surface
covering capable of generating a static charge.
Inspection and Cleaning

Inspection and Cleaning describes how to inspect for dirt and damage. It also
describes how to clean the exterior and interior of the instrument. Inspection and
cleaning are done as preventive maintenance. Preventive maintenance, when
done regularly, may prevent instrument malfunction and enhance its reliability.
Preventive maintenance consists of visually inspecting and cleaning the

instrument and using general care when operating it.
How often to do maintenance depends on the severity of the environment in
which the instrument is used. A proper time to perform preventive maintenance
is just before instrument adjustment.
General Care The cabinet helps keep dust out of the instrument and should normally be in
place when operating the instrument.
WARNING. Before performing any procedure that follows, power down the
instrument and disconnect it from line voltage.
Flat Panel Display The portable mainframe display is a soft plastic display and must be treated with
Cleaning care during cleaning.
CAUTION. Improper cleaning agents or methods can damage the flat panel
display.
Avoid using abrasive cleaners or commercial glass cleaners to clean the display
surface.
Avoid spraying liquids directly on the display surface.
Avoid scrubbing the display with excessive force.
Clean the flat panel display surface by gently rubbing the display with a
clean-room wipe (such as Wypall Medium Duty Wipes, #05701, available from
Kimberly-Clark Corporation).

Maintenance
If the display is very dirty, moisten the wipe with distilled water or a 75%
isopropyl alcohol solution and gently rub the display surface. Avoid using excess
force or you may damage the plastic display surface.
CAUTION. To prevent getting moisture inside the instrument during external

cleaning, use only enough liquid to dampen the cloth or applicator.
Exterior Use the following guidelines and methods to inspect and clean the outside of the
instrument.
Inspection — Exterior. Inspect the outside of the instrument for damage, wear, and
missing parts, using Table 6--1 as a guide. Immediately repair defects that could
cause personal injury or lead to further damage to the instrument.
Table 6- 1: External inspection check list
Item Inspect for Repair action

Cabinet, front panel, Cracks, scratches, deformations, Repair or replace defective
and cover damaged hardware. module.
Front-panel knobs Missing, damaged, or loose Repair or replace missing or
knobs. defective knobs.
Connectors Broken shells, cracked insulation, Repair or replace defective
and deformed contacts. Dirt in modules. Clear or wash out dirt.
connectors.
80C0X male fiber con- Lint or dust on all male fiber Clean all male fiber connections
nections connections. with a lint-free cleaning cloth.
Carrying handle, and Correct operation. Repair or replace defective
cabinet feet. module.
Accessories Missing items or parts of items, Repair or replace damaged or
bent pins, broken or frayed missing items, frayed cables, and
cables, and damaged connec- defective modules.
tors.
Cleaning — Exterior. Clean the exterior surfaces of the chassis with a dry lint-free
cloth or a soft-bristle brush. If any dirt remains, use a cloth or swab dipped in a
75% isopropyl alcohol solution. Use a swab to clean narrow spaces around
controls and connectors. Do not use abrasive compounds on any part of the
chassis that may damage the chassis.
Clean the On/Standby switch using a dampened cleaning towel. Do not spray or
wet the switch directly.

Maintenance
CAUTION. Avoid the use of chemical cleaning agents which might damage the
plastics used in this instrument. Use only deionized water when cleaning the
menu buttons or front-panel buttons. Use a 75% isopropyl alcohol solution as a
cleaner and rinse with deionized water. Before using any other type of cleaner,
consult your Tektronix Service Center or representative.
Interior Use the following guidelines and methods to inspect and clean the inside of the
instrument.
Inspection — Interior. To access the inside of the instrument for inspection and
cleaning, refer to the Removal and Installation Procedures in this section.
Inspect the internal portions of the instrument for damage and wear, using
Table 6--2 as a guide. Defects found should be repaired immediately.
If any circuit board is replaced, check Table 5--1 on page 5--1, in Chapter 5 to see
if it is necessary to adjust the instrument.
CAUTION. To prevent damage from electrical arcing, ensure that circuit boards
and components are dry before applying power to the instrument.
Table 6- 2: Internal inspection check list

Circuit boards Loose, broken, or corroded Remove and replace damaged
solder connections. Burned circuit board.
circuit boards. Burned, broken, or
cracked circuit-run plating.
Resistors Burned, cracked, broken, blis- Remove and replace damaged
tered condition. circuit board.
Solder connections Cold solder or rosin joints. Resolder joint and clean with
isopropyl alcohol.
Capacitors Damaged or leaking cases. Remove and replace damaged
Corroded solder on leads or circuit board.
terminals.
Semiconductors Loosely inserted in sockets. Firmly seat loose semiconduc-
Distorted pins. tors. Remove devices that have
distorted pins. Carefully straight-
en pins (as required to fit the
socket), using long-nose pliers,
and reinsert firmly. Ensure that
straightening action does not
crack pins, causing them to
break off.

Maintenance
Table 6- 2: Internal inspection check list (cont.)

Wiring and cables Loose plugs or connectors. Firmly seat connectors. Repair or
Burned, broken, or frayed wiring. replace modules with defective
wires or cables.
Chassis Dents, deformations, and dam- Straighten, repair, or replace
aged hardware. defective hardware.
Cleaning Procedure — Interior. To clean the instrument interior, do the following

steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton-
tipped applicator is useful for cleaning in narrow spaces and on circuit
boards.)
STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the
remaining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be
spray washed using a solution of 75% isopropyl alcohol by doing steps 4
through 8.
4. Gain access to the parts to be cleaned by removing easily accessible shields
and panels (see Removal and Installation Procedures).
5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the
majority of the alcohol to evaporate.
6. Use hot (120 _F to 140 _F) deionized water to thoroughly rinse them.
7. Dry all parts with low-pressure, deionized air.
8. Dry all components and assemblies in an oven or drying compartment using
low-temperature (125 _F to 150 _F) circulating air.

Maintenance

Removal and Installation Procedures
This subsection contains procedures for removal and installation of all mechani-
cal and electrical modules.
Preparation
WARNING. Before doing this or any other procedure in this manual, read the
Safety Summary found at the beginning of this manual. Also, to prevent possible
injury to service personnel or damage to this instrument’s components, read
Installation in Chapter 2, and Preventing ESD in this section.
This subsection contains the following items:

H Preparatory information that you need to properly do the procedures that
follow.
H A list of tools required to remove all modules.
H Procedures for removal and reinstallation of the electrical and mechanical
modules.
H A disassembly procedure for removal of all the major modules from the
instrument at one time and for reassembly of those modules into the
instrument. Instructions for doing the actual cleaning are found under
Inspection and Cleaning at the beginning of this section.
WARNING. Before doing any procedure in this subsection, disconnect the power
cord from the line voltage source. Failure to do so could cause serious injury or
death.
NOTE. Read Equipment Required for a list of the tools needed to remove and
install modules in this instrument. See Table 6-- 3, page 6-- 8.
Read the cleaning procedure before disassembling the instrument for cleaning.

Equipment Required. Most modules in this instrument can be removed with a

screwdriver handle mounted with a size T-15, TorxR screwdriver tip. Use this
tool whenever a procedure step instructs you to remove or install a screw unless
a different size screwdriver is specified in that step. All equipment required to
remove and reinstall each module is listed in the first step of its procedure.
Table 6-- 3: Tools required for module removal
Item
No. Name Description Part number
1 Screwdriver handle Accepts TorxR-driver bits General Tool:
620-440
2 Screwdriver handle, ex- Accepts TorxR-driver bits and 3/16 Standard tool or
tended length, 10.5 to socket tip. Used for removing the Xcelite 99X10V
12 inches T-10 screws and 3/16 inch hex posts N/S#48706
from the electrical and optical module
slots.
3 T-10 Torx tip Used for removing the electrical or General Tool:
optical module chassis. TorxR-driver 640-235
bit for T-10 size screw heads.
4 T-15 Torx tip Used for removing most the instru- General Tool:
ment’s screws. TorxR-driver bit for 640-247
T-15 size screw heads.
5 T-20 Torx tip Used for removing the handle General Tool:
hardware. TorxR-driver bit for T-20 640-250
size screw heads.
6 3/ inch socket tip Used for removing the 3/16 inch hex Standard tool
16
posts from the electrical and optical
module slots.
7 1/ inch flat-bladed screw- Screwdriver for unlocking cable Standard tool
8
driver connectors.
8 #0 phillips screwdriver Screwdriver for removing small Standard tool
phillips screws, CD, floppy & hard
drive.
9 Angle-Tip Tweezers Used to remove front panel knobs Standard tool
10 3/ inch open-end wrench Used to remove the rear panel nut Standard tool
16
posts.
11 5/ inch open-end wrench Used to remove the rear panel nut Standard tool
16
posts.
12 Coaxial cable connector Used to remove coaxial connectors Amp: 58095-1
tool from d-subminiature connector
housings.

Procedures for External Modules

The following procedures are found here and are listed in order presented.
H Front Panel Knobs
H Trim (all)
H Bottom cover
H Left and Right covers
H Line Fuse and Line Cord
Front-Panel Knobs 1. Assemble equipment and locate modules to be removed: Use an angled-tip
tweezers (Item 9) and locate the the front panel see Figure 6--2 on page 6--11.
2. Orient the instrument: Set the instrument so its bottom is down on the work
surface and its front is facing you.
3. Remove the knob(s): Grasp any knob you want to remove and pull it straight
out from the front panel about a 1/4 inch to create some clearance between
the base of the knob and the front panel. Insert the tweezers between the
knob and front panel and use them to remove the knob. See Figure 6--1.
4. Reinstallation: To reinstall, align knob to shaft and push it in until it snaps.
CAUTION. To prevent damage to the encoders located onto the circuit board,
apply pressure to the backs of the encoders while pushing the knob on the shaft.
Figure 6-- 1: Knob removal

Trim and Carrying Handle 1. Locate module to be removed: Locate the Trim in the locator diagram, See
Figure 6--7, page 6--18.
2. Remove the front panel trim: Use Figure 6--2, page 6--11, as a guide.
a. Grasp the trim ring by its top edge and pull toward you to detach the
three plastic snaps. (Alternatively, you can use a flat-bladed screwdriver
or other small prying tool to help you detach the snaps.)
b. Swing the bottom of the ring upward and off the front panel.
3. Remove the acquisition trim: Use Figure 6--2, page 6--11 as a guide.
a. Remove the six T-15 Torxdrive screws that secure the acquisition trim to
the instrument.
b. Remove the knobs from the electrical and optical ejector levers. Grasp
the knobs with your fingers and pull straight out.
c. Remove the acquisition trim from the instrument.
4. Remove the top cover trim: Use Figure 6--2, page 6--11 as a guide.
a. Remove the accessory pouch; it snaps off.
b. Remove the four T-15 Torxdrive screws that secure the top cover trim to
the instrument. The T-15 Torxdrive screws also secure the snap studs to
the top cover.
c. Remove the top cover trim from the instrument.
5. Remove the carrying handle and the right/left side trim panels: Use
Figure 6--2, page 6--11 as a guide.
a. Remove the two T-20 Torxdrive screws that secure the handle to the
instrument. Remove the handle from the instrument.
CAUTION. Over-tightening the handle screws may cause the handle to break off
from the cabinet. When reinstalling the screws, use a torque wrench to tighten the
screws to 8-- 10 in.lb.
b. Slide the side trim panels towards the rear of the instrument allowing the
tabs to clear the cover openings, then pull out to remove the panels from
the instrument.
6. Reinstallation: Do in reverse steps 2 through 5 to reinstall the appropriate
trim.

T-15 Torxdrive
screw (4)
Top cover trim
Left side trim
Right side trim
T-15 Torxdrive
screw (3)
Acquisition trim Carrying handle

Front panel trim T-20 Torxdrive
T-15 Torxdrive screw (3) screw (2)
Soldering aid
To remove the trim ring, slide the flat

end of a soldering aid into the side
slot on the trim ring. Press in, then
lift up to hook it underneath, then
pry up.
Figure 6-- 2: Trim removal
Bottom Cover 1. Remove the bottom cover: See Figure 6--3, page 6--12.

2. Orient the instrument: Set the instrument so its top is down on the work
surface and its bottom is facing you.
a. Remove the five T-15 Torxdrive screws that secure the bottom cover to
the instrument.
b. Remove the bottom cover from the instrument.
3. Reinstallation: Do in reverse steps a and b to reinstall the cabinet feet.
Bottom cover
T-15 Torxdrive
screw (5)
Figure 6-- 3: Bottom cover removal

Covers 1. Remove the left and right covers: See Figures 6--4 and 6--5, pages 6--14
and 6--15.
H Trim (all)
H Bottom cover
2. Orient the instrument: Set the instrument so its rear is on the work surface
and the front of the instrument facing the technician.
NOTE. All mounting screw holes are indicated by a star etched around the
mounting hole.
a. Remove the thirteen T-15 Torxdrive screws that secure the covers to the
top and both sides of the chassis.
b. Remove the nine T-15 Torxdrive screws that secure the covers to the
bottom of the chassis.
c. Pull the bottom-right cover down and slide to the right to remove from
the instrument. Pull the top-left cover upward and slide to the left to
remove from the instrument.
CAUTION. Take care not to bind or snag the covers on the instrument’s internal
cabling as you remove or install.
3. Reinstallation: Do in reverse steps a through c to reinstall the cabinet.

Left side cover All left and right

cover mounting
holes are
indicated as
shown.
T-15 Torxdrive
screw (13)
Right side cover
Figure 6-- 4: Cover removal

Left side cover
Right side cover
T-15 Torxdrive
screw (9)
Figure 6-- 5: Cover removal

Line Fuses and AC power 1. Assemble equipment and locate modules to be removed: Locate the power
cord connector switch, line fuses and AC power cord connector in Figure 6--6, page 6--17.
2. The instrument has a built-in soft power-off function that safely powers off
the instrument when you press the On/Standby switch. You must power off
the instrument using the Windows 98 shutdown process before depressing
the front panel On/Standby switch.
3. Power off the rear panel power switch before servicing the line fuses or
power cord.
CAUTION. When powering off the instrument, use the Windows 98 shut down
procedure. (Choose Shutdown from the Start menu.)
Powering down the instrument without using the Windows 98 shut down
procedure can corrupt the software on the hard disk.
surface and its rear is facing you. If you are servicing the line fuses, do the
next step; if you are servicing the line cord, skip to step 6.
5. Remove line fuses: Find the fuse caps on the rear panel. Now, remove both
fuse caps by turning them counterclockwise using a flat-bladed screwdriver,
and remove the line fuses. Reverse procedure to reinstall.
6. Remove line cord: Find the line cord on the rear cover. Pull the line cord
away to remove from the AC power connector. Reverse procedure to
reinstall.
7. Reinstallation: Do in reverse steps 5 and 6 to reinstall the line cord and then
the line fuse.

AC power cord
connector
Power
switch
AC power cord
Line fuse
holder
Line fuses
Figure 6-- 6: Line fuses and line cord removal

Pouch
Left side trim

Top cover trim
Left side cover
Rear foot
Right side cover

Front panel trim
Right side trim
Carrying handle
Front panel cover

Acquisition trim Chassis
Bottom cover
Figure 6-- 7: External modules

Hard-drive
CD-drive
CD-drive Interface board
Microprocessor, fan and heat sink
Fan assembly
NLX board
Riser board
Processor board
Display adapter board Floppy disk drive
Low-voltage power
supply assembly
Front panel board

Front panel keypad Rear power
distribution
Standby/On switch board
Front panel assembly Front power
Display module distribution
assembly board
Figure 6-- 8: Internal modules

Large interface
circuit board
Large module
chassis
Small module
chassis
Electrical front
end circuit board Acquisition assembly
Acquisition
circuit board
Figure 6-- 9: Acquisition modules

Procedures for Modules

You should have completed the Procedures for external modules before doing
many of the procedures in this collection. The procedures found here are listed in
disassembly order:
H Front Panel assembly
H Front Panel Board
H Front Panel Keypad
H Display assembly
H Display Adapter Board
H Standby/On Switch Flex Circuit
H Floppy Disk Drive
H Hard Disk Drive
H CD Drive
H Front and Rear Power Distribution Boards
H Low-Voltage Power Supply
H NLX Board
H Microprocessor
H PC Processor Board
H Fan assembly
H Acquisition assembly
H Large Module Interface Board
H Module Slot Doors
H Electrical Modules
H Optical Modules
H 80A01 Module
Front Panel Assembly 1. Locate module to be removed: Locate the Front Panel assembly Figure 6--10,
page 6--22. Additional modules to be removed:
H Trim (Front panel)

2. Remove the Front Panel assembly: See Figure 6--10, page 6--22.
surface and its front panel is facing you.
a. Remove the six T-15 Torxdrive screws that secure the Front panel
assembly to the front chassis.
b. Grasp the top of Front Panel assembly and pull forward to allow access
to the ribbon cable connector on the front panel board.
c. Use the 1@8 inch flat-bladed screwdriver to carefully lift J1 cable
connector lock up to disconnect J1 flex cable from the display module
assembly. See Figure 6--11, page 6--23. Note the connector’s pin 1 index
mark and the black stripe on the cable for later reassembly.
d. Pull the Front Panel assembly forward and remove from the instrument.
4. Reinstallation: Do in reverse steps a through d to reinstall the front panel
assembly.
Floppy disk
support tab (2)
Chassis
slot (2)
J1 ribbon cable
Front panel
assembly
Front panel square
opening (2)
T--15 Torxdrive
screw (6)
Figure 6-- 10: Front panel assembly removal

Black stripe
toward connector
Screwdriver
Screwdriver
Figure 6-- 11: J1 flex cable connector removal
Front Panel Board 1. Locate module to be removed: Locate the Front Panel assembly Figure 6--10,
H Front Panel Knobs
H Trim (front panel)
2. Remove the Front Panel board: See Figure 6--12, page 6--24.
a. Remove the eight T-15 Torxdrive screws that secure the Front panel
board to the Front panel assembly.
b. Pry the board up off the alignment studs. Place a flat bladed screwdriver
in the pry point access holes to pry the board up from the assembly.
c. Remove the board from the assembly.
3. Reinstallation: Do in reverse steps a through c to reinstall the front panel
board.

Front Panel Keypad 1. Locate module to be removed: Locate the Front Panel assembly Figure 6--10,
H Front Panel Knobs
H Trim (front panel)
H Front Panel Board
2. Remove the Front Panel keypad: See Figure 6--12, page 6--24.
a. Pull on each of the keypad support guides to separate the keypad from
the Front panel board. Use a pair of tweezers or equivalent tool to pull
the keypad support guides.
b. Remove the keypad from the front panel board.
T-15 Torxdrive
Front panel board screw (8)
Keypad support
guide (9)
Keypad
Alignment Pry point

stud access hole
Pry point access hole
Figure 6-- 12: Front panel board & keyboard removal

CAUTION. When removing or installing the keypad, make sure you do not touch
the switch contact with your fingers. The oils in your fingers will degrade or
damage the switch contacts. To help prevent damage to the keypad use cotton
gloves when removing or installing the keyboard pad.
3. Reinstallation: Do in reverse steps to reinstall the Keypad, front panel board,

and the front panel assembly. Then see the following instructions:
a. Make sure the keypad is aligned properly on the Front Panel board.
b. Make sure the ribbon cable is routed correctly when installing the Front
Panel into the chassis.
c. Insert the two floppy disk support tabs into the front panel square
openings. Both left front panel tabs must go into the chassis slots. See
Figure 6--10, page 6--22.
Display Assembly 1. Locate module to be removed: Locate the Display assembly, Figure 6--13,
H Trim (front panel & top)
CAUTION. To avoid damage to the front panel Standby/On switch assembly, do

not set the Display module assembly on a work surface. Sliding the instrument
over the edge of the work surface could break off the Standby/On switch
assembly.
3. Remove the Display assembly: See Figure 6--13, page 6--26.

a. Remove the four T-15 Torxdrive screws that secure the Display assembly
to the chassis.
b. Grasp the top edge of the Display assembly and pull forward far enough
to allow access to the flex cable connector.
c. Disconnect J8 flex cable from the display assembly. Remove the display
module assembly from the instrument. See Figure 6--13, page 6--26.

T-15 Torxdrive
screw (4)
J8 flex cable
Display
assembly
Figure 6-- 13: Display removal
4. Remove the Touch panel from the Display assembly: See Figures 6--14 &
6--15, pages 6--27 and 6--28.
CAUTION. To prevent degradation of the display sharpness, this procedure must

be performed in a dust free environment. The service technician should wear
cotton gloves to prevent finger oils from contaminating all surfaces of the display
glass.
a. Disconnect J1, J9 and J10 cables from the Display Adapter circuit board.
b. Separate the assembly by carefully prying the Touch panel (outer)
assembly from the Display (inner) assembly. Insert a flat-bladed
screwdriver in the access notches to push out on the Touch panel
assembly.

Access notches
(top and bottom)
Touch panel LCD module
Figure 6-- 14: Touch panel & LCD assembly removal
5. Reinstallation: Do in reverse steps 1 through 5 to reinstall the Display

assembly.
Display Adapter Board 1. Locate module to be removed: Locate the display adapter board in the locator
diagram Internal Modules, Figure 6--7, page 6--18. Additional modules to be
removed:
H Display assembly
2. Remove the Display Adapter Board: See Figure 6--15 and Figure 6--16, page
6--28.
a. Disconnect J11, J1, J7, J8, and J9 cables from the Display Adapter board.
b. Slide the clip off the connector (at J10).
c. Disconnect J10 cable from the Display Adapter board.
d. Remove the two T-15 Torxdrive screws that secure the Display Adapter
circuit board to the Display assembly. Remove the Display Adapter from
the assembly.
3. Reinstallation: Do in reverse steps 2a through 2d to reinstall the board.

Display module
J7
J10
J1
J9
Display J8
adaptor board
T--15
Torxdrive
Back view screw (2)
Figure 6-- 15: Display adaptor board removal
J1
Slide the clip
over connector
J10 Clip to secure

connector as
shown
Figure 6-- 16: Connector clip assembly

Standby/On Switch Flex 1. Locate module to be removed: Locate the Standby/On Switch flex circuit in
Circuit Removal the locator diagram Internal Modules, Figure 6--8, page 6--19. Additional
modules to be removed:
H Display assembly
2. Orient the oscilloscope: Set the oscilloscope so its bottom is down on the
work surface and its front is facing you.
3. Remove the Standby/On Switch flex circuit: See Figure 6--17, page 6--30.
a. Peel the Standby/On switch flex circuit away from the front of the
display assembly.
b. Disconnect the flex circuit from J9 on the Display Adapter circuit board.
c. Grasp the flex circuit and pull it out of the Display assembly.
4. Reinstallation: Do following procedure to reinstall the Standby/On Switch.
a. Remove the protective backing on the Standby/On switch flex circuit.
b. Slide the connector end of the Standby/On switch flex circuit through the
slot in the Display assembly. Make sure the flex circuit connector aligns
with J9 on the Display Adapter circuit board.
c. Align the holes in the flex circuit to the two index posts on the front side
of the Display assembly.
d. Firmly press the flex circuit to the Display assembly chassis surface.

Display
assembly
Standby/On switch
flex circuit
Front view
Display adaptor board
Standby/On switch
flex circuit
J9
Back view
Figure 6-- 17: Standby/On switch flex circuit removal

Floppy Disk Drive 1. Locate modules to be removed: Locate the Floppy Disk Drive in the locator
removed:
H Display assembly
2. Remove the floppy disk drive: Use Figure 6--18, page 6--31 as a guide.
A #0 phillips screwdriver is required for this procedure.
a. Remove the two small phillips screws that secure floppy disk drive
assembly to the bracket. Use the access hole located on the outer chassis
to remove one of the small phillips screws.
b. Slide the floppy drive out toward the front of the instrument far enough
to allow you to disconnect the ribbon cable connector.
c. Remove the floppy drive from the instrument.
4. Reinstallation: Do in reverse steps a through c to reinstall the floppy disk
drive.
Ribbon
cable
Access
hole (2)
Floppy drive
Small phillips screw (2)
Figure 6-- 18: Floppy disk drive removal

Hard Disk Drive 1. Locate module to be removed: Locate the Hard Disk Drive in the locator
diagram Internal Modules, Figure 6--8, page 6--19.
CAUTION. Do not remove the replaceable hard disk drive when the mainframe is
powered on.
The replaceable hard disk drive may be permanently damaged if it is removed
while the mainframe is powered on.
Always power down the mainframe before removing the replaceable hard disk
drive.
surface and its rear panel is facing you.
3. Remove the hard disk drive: See Figure 6--19, page 6--33.
a. Verify that the chassis is powered down.
b. Push the hard disk drive cover in and the hard drive will disconnect from
the latch.
c. Grasp the hard disk drive assembly and slide it out of the instrument.
4. Reinstallation: Do in reverse steps a and b to reinstall the hard disk drive
assembly. The hard disk drive will push in to lock and push in again to
unlock.

Depress
the latch
Remove the
hard disk drive
Figure 6-- 19: Hard drive disk removal
5. Remove the hard disk drive from the cartridge: See Figure 6--20, page 6--33.
a. Remove the four #0 phillips screws that fasten the hard disk drive to the
cartridge.
b. Carefully remove the hard disk drive from the cartridge, and remove the
cable assembly from the connector on the hard disk drive.
Remove 4 screws
Figure 6-- 20: Removing the hard disk drive from the cartridge

CD Drive 1. Locate module to be removed: Locate the CD Drive in the locator diagram
Internal Modules, Figure 6--8, page 6--19. Additional modules to be
removed:
H Trim (all)
H Bottom cover
2. Remove the CD Drive assembly: See Figure 6--21, page 6--35.
surface and its rear panel is facing you.
a. Remove the two T-15 Torxdrive screws that secure CD Drive assembly
to the rear chassis.
b. Disconnect the CD Drive ribbon cable J230, from Riser board.
c. Slide the CD Drive assembly (with the cable attached) toward the rear of
the chassis and remove it from the instrument.
4. Remove the CD Drive bracket and Rom interface board: See Figure 6--21,
page 6--35.
a. Remove the four #0 phillips screws that secure the bracket to the CD
Drive. Remove the CD Drive from the bracket.
b. Remove the Interface board from the CD Drive by pulling the Interface
board straight back until they separate.
5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the CD Drive
assembly.

CD drive
interface board
CD drive
CD drive
ribbon cable
#0 Phillips
Disconnect screw (4)
J230 CD drive
ribbon cable CD drive bracket
T--15 Torxdrive
screw (2)
Figure 6-- 21: CD drive & bracket removal
Fan Assembly Removal 1. Locate module to be removed: Locate the Fan assembly in the locator
removed:
H Trim (all)
H Bottom cover
surface and its left side is facing you.

3. Remove the fan assembly: See Figure 6--22, page 6--36.
CAUTION. Take care when handling the fan assembly, the fan blades are brittle
and can be easily damaged .
a. Disconnect the fan from processor/display board: Disconnect the fan’s

two power cables J130 and J170 located on the processor board.
b. Remove the two T-15 Torxdrive screws securing the fan assembly to the
top main chassis.
c. Lift the fan assembly up and out from the chassis.
4. Reinstallation: Do in reverse steps a through c to reinstall the fan assembly.
Disconnect
from J130
Disconnect
from J170
Figure 6-- 22: Fan assembly removal

Front and Rear Power 1. Assemble equipment and locate modules to be removed: Find the modules to
Distribution Boards be removed in the locator diagram Internal Modules, Figure 6--8, page 6--19.
Additional modules to be removed:
H Trim (all)
H Bottom cover
2. Orient the instrument: Set the instrument so its left side is down on the work
surface and its right side is facing you.
3. Remove the Front power distribution board: See Figure 6--23, page 6--37.
a. Grasp the Front power distribution board and pull it out from the
instrument to disconnect it from the following connectors; J2 Power
supply board, J102 Electrical front-end board, and J202 Acquisition
board.
b. Remove the Rear power distribution board: Grasp the Rear Power
Distribution board and pull it out from the instrument to disconnect it
from the following connectors; J201 Processor board, J1 Power supply
board, J301 Electrical front-end board, and J102 Acquisition board.
4. Reinstallation: Do in reverse steps a and b to reinstall the front and rear
power distribution circuit boards.
Rear power
distribution
circuit board
Front power
distribution
circuit board
Figure 6-- 23: Front & rear power distribution board removal

Low-Voltage Power 1. Assemble equipment and locate modules to be removed: Locate the modules
Supply to be removed in the locator diagram Internal Modules, Figure 6--8,
NOTE. In addition to this topic, see Checking the Power Supply Voltages on
page 6--72 in the Troubleshooting section.
H Trim (all)
H Bottom cover
H Front and Power rear distribution boards
2. Orient theinstrument: Set the instrument so its bottom is down on the work
surface and its right-side is facing you.
3. Remove the low-voltage power supply: See Figure 6--24, page 6--39.
a. Disconnect J930 ribbon cable connector from the PC processor board.
b. Remove the two T-15 Torxdrive screws securing the low-voltage power
supply to the right-side chassis support.
c. Remove the three T-15 Torxdrive screws securing the low-voltage power
supply to rear chassis.
d. Grasp the low-voltage power supply and carefully slide the assembly out
of the mainframe.
4. Reinstallation: Do in reverse steps a through c to reinstall the low-voltage
power supply.

T-15 Torxdrive screw (3)
Low-voltage power supply

T-15 Torxdrive screw (2)
Figure 6-- 24: Low-voltage power supply removal

NLX Board 1. Locate module to be removed: Locate the NLX Board in the locator diagram
Internal Modules, Figure 6--8, page 6--19. Additional modules to be
removed:
H Trim (all)
H Bottom cover
2. Remove the NLX Board assembly: See Figure 6--25, page 6--41.
surface and its top panel is facing you.
a. Remove the two T-15 Torxdrive screws that secure the floppy disk drive
assembly into the front chassis.
b. Slide the floppy drive assembly, with cable attached, out toward the rear
of the instrument. Place floppy drive assembly on top of the hard/CD
drive bracket.
c. Remove the five T-15 Torxdrive screws that secure NLX board assembly
to the chassis.
d. Remove the five T-15 Torxdrive screws that secure NLX board assembly
to the rear chassis.
e. Grasp the front edge of the NLX board assembly and pull up on the
assembly to disconnect the Riser Adapter from the PC Processor board’s
edge connector.
f. Remove the NLX board assembly from the instrument.

Hard/CD drive
bracket
Place floppy drive assembly on

top of hard/CD drive bracket
NLX board
assembly
Riser adapter
board
Leave floppy drive

cable attached
Remove floppy
drive assembly
from front chassis
Processor board
edge connector
Figure 6-- 25: NLX assembly removal
4. Remove the Riser Adapter and NLX boards: See Figure 6--26, page 6--42.
a. Remove the two T-15 Torxdrive screws that secure Riser Adapter board
to the NLX support bracket.
b. Disconnect the ribbon cable connectors from the floppy drive, hard drive
and CD drive.

c. Remove the floppy drive assembly from the NLX board assembly.
d. Grasp the Riser board and pull it straight out to disconnect J510 edge
card connector from the NLX board. Remove the Riser Adapter board
from the NLX board assembly.
e. Remove the four T-15 Torxdrive screws that secure NLX board to the
NLX support bracket.
f. Remove the six 3/16 nut posts that secure the three connectors to the rear
of the support bracket. Then remove the NLX board from the support
bracket.
g. Remove the NLX board from the support bracket.
5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the NLX board.
. T--15 Torx screw (4)
Floppy
drive cable
NLX board
Riser adapter
board
T--15 Torx
screw (2)
Hard drive cable

connector
CD drive cable
connector J510
Nut
post (6)
NLX support
bracket
Figure 6-- 26: Riser adapter & NLX board removal

Microprocessor 1. Locate module to be removed: Locate the Front Panel board in the locator
removed:
H Trim
H Bottom cover
CAUTION. The microprocessor is susceptible to static-discharge damage. Service

this component only in a static-free environment. Observe standard handling
precautions for static-sensitive devices while servicing the chassis. Always wear
a grounded wrist and foot straps while servicing the microprocessor, NLX or
processor boards.
2. Remove the microprocessor: See Figure 6--27, page 6--44.

a. Disconnect the fan power cable J401 from the NLX board.
b. Push down and pull out on the holding bracket located nearest to the
outer edge of the circuit board.
c. Pull out and unlatch the remaining bracket. Lift the fan/heatsink
assembly out from the microprocessor.
d. Lift the microprocessor socket locking lever upward. Remove the
microprocessor.
3. Reinstallation: To reinstall the microprocessor to the NLX board as follows:
a. Install the microprocessor in the socket.
b. Lower the socket locking lever.
c. Make sure the fan/heatsink assembly is positioned with the fan cable
toward the outer edge of the circuit board.
d. Place the fan/heatsink assembly on the microprocessor to allow you to
latch the bracket to the tab that is nearest to the center of the circuit
board.
e. Set the remaining edge of the fan/heatsink down on the microprocessor
and fasten the remaining bracket to the assembly.
f. Connect the fan power cable J401 from the NLX board.

Fan and heatsink
Microprocessor
Locking lever
Push down
and pull out to
release clamp
Push down
and pull out to J401 power cable
release clamp
NLX board
Figure 6-- 27: Microprocessor removal

PC Processor Board 1. Locate module to be removed: Locate the PC Processor Board assembly in
the locator diagram Internal Modules, Figure 6--8, page 6--19. Remove the
following in this order:
H Trim (all)
H Bottom cover
H Hard Disk and CD Drive
H Floppy Disk Drive
H NLX Board
surface and its top panel is facing you.
3. Remove the PC Processor board assembly: See Figure 6--28, page 6--46.
a. Disconnect J190 and J691 ribbon cables from the PC processor board.
b. Remove the nine T-15 Torxdrive screws securing the PC processor board
to the chassis support.
c. Remove the five T-15 Torxdrive screws securing the PC processor board
assembly to the rear chassis.
4. Remove the PC Processor Board: See Figure 6--28, page 6--46.
a. Remove the two 3/16 nut posts that secure the RS--232 connector to the
rear of the support bracket.
b. Remove the two 5/16 nut posts that secure the sub-D connector to the rear
of the support bracket.
c. Remove the two phillips screws that secure the PCMCIA (Personal card,
memory card interface adapter) to the pc processor board. Remove the
PCMCIA from the PC processor board.
d. Disconnect J930 ribbon cable connector from the PC processor board.
e. Then remove the PC processor board from the instrument.
5. Reinstallation: Do in reverse steps 3 and 4 to reinstall the PC processor
assembly.

J190
J691 J690
T--15 Torx
screw (9)
Phillips screw (2)
PC processor
board Support
J930 bracket
3/16 Nut post (2)
5/16 Nut post (2)
Chassis support
Disconnect
from J930
Figure 6-- 28: Processor board removal

Acquisition Assembly 1. Locate module to be removed: Locate the Acquisition assembly in the locator
diagram, Figure 6--9, page 6--20. Remove the Acquisition assembly
following in this order:
H Trim
H Bottom cover
3. Remove the Acquisition assembly: The Acquisition assembly includes, the
Acquisition board and Electrical Front End board. See Figure 6--30,
page 6--50 (8000 instrument) or Figure 6--31, page 6--51 (8000B instrument).
a. Remove the 5/16 inch nut that secures the TRIGGER PRESCALE SMA
cable to the front panel.
b. Remove the ten T-15 Torxdrive screws securing the Acquisition
assembly to the chassis.
NOTE. Six (seven on the 8000B) Acquisition assembly screws are 0.312 inch long.
Three Acquisition assembly screws are 1.750 inch long. The 1.750 inch screw
locations are marked on the circuit board.
c. Disconnect the one SMB connector that is connected to the trigger

hybrid, located on the front edge of the Acquisition circuit board.
d. Disconnect two coaxial cables from J8 and J16, located on the Acquisi-
tion circuit board.
e. Disconnect coaxial cable from J5, located on the Acquisition circuit
board (8000B only). See Figure 6--31, page 6--51.
f. Disconnect J10 ribbon cable connector from the J930 processor board.
g. Orient the instrument: Set the instrument so its front panel surface is
facing you. Push the module slot covers in to access the slot connectors
and attaching hardware.

CAUTION. Note the locations of the T-10 Torxdrive screws and the 3/16 inch hex
threaded posts for later reassembly. Make sure you reinstall the Torxdrive screw
and threaded posts in the correct position. The 3/16 inch hex threaded posts have
etched lines around their mounting holes. Interchanging the threaded posts with
the Torxdrive screws could cause damage to your module connector. See refer to
Figure 6-- 29 for hardware locations.
CAUTION. Do not interchange the small and large sampling module threaded
posts. The large slot sampling module threaded posts are single threaded posts
and the small slot sampling module posts are double threaded posts. Installing
the double threaded posts into the large module slot could damage the large
module connector.
3/ Inch hex double

T-10 Torxdrive 16
screw (4) threaded post (4)
Small slot
Large slot
3/ Inch hex single
16 T-10 Torxdrive
threaded post (2) screw (2)
Figure 6-- 29: T-10 screws and threaded posts
h. Remove the four 3/16 inch hex threaded post from each small module
slot.
i. Remove the four T-10 Torxdrive screws from each small module slot.
j. Disconnect J6 ribbon cable connector from the large module circuit
board.

k. Disconnect J5 coaxial cable connector from the large module circuit

board.
l. Disconnect the three coaxial cables connected to the front panel;
INTERNAL CLOCK OUTPUT, DC CALIBRATION OUTPUT, AND
EXTERNAL 10 MHz REFERENCE INPUT.
m. Disconnect the TRIGGER PROBE POWER ribbon connector from J25
on the Electrical front end board.
n. Slide the Acquisition assembly back toward the rear of the instrument
then lift up and out of the instrument.
4. Reinstallation: Do, in reverse order, substeps h through n.

T--15 Torxdrive
J6 ribbon cable screw (7)
(disconnect from Large T--15 Torxdrive
module circuit board) long screw (3)
Trigger hybrid
J10 ribbon cable

(disconnect from J930 Acquisition
processor board) circuit board
J25 connector for trigger

probe power ribbon cable J8 and J16 coaxial cables
(disconnect from Acquisition
Small module board)
interface board
SMB cables (disconnect

Coaxial cables from trigger hybrid on the
(disconnect from front Acquisition board)
panel connectors)
Large module
interface circuit
board
Trigger
prescale
SMA nut
J25 trigger probe power ribbon DC calibration output

cable (disconnect from Small (disconnect coaxial cable
module interface board) from back of connector)
External 10MHz reference Internal clock output

input (disconnect coaxial cable (disconnect coaxial cable
from back of connector) from back of connector)
Figure 6-- 30: Acquisition circuit board assembly removal (8000)

Large module trigger cable

(disconnect from J5 on
Large module circuit board)
T--15 Torxdrive
J6 ribbon cable screw (7) T--15 Torxdrive
(disconnect from Large long screw (3)
module circuit board)
Trigger hybrid
J5
J16
J10 ribbon cable J8

(disconnect from J930 Acquisition
processor board) circuit board
J5 coaxial cable
J25 connector for trigger
(disconnect from
probe power ribbon cable
Acquisition board)
Small module J8 coaxial cable (disconnect
interface board from Acquisition board)
J16 coaxial cable (disconnect

from Acquisition board)
Coaxial cables
(disconnect from front SMB cable (disconnect
panel connectors) from trigger hybrid on
Acquisition board)
Large module
interface circuit
board
Trigger
prescale
SMA nut
J25 trigger probe power ribbon DC calibration output

cable (disconnect from Small (disconnect coaxial cable
module interface board) from back of connector)
External 10MHz reference Internal clock output

input (disconnect coaxial cable (disconnect coaxial cable
from back of connector) from back of connector)
Figure 6-- 31: Acquisition circuit board assembly removal (8000B)

Large Module Interface 1. Locate module to be removed: Locate the Large module Interface circuit
Circuit Board board in the locator diagram, Figure 6--9, page 6--20. Remove the Large
Module Interface circuit board following in this order:
H Trim
H Bottom cover
H Front and Rear Power Distribution boards
3. Remove the Large Module Interface circuit board:
a. Remove the two 3/16 inch hex threaded post from each optical module
slot. See Figure 6--29, page 6--48
b. Remove the two T-10 Torxdrive screws from each optical module slot.
c. Remove the T-15 Torxdrive screw located on the Large Module Interface
circuit board. See Figure 6--32, page 6--53.
d. Lift up on the rear of the Large Module Interface circuit board and lift
the board out of the instrument.
4. Reinstallation: Do, in reverse order, substeps a through d.

T--15 Torxdrive
screw (1)
Large module
interface circuit
board
Figure 6-- 32: Large module interface circuit board removal
Module Slot Doors 1. Assemble equipment and locate modules to be removed: Locate the Module
Slot Doors in the locator diagram. Figure 6--9, page 6--20. Additional
modules to be removed:
H Trim
H Bottom cover
H Front and Rear Power Distribution boards
surface and its front is facing you.

3. Remove the small module chassis: See Figure 6--33,

page 6--55.
a. Remove the nine T-10 Torxdrive screws from front panel.
CAUTION. One of these Torxdrive screws secures a 5/16 inch hex nut and
grounding lug to the inside chassis. When removing the top right T-10 Torxdrive
screw, make sure this ground nut is retained for later reassembly.
See Figure 6-- 33, page 6-- 55.
b. Remove the seven 5/16 inch hex nuts that secures the small module
chassis to the instrument.
c. Lift the chassis up and out of the instrument.
4. Remove the large module chassis: See Figure 6--33,
page 6--55.
a. Remove the four T-10 Torxdrive screws from the front panel.
b. Remove the eleven 5/16 inch hex nuts that secure the optical module
chassis to the instrument.
c. Remove all the snap-on ejector lever handles.
d. Lift the back of the chassis up over the studs, then slide the chassis to
the rear and out of the instrument.

Lock nut (7)
Small module
chassis
Small module chassis removal

Ground nut
Ejector handle (6)
T--10 Torxdrive
screw (9)
Ground nut screw
Lock nut (11)
Large
module
chassis
T--10 Torxdrive
Large module chassis removal screw (4)
Figure 6-- 33: Small and Large module chassis removal

5. Remove the module slot doors: See Figures 6--34 & 6--35,
pages 6--57 & 6--58.
6. Orient the small or large module chassis: Set the chassis so the module slot
cavities with springs and slot guides are facing you.
a. Remove both slot door springs by prying the spring arm from the small
slots located on the sides of the module slot. Use a pair of tweezers to
pull the spring arms out from the slot.
NOTE. There is a right and left spring, note locations of the springs for later
reassembly.
b. Push the module slot door slighting in while lifting the door out of the
chassis.

Module
door spring
Module door
Large module chassis
Figure 6-- 34: Module door spring removal

Spring arm
Large module
chassis
Module door
Large module
chassis
Small module
chassis
Figure 6-- 35: Module slot door removal

7. Remove the module ejector levers: See Figures 6--36 & 6--37, pages 6--60
6--61.
8. Orient the small or large module chassis: Set the optical chassis so the
module ejector levers are facing you.
a. Remove both T-10 Torxdrive screws that secure the ejector lever to the
optical chassis.
b. Remove both brass washers, ejector lever and ejector spring.
9. Reinstallation: Perform the following procedure to reinstall the ejector levers
and module slot doors.
a. Place the ejector spring over the pem nut standoffs (pivot and slider).
One spring arm is positioned next to the ejector lever spring tab. The
other spring arm is positioned to the left-side of the stud post.
b. Place the ejector lever over the ejector spring and pem nut standoffs
(pivot and slider).
NOTE. Make sure the ejector lever is positioned correctly. The ejector lever has a
dimple protruding to accommodate the snap-on handle. When installing the
ejector lever this dimple must be facing up from the optical chassis. Refer to
Figure 6-- 36 on page 6-- 60.
c. Place brass shoulder washers over both pivot and slider mounting
positions.
d. Install both T-10 and Torxdrive screws to secure the pivot and slider
mounting positions.
e. Move the left spring arm to the right-side of the stud post. The right
spring arm must be on the left of the lever tab. Refer to Figure 6--37,
page 6--61.

T--10 screw (2)
Brass washer (2)
Dimple
Spring tab
Spring arm
Ejector lever
Ejector handle
Stud post
Slider standoff
Pivot
standoff
Small module chassis
Figure 6-- 36: Module ejector handles removal

Spring arm position
Figure 6-- 37: Spring arm position

Electrical Modules 1. Orient the sampling module: Set the sampling module so its left side is down
on the work surface and its right side is facing you.
CAUTION. Static discharge can damage any semiconductor in the instrument or

sampling module. To prevent damage from static discharge wear wrist and foot
grounding straps while handling sampling module chassis. Service should be
performed in a static-free work station by a qualified service technician.
Minimize handling of static-sensitive components.
2. Remove the cover: See Figure 6--38, page 6--62.

a. Remove two phillips screws that secure the front panel to the cover.
Remove the front panel.
b. Remove the four phillips screws that secure the cover to the chassis.
c. Slide the chassis out toward the rear of the cover.
Chassis
Cover
Front panel
Figure 6-- 38: Electrical module hardware removal

Exchanging the Electrical Sampling Module
Replacing the sampling If it is determined that a sampling module failure is caused by an internal part,
module chassis you must exchange the complete sampling module chassis to Tektronix. The
customer will keep the cover and attaching hardware. Sampling module
exchange can be made with either your local Tektronix service center or central
Tektronix exchange in Beaverton, Oregon.
1. Transport the chassis sampling modules with terminations on the inputs.
2. Transport the chassis sampling modules in their original containers and store
the sampling modules on a metal or conductive surface.
3. When handling the exposed chassis sampling module only, do not touch any
exposed component on the circuit board. Grasp the exposed module by the
edges of the circuit board or the rear or front housings.
Reinstalling exchange Program the serial number (printed on the sampling module cover) into the new
module serial number replacement sampling module chassis.
1. Reinstall the chassis into the cover following the procedure on page 6--62.
2. Install the electrical sampling module into one of the instrument’s slots.
3. Connect a GPIB cable to the GPIB port of the instrument connect the
remaining end to the GPIB port of a PC.
CAUTION. Do not have any user interface dialogs active. Dialogs such as
Compensation, System properties will prevent the instrument from responding to
GPIB commands.
4. Enter the following GPIB commands:

a. SYSTem:PROTect OFF
b. SYSTem:PROPerties:CH(1-8):SERialnum <serialNum_string>
Example: SYST:PROP:CH3:SER “B010123”
NOTE. For a 2 channel sampling module either channel can be specified in

step b. For an 80E01 sampling module use only the lower numbered channel
number such as CH1 or CH3.
c. SYSTem:PROTect ON

5. Verify the serial number change: Pull down the Utility menu and then select
System Properties, Sampling Modules. Click on the channel you want to
verify, such as C3 or C4. This display will confirm the sampling module
serial number.
Optical Modules 1. Orient the optical sampling module: Set the optical sampling module so its
left side is down on the work surface and its right side is facing you.
2. Remove the cover: See Figure 6--39.
a. Remove the seven T-10 Torxdrive screws (80C02 has eleven T-10
Torxdrive screws, four T-10 Torxdrive screws on the top cover) that
secure the cover to the module chassis.
b. Lift the rear of the cover up and slide back about 1/2 inch, then lift the
non-optical connector side up toward the optical connector side.
c. Remove the cover from the chassis.
3. Reinstallation: Do in reverse steps a through d to reinstall the front panel
assembly.
1: Lift back edge of

the cover to clear
the rear connector
Locking tab
2: Slide the cover back to
free the locking tab at the
front edge of the cover
3: Rotate and lift

Optical connector cover from module
Figure 6-- 39: Optical module cover removal

80A01 Module 1. Orient the module: Set the 80A01 module so that its left side is down on the
work surface and its right side is facing you.
CAUTION. Static discharge can damage any semiconductor in the instrument or

sampling module. To prevent damage from static discharge wear wrist and foot
grounding straps while handling the module chassis. Service should be per-
formed in a static-free work station by a qualified service technician. Minimize
handling of static-sensitive components.
2. Remove the front panel: See Figure 6--40, page 6--65.

a. Remove two coaxial terminators on the front panel connectors.
b. Remove two phillips screws that secure the front panel to the cover.
Remove the front panel.
Lock-down shaft
Shaft bracket
Antistatic label
Chassis
Terminators
Cover
Front panel
Label
Figure 6-- 40: 80A01 parts removal

3. Remove the cover: See Figure 6--40, page 6--65.

a. Remove the six phillips screws that secure the cover to the chassis.
b. Slide the chassis out toward the rear of the cover.
4. Remove the lock-down shaft and bracket: See Figure 6--40, page 6--65.
a. Remove the two phillips screws that secure the bracket to its mount.
Remove it.
b. Lift out the lock-down shaft.
5. Reinstallation: Perform steps 2 through 4 in reverse to reassemble the 80A01
module.
a. If installing a replacement the front panel, do the following steps before
performing step 2:
H Remove the backing from the front panel label.
H Align the holes and attach to the front panel.
b. If installing a replacement cover, do the following steps before perform-
ing step 3:
H Remove the backing from the antistatic label.
H Install the antistatic label to the replacement cover.

Troubleshooting
This section contains information and procedures designed to help you isolate
faulty modules in the instrument. If a module needs to be replaced, follow the
Removal and Installation Procedures located in this section.
Check for Common Problems

Use Table 6--4 to quickly isolate possible failures. The table lists problems
related to the instrument and possible causes. The list is not exhaustive, but it
may help you eliminate a problem that is quick to fix, such as a blown fuse or
loose cable.
Table 6-- 4: Failure symptoms and possible causes
Symptom Possible cause(s)

Mainframe will not power on H Power cord not plugged in.
H Failed fuse.
H Faulty power supply.
H Faulty modules.
H Main power switch (rear panel) not on.
H Front panel power switch not on.
H Monitor not connected properly.
Front panel light comes on H Faulty fan cable.
(mainframe powers on), but H Defective fan assembly.
one or more fans will not
operate H Faulty power supply.
Mainframe powers on but no H Wrong channel is selected, Waveform Selector and Setup
signal displayed menus.
H Module not fully installed into the slot.
H Signal cable not connected properly.
H Wrong trigger input, check signal cable and Setup menus
are Direct or Prescale.
Controller appears “dead”; H SO DIMMs incorrectly installed or missing.
power light comes on, but H Defective NLX board
monitor screen(s) is (are)
blank

Troubleshooting
Table 6-- 4: Failure symptoms and possible causes (cont.)

Flat LCD panel display blank H External monitor plugged in but not powered on.
H External monitor plugged in (look on external monitor for
display).
H Connect an external monitor cable to the SCOPE ONLY
VGA OUT rear panel connector. If monitor has a display,
replace the LCD panel assembly.
H Connect an external monitor cable to the SVGA OUT rear
panel connector, if monitor has a display the BIOS may
need to be setup.
H If the BIOS is OK then, replace the Power PC circuit board
assembly.
H Connect an external monitor cable to the SVGA OUT rear
panel connector. If the monitor has no display, replace the
NLX circuit board assembly.
H If the monitor has no display when connected to the SVGA
OUT rear panel connector, replace the NLX circuit board
assembly.
H Defective cable from front panel board to riser board.
H Defective cable from Power PC board to front panel board.
Front panel LEDs do not light. H Replace the front panel board.
Hard disk drive related H Defective hard disk drive.
symptoms H Incorrect hard disk type selected in the BIOS setup.
H Replaceable hard disk drive not installed.
H Power supply failure.
H Corrupted controller BIOS module firmware, reinstall
firmware.
H Controller BIOS setup problem. See BIOS Settings.
H Replaceable hard disk drive or optionally field installed fixed
hard disk drive not configured as bootable (slave) master
hard disk drive.
H Faulty benchtop controller.
CD-ROM related symptoms H Defective CD-ROM.
H Defective CD-ROM drive cable.
H Defective CD-ROM board.
H Incorrect CD-ROM configuration in the BIOS setup.
Diagnostic errors H Remove all electrical and optical modules from the
instrument, then diagnostics again. If the instrument passes
diagnostics, check for the electrical and optical module that
is causing the failures. Then run diagnostics again.
H If the instrument fails the diagnostics without the installed
modules replace the Acquisition assembly. The run
diagnostics again.

Troubleshooting
Table 6-- 4: Failure symptoms and possible causes (cont.)

Compensation errors H Remove all electrical and optical modules from the
instrument, then run compensation again. If the instrument
passes compensation, check for the electrical and optical
module that is causing the failure.
H Verify that each module is completely installed into the slot.
If the instrument still fails compensation, replace the
Acquisition assembly.
Modules not recognized H Module firmware incompatible with mainframe software
version.
H Faulty module. Refer to appropriate module service manual
for further troubleshooting information.
H Module not fully installed into the slot.
80C0X modules have no H Module not fully installed into the slot.
signals displayed H Wrong channel is selected, Waveform Selector and Setup
menus.
H Signal cable not connected properly.
H Replace optical cables.
H Replace Optical assembly or Acquisition assembly.
80C0X modules; poor noise H Male fiber-fiber connections need to be cleaned. Refer to
performance Table 6--1 on page 6--3.
80C0X modules; frequency H Bad internal O/E RF amplifier de-coupling. Check tightness
response exhibits a steep of all rigid cable interconnect.
negative “droop” in its plot.
BIOS error messages H Refer to the BIOS error message table.
Instrument locks up H Power down the instrument, then restart.
H Replace the NLX assembly.
H Replace the Power PC circuit board assembly.

Troubleshooting
Equipment Required
You will need a digital voltmeter to check power supply voltages, as described on
page 6--72.
Testing might also be required to correct some faults. Under those circumstances,
you will need the test equipment listed in the Performance Verification and
Adjustment Procedures in this manual.
Isolating Failures between the 80E0X/80C0X Modules or the Mainframe

To determine if the sampling module has failed or the mainframe failed, perform
the following:
1. Perform the module compensation. Refer to Perform the Compensation
on page 4--5.
2. Perform the measurement procedures you require to make your test.
3. If the the measurement fails, Remove the sampling module and install it into
another slot.
4. Perform steps 1 and 2, then take the following action:
H If the measurement successfully functions, there is a good chance the
mainframe channel has failed. Perform other mainframe diagnostics in
this section.
H If the measurement fails, there is a good chance the sampling module has
failed. Return to Tektronix, Inc. for repair.

Troubleshooting
Isolating to a Board if If the mains power is on, a red light (see Figure 6--41 for its location) is visible
Power Will Not Come Up through the right side of the instrument.
Mains power-on and over current LEDs are

near the center of the power supply. A red
glow from them is visible while looking
through the side of instrument.
Figure 6-- 41: Location of power-on and over current LEDs
If the instrument thinks power is on, a red light (see Figure 6--41) means that
there is an over current condition.
If the on/standby pin (pin C1 of P201 on the rear power distribution board or pin
B162 on the riser board) is low, the instrument thinks power is on.
Remove boards one at a time to locate a fault (the display, floppy, acquisition
board, front [analog supply to acquisition board] and rear power distribution
boards, the NLX board, and the riser board). If you remove the NLX board, you
must jumper the debug power-on pins (see Figure 6--42). The PPC board and the
rear power distribution board are required for power to come up.
If removing the boards did not find the problem, replace the power supply.

Troubleshooting
Debug
RST
Debug
power-on
Debug VSB5
Figure 6-- 42: Location of debug pins
Checking the Power Supply Voltages

Power off the mainframe and remove any modules installed in it. Power on the
instrument and connect the reference lead of a digital voltmeter to chassis
ground, such as the top of the power supply.
Attach a 0.025 inch square pin to the probe tip of the other lead and insert it into
a pin on one of the connectors. The pins that should be carrying voltages are
listed in Table 6--5. The location of the P1 and P2 connectors is shown in
Figure 6--43 on page 6--73.
Measure the power supply voltages with the voltmeter and compare each reading
to the values listed in the tables. If the voltages are within about 5% of the
nominal voltages, your power supply is functional.
Also see Low-Voltage Power Supply on page 6--38.

Troubleshooting
Table 6-- 5: Power supply voltages
Front power distribution board (P2) Voltage Rear power distribution board (P1) Voltage
Pins A1, B1, C1 +3.3 V Pins A5, B5, C5 +12 V
Pins A13, B13, C13 --15 V Pins A8, B8, C8 +5 V
Pins A15, B15, C15 +15 V Pins A19, B19, C19 +3.3 V
Pins A17, B17, C17 (8000 series only) --5 V
Pins A24, B24, C24 (8000 series only) +5 V
Pins A17, B17, C17 (8000B series only) --5.2 V
Pins A24, B24, C24 (8000B series only) +5.2 V
P1 (power supply)
Rear power
distribution
Front power circuit board
P2 (power supply) distribution
circuit board
Figure 6-- 43: Connectors J1 and J2
If the instrument Will Not If there is a display on the VGA port, but not on the LCD, replace the display
Boot assembly (LCD, lamps, and cable).
If nothing is displayed, is the display turned on? At boot time and while using an
external monitor connected to the NLX external video port, press F2 to enter the
BIOS setup. The Advanced Video Configuration menu lets you select PCI (LCD)
or AGP (the NLX port on the rear panel). The lower VGA port on the rear panel
is the PCI video port (driven by the same video controller as the LCD).
If none of the above is true, the display adapter may be bad.

Troubleshooting
Booting Into Windows If the instrument will not boot, press F8 to enter the start up menu, and boot to
the command prompt. If you can boot to the command prompt, use the MSDOS
Edit program to edit the autoexec.bat file to run the CMOS restore utility (see
Update/Restore the NLX Board CMOS on page 6--77).
If booting starts, finds the hard disk, but hangs displaying the Windows splash
screen:
1. Select the AGP video port using the setup menu.
2. Disable the busses and disconnect the PPC board by installing J840 and J841.
3. If the system boots (it will only boot to Windows, the instrument application
will not run) to the external NLX video port, replace the PPC board.
PPC and NLX PC Diagnostics

The primary diagnostics for the instrument are the power-on diagnostics, the
QA+Win32 diagnostics, and the instrument diagnostics. Procedures for running
these diagnostics are described below.
Power-On Diagnostics The power-on diagnostics check the basic functionality of the instrument at every
power on. If any failures occur at power on, the screen displays the calibration
and diagnostics property page.
The power on tests ensure that hardware is installed and can be accessed by the
software. The tests provide limited diagnostic information, but do not provide
any performance information. The instrument diagnostics provide more extensive
tests than the power-on diagnostics.
The power on tests check the generic hardware including the keyboard, mouse,
memory, CPU, and associated peripherals. The interrupt lines and trigger lines
are also checked.
QAPlus/Win If the instrument passes all the BIOS tests and Windows boots, the primary tree
calls for you to run QAPlus/Win diagnostics software.
QAPlus/Win is a comprehensive diagnostic software application to check and
verify the operation of the PC hardware in the instrument.
To run QAPlus/Win, you must have a working keyboard (a working mouse or
other pointing device is optional) and have the Windows operating system
running. Repair or replace any failed component identified by QAPlus/Win.

Troubleshooting
NOTE. To run QAPlus/Win you must have either a working keyboard or a

working mouse (or other pointing device) and Windows running.
To run the QAPlus/Win diagnostic software, do the following steps:

1. Exit the instrument application.
a. Display the Task Manager by pressing CTRL, ALT, and Delete.
b. Select TDS7000 and then touch End Task.
c. Display the Task Manager by pressing CTRL, ALT, and Delete.
d. Select Windowsscopeservices and then touch End TAsk.
2. Exit all other applications and exit all windows.
3. Click Start → Programs → QAPlus_Win → QAPlus_Win.
4. Touch OK and select the tests you want to perform.
5. To restore the instrument to normal operating condition, reboot the
instrument after QAPlus/Win diagnostic tests are complete.
instrument Diagnostics. If the instrument passes all the QAPlus/Win tests, the
primary tree calls for you to run the instrument Diagnostics. The instrument
Diagnostics are a comprehensive software test that checks the functionality of the
instrument. If the instrument Diagnostics test fails, the instrument is defective.
To run the instrument Diagnostics, do the following steps:
1. Turn off all other applications.
2. From the menu bar, touch Utilities and then select Instrument Diagnostics.
Diagnostics The instrument executes a set of internal diagnostics at every power-up. The
results can be viewed from the Utilities > Diagnostics dialog. To execute
diagnostics Refer to Perform Diagnostics on page to 4--3.
Firmware Updates
Firmware updates are easy to do. Simply install the firmware CD in your
instrument and follow the displayed instructions or the instructions that accompa-
ny the CD.
If you want to order a firmware update, contact your Tektronix service center.

Troubleshooting
After Repair
After removal and replacement of a module due to electrical failure, you must
perform the adjustment or software update as indicated in Table 6--6.
Table 6-- 6: Action required for module replaced
Module replaced Adjustment required Software update required

Front panel assembly No None
Acquisition board Yes Boot ROM and
authorization code
PPC processor board Yes Boot ROM and
authorization code
NLX processor assembly No Windows, instrument
application
Display panel or display system No None
Power supply Yes None
Interconnect boards No None
Fans No None
Installing the Instrument Model and Serial Number

To install a model or serial number into the instrument do the following steps:
1. Connect a PC with a GPIB interface to the GPIB interface of the instrument.
WARNING. Make sure the unique identifier does not end in all zeros before
generating or setting the key.
2. Enter the following GPIB commands, if necessary install a new instrument’s

model number:
SYST:PROT OFF
SYST:PROT:MAI:MODE “TDS8000B” or SYST:PROP:MAI:MODE
“CSA8000B”
SYST:PROT ON
NOTE. Remove the “B” from the model name in the example if your instrument is
not a B model.

Troubleshooting
3. Enter the following GPIB commands, if necessary install a new instrument’s

serial number:
SYST:PROT OFF
SYST:PROP:MAI:SER <serial number string>, e.g. “B010100”
SYST:PROT ON
4. These commands take effect immediately and can be verified by viewing the
mainframe properties: Utilities>System Properties.
Update/Restore the NLX Board CMOS

If the CMOS parameters become corrupted, restore the CMOS memory using the
following procedures:
CAUTION. Only install CMOS parameters from Tektronix. CMOS parameters

from other manufactures may make your instrument inoperable.
This procedure will allow the you to restore the CMOS settings with or without
LAN (local area network). Resnonet command will restore the CMOS with the
LAN disabled. Resnet command will restore the CMOS with the LAN enabled.
If the instrument is running normally or in safe mode:
1. Select Run from the Start menu.
2. From the Run dialog box type one of the following commands:
C:resnet (to enable the network)
C:resnonet (to disable the network)
3. Restart the computer, and hold down F2 while it reboots to get into the BIOS
Setup Utility menu.
4. In the Bios Setup Utility menu:
a. select Advanced, using the right arrow.
b. select Peripheral Configuration, using the down arrow.
c. press Enter.
5. Confirm the LAN Device configurations:
H Enabled if resnet was run.
H Disable if resnonet was run.
6. Press CTRL-ALT-DEL to reboot the computer.

Troubleshooting

Repackaging Instructions
This section contains the information needed to repackage the portable main-
frame for shipment or storage.
Packaging
When repacking the instrument or sampling modules for shipment, use the
original packaging. If the packaging is unavailable or unfit for use, contact your
local Tektronix representative to obtain new packaging. Refer to Contacting
Tektronix on page xxi for the address, the email address, and phone number.
Seal the shipping carton with an industrial stapler or strapping tape.
Shipping to the Service Center

Contact the Service Center to get an RMA (return material authorization)
number, and any return or shipping information you may need.
If the instrument is being shipped to a Tektronix Service Center, enclose the
following information:
H The RMA number.
H The owner’s address.
H Name and phone number of a contact person.
H Type and serial number of the instrument.
H Reason for returning.
H A complete description of the service required.

Mark the address of the Tektronix Service Center and the return address on the
shipping carton in two prominent locations.

Repackaging Instructions

This chapter lists available sampling modules, standard and optional accessories
available for the instrument, as well as the product options.
Table 7- 1: Available sampling modules
Module Product Description

Electrical 80E01 1 channel 50 GHz, 7 ps high performance sampling module
80E02 2 channel 12.5 GHz, 28 ps high performance sampling module
80E03 2 channel 20 GHz, 17.5 ps high performance sampling module
80E04 2 channel 20 GHz, 17.5 ps with high performance TDR/sampling module
80E06 1 channel 65 GHz, 5.0 ps high performance sampling module
Optical 80C01 1100 nm to 1650 nm, >20 GHz optical bandwidth at connector, with clock recovery
80C02 1100 nm to 1650 nm, >30 GHz optical bandwidth at connector, with clock recovery
80C03 700 nm to 1650 nm, >2.3 GHz optical bandwidth at connector, with clock recovery
80C04 1100 nm to 1650 nm, >30 GHz optical bandwidth at connector, with clock recovery 1 and 2
80C05 1520 nm to 1580 nm, >40 GHz optical bandwidth at connector
80C07 700 nm to 1650 nm, >2.3 GHz optical bandwidth at connector, with clock recovery
80C07B 700 nm to 1650 nm, >2.3 GHz optical bandwidth at connector, with clock recovery
80C08 700 nm to 1650 nm, >10 GHz optical bandwidth at connector, with clock recovery
80C08B 700 nm to 1650 nm, >10 GHz optical bandwidth at connector, with clock recovery 1 and 2
80C08C 700 nm to 1650 nm, >10 GHz optical bandwidth at connector, with clock recovery 1, 2, and 4
80C10 1310 nm ᐔ 30 nm, >65 GHz optical bandwidth at connector
1550 nm ᐔ 30 nm, >65 GHz optical bandwidth at connector
80C11 1100 nm to 1650 nm, >10 GHz optical bandwidth at connectorr, with clock recovery 1, 2, 3, and 4
Other 80A01 1-channel, 8-14 GHz AC-coupled 50-Ω limiting, preamplifier module that increases the sensitivity of
the oscilloscope prescale-trigger input to 200 mVpk-pk
80A02 EOS/ESD Protection Module to protect the sensitive input stage of instruments (such as the
sampling bridge of Tektronix electrical TDR sampling modules) from damages due to electro-over-
stress (EOS) and electro static discharge (ESD) from the device under test

Standard Accessories
Table 7--2 lists the standard accessories that ship with the instrument.
NOTE. Table 7--2 lists the standard accessories that ship with the instrument, not
those shipped with any modules. Each module ships individually in its own
package. Consult the module’s User manual for module accessories.
Table 7- 2: Standard accessories
Item Part number

Certificate of Traceable Calibration for product at initial shipment Not orderable
Business reply card Not orderable
1 Windows-98 compatible keyboard 119-6633-00
1 Windows-98 compatible mouse 119-6298-00
1 Instrument front cover 200-4519-00
1 Accessory pouch 016-1441-00
2 Touchscreen styluses 119-6107-00
1 ESD wrist strap with 6 foot coiled cord 006-3415-04
CSA8000B & TDS8000B Online Help (part of application software) Not orderable
CSA8000 & TDS8000 User Manual 071-0433-XX
CSA8000 & TDS8000 Reference 071-0437-XX
CSA8000B & TDS8000B User Manual (8000B only) 071-1099-XX
CSA8000B & TDS8000B Reference (8000B only) 071-1096-XX
Oscilloscope Analysis and Connectivity Made Easy Manual (includes a 020-2449-XX
CD with connectivity examples)
CSA8000 & TDS8000 Programmer Online Guide (part of application Not orderable
software)
CSA8000 & TDS8000 Series OS Rebuild CD (this 2-- disk set includes a 020-2436-XX
certificate of authenticity for software and a restore license)
CSA8000 & TDS8000 Product Software CD 020-2370-XX
CSA8000 & TDS8000 Series Demo Applications Software CD 020-2480-XX
Power cord Order by option
number

Optional Accessories
The following accessories are orderable for use with the instrument at the time
this manual originally published. Consult a current Tektronix catalog for
additions, changes, and details.
Table 7- 3: Optional accessories
Item Part Number

80A02 EOS/ESD Protection Module 80A02
Sampling Module Extender (1 meter) 012-1568-00
Sampling Module Extender (2 meter) 012-1569-00
3.5 Male to 3.5 Female SMA 015-0552-00
Slip-on SMA connector 015-0553-00
2X Attenuator (SMA Male-to-Female) 015-1001-00
5X Attenuator (Male-to-Female) 015-1002-00
10X Attenuator (Male-to-Female) 015-1003-00
Power divider 015-0565-00
BNC Female 75 Ω to 50 Ω Type N Minimum Loss Attenuator 131-0112-00
P6209 4 GHz Active FET Probe P6209
P6150 9 GHz Passive Probe P6150
Replacement hard disk drive 119-6733-00
CSA8000 & TDS8000 Series Service Manual 071-0438-XX

Options
The following options can be ordered for the instrument:
H Option 1K: Cart
H Option 1R: Rack Mount Kit (includes hardware and instructions for
converting to rackmount configuration. Tektronix part number,
016-1791-XX.
H International Power Cords Options:

H Option A0 -- North America 110 V, 60 Hz
H Option A1 -- Universal Euro 220 V, 50 Hz
H Option A2 -- UK 240 V, 50 Hz
H Option A3 -- Australian 240 V, 50 Hz
H Option A4 -- North America 220 V, 60 Hz
H Option A5 -- Switzerland 220 V, 50 Hz

H Option AC -- China 220 V, 50 Hz
H Option A99 -- No power cord shipped
H Service offerings:
H Option C3: Three years of calibration services
H Option C5: Five years of calibration services
H Option D1: Calibration data report

H Option D3: Test Data for calibration services in Opt. C3
H Option D5: Test Data for calibration services in Opt. C5
H Option R3: Repair warranty extended to cover three years

H Option R5: Repair warranty extended to cover five years

The modules that make up this instrument are often a combination of mechanical
and electrical subparts. Therefore, all replaceable modules are listed in
Chapter 10, Mechanical Parts List. Refer to that chapter for part numbers when
using this manual.


Diagrams
This chapter illustrates the electrical operation of the CSA8000 and TDS8000
series instruments and modules using the major circuit blocks.
Symbols
Graphic symbols and class designation letters are based on ANSI Standard
Y32.2--1975. Abbreviations are based on ANSI Y1.1--1972.
Logic symbology is based on ANSI/IEEE Std 91-1984 in terms of positive logic.

Logic symbols depict the logic function performed and can differ from the
manufacturer’s data.
The tilde (~) preceding a signal name indicates that the signal performs its
intended function when in the low state.
Other standards used in the preparation of diagrams by Tektronix, Inc. are:
H Tektronix Standard 062--2476 Symbols and Practices for Schematic Drafting

H ANSI Y14.159--1971 Interconnection Diagrams
H ANSI Y32.16--1975 Reference Designations for Electronic Equipment
H MIL--HDBK--63038--1A Military Standard Technical Manual Writing
Handbook

Diagrams
CSA8000 and TDS8000 Series Block Diagram

Figure 9--1 shows the instrument interconnections between major circuit blocks.
Floppy drive NLX board SVGA

Riser
USB x 2
adapter Processor Sound
board Serial
Touch Display
Parallel
panel panel
Inverter Ethernet
Display Mouse
adapter board
Keyboard
board
CD ROM
Hard drive
CPU board GPIB

ON/STANDBY Front PC CardBus x 2, type 1,2
panel RS232 (TTY0 (Diags)
Cal adjust lock
Fans
LVPS board Power

bus
Power
(rear)
bus
(front)
Large
interface
sampling
Small
interface
sampling
Acquisition J100
board
Figure 9- 1: Block diagram for CSA8000 and TDS8000 Series Instruments

Diagrams
Electrical Sampling Modules Block Diagram

Figure 9--2 shows the interconnections between major circuit blocks of all
electrical sampling modules.
Channel 1
User Input Six-diode

Traveling I/O
Wave Sampler
Main Instrument Interface Board

Front Panel of 80E00 Module
TDR Step Generator

(80E04 only)
Channel 2
(all except the 80E01 & 80E06)
Six-diode
User Input Traveling I/O
Wave Sampler
TDR Step Generator

(80E04 only)
Figure 9- 2: Block diagram for the 80E00 Series Electrical Sampling Modules

Diagrams
Optical Sampling Modules Block Diagrams

Figures 9--3 through 9--23 show the interconnections between major circuit
blocks of each optical sampling module.
Average Power Monitor >20 GHz optical BW

Single-mode Fiber (50 Ω reverse-terminated
(B010481 and below) to absorb finite reflections
Fiber Fiber from relay and filter
SC SC network. This reduces raw
conversion gain by 2x)
O/E #1
User Optical RIFOCS (male) Optical Fusion Splice
Input (NRZ (B010481 and above)
DATA)
Filter to achieve system OC12 Reference Receiver Lower noise sampler,

RF Switch RF Switch tuneable to achieve OC192
RF Switch
Filter #1 Reference Receiver
Filter #2 RF Switch
Filter to achieve system OC48 Reference Receiver

Two-diode I/O
Coaxial only (unfiltered path: >20 GHz or OC Reference Receiver)
Sampler
Front Panel of Module
Figure 9- 3: 80C01 Optical sampling block diagram

Diagrams
Average Power Monitor >20 GHz optical BW (50 Ω

Single-mode reverse-terminated to
Single-mode version
absorb finite reflections
Optical Fusion Splice from relay and filter
Fiber Fiber
(B010481 and above) network. This reduces raw
Optical Split conversion gain by 2x)
10% 90% O/E #1
User Optical SC SC
Input (NRZ RIFOCS (male)
SC SC
DATA)
Fiber
(B010481 and below)

Lower noise sample,
RF Switch tuneable to achieve OC192
RF Switch Reference Receiver
RF Switch Filter #1
Filter #2 RF Switch
Two-- diode I/O

Coaxial only (unfiltered path: >20 GHz or OC-- 192 Reference Receiver)
Sampler

Fiber OC192 9.953 Clock Recovery

(B010481 and below)
Fiber Fiber
SC SC CLK
Built in O/E 2.48832 GHz
Clock Recovery CLK Discrete
front end
Optical Fusion Splice 4 or 1
(B010481 and above) Q Q Circuitry
Separate Clock Recovery Board
DATA
DATA
Trig
CLK (/1 or /4
CLK (/1 or /4
Figure 9- 4: 80C01 Optical sampling with clock recovery block diagram

Diagrams
Average Power Monitor

Single-mode
>30 GHz optical BW
Fiber Optical Fusion Splice Fiber (not reverse-terminated)
(B010403 and above)
O/E #1
User Optical RIFOCS (male)
Input (NRZ SC SC
DATA)
Fiber
(B010403 and below)
Lower noise sampler; tuneable to
achieve OC192 Reference Receiver
Coaxial only (unfiltered path: >20 GHz or OC-- 192 Reference Receiver)
RF Switch

Two-diode I/O
Sampler

Diagrams
Average Power Monitor >30 GHz optical BW (50 Ω

Single-mode Single-mode version reverse-terminated to
Fiber Fiber Fiber Optical Fusion Splice Fiber from relay and filter
Optical Split conversion gain by 2x.)
10% 90% O/E #1
User Optical SC SC
Input (NRZ RIFOCS (male)
SC SC
DATA)
Fiber
(B010403 and below) Lower noise sampler, tuneable
to achieve OC192 Reference
Receiver without filter
Two-diode I/O
Sampler
(O/E with TLA+AGC Amplifier)

Fiber
(B010403 and below)
Fiber
SC SC 9.95328 GHz
O/E Resonant
Fiber
Optical Fusion Splice Filter
(B010403 and above)
DATA
CLK
CLK (/1/16) Trig

Diagrams
Average Power Monitor

Fiber (B010283 Built-in OC48 Reference
Single-mode and below) Receiver response in the
O/E and amplified
Fiber Fiber conversion gain
SC SC
O/E #1
User Optical Optical Fusion Splice
RIFOCS (male)
Input (NRZ (B010283 and above)
DATA)
Filter to achieve system FC Reference Receiver
Lower noise sampler, tuneable
RF Switch RF Switch to achieve OC192 Reference
RF Switch
Filter #1 Receiver without filter
Filter #2 RF Switch
Filter to achieve system GBE Reference Receiver

Two-diode I/O
Coaxial only (unfiltered path: >2.8 GHz or OC-48 Reference Receiver)

Sampler

Diagrams
Optical Fusion Splice Average Power Monitor Built-in OC 48 Reference

Multi-mode (B010283 and above) Receiver response in the
O/E and amplified
Multi-mode conversion gain
O/E #1
User Optical Fiber
Input (NRZ SC SC (B010283 and below)
DATA)
RIFOCS (male) 10% Out
90% Out
Electrical 10/90 splitter
Filter to achieve system OC 12 Reference Receiver
Lower noise sampler; tuneable
RF Switch to achieve OC 192 Reference
RF Switch Receiver without filter
RF Switch
Filter #1
Filter #2 RF Switch
Two-diode I/O
Coaxial only (unfiltered path: >20 GHz or OC 192 Reference Receiver)
Sampler
Limiting
Clock Recovery

Amplifier
DATA
DATA
CLK Trig
CLK

Diagrams
Average Power Monitor >30 GHz optical BW

Single-mode (not reverse-terminated)
Fiber Optical Fusion Splice Fiber

(B010170 and above)
O/E #1
Input (NRZ
SC SC
DATA)
Fiber
Lower noise sampler, tuneable
(B010170 and below) to achieve OC 192 or 10.66 Gb
Reference Receiver rates
without filter
RF Switch
Coaxial only (unfiltered path: >30 GHz or
OC 192 Reference Receiver rates)

Two-diode I/O
Sampler

Diagrams
Single- Average Power Monitor >30 GHz optical BW (50 Ω

Single-mode
mode Optical Fusion Splice reverse-terminated to
(B010170 and above) version
Fiber Fiber Fiber Optical Fusion Splice Fiber from relay and filter
Optical Split conversion gain by 2x.)
90% O/E #1
10%
User Optical
Input (NRZ Fiber
SC SC (B010170 SC SC
DATA) Fiber
and below)
RIFOCS (male) (B010170 and below) Lower noise sampler;
tuneable to achieve OC 192
or 10.66 Gb Reference
Receiver rates without filter
Two-diode I/O
Sampler

Fiber (O/E with TLA+AGC Amplifier)
(B010170 and below)

Fiber
SC SC 9.95328 GHz
O/E Resonant
Fiber Filter
Optical Fusion Splice
(B010170 and above) Separate Clock Recovery Board
DATA
CLK
CLK (/1/16) Trig
Figure 9- 10: 80C04 Optical sampling block diagram with clock recovery

Diagrams
RIFOCS Average Power Monitor >40 GHz optical BW

interchange Single-mode (reverse-terminated)
able (female)
Fiber Fiber
O/E #1
Input (NRZ
DATA)
Lower noise sampler; also

Reference Receiver without filter

OC 192 various Reference Receiver rates)
Two-diode I/O
Sampler

Diagrams
RIFOCS Average Power Monitor >30 GHz optical BW

interchange Single-mode (not reverse-terminated)
able (female)
Fiber Fiber
O/E #1
Input (NRZ
DATA)
Lower noise sampler;
or 10.66 Gb Reference
Receiver rates without filter
RF Switch

OC 192 various Reference Receiver rates)
55 GHz
Sampler

Diagrams
Optical signals/functions Female-to-male coaxial connector (left to right) Female-to-female fiber

Male optical ferrules Length of fiber connector
Electrical signals/functions
RIFOCS Average
interchangeable Power
(female) Built-- in OC48 Reference Receiver
Multi-- mode Monitor
Optical Fusion response in the O/E and amplified
Fiber Fiber conversion gain
Splice
O/E #1
User RIFOCS (male)
Optical Input
(NRZ DATA)
Filter to achieve system OC 3 Reference Receiver.
RF Switch RF Switch
RF Switch
Filter #1
Filter #2 RF Switch

Filter to achieve system OC 12 Reference Receiver.
Two-diode
Coaxial only (unfiltered path: >2.3 GHz or OC 48 Reference Receiver) Sampler

achieve OC48 Reference
Figure 9- 13: 80C07 and 80C07B Optical sampling block diagram

Diagrams

Male optical ferrules Length of fiber connector
RIFOCS Average
interchangeable Power Built-in OC 48 Reference Receiver
(female) Multi-mode Multi-mode Monitor response in the O/E and amplified
Fiber Optical Fusion Fiber conversion gain
Splice
O/E #1
User RIFOCS (male)
Optical Input Electrical 10/90
(NRZ DATA) Splitter
10 % Out
90% Out

RF Switch RF Switch
RF Switch Filter #1
Filter #2 RF Switch
Lower noise sampler; Two-diode

Coaxial only (unfiltered path: >2.3 GHz
tuneable to achieve Sampler
or OC 48 Reference Receiver)
OC 48 Reference

Limiting
Amplifier Limiting
Clock Recovery
Amplifier
DATA
DATA
CLK
Trig
CLK
Figure 9- 14: 80C07 and 80C07B Optical sampling with CR1 clock recovery block diagram

Diagrams

connector
Electrical signals/functions Male optical ferrules Length of fiber
Average
RIFOCS Power
interchangeable Monitor
(female) Multi-mode >9.0 GHz optical BW (not
Fiber Optical Fusion reverse terminated)
Fiber
Splice
O/E #1
User RIFOCS (male)
Optical Input Coaxial only (unfiltered path:
> various 10 Gb Reference

(NRZ DATA)
Receiver rates)
Two-diode
Sampler

achieve OC-192, 10GBase-W,
10GBase-R, and 10GFC Reference
Figure 9- 15: 80C08/80C08B/80C08C Optical sampling block diagram

Diagrams

connector
RIFOCS Average
interchangeable Power
(female) Monitor >9.0 GHz optical BW
Multi-mode
Fiber
O/E #1
User RIFOCS (male)
Optical Input
(NRZ DATA)
90/10
Electrical
Splitter
Lower noise sampler; tuneable to Two-diode

achieve 10 Gb/s Reference Sampler

RF Amplifier Electrical Clock
Recovery
CLK
R16
CLK (1/16) Trig
Figure 9- 16: 80C08/80C08B/80C08C Optical sampling with CR1, CR2, & CR4 clock recovery block diagram

Diagrams

Male optical ferrules Length of fiber connector)
Average
Power
RIFOCS
Monitor
interchangeable
(female) >30 GHz optical BW (not
Single-mode
Fiber Optical Fusion Fiber reverse-terminated)
Splice
O/E #1
User Optical RIFOCS (male) RF Switch
Input (1310 nm) Coaxial only (unfiltered path; > 30 GHz or
OC192 various Reference Receiver rates)

Two-diode
Sampler
Lower noise sampler, tuneable to achieve

OC 192, 10.71 Gb Reference Receiver
without filter

Diagrams

RIFOCS Average
interchangeable Single-mode version Power
(female) Single-mode
Monitor
Fiber Optical Fusion Fiber Optical Splitter Fiber Optical Fusion Fiber
Splice Splice
O/E #1
90%
User RIFOCS (male) 10%
Optical Input >30 GHz optical BW (50 Ω
(NRZ DATA) reverse terminated to absorb finite
reflections from relay and filter
network; this reduces raw
achieve OC192 or 10.71 Gb Sampler
Fiber Reference Receiver without filter
Optical (O/E with TIA + Separate Clock Recovery Board

Fusion AGC Amplifier)
Main Instrument Interface Baord

Splice Fiber
9.95328 GHz
O/E 10.709225 GHz
Clock Recovery
CLK
R16
CLK (1/16) Trig
Figure 9- 18: 80C09 Optical sampling with CR1 clock recovery block diagram

Diagrams

connector)
RIFOCS
interchangeable
(female) Single-mode Optical
Fiber Optical Fusion Fiber Fiber Optical Fusion Fiber
Splice Splice Fusion
1310 nm Splice
WDM
User Optical RIFOCS (male) Isolator: 1310 nm
Optical Fusion 1550 nm
Input (1310 nm) Fiber Optical Fusion
Splice Splice

Fiber
User Optical Isolator: 1550 nm Avg Power
Input (1550 nm) O/E #1
Monitor
Two-diode
Sampler

connector
Average
RIFOCS Power
interchangeable Monitor
(female) Single-mode >30.0 GHz optical BW (not
Fiber Optical Fusion reverse terminated)
Fiber
Splice

O/E #1
User RIFOCS (male)
Optical Input Coaxial only (unfiltered path:
(NRZ DATA) > 30 Gb or OC-192 various

Reference Receiver rates)
Two-diode
Sampler

Diagrams

RIFOCS Average
Monitor
Fiber Fiber Optical Splitter Fiber Fiber
O/E #1
90%
(O/E with TIA + Separate Clock Recovery Board

AGC amplifier)

Fiber
9.95328 GHz
O/E 10.664 GHz
resonant filter
DATA
CLK
R16
CLK (1/16) Trig
Figure 9- 21: 80C11 Optical sampling with CR1 clock recovery option block diagram

Diagrams

RIFOCS Average
Monitor
Splice Splice
O/E #1
90%

Optical Fusion
Splice (O/E with TIA + Separate Clock Recovery Board
AGC amplifier)
Fiber
O/E Clock recovery
CLK
R16
CLK (1/16) Trig
Figure 9- 22: 80C11 Optical sampling with CR2 and CR3 clock recovery option block diagram

Diagrams

RIFOCS Average
Monitor
Splice Splice
O/E #1
90%

Optical Fusion
(O/E with TIA + Separate Clock Recovery Board
Splice
AGC amplifier)
Fiber
9.95 Gb/s to 9.95 Gb/s to
O/E 12.5 Gb/s 12.5 Gb/s
MUX-CMU CDR-- DMUX
CLK
CLK (1/16) Trig
Figure 9- 23: 80C11 Optical sampling with CR4 clock recovery option block diagram

Diagrams
80A01 Block Diagram

Figure 9--24 show the interconnections between major circuit blocks of the
80A01 module.
Power LED Driver

LED
RF Amplifier
Input
Output
Curtain
Board
Figure 9- 24: 80A01 block diagram

This chapter contains a list of the replaceable modules for the instrument. Use
this list to identify and order replacement parts.
Parts Ordering Information

Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix instruments are sometimes made to accommodate

improved components as they become available and to give you the benefit of
the latest circuit improvements. Therefore, when ordering parts, it is important to
include the following information in your order.
H Part number
H Instrument type or model number
H Instrument serial number

H Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Module Servicing Modules can be serviced by selecting one of the following three options. Contact
your local Tektronix service center or representative for repair assistance.
Module Exchange. In some cases you may exchange your module for a reman-
ufactured module. These modules cost significantly less than new modules and
meet the same factory specifications. For more information about the module
exchange program, call 1-800-TEK-WIDE, extension 6630.
Module Repair and Return. You may ship your module to us for repair, after which
we will return it to you.
New Modules. You may purchase replacement modules in the same way as other
replacement parts.

Using the Replaceable Parts List

This section contains a list of the mechanical and/or electrical components that
are replaceable for the instrument. Use this list to identify and order replacement
parts. The following table describes each column in the parts list.
Parts list column descriptions
Column Column name Description

1 Figure & Index Number Items in this section are referenced by component number.
2 Tektronix Part Number Use this part number when ordering replacement parts from Tektronix.
3 and 4 Serial Number Column three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entries indicates the part is
good for all serial numbers.
5 Qty This indicates the quantity of parts used.
6 Name & Description An item name is separated from the description by a colon (:). Because of space limitations, an
item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook
H6-1 for further item name identification.
7 Mfr. Code This indicates the code of the actual manufacturer of the part. (Code to name and address cross
reference is located after this page.)
8 Mfr. Part Number This indicates the actual manufacturer’s or vendor’s part number.
Abbreviations Abbreviations conform to American National Standard ANSI Y1.1--1972.
Mfr. Code to Manufacturer The following table cross indexes codes, names, and addresses of manufacturers
Cross Index or vendors of components listed in the parts list.

Mfr. Code to Manufacturer The table titled Manufacturers Cross Index shows codes, names, and addresses
Cross Index of manufacturers or vendors of components listed in the parts list.
Manufacturers cross index
Mfr.
code Manufacturer Address City, state, zip code
00779 AMP INC. CUSTOMER SERVICE DEPT HARRISBURG, PA 17105-- 3608
PO BOX 3608
01295 TEXAS INSTRUMENTS INC SEMICONDUCTOR GROUP DALLAS, TX 75272-- 5303
13500 N CENTRAL EXPRESSWAY
PO BOX 655303
01963 CHERRY ELECTRICAL PRODUCTS CO 3600 SUNSET AVENUE WAUKEGAN, IL 60087-- 3214
02660 AMPHENOL CORP 720 SHERMAN AVE HAMDEN, CT 06514-- 6514
03ZT7 MOBILE PLANET 9175 DEERING AVE CHATSWORTH, CA 91311
04713 MOTOROLA INC SEMICONDUCTOR PRODUCTS SECTOR PHOENIX, AZ 85008-- 4229
5005 E MCDOWELL ROAD
049S6 FUJITSU COMPUTER PRODUCTS OF 2904 ORCHARD PARKWAY SAN JOSE, CA 95134-- 2009
AMERICA INC
05791 LYN-- TRON INC SOUTH 6001 THOMAS MALLEN RD SPOKANE, WA 99204
060D9 UNITREK CORPORATION 3000 COLUMBIA HOUSE BLVD, VANCOUVER, WA 98661
SUITE 120
06666 GENERAL DEVICES PO BOX 39100 INDIANAPOLIS, IN 46239
06915 RICHCO 5825 N TRIPP AVE CHICAGO, IL 60646
P.O. BOX 804238
07416 NELSON NAME PLATE COMPANY 3191 CASITAS AVENUE LOS ANGELES, CA 90039-- 2410
0ADN8 DELTA PRODUCTS CORP-- DPZ 4405 CUSHING PARKWAY FREMONT, CA 94538
0GZV8 HUBER & SUHNER INC 19 THOMPSON DRIVE ESSEX JUNCTION, VT 05452-- 3408
0J9P9 GEROME MFG CO INC PO BOX 737 NEWBERG, OR 97132
403 NORTH MAIN
0KB01 STAUFFER SUPPLY CO 810 SE SHERMAN PORTLAND, OR 97214-- 4657
0KB05 NORTH STAR NAMEPLATE INC 5750 NE MOORE COURT HILLSBORO, OR 97124-- 6474
0KBZ5 Q & D PLASTICS INC 1812 - 16TH AVENUE FOREST GROVE, OR 97116-- 0487
PO BOX 487
12136 PHC INDUSTRIES INC 1643 HADDON AVE CAMDEN, NJ 08103
PO BOX 1448
16179 M/A COM INC 1011 PAWTUCKER BLVD. LOWELL, MA 01853-- 3295
PO BOX 3295
1AW87 LEWIS SCREW CO. 4300 SOUTH RACINE AVENUE CHICAGO, IL 60609
1DM20 PARLEX CORP 7 INDUSTRIAL WAY SALEM, NH 03079
20944 ANRITSU COMPANY 685 JARVIS DRIVE MORGAN HILLS, CA 95037
22526 FCI/BERG ELECTRONICS INC 825 OLD TRAIL ROAD ETTERS, PA 17319-- 9769
22670 GM NAMEPLATE INCORPORATED 2040 15TH AVE WEST SEATTLE, WA 98119-- 2783
24931 FCI/BERG ELECTRONICS INC RF/COAXIAL DIV FRANKLIN, IN 46131
2100 EARLYWOOD DR
PO BOX 547
26003 MARTEK POWER MDI 4115 SPENCER STREET TORRANCE, CA 90503-- 2489

Manufacturers cross index (cont.)
Mfr.
26805 M/A COM OMNI SPECTRA INC MICROWAVE CONNECTOR DIV WALTHAM, MA 02254
140 4TH AVE
2K262 BOYD CORPORATION 6136 NE 87TH AVENUE PORTLAND, OR 97220
2W733 BELDEN WIRE & CABLE COMPANY 2200 US HWY 27 SOUTH RICHMOND, IN 47374
PO BOX 1980
32559 BIVAR INC 4 THOMAS ST IRVINE, CA 92718
34649 INTEL CORPORATION 3065 BOWERS SANTA CLARA, CA 95051-- 8130
PO BOX 58130
3M099 PORTLAND SCREW COMPANY 6520 N BASIN AVE PORTLAND, OR 97217
46628 LOGITECH INC 6505 KAISER DR FREMONT, CA 94555
50356 TEAC AMERICA INC 7733 TELEGRAPH RD MONTEBELLO, CA 90640-- 6537
PO BOX 750
5Y400 TRIAX METAL PRODUCTS INC 1880 SW MERLO DRIVE BEAVERTON, OR 97006
64537 KDI/TRIANGLE CORPORATION 60 S JEFFERSON RD WHIPPANY, NJ 07981
6Y440 MICRON SEMICONDUCTOR PRODUCTS INC 8000 S FEDERAL WAY BOISE, ID 83707-- 0006
PO BOX 6
61058 MATSUSHITA ELECTRIC CORP OF AMERICA PANASONIC INDUSTRIAL CO DIV SECAUCUS, NJ 07094
TWO PANASONIC WAY
64537 KDI/TRIANGLE CORPORATION 60 S JEFFERSON RD WHIPPANY, NJ 07981
71400 BUSSMANN DIVISION COOPER INDUSTRIES INC ST LOUIS, MO 63178
PO BOX 14460
74594 COMPONENT RESOURCES INC BUSSMAN PARTS BEAVERTON, OR 97006
C/O CASEY LAKEY
14525 SW WALKER ROAD
76096 ELMA ELECTRONICS INC 41440 CHRISTY ST FREMONT, CA 94538
78189 SHAKEPROOF DIVISION OF ILLINOIS TOOL WORK ELGIN, IL 60120
ST. CHARLES ROAD
7X318 KASO PLASTICS INC 5720-- C NE 121ST AVE, STE 110 VANCOUVER, WA 98682
80009 TEKTRONIX INC 14150 SW KARL BRAUN DR BEAVERTON, OR 97077-- 0001
PO BOX 500
86928 SEASTROM MFG CO INC 456 SEASTROM STREET TWIN FALLS, ID 83301
8X345 NORTHWEST SPRING MFG CO 5858 WILLOW LANE LAKE OSWEGO, OR 97035
93907 CAMCAR DIV OF TEXTRON INC ATTN: ALICIA SANFORD ROCKFORD, IL 611045181
516 18TH AVE
94222 SOUTHCO, INC. 210 N BRINTON LAKE RD CONCORDVILLE, PA 19331
98291 ITT CANNON RF PRODUCTS 585 EAST MAIN STREET NEW BRITAIN, CT 06051
S4091 SANYO DENKI C/O TJBO LIAISON BEAVERTON, OR 97077-- 7077
M/S 78-- 210
S5769 NEC CORPORATION NEC BUILDING TOKYO, JP 108
7-- 1, SHIBA 5 CHOME
MINATO-- KU
TK0588 UNIVERSAL PRECISION PRODUCT 1775 NW CORNELIUS PASS RD HILLSBORO, OR 97124
TK1163 POLYCAST INC 14140 SW 72ND AVE TIGARD, OR 97224
SUITE 100
TK1916 SKS DIE CASTING & MACHINING INC. 1849 OAK ST ALAMEDA, CA 94501

Manufacturers cross index (cont.)
Mfr.
TK1943 NEILSEN MANUFACTURING INC 3501 PORTLAND RD NE SALEM, OR 97303
TK2172 WYLE ELECTRONICS INC 10300 SW NIMBUS AVE PORTLAND, OR 97223
BLDG P, SUITE B
TK2250 ARROW ELECTRONICS INC. 9500 SW NIMBUS AVE, BLDG E BEAVERTON, OR 97008-- 7163
TK2338 ACC MATERIALS ED SNYDER BEAVERTON, OR 97077
BLDG 38-- 302
TK2376 CONDUCTIVE RUBBER TECH 22125 17TH AVE SE, SUITE 117 BOTHELL, WA 98021
TK2491 RIFOCS CORPORATION 1340 FLYNN RD CAMARILLO, CA 93012
TK2539 ROYAL CASE COMPANY INC 315 S MONTGOMERY SHERMAN, TX 75070
PO BOX 2231
TK2548 XEROX CORPORATION 14181 SW MILLIKAN WAY BEAVERTON, OR 97005
TK2563 REVTEK INC 4288 SE INTERNATIONAL WAY PORTLAND, OR 97222
TK2565 VISION PLASTICS INC 26000 SW PARKWAY DRIVE WILSONVILLE, OR 97070
TK2582 TUFF CAT USA LLC 814 N HAYDEN MEADOWS DRIVE PORTLAND, OR 97217
TK2601 MAXTEK COMPONENTS CORPORATION 13335 SW TERMAN RD BEAVERTON, OR 97075-- 0428
PO BOX 428
TK2647 INSTRUMENT SPECIALTIES CO INC. C/O TEMCO NW HILLSBORO, OR 97123
1336 SE 51ST STREET
TK6173 MULTI-- FINELINE ELECTRONIX INC (MFLEX) DBA: MFLEX ANAHEIM, CA 92806
1301 N DYNAMICS STREET
TK6181 IMC PLASTICS INC 19400 SW TETON AVE TUALATIN, OR 97062
TK6253 VOLEX INTERCONNECT INC 646 CARRIBEAN DR SUNNYVALE, CA 94089-- 1108

Replaceable Parts List
Fig. &
index Tektronix part Serial no. Serial no. Mfr.
number number effective discont’d Qty Name & description code Mfr. part number
1-- 1 016-- 1441-- 00 1 POUCH, PLASTIC: PLASTIC POUCH 80009 016-- 1441-- 00
-2 211-- 1050-- 00 12 SCREW,MACHINE:6-- 32 X 0.312 L,PNH,STL CAD,T15 0KB01 OBD
-3 355-- 0298-- 00 4 STUD.SNAP:0.570 DIA,0.165 THK,STAINLESS STEEL TK0588 355-- 0298-- 00
-4 348-- 1648-- 00 4 FOOT:REAR W/CORD WRAP,THERMOPLASTIC TK6181 348164800
-5 211-- 0720-- 00 4 SCR,ASSEM WSHR:6-- 32 X 0.500,PNH,STL,CDPL,T-- 15 0KB01 ORDER BY
DESCRIPTION
-6 161-- 0230-- 01 1 CABLE ASSY,PWR,:3,18 AWG,92 L,SVT, TK2432 ORDER BY DESC

(STANDARD ACCESSORY)
-7 159-- 0046-- 00 2 FUSE,CARTRIDGE:3AG,8A,250V,15SEC,CER 71400 ABC 8
159-- 0381-- 00 2 FUSE,CARTRIDGE:5 X 20 MM,6.3A,250V,FAST BLOW,HIGH 71400 GDA-- 6.3
BREAKING CAPACITY,UL REC,SEMKO,
-8 200-- 2264-- 00 2 CAP,FUSEHOLDER:3AG FUSES (AMERICAN) 61935 FEK 031 1666

200-- 2265-- 00 2 CAP,FUSEHOLDER:5 X 20MM FUSES (EUROPEAN) 61935 FEK 031.1663
-9 200-- 4522-- 00 1 COVER,RIGHT:PCABS,13.645L X 8.250W, BLUE TK6181 200-- 4522-- 00
- 10 212-- 0232-- 00 2 SCREW,MACHINE:8-- 32 X 1.125L, PNH,STL,BLACK 0KB01 OBD
OXIDE,T-- 20
- 11 367-- 0528-- 00 1 HANDLE,CARRYING:POLYPROPYLENE VINYL GRIP 12136 PT 3170
- 12 200-- 4556-- 00 1 COVER, BOTTOM RIGHT:0.050 ALUMINUM 0J9P9 200-- 4556-- 00
- 13 200-- 4625-- 00 1 COVER,BOTTOM:0.060 AL,VINYL CLAD, INCLUDING FEET 0J9P9 200-- 4625-- 00
(ITEMS 13 & 14)
- 14 348-- 1648-- 00 1 FEET,CABINET:CABINET FEET,BLACK,GLASS-- FIBRE 76096 63-- 526

REINFORCED PLASTIC,SET OF 4 FEET, W/SCREWS
- 15 101-- 0150-- 00 1 TRIM:ACQUSITION, PCABS TK6181 101015000

- 16 200-- 4519-- 00 1 COVER,FRONT:PCABS,17.420L X 8.670W X 2.000 TK6181 200-- 4519-- 00
- 17 101-- 0151-- 01 1 TRIM,FRONT:PCABS,17.200W X 8.450H, SILVER GRAY TK6181 101-- 0151-- 01
- 18 260-- 2719-- 00 1 SWITCH,KEYPAD:ELASTOMERIC,FRONT PANEL,ON/OFF TK2376 260-- 2719-- 00
- 19 335-- 0660-- 00 1 MARKER,IDENT:LABEL,MAIN FRAME,0.500 X 0KB05 335-- 0660-- 00
8.510,LEXAN,W/ADHESIVE,CSA8000,
- 19 335-- 0659-- 00 1 MARKER,IDENT:0.500 X 8.510,LEXAN W/ADHESIVE,MAIN 0KB05 335-- 0656-- 00

FRAME,TDS8000,
- 20 200-- 4555-- 00 1 COVER,TOP LEFT:0.050 ALUMINUM 0J9P9 200-- 4555-- 00
- 21 200-- 4521-- 00 1 COVER,LEFT:PCABS,13.654L X 8.250W,BLUE TK6181 200-- 4521-- 00
- 22 200-- 4520-- 00 1 COVER,TOP:PCABS,17.200L X 13.550W,BLUE TK6181 200-- 4520-- 00

1 2
3 4 5
21
22
6
7
8
20
19
18 10
17 11
2 12
16
2 15
13
14
Figure 10- 1: External parts

Fig. &
2-- 1 211-- 1050-- 00 8 SCREW,MACHINE:6-- 32 X 0.312 L,PNH,STL CAD,T15 0KB01 OBD
-2 650-- 4271-- 01 1 RHDD ASSEMBLY:W/O SW (ITEMS 3 THROUGH 7) 80009 650-- 4412-- 00
-3 119-- 6733-- 00 1 DISK DRIVE:WINCHESTER,2.5 IN, 20.0GB,SINGLE PLATTER 049S6 MHK2060AT
-4 437-- 0494-- 00 1 CABINET ASSY:REMOVEABLE HARD DISK DRIVE HOLDER TK1943 437-- 0494-- 00
-5 211-- 1081-- 00 4 SCREW,MACHINE:M3 X 0.5 X 3.5MM 0KB01 211-- 1081-- 00
-6 174-- 3925-- 00 1 CA ASSY,SP:RIBBON,,28 AWG,1.0 L,2 X 22 (HARD DRIVE) 060D9 174-- 3925-- 00
-7 679-- 4378-- 00 1 CKT BD SUBASSY:HARD DISK DRIVE INTERFACE 80009 679-- 4378-- 00
-8 174-- 4320-- 00 2 CA ASSY:FLAT FLEX, 9.753L (FLOPPY DRIVE CABLE & 060D9 174-- 4320-- 00
FRONT PANEL)
-9 671-- 4657-- 01 1 CIRCUIT BD ASSY:PROCESSOR 80009 671-- 4657-- 01
- 10 407-- 4706-- 00 1 BRACKET:FLOPPY DRIVE,6.064 X 5.075,ALUMINUM TK1943 407-- 4706-- 00
- 11 211-- 1079-- 00 2 SCREW,MACHINE:2.6 X 0.45 MM,3.0L,PNH,STL,PHILLIPS 0KB01 10310188-- 0
- 12 119-- 6106-- 00 1 DISK DRIVE:FLOPPY,3.5INCH,1.44 MB, 0.5 IN,DDDS TK2250 FD-- 05HF5630
- 13 174-- 4241-- 01 1 CA,ASSY:RIBBON,BUS,IDC,32 AWG,17.00L,60POS 060D9 174-- 4241-- 01
(PROCESSOR TO ACQ)
- 14 361-- 1762-- 00 1 SPACER,SUPPORT:0.250 X 0.171 X 0.375,CKT BD,NYLON 06915 CPST-- 4-- 01

- 15 679-- 4761-- 00 1 CKT BD SUBASSY:POWER REAR 80009 679-- 4761-- 00
- 16 679-- 4760-- 00 1 CKT BD SUBASSY:POWER FRONT 80009 679-- 4760-- 00
- 17 614-- 0968-- 00 1 PANEL MODULE:FRONT,W/HARDWARE 80009 614-- 0968-- 00
(ITEMS 18 THROUGH 23)
- 18 679-- 4689-- 00 1 CKT BD SUBASSY:FRONT PANEL CONTROL BD 80009 679-- 4689-- 00
- 19 260-- 2724-- 00 1 SWITCH,KEYPAD:ELASTOMERIC,FRONT PANEL TK2376 260-- 2724-- 00
- 20 366-- 0770-- 00 3 KNOB,CAP:0.925 DIA TK1163 366077000
- 21 366-- 0771-- 00 2 KNOB,CAP:SILVER GRAY,0.650 DIA X 0.520 H TK1163 366-- 0771-- 00
- 22 366-- 0772-- 00 3 KNOB,CAP:SIVER GRAY,0.425 DIA X 0.520 H TK1163 366-- 0772-- 00
- 23 333-- 4339-- 00 1 SUBPANEL,FRONT:6.380 X 7.700,ALUMINUM,LEXAN LABEL TK1943 333-- 4339-- 00
- 24 650-- 3938-- 00 1 COMPONENT KIT:DISPLAY MODULE 80009 650-- 3938-- 00
(ITEMS 25 THROUGH 30)
- 25 259-- 0155-- 01 1 FLEX CIRCUIT:POWER FLEX CIRCUIT SILVER INK 07416 259-- 0155-- 01
- 26 650-- 4186-- 00 1 MODULE ASSY:TOUCH PANEL (ITEMS 25 & 26) 80009 650-- 4186-- 00
- 27 174-- 4189-- 00 1 CABLE ASSEMBLY:FLAT FLEX (DISPLAY ADAPTER) 1DM20 174-- 4189-- 00
- 28 650-- 4187-- 01 1 MODULE ASSY:LCD, DISPLAY (ITEMS 27 THROUGH 30) 80009 650-- 4187-- 01
- 29 679-- 4479-- 00 1 CKT BD SUBASSY:DISPLAY ADAPTER, W/HARDWARE 80009 679-- 4479-- 00
- 30 174-- 3618-- 00 1 CA,ASSY SP:RIBBON,CPR,28 AWG,9.5 L,1X5,0.049CTR 060D9 OBD
- 31 343-- 1676-00 1 CABLE CLAMP,PC/ABS,BAYER,BAYBLEND FR-110,SILVER TK2565 343-- 1676-00
GREY
- 32 437-- 0486-- 01 1 ASSY,FAN:SIX FANS ASSEMBLY 0J9P9 437-- 0486-- 01

Replaceable Parts List (cont.)
Fig. &
- 33 174-- 4188-- 00 1 CA ASSY:RIBBON, (DISPLAY) 060D9 174-- 4188-- 00
- 34 679-- 4379-- 00 1 CKT BD SUBASSY:CONNECTOR CONVERSION 80009 679-- 4379-- 00
- 35 174-- 4231-- 00 1 CABLE ASSY:IDE CABLE ASSEMBY (HARD DRIVE) 060D9 174-- 4231-- 00

1
35
3
4
34 5
6
7 2
33
8
9 10
8
32
11
31
12
30
24 29
28
27 13
26
25
23
22 18 16
19 15
21
14
17
20
Figure 10- 2: Front panel and drives

Fig. &
3-- 1 119-- 6511-- 00 1 IC,PROCESSOR:CMOS,MICROPROCESSOR,CELERON, 34649 BX80524P500128
566 MHZ,66MHZ BUS,SOCKET 370 COMPATIB
- 1A 119-- 6459-- 00 1 FAN,CHIP COOLER:12VDC,80MA,4400RPM,30DBA,64MM X 80009 119-- 6459-- 00

51MM X 31MM,W/HEATSINK & CLIP FOR CELERON
-2 214-- 3903-- 00 8 SCREW,JACK:4-- 40 X 0.312 LONG,0.188 H HEX HEAD STAND 05791 LT4276
OFF,4-- 40 INT THD, X 0.312 THD EXT 4-- 40
-3 050-- 3506-- 00 1 NLX BOARD:MODIFY MOTHER BOARD NLX PROCESSOR 80009 039-- 0117-- 00
-4 211-- 1050-- 00 8 SCREW,MACHINE:6-- 32 X 0.312 L,PNH,STL CAD PLT,T15 0KB01 OBD
-5 679-- 4667-- 00 1 CKT BD SUBASSY:RISER 80009 679-- 4667-- 00
-7 213-- 1061-- 00 2 JACKSCREW:6-- 32 X 0.320 EXT THD,M3.5 X 0.6-- 6 INT THD X 00779 554043-- 3
0.215L,GPIB
-8 386-- 7147-- 00 1 PANEL,I/O:ALUMINUM,POWER PC PROCESSOR TK1943 386-- 7147-- 00
-9 131-- 6680-- 00 1 CONN HDR:CARDBUS HDR,SMD,MALE,RTANG,2 X 34 22526 61555-- 200CA
- 10 211-- 0887-- 00 4 SCREW,METRIC:M2 X 0.4 X 16 MM L,PH,PHILLIPS DRIVE 0KB01 211-- 0887-- 00
- 11 441-- 2172-- 00 1 CHASSIS ASSY:0.05 ALUM,13.65 X 16.50 X 3.55 (8000 ONLY) 0J9P9 441-- 2172-- 00
- 11 441-- 2283-- 00 1 CHASSIS ASSY:MAIN,CENTER,FRONT,REAR & ACQUISI- TK1943 441-- 2283-- 00
TION CHASSIS,TDS8000B,CSA8000B
- 12 119-- 5806-- 05 1 5.0V POWER SUPPLY:CUSTOM,AC-- DC,375W,85-- 275VAC 26003 119-- 5806-- 00
TDS8000, CSA8000
- 12 119-- 6697-- 01 1 5.2V POWER SUPPLY:CUSTOM,AC-- DC,375W,85-- 275VAC, 26003 119-- 6697-- 01
TDS8000B, CSA8000B
- 13 131-- 1315-- 01 1 CONN,RF JACK:BNC/PNL,50 OHM,FEMALE,STR,PELTOLA 24931 28JR306-- 1
- 14 103-- 0269-- 00 3 ADAPTER,CONN:SMA TO PELTOLA,FEMALE TO FE- 80009 103-- 0269-- 00
MALE,STR,PNL,D/FLAT,0.385 MTG HOLE,GOLD/NICKEL
- 15 131-- 0850-- 00 1 CONN,JACK,RF:SMA,FEEDTHRU,DUAL FEMALE,STR,50 26805 2084-- 0000-- 02

OHM,0.25 MTG W/ 0.375HEX,0.59 X 0.24 MLG,GOLD/SS
- 16 210-- 0457-- 00 1 NUT,PL,ASSEM WA:6-- 32 X 0.312,STL CD 0KB01 ORDER BY

PL,W/LOCKWASHER DESCRIPTION
- 17 210-- 0465-- 00 1 NUT,PLAIN,HEX:0.25-- 32 X 0.375,BRS CD PL 0KB01 ORDER BY
DESCRIPTION
- 18 650-- 4086-- 00 1 CABLE ASSEMBLY:ELECT,ANTI STATIC CONNECTION 060D9 650-- 4086-- 00

- 19 210-- 1443-- 00 1 WASHER,FLAT:0.25 ID X 0.375 OD X 0.265,NYLON 74594 5610-- 120-- 062
- 20 136-- 0140-- 00 1 JACK,TIP:BANANA,CHARCOAL GRAY 0KBZ5 N/A
- 21 156-- 4827-- 00 1 IC,MEMORY:CMOS,SDRAM,8MEG X 6Y440 MT8LSDT864AG-- 10
64,MC-- 458CB646-- A10,DIMM168 EC7
- 22 441-- 2183-- 01 1 CHASSIS:REAR DRIVE BAY (HDD & CD-- ROM) AL & STEEL TK1943 441-- 2183-- 01
- 23 407-- 4880-- 01 1 BRACKET,CD-- ROM:STEEL TK1943 407-- 4880-- 01
- 24 174-- 4231-- 00 1 CABLE ASSY:CABLE ASSEMBY (CD-- ROM) 060D9 174-- 4231-- 00
- 25 671-- 4377-- 00 1 CIRCUIT BD ASSY:CD ROM INTERFACE 80009 671-- 4377-- 00

Fig. &
- 26 119-- 5728-- 00 1 DISK DRIVE:OPTICAL,644MB,CD-- ROM,16.7 MB/SEC 50356 CD-- 224E-- 903
- 27 211-- 1070-- 00 4 SCREW:M2 X 2MM,PNH,PHL, STL NI PLT 0KB01 211-- 1070-- 00
- 28 441-- 2279-- 00 1 CHASSIS,NLX:ALUMINUM,W/HARDWARE TK1943 441-- 2279-- 00
- 29 211-- 0720-- 00 5 SCR,ASSEM WSHR:6-- 32,0.500,PNH,STL,CDPL,T-- 15 0KB01 ORDER BY
DESCRIPTION
- 30 156-- 9074-- 00 1 IC,MEMORY:CMOS,SDRAM,16MEG X 64, SYNC, MT16LSDT3264AG--

UNBUFFERED,3.3V,MC-- 4516CD646-- A10,DIMM168 10E

1 1A
30
2
29 3
4
28
5
26
27
25
4
24 6
7
23
8
9
10
4
22
21
11
12
20
19
18 17
16 15
14
4
13
Figure 10- 3: Power supply

Fig. &
4-- 1 441-- 2176-- 00 1 CHASSIS ASSY:LARGE MODULE,0.050 AL 0J9P9 441-- 2176-- 00
-3 671-- 4483-- 00 1 CIRCUIT BD ASSY:OPTICAL FRONT END 80009 671-- 4483-- 00
-4 174-- 4046-- 00 1 CA ASSY,SP:RIBBON,BUS PROCESSOR,IDC,32 AWG 060D9 174-- 4046-- 00
-5 351-- 1068-- 00 4 GUIDE:CARD GUIDE 32559 E-- 1000
-6 129-- 1516-- 00 3 SPACER, POST:ECB-- 1.077,0.250 HEX 12L 14 STEEL TK0588 129-- 1516-- 00
-7 210-- 0457-- 00 20 NUT,PL,ASSEM WA:6-- 32 X 0.312,STL CD 0KB01 ORDER BY
PL,W/LOCKWASHER DESCRIPTION
-8 174-- 4045-- 01 2 CA ASSY,SP:RIBBON,BUS ACQUISITION,IDC,32 AWG 060D9 174-- 4045-- 01
-9 Order 4-- 11: 1 CIRCUIT BD ASSY:SMALL MODULE INTERFACE 80009 NA
650-- 4418-- 01 Part of item 4-- 11: COMBO ASSEMBLY:ACQP/EFE
- 10 Order 4-- 11: 1 CKT BD SUBASSY:ACQ BOARD 80009 NA
650-- 4418-- 01 Part of item 4-- 11: COMBO ASSEMBLY:ACQP/EFE
- 11 650-- 4418-- 01 1 COMBO ASSEMBLY:ACQP/EFE 80009 650-- 4418-- 00
- 12 351-- 1067-- 00 8 GUIDE:CARD GUIDE,E-- 300 32559 E-- 300
- 13 174-- 4043-- 00 1 CA ASSY,SP,ELEC:DISCRETE,TRIGGER PROBE POWER 060D9 174-- 4043-- 00
- 14 211-- 0815-- 00 3 SCREW,MACHINE:6-- 32 X 1.750,PNH,STL,ZINC,T-- 15 3M099 211-- 0815-- 00
- 15 174-- 4322-- 00 1 CA ASSY,RF:RFS,0.141OD,50 OHM,SMA,JACK, X SMA,JACK 060D9 174-- 4322-- 00

- 16 441-- 2175-- 01 1 CHASSIS ASSY:SMALL MODULE,0.050 AL 0J9P9 441-- 2175-- 01
- 17 211-- 0373-- 00 18 SCREW,MACHINE:4-- 40 X 0.250,PNH,STL CD PLT,T10 93907 ORDER BY
DESCRIPTION
- 18 355-- 0259-- 00 4 STUD,LOCKING:0.850 X 0.188 HEX,SST TK0588 ORDER BY
DESCRIPTION
- 19 214-- 4893-- 00 6 SPRING,TORSION:0.126OD X 0.094ID,DOOR,RIGHT,0.018DIA 8X345 R07SPRG4

- 20 200-- 4560-- 00 4 COVER:SMALL MODULES,0.036 SST TK1943 200-- 4560-- 00
- 21 214-- 4892-- 00 6 SPRING,TORSION:0.126OD,0.094ID.DOOR,LEFT,0.018DIA 8X345 R07SPRG3
- 22 105-- 1132-- 00 4 LEVER,EJECT:0.048 THK SSTL,SMALL MODULE TK1943 105-- 1132-- 00
- 23 210-- 0185-- 00 12 WASHER,SHLDR:0.375 OD X 0.115 ID X 0.093 THK TK0588 210-- 0185-- 00
- 24 366-- 0815-- 00 6 KNOB:EJECTOR LEVER,PC/ABS,SILVER GRAY TK6181 366-- 0815-- 00
- 25 105-- 1131-- 00 2 LEVER,EJECT:0.048 THK SSTL,LARGE MODULE TK1943 105-- 1131-- 00
- 26 214-- 4891-- 00 6 SPRING,TORSION:0.304 X 0.256 X 1.152 8X345 R07SPRG1
- 27 355-- 0297-- 00 2 STUD,SHOULDERED:4-- 40 X 1.050L,SST TK0588 355-- 0297-- 00
- 28 200-- 4561-- 00 2 COVER:0.036 SST,LARGE MODULES TK1943 200-- 4561-- 00

3
2
21
28
19 2
17 5
27
6
26
7
25
8
24
23
17
22
21 12
17
18 16
20
19 7 13 9
10
11
2
15
14
Figure 10- 4: Acquisition

Fig. &
5-- 1 174-- 4348-- 00 2 CA ASSY, RF:COAXIAL,50 OHM,RG-- 316,12.00L,MCX RTANG 060D9 174-- 4348-- 00
PLUG 50 OHM TO MCX RTANG PLUG
-2 174-- 4233-- 00 4 CA ASSY,RF:COAXIAL,50 OHM, DSUB TO MCX-- B,R07CABL1 060D9 174-- 4233-- 00
-3 174-- 4347-- 00 10 CA ASSY,RF:COAXIAL,50 OHM,RG-- 316,7.500L,X D-- SUB 060D9 174-- 4347-- 00
-4 174-- 4138-- 00 3 CABLE ASSY,RF:COAXIAL,50 OHM,OPTICAL BD TO ACQ BD 060D9 174-- 4138-- 00
-5 174-- 4132-- 00 1 CABLE ASSY,RF:COAXIAL,50 OHM,7.5 L,SMB TO PELTOLA 060D9 174-- 4132-- 00
-6 174-- 4133-- 00 4 CABLE ASSY,RF:COAXIAL,50 OHM,14.0 L,MCX TO PELTOLA 060D9 174-- 4133-- 00
-7 174-- 4137-- 00 2 CABLE ASSY,RF:COAXIAL,50 OHM,D-- SUB TO ACQ BD 060D9 174-- 4137-- 00
-8 174-- 4234-- 01 1 CA ASSY,RF:COAXIAL,50 OHM, SMB TO MCX,R07CABL2 060D9 174-- 4234-- 01
-9 343-- 0459-- 00 1 STRAP,TIEDOWN,E:0.098 W X 4.0 L,ZYTEL 74594 343-- 0459-- 00
(not shown on drawing)

1 2 3 2 3
3
2
1
8 7
3
4
3
3
2
3
3
6
3
6
6 3
6
5
Figure 10- 5: Coaxial cables

Fig. &
Index Tektronix part Serial no. Serial no. Mfr.
6-- 1 211-- 0088-- 00 3 SCREW,MACHINE:2-- 56 X 0.281,FLH,82 DEG,STL BK 0KB01 ORDER BY
OXD,POZ DESCRIPTION
-2 386-- 7293-- 00 1 PLATE,FRICTION TK2601 386-- 7293-- 00

-3 384-- 1838-- 00 1 SHAFT; SCREW LOCKDOWN, 303 SST, R05HDSCR TK2563 ORDER BY
DESCRIPTION
-4 391-- 0239-- 00 1 LOCK SCREW:MOUNTING BLOCK TK2601 391-- 0239-- 00

-5 211-- 0088-- 00 4 SCREW,MACHINE:2-- 56 X 0.281,FLH,82 DEG,STL BK 0KB01 ORDER BY
OXD,POZ DESCRIPTION
-6 366-- 0804-- 00 1 KNOB:PUSH BUTTON, 0.11 OD, 0.33L, DELRIN, GRAY, 80E01 TK1163 366-- 0804-- 00
(R05PBKNB)
366-- 0804-- 00 2 KNOB:PUSH BUTTON, 0.11 OD, 0.33L, DELRIN, GRAY, TK1163 366-- 0804-- 00
80E02, 80E03, 80E04 (R05PBKNB)
-7 211-- 0087-- 00 2 SCREW,MACHINE:2-- 56 X 0.188,FLH,82 DEG SST,POZ 1AW87 ORDER BY

DESCRIPTION
-8 214-- 4081-- 00 1 MTG,SCR LOCKDWN:ALUMINUM 5Y400 ORDER BY

DESCRIPTION
-9 380-- 1132-- 00 1 HOUSING:SAMPLING HEAD,AL, 80E02 5Y400 380-- 1132-- 00

- 10 333-- 4340-- 00 1 PANEL,FRONT:ALUMINUM,CHROMATE,W/TEK SILVERGRAY 5Y400 333-- 4340-- 00
- 11 335-- 0151-- 00 1 MARKER,IDENT:LABEL,0.010 POLY,W/ADHESIVE,80E02 0KB05 335-- 0151-- 00
335-- 0152-- 00 1 MARKER,IDENT:LABEL,,0.010 POLY,W/ADHESIVE,80E03 0KB05 335-- 0152-- 00
335-- 0153-- 00 1 MARKER,IDENT:LABEL,0.010 POLY,W/ADHESIVE,80E04 0KB05 335-- 0153-- 00
- 12 380-- 1138-- 00 1 HOUSING:ALUMINUM,SAMPLING HEAD 80E01 5Y400 380-- 1138-- 00
- 13 333-- 4371-- 00 1 PANEL,FRONT:ALUMINUM,CHROMATE,W/TEK SILVERGRAY 5Y400 333-- 4371-- 00
- 14 335-- 0339-- 00 1 MARKER,IDENT:LABEL,0.010 POLY,W/ADHESIVE, 80E01 0KB05 335-- 0339-- 00

1 2 3
5 6
1
7 8 3
7
6
14 13 7 12
5
9
7
11
10
Figure 10- 6: Electrical modules (80E01, 80E02, 80E03, and 80E04)

Fig. &
7-- 1 380-- 1159-- 00 1 HOUSING:SAMPLING HEAD,ALUMINUM,80E06, SAFETY 5Y400 380-- 1159-- 00
CONTROLLED

DESCRIPTION
-3 333-- 4436-- 00 1 PANEL, FRONT:NSD HEADS,BLANK,386-- 5603-- 00,80E06 OJ4C1 333-- 4436-- 00
-4 335-- 0863-- 00 1 MARKER,IDENT:SAMPLING HEAD,2.760 X 0.810,0.010 OKB05 335-- 0863-- 00
POLY,W/ADHESIVE,80E06,SAFETY CONTROLLED

OXD,POZ DESCRIPTION
1
5
Figure 10- 7: 80E06 module

Fig. &
8-- 1 200-- 4568-- 00 1 COVER:OPTICAL MODULE,0.050 AL TK1943 200-- 4568-- 00
-2 335-- 0370-- 00 1 MARKER,IDENT:ANTI-- STATIC LABEL,0.005 POLY 0KB05 335-- 0102-- 00
-3 211-- 0373-- 00 7 SCREW,MACHINE:4-- 40 X 0.250,PNH,STL CD PLT,T10 93907 ORDER BY
DESCRIPTION
-4 105-- 1115-- 00 2 LATCH:ADJUSTABLE GRIP,16-- 10-- 511-- 16 94222 16-- 10-- 511-- 16
-5 200-- 4104-- 00 1 CAP,DUST:ELAY M75-- M80 SHORE,BLACK MATT TEXTURED TK2491 UT11-- 01
2
1
5
4
Figure 10- 8: Optical modules

Fig. &
Index Tektronix part Serial no. Serial no. Mfr.
9-- 1 384-- 1838-- 00 1 SHAFT:SCREW LOCKDOWN,303 SST,R05HDSCR TK0588 384-- 1838-- 00
-2 214-- 4081-- 00 1 LOCKDOWN:SCREW MOUNT,0.080 AL 5Y400 214-- 4081-- 00
-3 211-- 3008-- 00 2 SCREW,MACHINE:2-- 56 X 0.281,PNH,SST,PASS,POZI DR 0KB01 211-- 3008-- 00
-4 015-- 1022-- 01 1 TERMINATOR:COAXIAL, 50 OHM, 0.5W, SMA 61162 50T-- 320 SMA M
-5 335-- 0370-- 00 1 MARKER,IDENT:ANTI-- STATIC LABEL,0.005 POLY 0KB05 335-- 0102-- 00
OXD,POZ DESCRIPTION
-7 380-- 1151-- 00 1 HOUSING:SAMPLING MODULE,TRIGGER PRESCALE 5Y400 380-- 1151-- 00

LIMITING PREAMP

DESCRIPTION
-9 333-- 4392-- 00 1 PANEL,FRONT:TRIGGER PRESCALE LIMITING PREAMP,AL 5Y400 333-- 4392-- 00

ALLOY
- 10 335-- 0485-- 00 1 MARKER,IDENT:LABEL,MKD 80A01 PRESCALE 0KB05 335-- 0485-- 00
MODULE,2.760 X .810,LEXAN,
4 2
7
3
8
9
10
Figure 10- 9: 80A01 module

Fig. &
index Tektronix Serial no. Serial no. Mfr.
number part number effective discont’d Qty Name & description code Mfr. part number
MAINFRAME STANDARD ACCESSORIES
10-- 1 161-- 0104-- 05 1 CA ASSY,PWR:3,1.0MM SQ,250V/10A,2.5 M S3109 198-- 010
(OPTION A3 - AUSTRALIAN)
-2 161-- 0104-- 06 1 CA ASSY,PWR:3,1.0MM SQ,250V/10A,2.5 M S3109 198-- 010
(OPTION A1 - EUROPEAN)
-3 161-- 0104-- 07 1 CA ASSY,PWR:3,1.0MM SQ,240V/10A,2.5 M S3109 209010
(OPTION A2 - UNITED KINGDOM)
-4 161-- 0167-- 00 1 CA ASSY,PWR:3,0.75MM SQ,250V/10A,2.5 M S3109 ORDER BY DESC
(OPTION A5 - SWITZERLAND)
-5 161-- 0306-- 00 1 CA ASSY,PWR:3,1.0MM SQ,250V/10A,2.5 M TK6253 92-- 2637-- 250BKH
(OPTION AC - CHINA)
-------- 1 CABLE ASSY,PWER:3,18 AWG,92 L
(STANDARD CABLE - SEE FIG 10-- 1-- 6)
016-- 1268-- 00 1 POUCH, PLASTIC:POUCH TK2539 2122
(STANDARD CABLE - SEE FIG 10-- 1-- 1)
020-- 2370-- XX 1 ACCESSORY KIT:SOFTWARE PACKAGING KIT,8000 SERIES TK2548 020-- 2370-- XX
020-- 2436-- XX 1 ACCESSORY KIT:WINDOWS OPERATING SYSTEM TK2548 020-- 2436-- XX
RESTORE SOFTWARE,W/TEK ENVELOPES & CD BOOKLET
071-- 0433-- XX 1 MANUAL,TECH:USER, CSA8000, TDS8000 TK2548 071-- 0433-- XX
071-- 0434-- XX 1 MANUAL,TECH:SAMPLING MODULE USER (SHIPPED WITH TK2548 071-- 0434-- XX
EACH ELECTRICAL SAMPLING MODULE ORDERED WITH
THE MAINFRAME)
071-- 0435-- XX 1 MANUAL,TECH:OPTICAL MODULE USER (SHIPPED WITH TK2548 071-- 0435-- XX
EACH OPTICAL SAMPLING MODULE ORDERED WITH THE
MAINFRAME)
071-- 1096-- XX 1 MANUAL,TECH:REFERENCE, CSA8000B, TDS8000B TK2548 071-- 1096-- XX
071-- 1099-- XX 1 MANUAL,TECH:USER, CSA8000B, TDS8000B TK2548 071-- 1099-- XX
119-- 6633-- 00 1 KEYBOARD:USB KEYBOARD 52833 E06101 USB-- C
119-- 6298-- 00 1 MOUSE:LOGITECCH WHEEL MOUSE 46628 830306-- 001
119-- 6107-- 00 1 STYLUS:STYLUS FOR TOUCH SCREEN 03ZT7 T1100
MAINFRAME OPTIONAL ACCESSORIES
012-- 1568-- 00 1 CA ASSY:SSP,ELEC,1 METER LONG, EXTENDER 060D9 012-- 1568-- 00
015-- 0552-- 00 1 ADPTR,APC,ELEC:3.5MM,MALE TO FEMALE 02660 131-- 7053
015-- 0553-- 00 1 ADPTR,SMA,ELEC:MALE TO FEMALE,SLIDE ON MALE 98291 50-- 674-- 6324-- 990
015-- 1001-- 01 1 ATTENUATOR, FIX:2:1 ATTENUATION, 50 OHM, SMA SERIES 16179 2082-- 4573-- 06
CONNECTORS
015-- 1002-- 01 1 ATTENUATOR, FIX:5:1 ATTENUATION, 50 OHM, SERIES SMA 16179 2082-- 4573-- 14
CONNECTORS
015-- 0565-- 00 1 POWER DIVIDER:50 OHM, 3 SMA FEMALE CONNECTORS 64537 D293S
016-- 1791-- 01 1 RACKMOUNT KIT: OPTION 1R, CSA/TDS8000 SERIES 80009 016-- 1791-- 01
067-- 1338-- 00 1 FIXTURE,CAL:,SAMPLING HEAD CAL UNIT TK2601 067-- 1338-- 00
071-- 0438-- XX 1 MANUAL,TECH:SERVICE, CSA8000, TDS8000 TK2548 071-- 0438-- XX

Fig. &
index Tektronix Serial no. Serial no. Mfr.
number part number effective discont’d Qty Name & description code Mfr. part number
650-- 4271-- 00 1 DISK DRIVE:WINCHESTER,2.5 IN,10.0 GB SINGLE 80009 650-- 4271-- 00
PLATTER,9.5 MM,IDE,MHH2064AT,
--------- 1 DUAL DELAY LINE: DL-- 11 80009 DL-- 11
--------- 1 PROBE: P6209, 4.0 GHz ACTIVE FET PROBE 80009 P6202
--------- 1 EOS/ESD PROTECTION MODULE:ELECTRICAL STATIC 80009 80A02
ISOLATION OF TEKTRONIX ELECTRICAL SAMPLING
MODULES
80E0X STANDARD ACCESSORIES
071-- 0434-- XX 1 MANUAL,TECH:SAMPLING MODULE USER TK2548 071-- 0434-- XX
015-- 1022-- 00 1 TERMINATOR, COA:SHORT CIRCUIT, SMA MALE 0GZV8 64SMA-- 50-- 0-- 1
(80E01)
015-- 1022-- 00 2 TERMINATOR, COA:SHORT CIRCUIT, SMA MALE 0GZV8 64SMA-- 50-- 0-- 1
(80E02, 80E03 AND 80E04)
015-- 0703-- xx 1 ADPTR,RF,PRCN:2.4MM OR 1.85MM MALE TO 2.92MM 20944 26-925-0000-90
FEMALE (80E01 and 80E06 only)
80E0X OPTIONAL ACCESSORIES
CONNECTORS
CONNECTORS
80C0X STANDARD ACCESSORIES
071-- 0435-- XX 1 MANUAL,TECH:OPTICAL MODULE USER TK2548 071-- 0435-- XX
80C0X OPTIONAL ACCESSORIES
119-- 4514-- 00 1 ADAPTER,D4:TFS3030,AD4-- 20 TK2491 AD4-- 20
119-- 4515-- 00 1 ADAPTER,BICONIC:TFS3030,AB1-- 25 TK2491 ABI-- 25
119-- 4516-- 00 1 CONNECTOR, OPTO:ADAPTER, FC-- PC, ATTEN 0.6DB, RTN TK2491 APC-- 10
LOSS 35DB, RPTB+/-- 0.2DB, RIFOCS, APC-- 10
119-- 4517-- 00 1 ADAPTER,SMA:TFS3030,2.5MM,AMT-- 10 TK2491 AMT-- 10
119-- 4518-- 00 1 ADAPTER,SC:TFS3030,ASC-- 10 TK2491 ASC-- 10
119-- 4546-- 00 1 ADAPTER,DIN:47256,AD-- 234 TK2491 AD-- 234
119-- 4556-- 00 1 ADAPTER,HP-- PC:OPTICAL CONNECTOR, UNIVERSAL TK2491 PROPRIETARY
CONNECTOR INTERFACE, AHP-- 10 INFORMATION
(AHP-- 10)
119-- 4557-- 00 1 ADAPTER,UNIV:SMA 905/906,ASM-- 90 TK2491 PROPRIETARY
INFORMATION
(ASM-- 90)
119-- 4558-- 00 1 ADAPTER,UNIV:DIAMOND 3.5MM,AMS-- 00 TK2491 PROPRIETARY
INFORMATION
(AMS-- 00)
119-- 4513-- 00 1 CONNECTOR, OPTO:ADAPTER, ST, ATTEN 0.6DB, RTN TK2491 ATS-- 16
LOSS 35DB, RPTB +/-- 0.2DBRIFOCS, ATS-- 16

1 2 3 4 5
Figure 10- 10: Accessories


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Service Manual

Tektronix, Inc., P.O. Box 500, Beaverton, OR 97077

TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.

General Safety Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv

CSA8000 & TDS8000 Series Instruments and Sampling Modules i

80E00 Electrical Sampling Module Operation . . . . . . . . . . . . . . . . . . . . . . . . . 2-- 24

Performance Verification Procedures

ii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Perform the Functional Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 7

CSA8000 & TDS8000 Series Instruments and Sampling Modules iii

50 GHz - 65 GHz Analog Bandwidth (80E06) . . . . . . . . . . . . . . . . . . . . . . . . . 4-- 117

iv CSA8000 & TDS8000 Series Instruments and Sampling Modules

Procedures for External Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-- 9

CSA8000 & TDS8000 Series Instruments and Sampling Modules v

Options and Accessories

Electrical Parts List

Mechanical Parts List

vi CSA8000 & TDS8000 Series Instruments and Sampling Modules

Figure 2--1: Compartments for sampling modules . . . . . . . . . . . . . . . 2--3

Figure 4--1: Compensation dialog box . . . . . . . . . . . . . . . . . . . . . . . . . 4--5

CSA8000 & TDS8000 Series Instruments and Sampling Modules vii

Figure 4--26: Power-reference hookup . . . . . . . . . . . . . . . . . . . . . . . . . 4--100

Figure 5--1: Adjustment setup using the DMM . . . . . . . . . . . . . . . . . . 5--3

Figure 6--1: Knob removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--9

viii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Figure 6--3: Bottom cover removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6--12

CSA8000 & TDS8000 Series Instruments and Sampling Modules ix

Figure 6--41: Location of power-on and over current LEDs . . . . . . . 6--71

Figure 9--1: Block diagram for CSA8000 and TDS8000 Series

x CSA8000 & TDS8000 Series Instruments and Sampling Modules

Figure 9--24: 80A01 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 9--24

Figure 10--1: External parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10--7

CSA8000 & TDS8000 Series Instruments and Sampling Modules xi

Table 1--1: System -- Signal acquisition . . . . . . . . . . . . . . . . . . . . . . . 1--1

Table 2--1: Additional accessory connection information . . . . . . . . . 2--4

Table 3--1: Module optical/electrical split . . . . . . . . . . . . . . . . . . . . . . 3--6

Table 4--1: Equipment Required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4--31

xii CSA8000 & TDS8000 Series Instruments and Sampling Modules

Table 4--2: DC Voltage measurement accuracy . . . . . . . . . . . . . . . . . 4--90

Table 5--1: Adjustments required for module replaced . . . . . . . . . . . 5--1

Table 6--1: External inspection check list . . . . . . . . . . . . . . . . . . . . . . 6--3

Table 7--1: Available sampling modules . . . . . . . . . . . . . . . . . . . . . . . 7--1

CSA8000 & TDS8000 Series Instruments and Sampling Modules xiii

xiv CSA8000 & TDS8000 Series Instruments and Sampling Modules

Connect and Disconnect Properly. Do not connect or disconnect probes or test

CSA8000 & TDS8000 Series Instruments and Sampling Modules xv

Do Not Operate in Wet/Damp Conditions.

WARNING. Warning statements identify conditions or practices that could result

CAUTION. Caution statements identify conditions or practices that could result in

Terms on the Product. These terms may appear on the product:

CAUTION WARNING Protective Ground

Mains Disconnected Mains Connected Standby

xvi CSA8000 & TDS8000 Series Instruments and Sampling Modules

CSA8000 & TDS8000 Series Instruments and Sampling Modules xvii

xviii CSA8000 & TDS8000 Series Instruments and Sampling Modules

H CSA8000 and CSA8000B Communications Signal Analyzers,

NOTE. This manual includes information for the CSA8000/TDS8000 and

CSA8000 & TDS8000 Series Instruments and Sampling Modules xix

H 80E01, 80E02, 80E03, 80E04, and 80E06 Electrical Sampling Modules