Non-Synchronous PWM Boost Controller: General Description
Non-Synchronous PWM Boost Controller: General Description
Non-Synchronous PWM Boost Controller: General Description
General Description
The FP5209 is a boost topology switching regulator for wide operating voltage applications. It
provides built-in gate driver pin, EXT pin, for driving the external N-MOSFET. The internal
compensation network minimizes external component counts, and the non-inverting input of error
amplifier connects to a 0.6V precision reference voltage. The FP5209 have internal soft start function.
The FP5209 is available in the small footprint SOT23-5L package to fit in space-saving PCB
layout for miscellaneous application fields.
Features
Wide Supply Voltage Operating Range: 2.4 to 5.5V
Precision Feedback Reference Voltage: 0.6V (±2%)
Shutdown Current: <1μA
Internal Fixed PWM frequency: 550KHz
Internal Soft Start Function :7ms (SS)
Over Voltage Protection
Package: SOT23-5L
Duty Cycle: PWM/PFM Switching Control Circuit (15%~90%)
Applications
Chargers
LCD Displays
Digital Cameras
Handheld Devices
Portable Products
1 5
FB EXT
2 FP5209
Vcc
3 4
ON/OFF EN GND
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FP5209
Shutdown
UVLO
Circuitry
Error Amp.
FB
Control
and
0.6V EXT
Driver
PWM Logic
Comp.
Soft
Start
VRAMP
Oscillator
550KHz
Pin Descriptions
SOT23-5L
Top View
Name No. I/O Description
FB EXT
AX986
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FP5209
Marking Information
SOT23-5L
AX986
Lot Number
Year
Part Number Code
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FP5209
Ordering Information
Part Number Code Operating Temperature Package MOQ Description
FP5209KR-G1 AX -25°C ~ 85°C SOT23-5L 3000EA Tape & Reel
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FP5209
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FP5209
Function Description
Operation
The FP5209 is a voltage mode boost controller. The switching is a fixed frequency 550kHz and
operates with pulse width modulation (PWM). An internal resistive divider provides 0.6V reference for
the error amplifier. The FP5209 changes to PFM mode when output is light load. It can increase
efficiency, but PFM mode also increases output voltage ripple.
Shutdown Function
Drive Enable pin to ground to shut down the FP5209. Shutdown mode forces to turn off all
internal circuitry, and reduces the VIN supply current to 0.1μA (typ). The Enable pin rising threshold is
0.96V (typ). Before any operation begins, the voltage at Enable pin must exceed 0.96V (typ).
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FP5209
Application Information
Inductor Selection
Inductance value is decided based on different condition. 3.3uH to 4.7µH inductance value is
recommended for general application circuit. There are three important inductor specifications, DC
resistance, saturation current and core loss. Low DC resistance has better power efficiency.
Capacitor Selection
The output capacitor is required to maintain the DC voltage. Low ESR capacitors are preferred to
reduce the output voltage ripple. Ceramic capacitor of X5R and X7R are recommended, which have
low equivalent series resistance (ESR) and wider operation temperature range.
Diode Selection
Schottky diodes with fast recovery times and low forward voltages are recommended. Ensure the
diode average and peak current rating exceed the average output current and peak inductor current. In
addition, the diode’s reverse breakdown voltage must exceed the output voltage.
R1
VOUT 0.6V1
R2
Layout Considerations
1. The power traces, consisting of the GND trace, the MOS drain trace and the VCC trace should be
kept short, direct and wide.
2. Layout switching node MOS drain, inductor and diode connection traces wide and short to reduce
EMI.
3. Place CIN nearby VCC pin as closely as possible to maintain input voltage steady and filter out the
pulsing input current.
4. The resistive divider R1and R2 must be connected to FB pin directly and as closely as possible.
5. FB is a sensitive node. Please keep it away from switching node, MOS drain.
6. The GND of the IC, CIN and COUT should be connected close together and directly to a ground
plane.
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FP5209
L1
Vin
D1
R2
VIA to Vout R1
Q1
1 5
C3 Vout
2
FP5209
3 4
C1 C2
GND
Suggested Layout
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FP5209
Application Information
VIN L1 3.3µH
D1 SM540A VOUT
3V~4.2V 5V/2.1A
R3
C1 R1
10µF Q1 88K
1 5
FB EXT C5
C3
22µF*2
2 FP5209
Vcc R2
Optional 12K
3 4
EN GND
SOT23-5L
R3
C1 R1
10µF Q1 88K
1 5
FB EXT C5
C3 C2
22µF*2 100µF
2 FP5209
Vcc R2
Optional 12K
3 4
EN GND
SOT23-5L
Note:
1. C1 and C3 choose ceramic capacitor of X5R or X7R.
2. R3 and C5 are added for reducing EMI (Electromagnetic Interference).
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FP5209
Package Outline
SOT23-5L
Unit: mm
Symbols Min. (mm) Max.(mm)
A 1.050 1.350
A1 0.050 0.150
A2 1.000 1.200
b 0.250 0.500
c 0.080 0.200
D 2.700 3.000
E 2.600 3.000
E1 1.500 1.700
e 0.950 BSC
e1 1.900 BSC
L 0.300 0.550
L1 0.600 REF
L2 0.250 BSC
θ° 0° 10°
θ1° 3° 7°
θ2° 6° 10°
Note:
1. Package dimensions are in compliance with JEDEC outline: MO-178 AA.
2. Dimension “D” does not include molding flash, protrusions or gate burrs.
3. Dimension “E1” does not include inter-lead flash or protrusions.
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