This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.
This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.
This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.
This seminar report discusses Microelectromechanical Systems (MEMS). MEMS are integrated microdevices combining electrical and mechanical components fabricated using IC techniques and ranging in size from micrometers to millimeters. They can sense, search, control and actuate on the microscale. The report covers MEMS applications like biomems, moems and rfmems. It discusses MEMS fabrication methods including photolithography, bulk micromachining, surface micromachining and high aspect ratio micromachining. The report highlights advantages like low cost, compact size, and versatility and disadvantages such as limited maximum power. It concludes with future potential in combining MEMS with other technologies to create innovative systems offering outstanding functionality.
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MICRO ELECTROMECHANICAL SYSTEMS(MEMS)
SEMINAR REPORT
Submitted by
SHABEEL MP
(Reg. NO: 20033273)
in partial fulfilment for the award
DIPLOMA IN ELECTRICAL AND ELECTRONICS ENGINEERING
ORPHANAGE POLYTECHNIC COLLEGE, EDAVANNA
DEPARTMENT OF ELECTRICAL AND ELECTRONICS
ENGINEERING
APRIL 2022 MICRO ELECTROMECHANICAL SYSTEMS(MEMS)
SEMINAR REPORT
Submitted by SHABEEL MP
(Reg. NO: 20033273)
in partial fulfilment for the award
DIPLOMA IN
ELECTRICAL AND ELECTRONICS ENGINEERING
ORPHANAGE POLYTECHNIC COLLEGE, EDAVANNA
DEPARTMENT OF ELECTRICAL AND ELECTRONICS
ENGINEERING
APRIL 2022 BONAFIDE CERTIFICATE
It is Certified that this seminar report “MICRO ELECTROMECHANICAL
SYSTEMS(MEMS)” Is the Bonafide work of SHABEEL MP (Reg. NO: 20033273) who carried out the work under guidance for the partial fulfillment of the requirement for the award of the Diploma in Electrical and Electronics Engineering at Orphanage Polytechnic College, Edavanna.
Mr. ASHIKALI P MR. JASEEL JASIM V
HEAD OF DEPARTMENT SEMINAR CO-ORDINATOR Electrical & Electronics Engineering Electrical & Electronics Engineering Orphanage Polytechnic College Orphanage Polytechnic College Edavanna Edavanna ABSTRACT
Microelectromechanical Systems, or MEMS, are integrated micro devices or
systems combining electrical and mechanical components. They are fabricated using integrated circuit (IC) batch processing techniques and can range in size from micrometers to millimeters. These systems can sense, search control and actuate on the micro scale, and function individually or in arrays to generate effects on the macro scale. Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific device. The associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semipermanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related. MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will created. This will offer outstanding Functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, and hydrodynamics, biomedical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outstanding functionality. ACKNOWLEDGEMENT
I very much grateful to the authorities of Orphanage Polytechnic College,
Edavanna for providing the facilities needed during the seminar presentation
My deepest gratitude and thanks to our Principal Mr. Mansoor Ali PP who has been kind enough and encouraging us always during the entire period of our course.
I gratefully acknowledge the valuable help and advice received from
Mr. Ashikali.P Head of Department of Electrical and Electronics Engineering whose continuous encouragement that has resulted in the completion of the present work. His timely advice, meticulous scrutiny, scholarly advice and friendly approach have helped us to a very great extent to accomplish this work.
I would also like to express my profound thanks to my class tutor Miss. Shifana.N P Lecturer in Department of Electrical and Electronics Engineering whose thoughtful words helped us in completing my seminar successfully. Also, I would like express my sincere thanks to my seminar co-ordinator Mr. Jaseel Jasim.V demonstrator in Department of Electrical and Electronics Engineering whose instructions helped more to do my seminar presentation.
We thank profusely all the Teaching and non-teaching Faculty members of
Electrical and Electronics Engineering Department and my family members for being my supporting force during my seminar presentation.
No. Fig 2.1.a A MEMS silicon motor together with a strand of human hair. 3
Fig 2.1.b The legs of a spider mite standing on gears from a micro- 3 engine. Fig 3.1.a Micromachined microtitreplate with 96 cavities filled by 6 capillary force. Fig 3.1.b A bioMEMS device actuated with ‘microteeth’ to trap, hold 6 and release single red blood cells (unharmed). The little balls in the channels are red blood cells.
