16-08-2024

Indian Institute of Space Science and Technology

M.Tech. VLSI and Microsystems

Course : AVM 612 Introduction to MEMS

Lecture :1 Introduction
(Week 1)
Course Instructor
Dr. Seena.V.
E-mail : seena.v@iist.ac.in
/ seenapradeep@gmail.com
Office : R-107, Block-D3
Ext:579

Instructor: Dr Seena V
2

 Ph.D Microelectronics, Prof. V. Ramgopal Rao’s group, Centre of Excellence in

Nanoelectronics, Department of Electrical Engineering, IIT Bombay 2011

 Faculty member, IIT Jodhpur (2011-2012) and R&D Consultant for Nanosniff
Technologies Pvt. Ltd, Incubation company in MEMS, SINE, IIT Bombay

 Faculty member, Department of Avionics, IIST Since 2012

 Research : Mostly the same topics of this course. Focus on electromechanical

transduction for MEMS/NEMS, Design and fabrication of Micro/nanoscale
devices for Sensors , Nanomechancial Sensors

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Course Objectives and Scope

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 Provides some basic understanding of MEMS and Microsystems

 Makes us understand the inter-related design/materials/fabrication issues for

realization of micro machined transducers.

 Enables us to understand and apply common principles of sensing and

actuation.

 Guides us to learn how to analyze electromechanical behavior of simple

electromechanical systems

 Provides understanding of fabrication techniques used in MEMS/NEMS

 Gives a broad perspective of application areas and commercialization aspects of

MEMS and microsystems
 The course enables the students to explore the field of Micro/Nanoelectronics

Course Policy
4

1. Attendance requirements as per IIST rules

2. Grading:
• Midsem/Quiz exam : 30%
• Course Project/Term Paper :20%
• End Semester exam :50%

Note: 1. Tutorial /Assignment submission Compulsory.

2. Please take care of deadlines

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Course Outline
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Introduction to MEMS and Microelectronics
Broad-stroke overview – History of Microelectronics and MEMS, Introduction to MEMS
Technology and Applications

Analysis oriented.
Sensing and actuation principles of MEMS, Applications
Design and analysis of MEMS
MEMS: Mechanics of MEMS devices and Thin films
Transduction mechanisms :Electrostatic, piezoresistivity, piezoelectricity, thermal,

Fabrication oriented.
FET based transduction for MEMS
MEMS Materials and Fabrication Technology

Application oriented.
Micromachining technologies for MEMS
MEMS Micro sensors, and applications/Case studies
Physical, RF MEMS Applications

Outcome Based Education: Course Outcomes

6

(Ref: NBA@ Avionics)

 CO1: Provides basic understanding of Sensing & Actuation Principles of
Microsystems based on microelectronics

 CO2: Provides fundamental concepts on the design and analysis of electromechanical

behavior of simple Microsystems

 CO3: Familiarity on the materials and processes for MEMS and understanding on
MEMS fabrication processes.

 CO4: Enables to acquire a broad perspective of application areas for MEMS sensors
and actuators with case studies

8/16/2024

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Reference
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Books:
1. Foundations of MEMS Chang Liu, Pearson
2. S. D. Senturia, Microsystem Design, Springer (2005 edition)
3. Minhang Bao "Analysis and Design Principles of MEMS Devicess",
4. Nadim Maluf, An Introduction to Microelectromechanical Systems Engineering
5. G. K. Ananthasuresh , K. J. Vinoy, S. Gopalakrishnan, K. N. Bhat , V. K. Aatre Micro
and Smart Systems
6. Tai-Ran Hsu MEMS & Microsystems: Design, Manufacture, and Nanoscale
Engineering, 2nd Edition

Go beyond your Notes & Textbooks

Information Resources
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Journals:
1. Journal of Micromechanical Systems (JMEMS)
2. Journal of Micromechanics and Microengineering (JMM)
3. Nanotechnology
4. Sensors and Actuators (A, B & C)
5. Journal of Microelectronics
6. IEEE Sensors
Conference Proceedings:

1. International Electron Device Meeting (IEDM)

2. IEEE MEMS
3. International Conference on Solid-State Sensors and Actuators (Transducers)
4. Micro-Total-Analysis Systems (µTAS)

Other resources
1. Sensors Magazine
2. Micronews (Yole Development)
3. MST News

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MEMS/(Micro/Nano) Electronics ….?

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Performance Cost Medical Applications

Social Impact
Miniaturization Technologies
for Launch Vehicles,
Satellites (SPACE/ISRO)
Inertial sensors: Accelerometers
Micro Propulsion systems
Space environment sensors &...
Scaling improves cost, speed, and power per function with every new technology generation. An
engineering achievement unmatched in human history! Dr. Seena V
Expanding Moore’s law, ftp://download.intel.com/labs/eml/download/EML_opportunity.pdf

What is MEMS ?

MEMS : Micro-Electro-Mechanical –Systems

 MEMS (Since 1980s in US)
 Microsystems (MST) (Europe)
 Micromachines (Japan)

PRESSURE ‘SENSOR’
A “Microsystem”
• Sensor
• Electronic circuit
• Actuator

TI DMD
DIGITAL MICROMIRROR ‘ACTUATOR’

Seena V, IIST

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MEMS (Microsystems)

MEMS/Microsystems are Fabricated using micromachining technology (Derived from

Microelectronics)

Introduction to Microelectronics
12
Bardeen, Brattain, and Shockley
1947:First Point contact Transistor @ Bell Laboratories, 1948

Developed at Bell Labs Nobel prize in physics awarded 1956

Germanium semiconductor, and two gold contacts
separated by 50 µm.
1950: William Shockley develops the BJT
device most commonly referred to as a Transistor
1958: First Integrated Circuit
First IC from TI
Developed by J. Kilby (Texas Instruments)) 1958
(“Kilby Device”: Phase-shift oscillator with 1 transistor, 1
capacitor and three resistors in a single germanium substrate,
connected via soldered wires
J. Kilby
1959: Planar Technology First Planar
Developed at Fairchild Semiconductor transistor
The B region diffused into C (substrate) and E region into the base B
Integrated Wiring (Robert Noyce): By covering the planar
E
transistor with an oxide layer. Aluminum can be used on top
to wire the devices
C

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Introduction to Microelectronics
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1961:First Commercial Planar ICs
RTL (resistors-transistor logic) family of logic chips called was
developed at Fairchild Semiconductor based on the planar process
developed by R. Noyce and J. J. Hoerni

1960: First Silicon MOSFET Flip flop with 4

(Slow compared to BJTs. High layout density and simpler fabrication process ) bipolar transistors
and 5resistors
Kahng and Atalla, Bell Labs

1963: CMOS  Major breakthrough in the level of integration

Wanlass and Sah, Fairchild, USA
1971: The First Microprocessor Intel 4004
Developed at Intel. 2,300 MOS transistors in 10 micron PMOS technology on 2 inch wafers.

2002-2003 : Intel 90nm process technology, including higher-performance, lower-power

transistors, strained silicon, high-speed copper interconnects and a new low-k dielectric material
2009: Intel Quad-Core Xeon 5500 Series
45 nm CMOS technology with 9 metallization levels; 731 million transistors ;Clock rate: up to 3 GHz
Most VLSI Chips in production today are based on CMOS technology

Microelectronics

Generation Year Transistors

Small Scale Integration (SSI) 1967 1~100
Medium Scale Integration (MSI) 1967 100~1000
Large Scale Integration (LSI) 1972 1000~10000
Very Large Scale Integration (VLSI) 1978 10000~……..

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History of Microelectronics/Microsystems
VLSI era

strained Si (2003)
high-k/metal gate (2007)

Intel’s 3-D, 22nm

Technology
Combination of
Performance and Power
Efficiency

Semiconductor Industry
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Circuit design
Device design
Integration
Manufacturing

Equipment manufacturers.
Lithography, ovens, etch tools,
implanter,…..

System design

Test equipment
(material, electrical, …)

Courtesy : Prof. K. Anil IIT Bombay

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History of MEMS (Microsystems)

Applications:

MEMS Inertial Sensors

3D accelerometers: (Commercial applications, Automobile)

Gyroscope for camera stabilisation and GPS

RF MEMS passive and active devices:

Pressure, temperature sensors etc..

MEMS Lab on a Chip (BioMEMS) for health care and point of care diagnostics

Chemical and Environmental Sensors: (Eg: Hazardous gas sensors, Homeland Security)

Microfuel cell: provides longer lifetime for the batteries

MEMS Energy Harvesters

Microfluidics………..

History of MEMS (Microsystems)

1958 Robert Noyce – Fairchild and Jack Kilby Texas Instruments invent the integrated
circuit (Planar IC Technology)

 By the early 1960s: It was generally recognized that Planar IC technology was the way to make
miniaturized and cost effective electronics

1965: Harvey Nathanson and William Newell, surface-micromachined resonant gate transistor,
Westinghouse

Silicon Substrate (Bulk) Micromachining

1950s: silicon anisotropic etchants (e.g., KOH) discovered at Bell Labs
Late 1960s: Honeywell and Philips commercialize piezoresistive pressure sensor utilizing a silicon
membrane formed by anisotropic etching
1960s-70s: research at Stanford on implanted silicon pressure sensors (Jim Meindl), neural probes, and
a wafer-scale gas chromatograph (both Jim Angell)
1980s: Kurt Petersen of IBM and ex-Stanford students Henry Allen, Jim Knutti, Steve Terry help
initiate Silicon Valley “silicon microsensor and microstructures” industry
1990s: silicon ink -jet print heads become a commodity

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History of MEMS (Microsystems)

Early 1980s: Berkeley and Wisconsin demonstrate polysilicon structural layers and oxide
sacrificial layers(surface micromachining again…….)

1984: Integration of polysilicon microstructures with NMOS electronics

1987: Berkeley and Bell Labs demonstrate polysilicon surface micromechanisms; MEMS

becomes the name in U.S.; Analog Devices begins accelerometer project

1988: Berkeley demonstrates electrostatic micromotor, stimulating major interest in

Europe,Japan, and U.S.; Berkeley demonstrates the electrostatic comb drive

Structures move laterally to surface

C. Nguyen and
R. T. Howe,
IEEE IEDM,
Washington,
D.C.,
December 1993

MEMS Accelerometers

ADVANTAGES 950 6032 7706 MEASURES

LOW COST, SMALL LINEAR

SIZE, LOW POWER MEMS ACCELEROMETER ACCELERATION,
CONSUMPTION AND VELOCITY,
PROMISING DISPLACEMENT
PERFORMANCES VECTORS

APPLICATIONS

NAVIGATION SYSTEMS,
AUTOMOBILES, CONSUMER
ELECTRONICS, LONG
RANGE GUIDANCE,
TACTICAL WEAPONS ETC.

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MEMS Accelerometers

• Measures Linear acceleration, velocity, displacement Principle of Operation

vectors

• Low cost, Small size, Low power consumption,

Promising performances

• Navigation Systems, Automobiles, Consumer

Electronics, Long range guidance, Tactical weapons etc.

Transduction Mechanisms

 Capacitive
 Piezoelectric
 Piezoresistive

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 Second-order spring-mass-damper system.
Piezo-resistive Capacitive
IIST 16-08-2024

MEMS Accelerometers

Acceleromete
Main
r Bandwidth Range
Application
Grade

Motion, static
Consumer 0 Hz 1g
acceleration

Automotive Crash/stability 100 Hz <200 g

Platform
Industrial 5 Hz to 500 Hz 25 g
stability/tilt

Weapons/craft
Tactical <1 kHz 8g
navigation

Submarine/cra
Navigation >300 Hz 15 g
ft navigation

MEMS Accelerometer @IIST

SPACE Application

IIST 16-08-2024

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MEMS Accelerometers

Hz

Analog Devices Accelerometer

Full range: 0-5g

sensitivity: 200 mV/g
resolution: 5 mg at 100 Hz
noise floor: 0.5 mg/(Hz)1/2

Indian Institute of Space Science and Technology

M.Tech. VLSI and Microsystems

Course : AVM 612 Introduction to MEMS

Lecture :1 Introduction
(Week 2)
Course Instructor
Dr. Seena.V.
E-mail : seena.v@iist.ac.in
/ seenapradeep@gmail.com
Office : R-107, Block-D3
Ext:579

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MEMS Accelerometers

Digital Micro Mirrors

www.ti.com/dlp

TI Photos

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MEMS Micromirrors

MEMS Nanomechanical Sensors

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Motivation : Demands for the detection of very low levels of a large number of chemical and
biological substances (‘X’) in application areas :-
• Gas leak detection (Space appl.) •Environmental monitoring
• Healthcare and clinical analysis •Homeland security

MEMS + Nanotechnology  Nanomechanical Bio/Chemical Sensors

Principle :Translation of molecular interaction into nanomechanical motion

Sensing modes

Large surface to volume ratio Good sensitivity Anchor

Miniaturization and mass production Low cost
Seena V, IIST

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MEMS Vibration Energy Harvester

MEMS Vibration Energy Harvester

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Areas of Work related to Biology and Medicine

 Biofluidics  Tissue engineering
 active drug delivery chips
 whole organ engineering for
 cell transport and sorting
 assay storage and critical organ transplant
transportation  blood vessel, kidney,
 micro chemical reactors musculoskeletal
 Medical applications
 least intrusive blood vessel  Genetic analysis
cleaning  DNA amplification
 total health monitoring  DNA transportation and
 micromachined surgical tools manipulation
 biochemical sensing
 total blood analysis
 Cell manipulation
 cell characteristics monitoring
 neuron prosthesis
 cell and tissue based sensors

MEMS for Future Biomedical Applications

 Early Detection of Cancer Cells in Bodily Fluid

 Rapid and precise screen of gene sequence
 identify within a matter of minutes gene sequence of 10-20
base pairs for cancer detection, biological warfare agent
detection.
 Target drug delivery system
 trans-dermal and in-body drug delivery for maximizing the
effective of medicine and reducing the amount of pain
 Next ???
 Micromachined components that travel in blood streams to
detect and cure disease.

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Whole Blood Analysis at Home …

Nasdaq: STAT. Www.I-stat.com

 Patient-side testing with

disposable cartridge for
11 tests
 electrochemical sensors
 potentiometric (Na,
K, Cl, urea, Ca, pH
and CO2)
 amperometric
(glucose, creatinine,
oxygen)
 conductometric.

 Coagulation detection

Needle without Pain …

University of Georgia Tech

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MEMS Facilities in India

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• SCL, Chandigarh
• CenSe, IISc Bangalore
• CEN,IIT Bombay
• BEL, Bangalore
• SITAR, Bangalore
• IIT Madras

Seena V, IIST

MEMS Scaling Advantages?

 MEMS offer the same scaling advantages that IC technology offers (e.g., speed,
low power, complexity, cost)
 For domains beyond electronics:-

𝑬
𝒉
𝒇 = 𝟏. 𝟎𝟑 𝝆 𝑳𝟐
𝑬
𝝆
: Acoustic Velocity
𝑳 = 𝟒𝟎 𝝁𝒎, 𝒉 = 𝟐𝝁𝒎, 𝑬 = 𝟏𝟓𝟎 𝑮𝑷𝒂 𝒇 = 𝟏𝟎. 𝟒 𝑴𝑯𝒛
𝑳 = 𝟒 𝝁𝒎; 𝒇 = 𝟏. 𝟎𝟒 𝑮𝑯𝒛

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MEMS Scaling Advantages?

Concept of Surface to Volume Ratio

Surface area of a sphere Volume of a sphere

Surface to volume ratio of a sphere

http://www.ett.bme.hu/memsedu/cd/menu.html

MEMS Scaling Advantages?

Concept of Surface to Volume Ratio

Length 1/r (meters-1)

• 1 meter 1
• 1 mm 1,000
• 1 um 1,000,000
• 1 nm 1,000,000,000

http://www.ett.bme.hu/memsedu/cd/menu.html

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MEMS (Microsystems)

MEMS as a ‘Microsensor’
Power
Supply

Input Microsensing Transduction Output

Signal element Unit Signal

Pressure
Temperature
Flow rate Electrical (V, I, f etc.)
Radiation Optical
Chemicals ?
Pathogens
?

MEMS: Principles
40

A transducer converts a signal from one signal domain into another using a
“transducer effect”

The transducer can be either a single-step or multi-step

– Single-Step Transducer:
e.g. Photodiode converting a photon flux in a photocurrent
– Multi-Step Transducer:
e.g. Acceleration sensor converts an acceleration first into the deflection of a
microstructure and then in an electric signal

Seena V, IIST

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MEMS (Microsystems)

MEMS as a Microsensor

MEMS Pressure Sensor

Transduction : Piezoresistive

MEMS (Microsystems)

MEMS as a Microsensor

MEMS Pressure Sensor

Transduction : Piezoresistive 1.2 bar MEMS pressure sensors packaged
K.N Bhat et.al, CenSe IISC

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MEMS (Microsystems)

MEMS as a Microsensor

MEMS (Microsystems)

MEMS as a Microsensor

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MEMS (Microsystems)

MEMS as a Microsensor

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