Doc No.

TA4-EA-06197
Revision. 4
Product Standards

NN30332A
http://www.semicon.panasonic.co.jp/en/
10 A Synchronous DC-DC Step down Regulator
with low quiescent power mode
(VIN = 4.5 V to 24 V, VOUT = 0.75 V to 3.6 V)
FEATURES DESCRIPTION
 High-Speed Response DC-DC Step Down Regulator NN30332A is a synchronous DC-DC Step down
Circuit that employs Hysteretic Control System Regulator (1-ch) comprising of a Controller IC and two
power MOSFETs and employs the hysteretic control
 Hi-side 20 m (Typ), Low-side 6 m (Typ) MOSFETs
system.
for High efficiency at 10 A
By this system, when load current changes suddenly,
 Low Power Mode (discontinuous) for Light Load Efficiency it responds at high speed and minimizes the changes
 Maximum Output Current : 10 A of output voltage.
 Input Voltage Range : AVIN = 4.5 V to 24 V, Since it is possible to use capacitors with small
PVIN = 4.5 V to 24 V, capacitance and it is unnecessary to add external
parts for system phase compensation, this IC realizes
V5 = 4.5 V to 5.5 V
downsizing of set and reducing in the number of
 Output Voltage Range : 0.75 V to 3.6 V external parts. Output voltage is adjustable by user.
 Selectable Switching Frequency 430 kHz / 630 kHz Maximum current is 10 A.
 Built-in Feed Back Resistors for 1.2 V / 1.05 V Output
Voltage (Also configurable using External Resistors) APPLICATIONS
 Adjustable Soft Start High Current Distributed Power Systems such as
 Selectable Low Operating and Standby Quiescent ・PCs
Current to achieve light load efficiency ・HDDs (Hard Disk Drives)
 Open Drain Power Good Indication for Output Over / ・SSDs (Solid State Drives)
Under Voltage ・Game consoles
 Built-in Under Voltage Lockout (UVLO), ・Servers
Thermal Shut Down (TSD), Under Voltage Detection (UVD), ・Security Cameras
Over Voltage Detection (OVD), Short Circuit Protection (SCP) ・Network TVs
Over Current Protection (OCP), ・Home Appliances
 24 pin Plastic Quad Flat Non-leaded Package Heat ・OA Equipment etc.
Slug Down (QFN Type)
(Size : 4 mm  4 mm  0.7 mm, 0.5 mm pitch)
SIMPLIFIED APPLICATION
V5

PVIN
EN
PVIN 100 k
0.1 µF
22 µF

PGOOD
VOUT
AVIN BST

AVIN NN30332A 0.1 µF

0.1 µF
1 µF

1 µH VOUT = 1.05 V
LX
27 k
VFB 22 µF  4
V5 SS AGND PGND V5
36 k

3.3 nF
0.1 µF

10 µF

Note : The application circuit is an example. The operation of

the mass production set is not guaranteed. Sufficient
evaluation and verification is required in the design of Condition :
the mass production set. The Customer is fully VIN = 12 V, VOUT Setting = 1.05 V,
responsible for the incorporation of the above Switching Frequency = 430 kHz, Low Power Mode / Normal Mode,
illustrated application circuit in the design of the LO = 1 µH, CO = 88 µF (22 µF x 4) #Including V5 current
equipment.

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Product Standards

NN30332A

ORDERING INFORMATION
Order Number Feature Package Output Supply
NN30332A-VB1 Maximum Output Current : 10 A 24 pin HQFN Emboss Taping

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Rating Unit Notes
Supply voltage 1 VIN 30 V *1
Supply voltage 2 V5 6 V *1
Operating free-air temperature Topr – 40 to + 85 C *2
Operating junction temperature Tj – 40 to + 150 C *2
Storage temperature Tstg – 55 to + 150 C *2
*1
VLP, VFSEL, VOUT, VFB – 0.3 to (V5 + 0.3) V
Input Voltage Range *3
VEN – 0.3 to 6.0 V *1
*1
VPGOOD – 0.3 to (V5 + 0.3) V
*3
Output Voltage Range
*1
VLX – 0.3 to (VIN + 0.3) V
*4
ESD HBM 2 kV —

Notes : This product may sustain permanent damage if subjected to conditions higher than the above stated absolute
maximum rating. This rating is the maximum rating and device operating at this range is not guaranteed as it
is higher than our stated recommended operating range.
When subjected under the absolute maximum rating for a long time, the reliability of the product may be affected.
VIN is voltage for AVIN, PVIN. VIN = AVIN = PVIN.
Do not apply external currents and voltages to any pin not specifically mentioned.
*1 : The values under the condition not exceeding the above absolute maximum ratings and
the power dissipation.
*2 : Except for the power dissipation, operating ambient temperature, and storage temperature,
all ratings are for Ta = 25 C.
*3 :(V5 + 0.3) V must not exceed 6 V.
*4 : (VIN + 0.3) V must not exceed 30 V.

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Product Standards

NN30332A

POWER DISSIPATION RATING

PD PD
Package j-a j-C Notes
(Ta = 25 C) (Ta = 85 C)

24 pin Plastic Quad Flat Non-leaded 50.4 C / W 4.5 C / W 2.480 W 1.290 W *1

Package Heat Slug Down (QFN Type) 33.3 C / W 3.6 C / W 3.754 W 1.858 W *2

Notes : For the actual usage, please follow the power supply voltage, load and ambient temperature conditions to ensure that there is
enough margin and the thermal design does not exceed the allowable value.
*1:Glass Epoxy Substrate (4 Layers) [50  50  0.8 t (mm)]
*2:Glass Epoxy Substrate (4 Layers) [50  50  1.57 t (mm)]

CAUTION
Although this IC has built-in ESD protection circuit, it may still sustain permanent damage if not handled
properly. Therefore, proper ESD precautions are recommended to avoid electrostatic damage to the MOS
gates.

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Min Typ Max Unit Notes
AVIN 4.5 12.0 24.0 V —
Supply voltage range PVIN 4.5 12.0 24.0 V —
V5 4.5 5.0 5.5 V —
VLP – 0.3 — V5 + 0.3 V *1
Input Voltage Range VFSEL – 0.3 — V5 + 0.3 V *1
VEN – 0.3 — 5.0 V —
VPGOOD – 0.3 — V5 + 0.3 V *1
Output Voltage Range
VLX – 0.3 — VIN + 0.3 V *2

Notes : Voltage values, unless otherwise specified, are with respect to GND.
GND is voltage for AGND, PGND. AGND = PGND
VIN is voltage for AVIN, PVIN. VIN = AVIN = PVIN.
Do not apply external currents or voltages to any pin not specifically mentioned.
*1 : (V5 + 0.3) V must not exceed 6 V.
*2 : (VIN + 0.3) V must not exceed 30 V.

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Product Standards

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ELECRTRICAL CHARACTERISTICS
CO = 22 µF  4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C  2 C unless otherwise noted.
Limits
Parameter Symbol Condition Unit Note
Min Typ Max
Current Consumption
VEN = 5 V, IOUT = 0 A
Consumption current at active RFB1 = 27 k
IVDDACTN — 450 900 µA —
(Normal Mode) RFB2 = 36 k
VLP = 1 V , VFB = 0.62 V
VEN = 5 V, IOUT = 0 A
Consumption current at active RFB1 = 27 k
IVDDACTL — 80 130 µA —
(Low Power Mode) RFB2 = 36 k
VLP = 0 V, VFB = 0.62 V
V5 Consumption current at standby IV5STB V5 = 5 V, VEN = 0 V — 2 4 µA —

AVIN/PVIN Consumption current at AVIN = PVIN = 7.4 V

IVINSTB — 1 2 µA —
standby VEN = 0 V
Logic Pin Characteristics
EN pin Low-level input voltage VENL — — — 0.3 V —
EN pin High-level input voltage VENH — 1.5 — 5.0 V —
EN pin leakage current ILEAKEN VEN = 5 V — 3 7 µA —
LP pin Low-level input voltage VLPL — — — 0.49 V —
LP pin High-level input voltage VLPH — 0.72 — V5 V —
LP pin leakage current ILEAKLP VLP = 1 V — 2 4 µA —
FSEL pin Low-level input voltage VFSELL — — — 0.3 V —
V5
FSEL pin High-level input voltage VFSELH — — V5 V —
 0.7
FSEL pin leakage current ILEAKFS VFSEL = 5 V — 5 10 µA —

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Product Standards

NN30332A

ELECRTRICAL CHARACTERISTICS (Continued)

CO = 22 µF  4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C  2 C unless otherwise noted.
Limits
Parameter Symbol Condition Unit Note
Min Typ Max
VFB Characteristics
VFB comparator threshold VFBTH — 0.594 0.600 0.606 V —
VFB pin leakage current 1 ILEAKFB1 VFB = 0 V –1 — 1 µA —
VFB pin leakage current 2 ILEAKFB2 VFB = 6 V –1 — 1 µA —
Under Voltage Lock Out
UVLO shutdown voltage VUVLODE V5 = 5 V to 0 V 4.15 4.20 4.25 V —

UVLO wakeup voltage VUVLORE V5 = 0 V to 5 V 4.35 4.40 4.45 V —

UVLO hysteresis VUVLO — 150 200 250 mV —

PGOOD
PGOOD Threshold 1
VPGUV PGOOD : High to Low 77 85 93 % —
(VFB ratio for UVD detect)
PGOOD Hysteresis 1
VPGUV PGOOD : Low to High 3.5 5.0 6.5 % —
(VFB ratio for UVD release)
PGOOD Threshold 2
VPGOV PGOOD : High to Low 107 115 123 % —
(VFB ratio for OVD detect)
PGOOD Hysteresis 2
VPGOV PGOOD : Low to High 3.5 5.0 6.5 % —
(VFB ratio for OVD release)
PGOOD start up delay time
VPDT — 0.4 1.0 1.6 ms —
(After reached VFB = 0.6 V)
PGOOD ON resistance RPG — — 10 15  —

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Product Standards

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ELECRTRICAL CHARACTERISTICS (Continued)

CO = 22 µF  4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C  2 C unless otherwise noted.
Limits
Parameter Symbol Condition Unit Note
Min Typ Max
DC-DC Characteristics
RFB1 = 27 k
Output voltage 1 Vo1 RFB2 = 36 k 1.035 1.050 1.065 V —
IOUT = 5 A
RFB1 = 30 k
Output voltage 2 Vo2 RFB2 = 30 k 1.182 1.200 1.218 V —
IOUT = 5 A
VFB = float,
Output voltage 3 Vo1 before VEN = 0 V to 1.5 V 1.035 1.050 1.065 V —
IOUT = 5 A
VFB = V5,
Output voltage 4 Vo2 before VEN = 0 V to 1.5 V 1.182 1.200 1.218 V —
IOUT = 5 A
PVIN = 6 V to 24 V
Line regulation 1 VLIN1 — 0.25 0.75 %/V —
IOUT = 150 mA, VLP = 0 V
PVIN = 6 V to 24 V
Line regulation 2 VLIN2 — 0.25 0.75 %/V —
IOUT = 0.5 A
IOUT = 10 mA to 150 mA
Load regulation 1 VLOA1 — 1.5 — % *1
VLP = 0V
Load regulation 2 VLOA2 IOUT = 10 mA to 10 A — 2.0 — % *1
IOUT = 10 mA mV
Output ripple voltage 1 VRL1 — 40 — *1
VLP = 0 V or 1 V [p-p]
mV
Output ripple voltage 2 VRL2 IOUT = 4 A — 15 — *1
[p-p]
IOUT = 100 mA to 4 A
Load transient response 1 VTR1 — 20 — mV *1
t = 0.5 A / µs
IOUT = 4 A to 100 mA
Load transient response 2 VTR2 — 20 — mV *1
t = 0.5 A / µs
High Side Power MOSFET
RONH VGS = 5.0 V — 20 40 m —
ON resistance
Low Side Power MOSFET
RONL VGS = 5.0 V — 6 10 m —
ON resistance

Min Input and output voltage

Vdiff Vdiff = VIN – VOUT — 2.5 — V *1
difference
Note : *1 : Typical design value

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Product Standards

NN30332A

ELECRTRICAL CHARACTERISTICS (Continued)

CO = 22 µF  4, LO = 1 µH, VOUT Setting = 1.05 V, VIN = AVIN = PVIN = 12 V, V5 = 5 V,
Switching Frequency = 430 kHz, VLP = 1 V (Normal Mode),
Ta = 25 C  2 C unless otherwise noted.
Limits
Parameter Symbol Condition Unit Note
Min Typ Max
PROTECTION
DC-DC Over Current
ILMT — — 12 — A *1
Protection Limit
DC-DC Short Circuit
Ishort VFB = 0.6 V to 0.0 V 50 60 70 % —
Protection Threshold
Thermal Shut Down (TSD)
TTSDTH — — 130 — C *1
Threshold
Thermal Shut Down (TSD)
TTSDHYS — — 30 — C *1
Hysteresis
Soft-Start Timing
SS Charge Current ISSCHG VSS = 0.3 V 1 2 4 µA —
SS Discharge Resistance (Shut-down) RSSDIS VEN = 0 V — 5 10 k —
Switching Frequency
DC-DC Switching Frequency 1 DDFSW1 IOUT = 3 A, VFSEL = 0 V — 430 — kHz *1
DC-DC Switching Frequency 2 DDFSW2 IOUT = 3 A, VFSEL = V5 — 630 — kHz *1
Note : *1 : Typical design value

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Product Standards

NN30332A

PIN CONFIGURATION

VOUT

FSEL
VFB

EN
SS

V5
Top View

18 17 16 15 14 13
19 12 AVIN
PGOOD 25
20 AGND 11 AGND
AGND
21 10 LP
BST
22 9
26 27
PVIN 23 PVIN LX 8 PGND
24 7
1 2 3 4 5 6
LX

PIN FUNCTIONS
Pin No. Pin name Type Description
1 Power MOSFET output pin
2 An inductor is connected and switching operation is carried out
3 between VIN and GND.
LX Output Due to high current and large amplitude at this terminal,
4
the parasitic inductance and impedance of the routing path
5 can cause an increase in noise and a degradation in the efficiency.
6 Routing path should be kept as short as possible.
7
8 PGND Ground Ground pin for Power MOSFET
9
Low Power Mode / Normal Mode selection pin
10 LP Input Low Power Mode is set at Low level input, Normal Mode is set at High level
input.
11
AGND Ground Ground pin
20
Power supply voltage sense pin
12 AVIN Input Recommended rise time ( time to reach 90 % of set value ) setting is
greater than or equal to 10 µs and less than or equal to 1 s.
Frequency selection pin
13 FSEL Input
This is set to 430 kHz at Low level input, 630 kHz at High level input
ON / OFF control pin
14 EN Input
DC-DC is stopped at Low level input, and it is started at High level input.
Power
15 V5 5 V input pin (Power supply for internal control circuit)
supply
Note : Detailed pin descriptions are provided in the OPERATION and APPLICATION INFORMATION section.

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NN30332A

PIN FUNCTIONS (Continued)

Pin No. Pin name Type Description
Comparator negative input pin and 1.05 V / 1.2 V output voltage selection pin
VFB terminal voltage is regulated to REF output (internal reference voltage).
16 VFB Input Since VFB is a high impedance terminal, it should not be routed near
other noisy path (LX, BST, etc.) or an inductor
Routing path should be kept as short as possible.
Output voltage sense pin
17 VOUT Input
Switching frequency is controlled by monitoring output voltage.
Soft start capacitor connect pin
The output voltage at a start up is smoothly controlled
18 SS Output
by adjusting Soft Start time.
Please connect capacitor between SS and GND.
Power good open drain pin
19 PGOOD Output A pull up resistor between PGOOD and V5 terminal is necessary.
Output is low during Over or Under Voltage Detection conditions.
High side Power MOSFET gate driver pin
Bootstrap operation is carried out in order to drive the gate voltage of High
21 BST Output
side Power MOSFET. Please connect a capacitor between BST and LX.
Routing path should be kept as short as possible to minimize noise.
22 Power supply pin for Power MOSFET
Power
23 PVIN Recommended rise time ( time to reach 90 % of set value ) setting is
supply
24 greater than or equal to 10 µs and less than or equal to 1 s.

25 AGND Ground Ground pin for heat radiation

Power
26 PVIN Power supply pin for heat radiation
supply
27 LX Output Power MOSFET output pin for heat radiation

Note : Detailed pin descriptions are provided in the OPERATION and APPLICATION INFORMATION section.

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FUNCTIONAL BLOCK DIAGRAM

SS AVIN

18 12
Soft-Start
EN SS 19 PGOOD
14 Ton / Toff timer
0.6 V + 15 %

V5 V5
15 0.6 V – 15 %
VREF
BGR

Internal circuit 21 BST

UVLO OCP

SCP TSD 22,23,24,26 PVIN

17 1.2 V / 1.05 V
VOUT
Divider/Selector

Fault
HGATE
HPD
16
VFB 1,2,3,
Soft-Start 4,5,6,
HGO 27 LX
Aux VREF REF
Timer 0.6 V

Control
ON Logic
13 LGATE
Ton Toff CMP
FSEL LPD
AVIN Timer + Comp Timer + Comp

Coast PGND
LGO
7,8,9
10 Low Power
LP
/ Normal

11,20,25

AGND

Note : This block diagram is for explaining functions. Part of the block diagram may be omitted, or it may be simplified.

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OPERATION

1. Protection

(1) Over Current Protection (OCP) and (2) Over Voltage Detection (OVD)
Short Circuit Protection (SCP)
If the VFB pin voltage exceeds 115 % of the set
1) The Over Current Protection is activated at about 12 A voltage (0.6 V) and lasts more than 10 ns, Over
(Typ). This device uses pulse – by – pulse valley Voltage Detection will be triggered and PGOOD pin will
current protection method. When the low side power be pulled down. Furthermore, in an over voltage
MOSFET is turned on, the voltage across the drain condition, high side power MOSFET is turned off to
and source is monitored which is proportional to the stop PWM operation, and low side power MOSFET is
inductor current. The high side power MOSFET is only turned on and held on until the inductor current starts
allowed to turn on when the current flowing in the low to flow back to the device. If the VFB pin voltage drops
side power MOSFET falls below the OCP level. below 110 % of the set voltage within 2.2 ms after Over
Hence, during the OCP, the output voltage continues Voltage Detection triggers, PGOOD pin will be pulled
to drop at the specified current. OCP is a non – latch up again and PWM operation will resume. Otherwise,
type protection. both high side and low side MOSFET will be latched off
2) The Short Circuit Protection function is implemented and the output will be discharged by internal MOSFET.
when the output voltage decreases and the VFB pin Power reset or EN pin reset is necessary to activate
reaches to 60 % of the set voltage (0.6 V). the device again.
If the VFB voltage stays below 70 % of the set
voltage over 250 µs after SCP triggers, both
high side and low side power MOSFET will be latched
off and the output will be discharged by internal 115 %
110 %
MOSFET. Power reset or EN pin reset is necessary to 0.6 V 0.6 V
VFB
activate the device again. 90 %
85 %
< 2.2 ms
> 2.2 ms
Over Current Protection ( typ : 12 A ) 1 ms
10.5 A to 14 A
PGOOD
Output Voltage [V]

1)
Note: PGOOD pin is pulled up to V5 pin
(Ground short
protection Detection Figure : OVD Operation
2) 60% of Vout )

(3) Output discharging function

Output current [A] When EN is low, the output is discharged by an

Figure : OCP and SCP Operation internal MOSFET that is connected to VOUT pin.
When EN is high, if the controller is turned off by
Under Voltage Lock Out, or the controller is latched off
by Over Voltage Detection or Short Circuit Protection,
the output is discharged by the above said internal
MOSFET.
The ON resistance of the internal MOSFET is 50 .

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OPERATION (Continued)

1. Protection (Continued) 2. Pin Setting

(4) Under Voltage Detection (UVD) (1) Operating LP Setting

During the operation, if the output voltage drops and The IC can operate at two different modes :
VFB pin voltage reaches 85 % of the set Low Power Mode and Normal Mode.
voltage (0.6 V), the MOSFET, the drain of which is In Low Power Mode, the IC is working under low
connected to PGOOD pin, will turn on and pull the current consumption to achieve light load efficiency
voltage of PGOOD to be low. (IOUT < 150 mA). In Normal Mode, the IC is working
If the output voltage continues to drop and VFB pin at high current ability up to 10 A.
voltage reaches 60 % of the set voltage (0.6 V), The Operating Mode can be set by LP pin as follows.
Short Circuit Protection (SCP) will be triggered.
If the output voltage returns to 90 % of the set LP pin Mode
voltage (0.6 V) before triggering Short Circuit Low Low Power Mode
Protection, the MOSFET that is connected to PGOOD High Normal Mode
pin will turn off after 1 ms and PGOOD voltage will
become logic high.

(2) Switching Frequency Setting

0.6 V
VFB
90 % The IC can operate at two different frequency :
85 % 430 kHz and 630 kHz.
60 % The Switching Frequency can be set by FSEL pin
1 ms
as follows.
PGOOD
FSEL pin Frequency [kHz]
Note: PGOOD Pin is pulled up to V5 pin Low 430
High 630
Figure : UVD Operation

(5) Thermal Shut Down (TSD)

When the IC internal temperature becomes more

than about 130C, TSD operates and DC-DC turns off.

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OPERATION (Continued)

3. Output Voltage Setting 4. Soft Start Setting

The Output Voltage can be set by external resistance Soft Start function maintains the smooth control of the
of VFB pin, and its calculation is as follows. output voltage during start up by adjusting soft start
time. When the EN pin becomes High, the current
(2 µA) begin to charge toward the external capacitor
VOUT (CSS) of SS pin, and the voltage of SS pin increases
straightly.
RFB1 Because the voltage of VFB pin is controlled by the
RFB1 VFB (0.6 V) voltage of SS pin during start up, the voltage of VFB
VOUT = (1 + )  0.6
RFB2 increase straightly to the regulation voltage (0.6 V)
RFB2 together with the voltage of SS pin and keep the
regulation voltage after that. On the other hand, the
voltage of SS pin increase to about 2.8 V and keep the
voltage. The calculation of Soft Start Time is as follows.
Below resistors are recommended for following popular
output voltage.
0.6
VOUT [V] RFB1 [] RFB2 [] Soft Start Setting [s] =  CSS
2µ
3.3 54 k 12 k
1.8 36 k 18 k
1.35 30 k 24 k CSS : External capacitor value of SS pin
1.2 30 k 30 k
1.05 27 k 36 k
VFB comparator threshold is adjusted to  1 %, but EN
the actual output voltage accuracy becomes more
than  1 % due to the influence from the circuits other
4.4 V
than VFB comparator. VREG
In the case of VOUT setting = 1.05 V, the actual output
voltage accuracy becomes  1.5 %.
(VIN = 12 V, IOUT = 4 A, Switching Frequency = UVLO
430 kHz) Soft Start Time [s]

SS 0.6 V

VFB

VOUT

Figure : Soft Start Operation

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OPERATION (Continued)

5. Built-in Feed Back Resistors for 1.05 V / 1.2 V

NN30332A has built-in feedback resistors for 1.05 V

and 1.2 V output voltage.
At the timing of EN pin going from Low to High,
depending on the state of VFB pin, the output voltage
can be set as follows :

VFB [V] VOUT [V]

V5 1.2 V
FLOAT 1.05 V
Adjustable between
Resistor divider
0.75 V to 3.6 V

4.4 V
V5

EN

UVLO

V5
FLOAT

VFB 0.6V

1.2V
1.05V
0.75V to 3.6V using External Resistors
VOUT

Figure : Timing chart of output voltage setting

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OPERATION (Continued)

6. Inductor and Output Capacitor Setting

IL Highest efficiency operation is obtained at low

IO frequency with small ripple current. However,
achieving this requires a large inductor. There is a
0 trade off among component size, efficiency and
operating frequency. A reasonable starting point is to
IL / 2 choose a ripple current that is about 40 % of
0 IO (Max). The largest ripple current occurs at the
IC highest Ei. To guarantee that ripple current does not
IL / 2 exceed a specified maximum, the inductance should
be chosen according to:

VO Eo  Ei  Eo 
Lo  @ Ei  Ei_max
EO VRPL
2 Ei  Iox  f
And its maximum current rating is

Ton IL
IL_max  Io_max  @ Ei  Ei_max
T=1/f 2
The selection of CO is primarily determined by the
VO(EO) ESR (RC) required to minimize voltage ripple and load
transients. The output ripple VRPL is approximately
Q1 LO
IL IC IO bounded by:
Ei Co  Rc 2 IL
Q2
CO Vrpl  Vop  Vob  Ei  
2 Lo 8Co  f
RC Co  Rc 2 Eo  Ei  Eo 
 Ei  
2 Lo 8Ei  Lo  Co  f 2

From the above equation, to achieve desired output

Given the desired input and output voltages, ripple, low ESR ceramic capacitors are recommended,
the inductor value and operating frequency determine and its required RMS current rating is:
the ripple current.
Eo  Ei  Eo 
IL
IL  Ic(rms)_max  @ Ei  Ei_max
Ei  Lo  f 2 3

IL
Iox 
2

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES

1. Output Ripple Voltage

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 0 A IOUT = 1 A

VOUT (50mV/div) VOUT (50mV/div)

LX (5V/div) LX (5V/div)

TIME (20ms/div) TIME (2us/div)

IOUT = 3 A IOUT = 10 A

VOUT (50mV/div) VOUT (50mV/div)

LX (5V/div) LX (5V/div)

TIME (2us/div) TIME (2us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

1. Output Ripple Voltage (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 0 A IOUT = 10 mA

VOUT (50mV/div) VOUT (50mV/div)

LX (5V/div) LX (5V/div)

TIME (20ms/div) TIME (200us/div)

IOUT = 50 mA IOUT = 150 mA

VOUT (50mV/div) VOUT (50mV/div)

LX (5V/div) LX (5V/div)

TIME (50us/div) TIME (10us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

1. Output Ripple Voltage (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 0 A IOUT = 1 A

VOUT (20mV/div) VOUT (20mV/div)

LX (5V/div) LX (5V/div)

TIME (20ms/div) TIME (1us/div)

IOUT = 3 A IOUT = 10 A

VOUT (20mV/div) VOUT (20mV/div)

LX (5V/div) LX (5V/div)

TIME (1us/div) TIME (1us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

1. Output Ripple Voltage (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 0 A IOUT = 10 mA

VOUT (20mV/div) VOUT (20mV/div)

LX (5V/div) LX (5V/div)

TIME (20ms/div) TIME (100us/div)

IOUT = 50 mA IOUT = 150 mA

VOUT (20mV/div) VOUT (20mV/div)

LX (5V/div) LX (5V/div)

TIME (20us/div) TIME (5us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

2. Load transient response

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 10 mA to 10 A (0.5A / µs) IOUT = 10 mA to 10 A (0.15A / µs)

50mV 50mV
VOUT (50mV/div) VOUT (50mV/div)

IOUT (5A/div) IOUT (5A/div)

PGOOD (10V/div) PGOOD (10V/div)

TIME (500us/div) TIME (500us/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 10 mA to 150mA (0.5A / µs) IOUT = 10 mA to 150mA (0.15A / µs)

VOUT (50mV/div) VOUT (50mV/div)

IOUT (0.1A/div) IOUT (0.1A/div)

PGOOD (10V/div) PGOOD (10V/div)

TIME (500us/div) TIME (500us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

2. Load transient response (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 10 mA to 10 A (0.5A / µs) IOUT = 10 mA to 10 A (0.15A / µs)

40mV 40mV

VOUT (50mV/div) VOUT (50mV/div)

IOUT (5A/div) IOUT (5A/div)

PGOOD (10V/div) PGOOD (10V/div)

TIME (500us/div) TIME (500us/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
LO = 1 µH, CO = 88 µF (22 µF x 4)

IOUT = 10 mA to 150mA (0.5A / µs) IOUT = 10 mA to 150mA (0.15A / µs)

VOUT (50mV/div) VOUT (50mV/div)

IOUT (0.1A/div) IOUT (0.1A/div)

PGOOD (10V/div) PGOOD (10V/div)

TIME (500µs/div) TIME (500µs/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

3. Efficiency

Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 430 kHz, Normal Mode,

CO = 88 µF (22 µF x 4) #Including V5 current

VOUT = 1.05 V, Lo = 1 µH VOUT = 1.2 V, Lo = 1 µH

VOUT = 1.8 V, Lo = 1 µH VOUT = 3.3 V, Lo = 3.3 µH

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

3. Efficiency (Continued)

Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 430 kHz, Low Power Mode,
CO = 88 µF (22 µF x 4) #Including V5 current

VOUT = 1.05 V, Lo = 1 µH VOUT = 1.2 V, Lo = 1 µH

VOUT = 1.8 V, Lo = 1 µH VOUT = 3.3 V, Lo = 3.3 µH

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

3. Efficiency (Continued)

Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 630 kHz, Normal Mode,

CO = 88 µF (22 µF x 4) #Including V5 current

VOUT = 1.05 V, Lo = 1 µH VOUT = 1.2 V, Lo = 1 µH

VOUT = 1.8 V, Lo = 1 µH VOUT = 3.3 V, Lo = 3.3 µH

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

3. Efficiency (Continued)

Condition : VIN = 7.4 V / 12 V / 19 V, V5 = 5 V, Switching Frequency = 630 kHz, Low Power Mode,
CO = 88 µF (22 µF x 4) #Including V5 current

VOUT = 1.05 V, Lo = 1 µH VOUT = 1.2 V, Lo = 1 µH

VOUT = 1.8 V, Lo = 1 µH VOUT = 3.3 V, Lo = 3.3 µH

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

4. Load Regulation

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Normal Mode, LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Low Power Mode, LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

5. Line Regulation

Condition : V5 = 5 V, VOUT Setting = 1.05 V, Normal Mode, IOUT = 5 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

Condition : V5 = 5 V, VOUT Setting = 1.05 V, Low Power Mode, IOUT = 150 mA, LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

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NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Normal Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz, Low Power Mode,
IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),

Switching Frequency = 430 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),

Switching Frequency = 430 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),

Switching Frequency = 630 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V (Built-in Feed Back Resistors),

Switching Frequency = 630 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),

Switching Frequency = 430 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),

Switching Frequency = 430 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

TIME (10ms/div) TIME (10ms/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

6. Start / Shut Down (Continued)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),

Switching Frequency = 630 kHz, Normal Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.2 V (Built-in Feed Back Resistors),

Switching Frequency = 630 kHz, Low Power Mode, IOUT = 0 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

EN (2V/div) EN (2V/div)

SS (2V/div) SS (2V/div)

VOUT (0.5V/div) VOUT (0.5V/div)

Time (10ms/div) Time (10ms/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

7. Short Circuit Protection

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz,

LO = 1 µH, CO = 88 µF (22 µF x 4)

Normal Mode Low Power Mode

LX (10V/div) LX (10V/div)

SS (2V/div) SS (2V/div)

VOUT (2V/div) VOUT (2V/div)

IOUT (10A/div) IOUT (1A/div)

TIME (1ms/div) TIME (500us/div)

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 630 kHz,

LO = 1 µH, CO = 88 µF (22 µF x 4)

Normal Mode Low Power Mode

LX (10V/div) LX (10V/div)

SS (2V/div) SS (2V/div)

VOUT (2V/div) VOUT (2V/div)

IOUT (10A/div) IOUT (1A/div)

TIME (1ms/div) TIME (500us/div)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

8. Switching Frequency

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, IOUT = 10 mA to 10 A,

LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

Condition : V5 = 5 V, VOUT Setting = 1.05 V, IOUT = 10 A, VIN = 4.5 V to 24 V,

LO = 1 µH, CO = 88 µF (22 µF x 4)

Frequency = 430 kHz Frequency = 630 kHz

LX Average Frequency (MHz) Skip Mode (Freq=430kHz) LX Average Frequency (MHz) Skip Mode (Freq=630kHz)
0.60 0.90

0.50 0.80
LX Average Freqency (MHz)
LX Average Frequency (MHz)

0.40 0.70

0.30 0.60

0.20 0.50

0.10 0.40

0.00 0.30
4 6 8 10 12 14 16 18 20 22 24 4 6 8 10 12 14 16 18 20 22 24
VIN(V) VIN(V)

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Product Standards

NN30332A

TYPICAL CHARACTERISTICS CURVES (Continued)

9. Thermal Performance

Condition : VIN = 12 V, V5 = 5 V, VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Normal Mode,
IOUT = 10 A, LO = 1 µH, CO = 88 µF (22 µF x 4)

Page 36 of 42

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Product Standards

NN30332A

APPLICATIONS INFORMATION

1. Evaluation Board Information

Condition : VOUT Setting = 1.05 V, Switching Frequency = 430 kHz, Low Power Mode
PVIN
C-PVIN5
C-PVIN6

PVIN
R-PG

C-PVIN3
VOUT
PGOOD

C-DCDCOUT3 C-PVIN2
AGND
PVIN

BST

SS C-DCDCOUT4
C-BST

24 23 22 21 20 19
C-SS

LX SS C-BST
18
1

VOUT VOUT
C-PVIN1
17
2

SS
R-FB4 R-FB3 R-FB2 R-FB1

VFB
VOUT L-LX VFB R-FB
16
3

LX
C-V5

V5
15
4

EN
C-V5 R-FB
C-V52
14
5

FSEL C-DCDCOUT1
13
6

C-DCDCOUT2 V5
7 8 9 10 11 12
C-AVIN1 AVIN
AGND

AVIN
LP

C-AVIN2
C-AVIN1
C-AVIN2

DCDCOUT
PGND
L-LX
C-DCDCOUT1
C-DCDCOUT2

Figure : layout

Figure : Application circuit

Figure : Top Layer with silk screen Figure : Bottom Layer with silk screen
(Top View) with Evaluation board (Bottom View) with Evaluation board

Notes) This application circuit and layout is an example. The operation of mass production set is not guaranteed. You should perform
enough evaluation and verification on the design of mass production set. You are fully responsible for the incorporation of the
above application circuit and information in the design of your equipment.

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Product Standards

NN30332A

APPLICATIONS INFORMATION (Continued)

2. Layout Recommendations

Board layout considerations are necessary for stable

operation of the DC-DC regulator. The following
precautions must be used when designing the board
layout. (1)
AVIN PVIN

(a) The Input capacitor CIN must be placed in such a way

that the distance between PVIN and PGND is VOUT
(3)
BST
minimum, in order to suppress the switching noise.
Stray inductance and impedance should be reduced RFB1
LO
as indicated by loop (1) in the figure below. VFB
IOUT
LX
(b) A single point ground connection (2) must be used to
RFB2
connect PGND and AGND to improve operation
V5 SS AGND PGND
stability. CIN CO
(c) Output current line IOUT and the output sense line
VOUT must have small common impedance to
(4)
reduce output load variations. Output sense line
(2)
VOUT must be close to the output condenser CO as
indicated by (3) below.
(d) Power Loss and output ripple voltage can be reduced Figure : Application circuit diagram
by placing the inductor LO and output capacitor CO
such that the stray inductance and the impedance of
loop (4) is minimum. This is realized by :
i) Minimizing distance between inductor L O and LX Note : The application circuit diagram and layout diagram
pin. explained in this section, should be used as reference
ii) Reducing distance between output capacitor C O examples. The operation of the mass production set is
and (2) / (3) not guaranteed. Sufficient evaluation and verification is
(e) Thick lines in the application circuit example required in the design of the mass production set. The
represent lines with large current flow. These lines Customer is fully responsible for the incorporation of
should be designed as thick as possible. the above illustrated application circuit and the
(f) VFB / SS / V5 lines should be placed far away information attached with it, in the design of the
from LX line, BST line and inductor LO to reduce the equipment.
effects of switching noise. These lines should be
designed as short as possible. This is especially true
for the VFB line, which is a high impedance line.
(g) RFB1 / RFB2 should also be placed as far away as
possible from LX line, BST line and inductor L O to
minimize the effects of switching noise. RFB1 / RFB2
should be placed close to the VFB pin.
(h) LX / BST lines are noisy lines. They should be
designed as short as possible.

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Product Standards

NN30332A

APPLICATIONS INFORMATION (Continued)

3. Recommended component

Reference Designator QTY Value Manufacturer Part Number Note

C-AVIN1 1 0.1 µF Murata GRM188R72A104KA35L —

C-AVIN2 1 1 µF Murata GRM21BR71H105KA12L —

C-BST 1 0.1 µF Murata GRM188R72A104KA35L —

C-DCDCOUT1
C-DCDCOUT2
4 22 µF Murata GRM31CR70J226KE19L —
C-DCDCOUT3
C-DCDCOUT4

C-PVIN1 1 0.1 µF Murata GRM188R72A104KA35L —

TAIYO
C-PVIN2, 3 2 10 µF UMK325AB7106MM-T —
YUDEN

C-SS 1 3.3 nF Murata GRM188R72A332KA01L —

C-V5 1 0.1 µF Murata GRM188R72A104KA35L —

C-V52 1 4.7 µF Murata GRM21BR71A475KA73 —

ALPS GREEN
L-LX 1 1 µH GLMC1R003A —
DEVICE

R-FB1 1 0 Panasonic ERJ3GEY0R00V —

R-FB2 1 27 k Panasonic ERJ3EKF2702V —

R-RB3 1 36 k Panasonic ERJ3EKF3602V —

R-FB4 1 0 Panasonic ERJ3GEY0R00V —

R-PG 1 100 k Panasonic ERJ3EKF1003V —

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Product Standards

NN30332A

APPLICATIONS INFORMATION (Continued)

4. Special attention and precaution in using

This IC is intended to be used for general electronic

equipment. Ensure that the IC is used within the
recommended safe operating region illustrated by the
reference graph below. Do take note that thermal
performance may varies with PCB design and PCB
materials. You are encourage to use the graph only as
a reference for your design and discuss further with
our application engineer.
It is to be understood that our company shall not be
held responsible for any damage incurred as a result
of application beyond the recommended safe
operating region.

PKG surface Temp (Ave) = 80 deg

24

22
Vout=1.05V、fsw=430kHz
20 Vout=1.05V、fsw=630kHz
Vout=3.3V、fsw=430kHz
18
Vout=3.3V、fsw=630kHz
16
VIN（V）

14

12

10

6
7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
IOUT（A）

PKG surface Temp (Ave) = 90 deg

24

22
Vout=1.05V、fsw=430kHz
20 Vout=1.05V、fsw=630kHz
Vout=3.3V、fsw=430kHz
18
Vout=3.3V、fsw=630kHz
16
VIN（V）

14

12

10

6
7 7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
IOUT（A）

Page 40 of 42

Established : 2013-07-29
Revised : 2018-01-16
 Doc No. TA4-EA-06197
Revision. 4
Product Standards

NN30332A

PACKAGE INFORMATION

Outline Drawing

Unit : mm

Body Material : Br / Sb Free Epoxy Resin

Lead Material : Cu Alloy

Lead Finish Method : Pd Plating

Page 41 of 42

Established : 2013-07-29
Revised : 2018-01-16
 Doc No. TA4-EA-06197
Revision. 4
Product Standards

NN30332A

IMPORTANT NOTICE
1. When using the IC for new models, verify the safety including the long-term reliability for each product.
2. When the application system is designed by using this IC, please confirm the notes in this book.
Please read the notes to descriptions and the usage notes in the book.
3. This IC is intended to be used for general electronic equipment.
Consult our sales staff in advance for information on the following applications: Special applications in which exceptional
quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body.
Any applications other than the standard applications intended.
(1) Space appliance (such as artificial satellite, and rocket)
(2) Traffic control equipment (such as for automotive, airplane, train, and ship)
(3) Medical equipment for life support
(4) Submarine transponder
(5) Control equipment for power plant
(6) Disaster prevention and security device
(7) Weapon
(8) Others : Applications of which reliability equivalent to (1) to (7) is required
Our company shall not be held responsible for any damage incurred as a result of or in connection with the IC being used for
any special application, unless our company agrees to the use of such special application.
However, for the IC which we designate as products for automotive use, it is possible to be used for automotive.
4. This IC is neither designed nor intended for use in automotive applications or environments unless the IC is designated by our
company to be used in automotive applications.
Our company shall not be held responsible for any damage incurred by customers or any third party as a result of or in
connection with the IC being used in automotive application, unless our company agrees to such application in this book.
5. Please use this IC in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled
substances, including without limitation, the EU RoHS Directive. Our company shall not be held responsible for any damage
incurred as a result of our IC being used by our customers, not complying with the applicable laws and regulations.
6. Pay attention to the direction of the IC. When mounting it in the wrong direction onto the PCB (printed-circuit-board),
it might be damaged.
7. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins.
In addition, refer to the Pin Description for the pin configuration.
8. Perform visual inspection on the PCB before applying power, otherwise damage might happen due to problems such as
solder-bridge between the pins of the IC. Also, perform full technical verification on the assembly quality, because the same
damage possibly can happen due to conductive substances, such as solder ball, that adhere to the IC during transportation.
9. Take notice in the use of this IC that it might be damaged when an abnormal state occurs such as output pin-VCC short
(Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short). Safety measures such as
installation of fuses are recommended because the extent of the above-mentioned damage will depend on the current
capability of the power supply.
10. The protection circuit is for maintaining safety against abnormal operation. Therefore, the protection circuit should not work
during normal operation.
Especially for the thermal protection circuit, if the area of safe operation or the absolute maximum rating is momentarily
exceeded due to output pin to VCC short (Power supply fault), or output pin to GND short (Ground fault), the IC might be
damaged before the thermal protection circuit could operate.
11. Unless specified in the product specifications, make sure that negative voltage or excessive voltage are not applied to the
pins because the IC might be damaged, which could happen due to negative voltage or excessive voltage generated during
the ON and OFF timing when the inductive load of a motor coil or actuator coils of optical pick-up is being driven.
12. Product which has specified ASO (Area of Safe Operation) should be operated in ASO
13. Verify the risks which might be caused by the malfunctions of external components.
14. Connect the metallic plates (fins) on the back side of the IC with their respective potentials (AGND, PVIN, LX). The thermal
resistance and the electrical characteristics are guaranteed only when the metallic plates (fins) are connected with their
respective potentials.

Page 42 of 42

Established : 2013-07-29
Revised : 2018-01-16
 Request for your special attention and precautions
in using the technical information and semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the
laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.

(2) The technical information described in this book is intended only to show the main characteristics and application circuit
examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic
Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon
any such right owned by any other company which may arise as a result of the use of technical information de-scribed in
this book.

(3) The products described in this book are intended to be used for general applications (such as office equipment,
communications equipment, measuring instruments and household appliances), or for specific applications as expressly
stated in this book.
Please consult with our sales staff in advance for information on the following applications, moreover please exchange
documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace,
automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in
which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize
life or harm the human body.
Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held
responsible for any damage incurred as a result of or in connection with your using the products described in this book for
any special application.

(4) The products and product specifications described in this book are subject to change without notice for modification and/or
improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date
Product Standards in advance to make sure that the latest specifications satisfy your requirements.

(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating
conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed
the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down
and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design,
arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages,
for example, by using the products.

(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD,
EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do not
guarantee quality for disassembled products or the product re-mounted after removing from the mounting board.
When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed
time since first opening the packages.

(7) When reselling products described in this book to other companies without our permission and receiving any claim of
request from the resale destination, please understand that customers will bear the burden.

(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our
company.

No.010618