AT2003
AT2003
AT2003
Applications
Car Charger/Adaptor
Ordering and Marking Information
General-Purposed DC/DC Converters with
Constant Current Limit Order Number Package Top Marking
Rechargeable Portable Devices AT2003ZSP8 PSOP-8L AT2003Z
Note: Aplustek products are compatible with the current
IPC/JEDEC J-STD-020 requirement. They are halogen-free,
Pin Configuration RoHS compliant and 100% matte tin (Sn) plating that are
suitable for use in SnPb or Pb-free soldering processes.
VCC LX
GND BST
GND
FB SENN
COMP SENP
VC C =9~40V
LOUT
R SENSE V OUT
C IN C BST
AT2003 C OUT
VCC
Regulator
OCP
OTP POR LX
5V
5V
UVP BST
0.4V
Fault
OVP Logics
Driver
1.45V Duty
Logics
CV loop
FB
1.2V LX
SENP CC loop
GND
SENN
Thermal Characteristics
Package Thermal Resistance (Note3)
PSOP-8L θJA ------------------------------------------------------------------------------------------------------------------------ 50OC/W
PSOP-8L θJC ------------------------------------------------------------------------------------------------------------------------- 5OC/W
Power Dissipation, PD @ TA = 25°C
PSOP-8L ------------------------------------------------------------------------------------------------------------------------ 2.0W
Electrical Characteristics
( VCC = 12V, TA = +25OC unless otherwise specified.)
Parameter Symbol Test C onditions Min Typ Max U nits
Supply Input Section
VC C operati on range VCC,R 9 -- 40 V
VCC,R VC C Ri si ng -- 8.2 -- V
VC C UVLO threshold
VCC,F VC C Falli ng -- 6.3 -- V
VC C operati on current ICC VC C =9V to 40V, C OMP short to FB -- 1 1.5 mA
Oscillation Section
-- 120 -- kHz
PWM Frequency FSW
-15% -- +15 %
Max D uty D MAX -- 90 -- %
PWM loop Section
Feedback reference voltage VREF -- 1.2 -- V
Feedback reference accuracy -1% -- +1% %
C OMP source current FB<1.2V -- 85 -- uA
C OMP si nk current FB>1.2V -- 85 -- uA
C OMP Hi gh voltae FB<1.2V -- 4.3 -- V
C OMP Low voltae FB>1.2V -- 0.8 -- V
Fault protection Section
FB under voltage level VUVP -- 0.4 -- V
FB over voltage level VOVP -- 1.45 -- V
FB short Impedance level VSHORT -- 0.2 -- V
O
TOTP -- 150 -- C
Over Tempperature level
O
THYS -- 40 -- C
Note 1. Exceeding these limits may impaire the life of the device. Exposure to absolute maximum rating conditions
for long periods may affect device reliability.
Note 2. θJA is measured with the component mounted on a high effective thermal conductivity test board in free
air.The exposed pad of the package is soldered directly on the PCB.
1.25 130
Frequency (KHz)
VFB (V)
1.20 120
1.15
110
1.10
10 15 20 25 30 35 40 100
10 15 20 25 30 35 40
LX (10V/Div) LX (10V/Div)
20ms/Div 200ms/Div
LX (10V/Div) LX (10V/Div)
IL (2A/Div) IL (2A/Div)
20ms/Div 20ms/Div
PSOP-8L
1.50 ± 0.10
3.20 ± 0. 10
2.30 ± 0. 10
4.00 ± 0. 10
7.00 ± 0. 10
5.50 ± 0. 10
5.79 - 6.20
3.80 - 4.00
1.90 - 2.55
1
0.40 - 1.27
Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension .
MAX: Maximum dimension specified.
MIN: Minimum dimension specified.
REF: Represents dimension for reference use only. The value is not the device specification.
TYP: Represents as a typical value. The value is not the device specification.
2.All linear dimensions are in Millimeters.