1.

Features
• Low-voltage and Standard-voltage Operation
– 1.8 (VCC = 1.8V to 5.5V)
• Internally Organized 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 1 MHz (5V, 2.5V), 400 kHz (1.8V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 16-byte Page (16K) Write Modes Two-wire
• Partial Page Writes Allowed
• Self-timed Write Cycle (5 ms max) Serial EEPROM
• High-reliability
– Endurance: 1 Million Write Cycles
16K (2048 x 8)
– Data Retention: 100 Years
• 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-MAP (MLP 2x3), 5-lead SOT23,
8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP and 8-ball dBGA2
Packages
• Lead-free/Halogen-free AT24C16B
• Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers

2. Description
The AT24C16B provides 16384 bits of serial electrically erasable and programmable Not Recommeded
read-only memory (EEPROM) organized as 2048 words of 8 bits each. The device is
optimized for use in many industrial and commercial applications where low-power for New Design.
and low-voltage operation are essential. The AT24C16B is available in space-saving Replaced by
8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead
SOT23, 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP, and 8-ball
AT24C16C.
dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the
AT24C16B is available in 1.8V (1.8V to 5.5V) version.
Table 2-1. Pin Configuration
8-lead Ultra Thin
Pin Name Function Mini-MAP (MLP 2x3) 8-ball dBGA2
NC No Connect VCC 8 1 NC VCC 8 1 NC
WP 7 2 NC WP 7 2 NC
SDA Serial Data
SCL 6 3 NC SCL 6 3 NC
SCL Serial Clock Input SDA 5 4 GND SDA 5 4 GND

WP Write Protect Bottom View Bottom View

GND Ground 8-lead TSSOP 8-lead SOIC

NC 1 8 VCC NC 1 8 VCC
VCC Power Supply
NC 2 7 WP NC 2 7 WP
NC 3 6 SCL NC 3 6 SCL
8-lead Ultra Lead Frame
GND 4 5 SDA GND 4 5 SDA
Land Grid Array (ULA)
VCC 8 1 NC 5-lead SOT23 8-lead PDIP
WP 7 2 NC NC 1 8 VCC
SCL 1 5 WP
SCL 6 3 NC NC 2 7 WP
GND 2
SDA 5 4 GND NC 3 6 SCL
Bottom View SDA 3 4 VCC GND 4 5 SDA
5175E–SEEPR–3/09
Absolute Maximum Ratings
Operating Temperature ................................ –55C to +125C *NOTICE: Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent dam-
Storage Temperature.................................... –65C to +150C age to the device. This is a stress rating only and
functional operation of the device at these or any
Voltage on Any Pin other conditions beyond those indicated in the
with Respect to Ground ....................................–1.0V to +7.0V operational sections of this specification is not
implied. Exposure to absolute maximum rating
Maximum Operating Voltage .......................................... 6.25V conditions for extended periods may affect device
reliability.
DC Output Current........................................................ 5.0 mA

Figure 2-1. Block Diagram

VCC
GND
WP
SCL START
STOP
SDA LOGIC SERIAL
EN
CONTROL H.V. PUMP/TIMING
LOGIC
LOAD

DEVICE COMP DATA RECOVERY

ADDRESS
COMPARATOR LOAD INC

X DEC
R/W DATA WORD EEPROM
ADDR/COUNTER

Y DEC SERIAL MUX

DIN DOUT/ACK
LOGIC
DOUT

2 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

3. Pin Description
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM
device and negative edge clock data out of each device.
SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is open-
drain driven and may be wire-ORed with any number of other open-drain or open-collector
devices.
DEVICE/PAGE ADDRESSES: The AT24C16B does not use the device address pins, which lim-
its the number of devices on a single bus to one.
WRITE PROTECT (WP): The AT24C16B has a write protect pin that provides hardware data
protection. The write protect pin allows normal read/write operations when connected to ground
(GND). When the write protect pin is connected to VCC, the write protection feature is enabled
and operates as shown in Table 3-1.

Table 3-1. Write Protect

Part of the Array Protected

WP Pin
Status 24C16B

At VCC Full (16K) Array

At GND Normal Read/Write Operations

4. Memory Organization
AT24C16B, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes each, the
16K requires an 11-bit data word address for random word addressing.

3
5175E–SEEPR–3/09
Table 4-1. Pin Capacitance(1)
Applicable over recommended operating range from TA = 25C, f = 1.0 MHz, VCC = +1.8V
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (SCL) 6 pF VIN = 0V
Note: 1. This parameter is characterized and is not 100% tested.

Table 4-2. DC Characteristics

Applicable over recommended operating range from: TAI = 40C to +85C, VCC = +1.8V to +5.5V (unless otherwise noted)
Symbol Parameter Test Condition Min Typ Max Units
VCC1 Supply Voltage 1.8 5.5 V
ICC1 Supply Current VCC = 5.0V READ at 400 kHz 1.0 2.0 mA
ICC2 Supply Current VCC = 5.0V WRITE at 400 kHz 2.0 3.0 mA

Standby Current VCC = 1.8V 1.0 µA

ISB1 VIN = VCC or VSS
(1.8V option) VCC = 5.5V 6.0
Input Leakage
ILI VIN = VCC or VSS 0.10 3.0 µA
Current VCC = 5.0V
Output Leakage
ILO VOUT = VCC or VSS 0.05 3.0 µA
Current VCC = 5.0V
VIL Input Low Level(1) 0.6 VCC x 0.3 V
(1)
VIH Input High Level VCC x 0.7 VCC + 0.5 V
VOL1 Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V
VOL2 Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V
Notes: 1. VIL min and VIH max are reference only and are not tested.

4 AT24C16B
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 AT24C16B

Table 4-3. AC Characteristics (Industrial Temperature)

Applicable over recommended operating range from TAI = 40C to +85C, VCC = +1.8V to +5.5V, CL = 100 pF (unless oth-
erwise noted). Test conditions are listed in Note 2.
1.8-volt 2.5, 5.0-volt
Symbol Parameter Min Max Min Max Units
fSCL Clock Frequency, SCL 400 1000 kHz
tLOW Clock Pulse Width Low 1.3 0.4 µs
tHIGH Clock Pulse Width High 0.6 0.4 µs
tAA Clock Low to Data Out Valid 0.05 0.9 0.05 0.55 µs
Time the bus must be free before a new transmission
tBUF 1.3 0.5 µs
can start(1)
tHD.STA Start Hold Time 0.6 0.25 µs
tSU.STA Start Set-up Time 0.6 0.25 µs
tHD.DAT Data In Hold Time 0 0 µs
tSU.DAT Data In Set-up Time 100 100 ns
(1)
tR Inputs Rise Time 0.3 0.3 µs
tF Inputs Fall Time(1) 300 100 ns
tSU.STO Stop Set-up Time 0.6 0.25 µs
tDH Data Out Hold Time 50 50 ns
tWR Write Cycle Time 5 5 ms
Write
Endurance(1) 25°C, Page Mode, 3.3V 1,000,000
Cycles
Notes: 1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3 k (2.5V, 5.0V), 10 k (1.8V)
Input pulse voltages: 0.3 VCC to 0.7 VCC
Input rise and fall times:  50 ns
Input and output timing reference voltages: 0.5 VCC

5
5175E–SEEPR–3/09
5. Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device.
Data on the SDA pin may change only during SCL low time periods (see Figure 7-2 on page 8).
Data changes during SCL high periods will indicate a start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which
must precede any other command (see Figure 7-3 on page 8).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a
read sequence, the stop command will place the EEPROM in a standby power mode (see Fig-
ure 7-3 on page 8).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the
EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each
word. This happens during the ninth clock cycle.
STANDBY MODE: The AT24C16B features a low-power standby mode which is enabled: (a)
upon power-up and (b) after the receipt of the STOP bit and the completion of any internal
operations.
2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any
2-wire part can be protocol reset by following these steps:
1. Create a start bit condition.
2. Clock 9 cycles.
3. Create another start bit followed by stop bit condition as shown below.

Start bit Dummy Clock Cycles Start bit Stop bit

SCL 1 2 3 8 9

SDA

6 AT24C16B
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 AT24C16B

6. Bus Timing
Figure 6-1. SCL: Serial Clock, SDA: Serial Data I/O®
tHIGH
tF tR

tLOW tLOW
SCL

tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO

SDA IN

tAA tDH tBUF

SDA OUT

7. Write Cycle Timing

Figure 7-1. SCL: Serial Clock, SDA: Serial Data I/O

SCL

SDA 8th BIT ACK

WORDn
(1)
twr

STOP START
CONDITION CONDITION

Note: 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle.

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Figure 7-2. Data Validity

SDA

SCL

DATA STABLE DATA STABLE

DATA
CHANGE

Figure 7-3. Start and Stop Definition

SDA

SCL

START STOP

Figure 7-4. Output Acknowledge

SCL 1 8 9

DATA IN

DATA OUT

START ACKNOWLEDGE

8 AT24C16B
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 AT24C16B

8. Device Addressing
The 16K EEPROM device requires an 8-bit device address word following a start condition to
enable the chip for a read or write operation (refer to Figure 10-1).
The device address word consists of a mandatory one, zero sequence for the first four most sig-
nificant bits as shown. This is common to all the EEPROM devices.
The next 3 bits used for memory page addressing and are the most significant bits of the data
word address which follows.
The eighth bit of the device address is the read/write operation select bit. A read operation is ini-
tiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a zero. If a compare is not
made, the chip will return to a standby state.

9. Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device
address word and acknowledgment. Upon receipt of this address, the EEPROM will again
respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data
word, the EEPROM will output a zero and the addressing device, such as a microcontroller,
must terminate the write sequence with a stop condition. At this time the EEPROM enters an
internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this
write cycle and the EEPROM will not respond until the write is complete (see Figure 10-2 on
page 11).
PAGE WRITE: The 16K EEPROM is capable of an 16-byte page write.
A page write is initiated the same as a byte write, but the microcontroller does not send a stop
condition after the first data word is clocked in. Instead, after the EEPROM acknowledges
receipt of the first data word, the microcontroller can transmit up to fifteen data words. The
EEPROM will respond with a zero after each data word received. The microcontroller must ter-
minate the page write sequence with a stop condition (see Figure 10-3 on page 11).
The data word address lower three bits are internally incremented following the receipt of each
data word. The higher data word address bits are not incremented, retaining the memory page
row location. When the word address, internally generated, reaches the page boundary, the fol-
lowing byte is placed at the beginning of the same page. If more than sixteen data words are
transmitted to the EEPROM, the data word address will “roll over” and previous data will be
overwritten.

ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the
EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a
start condition followed by the device address word. The read/write bit is representative of the
operation desired. Only if the internal write cycle has completed will the EEPROM respond with
a zero allowing the read or write sequence to continue.

9
5175E–SEEPR–3/09
10. Read Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to one. There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last
address accessed during the last read or write operation, incremented by one. This address
stays valid between operations as long as the chip power is maintained. The address “roll over”
during read is from the last byte of the last memory page to the first byte of the first page. The
address “roll over” during write is from the last byte of the current page to the first byte of the
same page.
Once the device address with the read/write select bit set to one is clocked in and acknowledged
by the EEPROM, the current address data word is serially clocked out. The microcontroller does
not respond with an input zero but does generate a following stop condition (see Figure 10-4 on
page 11).
RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data
word address. Once the device address word and data word address are clocked in and
acknowledged by the EEPROM, the microcontroller must generate another start condition. The
microcontroller now initiates a current address read by sending a device address with the
read/write select bit high. The EEPROM acknowledges the device address and serially clocks
out the data word. The microcontroller does not respond with a zero but does generate a follow-
ing stop condition (see Figure 10-5 on page 12).
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a ran-
dom address read. After the microcontroller receives a data word, it responds with an
acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment
the data word address and serially clock out sequential data words. When the memory address
limit is reached, the data word address will “roll over” and the sequential read will continue. The
sequential read operation is terminated when the microcontroller does not respond with a zero
but does generate a following stop condition (see Figure 10-6 on page 12).

Figure 10-1. Device Address

16 P2 P1 P0
MSB

10 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

Figure 10-2. Byte Write

Figure 10-3. Page Write

Figure 10-4. Current Address Read

11
5175E–SEEPR–3/09
Figure 10-5. Random Read

Figure 10-6. Sequential Read

12 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

AT24C16B Ordering Information

Ordering Codes Voltage Package Operating Range
AT24C16B-PU (Bulk Form Only) 1.8 8P3
AT24C16BN-SH-B(1) (NiPdAu Lead Finish) 1.8 8S1
AT24C16BN-SH-T(2) (NiPdAu Lead Finish) 1.8 8S1
AT24C16B-TH-B(1) (NiPdAu Lead Finish) 1.8 8A2 Lead-Free/Halogen-Free
AT24C16B-TH-T(2) (NiPdAu Lead Finish) 1.8 8A2 Industrial Temperature
AT24C16BY6-YH-T(2) (NiPdAu Lead Finish) 1.8 8Y6 (-40C to 85C)
(2)
AT24C16BD3-DH-T (NiPdAu Lead Finish) 1.8 8D3
(2)
AT24C16BTSU-T 1.8 5TS1
AT24C16BU3-UU-T(2) 1.8 8U3-1
Industrial Temperature
AT24C16B-W-11(3) 1.8 Die Sales
(-40C to 85C)
Notes: 1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT23, dBGA2 = 5K per reel.
3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request.
Please contact Serial Interface Marketing.

Package Type
8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8Y6 8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8U3-1 8-ball, die Ball Grid Array Package (dBGA2)
8D3 8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA)
Options
–1.8 Low-voltage (1.8V to 5.5V)

13
5175E–SEEPR–3/09
11. Part Marking

11.1 8-PDIP

Seal Year
TOP MARK | Seal Week
| | |
|---|---|---|---|---|---|---|---|
A T M L U Y W W
|---|---|---|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|---|---|---|
* Lot Number
|---|---|---|---|---|---|---|---|
|
Pin 1 Indicator (Dot)

Y = SEAL YEAR WW = SEAL WEEK

6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52

Lot Number to Use ALL Characters in Marking

BOTTOM MARK

No Bottom Mark

14 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

11.2 8-SOIC

Seal Year
TOP MARK | Seal Week
| | |
|---|---|---|---|---|---|---|---|
A T M L H Y W W
|---|---|---|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|---|---|---|
* Lot Number
|---|---|---|---|---|---|---|---|
|
Pin 1 Indicator (Dot)

Y = SEAL YEAR WW = SEAL WEEK

6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52

Lot Number to Use ALL Characters in Marking

BOTTOM MARK

No Bottom Mark

15
5175E–SEEPR–3/09
11.3 8-TSSOP

TOP MARK

Pin 1 Indicator (Dot)

|
|---|---|---|---|
* H Y W W
|---|---|---|---|---|
1 6 B 1
|---|---|---|---|---|

BOTTOM MARK

|---|---|---|---|---|---|---|
P H
|---|---|---|---|---|---|---|
A A A A A A A
|---|---|---|---|---|---|---|
<- Pin 1 Indicator

Y = SEAL YEAR WW = SEAL WEEK

6: 2006 0: 2010 02 = Week 2
7: 2007 1: 2011 04 = Week 4
8: 2008 2: 2012 :: : :::: :
9: 2009 3: 2013 :: : :::: ::
50 = Week 50
52 = Week 52

16 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

11.4 8-Ultra Thin Mini-Map

TOP MARK
|---|---|---|
1 6 B
|---|---|---|
H 1
|---|---|---|
Y X X
|---|---|---|
*
|
Pin 1 Indicator (Dot)

Y = YEAR OF ASSEMBLY

XX = ATMEL LOT NUMBER TO COORESPOND WITH

NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)

Y = SEAL YEAR
6: 2006 0: 2010
7: 2007 1: 2011
8: 2008 2: 2012
9: 2009 3: 2013

11.5 8-ULA

TOP MARK
|---|---|---|
1 6 B
|---|---|---|
Y X X
|---|---|---|
*
|
Pin 1 Indicator (Dot)

Y = BUILD YEAR
2006 = 6 2008 = 8
2007 = 7 Etc. . .

XX = ATMEL LOT NUMBER TO COORESPOND WITH

NSEB TRACE CODE LOG BOOK.
(e.g. XX = AA, AB, AC,...AX, AY, AZ)

17
5175E–SEEPR–3/09
11.6 dBGA2
TOP MARK
LINE 1-------> 16BU
LINE 2-------> PYMTC
|<-- Pin 1 This Corner
P = COUNTRY OF ORIGIN
Y = ONE DIGIT YEAR CODE
4: 2004 7: 2007
5: 2005 8: 2008
6: 2006 9: 2009
M = SEAL MONTH (USE ALPHA DESIGNATOR A-L)
A = JANUARY
B = FEBRUARY
" " """""""
J = OCTOBER
K = NOVEMBER
L = DECEMBER
TC = TRACE CODE (ATMEL LOT
NUMBERS TO CORRESPOND
WITH ATK TRACE CODE LOG BOOK)

11.7 SOT23
TOP MARK
|---|---|---|---|---|
Line 1 -----------> 1 6 B 1 U
|---|---|---|---|---|
*
|
XXX = Device
V = Voltage Indicator
U = Material Set
Pin 1 Indicator (Dot)
BOTTOM MARK
|---|---|---|---|
Y M T C
|---|---|---|---|
Y = One Digit Year Code
M = Seal Month
(Use Alpha Designator A-L)
TC = Trace Code

18 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

12. Packaging Information

12.1 8P3 – PDIP

1
E

E1

Top View c
eA

End View

COMMON DIMENSIONS
D (Unit of Measure = inches)
e
D1 SYMBOL MIN NOM MAX NOTE
A2 A
A – – 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
b2 L D1 0.005 – – 3
b3 E 0.300 0.310 0.325 4
4 PLCS b E1 0.240 0.250 0.280 3
e 0.100 BSC
Side View
eA 0.300 BSC 4
L 0.115 0.130 0.150 2

Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
01/09/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8P3, 8-lead, 0.300" Wide Body, Plastic Dual
8P3 B
R San Jose, CA 95131 In-line Package (PDIP)

19
5175E–SEEPR–3/09
12.2 8S1 – JEDEC SOIC

E E1

N L

∅
Top View
End View
e B
COMMON DIMENSIONS
A
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A1 A 1.35 – 1.75
A1 0.10 – 0.25
b 0.31 – 0.51
C 0.17 – 0.25
D 4.80 – 5.00
D
E1 3.81 – 3.99
E 5.79 – 6.20
Side View e 1.27 BSC
L 0.40 – 1.27
∅ 0˚ – 8˚

Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.

10/7/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Colorado Springs, CO 80906 8S1 B
R
Small Outline (JEDEC SOIC)

20 AT24C16B
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 AT24C16B

12.3 8A2 – TSSOP

3 2 1

Pin 1 indicator
this corner

E1 E

L1

N
L
Top View End View
COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A D 2.90 3.00 3.10 2, 5

b E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A – – 1.20

e A2 A2 0.80 1.00 1.05

b 0.19 – 0.30 4
D
e 0.65 BSC
Side View L 0.45 0.60 0.75
L1 1.00 REF

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and ad acent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02
TITLE DRAWING NO. REV.
2325 Orchard Parkway 8A2, 8-lead, 4.4 mm Body, Plastic
8A2 B
R San Jose, CA 95131 Thin Shrink Small Outline Package (TSSOP)

21
5175E–SEEPR–3/09
12.4 8Y6 - Mini Map

A D2 b
(8X)

Pin 1
Index
Area

E2
E

Pin 1 ID

L (8X)

D
e (6X)
A2 A1
1.50 REF.
A3 COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

D 2.00 BSC
E 3.00 BSC
D2 1.40 1.50 1.60
E2 - - 1.40
A - - 0.60
A1 0.0 0.02 0.05
A2 - - 0.55
A3 0.20 REF
L 0.20 0.30 0.40
e 0.50 BSC
b 0.20 0.25 0.30 2

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
10/16/07
TITLE DRAWING NO. REV.
2325 Orchard Parkway
8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map, 8Y6 D
R San Jose, CA 95131 Dual No Lead Package (DFN) ,(MLP 2x3)

22 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

12.5 5TS1 – SOT23

e1

5 4 C

E1 E C
L

L1

1 2 3
Top View End View

A2 A

Seating
Plane A1
e

D
Side View COMMON DIMENSIONS
(Unit of Measure = mm)

NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing SYMBOL MIN NOM MAX NOTE
MO-193, Variation AB, for additional information. A – – 1.10
2. Dimension D does not include mold flash, protrusions, or gate burrs.
Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. A1 0.00 – 0.10
Dimension E1 does not include interlead flash or protrusion. Interlead A2 0.70 0.90 1.00
flash or protrusion shall not exceed 0.15 mm per side.
3. The package top may be smaller than the package bottom. Dimensions c 0.08 – 0.20 4
D and E1 are determined at the outermost extremes of the plastic body D 2.90 BSC 2, 3
exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of the plastic body. E 2.80 BSC 2, 3
4. These dimensions apply to the flat section of the lead between 0.08 mm E1 1.60 BSC 2, 3
and 0.15 mm from the lead tip.
5. Dimension "b" does not include Dambar protrusion. Allowable Dambar L1 0.60 REF
protrusion shall be 0.08 mm total in excess of the "b" dimension at e 0.95 BSC
maximum material condition. The Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and an adjacent lead e1 1.90 BSC
shall not be less than 0.07 mm. b 0.30 – 0.50 4, 5

6/25/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink
R Colorado Springs, CO 80906 Small Outline Package (SHRINK SOT) PO5TS1 A

23
5175E–SEEPR–3/09
12.6 8U3-1 – dBGA2

D
1. b

A1
PIN 1 BALL PAD CORNER
A2
Top View
A

PIN 1 BALL PAD CORNER Side View

1 2 3 4
(d1)

8 7 6 5
e
COMMON DIMENSIONS
(Unit of Measure = mm)
(e1)
SYMBOL MIN NOM MAX NOTE
Bottom View A 0.71 0.81 0.91
8 SOLDER BALLS
A1 0.10 0.15 0.20
A2 0.40 0.45 0.50
b 0.20 0.25 0.30
D 1.50 BSC
1. Dimension “b” is measured at the maximum solder ball diameter.
E 2.00 BSC
This drawing is for general information only. e 0.50 BSC
e1 0.25 REF
d 1.00 BSC
d1 0.25 REF

6/24/03
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
R Colorado Springs, CO 80906 Small Die Ball Grid Array Package (dBGA2) PO8U3-1 A

24 AT24C16B
5175E–SEEPR–3/09
 AT24C16B

12.7 8D3 - ULA

D e1
8 7 6 5 b
L

PIN #1 ID E
0.10
PIN #1 ID
0.15

1 2 3 4 A1
b
e
A

TOP VIEW SIDE VIEW BOTTOM VIEW

COMMON DIMENSIONS
(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A – – 0.40
A1 0.00 – 0.05
D 1.70 1.80 1.90
E 2.10 2.20 2.30
b 0.15 0.20 0.25
e 0.40 TYP
e1 1.20 REF
L 0.25 0.30 0.35

11/15/05
TITLE DRAWING NO. REV.
1150 E. Cheyenne Mtn. Blvd. 8D3, 8-lead (1.80 x 2.20 mm Body) Ultra Leadframe
Colorado Springs, CO 80906 8D3 0
R
Land Grid Array (ULLGA) D3

25
5175E–SEEPR–3/09
 13. Revision History
Lit No. Date Comment
5175E 7/2012 Not recommended for new design. Use AT24C16C.
5175E 3/2009 Changed the Vcc to 5.5V in the test condition for Isb1
5175D 6/2008 Deleted A0, A1, A2 pin-outs
AT24C16B product with date code 742 or later supports 5Vcc operation
5175C 11/2007
Added ULA package information
Removed reference to Waffle Pack
5175B 4/2007 Corrected Note 3 on Page 13
Added lines to Ordering Code table
5175A 3/2007 Initial document release

26 AT24C16B
5175E–SEEPR–3/09
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5175E–SEEPR–3/09