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2sa0794, 2sa0794a

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Power Transistors

2SA0794 (2SA794), 2SA0794A (2SA794A)


Silicon PNP epitaxial planar type

For low-frequency output driver Unit: mm


8.0+0.5
Complementary to 2SC1567, 2SC1567A –0.1 3.2±0.2

φ 3.16±0.1

11.0±0.5
■ Features

3.8±0.3

3.05±0.1
• High collector-emitter voltage (Base open) VCEO
• Optimum for the driver stage of low-frequency and 40 W to 100 W
output amplifier

1.9±0.1
• TO-126B package which requires no insulation plate for installa-

16.0±1.0
tion to the heat sink

■ Absolute Maximum Ratings Ta = 25°C


0.75±0.1
Parameter Symbol Rating Unit 0.5±0.1
0.5±0.1 1.76±0.1
4.6±0.2
Collector-base voltage 2SA0794 VCBO −100 V 2.3±0.2
1: Emitter
(Emitter open) 2SA0794A −120 2: Collector
1 2 3
Collector-emitter voltage 2SA0794 VCEO −100 V 3: Base
TO-126B-A1 Package
(Base open) 2SA0794A −120
Emitter-base voltage (Collector open) VEBO −5 V
Collector current IC − 0.5 A
Peak collector current ICP −1 A
Collector power dissipation PC 1.2 W
Junction temperature Tj 150 °C
Storage temperature Tstg −55 to +150 °C

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-emitter voltage 2SA0794 VCEO IC = −100 µA, IB = 0 −100 V
(Base open) 2SA0794A −120
Emitter-base voltage (Collector open) VEBO IE = −1 µA, IC = 0 −5 V
Forward current transfer ratio hFE1 * VCE = −10 V, IC = −150 mA 90 220 
hFE2 VCE = −5 V, IC = −500 mA 50 100
Collector-emitter saturation voltage VCE(sat) IC = −500 mA, IB = −50 mA − 0.2 − 0.4 V
Base-emitter saturation voltage VBE(sat) IC = −500 mA, IB = −50 mA − 0.85 −1.20 V
Transition frequency fT VCB = −10 V, IE = 50 mA, f = 200 MHz 120 MHz
Collector output capacitance Cob VCB = −10 V, IE = 0, f = 1 MHz 20 30 pF
(Common base, input open circuited)
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank Q R
hFE1 90 to 155 130 to 220

Note) The part numbers in the parenthesis show conventional part number.

Publication date: February 2003 SJD00001BED 1


2SA0794, 2SA0794A

PC  Ta IC  VCE IC  I B
1.6 −1.2 −1.2
TC = 25°C VCE = −10 V
TC = 25°C
−18 mA IB = −20 mA
Collector power dissipation PC (W)

−1.0 −1.0
−16 mA
1.2 −14 mA −12 mA

Collector current IC (A)

Collector current IC (A)


−10 mA
− 0.8 −8 mA − 0.8
−6 mA

0.8 − 0.6 − 0.6


−4 mA

− 0.4 −2 mA − 0.4
0.4
− 0.2 − 0.2

0 0 0
0 40 80 120 160 0 −2 −4 −6 −8 −10 −12 0 −2 −4 −6 −8 −10 −12 −14
Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Base current IB (mA)

IC  VBE VCE(sat)  IC VBE(sat)  IC


− 0.6
IC / IB = 10
Collector-emitter saturation voltage VCE(sat) (V)

VCE = −10 V IC / IB = 10

Base-emitter saturation voltage VBE(sat) (V)


− 0.5
Ta = 125°C −25°C TC = −25°C
−1 −1
Collector current IC (A)

− 0.4 100°C
75°C
25°C
TC = 100°C
− 0.3
25°C
−25°C
− 0.1 − 0.1
− 0.2

− 0.1

0 − 0.01 − 0.01
0 − 0.2 − 0.4 − 0.6 − 0.8 −1.0 − 0.01 − 0.1 −1 − 0.01 − 0.1 −1
Base-emitter voltage VBE (V) Collector current IC (A) Collector current IC (A)

hFE  IC fT  I E Cob  VCB


200 50
C (pF)

VCE = −10 V VCB = −10 V IE = 0


f = 200 MHz f = 1 MHz
TC = 25°C
(Common base, input open circuited) ob

TC = 25°C
Forward current transfer ratio hFE

Transition frequency fT (MHz)

160 40
1 000

120 30
TC = 100°C
Collector output capacitance

25°C

80 20
100 −25°C

40 10

10 0 0
− 0.01 − 0.1 −1 1 10 100 −1 −10 −100
Collector current IC (A) Emitter current IE (mA) Collector-base voltage VCB (V)

2 SJD00001BED
2SA0794, 2SA0794A

ICEO  Ta ICBO  Ta Safe operation area


105 104 −10
VCE = 20 V VCB = −20 V Single pulse
TC = 25°C

104 ICP
103 −1

Collector current IC (A)


ICBO (Ta = 25°C)
ICEO (Ta = 25°C)

IC
103
t = 10 ms

ICBO (Ta)
ICEO (Ta)

t=1s
102 − 0.1

102

10 − 0.01
10

1 1 − 0.001
0 40 80 120 160 200 0 40 80 120 160 −1 −10 −100 −1 000
Ambient temperature Ta (°C) Ambient temperature Ta (°C) Collector-emitter voltage VCE (V)

SJD00001BED 3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteris-
tics and applied circuits examples of the products. It neither warrants non-infringement of intellec-
tual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maxi-
mum rating, the range of operating power supply voltage, and heat radiation characteristics. Other-
wise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2002 JUL
This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

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