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TPS73201, TPS73215, TPS73216

TPS73218, TPS73225, TPS73230


TPS73233, TPS73250
www.ti.com SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

Cap-Free, NMOS, 250mA Low Dropout Regulator


with Reverse Current Protection

FEATURES DESCRIPTION
• Stable with No Output Capacitor or Any Value The TPS732xx family of low-dropout (LDO) voltage
or Type of Capacitor regulators uses a new topology: an NMOS pass
• Input Voltage Range: 1.7V to 5.5V element in a voltage-follower configuration. This top-
ology is stable using output capacitors with low ESR,
• Ultralow Dropout Voltage: 40mV Typ at 250mA
and even allows operation without a capacitor. It also
• Excellent Load Transient Response—with or provides high reverse blockage (low reverse current)
without Optional Output Capacitor and ground pin current that is nearly constant over all
• New NMOS Topology Provides Low Reverse values of output current.
Leakage Current The TPS732xx uses an advanced BiCMOS process
• Low Noise: 30µVRMS Typ (10kHz to 100kHz) to yield high precision while delivering very low
• 0.5% Initial Accuracy dropout voltages and low ground pin current. Current
consumption, when not enabled, is under 1µA and
• 1% Overall Accuracy (Line, Load, and ideal for portable applications. The extremely low
Temperature) output noise (30µVRMS with 0.1µF CNR) is ideal for
• Less Than 1µA Max IQ in Shutdown Mode powering VCOs. These devices are protected by
• Thermal Shutdown and Specified Min/Max thermal shutdown and foldback current limit.
Current Limit Protection DCQ PACKAGE
SOT223
• Available in Multiple Output Voltage Versions (TOP VIEW)
DBV PACKAGE
– Fixed Outputs of 1.2V, 1.5V, 1.6V, 1.8V, 2.5V, SOT23
(TOP VIEW) TAB IS GND
3.0V, 3.3V, and 5.0V
– Adjustable Outputs From 1.20V to 5.5V IN 1 5 OUT
– Custom Outputs Available GND 2 1 2 3 4 5

EN 3 4 NR/FB
APPLICATIONS
• Portable/Battery-Powered Equipment IN GND EN
OUT NR/FB
• Post-Regulation for Switching Supplies
• Noise-Sensitive Circuitry such as VCOs
• Point of Load Regulation for DSPs, FPGAs,
ASICs, and Microprocessors

Optional Optional

VIN IN OUT VOUT


TPS732xx
EN GND NR

Optional

Typical Application Circuit for Fixed-Voltage Versions

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date. Copyright © 2003–2004, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.

ORDERING INFORMATION
SPECIFIED
PACKAGE-LEAD PACKAGE ORDERING
PRODUCT VOUT (1) TEMPERATURE TRANSPORT MEDIA,
(DESIGNATOR) (2) MARKING NUMBER
RANGE QUANTITY
TPS73201DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C PJEQ
Adjustable TPS73201DBVR Tape and Reel, 3000
TPS73201
or 1.2V (3) TPS73201DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73201
TPS73201DCQR Tape and Reel, 2500
TPS73215DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T38
TPS73215DBVR Tape and Reel, 3000
TPS73215 1.5V
TPS73215DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73215
TPS73215DCQR Tape and Reel, 2500
TPS73216DBVT Tape and Reel, 250
TPS73216 1.6V SOT23-5 (DBV) -40°C to +125°C T50
TPS73216DBVR Tape and Reel, 3000
TPS73218DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T37
TPS73218DBVR Tape and Reel, 3000
TPS73218 1.8V
TPS73218DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73218
TPS73218DCQR Tape and Reel, 2500
TPS73225DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T36
TPS73225DBVR Tape and Reel, 3000
TPS73225 2.5V
TPS73225DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73225
TPS73225DCQR Tape and Reel, 2500
TPS73230DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T39
TPS73230DBVR Tape and Reel, 3000
TPS73230 3.0V
TPS73230DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73230
TPS73230DCQR Tape and Reel, 2500
TPS73233DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T40
TPS73233DBVR Tape and Reel, 3000
TPS73233 3.3V
TPS73233DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73233
TPS73233DCQR Tape and Reel, 2500
TPS73250DBVT Tape and Reel, 250
SOT23-5 (DBV) -40°C to +125°C T41
TPS73250DBVR Tape and Reel, 3000
TPS73250 5.0V
TPS73250DCQT Tube, 80
SOT223-5 (DCQ) -40°C to +125°C PS73250
TPS73250DCQR Tape and Reel, 2500

(1) Custom output voltages from 1.3V to 4V in 100mV increments are available on a quick-turn basis for prototyping. Production quantities
are available; minimum order quantities apply. Contact factory for details and availability.
(2) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet.
(3) For fixed 1.2V operation, tie FB to OUT.

2
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

ABSOLUTE MAXIMUM RATINGS


over operating junction temperature range unless otherwise noted (1)
TPS732xx UNIT
VIN range -0.3 to 6.0 V
VEN range -0.3 to 6.0 V
VOUT range -0.3 to 5.5 V
Peak output current Internally limited
Output short-circuit duration Indefinite
Continuous total power dissipation See Dissipation Ratings Table
Junction temperature range, TJ -55 to +150 °C
Storage temperature range -65 to +150 °C
ESD rating, HBM 2 kV
ESD rating, CDM 500 V

(1) Stresses beyond those listedunder absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings
only, andfunctional operation of the device at these or any other conditions beyondthose indicated under the Electrical Characteristics is
not implied. Exposureto absolute maximum rated conditions for extended periods may affect devicereliability.

POWER DISSIPATION RATINGS (1)


DERATING FACTOR TA ≤ 25°C TA = 70°C TA = 85°C
BOARD PACKAGE RΘJC RΘJA
ABOVE TA = 25°C POWER RATING POWER RATING POWER RATING
Low-K (2) DBV 64°C/W 255°C/W 3.9mW/°C 390mW 215mW 155mW
High-K (3) DBV 64°C/W 180°C/W 5.6mW/°C 560mW 310mW 225mW
Low-K (2) DCQ 15°C/W 53°C/W 18.9mW/°C 1.89W 1.04W 0.76W

(1) SeePower Dissipation in theApplications section formore information related to thermal design.
(2) The JEDEC Low-K (1s) boarddesign used to derive this data was a 3 inch x 3 inch, two-layer board with2-ounce copper traces on top of
the board.
(3) The JEDEC High-K (2s2p)board design used to derive this data was a 3 inch x 3 inch, multilayer boardwith 1-ounce internal power and
ground planes and 2-ounce copper traces on thetop and bottom of the board.

3
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = -40°C to +125°C), VIN = VOUT(nom) + 0.5V (1), IOUT = 10mA, VEN = 1.7V, and
COUT = 0.1µF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range (1) 1.7 5.5 V
VFB Internal reference (TPS73201) TJ = 25°C 1.198 1.20 1.210 V
Output voltage range (TPS73201) (2) VFB 5.5-VDO V
Nominal TJ = 25°C -0.5 +0.5
VOUT
Accuracy (1) VOUT + 0.5V ≤ VIN ≤ 5.5V; %
VIN, IOUT, and T -1.0 ±0.5 +1.0
10 mA ≤ IOUT≤ 250mA
∆VOUT%/∆VIN Line regulation (1) VOUT(nom) + 0.5V ≤ VIN ≤ 5.5V 0.01 %/V
1mA ≤ IOUT ≤ 250mA 0.002
∆VOUT%/∆IOUT Load regulation %/mA
10mA ≤ IOUT ≤ 250mA 0.0005
Dropout voltage (3)
VDO IOUT = 250mA 40 150 mV
(VIN = VOUT (nom) - 0.1V)
ZO(DO) Output impedance in dropout 1.7 V ≤ VIN ≤ VOUT + VDO 0.25 Ω
ICL Output current limit VOUT = 0.9 × VOUT(nom) 250 425 600 mA
ISC Short-circuit current VOUT = 0V 300 mA
IREV Reverse leakage current (4) (-IIN) VEN ≤ 0.5V, 0V≤ VIN ≤ VOUT 0.1 10 µA
IOUT = 10mA (IQ) 400 550
IGND Ground pin current µA
IOUT = 250mA 650 950
ISHDN Shutdown current (IGND) VEN ≤ 0.5V, VOUT ≤ VIN ≤ 5.5 0.02 1 µA
IFB FB pin current (TPS73201) .1 .3 µA
Power-supply rejection ratio f = 100Hz, IOUT = 250 mA 58
PSRR dB
(ripple rejection) f = 10kHz, IOUT = 250 mA 37
Output noise voltage COUT = 10µF, No CNR 27 × VOUT
VN µVRMS
BW = 10Hz - 100kHz COUT= 10µF, CNR = 0.01µF 8.5 × VOUT
VOUT = 3V, RL = 30Ω
tSTR Startup time 600 µs
COUT = 1 µF, CNR= 0.01 µF
VEN(HI) Enable high (enabled) 1.7 VIN V
VEN(LO) Enable low (shutdown) 0 0.5 V
IEN(HI) Enable pin current (enabled) VEN = 5.5V 0.02 0.1 µA
Shutdown Temp increasing 160
TSD Thermal shutdown temperature °C
Reset Temp decreasing 140
TJ Operating junction temperature -40 125 °C

(1) Minimum VIN = VOUT +VDO or 1.7V, whichever isgreater.


(2) TPS73201 is tested atVOUT = 2.5V.
(3) VDO is not measured for the TPS73214, TPS73215 orTPS73216 since minimum VIN =1.7V.
(4) Fixed-voltage versions only;refer to Applicationssection for more information.

4
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

FUNCTIONAL BLOCK DIAGRAMS


IN

Charge
Pump

EN
Thermal
Protection
Ref
Servo
27kΩ
Bandgap
Error
Amp
Current
Limit OUT

GND 8kΩ
R1

R1 + R2 = 80kΩ R2

NR

Figure 1. Fixed Voltage Version

IN Table 1. Standard 1%
Resistor Values for
Common Output Voltages
VOUT R1 R2
Charge
Pump 1.2V Short Open
1.5V 23.2kΩ 95.3kΩ
EN
Thermal 1.8V 28.0kΩ 56.2kΩ
Protection
Ref 2.5V 39.2kΩ 36.5kΩ
Servo 2.8V 44.2kΩ 33.2kΩ
27kΩ 3.0V 46.4kΩ 30.9kΩ
Bandgap
Error 3.3V 52.3kΩ 30.1kΩ
Amp 5.0V 78.7kΩ 24.9kΩ
Current OUT
Limit NOTE: VOUT = (R1 + R2)/R2 × 1.204;
GND 80kΩ R1R2 ≅ 19kΩ for best
8kΩ
R1 accuracy.
FB

R2

Figure 2. Adjustable Voltage Version

5
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

PIN ASSIGNMENTS
DBV PACKAGE DCQ PACKAGE
SOT23 SOT223
(TOP VIEW) (TOP VIEW)

5 TAB IS GND
IN 1 OUT

GND 2

EN 3 4 NR/FB 1 2 3 4 5

IN GND EN
OUT NR/FB

TERMINAL FUNCTIONS
TERMINAL
SOT23 SOT223 DESCRIPTION
NAME (DBV) (DCQ)
PIN NO. PIN NO.
IN 1 1 Unregulated input supply
GND 2 3 Ground
EN 3 5 Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. Refer to the Shutdown section under Applications Information for more details.
EN can be connected to IN if not used.
NR 4 4 Fixed voltage versions only—connecting an external capacitor to this pin bypasses noise
generated by the internal bandgap. This allows output noise to be reduced to very low levels.
FB 4 4 Adjustable voltage version only—this is the input to the control loop error amplifier, and is used to
set the output voltage of the device.
OUT 5 2 Output of the Regulator. There are no output capacitor requirements for stability.

6
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.

LOAD REGULATION LINE REGULATION


0.5 0.20
Referred to IOUT = 10mA Referred to VIN = VOUT + 0.5V at IOUT = 10mA
0.4 0.15
0.3 −40C
+25C 0.10
Change in VOUT (%)

Change in VOUT (%)


0.2 +25 C
+125C +125C
0.1 0.05

0 0
−0.1 −0.05
−0.2 −40 C
−0.10
−0.3
−0.4 −0.15

−0.5 −0.20
0 50 100 150 200 250 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
IOUT (mA) VIN − VOUT (V)

Figure 3. Figure 4.

DROPOUT VOLTAGE vsOUTPUT CURRENT DROPOUT VOLTAGE vs TEMPERATURE


100 100
TPS73225DBV TPS73225DBV
80 80
+125 C
60 60
VDO (mV)

VDO (mV)

+25 C
40 50

20 20
−40C

0 0
0 50 100 150 200 250 −50 −25 0 25 50 75 100 125
IOUT (mA) Temperature (C)

Figure 5. Figure 6.

OUTPUT VOLTAGE ACCURACY HISTOGRAM OUTPUT VOLTAGE DRIFT HISTOGRAM


30 18
I OUT = 10mA
IOUT = 10mA 16 All Voltage Versions
25
14
Percent of Units (%)

Percent of Units (%)

20 12

10
15
8

10 6
4
5
2
0 0
−1.0
−0.9
−0.8
−0.7
−0.6
−0.5
−0.4
−0.3
−0.2
−0.1

−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0

0
10
20
30
40
50
60
70
80
90
100

VOUT Error (%) Worst Case dVOUT/dT (ppm/ C)

Figure 7. Figure 8.

7
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS (continued)


For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.

GROUND PIN CURRENT vs OUTPUT CURRENT GROUND PIN CURRENT vs TEMPERATURE


1000 800
900 IOUT = 250mA
700
800
600
700
600 500
I GND (µA)

I GND (µA)
500 400
400 300
300 VIN = 5.5V
VIN = 5.5V 200 VIN = 4V
200
VIN = 4V VIN = 2V
100 100
VIN = 2V
0 0
0 50 100 150 200 250 −50 −25 0 25 50 75 100 125
IOUT (mA) Temperature (C)

Figure 9. Figure 10.

CURRENT LIMIT vs VOUT GROUND PIN CURRENT in SHUTDOWN


(FOLDBACK) vs TEMPERATURE
500 1
450 VENABLE = 0.5V
ICL VIN = VOUT + 0.5V
400
Current Limit (mA)

350
300
IGND (µA)

ISC
250 0.1
200
150
100
50
TPS73233
0 0.01
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 −50 −25 0 25 50 75 100 125
VOUT (V) Temperature (C)

Figure 11. Figure 12.

CURRENT LIMIT vs VIN CURRENT LIMIT vs TEMPERATURE


600 600

550 550

500 500
Current Limit (mA)

Current Limit (mA)

450 450

400 400

350 350

300 300

250 250
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 −50 −25 0 25 50 75 100 125
VIN (V) Temperature ( C)

Figure 13. Figure 14.

8
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS (continued)


For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.

PSRR (RIPPLE REJECTION) vs FREQUENCY PSRR (RIPPLE REJECTION) vs VIN - VOUT


90 40
IOUT = 100mA IOUT = 1mA
80 COUT = Any 35
COUT = 1µF
70 30
IOUT = 1mA
Ripple Rejection (dB)

60 COUT = 10µF
25

PSRR (dB)
IO = 100mA
50 CO = 1µF
IOUT = 1mA 20
40 C OUT = Any
15
30
10
20 I OUT = 100mA Frequency = 100kHz
IOUT = Any COUT = 10µF 5 COUT = 10µF
10
COUT = 0µF CNR = 0.01µF
0 0
10 100 1k 10k 100k 1M 10M 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Frequency (Hz) VIN − VOUT (V)

Figure 15. Figure 16.

NOISE SPECTRAL DENSITY NOISE SPECTRAL DENSITY


CNR = 0µF CNR = 0.01µF
1 1

C OUT = 1µF
eN (µV/√Hz)

eN (µV/√Hz)

COUT = 0µF COUT = 1µF


0.1 0.1
COUT = 10µF

COUT = 0µF
COUT = 10µF

IOUT = 150mA IOUT = 150mA


0.01 0.01
10 100 1k 10k 100k 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)

Figure 17. Figure 18.

RMS NOISE VOLTAGE vs COUT RMS NOISE VOLTAGE vs CNR


60 140
VOUT = 5.0V
50 120
VOUT = 5.0V
100
40
VN (RMS)

VN (RMS)

80 VOUT = 3.3V
30 VOUT = 3.3V
60
20
40 VOUT = 1.5V
VOUT = 1.5V
10 20
CNR = 0.01µF COUT = 0µF
10Hz < Frequency < 100kHz 10Hz < Frequency < 100kHz
0 0
0.1 1 10 1p 10p 100p 1n 10n
COUT (µF) CNR (F)

Figure 19. Figure 20.

9
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS (continued)


For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.

TPS73233 TPS73233
LOAD TRANSIENT RESPONSE LINE TRANSIENT RESPONSE

VIN = 3.8V COUT = 0µF IOUT = 250mA


50mV/tick VOUT
COUT = 0µF
50mV/div VOUT
COUT = 1µF
50mV/tick VOUT

COUT = 10µF C OUT = 100µF


50mV/tick VOUT 50mV/div VOUT

5.5V dVIN
250mA = 0.5V/µs
dt
50mA/tick 4.5V
10mA 1V/div VIN
I OUT
10µs/div 10µs/div

Figure 21. Figure 22.

TPS73233 TPS73233
TURN-ON RESPONSE TURN-OFF RESPONSE
RL = 1kΩ RL = 20Ω
COUT = 0µF VOUT COUT = 10µF
R L = 20Ω R L = 20Ω
1V/div C OUT = 1µF 1V/div C OUT = 1µF
RL = 1kΩ
RL = 20Ω COUT = 0µF
COUT = 10µF
VOUT
2V 2V
VEN

1V/div 1V/div
0V 0V
VEN

100µs/div 100µs/div

Figure 23. Figure 24.

TPS73233
POWER UP / POWER DOWN IENABLE vs TEMPERATURE
6 10

5
VIN
4
VOUT
1
3
IENABLE (nA)
Volts

1
0.1
0

−1

−2 0.01
50ms/div −50 −25 0 25 50 75 100 125
Temperature (°C)

Figure 25. Figure 26.

10
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

TYPICAL CHARACTERISTICS (continued)


For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.

TPS73101 TPS73201
RMS NOISE VOLTAGE vs CADJ IFB vs TEMPERATURE
60 160

55 140

50 120

45 100
VN (rms)

I FB (nA)
40 80

35 60
VOUT = 2.5V
30 40
COUT = 0µF
25 R1 = 39.2kΩ 20
10Hz < Frequency < 100kHz
20 0
10p 100p 1n 10n −50 −25 0 25 50 75 100 125
CFB (F) Temperature (C)

Figure 27. Figure 28.

TPS73201 TPS73201
LOAD TRANSIENT, ADJUSTABLE VERSION LINE TRANSIENT, ADJUSTABLE VERSION

CFB = 10nF VOUT = 2.5V


R1 = 39.2kΩ CFB = 10nF
COUT = 0µF COUT = 0µF
100mV/div VOUT 100mV/div VOUT

C OUT = 10µF COUT = 10µF


100mV/div VOUT 100mV/div VOUT

4.5V

250mA 3.5V
VIN
10mA
IOUT
10µs/div 5µs/div

Figure 29. Figure 30.

11
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

APPLICATION INFORMATION

The TPS732xx belongs to a family of new generation


LDO regulators that use an NMOS pass transistor to INPUT AND OUTPUT CAPACITOR
achieve ultra-low-dropout performance, reverse cur- REQUIREMENTS
rent blockage, and freedom from output capacitor Although an input capacitor is not required for stab-
constraints. These features, combined with low noise ility, it is good analog design practice to connect a
and an enable input, make the TPS732xx ideal for 0.1µF to 1µF low ESR capacitor across the input
portable applications. This regulator family offers a supply near the regulator. This counteracts reactive
wide selection of fixed output voltage versions and an input sources and improves transient response, noise
adjustable output version. All versions have thermal rejection, and ripple rejection. A higher-value capaci-
and over-current protection, including foldback cur- tor may be necessary if large, fast rise-time load
rent limit. transients are anticipated or the device is located
several inches from the power source.
Figure 31 shows the basic circuit connections for the
fixed voltage models. Figure 32 gives the connections The TPS732xx does not require an output capacitor
for the adjustable output version (TPS73201). for stability and has maximum phase margin with no
capacitor. It is designed to be stable for all available
Optional input capacitor. Optional output capacitor. types and values of capacitors. In applications where
May improve source May improve load transient,
impedance, noise, or PSRR. noise, or PSRR.
VIN - VOUT < 0.5V and multiple low ESR capacitors
are in parallel, ringing may occur when the product of
VIN IN OUT VOUT COUT and total ESR drops below 50nΩF. Total ESR
TPS732xx includes all parasitic resistances, including capacitor
EN GND NR ESR and board, socket, and solder joint resistance.
In most applications, the sum of capacitor ESR and
trace resistance will meet this requirement.
Optional bypass
capacitor to reduce OUTPUT NOISE
output noise.
A precision band-gap reference is used to generate
Figure 31. Typical Application Circuit for the internal reference voltage, VREF. This reference is
Fixed-Voltage Versions the dominant noise source within the TPS732xx and
it generates approximately 32µVRMS (10Hz to
100kHz) at the reference output (NR). The regulator
Optional input capacitor. Optional output capacitor. control loop gains up the reference noise with the
May improve source May improve load transient,
impedance, noise, or PSRR. noise, or PSRR.
same gain as the reference voltage, so that the noise
voltage of the regulator is approximately given by:
VIN VOUT
IN OUT (R  R2) V
TPS732xx V N  32VRMS  1  32VRMS  OUT
R1 CFB R2 VREF (1)
EN GND FB
Since the value of VREF is 1.2V, this relationship
R2 reduces to:

VOUT =
(R1 + R2)
R2
× 1.204
Optional capacitor
reduces output noise. V N(VRMS)  27 
V RMS
V

 V OUT(V)
(2)
Figure 32. Typical Application Circuit for for the case of no CNR.
Adjustable-Voltage Versions
An internal 27kΩ resistor in series with the noise
reduction pin (NR) forms a low-pass filter for the
R1 and R2 can be calculated for any output voltage voltage reference when an external noise reduction
using the formula shown in Figure 32. Sample re- capacitor, CNR, is connected from NR to ground. For
sistor values for common output voltages are shown CNR = 10nF, the total noise in the 10Hz to 100kHz
in Figure 2. For best accuracy, make the parallel bandwidth is reduced by a factor of ~3.2, giving the
combination of R1 and R2 approximately 19kΩ. approximate relationship:

V N(VRMS)  8.5 VV   V


RMS
OUT(V)
(3)
for CNR = 10nF.

12
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
www.ti.com
TPS73233, TPS73250
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

This noise reduction effect is shown as RMS Noise DROPOUT VOLTAGE


Voltage vs CNR in the Typical Characteristics section.
The TPS732xx uses an NMOS pass transistor to
The TPS73201 adjustable version does not have the achieve extremely low dropout. When (VIN - VOUT) is
noise-reduction pin available. However, connecting a less than the dropout voltage (VDO), the NMOS pass
feedback capacitor, CFB, from the output to the FB pin device is in its linear region of operation and the
will reduce output noise and improve load transient input-to-output resistance is the RDS-ON of the NMOS
performance. pass element.
The TPS732xx uses an internal charge pump to For large step changes in load current, the TPS732xx
develop an internal supply voltage sufficient to drive requires a larger voltage drop from VIN to VOUT to
the gate of the NMOS pass element above VOUT. The avoid degraded transient response. The boundary of
charge pump generates ~250µV of switching noise at this transient dropout region is approximately twice
~2MHz; however, charge-pump noise contribution is the dc dropout. Values of VIN - VOUT above this line
negligible at the output of the regulator for most insure normal transient response.
values of IOUT and COUT.
Operating in the transient dropout region can cause
an increase in recovery time. The time required to
BOARD LAYOUT RECOMMENDATION TO recover from a load transient is a function of the
IMPROVE PSRR AND NOISE PERFORMANCE magnitude of the change in load current rate, the rate
To improve ac performance such as PSRR, output of change in load current, and the available head-
noise, and transient response, it is recommended that room (VIN to VOUT voltage drop). Under worst-case
the PCB be designed with separate ground planes for conditions [full-scale instantaneous load change with
VIN and VOUT, with each ground plane connected only (VIN - VOUT) close to dc dropout levels], the TPS732xx
at the GND pin of the device. In addition, the ground can take a couple of hundred microseconds to return
connection for the bypass capacitor should connect to the specified regulation accuracy.
directly to the GND pin of the device.
TRANSIENT RESPONSE
INTERNAL CURRENT LIMIT The low open-loop output impedance provided by the
The TPS732xx internal current limit helps protect the NMOS pass element in a voltage follower configur-
regulator during fault conditions. Foldback helps to ation allows operation without an output capacitor for
protect the regulator from damage during output many applications. As with any regulator, the addition
short-circuit conditions by reducing current limit when of a capacitor (nominal value 1µF) from the output pin
VOUT drops below 0.5V. See Figure 11 in the Typical to ground will reduce undershoot magnitude but
Characteristics section for a graph of IOUT vs VOUT. increase duration. In the adjustable version, the
addition of a capacitor, CFB, from the output to the
SHUTDOWN adjust pin will also improve the transient response.
The Enable pin is active high and is compatible with The TPS732xx does not have active pull-down when
standard TTL-CMOS levels. VEN below 0.5V (max) the output is over-voltage. This allows applications
turns the regulator off and drops the ground pin that connect higher voltage sources, such as alter-
current to approximately 10nA. When shutdown capa- nate power supplies, to the output. This also results
bility is not required, the Enable pin can be connected in an output overshoot of several percent if the load
to VIN. When a pull-up resistor is used, and operation current quickly drops to zero when a capacitor is
down to 1.8V is required, use pull-up resistor values connected to the output. The duration of overshoot
below 50 kΩ. can be reduced by adding a load resistor. The
overshoot decays at a rate determined by output
capacitor COUT and the internal/external load resist-
ance. The rate of decay is given by:
(Fixed voltage version)
V OUT
dVdt 
C OUT  80k (4)

13
TPS73201, TPS73215, TPS73216
TPS73218, TPS73225, TPS73230
TPS73233, TPS73250 www.ti.com
SBVS037F – AUGUST 2003 – REVISED SEPTEMBER 2004

(Adjustable voltage version) reliability, thermal protection should trigger at least


VOUT 35°C above the maximum expected ambient con-
dVdt  dition of your application. This produces a worst-case
C OUT  80k  (R 1  R 2) (5) junction temperature of 125°C at the highest ex-
pected ambient temperature and worst-case load.
REVERSE CURRENT
The internal protection circuitry of the TPS732xx has
The NMOS pass element of the TPS732xx provides been designed to protect against overload conditions.
inherent protection against current flow from the It was not intended to replace proper heatsinking.
output of the regulator to the input when the gate of Continuously running the TPS732xx into thermal
the pass device is pulled low. To ensure that all shutdown will degrade device reliability.
charge is removed from the gate of the pass element,
the enable pin must be driven low before the input POWER DISSIPATION
voltage is removed. If this is not done, the pass
element may be left on due to stored charge on the The ability to remove heat from the die is different for
gate. each package type, presenting different consider-
ations in the PCB layout. The PCB area around the
After the enable pin is driven low, no bias voltage is device that is free of other components moves the
needed on any pin for reverse current blocking. Note heat from the device to the ambient air. Performance
that reverse current is specified as the current flowing data for JEDEC low- and high-K boards are shown in
out of the IN pin due to voltage applied on the OUT the Power Dissipation Ratings table. Using heavier
pin. There will be additional current flowing into the copper will increase the effectiveness in removing
OUT pin due to the 80kΩ internal resistor divider to heat from the device. The addition of plated
ground (see Figure 1 and Figure 2). through-holes to heat-dissipating layers will also im-
For the TPS73201, reverse current may flow when prove the heat-sink effectiveness.
VFB is more than 1.0V above VIN. Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
THERMAL PROTECTION of the output current times the voltage drop across
Thermal protection disables the output when the the output pass element (VIN to VOUT):
junction temperature rises to approximately 160°C, P D  (VIN  VOUT)  I OUT (6)
allowing the device to cool. When the junction tem-
perature cools to approximately 140°C, the output Power dissipation can be minimized by using the
circuitry is again enabled. Depending on power dissi- lowest possible input voltage necessary to assure the
pation, thermal resistance, and ambient temperature, required output voltage.
the thermal protection circuit may cycle on and off.
This limits the dissipation of the regulator, protecting Package Mounting
it from damage due to overheating. Solder pad footprint recommendations for the
Any tendency to activate the thermal protection circuit TPS732xx are presented in Application Bulletin
indicates excessive power dissipation or an inad- Solder Pad Recommendations for Surface-Mount De-
equate heatsink. For reliable operation, junction tem- vices (AB-132), available from the Texas Instruments
perature should be limited to 125°C maximum. To web site at www.ti.com.
estimate the margin of safety in a complete design
(including heatsink), increase the ambient tempera-
ture until the thermal protection is triggered; use
worst-case loads and signal conditions. For good

14
PACKAGE OPTION ADDENDUM
www.ti.com 30-Sep-2004

PACKAGING INFORMATION

ORDERABLE DEVICE STATUS(1) PACKAGE TYPE PACKAGE DRAWING PINS PACKAGE QTY
TPS73201DBVR ACTIVE SOP DBV 5 3000
TPS73201DBVT ACTIVE SOP DBV 5 250
TPS73201DCQ ACTIVE SOP DCQ 6 78
TPS73201DCQR ACTIVE SOP DCQ 6 2500
TPS73215DBVR ACTIVE SOP DBV 5 3000
TPS73215DBVT ACTIVE SOP DBV 5 250
TPS73215DCQ ACTIVE SOP DCQ 6 78
TPS73215DCQR ACTIVE SOP DCQ 6 2500
TPS73216DBVR ACTIVE SOP DBV 5 3000
TPS73216DBVT ACTIVE SOP DBV 5 250
TPS73218DBVR ACTIVE SOP DBV 5 3000
TPS73218DBVT ACTIVE SOP DBV 5 250
TPS73218DCQ ACTIVE SOP DCQ 6 78
TPS73218DCQR ACTIVE SOP DCQ 6 2500
TPS73225DBVR ACTIVE SOP DBV 5 3000
TPS73225DBVT ACTIVE SOP DBV 5 250
TPS73225DCQ ACTIVE SOP DCQ 6 78
TPS73225DCQR ACTIVE SOP DCQ 6 2500
TPS73230DBVR ACTIVE SOP DBV 5 3000
TPS73230DBVT ACTIVE SOP DBV 5 250
TPS73230DCQ ACTIVE SOP DCQ 6 78
TPS73230DCQR ACTIVE SOP DCQ 6 2500
TPS73233DBVR ACTIVE SOP DBV 5 3000
TPS73233DBVT ACTIVE SOP DBV 5 250
TPS73233DCQ ACTIVE SOP DCQ 6 78
TPS73233DCQR ACTIVE SOP DCQ 6 2500
TPS73250DBVR ACTIVE SOP DBV 5 3000
TPS73250DBVT ACTIVE SOP DBV 5 250
TPS73250DCQ ACTIVE SOP DCQ 6 78
TPS73250DCQR ACTIVE SOP DCQ 6 2500

(1) The marketing status values are defined as follows:


ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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