Syllabus 6 Sem
Syllabus 6 Sem
Syllabus 6 Sem
Course Code: BTEEC 30601 Credit Units: 04 Course Contents: Module I: Devices and the wire Diode, dynamic and transient behaviour-diffusion capacitance, SPICE diode model Mosfet Static Behaviour: Threshold voltage and its dependence on VSB MOSFET Operation in resistive and saturation region, channel length modulation, Velocity saturation and its impact on sub micron devices, sub threshold conduction, Model for manual analysis, Equivalent resistance for MOSFET in (velocity) saturated region, comparison of equations for PMOS and NMOS, depletion and enhancement device Dynamic Behaviour: Channel capacitance in different regions of operation, junction capacitance, Level 1 SPICE MODELS for MOS transistors The Wire: Interconnect parameters: resistance, capacitance and Inductance, Lumped RC model, Elmore Delay Module II: CMOS Inverter VTC of an ideal inverter, Switching Model of the CMOS inverter: nMOS /pMOS discharge and charge, VTC of CMOS inverter : PMOS AND NMOS operation in various regions including velocity saturation, Switching threshold, (W/L)p/(W/L)n ratio for setting desired VM with and without velocity saturation, Noise Margins, buffer Ratioed logic: Pseudo NMOS inverter and pmos to nmos ratio for performance, tristate inverter, Resistive load inverter Load Capacitance calculations: fan out capacitance, self capacitance calculations: Miller effect, wire capacitance; Improving delay calculation with input slope, Propagation delay: first order analysis, analysis from a design perspective, sizing a chain of inverters for minimum delay, choosing optimum number of stages Power, Energy and Energy Delay: Dynamic power consumption, Static power, Glitches and power dissipation due to direct path currents, power and delay trade off, Transistor sizing for energy minimization Module III: Combinational circuits CMOS Logic: Good 0 and poor 0, Goo1 and poor 1, series and parallel N and P switches, 2 and Higher input NAND and NOR gates, Functions of the type (AB+C(D+E)) and their complements, XOR and XNOR gates, 2 input Multiplexer, Full Adder; Transistor sizing in CMOS logic for optimal delay, Pseudo NMOS NAND NOR and other gates and the transistor sizing, Introduction to DSVCL logic, CPL AND/NAND, OR/NOR, XOR/XNOR gates Logical effort, Electrical Effort, Branching effort, Examples of sizing Combinational logic chains for minimum delay Pass-transistor logic, pass gate configurations for nmos and pmos, 2 input and 4 input MUX, XOR, XNOR and implementation of general functions like AB+AB*C+A*C*, Robust and Efficient PTL Design, Delay of Transmission Gate chain Dynamic CMOS design: Precharge and Evaluation, charge leakage, bootstrapping, charge sharing, Cascading Dynamic Gates, DOMINO Logic, Optimization of Domino Logic Gates, simple example circuit implementations of DOMINO logic Module IV: Sequential Logic circuits Principle of Bistability, NAND and NOR based SR latch, and clocked SR Latch, JK latch, example of master slave flip flop, CMOS D latch, , MUX based Latches, master slave edge triggered register, non ideal clocks, clock overlap, C2MOS register, TSPCR Register, Schmitt Trigger, Pipelining and NORA CMOS Module V: Layout Design Rules Introduction to CMOS Process technology, Layout of CMOS inverter, CMOS NAND and NOR gates, Concept of Euler path, and stick diagrams for functions like (AB+E+CD)
MICROWAVE ENGINEERING
Course Code: BTEEC 30603 Credit Units: 03 Course Objective: This course deals with the microwaves. Microwaves are important when we are going to the high frequency regime. By studying this course students will be able to know about the microwave components and devices, microwave generators and their characteristics, microwave applications and measurement. Also they will be familier about the rectangular and circular waveguides, their equations and the modes existing in these waveguides. Course Contents: Module I: Introduction Microwave frequencies, standard frequency bands, behaviour of circuits at conventional and microwave frequencies, microwave application. Module II: Waveguide Overview of guided waves, TE, TM and TEM modes, rectangular and cylindrical wave guide resonators, choice of the type of waveguide, waveguide problems. Module III: Microwave Components and Devices Scattering matrix and its properties, coupling probes, coupling loops, windows, waveguide tuners, termination, Eplane Tee, H-plane Tee, Magic Tee, Phase-Shifter, attenuators, Directional Coupler, Gunn diode, Resonator and circulators, IMPATT devices, TRAPATT. Module IV: Microwave tubes Transit-time effect, limitations of conventional tubes, Two-cavity and multi-cavity Klystrons, Reflex Klystron, TWT and Magnetrons.