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Excitation laser energy dependence of the gap-mode TERS spectra of WS$_2$ and MoS$_2$ on silver
Authors:
Andrey Krayev,
Eleonora Isotta,
Lauren Hoang,
Jerry A. Yang,
Kathryn Neilson,
Minyuan Wang,
Noah Haughn,
Eric Pop,
Andrew Mannix,
Oluwaseyi Balogun,
Chih-Feng Wang
Abstract:
We present a systematic study of the dependence of gap mode tip-enhanced Raman scattering (TERS) of mono- and bi-layer WS$_2$ and MoS$_2$ as a function of excitation laser energy. We collected consecutive TERS maps of mono-and bi-layer regions with 6 different excitation lasers. To decrease the acquisition time, we used for the first time concurrent excitation and collection with two lasers simult…
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We present a systematic study of the dependence of gap mode tip-enhanced Raman scattering (TERS) of mono- and bi-layer WS$_2$ and MoS$_2$ as a function of excitation laser energy. We collected consecutive TERS maps of mono-and bi-layer regions with 6 different excitation lasers. To decrease the acquisition time, we used for the first time concurrent excitation and collection with two lasers simultaneously. We found that the E$_{2g}$/A$_{1g}$ peak intensity ratio for bilayer WS$_2$@Ag and the A'/A$_{1g}$ peak intensity ratio of the out-of-plane modes for mono- and bilayer change in a significantly non-monotonous way with excitation laser energies from 1.58 to 2.62 eV. The former ratio increases at energies corresponding to A and B excitons in bilayer WS$_2$. The intensity of the A peak in the monolayer, and hence the A/A$_{1g}$ ratio, is surprisingly high at low excitation energies, dips dramatically at energy corresponding to the A exciton, and is restored partially in between A and B excitons, though still showing a descending trend with increasing energy. A similar picture was observed in mono- and bi-layer MoS$_2$, though the existing set of lasers did not match its excitonic profile as nicely as for WS$_2$. We attribute the observed behavior to intermediate (Fano resonance) or strong (Rabi splitting) coupling between the excitons in transition metal dichalcogenides (TMDs) and the plasmons in the tip-substrate nanocavity. This is akin to the so-called Fano (Rabi) transparency experimentally observed in far field scattering from TMDs between two plasmonic metals. The possibility of intermediate/strong coupling between excitonic resonances in TMDs and the nanocavity re-evaluates the role of resonances in gap-mode TERS and should become an important factor to be considered by TERS practitioners when planning experiments. Finally, we propose the ideal substrate for efficient TERS and tip enhanced photoluminescence measurements.
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Submitted 18 July, 2024;
originally announced July 2024.
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CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Authors:
Marc Jaikissoon,
Çağıl Köroğlu,
Jerry A. Yang,
Kathryn M. Neilson,
Krishna C. Saraswat,
Eric Pop
Abstract:
Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nit…
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Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nitride capping layers can impart strain to monolayer MoS2 transistors on conventional silicon substrates, enhancing their electrical performance with a low thermal budget (350 °C), CMOS-compatible approach. Strained back-gated and dual-gated MoS2 transistors demonstrate median increases up to 60% and 45% in on-state current, respectively. The greatest improvements are found when both transistor channels and contacts are reduced to ~200 nm, reaching saturation currents of 488 uA/um, higher than any previous reports at such short contact pitch. Simulations reveal that most benefits arise from tensile strain lowering the contact Schottky barriers, and that further reducing device dimensions (including contacts) will continue to offer increased strain and performance improvements.
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Submitted 29 June, 2024; v1 submitted 15 May, 2024;
originally announced May 2024.
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Mobility and Threshold Voltage Extraction in Transistors with Gate-Voltage-Dependent Contact Resistance
Authors:
Robert K. A. Bennett,
Lauren Hoang,
Connor Cremers,
Andrew J. Mannix,
Eric Pop
Abstract:
The mobility of emerging (e.g., two-dimensional, oxide, organic) semiconductors is commonly estimated from transistor current-voltage measurements. However, such devices often experience contact gating, i.e., electric fields from the gate modulate the contact resistance during measurements, which can lead conventional extraction techniques to estimate mobility incorrectly even by a factor >2. This…
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The mobility of emerging (e.g., two-dimensional, oxide, organic) semiconductors is commonly estimated from transistor current-voltage measurements. However, such devices often experience contact gating, i.e., electric fields from the gate modulate the contact resistance during measurements, which can lead conventional extraction techniques to estimate mobility incorrectly even by a factor >2. This error can be minimized by measuring transistors at high gate-source bias, |$V_\mathrm{gs}$|, but this regime is often inaccessible in emerging devices that suffer from high contact resistance or early gate dielectric breakdown. Here, we propose a method of extracting mobility in transistors with gate-dependent contact resistance that does not require operation at high |$V_\mathrm{gs}$|, enabling accurate mobility extraction even in emerging transistors with strong contact gating. Our approach relies on updating the transfer length method (TLM) and can achieve <10% error even in regimes where conventional techniques overestimate mobility by >2$\times$.
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Submitted 19 June, 2024; v1 submitted 29 April, 2024;
originally announced April 2024.
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Chemically Tailored Growth of 2D Semiconductors via Hybrid Metal-Organic Chemical Vapor Deposition
Authors:
Zhepeng Zhang,
Lauren Hoang,
Marisa Hocking,
Jenny Hu,
Gregory Zaborski Jr.,
Pooja Reddy,
Johnny Dollard,
David Goldhaber-Gordon,
Tony F. Heinz,
Eric Pop,
Andrew J. Mannix
Abstract:
Two-dimensional (2D) semiconducting transition-metal dichalcogenides (TMDCs) are an exciting platform for new excitonic physics and next-generation electronics, creating a strong demand to understand their growth, doping, and heterostructures. Despite significant progress in solid-source (SS-) and metal-organic chemical vapor deposition (MOCVD), further optimization is necessary to grow highly cry…
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Two-dimensional (2D) semiconducting transition-metal dichalcogenides (TMDCs) are an exciting platform for new excitonic physics and next-generation electronics, creating a strong demand to understand their growth, doping, and heterostructures. Despite significant progress in solid-source (SS-) and metal-organic chemical vapor deposition (MOCVD), further optimization is necessary to grow highly crystalline 2D TMDCs with controlled doping. Here, we report a hybrid MOCVD growth method that combines liquid-phase metal precursor deposition and vapor-phase organo-chalcogen delivery to leverage the advantages of both MOCVD and SS-CVD. Using our hybrid approach, we demonstrate WS$_2$ growth with tunable morphologies - from separated single-crystal domains to continuous monolayer films - on a variety of substrates, including sapphire, SiO$_2$, and Au. These WS$_2$ films exhibit narrow neutral exciton photoluminescence linewidths down to 33 meV and room-temperature mobility up to 34 - 36 cm$^2$V$^-$$^1$s$^-$$^1$). Through simple modifications to the liquid precursor composition, we demonstrate the growth of V-doped WS$_2$, MoxW$_1$$_-$$_x$S$_2$ alloys, and in-plane WS$_2$-MoS$_2$ heterostructures. This work presents an efficient approach for addressing a variety of TMDC synthesis needs on a laboratory scale.
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Submitted 6 March, 2024;
originally announced March 2024.
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Direct Exfoliation of Nanoribbons from Bulk van der Waals Crystals
Authors:
Ashley P. Saunders,
Victoria Chen,
Jierong Wang,
Amalya C. Johnson,
Amy S. McKeown-Green,
Helen J. Zeng,
T. Kien Mac,
Tuan Trinh,
Tony F. Heinz,
Eric Pop,
Fang Liu
Abstract:
Confinement of monolayers into quasi-one-dimensional atomically-thin nanoribbons could lead to novel quantum phenomena beyond those achieved in their bulk and monolayer counterparts. However, current experimental availability of nanoribbon species beyond graphene has been limited to bottom-up synthesis or top-down patterning. In this study, we introduce a versatile and direct lithography-free appr…
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Confinement of monolayers into quasi-one-dimensional atomically-thin nanoribbons could lead to novel quantum phenomena beyond those achieved in their bulk and monolayer counterparts. However, current experimental availability of nanoribbon species beyond graphene has been limited to bottom-up synthesis or top-down patterning. In this study, we introduce a versatile and direct lithography-free approach to exfoliate a variety of bulk van der Waals (vdW) crystals into nanoribbons. Akin to the Scotch tape exfoliation in producing monolayers, this technique provides convenient access to a wide range of nanoribbons derived from their corresponding bulk crystals, including MoS2, WS2, MoSe2, WSe2, MoTe2, WTe2, ReS2, and hBN. The nanoribbons are single-crystalline, parallel-aligned, flat, and have high aspect ratio. We demonstrated the electrical, magnetic, and optical properties from the confinement, strain, and edge configurations of these nanoribbons. This versatile preparation technique will pave the way for future experimental investigation and broad applications in optoelectronic, sensing, electronic and quantum devices.
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Submitted 17 February, 2024;
originally announced February 2024.
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Toward Mass-Production of Transition Metal Dichalcogenide Solar Cells: Scalable Growth of Photovoltaic-Grade Multilayer WSe2 by Tungsten Selenization
Authors:
Kathryn M. Neilson,
Sarallah Hamtaei,
Koosha Nassiri Nazif,
Joshua M. Carr,
Sepideh Rahimisheikh,
Frederick U. Nitta,
Guy Brammertz,
Jeffrey L. Blackburn,
Joke Hadermann,
Krishna C. Saraswat,
Obadiah G. Reid,
Bart Vermang,
Alwin Daus,
Eric Pop
Abstract:
Semiconducting transition metal dichalcogenides (TMDs) are promising for high-specific-power photovoltaics due to desirable band gaps, high absorption coefficients, and ideally dangling-bond-free surfaces. Despite their potential, the majority of TMD solar cells are fabricated in a non-scalable fashion using exfoliated materials due to the absence of high-quality, large-area, multilayer TMDs. Here…
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Semiconducting transition metal dichalcogenides (TMDs) are promising for high-specific-power photovoltaics due to desirable band gaps, high absorption coefficients, and ideally dangling-bond-free surfaces. Despite their potential, the majority of TMD solar cells are fabricated in a non-scalable fashion using exfoliated materials due to the absence of high-quality, large-area, multilayer TMDs. Here, we present the scalable, thickness-tunable synthesis of multilayer tungsten diselenide (WSe$_{2}$) films by selenizing pre-patterned tungsten with either solid source selenium or H$_{2}$Se precursors, which leads to smooth, wafer-scale WSe$_{2}$ films with a layered van der Waals structure. The films have charge carrier lifetimes up to 144 ns, over 14x higher than large-area TMD films previously demonstrated. Such high carrier lifetimes correspond to power conversion efficiency of ~22% and specific power of ~64 W g$^{-1}$ in a packaged solar cell, or ~3 W g$^{-1}$ in a fully-packaged solar module. This paves the way for the mass-production of high-efficiency multilayer WSe$_{2}$ solar cells at low cost.
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Submitted 13 February, 2024;
originally announced February 2024.
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Biaxial Tensile Strain Enhances Electron Mobility of Monolayer Transition Metal Dichalcogenides
Authors:
Jerry A. Yang,
Robert K. A. Bennett,
Lauren Hoang,
Zhepeng Zhang,
Kamila J. Thompson,
Antonios Michail,
John Parthenios,
Konstantinos Papagelis,
Andrew J. Mannix,
Eric Pop
Abstract:
Strain engineering can modulate the material properties of two-dimensional (2D) semiconductors for electronic and optoelectronic applications. Recent theory and experiments have found that uniaxial tensile strain can improve the electron mobility of monolayer MoS$_2$, a 2D semiconductor, but the effects of biaxial strain on charge transport are not well-understood in 2D semiconductors. Here, we us…
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Strain engineering can modulate the material properties of two-dimensional (2D) semiconductors for electronic and optoelectronic applications. Recent theory and experiments have found that uniaxial tensile strain can improve the electron mobility of monolayer MoS$_2$, a 2D semiconductor, but the effects of biaxial strain on charge transport are not well-understood in 2D semiconductors. Here, we use biaxial tensile strain on flexible substrates to probe the electron mobility in monolayer WS$_2$ and MoS$_2$ transistors. This approach experimentally achieves ~2x higher on-state current and mobility with ~0.3% applied biaxial strain in WS$_2$, the highest mobility improvement at the lowest strain reported to date. We also examine the mechanisms behind this improvement through density functional theory simulations, concluding that the enhancement is primarily due to reduced intervalley electron-phonon scattering. These results underscore the role of strain engineering 2D semiconductors for flexible electronics, sensors, integrated circuits, and other optoelectronic applications.
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Submitted 28 November, 2023; v1 submitted 19 September, 2023;
originally announced September 2023.
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Semimetal-Monolayer Transition Metal Dichalcogenides Photodetectors for Wafer-Scale Ultraviolet Photonics
Authors:
Hon-Loen Sinn,
Aravindh Kumar,
Eric Pop,
Akm Newaz
Abstract:
Atomically thin two-dimensional (2D) transition metal dichalcogenides (TMDs), such as MoS$_2$, are promising candidates for nanoscale photonics because of strong-light matter interactions. However, Fermi level pinning due to metal-induced gap (MIGS) states at the metals-monolayer MoS$_2$ interface limits the application of optoelectronic devices based on conventional metals because of the high con…
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Atomically thin two-dimensional (2D) transition metal dichalcogenides (TMDs), such as MoS$_2$, are promising candidates for nanoscale photonics because of strong-light matter interactions. However, Fermi level pinning due to metal-induced gap (MIGS) states at the metals-monolayer MoS$_2$ interface limits the application of optoelectronic devices based on conventional metals because of the high contact resistance of the Schottky contacts. On the other hand, a semimetal-TMD-semimetal device can overcome this limitation, where the MIGS are sufficiently suppressed and can result in ohmic contacts. Here we demonstrate the optoelectronic performance of a bismuth-monolayer (1L) MoS$_2$-bismuth device with ohmic electrical contacts and extraordinary optoelectronic properties. To address the wafer-scale production, we grew full coverage 1L MoS$_2$ by using chemical vapor deposition method. We measured high photoresponsivity of 300 A/W in the UV regime at 77 K, which translates into an external quantum efficiency (EQE) ~ 1000 or $10^5$%. We found that the 90% rise time of our devices at 77 K is 0.1 ms, which suggests that the current devices can operate at the speed of ~ 10 kHz. The combination of large-array device fabrication, high sensitivity, and high-speed response offers great potential for applications in photonics that includes integrated optoelectronic circuits.
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Submitted 29 January, 2023;
originally announced January 2023.
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How do Quantum Effects Influence the Capacitance and Carrier Density of Monolayer MoS$_2$ Transistors?
Authors:
Robert K. A. Bennett,
Eric Pop
Abstract:
When transistor gate insulators have nanometer-scale equivalent oxide thickness (EOT), the gate capacitance ($C_\textrm{G}$) becomes smaller than the oxide capacitance ($C_\textrm{ox}$) due to the quantum capacitance and charge centroid capacitance of the channel. Here, we study the capacitance of monolayer MoS$_\textrm{2}$ as a prototypical two-dimensional (2D) channel while considering spatial v…
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When transistor gate insulators have nanometer-scale equivalent oxide thickness (EOT), the gate capacitance ($C_\textrm{G}$) becomes smaller than the oxide capacitance ($C_\textrm{ox}$) due to the quantum capacitance and charge centroid capacitance of the channel. Here, we study the capacitance of monolayer MoS$_\textrm{2}$ as a prototypical two-dimensional (2D) channel while considering spatial variations in the potential, charge density, and density of states. At 0.5 nm EOT, the monolayer MoS$_\textrm{2}$ capacitance is smaller than its quantum capacitance, limiting the single-gated $C_\textrm{G}$ of an n-type channel to between 63% and 78% of $C_\textrm{ox}$ for gate overdrive voltages between 0.5 and 1 V. Despite these limitations, for dual-gated devices, the on-state $C_\textrm{G}$ of monolayer MoS$_\textrm{2}$ is 50% greater than that of silicon at 0.5 nm EOT and more than three times that of InGaAs at 1 nm EOT, indicating that 2D semiconductors are promising for nanoscale devices at future technology nodes.
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Submitted 14 February, 2023; v1 submitted 9 January, 2023;
originally announced January 2023.
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Imaging the electron charge density in monolayer MoS2 at the Ångstrom scale
Authors:
Joel Martis,
Sandhya Susarla,
Archith Rayabharam,
Cong Su,
Timothy Paule,
Philipp Pelz,
Cassandra Huff,
Xintong Xu,
Hao-Kun Li,
Marc Jaikissoon,
Victoria Chen,
Eric Pop,
Krishna Saraswat,
Alex Zettl,
Narayana R. Aluru,
Ramamoorthy Ramesh,
Peter Ercius,
Arun Majumdar
Abstract:
Four-dimensional scanning transmission electron microscopy (4D-STEM) has recently gained widespread attention for its ability to image atomic electric fields with sub-Ångstrom spatial resolution. These electric field maps represent the integrated effect of the nucleus, core electrons and valence electrons, and separating their contributions is non-trivial. In this paper, we utilized simultaneously…
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Four-dimensional scanning transmission electron microscopy (4D-STEM) has recently gained widespread attention for its ability to image atomic electric fields with sub-Ångstrom spatial resolution. These electric field maps represent the integrated effect of the nucleus, core electrons and valence electrons, and separating their contributions is non-trivial. In this paper, we utilized simultaneously acquired 4D-STEM center of mass (CoM) images and annular dark field (ADF) images to determine the electron charge density in monolayer MoS2. We find that both the core electrons and the valence electrons contribute to the derived electron charge density. However, due to blurring by the probe shape, the valence electron contribution forms a nearly featureless background while most of the spatial modulation comes from the core electrons. Our findings highlight the importance of probe shape in interpreting charge densities derived from 4D STEM.
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Submitted 31 July, 2023; v1 submitted 17 October, 2022;
originally announced October 2022.
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Strain-Enhanced Mobility of Monolayer MoS2
Authors:
Isha M. Datye,
Alwin Daus,
Ryan W. Grady,
Kevin Brenner,
Sam Vaziri,
Eric Pop
Abstract:
Strain engineering is an important method for tuning the properties of semiconductors and has been used to improve the mobility of silicon transistors for several decades. Recently, theoretical studies have predicted that strain can also improve the mobility of two-dimensional (2D) semiconductors, e.g. by reducing intervalley scattering or lowering effective masses. Here, we experimentally show st…
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Strain engineering is an important method for tuning the properties of semiconductors and has been used to improve the mobility of silicon transistors for several decades. Recently, theoretical studies have predicted that strain can also improve the mobility of two-dimensional (2D) semiconductors, e.g. by reducing intervalley scattering or lowering effective masses. Here, we experimentally show strain-enhanced electron mobility in monolayer MoS2 transistors with uniaxial tensile strain, on flexible substrates. The on-state current and mobility are nearly doubled with tensile strain up to 0.7%, and devices return to their initial state after release of strain. We also show a gate-voltage-dependent gauge factor up to 200 for monolayer MoS2, which is higher than previous values reported for sub-1 nm thin piezoresistive films. These results demonstrate the importance of strain engineering 2D semiconductors for performance enhancements in integrated circuits, or for applications such as flexible strain sensors.
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Submitted 5 October, 2022; v1 submitted 8 May, 2022;
originally announced May 2022.
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Substrate-Dependence of Monolayer MoS$_2$ Thermal Conductivity and Thermal Boundary Conductance
Authors:
Alexander J. Gabourie,
Cagil Koroglu,
Eric Pop
Abstract:
The thermal properties of two-dimensional (2D) materials, like MoS$_2$, are known to be affected by interactions with their environment, but this has primarily been studied only with SiO$_2$ substrates. Here, we compare the thermal conductivity (TC) and thermal boundary conductance (TBC) of monolayer MoS$_2$ on amorphous (a-) and crystalline (c-) SiO$_2$, AlN, Al$_2$O$_3$, and $\textit{h}$-BN mono…
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The thermal properties of two-dimensional (2D) materials, like MoS$_2$, are known to be affected by interactions with their environment, but this has primarily been studied only with SiO$_2$ substrates. Here, we compare the thermal conductivity (TC) and thermal boundary conductance (TBC) of monolayer MoS$_2$ on amorphous (a-) and crystalline (c-) SiO$_2$, AlN, Al$_2$O$_3$, and $\textit{h}$-BN monolayers using molecular dynamics. The room temperature TC of MoS$_2$ is ~38 Wm$^{-1}$K$^{-1}$ on amorphous substrates and up to ~68 Wm$^{-1}$K$^{-1}$ on crystalline substrates, with most of the difference due to substrate interactions with long-wavelength MoS$_2$ phonons (< 2 THz). An $\textit{h}$-BN monolayer used as a buffer between MoS$_2$ and the substrate causes the MoS$_2$ TC to increase by up to 50%. Length-dependent calculations reveal TC size effects below ~2 $μ$m and show that the MoS$_2$ TC is size- but not substrate-limited below ~100 nm. We also find that the TBC of MoS$_2$ with c-Al$_2$O$_3$ is over twice that with c-AlN despite a similar MoS$_2$ TC on both, indicating that the TC and TBC could be tuned independently. Finally, we compare the thermal resistance of MoS$_2$ transistors on all substrates to show that MoS$_2$ TBC is the most important parameter for heat removal for long-channel (> 150 nm) devices, while TBC and TC are equally important for short channels. This work provides important insights for electro-thermal applications of 2D materials on various substrates.
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Submitted 24 April, 2022;
originally announced April 2022.
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How to Report and Benchmark Emerging Field-Effect Transistors
Authors:
Zhihui Cheng,
Chin-Sheng Pang,
Peiqi Wang,
Son T. Le,
Yanqing Wu,
Davood Shahrjerdi,
Iuliana Radu,
Max C. Lemme,
Lian-Mao Peng,
Xiangfeng Duan,
Zhihong Chen,
Joerg Appenzeller,
Steven J. Koester,
Eric Pop,
Aaron D. Franklin,
Curt A. Richter
Abstract:
Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and comparing device performance has been challenging due to the involvement and interlinking of multiple device parameters. More importantly, the interdisciplinarity of this research community results in a lack of consistent reporting and benc…
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Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and comparing device performance has been challenging due to the involvement and interlinking of multiple device parameters. More importantly, the interdisciplinarity of this research community results in a lack of consistent reporting and benchmarking guidelines. Here we report a consensus among the authors regarding guidelines for reporting and benchmarking important FET parameters and performance metrics. We provide an example of this reporting and benchmarking process for a two-dimensional (2D) semiconductor FET. Our consensus will help promote an improved approach for assessing device performance in emerging FETs, thus aiding the field to progress more consistently and meaningfully.
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Submitted 4 August, 2022; v1 submitted 30 March, 2022;
originally announced March 2022.
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Improved Gradual Resistive Switching Range and 1000x On/Off Ratio in HfOx RRAM Achieved with a $Ge_2Sb_2Te_5$ Thermal Barrier
Authors:
Raisul Islam,
Shengjun Qin,
Sanchit Deshmukh,
Zhouchangwan Yu,
Cagil Koroglu,
Asir Intisar Khan,
Kirstin Schauble,
Krishna C. Saraswat,
Eric Pop,
H. -S. Philip Wong
Abstract:
Gradual switching between multiple resistance levels is desirable for analog in-memory computing using resistive random-access memory (RRAM). However, the filamentary switching of $HfO_x$-based conventional RRAM often yields only two stable memory states instead of gradual switching between multiple resistance states. Here, we demonstrate that a thermal barrier of $Ge_2Sb_2Te_5$ (GST) between…
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Gradual switching between multiple resistance levels is desirable for analog in-memory computing using resistive random-access memory (RRAM). However, the filamentary switching of $HfO_x$-based conventional RRAM often yields only two stable memory states instead of gradual switching between multiple resistance states. Here, we demonstrate that a thermal barrier of $Ge_2Sb_2Te_5$ (GST) between $HfO_x$ and the bottom electrode (TiN) enables wider and weaker filaments, by promoting heat spreading laterally inside the $HfO_x$. Scanning thermal microscopy suggests that $HfO_x+GST$ devices have a wider heating region than control devices with only $HfO_x$, indicating the formation of a wider filament. Such wider filaments can have multiple stable conduction paths, resulting in a memory device with more gradual and linear switching. The thermally-enhanced $HfO_x+GST$ devices also have higher on/off ratio ($>10^3$) than control devices ($<10^2$), and a median set voltage lower by approximately 1 V (~35%), with a corresponding reduction of the switching power. Our $HfO_x+GST$ RRAM shows 2x gradual switching range using fast (~ns) identical pulse trains with amplitude less than 2 V.
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Submitted 23 March, 2022;
originally announced March 2022.
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Pinpointing the Dominant Component of Contact Resistance to Atomically Thin Semiconductors
Authors:
Emanuel Ber,
Ryan W. Grady,
Eric Pop,
Eilam Yalon
Abstract:
Achieving good electrical contacts is one of the major challenges in realizing devices based on atomically thin two-dimensional (2D) semiconductors. Several studies have examined this hurdle, but a universal understanding of the contact resistance and an underlying approach to its reduction are currently lacking. In this work we expose the shortcomings of the classical contact resistance model in…
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Achieving good electrical contacts is one of the major challenges in realizing devices based on atomically thin two-dimensional (2D) semiconductors. Several studies have examined this hurdle, but a universal understanding of the contact resistance and an underlying approach to its reduction are currently lacking. In this work we expose the shortcomings of the classical contact resistance model in describing contacts to 2D materials, and offer a correction based on the addition of a lateral pseudo-junction resistance component (Rjun). We use a combination of unique contact resistance measurements to experimentally characterize Rjun for Ni contacts to monolayer MoS2. We find that Rjun is the dominating component of the contact resistance in undoped 2D devices and show that it is responsible for most of the back-gate bias and temperature dependence. Our corrected model and experimental results help understand the underlying physics of state-of-the-art contact engineering approaches in the context of minimizing Rjun.
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Submitted 6 October, 2021;
originally announced October 2021.
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Toward Low-Temperature Solid-Source Synthesis of Monolayer MoS2
Authors:
Alvin Tang,
Aravindh Kumar,
Marc Jaikissoon,
Krishna Saraswat,
H. -S. Philip Wong,
Eric Pop
Abstract:
Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for ba…
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Two-dimensional (2D) semiconductors have been proposed for heterogeneous integration with existing silicon technology; however, their chemical vapor deposition (CVD) growth temperatures are often too high. Here, we demonstrate direct CVD solid-source precursor synthesis of continuous monolayer (1L) MoS$_2$ films at 560 C in 50 min, within the 450-to-600 C, 2 h thermal budget window required for back-end-of-the-line compatibility with modern silicon technology. Transistor measurements reveal on-state current up to ~140 $\mathrm{μA/μm}$ at 1 V drain-to-source voltage for 100 nm channel lengths, the highest reported to date for 1L MoS$_2$ grown below 600 C using solid-source precursors. The effective mobility from transfer length method test structures is $\mathrm{29 \pm 5\ cm^2V^{-1}s^{-1}}$ at $\mathrm{6.1 \times 10^{12}\ cm^{-2}}$ electron density, which is comparable to mobilities reported from films grown at higher temperatures. The results of this work provide a path toward the realization of high-quality, thermal-budget-compatible 2D semiconductors for heterogeneous integration with silicon manufacturing.
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Submitted 4 September, 2021;
originally announced September 2021.
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Engineering thermal transport across layered graphene-MoS2 superlattices
Authors:
Aditya Sood,
Charles Sievers,
Yong Cheol Shin,
Victoria Chen,
Shunda Chen,
Kirby K. H. Smithe,
Sukti Chatterjee,
Davide Donadio,
Kenneth E. Goodson,
Eric Pop
Abstract:
Layering two-dimensional van der Waals materials provides unprecedented control over atomic placement, which could enable tailoring of vibrational spectra and heat flow at the sub-nanometer scale. Here, using spatially-resolved ultrafast thermoreflectance and spectroscopy, we uncover the design rules governing cross-plane heat transport in superlattices assembled from monolayers of graphene (G) an…
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Layering two-dimensional van der Waals materials provides unprecedented control over atomic placement, which could enable tailoring of vibrational spectra and heat flow at the sub-nanometer scale. Here, using spatially-resolved ultrafast thermoreflectance and spectroscopy, we uncover the design rules governing cross-plane heat transport in superlattices assembled from monolayers of graphene (G) and MoS2 (M). Using a combinatorial experimental approach, we probe nine different stacking sequences: G, GG, MG, GGG, GMG, GGMG, GMGG, GMMG, GMGMG and identify the effects of vibrational mismatch, interlayer adhesion, and junction asymmetry on thermal transport. Pure G sequences display signatures of quasi-ballistic transport, whereas adding even a single M layer strongly disrupts heat conduction. The experimental data are described well by molecular dynamics simulations which include thermal expansion, accounting for the effect of finite temperature on the interlayer spacing. The simulations show that a change of only 1.5% in the layer separation can lead to a nearly 100% increase of the thermal resistance. Using these design rules, we experimentally demonstrate a 5-layer GMGMG superlattice with an ultralow effective cross-plane thermal conductivity comparable to air, paving the way for a new class of thermal metamaterials with extreme properties.
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Submitted 22 July, 2021;
originally announced July 2021.
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Lateral Transport and Field-Effect Characteristics of Sputtered P-Type Chalcogenide Thin Films
Authors:
Sumaiya Wahid,
Alwin Daus,
Asir Intisar Khan,
Victoria Chen,
Kathryn M. Neilson,
Mahnaz Islam,
Eric Pop
Abstract:
Investigating lateral electrical transport in p-type thin film chalcogenides is important to evaluate their potential for field-effect transistors (FETs) and phase-change memory applications. For instance, p-type FETs with sputtered materials at low temperature (<= 250 C) could play a role in flexible electronics or back-end-of-line (BEOL) silicon-compatible processes. Here, we explore lateral tra…
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Investigating lateral electrical transport in p-type thin film chalcogenides is important to evaluate their potential for field-effect transistors (FETs) and phase-change memory applications. For instance, p-type FETs with sputtered materials at low temperature (<= 250 C) could play a role in flexible electronics or back-end-of-line (BEOL) silicon-compatible processes. Here, we explore lateral transport in chalcogenide films (Sb2Te3, Ge2Sb2Te5, Ge4Sb6Te7) and multilayers, with Hall measurements (in <= 50 nm thin films) and with p-type transistors (in <= 5 nm ultrathin films). The highest Hall mobilities are measured for Sb2Te3/GeTe superlattices (~18 cm2/V/s at room temperature), over 2-3x higher than the other films. In ultrathin p-type FETs with Ge2Sb2Te5, we achieve field-effect mobility up to ~5.5 cm2/V/s with current on/off ratio ~10000, the highest for Ge2Sb2Te5 transistors to date. We also explore process optimizations (e.g., AlOx capping layer, type of developer for lithography) and uncover their trade-offs towards the realization of p-type transistors with acceptable mobility and on/off current ratio. Our study provides essential insights into the optimization of electronic devices based on p-type chalcogenides.
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Submitted 17 July, 2021;
originally announced July 2021.
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Vibrational Properties of a Naturally Occurring Semiconducting van der Waals heterostructure
Authors:
V. Z. Costa,
Liangbo Liang,
Sam Vaziri,
Addison Miller,
Eric Pop,
A. K. M. Newaz
Abstract:
We present vibrational properties of Franckeite, which is a naturally occurring van der Waals heterostructure consisting of two different semiconducting layers. Franckeite is a complex layered crystal composed of alternating SnS$_2$ like pseudohexagonal and PbS-like pseudotetragonal layers stacked on top of each other, providing a unique platform to study vibrational properties and thermal transpo…
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We present vibrational properties of Franckeite, which is a naturally occurring van der Waals heterostructure consisting of two different semiconducting layers. Franckeite is a complex layered crystal composed of alternating SnS$_2$ like pseudohexagonal and PbS-like pseudotetragonal layers stacked on top of each other, providing a unique platform to study vibrational properties and thermal transport across layers with mass density and phonon mismatches. By using micro-Raman spectroscopy and first-principles Raman simulations, we found that the PbS-like pseudotetragonal structure is mostly composed of Pb$_3$SbS$_4$. We also discovered several low-frequency Raman modes that originate from the intralayer vibrations of the pseudotetragonal layer. Using density functional theory, we determined all vibrational patterns of Franckeite, whose signatures are observed in the Raman spectrum. By studying temperature dependent Raman spectroscopy (300 K - 500 K), we have found different temperature coefficients for both pseudotetragonal and pseudohexagonal layers. We believe that our study will help understand the vibration modes of its complex heterostructure and the thermal properties at the nanoscale.
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Submitted 15 July, 2021;
originally announced July 2021.
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High-Specific-Power Flexible Transition Metal Dichalcogenide Solar Cells
Authors:
Koosha Nassiri Nazif,
Alwin Daus,
Jiho Hong,
Nayeun Lee,
Sam Vaziri,
Aravindh Kumar,
Frederick Nitta,
Michelle Chen,
Siavash Kananian,
Raisul Islam,
Kwan-Ho Kim,
Jin-Hong Park,
Ada Poon,
Mark L. Brongersma,
Eric Pop,
Krishna C. Saraswat
Abstract:
Semiconducting transition metal dichalcogenides (TMDs) are promising for flexible high-specific-power photovoltaics due to their ultrahigh optical absorption coefficients, desirable band gaps and self-passivated surfaces. However, challenges such as Fermi-level pinning at the metal contact-TMD interface and the inapplicability of traditional doping schemes have prevented most TMD solar cells from…
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Semiconducting transition metal dichalcogenides (TMDs) are promising for flexible high-specific-power photovoltaics due to their ultrahigh optical absorption coefficients, desirable band gaps and self-passivated surfaces. However, challenges such as Fermi-level pinning at the metal contact-TMD interface and the inapplicability of traditional doping schemes have prevented most TMD solar cells from exceeding 2% power conversion efficiency (PCE). In addition, fabrication on flexible substrates tends to contaminate or damage TMD interfaces, further reducing performance. Here, we address these fundamental issues by employing: 1) transparent graphene contacts to mitigate Fermi-level pinning, 2) $\rm{MoO}_\it{x}$ capping for doping, passivation and anti-reflection, and 3) a clean, non-damaging direct transfer method to realize devices on lightweight flexible polyimide substrates. These lead to record PCE of 5.1% and record specific power of $\rm{4.4\ W\,g^{-1}}$ for flexible TMD ($\rm{WSe_2}$) solar cells, the latter on par with prevailing thin-film solar technologies cadmium telluride, copper indium gallium selenide, amorphous silicon and III-Vs. We further project that TMD solar cells could achieve specific power up to $\rm{46\ W\,g^{-1}}$, creating unprecedented opportunities in a broad range of industries from aerospace to wearable and implantable electronics.
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Submitted 24 June, 2021; v1 submitted 19 June, 2021;
originally announced June 2021.
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Improving Electric Contacts to Two-Dimensional Semiconductors
Authors:
Saurabh V. Suryavanshi,
Blanka Magyari-Kope,
Paul Lim,
Connor McClellan,
Kirby K. H. Smithe,
Chris D. English,
Eric Pop
Abstract:
Electrical contact resistance to two-dimensional (2D) semiconductors such as monolayer MoS_{2} is a key bottleneck in scaling the 2D field effect transistors (FETs). The 2D semiconductor in contact with three-dimensional metal creates unique current crowding that leads to increased contact resistance. We developed a model to separate the contribution of the current crowding from the intrinsic cont…
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Electrical contact resistance to two-dimensional (2D) semiconductors such as monolayer MoS_{2} is a key bottleneck in scaling the 2D field effect transistors (FETs). The 2D semiconductor in contact with three-dimensional metal creates unique current crowding that leads to increased contact resistance. We developed a model to separate the contribution of the current crowding from the intrinsic contact resistivity. We show that current crowding can be alleviated by doping and contact patterning. Using Landauer-Büttiker formalism, we show that van der Waals (vdW) gap at the interface will ultimately limit the electrical contact resistance. We compare our models with experimental data for doped and undoped MoS_{2} FETs. Even with heavy charge-transfer doping of > 2x10^{13} cm^{-2}, we show that the state-of-the-art contact resistance is 100 times larger than the ballistic limit. Our study highlights the need to develop efficient interface to achieve contact resistance of < 10 Ω.μm, which will be ideal for extremely scaled devices.
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Submitted 22 May, 2021;
originally announced May 2021.
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Scaling Theory of Two-Dimensional Field Effect Transistors
Authors:
Saurabh V. Suryavanshi,
Chris D. English,
H. -S. P. Wong,
Eric Pop
Abstract:
We present a scaling theory of two-dimensional (2D) field effect transistors (FETs). For devices with channel thickness less than 4 nm, the device electrostatics is dominated by the physical gate oxide thickness and not the effective oxide thickness. Specifically, for symmetric double gate (DG) FETs the scale length (Λ) varies linearly with the gate oxide thickness(t_{ox}) as Λ ~ 3/4t_{ox}. The ga…
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We present a scaling theory of two-dimensional (2D) field effect transistors (FETs). For devices with channel thickness less than 4 nm, the device electrostatics is dominated by the physical gate oxide thickness and not the effective oxide thickness. Specifically, for symmetric double gate (DG) FETs the scale length (Λ) varies linearly with the gate oxide thickness(t_{ox}) as Λ ~ 3/4t_{ox}. The gate oxide dielectric permittivity and the semiconductor channel thickness do not affect the device electrostatics for such device geometries. For an asymmetric device such as single gate (SG) FETs, the fringing fields have a second order effect on the scale length. However, like symmetric DG FETs, the scale length in asymmetric FETs is also ultimately limited by the physical gate oxide thickness. We compare our theoretical predictions for scaled monolayer MoS2 DG FETs.
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Submitted 22 May, 2021;
originally announced May 2021.
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Uncovering Phase Change Memory Energy Limits by Sub-Nanosecond Probing of Power Dissipation Dynamics
Authors:
Keren Stern,
Nicolás Wainstein,
Yair Keller,
Christopher M. Neumann,
Eric Pop,
Shahar Kvatinsky,
Eilam Yalon
Abstract:
Phase change memory (PCM) is one of the leading candidates for neuromorphic hardware and has recently matured as a storage class memory. Yet, energy and power consumption remain key challenges for this technology because part of the PCM device must be self-heated to its melting temperature during reset. Here, we show that this reset energy can be reduced by nearly two orders of magnitude by minimi…
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Phase change memory (PCM) is one of the leading candidates for neuromorphic hardware and has recently matured as a storage class memory. Yet, energy and power consumption remain key challenges for this technology because part of the PCM device must be self-heated to its melting temperature during reset. Here, we show that this reset energy can be reduced by nearly two orders of magnitude by minimizing the pulse width. We utilize a high-speed measurement setup to probe the energy consumption in PCM cells with varying pulse width (0.3 to 40 nanoseconds) and uncover the power dissipation dynamics. A key finding is that the switching power (P) remains unchanged for pulses wider than a short thermal time constant of the PCM ($τ$$_t$$_h$ < 1 ns in 50 nm diameter device), resulting in a decrease of energy (E=P$τ$) as the pulse width $τ$ is reduced in that range. In other words, thermal confinement during short pulses is achieved by limiting the heat diffusion time. Our improved programming scheme reduces reset energy density below 0.1 nJ/$μ$m$^2$, over an order of magnitude lower than state-of-the-art PCM, potentially changing the roadmap of future data storage technology and paving the way towards energy-efficient neuromorphic hardware
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Submitted 2 May, 2021; v1 submitted 23 April, 2021;
originally announced April 2021.
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Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films
Authors:
Heungdong Kwon,
Asir Intisar Khan,
Christopher Perez,
Mehdi Asheghi,
Eric Pop,
Kenneth E. Goodson
Abstract:
Superlattice-like phase change memory (SL-PCM) promises lower switching current than conventional PCM based on Ge2Sb2Te5 (GST). However, a fundamental understanding of SL-PCM requires detailed characterization of the interfaces within such a SL. Here, we explore the electrical and thermal transport of SLs with deposited Sb2Te3 and GeTe alternating layers of various thicknesses. We find up to ~4X r…
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Superlattice-like phase change memory (SL-PCM) promises lower switching current than conventional PCM based on Ge2Sb2Te5 (GST). However, a fundamental understanding of SL-PCM requires detailed characterization of the interfaces within such a SL. Here, we explore the electrical and thermal transport of SLs with deposited Sb2Te3 and GeTe alternating layers of various thicknesses. We find up to ~4X reduction of the effective cross-plane thermal conductivity of the SL stack (as-deposited polycrystalline) compared to polycrystalline GST (as-deposited amorphous and later annealed) due to the thermal interface resistances within the SL. Thermal measurements with varying periods of our SLs show a signature of phonon coherence with a transition from wave-like to particle-like phonon transport, further described by our modeling. Electrical resistivity measurements of such SLs reveal strong anisotropy (~2000X) between the in-plane and cross-plane directions due to the weakly interacting van der Waals gaps. This work uncovers electro-thermal transport in SLs based on Sb2Te3 and GeTe, for improved design of low-power PCM.
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Submitted 23 July, 2021; v1 submitted 4 March, 2021;
originally announced March 2021.
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Spectral Decomposition of Thermal Conductivity: Comparing Velocity Decomposition Methods in Homogeneous Molecular Dynamics Simulations
Authors:
Alexander J. Gabourie,
Zheyong Fan,
Tapio Ala-Nissila,
Eric Pop
Abstract:
The design of new applications, especially those based on heterogeneous integration, must rely on detailed knowledge of material properties, such as thermal conductivity (TC). To this end, multiple methods have been developed to study TC as a function of vibrational frequency. Here, we compare three spectral TC methods based on velocity decomposition in homogenous molecular dynamics simulations: G…
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The design of new applications, especially those based on heterogeneous integration, must rely on detailed knowledge of material properties, such as thermal conductivity (TC). To this end, multiple methods have been developed to study TC as a function of vibrational frequency. Here, we compare three spectral TC methods based on velocity decomposition in homogenous molecular dynamics simulations: Green-Kubo modal analysis (GKMA), the spectral heat current (SHC) method, and a method we propose called homogeneous nonequilibrium modal analysis (HNEMA). First, we derive a convenient per-atom virial expression for systems described by general many-body potentials, enabling compact representations of the heat current, each velocity decomposition method, and other related quantities. Next, we evaluate each method by calculating the spectral TC for carbon nanotubes, graphene, and silicon. We show that each method qualitatively agrees except at optical phonon frequencies, where a combination of mismatched eigenvectors and a large density of states produces artificial TC peaks for modal analysis methods. Our calculations also show that the HNEMA and SHC methods converge much faster than the GKMA method, with the SHC method being the most computationally efficient. Finally, we demonstrate that our single-GPU modal analysis implementation in GPUMD (Graphics Processing Units Molecular Dynamics) is over 1000 times faster than the existing LAMMPS (Large-scale Atomic/Molecular Massively Parallel Simulator) implementation on one CPU.
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Submitted 6 February, 2021;
originally announced February 2021.
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High Current Density in Monolayer MoS$_2$ Doped by AlO$_x$
Authors:
Connor J. McClellan,
Eilam Yalon,
Kirby K. H. Smithe,
Saurabh V. Suryavanshi,
Eric Pop
Abstract:
Semiconductors require stable doping for applications in transistors, optoelectronics, and thermoelectrics. However, this has been challenging for two-dimensional (2D) materials, where existing approaches are either incompatible with conventional semiconductor processing or introduce time-dependent, hysteretic behavior. Here we show that low temperature (< 200$^\circ$ C) sub-stoichiometric AlO…
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Semiconductors require stable doping for applications in transistors, optoelectronics, and thermoelectrics. However, this has been challenging for two-dimensional (2D) materials, where existing approaches are either incompatible with conventional semiconductor processing or introduce time-dependent, hysteretic behavior. Here we show that low temperature (< 200$^\circ$ C) sub-stoichiometric AlO$_x$ provides a stable n-doping layer for monolayer MoS$_2$, compatible with circuit integration. This approach achieves carrier densities > 2x10$^{13}$ 1/cm$^2$, sheet resistance as low as ~7 kOhm/sq, and good contact resistance ~480 Ohm.um in transistors from monolayer MoS$_2$ grown by chemical vapor deposition. We also reach record current density of nearly 700 uA/um (>110 MA/cm$^2$) in this three-atom-thick semiconductor while preserving transistor on/off current ratio > $10^6$. The maximum current is ultimately limited by self-heating and could exceed 1 mA/um with better device heat sinking. With their 0.1 nA/um off-current, such doped MoS$_2$ devices approach several low-power transistor metrics required by the international technology roadmap
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Submitted 30 December, 2020;
originally announced December 2020.
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Size scaling, dynamics, and electro-thermal bifurcation of VO2 Mott oscillators
Authors:
Stephanie M. Bohaichuk,
Suhas Kumar,
Miguel Muñoz Rojo,
R. Stanley Williams,
Mahnaz Islam,
Gregory Pitner,
Jaewoo Jeong,
Mahesh G. Samant,
Stuart S. P. Parkin,
Eric Pop
Abstract:
Traditional electronic devices are well-known to improve in speed and energy-efficiency as their dimensions are reduced to the nanoscale. However, this scaling behavior remains unclear for nonlinear dynamical circuit elements, such as Mott neuron-like spiking oscillators, which are of interest for bio-inspired computing. Here we show that shrinking micrometer-sized VO2 oscillators to sub-100 nm ef…
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Traditional electronic devices are well-known to improve in speed and energy-efficiency as their dimensions are reduced to the nanoscale. However, this scaling behavior remains unclear for nonlinear dynamical circuit elements, such as Mott neuron-like spiking oscillators, which are of interest for bio-inspired computing. Here we show that shrinking micrometer-sized VO2 oscillators to sub-100 nm effective sizes, achieved using a nanogap cut in a metallic carbon nanotube (CNT) electrode, does not guarantee faster spiking. However, an additional heat source such as Joule heating from the CNT, in combination with small size and heat capacity (defined by the narrow volume of VO2 whose insulator-metal transition is triggered by the CNT), can increase the spiking frequency by ~1000x due to an electro-thermal bifurcation in the nonlinear dynamics. These results demonstrate that nonlinear dynamical switches operate in a complex phase space which can be controlled by careful electro-thermal design, offering new tuning parameters for designing future biomimetic electronics.
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Submitted 14 December, 2020;
originally announced December 2020.
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Application-Driven Synthesis and Characterization of Hexagonal Boron Nitride on Metal and Carbon Nanotube Substrates
Authors:
Victoria Chen,
Yong Cheol Shin,
Evgeny Mikheev,
Joel Martis,
Ze Zhang,
Sukti Chatterjee,
Arun Majumdar,
David Goldhaber-Gordon,
Eric Pop
Abstract:
Hexagonal boron nitride (h-BN) is unique among two-dimensional materials, with a large band gap (~6 eV) and high thermal conductivity (>400 W/m/K), second only to diamond among electrical insulators. Most electronic studies to date have relied on h-BN exfoliated from bulk crystals; however, for scalable applications the material must be synthesized by methods such as chemical vapor deposition (CVD…
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Hexagonal boron nitride (h-BN) is unique among two-dimensional materials, with a large band gap (~6 eV) and high thermal conductivity (>400 W/m/K), second only to diamond among electrical insulators. Most electronic studies to date have relied on h-BN exfoliated from bulk crystals; however, for scalable applications the material must be synthesized by methods such as chemical vapor deposition (CVD). Here, we demonstrate single- and few-layer h-BN synthesized by CVD on single crystal platinum and on carbon nanotube (CNT) substrates, also comparing these films with h-BN deposited on the more commonly used polycrystalline Pt and Cu growth substrates. The h-BN film grown on single crystal Pt has a lower surface roughness and is more spatially homogeneous than the film from a polycrystalline Pt foil, and our electrochemical transfer process allows for these expensive foils to be reused with no measurable degradation. In addition, we demonstrate monolayer h-BN as an ultrathin, 3.33 $\unicode{x212B}$ barrier protecting MoS2 from damage at high temperatures and discuss other applications that take advantage of the conformal h-BN deposition on various substrates demonstrated in this work.
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Submitted 29 November, 2020;
originally announced November 2020.
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Graphene-Based Electromechanical Thermal Switches
Authors:
Michelle E. Chen,
Miguel Muñoz Rojo,
Feifei Lian,
Justin Koeln,
Aditya Sood,
Stephanie M. Bohaichuk,
Christopher M. Neumann,
Sarah G. Garrow,
Andrew G. Alleyne,
Kenneth E. Goodson,
Eric Pop
Abstract:
Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g. via thermal switches or diodes) would offer additional degrees of control over the management of thermal transients and system reliability. Here we report the fir…
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Thermal management is an important challenge in modern electronics, avionics, automotive, and energy storage systems. While passive thermal solutions (like heat sinks or heat spreaders) are often used, actively modulating heat flow (e.g. via thermal switches or diodes) would offer additional degrees of control over the management of thermal transients and system reliability. Here we report the first thermal switch based on a flexible, collapsible graphene membrane, with low operating voltage, < 2 V. We also employ active-mode scanning thermal microscopy (SThM) to measure the device behavior and switching in real time. A compact analytical thermal model is developed for the general case of a thermal switch based on a double-clamped suspended membrane, highlighting the thermal and electrical design challenges. System-level modeling demonstrates the thermal trade-offs between modulating temperature swing and average temperature as a function of switching ratio. These graphene-based thermal switches present new opportunities for active control of fast (even nanosecond) thermal transients in densely integrated systems.
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Submitted 21 November, 2020;
originally announced November 2020.
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High-Performance Flexible Nanoscale Field-Effect Transistors Based on Transition Metal Dichalcogenides
Authors:
Alwin Daus,
Sam Vaziri,
Victoria Chen,
Cagil Koroglu,
Ryan W. Grady,
Connor S. Bailey,
Hye Ryoung Lee,
Kevin Brenner,
Kirstin Schauble,
Eric Pop
Abstract:
Two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) are good candidates for high-performance flexible electronics. However, most demonstrations of such flexible field-effect transistors (FETs) to date have been on the micron scale, not benefitting from the short-channel advantages of 2D-TMDs. Here, we demonstrate flexible monolayer MoS2 FETs with the shortest channels repor…
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Two-dimensional (2D) semiconducting transition metal dichalcogenides (TMDs) are good candidates for high-performance flexible electronics. However, most demonstrations of such flexible field-effect transistors (FETs) to date have been on the micron scale, not benefitting from the short-channel advantages of 2D-TMDs. Here, we demonstrate flexible monolayer MoS2 FETs with the shortest channels reported to date (down to 50 nm) and remarkably high on-current (up to 470 uA/um at 1 V drain-to-source voltage) which is comparable to flexible graphene or crystalline silicon FETs. This is achieved using a new transfer method wherein contacts are initially patterned on the rigid TMD growth substrate with nanoscale lithography, then coated with a polyimide (PI) film which becomes the flexible substrate after release, with the contacts and TMD. We also apply this transfer process to other TMDs, reporting the first flexible FETs with MoSe2 and record on-current for flexible WSe2 FETs. These achievements push 2D semiconductors closer to a technology for low-power and high-performance flexible electronics.
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Submitted 5 February, 2021; v1 submitted 8 September, 2020;
originally announced September 2020.
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Ultrahigh Doping of Graphene Using Flame-Deposited MoO3
Authors:
Sam Vaziri,
Victoria Chen,
Lili Cai,
Yue Jiang,
Michelle Chen,
Ryan Grady,
Xiaolin Zheng,
Eric Pop
Abstract:
The expected high performance of graphene-based electronics is often hindered by lack of adequate doping, which causes low carrier density and large sheet resistance. Many reported graphene doping schemes also suffer from instability or incompatibility with existing semiconductor processing. Here we report ultrahigh and stable p-type doping up to ~7x10^13 1/cm^2 (~2x10^21 1/cm^3}) of monolayer gra…
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The expected high performance of graphene-based electronics is often hindered by lack of adequate doping, which causes low carrier density and large sheet resistance. Many reported graphene doping schemes also suffer from instability or incompatibility with existing semiconductor processing. Here we report ultrahigh and stable p-type doping up to ~7x10^13 1/cm^2 (~2x10^21 1/cm^3}) of monolayer graphene grown by chemical vapor deposition. This is achieved by direct polycrystalline MoO3 growth on graphene using a rapid flame synthesis technique. With this approach, the metal-graphene contact resistance for holes is reduced to ~200 Ohm-um. We also demonstrate that flame-deposited MoO3 provides over 5x higher doping of graphene, as well as superior thermal and long-term stability, compared to electron-beam deposited MoO3.
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Submitted 15 August, 2020;
originally announced August 2020.
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Uncovering the Effects of Metal Contacts on Monolayer MoS2
Authors:
Kirstin Schauble,
Dante Zakhidov,
Eilam Yalon,
Sanchit Deshmukh,
Ryan W. Grady,
Kayla A. Cooley,
Connor J. McClellan,
Sam Vaziri,
Donata Passarello,
Suzanne E. Mohney,
Michael F. Toney,
A. K. Sood,
Alberto Salleo,
Eric Pop
Abstract:
Metal contacts are a key limiter to the electronic performance of two-dimensional (2D) semiconductor devices. Here we present a comprehensive study of contact interfaces between seven metals (Y, Sc, Ag, Al, Ti, Au, Ni, with work functions from 3.1 to 5.2 eV) and monolayer MoS2 grown by chemical vapor deposition. We evaporate thin metal films onto MoS2 and study the interfaces by Raman spectroscopy…
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Metal contacts are a key limiter to the electronic performance of two-dimensional (2D) semiconductor devices. Here we present a comprehensive study of contact interfaces between seven metals (Y, Sc, Ag, Al, Ti, Au, Ni, with work functions from 3.1 to 5.2 eV) and monolayer MoS2 grown by chemical vapor deposition. We evaporate thin metal films onto MoS2 and study the interfaces by Raman spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction, transmission electron microscopy, and electrical characterization. We uncover that, 1) ultrathin oxidized Al dopes MoS2 n-type (> 2x10^12 1/cm^2) without degrading its mobility, 2) Ag, Au, and Ni deposition causes varying levels of damage to MoS2 (broadening Raman E' peak from <3 1/cm to >6 1/cm), and 3) Ti, Sc, and Y react with MoS2. Reactive metals must be avoided in contacts to monolayer MoS2, but control studies reveal the reaction is mostly limited to the top layer of multilayer films. Finally, we find that 4) thin metals do not significantly strain MoS2, as confirmed by X-ray diffraction. These are important findings for metal contacts to MoS2, and broadly applicable to many other 2D semiconductors.
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Submitted 28 July, 2020;
originally announced July 2020.
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Reduced Thermal Conductivity of Supported and Encased Monolayer and Bilayer MoS$_2$
Authors:
Alexander J. Gabourie,
Saurabh V. Suryavanshi,
Amir Barati Farimani,
Eric Pop
Abstract:
Electrical and thermal properties of atomically thin two-dimensional (2D) materials are affected by their environment, e.g. through remote phonon scattering or dielectric screening. However, while it is known that mobility and thermal conductivity (TC) of graphene are reduced on a substrate, these effects are much less explored in 2D semiconductors such as MoS$_2$. Here, we use molecular dynamics…
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Electrical and thermal properties of atomically thin two-dimensional (2D) materials are affected by their environment, e.g. through remote phonon scattering or dielectric screening. However, while it is known that mobility and thermal conductivity (TC) of graphene are reduced on a substrate, these effects are much less explored in 2D semiconductors such as MoS$_2$. Here, we use molecular dynamics to understand TC changes in monolayer (1L) and bilayer (2L) MoS$_2$ by comparing suspended, supported, and encased structures. The TC of monolayer MoS$_2$ is reduced from ~117 Wm$^{-1}$K$^{-1}$ when suspended, to ~31 Wm$^{-1}$K$^{-1}$ when supported by SiO$_2$, at 300 K. Encasing 1L MoS$_2$ in SiO$_2$ further reduces its TC down to ~22 Wm$^{-1}$K$^{-1}$. In contrast, the TC of 2L MoS$_2$ is not as drastically reduced, being >50% higher than 1L both when supported and encased. These effects are due to phonon scattering with remote vibrational modes of the substrate, which are partly screened in 2L MoS$_2$. We also examine the TC of 1L MoS$_2$ across a wide range of temperatures (300 to 700 K) and defect densities (up to 5$\times$10$^{13}$ cm$^{-2}$), finding that the substrate reduces the dependence of TC on these factors. Taken together, these are important findings for all applications which will use 2D semiconductors supported or encased by insulators, instead of freely suspended.
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Submitted 9 July, 2020;
originally announced July 2020.
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Layer Dependent Interfacial Transport and Optoelectrical Properties of MoS2 on Ultra-flat Metals
Authors:
Hao Lee,
S. Deshmukh,
Jing Wen,
V. Z. Costa,
J. S. Schuder,
M. Sanchez,
A. S. Ichimura,
Eric Pop,
Bin Wang,
A. K. M. Newaz
Abstract:
Transition metal dichalcogenides (TMDs) are layered semiconducting van der Waal crystals and promising materials for a wide range of electronic and optoelectronic devices. Realizing practical electrical and optoelectronic device applications requires a connection between a metal junction and a TMD semiconductor. Hence, a complete understanding of electronic band alignments and the potential barrie…
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Transition metal dichalcogenides (TMDs) are layered semiconducting van der Waal crystals and promising materials for a wide range of electronic and optoelectronic devices. Realizing practical electrical and optoelectronic device applications requires a connection between a metal junction and a TMD semiconductor. Hence, a complete understanding of electronic band alignments and the potential barrier heights governing the transport through a metal-TMD-metal junction is critical. But, there is a knowledge gap; it is not clear how the energy bands of a TMD align while in contact with a metal as a function of the number of layers. In pursuit of removing this knowledge gap, we have performed conductive atomic force microscopy (CAFM) of few layered (1-5) MoS2 immobilized on ultra-flat conducting Au surfaces (root mean square (RMS) surface roughness <0.2 nm) and indium tin oxide (ITO) substrate (RMS surface roughness <0.7 nm) forming a vertical metal (conductive-AFM tip)-semiconductor-metal device. We have observed that the current increases as the number of layers increases up to 5 layers. By applying Fowler-Nordheim tunneling theory, we have determined the barrier heights for different layers and observed that the barrier height decreases as the number of layers increases. Using density functional theory (DFT) calculation, we successfully demonstrated that the barrier height decreases as the layer number increases. By illuminating the TMDs on a transparent ultra-flat conducting ITO substrate, we observed a reduction in current when compared to the current measured in the dark, hence demonstrating negative photoconductivity. Our study provides a fundamental understanding of the local electronic and optoelectronic behaviors of TMD-metal junction, and may pave an avenue toward developing nanoscale electronic devices with tailored layer-dependent transport properties.
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Submitted 1 August, 2019;
originally announced August 2019.
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Localized Triggering of the Insulator-Metal Transition in VO2 using a Single Carbon Nanotube
Authors:
Stephanie M. Bohaichuk,
Miguel Muñoz Rojo,
Gregory Pitner,
Connor J. McClellan,
Feifei Lian,
Jason Li,
Jaewoo Jeong,
Mahesh G. Samant,
Stuart S. P. Parkin,
H. -S. Philip Wong,
Eric Pop
Abstract:
Vanadium dioxide (VO2) has been widely studied for its rich physics and potential applications, undergoing a prominent insulator-metal transition (IMT) near room temperature. The transition mechanism remains highly debated, and little is known about the IMT at nanoscale dimensions. To shed light on this problem, here we use ~1 nm wide carbon nanotube (CNT) heaters to trigger the IMT in VO2. Single…
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Vanadium dioxide (VO2) has been widely studied for its rich physics and potential applications, undergoing a prominent insulator-metal transition (IMT) near room temperature. The transition mechanism remains highly debated, and little is known about the IMT at nanoscale dimensions. To shed light on this problem, here we use ~1 nm wide carbon nanotube (CNT) heaters to trigger the IMT in VO2. Single metallic CNTs switch the adjacent VO2 at less than half the voltage and power required by control devices without a CNT, with switching power as low as ~85 $μW$ at 300 nm device lengths. We also obtain potential and temperature maps of devices during operation using Kelvin Probe Microscopy (KPM) and Scanning Thermal Microscopy (SThM). Comparing these with three-dimensional electrothermal simulations, we find that the local heating of the VO2 by the CNT play a key role in the IMT. These results demonstrate the ability to trigger IMT in VO2 using nanoscale heaters, and highlight the significance of thermal engineering to improve device behaviour.
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Submitted 5 July, 2019;
originally announced July 2019.
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Contact Engineering High Performance n-Type MoTe2 Transistors
Authors:
Michal J. Mleczko,
Andrew C. Yu,
Christopher M. Smyth,
Victoria Chen,
Yong Cheol Shin,
Sukti Chatterjee,
Yi-Chia Tsai,
Yoshio Nishi,
Robert M. Wallace,
Eric Pop
Abstract:
Semiconducting MoTe2 is one of the few two-dimensional (2D) materials with a moderate band gap, similar to silicon. However, this material remains under-explored for 2D electronics due to ambient instability and predominantly p-type Fermi level pinning at contacts. Here, we demonstrate unipolar n-type MoTe2 transistors with the highest performance to date, including high saturation current (>400…
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Semiconducting MoTe2 is one of the few two-dimensional (2D) materials with a moderate band gap, similar to silicon. However, this material remains under-explored for 2D electronics due to ambient instability and predominantly p-type Fermi level pinning at contacts. Here, we demonstrate unipolar n-type MoTe2 transistors with the highest performance to date, including high saturation current (>400 $μA/μm$ at 80 K and >200 $μA/μm$ at 300 K) and relatively low contact resistance (1.2 to 2 $kΩ\cdotμm$ from 80 to 300 K), achieved with Ag contacts and AlOx encapsulation. We also investigate other contact metals, extracting their Schottky barrier heights using an analytic subthreshold model. High-resolution X-ray photoelectron spectroscopy reveals that interfacial metal-Te compounds dominate the contact resistance. Among the metals studied, Sc has the lowest work function but is the most reactive, which we counter by inserting monolayer h-BN between MoTe2 and Sc. These metal-insulator-semiconductor (MIS) contacts partly de-pin the metal Fermi level and lead to the smallest Schottky barrier for electron injection. Overall, this work improves our understanding of n-type contacts to 2D materials, an important advance for low-power electronics.
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Submitted 4 July, 2019;
originally announced July 2019.
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Strongly Tunable Anisotropic Thermal Transport in MoS2 by Strain and Lithium Intercalation: First--Principles Calculations
Authors:
Shunda Chen,
Aditya Sood,
Eric Pop,
Kenneth E. Goodson,
Davide Donadio
Abstract:
The possibility of tuning the vibrational properties and the thermal conductivity of layered van der Waals materials either chemically or mechanically paves the way to significant advances in nanoscale heat management. Using first-principles calculations we investigate the modulation of heat transport in MoS2 by lithium intercalation and cross-plane strain. We find that both the in-plane and cross…
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The possibility of tuning the vibrational properties and the thermal conductivity of layered van der Waals materials either chemically or mechanically paves the way to significant advances in nanoscale heat management. Using first-principles calculations we investigate the modulation of heat transport in MoS2 by lithium intercalation and cross-plane strain. We find that both the in-plane and cross-plane thermal conductivity (kr, kz) of MoS2 are extremely sensitive to both strain and electrochemical intercalation. Combining lithium intercalation and strain, the in-plane and cross-plane thermal conductivity can be tuned over one and two orders of magnitude, respectively. Furthermore, since kr and kz respond in different ways to intercalation and strain, the thermal conductivity anisotropy can be modulated by two orders of magnitude. The underlying mechanisms for such large tunability of the anisotropic thermal conductivity of \Mos are explored by computing and analyzing the dispersion relations, group velocities, relaxation times and mean free paths of phonons. Since both intercalation and strain can be applied reversibly, their stark effect on thermal conductivity can be exploited to design novel phononic devices, as well as for thermal management in MoS2-based electronic and optoelectronic systems.
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Submitted 14 May, 2019;
originally announced May 2019.
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Thermal conductivity of crystalline AlN and the influence of atomic-scale defects
Authors:
Runjie Lily Xu,
Miguel Munoz Rojo,
S. M. Islam,
Aditya Sood,
Bozo Vareskic,
Ankita Katre,
Natalio Mingo,
Kenneth E. Goodson,
Huili Grace Xing,
Debdeep Jena,
Eric Pop
Abstract:
Aluminum nitride (AlN) plays a key role in modern power electronics and deep-ultraviolet photonics, where an understanding of its thermal properties is essential. Here we measure the thermal conductivity of crystalline AlN by the 3$ω$ method, finding it ranges from 674 ${\pm}$ 56 W/m/K at 100 K to 186 ${\pm}$ 7 W/m/K at 400 K, with a value of 237 ${\pm}$ 6 W/m/K at room temperature. We compare the…
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Aluminum nitride (AlN) plays a key role in modern power electronics and deep-ultraviolet photonics, where an understanding of its thermal properties is essential. Here we measure the thermal conductivity of crystalline AlN by the 3$ω$ method, finding it ranges from 674 ${\pm}$ 56 W/m/K at 100 K to 186 ${\pm}$ 7 W/m/K at 400 K, with a value of 237 ${\pm}$ 6 W/m/K at room temperature. We compare these data with analytical models and first principles calculations, taking into account atomic-scale defects (O, Si, C impurities, and Al vacancies). We find Al vacancies play the greatest role in reducing thermal conductivity because of the largest mass-difference scattering. Modeling also reveals that 10% of heat conduction is contributed by phonons with long mean free paths, over ~7 $μ$m at room temperature, and 50% by phonons with MFPs over ~0.3 $μ$m. Consequently, the effective thermal conductivity of AlN is strongly reduced in sub-micron thin films or devices due to phonon-boundary scattering.
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Submitted 8 December, 2019; v1 submitted 31 March, 2019;
originally announced April 2019.
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Fast Spiking of a Mott VO2-Carbon Nanotube Composite Device
Authors:
Stephanie M. Bohaichuk,
Suhas Kumar,
Greg Pitner,
Connor J. McClellan,
Jaewoo Jeong,
Mahesh G. Samant,
H-. S. Philip Wong,
Stuart S. P. Parkin,
R. Stanley Williams,
Eric Pop
Abstract:
The recent surge of interest in brain-inspired computing and power-efficient electronics has dramatically bolstered development of computation and communication using neuron-like spiking signals. Devices that can produce rapid and energy-efficient spiking could significantly advance these applications. Here we demonstrate DC-current or voltage-driven periodic spiking with sub-20 ns pulse widths fr…
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The recent surge of interest in brain-inspired computing and power-efficient electronics has dramatically bolstered development of computation and communication using neuron-like spiking signals. Devices that can produce rapid and energy-efficient spiking could significantly advance these applications. Here we demonstrate DC-current or voltage-driven periodic spiking with sub-20 ns pulse widths from a single device composed of a thin VO2 film with a metallic carbon nanotube as a nanoscale heater. Compared with VO2-only devices, adding the nanotube heater dramatically decreases the transient duration and pulse energy, and increases the spiking frequency, by up to three orders of magnitude. This is caused by heating and cooling of the VO2 across its insulator-metal transition being localized to a nanoscale conduction channel in an otherwise bulk medium. This result provides an important component of energy-efficient neuromorphic computing systems, and a lithography-free technique for power-scaling of electronic devices that operate via bulk mechanisms.
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Submitted 7 March, 2019;
originally announced March 2019.
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Engineering Thermal and Electrical Interface Properties of Phase Change Memory with Monolayer MoS2
Authors:
Christopher M. Neumann,
Kye L. Okabe,
Eilam Yalon,
Ryan W. Grady,
H. -S. Philip Wong,
Eric Pop
Abstract:
Phase change memory (PCM) is an emerging data storage technology, however its programming is thermal in nature and typically not energy-efficient. Here we reduce the switching power of PCM through the combined approaches of filamentary contacts and thermal confinement. The filamentary contact is formed through an oxidized TiN layer on the bottom electrode, and thermal confinement is achieved using…
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Phase change memory (PCM) is an emerging data storage technology, however its programming is thermal in nature and typically not energy-efficient. Here we reduce the switching power of PCM through the combined approaches of filamentary contacts and thermal confinement. The filamentary contact is formed through an oxidized TiN layer on the bottom electrode, and thermal confinement is achieved using a monolayer semiconductor interface, three-atom thick MoS2. The former reduces the switching volume of the phase change material and yields a 70% reduction in reset current versus typical 150 nm diameter mushroom cells. The enhanced thermal confinement achieved with the ultra-thin (~6 Å) MoS2 yields an additional 30% reduction in switching current and power. We also use detailed simulations to show that further tailoring the electrical and thermal interfaces of such PCM cells toward their fundamental limits could lead up to a six-fold benefit in power efficiency.
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Submitted 1 March, 2019;
originally announced March 2019.
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Quasi-ballistic thermal transport across MoS$_2$ thin films
Authors:
Aditya Sood,
Feng Xiong,
Shunda Chen,
Ramez Cheaito,
Feifei Lian,
Mehdi Asheghi,
Yi Cui,
Davide Donadio,
Kenneth E. Goodson,
Eric Pop
Abstract:
Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. In general, it is thought that cross-plane thermal conductivities ($κ_z$) are low, and therefore c-axis phonon mean free paths (MFPs) are small. Here, we measure $κ_z$ across MoS$_2$ films of varying thickness (20 to 240 nm) and uncover evidence of very long c-axis pho…
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Layered two-dimensional (2D) materials have highly anisotropic thermal properties between the in-plane and cross-plane directions. In general, it is thought that cross-plane thermal conductivities ($κ_z$) are low, and therefore c-axis phonon mean free paths (MFPs) are small. Here, we measure $κ_z$ across MoS$_2$ films of varying thickness (20 to 240 nm) and uncover evidence of very long c-axis phonon MFPs at room temperature in these layered semiconductors. Experimental data obtained using time-domain thermoreflectance (TDTR) are in good agreement with first-principles density functional theory (DFT). These calculations reveal that ~50% of the heat is carried by phonons with MFP >200 nm, exceeding kinetic theory estimates by nearly two orders of magnitude. Because of quasi-ballistic effects, the $κ_z$ of nanometer thin films of MoS$_2$ scales with their thickness and the volumetric thermal resistance asymptotes to a non-zero value, ~10 m$^{2}$KGW$^{-1}$. This contributes as much as 30% to the total thermal resistance of a 20 nm thick film, the rest being limited by thermal interface resistance with the SiO$_2$ substrate and top-side aluminum transducer. These findings are essential for understanding heat flow across nanometer-thin films of MoS$_2$ for optoelectronic and thermoelectric applications.
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Submitted 7 March, 2019; v1 submitted 22 February, 2019;
originally announced February 2019.
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An electrochemical thermal transistor
Authors:
Aditya Sood,
Feng Xiong,
Shunda Chen,
Haotian Wang,
Daniele Selli,
Jinsong Zhang,
Connor J. McClellan,
Jie Sun,
Davide Donadio,
Yi Cui,
Eric Pop,
Kenneth E. Goodson
Abstract:
The ability to actively regulate heat flow at the nanoscale could be a game changer for applications in thermal management and energy harvesting. Such a breakthrough could also enable the control of heat flow using thermal circuits, in a manner analogous to electronic circuits. Here we demonstrate switchable thermal transistors with an order of magnitude thermal on/off ratio, based on reversible e…
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The ability to actively regulate heat flow at the nanoscale could be a game changer for applications in thermal management and energy harvesting. Such a breakthrough could also enable the control of heat flow using thermal circuits, in a manner analogous to electronic circuits. Here we demonstrate switchable thermal transistors with an order of magnitude thermal on/off ratio, based on reversible electrochemical lithium intercalation in MoS2 thin films. We use spatially-resolved time-domain thermoreflectance to map the lithium ion distribution during device operation, and atomic force microscopy to show that the lithiated state correlates with increased thickness and surface roughness. First principles calculations reveal that the thermal conductance modulation is due to phonon scattering by lithium rattler modes, c-axis strain, and stacking disorder. This study lays the foundation for electrochemically-driven nanoscale thermal regulators, and establishes thermal metrology as a useful probe of spatio-temporal intercalant dynamics in nanomaterials.
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Submitted 14 January, 2019;
originally announced January 2019.
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Thermal Boundary Conductance of Two-Dimensional $MoS_{2}$ Interfaces
Authors:
Saurabh V. Suryavanshi,
Alexander J. Gabourie,
Amir Barati Farimani,
Eric Pop
Abstract:
Understanding the thermal properties of two-dimensional (2D) materials and devices is essential for thermal management of 2D applications. Here we perform molecular dynamics simulations to evaluate both the specific heat of $MoS_{2}$ as well as the thermal boundary conductance (TBC) between one to five layers of $MoS_{2}$ with amorphous $SiO_{2}$ and between single-layer $MoS_{2}$ and crystalline…
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Understanding the thermal properties of two-dimensional (2D) materials and devices is essential for thermal management of 2D applications. Here we perform molecular dynamics simulations to evaluate both the specific heat of $MoS_{2}$ as well as the thermal boundary conductance (TBC) between one to five layers of $MoS_{2}$ with amorphous $SiO_{2}$ and between single-layer $MoS_{2}$ and crystalline $AlN$. The results of all calculations are compared to existing experimental data. In general, the TBC of such 2D interfaces is low, below ~20 $MWm^{-2}K^{-1}$, due to the weak van der Waals (vdW) coupling and mismatch of phonon density of states (PDOS) between materials. However, the TBC increases with vdW coupling strength, with temperature, and with the number of $MoS_{2}$ layers (which introduce additional phonon modes). These findings suggest that the TBC of 2D materials is tunable by modulating their interface interaction, the number of layers, and finding a PDOS-matched substrate, with important implications for future energy-efficient 2D electronics, photonics, and thermoelectrics.
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Submitted 13 May, 2019; v1 submitted 8 January, 2019;
originally announced January 2019.
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Thermal Transport Across Graphene Step Junctions
Authors:
Miguel Munoz Rojo,
Zuanyi Li,
Charles Sievers,
Alex C. Bornstein,
Eilam Yalon,
Sanchit Deshmukh,
Sam Vaziri,
Myung-Ho Bae,
Feng Xiong,
Davide Donadio,
Eric Pop
Abstract:
Step junctions are often present in layered materials, i.e. where single-layer regions meet multi-layer regions, yet their effect on thermal transport is not understood to date. Here, we measure heat flow across graphene junctions (GJs) from monolayer to bilayer graphene, as well as bilayer to four-layer graphene for the first time, in both heat flow directions. The thermal conductance of the mono…
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Step junctions are often present in layered materials, i.e. where single-layer regions meet multi-layer regions, yet their effect on thermal transport is not understood to date. Here, we measure heat flow across graphene junctions (GJs) from monolayer to bilayer graphene, as well as bilayer to four-layer graphene for the first time, in both heat flow directions. The thermal conductance of the monolayer-bilayer GJ device ranges from ~0.5 to 9.1x10^8 Wm-2K-1 between 50 K to 300 K. Atomistic simulations of such GJ device reveal that graphene layers are relatively decoupled, and the low thermal conductance of the device is determined by the resistance between the two dis-tinct graphene layers. In these conditions the junction plays a negligible effect. To prove that the decoupling between layers controls thermal transport in the junction, the heat flow in both directions was measured, showing no evidence of thermal asymmetry or rectification (within experimental error bars). For large-area graphene applications, this signifies that small bilayer (or multilayer) islands have little or no contribution to overall thermal transport.
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Submitted 30 November, 2018;
originally announced November 2018.
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Thermal Transport in MoS$_2$ from Molecular Dynamics using Different Empirical Potentials
Authors:
Ke Xu,
Alexander J. Gabourie,
Arsalan Hashemi,
Zheyong Fan,
Ning Wei,
Amir Barati Farimani,
Hannu-Pekka Komsa,
Arkady V. Krasheninnikov,
Eric Pop,
Tapio Ala-Nissila
Abstract:
Thermal properties of molybdenum disulfide (MoS$_2$) have recently attracted attention related to fundamentals of heat propagation in strongly anisotropic materials, and in the context of potential applications to optoelectronics and thermoelectrics. Multiple empirical potentials have been developed for classical molecular dynamics (MD) simulations of this material, but it has been unclear which p…
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Thermal properties of molybdenum disulfide (MoS$_2$) have recently attracted attention related to fundamentals of heat propagation in strongly anisotropic materials, and in the context of potential applications to optoelectronics and thermoelectrics. Multiple empirical potentials have been developed for classical molecular dynamics (MD) simulations of this material, but it has been unclear which provides the most realistic results. Here, we calculate lattice thermal conductivity of single- and multi-layer pristine MoS$_2$ by employing three different thermal transport MD methods: equilibrium, nonequilibrium, and homogeneous nonequilibrium ones. These methods allow us to verify the consistency of our results and also facilitate comparisons with previous works, where different schemes have been adopted. Our results using variants of the Stillinger-Weber potential are at odds with some previous ones and we analyze the possible origins of the discrepancies in detail. We show that, among the potentials considered here, the reactive empirical bond order (REBO) potential gives the most reasonable predictions of thermal transport properties as compared to experimental data. With the REBO potential, we further find that isotope scattering has only a small effect on thermal conduction in MoS$_2$ and the in-plane thermal conductivity decreases with increasing layer number and saturates beyond about three layers. We identify the REBO potential as a transferable empirical potential for MD simulations of MoS$_2$ which can be used to study thermal transport properties in more complicated situations such as in systems containing defects or engineered nanoscale features. This work establishes a firm foundation for understanding heat transport properties of MoS$_2$ using MD simulations.
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Submitted 18 November, 2018;
originally announced November 2018.
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Significant Phonon Drag Enables High Power Factor in the AlGaN/GaN Two-Dimensional Electron Gas
Authors:
Ananth Saran Yalamarthy,
Miguel Muñoz Rojo,
Alexandra Bruefach,
Derrick Boone,
Karen M. Dowling,
Peter F. Satterthwaite,
David Goldhaber-Gordon,
Eric Pop,
Debbie G. Senesky
Abstract:
In typical thermoelectric energy harvesters and sensors, the Seebeck effect is caused by diffusion of electrons or holes in a temperature gradient. However, the Seebeck effect can also have a phonon drag component, due to momentum exchange between charge carriers and lattice phonons, which is more difficult to quantify. Here, we present the first study of phonon drag in the AlGaN/GaN two-dimension…
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In typical thermoelectric energy harvesters and sensors, the Seebeck effect is caused by diffusion of electrons or holes in a temperature gradient. However, the Seebeck effect can also have a phonon drag component, due to momentum exchange between charge carriers and lattice phonons, which is more difficult to quantify. Here, we present the first study of phonon drag in the AlGaN/GaN two-dimensional electron gas (2DEG). We find that phonon drag does not contribute significantly to the thermoelectric behavior of devices with ~100 nm GaN thickness, which suppress the phonon mean free path. However, when the thickness is increased to ~1.2 $μ$m, up to 32% (88%) of the Seebeck coefficient at 300 K (50 K) can be attributed to the drag component. In turn, the phonon drag enables state-of-the-art thermoelectric power factor in the thicker GaN film, up to ~40 mW m$^{-1}$ K$^{-2}$ at 50 K. By measuring the thermal conductivity of these AlGaN/GaN films, we show that the magnitude of the phonon drag can increase even when the thermal conductivity decreases. Decoupling of thermal conductivity and Seebeck coefficient could enable important advancements in thermoelectric power conversion with devices based on 2DEGs.
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Submitted 15 May, 2019; v1 submitted 21 September, 2018;
originally announced September 2018.
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Size Dependence and Ballistic Limits of Thermal Transport in Anisotropic Layered Two-Dimensional Materials
Authors:
Zuanyi Li,
Yizhou Liu,
Lucas Lindsay,
Yong Xu,
Wenhui Duan,
Eric Pop
Abstract:
Layered materials have uncommonly anisotropic thermal properties due to their strong in-plane covalent bonds and weak out-of-plane van der Waals interactions. Here we examine heat flow in graphene (graphite), h-BN, MoS2, and WS2 monolayers and bulk films, from diffusive to ballistic limits. We determine the ballistic thermal conductance limit (Gball) both in-plane and out-of-plane, based on full p…
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Layered materials have uncommonly anisotropic thermal properties due to their strong in-plane covalent bonds and weak out-of-plane van der Waals interactions. Here we examine heat flow in graphene (graphite), h-BN, MoS2, and WS2 monolayers and bulk films, from diffusive to ballistic limits. We determine the ballistic thermal conductance limit (Gball) both in-plane and out-of-plane, based on full phonon dispersions from first-principles calculations. An overall phonon mean free path (λ) is expressed in terms of Gball and the diffusive thermal conductivity, consistent with kinetic theory if proper averaging of phonon group velocity is used. We obtain a size-dependent thermal conductivity k(L) in agreement with available experiments, and find that k(L) only converges to >90% of the diffusive thermal conductivity for sample sizes L > 16λ, which ranges from ~140 nm for MoS2 cross-plane to ~10 um for suspended graphene in-plane. These results provide a deeper understanding of microscopic thermal transport, revealing that device scales below which thermal size effects should be taken into account are generally larger than previously thought.
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Submitted 7 November, 2017;
originally announced November 2017.
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Temperature Dependent Thermal Boundary Conductance of Monolayer MoS$_2$ by Raman Thermometry
Authors:
Eilam Yalon,
Özgür Burak Aslan,
Kirby K. H. Smithe,
Connor J. McClellan,
Saurabh V. Suryavanshi,
Feng Xiong,
Aditya Sood,
Christopher M. Neumann,
Xiaoqing Xu,
Kenneth E. Goodson,
Tony F. Heinz,
Eric Pop
Abstract:
The electrical and thermal behavior of nanoscale devices based on two-dimensional (2D) materials is often limited by their contacts and interfaces. Here we report the temperature-dependent thermal boundary conductance (TBC) of monolayer MoS$_2$ with AlN and SiO$_2$, using Raman thermometry with laser-induced heating. The temperature-dependent optical absorption of the 2D material is crucial in suc…
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The electrical and thermal behavior of nanoscale devices based on two-dimensional (2D) materials is often limited by their contacts and interfaces. Here we report the temperature-dependent thermal boundary conductance (TBC) of monolayer MoS$_2$ with AlN and SiO$_2$, using Raman thermometry with laser-induced heating. The temperature-dependent optical absorption of the 2D material is crucial in such experiments, which we characterize here for the first time above room temperature. We obtain TBC ~ 15 MWm$^-$$^2$K$^-$$^1$ near room temperature, increasing as ~ T$^0$$^.$$^6$$^5$ in the range 300 - 600 K. The similar TBC of MoS$_2$ with the two substrates indicates that MoS$_2$ is the "softer" material with weaker phonon irradiance, and the relatively low TBC signifies that such interfaces present a key bottleneck in energy dissipation from 2D devices. Our approach is needed to correctly perform Raman thermometry of 2D materials, and our findings are key for understanding energy coupling at the nanoscale.
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Submitted 8 February, 2020; v1 submitted 20 October, 2017;
originally announced October 2017.
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Tuning Electrical and Thermal Transport in AlGaN/GaN Heterostructures via Buffer Layer Engineering
Authors:
Ananth Saran Yalamarthy,
Hongyun So,
Miguel Muñoz Rojo,
Ateeq J. Suria,
Xiaoqing Xu,
Eric Pop,
Debbie G. Senesky
Abstract:
Over the last decade, progress in wide bandgap, III-V materials systems based on gallium nitride (GaN) has been a major driver in the realization of high power and high frequency electronic devices. Since the highly conductive, two-dimensional electron gas (2DEG) at the AlGaN/GaN interface is based on built-in polarization fields (not doping) and is confined to very small thicknesses, its charge c…
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Over the last decade, progress in wide bandgap, III-V materials systems based on gallium nitride (GaN) has been a major driver in the realization of high power and high frequency electronic devices. Since the highly conductive, two-dimensional electron gas (2DEG) at the AlGaN/GaN interface is based on built-in polarization fields (not doping) and is confined to very small thicknesses, its charge carriers exhibit much higher mobilities in comparison to their doped counterparts. In this study, we show that this heterostructured material also offers the unique ability to manipulate electrical transport separately from thermal transport through the examination of fully-suspended AlGaN/GaN diaphragms of varied GaN buffer layer thicknesses. Notably, we show that ~$100$ nm thin GaN layers can considerably impede heat flow without electrical transport degradation, and that a significant improvement (~$4$x) in the thermoelectric figure of merit ($\it zT$) over externally doped GaN is observed in 2DEG based heterostructures. We also observe state-of-the art thermoelectric power factors ($4-7\times$ $10^{-3}$$\,Wm^{-1}K^{-2}$) at room temperature) in the 2DEG of this material system. This remarkable tuning behavior and thermoelectric enhancement, elucidated here for the first time in a polarization-based heterostructure, is achieved since the electrons are at the heterostructured interface, while the phonons are within the material system. These results highlight the potential for using the 2DEG in III-V materials for on-chip thermal sensing and energy harvesting.
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Submitted 14 February, 2018; v1 submitted 9 October, 2017;
originally announced October 2017.
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Scalable Fabrication of Atomically Thin Monolayer MoS2 Photodetectors
Authors:
Alexander E. Yore,
K. K. H. Smithe,
Sauraj Jha,
Kyle Ray,
Eric Pop,
A. K. M. Newaz
Abstract:
Scalable fabrication of high quality photodetectors derived from synthetically grown monolayer transition metal dichalcogenides is highly desired and important for wide range of nanophotonics applications. We present here scalable fabrication of monolayer MoS2 photodetectors on sapphire substrates through an efficient process, which includes growing large scale monolayer MoS2 via chemical vapor de…
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Scalable fabrication of high quality photodetectors derived from synthetically grown monolayer transition metal dichalcogenides is highly desired and important for wide range of nanophotonics applications. We present here scalable fabrication of monolayer MoS2 photodetectors on sapphire substrates through an efficient process, which includes growing large scale monolayer MoS2 via chemical vapor deposition (CVD), and multi-step optical lithography for device patterning and high quality metal electrodes fabrication. In every measured device, we observed the following universal features: (i) negligible dark current $(I_{dark}\leqslant10 fA)$; (ii) sharp peaks in photocurrent at $\sim$1.9eV and $\sim$2.1eV attributable to the optical transitions due to band edge excitons; (iii) a rapid onset of photocurrent above $\sim$2.5eV peaked at $\sim$2.9eV due to an excitonic absorption originating from the van Hove singularity of MoS$_2$. We observe low ($\leqslant 300\%$) device-to-device variation of photoresponsivity. Furthermore, we observe very fast rise time $\sim$0.5 ms, which is three orders of magnitude faster than other reported CVD grown 1L-MoS$_2$ based photodetectors. The combination of scalable device fabrication, ultra-high sensitivity and high speed offer a great potential for applications in photonics.
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Submitted 7 September, 2017;
originally announced October 2017.