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A general framework for spatial correlation modeling in VLSI design

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Frank LiuAuthors Info & Claims

DAC '07: Proceedings of the 44th annual Design Automation Conference

Pages 817 - 822

https://doi.org/10.1145/1278480.1278684

Published: 04 June 2007 Publication History

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Abstract

Many characteristics of VLSI designs, such as process variations, demonstrate strong spatial correlations. Accurately modeling of these correlated behaviors is crucial for many timing and power analyses to be valid. This paper proposes a new spatial model with a long-range trend component, a smooth correlation component, as well as a truly random component. The efficient method to construct such a spatial model is based on the Generalized Least Square fitting and the structured correlation functions, which are actually the generalization of the popular Pelgrom mismatch models. Experimental results on industrial benchmarks show that the method is not only highly effective for variability modeling, but can also be used for other spatially distributed characteristics such as IR drops and on-chip temperature distributions.

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Cited By

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Hsu CSarson PSchatzberger GLeisenberger FCarulli JSiddhartha SCheng K(2016)Variation and failure characterization through pattern classification of test data from multiple test stages2016 IEEE International Test Conference (ITC)10.1109/TEST.2016.7805845(1-10)Online publication date: Nov-2016
https://doi.org/10.1109/TEST.2016.7805845
Huang CWey CChen JLuo P(2015)Performance-Driven Unit-Capacitor Placement of Successive-Approximation-Register ADCsACM Transactions on Design Automation of Electronic Systems10.1145/277087221:1(1-17)Online publication date: 2-Dec-2015
https://dl.acm.org/doi/10.1145/2770872
Majzoub S(2015)Reducing random-dopant fluctuation impact using footer transistors in many-core systemsIntegration, the VLSI Journal10.1016/j.vlsi.2014.06.00548:C(46-54)Online publication date: 1-Jan-2015
https://dl.acm.org/doi/10.1016/j.vlsi.2014.06.005
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A general framework for spatial correlation modeling in VLSI design
1. Applied computing
  1. Physical sciences and engineering
    1. Engineering

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Published In

DAC '07: Proceedings of the 44th annual Design Automation Conference

June 2007

1016 pages

ISBN:9781595936271

DOI:10.1145/1278480

General Chair:
Steven P. Levitan
Univ. of Pittsburgh, Pittsburgh, PA

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Association for Computing Machinery

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Published: 04 June 2007

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DAC07: The 44th Annual Design Automation Conference 2007

June 4 - 8, 2007

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DAC '07 Paper Acceptance Rate 152 of 659 submissions, 23%;

Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Hsu CSarson PSchatzberger GLeisenberger FCarulli JSiddhartha SCheng K(2016)Variation and failure characterization through pattern classification of test data from multiple test stages2016 IEEE International Test Conference (ITC)10.1109/TEST.2016.7805845(1-10)Online publication date: Nov-2016
https://doi.org/10.1109/TEST.2016.7805845
Huang CWey CChen JLuo P(2015)Performance-Driven Unit-Capacitor Placement of Successive-Approximation-Register ADCsACM Transactions on Design Automation of Electronic Systems10.1145/277087221:1(1-17)Online publication date: 2-Dec-2015
https://dl.acm.org/doi/10.1145/2770872
Majzoub S(2015)Reducing random-dopant fluctuation impact using footer transistors in many-core systemsIntegration, the VLSI Journal10.1016/j.vlsi.2014.06.00548:C(46-54)Online publication date: 1-Jan-2015
https://dl.acm.org/doi/10.1016/j.vlsi.2014.06.005
Huang KKupp NXanthopoulos CCarulli JMakris Y(2014)Low-Cost Analog/RF IC Testing through Combined Intra- and Inter-Die Correlation ModelsIEEE Design & Test10.1109/MDAT.2014.2361721(1-1)Online publication date: 2014
https://doi.org/10.1109/MDAT.2014.2361721
Kahng ALin BNath SMacii E(2013)Enhanced metamodeling techniques for high-dimensional IC design estimation problemsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485726(1861-1866)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485726
Zhao JLu SBurleson WTessier RMacii E(2013)Run-time probabilistic detection of miscalibrated thermal sensors in many-core systemsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485620(1395-1398)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485620
Cha BGupta SMacii E(2013)Trojan detection via delay measurementsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485592(1265-1270)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485592
Huang KKupp NCarulli JMakris YMacii E(2013)Handling discontinuous effects in modeling spatial correlation of wafer-level analog/RF testsProceedings of the Conference on Design, Automation and Test in Europe10.5555/2485288.2485425(553-558)Online publication date: 18-Mar-2013
https://dl.acm.org/doi/10.5555/2485288.2485425
Lee YHuang P(2013)An efficient method for analyzing on-chip thermal reliability considering process variationsACM Transactions on Design Automation of Electronic Systems10.1145/2491477.249148518:3(1-32)Online publication date: 29-Jul-2013
https://dl.acm.org/doi/10.1145/2491477.2491485
Huang SHuang LTsai KCheng W(2013)Delay testing and characterization of post-bond interposer wires in 2.5-D ICs2013 IEEE International Test Conference (ITC)10.1109/TEST.2013.6651906(1-8)Online publication date: Sep-2013
https://doi.org/10.1109/TEST.2013.6651906
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Spatial entropy-based clustering for mining data with spatial correlation

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