research-article

An efficient method for analyzing on-chip thermal reliability considering process variations

Authors:

Pei-Yu HuangAuthors Info & Claims

ACM Transactions on Design Automation of Electronic Systems (TODAES), Volume 18, Issue 3

Article No.: 41, Pages 1 - 32

https://doi.org/10.1145/2491477.2491485

Published: 29 July 2013 Publication History

Abstract

This work provides an efficient statistical electrothermal simulator for analyzing on-chip thermal reliability under process variations. Using the collocation-based statistical modeling technique, first, the statistical interpolation polynomial for on-chip temperature distribution can be obtained by performing deterministic electrothermal simulation very few times and by utilizing polynomial interpolation. After that, the proposed simulator not only provides the mean and standard deviation profiles of on-chip temperature distribution, but also innovates the concept of thermal yield profile to statistically characterize the on-chip temperature distribution more precisely, and builds an efficient technique for estimating this figure of merit. Moreover, a mixed-mesh strategy is presented to further enhance the efficiency of the developed statistical electrothermal simulator.

Experimental results demonstrate that (1) the developed statistical electrothermal simulator can obtain accurate approximations with orders of magnitude speedup over the Monte Carlo method; (2) comparing with a well-known cumulative distribution function estimation method, APEX [Li et al. 2004], the developed statistical electrothermal simulator can achieve 215× speedup with better accuracy; (3) the developed mixed-mesh strategy can achieve an order of magnitude faster over our baseline algorithm and still maintain an acceptable accuracy level.

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Cited By

Peng Z(2023)Temperature-Aware Design and Optimization of Reliable Cyber-Physical Systems2023 International Conference on Electrical, Computer and Energy Technologies (ICECET)10.1109/ICECET58911.2023.10389266(1-6)Online publication date: 16-Nov-2023
https://doi.org/10.1109/ICECET58911.2023.10389266
Sultan HSarangi S(2023)VarSim: A fast process variation-aware thermal modeling methodology using Green’s functionsMicroelectronics Journal10.1016/j.mejo.2023.105995142(105995)Online publication date: Dec-2023
https://doi.org/10.1016/j.mejo.2023.105995
Liu WMa SHuang LWang Z(2018)The Design of NoC-Side Memory Access Scheduling for Energy-Efficient GPGPUsInternational Journal of Parallel Programming10.1007/s10766-017-0521-246:4(722-735)Online publication date: 1-Aug-2018
https://dl.acm.org/doi/10.1007/s10766-017-0521-2
Show More Cited By

Index Terms

An efficient method for analyzing on-chip thermal reliability considering process variations
1. Hardware
  1. Electronic design automation
    1. Physical design (EDA)
  2. Hardware validation

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cover image ACM Transactions on Design Automation of Electronic Systems

ACM Transactions on Design Automation of Electronic Systems Volume 18, Issue 3

July 2013

268 pages

ISSN:1084-4309

EISSN:1557-7309

DOI:10.1145/2491477

Issue’s Table of Contents

Copyright © 2013 ACM.

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 29 July 2013

Accepted: 01 January 2013

Revised: 01 September 2012

Received: 01 March 2012

Published in TODAES Volume 18, Issue 3

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Cited By

Peng Z(2023)Temperature-Aware Design and Optimization of Reliable Cyber-Physical Systems2023 International Conference on Electrical, Computer and Energy Technologies (ICECET)10.1109/ICECET58911.2023.10389266(1-6)Online publication date: 16-Nov-2023
https://doi.org/10.1109/ICECET58911.2023.10389266
Sultan HSarangi S(2023)VarSim: A fast process variation-aware thermal modeling methodology using Green’s functionsMicroelectronics Journal10.1016/j.mejo.2023.105995142(105995)Online publication date: Dec-2023
https://doi.org/10.1016/j.mejo.2023.105995
Liu WMa SHuang LWang Z(2018)The Design of NoC-Side Memory Access Scheduling for Energy-Efficient GPGPUsInternational Journal of Parallel Programming10.1007/s10766-017-0521-246:4(722-735)Online publication date: 1-Aug-2018
https://dl.acm.org/doi/10.1007/s10766-017-0521-2
Ukhov IEles PPeng Z(2017)Probabilistic Analysis of Electronic Systems via Adaptive Hierarchical InterpolationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.270511736:11(1883-1896)Online publication date: Nov-2017
https://doi.org/10.1109/TCAD.2017.2705117
Sahu AFanucci LTeich J(2016)Thermal aware scheduling and mapping of multiphase applications onto chip multiprocessorProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2972063(1096-1101)Online publication date: 14-Mar-2016
https://dl.acm.org/doi/10.5555/2971808.2972063
Wan YHuang HDas DPecht M(2016)Thermal reliability prediction and analysis for high-density electronic systems based on the Markov processMicroelectronics Reliability10.1016/j.microrel.2015.10.00656(182-188)Online publication date: Jan-2016
https://doi.org/10.1016/j.microrel.2015.10.006
Chen HLi YTan SHuang XWang HWong N(2015)H-Matrix-Based Finite-Element-Based Thermal Analysis for 3D ICsACM Transactions on Design Automation of Electronic Systems10.1145/271456320:4(1-25)Online publication date: 28-Sep-2015
https://dl.acm.org/doi/10.1145/2714563
Ukhov IEles PPeng Z(2015)Temperature-Centric Reliability Analysis and Optimization of Electronic Systems Under Process VariationIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2014.237124923:11(2417-2430)Online publication date: Nov-2015
https://doi.org/10.1109/TVLSI.2014.2371249
Ukhov IEles PPeng Z(2014)Probabilistic Analysis of Power and Temperature Under Process Variation for Electronic System DesignIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2014.230167233:6(931-944)Online publication date: Jun-2014
https://doi.org/10.1109/TCAD.2014.2301672

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