GLSVLSI

With the escalating computation capability demands of AI and other applications, chiplet technology has emerged as a prominent force in the current market, offering scalability and cost-effectiveness. One of the most critical issues in chiplet-based ...

3D Network on Chips (3D-NoCs) have ample on-chip wiring resources and high bandwidth, yet face numerous hotspots and higher temperature gradients due to increased integration and power density. This could lead to device failure, impacting system ...

Planar inductors are widely utilized in traditional, PCB-level switching mode power supplies. To mitigate prohibitive power loss in modern high-performance integrated systems, power converters should be embedded closer to points-of-load (POLs). The ...

With the ever-increasing complexity of microprocessors, microarchitectural design becomes over-challenging. Design space exploration (DSE) of microarchitecture configurations to obtain high-quality designs with different PPA trade-offs is time-consuming,...