research-article

B-open Defect: A Novel Defect Model in FinFET Technology

Authors:

Victor Champac,

Michel RenovellAuthors Info & Claims

ACM Journal on Emerging Technologies in Computing Systems, Volume 19, Issue 1

Article No.: 3, Pages 1 - 19

https://doi.org/10.1145/3564244

Published: 09 December 2022 Publication History

Abstract

This article proposes an electrical analysis of a new defect mechanism, to be named as b-open defect, which may occur in nanometer technologies due to the use of the Self-Aligned Double Patterning (SADP) technique. In metal lines making use of the SADP technique, a single dust particle may cause the simultaneous occurrence of a bridge defect and an open defect. When the two defects impact the same gates, the electrical effects of the bridge and the open combine and exhibit a new specific electrical behavior; we call this new defect behavior a b-open. As a consequence, existing test generation methodologies may miss defect detection. The electrical behavior of the b-open defect is first analyzed graphically and then validated through extensive SPICE simulations. The test pattern conditions to detect the b-open defect are finally determined, and it is shown that the b-open defect requires specific test generation.

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Cited By

Aguirre GGamez JChampac V(2024)Aggravated NBTI reliability due to hard-to-detect open defectsMicroelectronics Reliability10.1016/j.microrel.2024.115480160(115480)Online publication date: Sep-2024
https://doi.org/10.1016/j.microrel.2024.115480
Wunderlich HJafarzadeh HKourfali ALylina NNajafi-Haghi Z(2023)Test Aspects of System Health State Monitoring2023 IEEE 24th Latin American Test Symposium (LATS)10.1109/LATS58125.2023.10154480(1-2)Online publication date: 21-Mar-2023
https://doi.org/10.1109/LATS58125.2023.10154480

Index Terms

B-open Defect: A Novel Defect Model in FinFET Technology
1. Hardware
  1. Hardware test
    1. Defect-based test

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Published In

cover image ACM Journal on Emerging Technologies in Computing Systems

ACM Journal on Emerging Technologies in Computing Systems Volume 19, Issue 1

January 2023

187 pages

ISSN:1550-4832

EISSN:1550-4840

DOI:10.1145/3573312

Editor:
Ramesh Karri
Polytechnic Institute of New York University, USA

Issue’s Table of Contents

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected].

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Association for Computing Machinery

New York, NY, United States

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ACM Journals for the Design of Smart and Connected Systems

Publication History

Published: 09 December 2022

Online AM: 16 September 2022

Accepted: 28 August 2022

Revised: 27 May 2022

Received: 08 June 2021

Published in JETC Volume 19, Issue 1

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Cited By

Aguirre GGamez JChampac V(2024)Aggravated NBTI reliability due to hard-to-detect open defectsMicroelectronics Reliability10.1016/j.microrel.2024.115480160(115480)Online publication date: Sep-2024
https://doi.org/10.1016/j.microrel.2024.115480
Wunderlich HJafarzadeh HKourfali ALylina NNajafi-Haghi Z(2023)Test Aspects of System Health State Monitoring2023 IEEE 24th Latin American Test Symposium (LATS)10.1109/LATS58125.2023.10154480(1-2)Online publication date: 21-Mar-2023
https://doi.org/10.1109/LATS58125.2023.10154480

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