ABSTRACT
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The NTC powder materials were prepared chemically using acetates of (Mn–Co–Ni), as precursor materials. The sintering of the powders shows the existence of spinel phases at comparatively low temperature, i.e. 800°C. ‘Green’ thick films... more
The NTC powder materials were prepared chemically using acetates of (Mn–Co–Ni), as precursor materials. The sintering of the powders shows the existence of spinel phases at comparatively low temperature, i.e. 800°C. ‘Green’ thick films were prepared by admixing of the spinel powder, RuO2, lead free glass frit and the organic vehicle. Synthesized powders as well as the thermistor films were
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This paper reports the comparison of two fabrication techniques (viz. thin and thick film) for microstrip broadband filter in the X-band. The effect of bulk Al2O3 overlay (in pellet form and at different positions) on the characteristics... more
This paper reports the comparison of two fabrication techniques (viz. thin and thick film) for microstrip broadband filter in the X-band. The effect of bulk Al2O3 overlay (in pellet form and at different positions) on the characteristics of the broadband filter is also reported in this paper. The characteristics vary with the overlay position and thin film circuits seem to
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Environment friendly thick film NTC thermistors based on spinel-type semiconducting electroceramics of different compositions Mn1.85Co0.8Ni0.35O4, and Mn1.85Co0.8Ni0.35O4+RuO2 were fabricated on alumina substrate. The basic bulk ceramics... more
Environment friendly thick film NTC thermistors based on spinel-type semiconducting electroceramics of different compositions Mn1.85Co0.8Ni0.35O4, and Mn1.85Co0.8Ni0.35O4+RuO2 were fabricated on alumina substrate. The basic bulk ceramics and the fired thick films were characterized by thermo-gravimetric analysis, X-ray diffraction, and scanning electron microscopy with energy depressive X-ray analysis. Thick film samples showed compact and homogeneous microstructure. The electrical parameters of the
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Recent improvements in materials and processing technologies have dramatically increased the frequency range where ceramic thick film circuits can be utilized. Coupled with inherent advantages of thick film technology viz. low... more
Recent improvements in materials and processing technologies have dramatically increased the frequency range where ceramic thick film circuits can be utilized. Coupled with inherent advantages of thick film technology viz. low manufacturing cost, multilayering capability and relative insensitivity to substrate surface characteristics, such improvements have resulted in circuits that are penetrating the domain which was previously reserved to thin film
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As well known, the dielectric matrix of air-fireable thick film resistors (TFRs) presently used in hybrid microelectronics and passive components invariably consists in a high-lead silicate glass. However the actual trend is to restrict... more
As well known, the dielectric matrix of air-fireable thick film resistors (TFRs) presently used in hybrid microelectronics and passive components invariably consists in a high-lead silicate glass. However the actual trend is to restrict and possibly eliminate Pb from electronic components. Attempts to develop suiTab.RuO2-based or pyrochlore ruthenate-based Pb-Cd free TFRs has been only partially successful till now. We report here the preliminary results of a study aimed to investigate the feasibility of CaRuO3 perovskite-based lead-free TFRs. The results show that sheet resistances larger than 1 KΩ/sq. can be easily achieved in a controlled way, with hot temperature coefficients of resistance in the range of a few hundreds ppm/oC. In addition, the resistors do not exhibit negative structural features, like bleeding or devitrification, observed in previous attempts to develop reliable lead-free TFRs. Keywords: thick film resistors, hybrid microelectronics, perovskite ruthenate-based