74 HC 245
74 HC 245
1. General description
The 74HC245; 74HCT245 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL). The 74HC245; 74HCT245 is an octal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The 74HC245; 74HCT245 features an output enable input (OE) for easy cascading and a send/receive input (DIR) for direction control. OE controls the outputs so that the buses are effectively isolated. The 74HC245; 74HCT245 is similar to the 74HC640; 74HCT640 but has true (non-inverting) outputs.
2. Features
I I I I I Octal bidirectional bus interface Non-inverting 3-state outputs Multiple package options Complies with JEDEC standard no. 7A ESD protection: N HBM EIA/JESD22-A114-B exceeds 2000 V N MM EIA/JESD22-A115-A exceeds 200 V I Specied from 40 C to +85 C and from 40 C to +125 C
Min -
Typ 7 3.5 10 30
Max -
Unit ns pF pF pF
Type 74HC245
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 1: Quick reference data continued GND = 0 V; Tamb = 25 C; tr = tf = 6 ns. Symbol CI CI/O CPD Parameter input capacitance input/output capacitance power dissipation capacitance per transceiver VI = GND to VCC 1.5 V
[1]
Conditions
Min -
Typ 3.5 10 30
Max -
Unit pF pF pF
[1]
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.
4. Ordering information
Table 2: Ordering information Package Temperature range Name 74HC245N 74HC245D 74HC245PW 74HC245DB 74HC245BQ 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C DIP20 SO20 TSSOP20 SSOP20 Description plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm Version SOT146-1 SOT163-1 Type number
plastic thin shrink small outline package; 20 leads; SOT360-1 body width 4.4 mm plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad at package no leads; 20 terminals; body 2.5 4.5 0.85 mm DIP20 SO20 TSSOP20 SSOP20 plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm SOT146-1 SOT163-1
plastic thin shrink small outline package; 20 leads; SOT360-1 body width 4.4 mm plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
DHVQFN20 plastic dual-in-line compatible thermal enhanced SOT764-1 very thin quad at package no leads; 20 terminals; body 2.5 4.5 0.85 mm
2 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
5. Functional diagram
DIR OE
19
A0 B0 18 19 1 G3 3EN1 3EN2
A1 B1 17
A2 B2 2 16 3 B3 15 4 5 B4 14 6 7 B5 13 8 9 B6
1 2 18 17 16 15 14 13 12 11
mna175
A3
A4
A5
A6 12
A7 B7 11
mna174
3 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
6. Pinning information
6.1 Pinning
terminal 1 index area A0 A1 DIR A0 A1 A2 A3 A4 A5 A6 A7 1 2 3 4 5 6 7 8 9 20 VCC 19 OE 18 B0 17 B1 16 B2 15 B3 14 B4 13 B5 12 B6 11 B7
001aac431
2 3 4 5
20 VCC 19 OE 18 B0 17 B1 16 B2 15 B3 14 B4 13 B5 12 B6 B7 11
A2 A3 A4 A5 A6 A7
6 7 8 9 GND 10 GND(1)
245
DIR
245
001aac432
GND 10
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input
Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Description direction control data input/output data input/output data input/output data input/output data input/output data input/output data input/output data input/output ground (0 V) data input/output data input/output data input/output data input/output data input/output data input/output
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Pin description continued Pin 17 18 19 20 Description data input/output data input/output output enable input (active LOW) supply voltage
7. Functional description
7.1 Function table
Table 4: Input OE L L H
[1]
H = HIGH voltage level; L = LOW voltage level; X = dont care; Z = high-impedance OFF-state.
8. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC, IGND Tstg Ptot Parameter supply voltage input diode current output diode current output source or sink current VCC or GND current storage temperature total power dissipation DIP20 package SO20, SSOP20, TSSOP20 and DHVQFN20 packages
[1]
[1]
Conditions VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V VO = 0.5 V to VCC + 0.5 V
Min 0.5 65 -
Unit V mA mA mA mA C mW mW
For DIP20 packages: above 70 C, Ptot derates linearly with 12 mW/K. For SO20 packages: above 70 C, Ptot derates linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 C, Ptot derates linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 C, Ptot derates linearly with 4.5 mW/K.
5 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Type 74HC245
6 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 7: Static characteristics type 74HC245 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VOL Parameter LOW-level output voltage Conditions VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V ILI IOZ ICC CI CI/O VIH input leakage current OFF-state output current quiescent supply current input capacitance input/output capacitance HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V ILI IOZ ICC input leakage current OFF-state output current quiescent supply current VI = VCC or GND; VCC = 6.0 V VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
9397 750 14502
Max 0.1 0.1 0.1 0.26 0.26 0.1 0.5 8.0 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1.0 5.0 80
Unit V V V V V A A A pF pF V V V V V V V V V V V V V V V V A A A
VI = VCC or GND; VCC = 6.0 V VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V
Tamb = 40 C to +85 C
7 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 7: Static characteristics type 74HC245 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIL Parameter LOW-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V ILI IOZ ICC input leakage current OFF-state output current quiescent supply current VI = VCC or GND; VCC = 6.0 V VI = VIH or VIL; VO = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 1.9 4.4 5.9 3.7 5.2 Min Typ 0.1 0.1 0.1 0.4 0.4 1.0 10.0 160 V V V V V A A A V V V V V Max 0.5 1.35 1.8 Unit V V V
Table 8: Static characteristics type 74HCT245 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH VIL VOH Parameter HIGH-level input voltage LOW-level input voltage HIGH-level output voltage Conditions VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A VI = VCC or GND; IO = 0 A; VCC = 5.5 V 0 0.15 0.1 0.26 0.1 0.5 V V A A 4.4 3.98 4.5 4.32 V V Min 2.0 Typ 1.6 1.2 Max 0.8 Unit V V Tamb = 25 C
ICC
8.0
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 8: Static characteristics type 74HCT245 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol ICC Parameter additional quiescent supply current per input pin An or Bn inputs OE input DIR input CI CI/O VIH VIL VOH input capacitance input/output capacitance HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A VI = VCC or GND; IO = 0 A; VCC = 5.5 V VI = VCC 2.1 V; other inputs at VI = VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 6.0 mA ILI IOZ input leakage current OFF-state output current VI = VCC or GND; VCC = 5.5 V VI = VIH or VIL; VCC = 5.5 V; VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A 0.1 0.4 1.0 10 V V A A 4.4 3.7 V V 2.0 180 675 405 0.8 A A A V V 0.1 0.33 1.0 5.0 V V A A 4.4 3.84 V V Conditions VI = VCC 2.1 V; other inputs at VI = VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A 2.0 40 150 90 3.5 10 144 540 324 0.8 A A A pF pF V V Min Typ Max Unit
Tamb = 40 C to +85 C
ICC ICC
quiescent supply current additional quiescent supply current per input pin An or Bn inputs OE input DIR input
80
Tamb = 40 C to +125 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage
9 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 8: Static characteristics type 74HCT245 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol ICC ICC Parameter quiescent supply current additional quiescent supply current per input pin An or Bn inputs OE input DIR input Conditions VI = VCC or GND; IO = 0 A; VCC = 5.5 V VI = VCC 2.1 V; other inputs at VI = VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A 196 735 441 A A A Min Typ Max 160 Unit A
25 9 7 7 30 11 9 41 15 12 14 5 4 30
90 18 15 150 30 26 150 30 26 60 12 10 -
ns ns ns ns ns ns ns ns ns ns ns ns ns pF
Tamb = 40 C to +85 C tPHL, tPLH propagation delay An to Bn or Bn see Figure 5 to An VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 115 23 20 ns ns ns
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 9: Dynamic characteristics type 74HC245 continued GND = 0 V; test circuit see Figure 7. Symbol tPZH, tPZL Parameter 3-state output enable time OE to An or OE to Bn Conditions see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPHZ, tPLZ 3-state output disable time OE to An or OE to Bn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tTHL, tTLH output transition time see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Tamb = 40 C to +125 C tPHL, tPLH propagation delay An to Bn or Bn see Figure 5 to An VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPZH, tPZL 3-state output enable time OE to An or OE to Bn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tPHZ, tPLZ 3-state output disable time OE to An or OE to Bn see Figure 6 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tTHL, tTLH output transition time see Figure 5 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
[1] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.
Min -
Typ -
Unit ns ns ns ns ns ns ns ns ns
ns ns ns ns ns ns ns ns ns ns ns ns
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
Table 10: Dynamic characteristics type 74HCT245 GND = 0 V; test circuit see Figure 7. Symbol tPHL, tPLH Parameter Conditions Min Typ Max Unit Tamb = 25 C propagation delay An to Bn or Bn see Figure 5 to An VCC = 4.5 V VCC = 5.0 V; CL = 15 pF tPZH, tPZL tPHZ, tPLZ tTHL, tTLH CPD 3-state output enable time OE to An or OE to Bn 3-state output disable time OE to An or OE to Bn output transition time power dissipation capacitance per transceiver VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 5 VI = GND to VCC 1.5 V
[1]
12 10 16 16 5 30
22 30 30 12 -
ns ns ns ns ns pF
Tamb = 40 C to +85 C tPHL, tPLH tPZH, tPZL tPHZ, tPLZ tTHL, tTLH tPHL, tPLH tPZH, tPZL tPHZ, tPLZ tTHL, tTLH
[1]
propagation delay An to Bn or Bn VCC = 4.5 V; see Figure 5 to An 3-state output enable time OE to An or OE to Bn 3-state output disable time OE to An or OE to Bn output transition time VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 5
28 38 38 15 33 45 45 18
ns ns ns ns ns ns ns ns
Tamb = 40 C to +125 C propagation delay An to Bn or Bn VCC = 4.5 V; see Figure 5 to An 3-state output enable time OE to An or OE to Bn 3-state output disable time OE to An or OE to Bn output transition time VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 6 VCC = 4.5 V; see Figure 5
CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
12. Waveforms
VI An, Bn input GND t PHL VOH Bn, An output VOL t THL VM VM 10 % t TLH
001aac433
VM
VM
t PLH 90 %
Measurement points are given in Table 11. VOL and VOH are typical voltage output drop that occur with the output load.
Fig 5. Input (An, Bn) to output (Bn, An) propagation delays and output transition times
tr VI OE input GND VCC 10 % tPLZ output LOW-to-OFF OFF-to-LOW VOL tPHZ output HIGH-to-OFF OFF-to-HIGH GND outputs enabled outputs disabled VOH 90 % 90 % VM
tf
tPZL
VM 10 % tPZH
VM
outputs enabled
001aac479
Measurement points are given in Table 11. VOL and VOH are typical voltage output drop that occur with the output load.
Fig 6. 3-state output enable and disable times Table 11: Type 74HC245 74HCT245 Measurement points Input VM 0.5VCC 1.3 V Output VM 0.5VCC 1.3 V
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
VCC VI D.U.T RT CL VO RL = 1 k
VCC
PULSE GENERATOR
open 50 pF
mgk563
Test data is given in Table 12. Denitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistor.
Fig 7. Load circuitry for switching times Table 12: Type 74HC245 74HCT245 Test data Input VI VCC 3V tr, tf 6 ns 6 ns Test tPHL, tPLH open open tPZH, tPHZ GND GND tPZL, tPLZ VCC VCC
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
D seating plane
ME
A2
A1
c Z e b1 b 20 11 MH w M (e 1)
pin 1 index E
10
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
(1)
e 2.54 0.1
e1 7.62 0.3
w 0.254 0.01
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC MS-001 JEITA SC-603 EUROPEAN PROJECTION
15 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
SOT163-1
A X
c y HE v M A
Z 20 11
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
8 o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
16 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A X
c y HE v M A
Z 20 11
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
17 of 22
Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
c y HE v M A
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm
A A1 E c
detail X
e1 b 9 v M C A B w M C y1 C
C y
1 Eh 20
10 e 11
19 Dh 0
12 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.6 4.4 Dh 3.15 2.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 3.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT764-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
The format of this data sheet is redesigned to comply with the new presentation and information standard of Philips Semiconductors Section 4 Ordering information, Section 6 Pinning information and Section 13 Package outline are modied to include the DHVQFN20 package. Product specication -
74HC_HCT245_CNV_2
19930930
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
III
Product data
Production
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
16. Denitions
Short-form specication The data in a short-form specication is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values denition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specied use without further testing or modication.
17. Disclaimers
Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specied.
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Philips Semiconductors
74HC245; 74HCT245
Octal bus tranceiver; 3-state
19. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 12 13 14 15 16 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Contact information . . . . . . . . . . . . . . . . . . . . 21