74AHC1G32; 74AHCT1G32

2-input OR gate
Rev. 07 14 May 2009 Product data sheet

1. General description
74AHC1G32 and 74AHCT1G32 are high-speed Si-gate CMOS devices. They provide a 2-input OR function. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.

2. Features
I Symmetrical output impedance I High noise immunity I ESD protection: N HBM JESD22-A114E: exceeds 2000 V N MM JESD22-A115-A: exceeds 200 V N CDM JESD22-C101C: exceeds 1000 V I Low power dissipation I Balanced propagation delays I SOT353-1 and SOT753 package options I Specied from 40 C to +125 C

3. Ordering information
Table 1. Ordering information Package Temperature range 74AHC1G32GW 74AHCT1G32GW 74AHC1G32GV 74AHCT1G32GV 40 C to +125 C SC-74A 40 C to +125 C Name TSSOP5 Description plastic thin shrink small outline package; 5 leads; body width 1.25 mm plastic surface-mounted package; 5 leads Version SOT353-1 SOT753 Type number

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

4. Marking
Table 2. Marking codes Marking code AG CG A32 C32 Type number 74AHC1G32GW 74AHCT1G32GW 74AHC1G32GV 74AHCT1G32GV

5. Functional diagram

1 2

B A

1 2

mna164

mna165

Fig 1.

Logic symbol

Fig 2.

IEC logic symbol

B Y A
mna166

Fig 3.

Logic diagram

6. Pinning information
6.1 Pinning
74AHC1G32 74AHCT1G32
B A 1 2 5 VCC

GND

3
001aak129

Fig 4. Pin conguration SOT353-1 (TSSOP5) and SOT753 (SC-74A)

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

2 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

6.2 Pin description

Table 3. Symbol B A GND Y VCC Pin description Pin 1 2 3 4 5 Description data input data input ground (0 V) data output supply voltage

7. Functional description
Table 4. Function table H = HIGH voltage level; L = LOW voltage level Inputs A L L H H B L H L H Output Y L H H H

8. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI IIK IOK IO ICC IGND Tstg Ptot
[1] [2]

Parameter supply voltage input voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation

Conditions

Min 0.5 0.5

Max +7.0 +7.0 20 25 75 +150 250

Unit V V mA mA mA mA mA C mW

VI < 0.5 V VO < 0.5 V or VO > VCC + 0.5 V 0.5 V < VO < VCC + 0.5 V
[1]

20 75 65

Tamb = 40 C to +125 C

[2]

The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For both TSSOP5 and SC-74A packages: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K.

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

3 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

9. Recommended operating conditions

Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC VI VO Tamb t/V supply voltage input voltage output voltage ambient temperature input transition rise and fall rate VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Conditions 74AHC1G32 Min 2.0 0 0 40 Typ 5.0 +25 Max 5.5 5.5 VCC +125 100 20 74AHCT1G32 Min 4.5 0 0 40 Typ 5.0 +25 Max 5.5 5.5 VCC +125 20 V V V C ns/V ns/V Unit

10. Static characteristics

Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter For type 74AHC1G32 VIH HIGH-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VIL LOW-level input voltage VCC = 2.0 V VCC = 3.0 V VCC = 5.5 V VOH HIGH-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V IO = 50 A; VCC = 3.0 V IO = 50 A; VCC = 4.5 V IO = 4.0 mA; VCC = 3.0 V IO = 8.0 mA; VCC = 4.5 V VOL LOW-level VI = VIH or VIL output voltage IO = 50 A; VCC = 2.0 V IO = 50 A; VCC = 3.0 V IO = 50 A; VCC = 4.5 V IO = 4.0 mA; VCC = 3.0 V IO = 8.0 mA; VCC = 4.5 V II ICC CI input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V 1.5 2.1 3.85 1.9 2.9 4.4 2.58 3.94 2.0 3.0 4.5 0 0 0 1.5 0.5 0.9 1.65 0.1 0.1 0.1 0.36 0.36 0.1 1.0 10 1.5 2.1 3.85 1.9 2.9 4.4 2.48 3.8 0.5 0.9 1.65 0.1 0.1 0.1 0.44 0.44 1.0 10 10 1.5 2.1 3.85 1.9 2.9 4.4 2.40 3.70 0.5 0.9 1.65 0.1 0.1 0.1 0.55 0.55 2.0 40 10 V V V V V V V V V V V V V V V V A A pF Conditions Min 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V input capacitance

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

4 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

Table 7. Static characteristics continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter For type 74AHCT1G32 VIH VIL VOH HIGH-level input voltage LOW-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V 2.0 0.8 2.0 0.8 2.0 0.8 V V Conditions Min 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max

HIGH-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA LOW-level VI = VIH or VIL; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA input leakage current VI = 5.5 V or GND; VCC = 0 V to 5.5 V

4.4 3.94 -

4.5 0 -

0.1 0.36 0.1 1.0 1.35

4.4 3.8 -

0.1 0.44 1.0 10 1.5

4.4 3.70 -

0.1 0.55 2.0 40 1.5

V V V V A A mA

VOL

II ICC ICC

supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V input capacitance

CI

1.5

10

10

10

pF

11. Dynamic characteristics

Table 8. Dynamic characteristics GND = 0 V; tr = tf = 3.0 ns. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter For type 74AHC1G32 tpd propagation delay A and B to Y VCC = 3.0 V to 3.6 V CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC
[4] [3] [1] [2]

Conditions Min

25 C Typ Max

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

4.4 6.3 3.2 4.6 16

7.9 11.4 5.5 7.5 -

1.0 1.0 1.0 1.0 -

9.5 13.0 6.5 8.5 -

1.0 1.0 1.0 1.0 -

10.0 14.5 7.0 9.5 -

ns ns ns ns pF

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

5 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

Table 8. Dynamic characteristics continued GND = 0 V; tr = tf = 3.0 ns. For waveform see Figure 5. For test circuit see Figure 6. Symbol Parameter For type 74AHCT1G32 tpd propagation delay A and B to Y; see Figure 5; VCC = 4.5 V to 5.5 V CL = 15 pF CL = 50 pF CPD power per buffer; dissipation CL = 50 pF; f = 1 MHz; capacitance VI = GND to VCC
tpd is the same as tPLH and tPHL. Typical values are measured at VCC = 3.3 V. Typical values are measured at VCC = 5.0 V. CPD is used to determine the dynamic power dissipation PD (W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts.
[4] [1] [3]

Conditions Min

25 C Typ Max

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

3.3 4.8 17

6.9 7.9 -

1.0 1.0 -

8.0 9.0 -

1.0 1.0 -

9.0 10 -

ns ns pF

[1] [2] [3] [4]

12. Waveforms

A, B input

VM

tPHL

tPLH

Y output

VM
mna167

Measurement points are given in Table 9.

Fig 5. Table 9.

The input (A and B) to output (Y) propagation delays Measurement points Input VI VM 0.5 VCC 1.5 V GND to VCC GND to 3.0 V Output VM 0.5 VCC 0.5 VCC

Type number 74AHC1G32 74AHCT1G32

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

6 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

VCC PULSE GENERATOR VI DUT

RT CL

VO

mna101

Test data is given in Table 8. Denitions for test circuit: CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator.

Fig 6.

Load circuitry for switching times

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

7 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

13. Package outline

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1

A X

c y HE v M A

4
A2 A1 (A3) A

1
e e1 bp

3
w M detail X

Lp L

1.5 scale

3 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.1 0 A2 1.0 0.8 A3 0.15 bp 0.30 0.15 c 0.25 0.08 D(1) 2.25 1.85 E(1) 1.35 1.15 e 0.65 e1 1.3 HE 2.25 2.0 L 0.425 Lp 0.46 0.21 v 0.3 w 0.1 y 0.1 Z(1) 0.60 0.15 7 0

Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT353-1 REFERENCES IEC JEDEC MO-203 JEITA SC-88A EUROPEAN PROJECTION ISSUE DATE 00-09-01 03-02-19

Fig 7.

Package outline SOT353-1 (TSSOP5)

NXP B.V. 2009. All rights reserved.

74AHC_AHCT1G32_7

Product data sheet

Rev. 07 14 May 2009

8 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

Plastic surface-mounted package; 5 leads

SOT753

HE

v M A

A A1 c

3
detail X

Lp

bp

w M B

1 scale

2 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 0.100 0.013 bp 0.40 0.25 c 0.26 0.10 D 3.1 2.7 E 1.7 1.3 e 0.95 HE 3.0 2.5 Lp 0.6 0.2 Q 0.33 0.23 v 0.2 w 0.2 y 0.1

OUTLINE VERSION SOT753

REFERENCES IEC JEDEC JEITA SC-74A

EUROPEAN PROJECTION

ISSUE DATE 02-04-16 06-03-16

Fig 8.

Package outline SOT753 (SC-74A)

NXP B.V. 2009. All rights reserved.

74AHC_AHCT1G32_7

Product data sheet

Rev. 07 14 May 2009

9 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

14. Abbreviations
Table 10. Acronym CDM DUT ESD HBM MM TTL Abbreviations Description Charged Device Model Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic

15. Revision history

Table 11. Revision history Release date 20090514 Data sheet status Product data sheet Product data sheet Product specication Product specication Product specication Product specication Product specication Change notice Supersedes 74AHC_AHCT1G32_6 74AHC_AHCT1G32_5 74AHC_AHCT1G32_4 74AHC_AHCT1G32_3 74AHC_AHCT1G32_2 74AHC_AHCT1G32_N_1 Document ID 74AHC_AHCT1G32_7 Modications: 74AHC_AHCT1G32_6 74AHC_AHCT1G32_5 74AHC_AHCT1G32_4 74AHC_AHCT1G32_3 74AHC_AHCT1G32_2

Pin conguration SOT353-1 (TSSOP5) and SOT753 (SC-74A) drawing corrected.

20070702 20020605 20020326 20010222 19990127

74AHC_AHCT1G32_N_1 19981125

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

10 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

16. Legal information

16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualication Production

Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

16.3 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com For sales ofce addresses, please send an email to: salesaddresses@nxp.com

74AHC_AHCT1G32_7

NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 07 14 May 2009

11 of 12

NXP Semiconductors

74AHC1G32; 74AHCT1G32
2-input OR gate

18. Contents
1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

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All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 14 May 2009 Document identifier: 74AHC_AHCT1G32_7