RC: 0.1 F, 50 O (P R = 1 W) 1) For solder connection. Permissible current for plug connection see DlN lEC 760E and DlN 46249 part 1 2) Freely suspended or mounted on an insulator 3) Mounted on a painted metal sheet of min. 250 x 250 x 1 mm SKD V RSM V RRM , V DRM l D = 50 1) A (full conduction) V V (T c = 127 C) 500 400 SKD 51/04 900 800 SKD 51/08 1300 1200 SKD 51/12 1500 1400 SKD 51/14 1700 1600 SKD 51/16 1900 1800 SKD 51/18 Symbol Conditions Values Units l D T c = 127 C 50 A T a = 45 C; isolated 2) 7 A T a = 45 C; chassis 3) 18 A T a = 45 C; R4A/120 27 A T a = 45 C; P5A/100 31 A l FSM T vj = 25 C; 10 ms 775 A T vj = 150 C; 10 ms 700 A it T vj = 25 C; 8,3 ... 10 ms 3000 As T vj = 150 C; 8,3 ... 10 ms 2450 As V F T vj = 25 C; l F = 75 A max. 1,45 V V (TO) T vj = 150 C max. 0,8 V r T T vj = 150 C max. 8,5 mO l RD T vj = 25 C; V DD = V DRM ; V RD = V RRM max. 0,2 mA T vj = 150 C; V RD = V RRM 4 mA t rr T vj = 25 C; l F = l R = 1A 5 s R th(j-c) per diode 1,1 K/W total 0,183 K/W R th(c-s) total 0,1 K/W R th(j-a) isolated 2) (chassis 3) ) 9 (3,15) K/W T vj - 40 ... +150 C T stg - 40 ... +125 C V isol a. c. 50 Hz; r.m.s.; 1 s / 1 min. 3600 ( 3000 ) V M s to heatsink 4,5 15 % Nm M t m 97 g Case G 51 SKD 51 1 26-06-2007 SCH by SEMIKRON Fig. 3L Power dissipation vs. output current Fig. 3R Power dissipation vs. case temperature Fig. 6 Rated overload characteristics vs. time SKD 51 2 26-06-2007 SCH by SEMIKRON Dimensions in mm Case G 51 * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. SKD 51 3 26-06-2007 SCH by SEMIKRON