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Frequency Generator & Integrated Buffers For Celeron & PII/III™

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The document provides details about an integrated circuit chip including its purpose, features, specifications and electrical characteristics.

The chip is a frequency generator and buffer chip used in computer motherboards to generate clock signals for various components like the CPU, memory and PCI bus.

The chip can generate clock signals between 100-150MHz, supports power management modes, uses spread spectrum technology for EMI control and has tight timing specifications between its outputs.

Integrated ICS9250-08

Circuit
Systems, Inc.

Frequency Generator & Integrated Buffers for Celeron & PII/III

Recommended Application: Pin Configuration


BX, Appollo Pro 133 type of chip set.
VDDREF 1 56 VDDLIOAPIC
Output Features: *FS2/REF1 2 55 IOAPIC0
3 - CPUs @2.5V, up to 150MHz. *PCI_STOP/REF0 3 54 IOAPIC_F
GND 4 53 GND
17 - SDRAM @ 3.3V, up to 150MHz. X1 5 52 CPUCLK_F
7 - PCI @3.3V X2 6 51 CPUCLK1
VDDPCI 7 50 VDDLCPU
2 - IOAPIC @ 2.5V *MODE/PCICLK_F 8 49 CPUCLK2
1 - 48MHz, @3.3V fixed. **FS3/PCICLK0 9 48 GND
GND 10 47 CPU_STOP#
1 - 24MHz @ 3.3V

ICS9250-08
PCICLK1 11 46 SDRAM_F
2 - REF @3.3V, 14.318MHz. PCICLK2 12 45 VDDSDR
PCICLK3 13 44 SDRAM0
Features: PCICLK4 14 43 SDRAM1
Up to 150MHz frequency support VDDPCI 15 42 GND
Support power management: CPU, PCI, stop and PCICLK5 16 41 SDRAM2
Power down Mode form I2C programming. BUFFERIN
SDRAM11
17
18
40
39
SDRAM3
SDRAM4
Spread spectrum for EMI control (0 to -0.5%, SDRAM10 19 38 SDRAM5
0.25%). VDDSDR 20 37 VDDSDR
SDRAM9 21 36 SDRAM6
Uses external 14.318MHz crystal SDRAM8 22 35 SDRAM7
Key Specifications: GND 23 34 GND
CPU CPU: <175ps SDRAM15 24 33 SDRAM12
SDRAM14 25 32 SDRAM13
CPU PCI: min = 1ns max = 4ns GND 26 31 VDD48

PCI PCI: <250ps


SDRAM - SDRAM: <500ps
2
I C{ SDATA
SCLK
27
28
30
29
24MHz/FS0*
48MHz/FS1*

56-Pin SSOP
* Internal Pull-up Resistor of 240K to 3.3V on indicated inputs
** Internal Pull-down resistor of 240K to GND on indicated inputs.
Block Diagram

PLL2 48MHz

2 24MHz
Functionality
CPU
IOAPIC_F FS3 FS2 FS1 FS0 PCICLK (MHz)
(MHz)
X1 XTAL
STOP IOAPIC0
1 1 1 1 133 33.3 (CPU/4)
X2 OSC
1 1 1 0 124 31 (CPU/4)
REF [1:0] 1 1 0 1 150 37.5 (CPU/4)
2
1 1 0 0 140 35 (CPU/4)
CPUCLK_F
PLL1 1 1 0 1 1 105 35 (CPU/3)
Spread
Spectrum STOP CPUCLK [2:1]
1 0 1 0 110 36.67 (CPU/3)
2
1 0 0 1 115 38.33 (CPU/3)
FS[3:0]
MODE
LATCH 1 0 0 0 120 40.00 (CPU/3)
PCI 0 1 1 1 100.3 33.43 (CPU/3)
4 CLOCK STOP
6 PCICLK [5:0]
DIVDER
POR 0 1 1 0 133 44.33 (CPU/3)
CPU_STOP# PCICLK_F
0 1 0 1 112 37.33 (CPU/3)
Control 0 1 0 0 103 34.33 (CPU/2)
PCI_STOP# Logic 0 0 1 1 66.8 33.40 (CPU/2)
0 0 1 0 83.3 41.65 (CPU/2)
2
I C { SDATA
SCLK Config.
STOP
16
SDRAM [15:0]
0 0 0 1 75 37.5 (CPU/2)
Reg.
0 0 0 0 124 41.33 (CPU/2)
BUFFERIN SDRAM_F

0378J05/17/05
ICS9250-08

Pin Configuration
PIN NUMBER PIN NAME TYPE DESCRIPTION
REF1 OUT 14.318 MHz reference clock output
2
FS21 IN Latched frequency select input. Has pull-up to VDDPCI
REF0 OUT 14.318MHz reference clock output
3 Halts PCICLK [5:0] at logic "0" level when low.
P C I _ S TO P #1 IN
( i n m o b i l e, M O D E = 0 )
4, 10, 23, 26, 34,
GND PWR Ground.
42, 48, 53
5 X1 IN 14.318MHz input. Has internal load cap, (nominal 33pF).
Cr ystal output. Has inter nal load cap (33pF) and feedback
6 X2 OUT
resistor to X1
PCICLK_F OUT Free r unning BUS clock not affected by PCI_STOP#
8 1 Latched input for MODE select. Conver ts pin 3 to PCI_STOP#
MODE IN
when low for power management.
FS31 IN L a t c h e d f r e q u e n c y s e l e c t i n p u t , p u l l - d ow n
9
PCICLK0 OUT Free r unning BUS clock not affected by PCI_STOP#

16, 14, 13, 12, 11 PCICLK [5:1] OUT PCI Clock Outputs.

17 BU F F E R I N IN Input for Buffers


27 SDATA IN Ser ial data in for ser ial config por t. (I2C)
28 SCLK IN Clock input for ser ial config por t. (I2C)
24MHz OUT 24MHz clock output for Super I/O or FD.
30
FS01 IN Latched frequency select input. Has pull-up to VDD4.
48MHz OUT 48MHz clock output for USB.
29
FS11 IN Latched frequency select input. Has pull-up to VDD2.
1, 7, 15, 20, VDDPCI, VDDREF,
PWR Nominal 3.3V power supply, see power groups for function.
31, 37, 45 VDDSDR, VDD48
24, 25, 32, 33, 18,
19, 21, 22, 35, 36,
SDRAM [15:0] OUT SDRAM clocks
38, 39, 40, 41, 43,
44
46 SDRAM_F OUT Free r unning SDRAM clock Not affected by CPU_STOP#

Halts CPUCLK [2:1], IOAPIC0, SDRAM [15:0]


47 C P U _ S TO P# IN
clocks at logic "0" level when low.
VDDLCPU,
50, 56 PWR CPU and IOAPIC clock buffer power supply, 2.5V nominal.
V D D L I OA P I C
55 I OA P I C 0 OUT IOAPIC clock output. (14.318 MHz) Poweredby VDDLIOAPIC
51, 49 CPUCLK [2:1] OUT CPU Output clocks. Powered by VDDL2 (60 or 66.6MHz)
52 CPUCLK_F OUT Free r unning CPU output clock. Not affected ty the CPU_STOP#.
Freer unning IOAPIC clock output. Not affected by the
54 I OA P I C _ F OUT
CPU_STOP# (14.31818 MHz) Powered by VDDLIOAPIC
Notes:
1: Bidirectional input/output pins, input logic levels are latched at internal power-on-reset. Use
10Kohm resistor to program logic Hi to VDD or GND for logic low.
0378J05/17/05

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ICS9250-08

General Description Power Groups


The ICS9250-08 is the single chip clock solution for VDDREF = REF [1:0], X1, X2
Desktop/designs using BX, Appollo Pro 133 type of chip VDDPCI = PCICLK_F, PCICLK [5:0]
sets. It provides all necessary clock signals for such a VDDSDR = SDRAM [15:0], supply for PLL core,
system. VDD48 = 48MHz, 24MHz
VDDLIOAPIC = IOAPIC_F
Spread spectrum may be enabled through I 2 C VDDLCPU = CPUCLK_F [2:1]
programming.
Spread spectrum typically reduces system EMI by 8dB to
10dB. This simplifies EMI qualification without resorting
to
board design iterations or costly shielding. The ICS9250-
08
employs a proprietary closed loop design, which tightly
controls the percentage of spreading over process and
temperature variations.

Serial programming I2C interface allows changing functions,


stop clock programming and frequency selection.

Mode Pin - Power Management Input Control


MODE
(Latched Input)
PCI_STOP#
0
(Input)
REF0
1
(Output)

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ICS9250-08

General I2C serial interface information


The information in this section assumes familiarity with I2C programming.
For more information, contact ICS for an I2C programming application note.

How to Write: How to Read:


Controller (host) sends a start bit. Controller (host) will send start bit.
Controller (host) sends the write address D2 (H) Controller (host) sends the read address D3 (H)
ICS clock will acknowledge ICS clock will acknowledge
Controller (host) sends a dummy command code ICS clock will send thebyte count
ICS clock will acknowledge Controller (host) acknowledges
Controller (host) sends a dummy byte count ICS clock sends first byte (Byte 0) through byte 5
ICS clock will acknowledge Controller (host) will need to acknowledge each byte
Controller (host) starts sending first byte (Byte 0) Controller (host) will send a stop bit
through byte 5
ICS clock will acknowledge each byte one at a time.
Controller (host) sends a Stop bit

How to Write:
Controller (Host) ICS (Slave/Receiver)
Start Bit How to Read:
Address Controller (Host) ICS (Slave/Receiver)
D2(H) Start Bit
ACK Address
Dummy Command Code D3(H)
ACK ACK
Dummy Byte Count Byte Count
ACK ACK
Byte 0 Byte 0
ACK ACK
Byte 1 Byte 1
ACK ACK
Byte 2 Byte 2
ACK ACK
Byte 3 Byte 3
ACK ACK
Byte 4 Byte 4
ACK ACK
Byte 5 Byte 5
ACK ACK
Stop Bit Stop Bit

Notes:
1. The ICS clock generator is a slave/receiver, I2C component. It can read back the data stored in the latches for
verification. Read-Back will support Intel PIIX4 "Block-Read" protocol.
2. The data transfer rate supported by this clock generator is 100K bits/sec or less (standard mode)
3. The input is operating at 3.3V logic levels.
4. The data byte format is 8 bit bytes.
5. To simplify the clock generator I2C interface, the protocol is set to use only "Block-Writes" from the controller.
The bytes must be accessed in sequential order from lowest to highest byte with the ability to stop after any
complete byte has been transferred. The Command code and Byte count shown above must be sent, but the
data is ignored for those two bytes. The data is loaded until a Stop sequence is issued.
6. At power-on, all registers are set to a default condition, as shown.
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ICS9250-08

Serial Configuration Command Bitmap


Byte0: Functionality and Frequency Select Register (default = 0)

Bit Description PWD


0: 0.25% Spread Spectrum Modulation
Bit 7 0
1: -0.5% Spread Spectrum Modulation
Bit2 Bit6 Bit5 Bit4 CPU clock PCI
0111 100.3 33.43 (CPU/3)
0110 133 44.33 (CPU/3)
0101 112 37.33 (CPU/3)
0100 103 34.3 (CPU/3) Note1
0011 66.8 33.4 (CPU/2)
0010 83.3 41.65(CPU/2)
0001 75 37.5 (CPU/2)
Bit 2, 0000 124 41.33 (CPU/3)
Bit 6:4 1111 133 33.25 (CPU/4)
1110 124 31.00 (CPU/4)
1101 150 37.50 (CPU/4)
1100 140 35.00 (CPU/4)
1011 105 35.00 (CPU/3)
1010 110 36.67 (CPU/3)
1001 115 38.33 (CPU/3)
1000 120 40.00 (CPU/3)
0 - Frequency is selected by hardware select, Latched
Bit 3 Inputs 0
1 - Frequency is selected by Bit 2, 6:4 (above)
0 - Normal
Bit 1 0
1 - Spread Spectrum Enabled (Center Spread)
0 - Running
Bit 0 0
1- Tristate all outputs

Note 1. Default at Power-up will be for latched logic inputs to define frequency. Bits
2, 4, 5, 6 are default to 0000, and if bit 3 is written to a 1 to use Bits 2, 6:4,
then these should be defined to desired frequency at same write cycle.

Note: PWD = Power-Up Default

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ICS9250-08

Byte 1: CPU, Active/Inactive Register Byte 2: PCI, Active/Inactive Register


(1= enable, 0 = disable) (1= enable, 0 = disable)
BIT PIN# PWD DESCRIPTION BIT PIN# PWD DESCRIPTION
Bit 7 - 1 R e s e r ve d Bit 7 - 1 R e s e r ve d
Bit 6 - 1 R e s e r ve d Bit 6 8 1 PCICLK_F (Act/Inact)
Bit 5 - 1 R e s e r ve d Bit 5 16 1 PCICLK5 (Act/Inact)
Bit 4 - 1 R e s e r ve d Bit 4 14 1 PCICLK4 (Act/Inact)
Bit 3 46 1 SDRAM_F (Act/Inact) Bit 3 13 1 PCICLK3 (Act/Inact)
Bit 2 49 1 CPUCLK2 (Act/Inact) Bit 2 12 1 PCICLK2 (Act/Inact)
Bit 1 51 1 CPUCLK1 (Act/Inact) Bit 1 11 1 PCICLK1 (Act/Inact)
Bit 0 52 1 CPUCLK_F (Act/Inact) Bit 0 9 1 PCICLK0 (Act/Inact)

Byte 3: SDRAM, Active/Inactive Register Byte 4: Reserved , Active/Inactive Register


(1= enable, 0 = disable) (1= enable, 0 = disable)

BIT PIN# PWD DESCRIPTION BIT PIN# PWD DESCRIPTION


Bit 7 - 1 R e s e r ve d Bit 7 - X Latched FS0#
Bit 6 - 1 R e s e r ve d Bit 6 - 1 R e s e r ve d
Bit 5 30 1 24MHz (Act/Inact) Bit 5 - 1 R e s e r ve d
Bit 4 29 1 48MHz (Act/Inact) Bit 4 - X Latched FS1#
33, 32, Bit 3 - 1 R e s e r ve d
Bit 3 1 SDRAM(12:15) (Act/Inact)
25, 24 Bit 2 - 1 R e s e r ve d
22, 21, Bit 1 - X Latched FS3#
Bit 2 1 SDRAM (8:11) (Act/Inact)
19, 18
Bit 0 - 1 R e s e r ve d
39, 38,
Bit 1 1 SDRAM (4:7) (Act/Inact)
36, 35
44, 43,
Bit 0 1 SDRAM0 (0:3) (Act/Inact)
41, 40

Byte 5: Peripheral , Active/Inactive Register


(1= enable, 0 = disable)

BIT PIN# PWD DESCRIPTION


Bit 7 - 1 R e s e r ve d
Bit 6 - X Latched FS2#
Bit 5 54 1 IOAPIC_F (Act/Inact)
Bit 4 55 1 IOAPIC0 (Act/Inact)
Bit 3 - 1 R e s e r ve d
Notes:
Bit 2 - 1 R e s e r ve d 1. Inactive means outputs are held LOW and are disabled
Bit 1 2 1 REF1 (Act/Inact) from switching.
2. Latched Frequency Selects (FS#) will be inverted logic
Bit 0 3 1 REF0 (Act/Inact) load of the input frequency select pin conditions.

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ICS9250-08

Shared Pin Operation -


Input/Output Pins
The I/O pins designated by (input/output) on the ICS9250- Figs. 1 and 2 show the recommended means of
08 serve as dual signal functions to the device. During implementing this function. In Fig. 1 either one of the
initial power-up, they act as input pins. The logic level resistors is loaded onto the board (selective stuffing) to
(voltage) that is present on these pins at this time is read configure the devices internal logic. Figs. 2a and b
and stored into a 4-bit internal data latch. At the end of provide a single resistor loading option where either solder
Power-On reset, (see AC characteristics for timing values), spot tabs or a physical jumper header may be used.
the device changes the mode of operations for these pins These figures illustrate the optimal PCB physical layout
to an output function. In this mode the pins produce the options. These configuration resistors are of such a large
specified buffered clocks to external loads. ohmic value that they do not effect the low impedance
clock signals. The layouts have been optimized to provide
To program (load) the internal configuration register for as little impedance transition to the clock signal as
these pins, a resistor is connected to either the VDD possible, as it passes through the programming resistor
(logic 1) power supply or the GND (logic 0) voltage pad(s).
potential. A 10 Kilohm(10K) resistor is used to provide
both the solid CMOS programming voltage needed during
the power-up programming period and to provide an
insignificant load on the output clock during the subsequent
operating period.

Fig. 1

0378J05/17/05

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ICS9250-08

Fig. 2a

Fig. 2b

0378J05/17/05

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ICS9250-08

CPU_STOP# Timing Diagram


CPUSTOP# is an asychronous input to the clock synthesizer. It is used to turn off the CPUCLKs for low power operation.
CPU_STOP# is synchronized by the ICS9250-08. All other clocks will continue to run while the CPUCLKs are disabled.
The CPUCLKs will always be stopped in a low state and start in such a manner that guarantees the high pulse width
is a full pulse. CPUCLK on latency is less than 4 CPUCLKs and CPUCLK off latency is less than 4 CPUCLKs.

Notes:
1. All timing is referenced to the internal CPUCLK.
2. CPU_STOP# is an asynchronous input and metastable conditions may exist. This signal is synchronized to
the CPUCLKs inside the ICS9250-08.
3. IOAPIC output is stopped Glitch Free by CPUSTOP# going low.
4. PCI_STOP# is shown in a high (true) state.
5. All other clocks continue to run undisturbed.

PCI_STOP# Timing Diagram


PCI_STOP# is an asynchronous input to the ICS9250-08. It is used to turn off the PCICLK (0:5) clocks for low power
operation. PCI_STOP# is synchronized by the ICS9250-08 internally. PCICLK (0:5) clocks are stopped in a low state
and started with a full high pulse width guaranteed. PCICLK (0:5) clock on latency cycles are only one rising PCICLK
clock off latency is one PCICLK clock.

Notes:
1. All timing is referenced to the Internal CPUCLK (defined as inside the device.)
2. PCI_STOP# is an asynchronous input, and metastable conditions may exist. This signal is required to be synchronized
inside the device.
3. All other clocks continue to run undisturbed.
4. CPU_STOP# is shown in a high (true) state.
0378J05/17/05

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ICS9250-08

Absolute Maximum Ratings


Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . 7.0 V
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . GND 0.5 V to VDD +0.5 V
Ambient Operating Temperature . . . . . . . . . . 0C to +70C
Case Temperature . . . . . . . . . . . . . . . . . . . . . . 115C
Storage Temperature . . . . . . . . . . . . . . . . . . . . 65C to +150C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These
ratings are stress specifications only and functional operation of the device at these or any other conditions above those
listed in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect product reliability.

Electrical Characteristics - Input/Supply/Common Output Parameters


TA = 0 - 70 C; Supply Voltage VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5% (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input High Voltage VIH 2 VDD+0.3 V
Input Low Voltage VIL VSS-0.3 0.8 V
Input High Current IIH VIN = VDD 0.1 5 A
Input Low Current IIL1 VIN = 0 V; Inputs with no pull-up resistors -5 2.0 A
Input Low Current IIL2 VIN = 0 V; Inputs with pull-up resistors -200 -100 A
IDD3.3OP66 Select @ 66MHz; Sdram running, unloaded 112 140
Operating Supply
IDD3.3OP100 Select @ 100MHz; Sdram running, unloaded 150 180 mA
Current
IDD3.3OP133 Select @ 133MHz; Sdram running, unloaded 200 250
Input frequency Fi VDD = 3.3 V 12 14.318 16 MHz
1 CIN Logic Inputs 5 pF
Input Capacitance
CINX X1 & X2 pins 27 36 45 pF
1
Transition Time TTrans To 1st crossing of target Freq. 3 ms
1
Settling Time TS From 1st crossing to 1% target Freq. 1 3 ms
1
Clk Stabilization TStab From VDD = 3.3 V to 1% target Freq. 3 ms
1
Guaranteed by design, not 100% tested in production.

Electrical Characteristics - Input/Supply/Common Output Parameters


TA = 0 - 70 C; Supply Voltage VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5% (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating IDD2.5OP66 Select @ 66MHz; Max discrete cap loads 10 25
Operating IDD2.5OP100 Select @ 100MHz; Max discrete cap loads 13 25 mA
Supply Current IDD2.5OP133 Select @ 133MHz; Max discrete cap loads 18 25
1
Guaranteed by design, not 100% tested in production.

0378J05/17/05

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ICS9250-08

Electrical Characteristics - CPUCLK


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH2B IOH = -12.0 mA 2 2.3 V
Output Low Voltage VOL2B IOL = 12 mA 0.3 0.4 V
Output High Current IOH2B VOH = 1.7 V -35 -19 mA
Output Low Current IOL2B VOL = 0.7 V 19 26 mA
1
Rise Time tr2B VOL = 0.4 V, VOH = 2.0 V 0.4 1.4 1.8 ns
1
Fall Time tf2B VOH = 2.0 V, VOL = 0.4 V 0.4 1.35 1.8 ns
1
dt1B VT = 1.25 V; CPU < 120MHz 45 45 55
Duty Cycle 1 %
dt2B VT = 1.25 V; CPU >= 124MHz 35 43 50
1
tsk2B VT = 1.25 V; CPU >= 100 MHz 150 175
Skew 1 ps
tsk2B VT = 1.25 V; CPU < 100 MHz 170 240
1
Jitter, One Sigma tj12B VT = 1.25 V 35 150
1
Jitter, Absolute tjabs2B VT = 1.25 V -250 99 +250 ps
1
Jitter, Cycle-to-cycle tjcyc-cyc2B VT = 1.25 V 210 250
1
Guaranteed by design, not 100% tested in production.

Electrical Characteristics - PCICLK


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 60 pF for PCI0 & PCI1, CL = 30 pF for other PCIs
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH1 IOH = -18 mA 2.4 2.9 V
Output Low Voltage VOL1 IOL = 9.4 mA 0.2 0.4 V
Output High Current IOH1 VOH = 2.0 V -52 -22 mA
Output Low Current IOL1 VOL = 0.8 V 25 41 mA
Rise Time1 tr1 VOL = 0.4 V, VOH = 2.4 V 0.5 2.2 2.6 ns
Fall Time1 tf1 VOH = 2.4 V, VOL = 0.4 V 0.5 1.8 2.2 ns
Duty Cycle1 dt1 VT = 1.5 V 46 50 56 %
tsk1 VT = 1.5 V; All PCI clocks including PCI0 400 850
Skew1 window ps
tsk1 VT = 1.5 V; All PCI clocks except PCI0 250 500
Jitter, One Sigma1 tj11 VT = 1.5 V 15 150
1
ps
Jitter, Absolute tjabs1 VT = 1.5 V -250 60 250
1
Guaranteed by design, not 100% tested in production.

0378J05/17/05

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ICS9250-08

Electrical Characteristics - SDRAM


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL =30 pF
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH1 IOH = -28 mA 2.4 2.8 V
Output Low Voltage VOL1 IOL = 19 mA 0.34 0.4 V
Output High Current IOH1 VOH = 2.0 V -100 -42 mA
Output Low Current IOL1 VOL = 0.8 V 33 42 mA
1 tr1 VOL = 0.4 V, VOH = 2.4 V; 66, 75, 83 MHz 0.5 1.6 2.2
Rise Time
tr1 VOL = 0.4 V, VOH = 2.4 V; >= 100 MHz 0.5 1.3 1.6
ns
1 tf1 VOH = 2.4 V, VOL = 0.4 V; 66, 75, 83 MHz 0.5 1.5 2.3
Fall Time
tf1 VOH = 2.4 V, VOL = 0.4 V; >= 100 MHz 0.5 1.5 1.8
1
Duty Cycle d t1 VT = 1.5 V; Input Duty Cycle at 50% 47 52 57 %
1 tsk1 VT = 1.5 V; SD_F to 0:6, 8:10 150 250
Skew Window
tsk1 VT = 1.5 VSD_F to 7, 12:15 210 400
1 ps
Jitter, One Sigma tj1 1 VT = 1.5 V 50 150
1
Jitter, Absolute tjabs1 VT = 1.5 V -250 130 250
1
Guaranteed by design, not 100% tested in production.

Electrical Characteristics - IOAPIC


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH4B IOH = -8 mA 2 2.2 V
Output Low Voltage VOL4B IOL = 12 mA 0.3 0.4 V
Output High Current IOH4B VOH = 1.7 V -24 -15 mA
Output Low Current IOL4B VOL = 0.7 V 19 26 mA
Rise Time1 Tr4B VOL = 0.4 V, VOH = 2.0 V 0.4 1.3 1.6 ns
1
Fall Time Tf4B VOH = 2.0 V, VOL = 0.4 V 0.4 2 2.6 ns
1
Duty Cycle Dt4B VT = 1.25 V 45 51 55 %
1
Jitter, One Sigma Tj14B VT = 1.25 V 240 300 ps
Jitter, Absolute1 Tjabs4B VT = 1.25 V 625 650 ps
1
Guaranteed by design, not 100% tested in production.

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ICS9250-08

Electrical Characteristics - 48MHz, 24MHz,REF0


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH5 IOH = -12 mA 2.4 2.8 V
Output Low Voltage VOL5 IOL = 12 mA 0.2 0.4 V
Output High Current IOH5 VOH = 2.0 V -33 -20 mA
Output Low Current IOL5 VOL = 0.8 V 10 32 mA
1
Rise Time t r5 VOL = 0.4 V, VOH = 2.4 V, 48MHz 2 4 ns
1
Fall Time tf5 VOH = 2.4 V, VOL = 0.4 V, 48MHz 1.8 4 ns
1
Duty Cycle d t5 VT = 1.5 V, 48MHz 45 50 55 %
1
Rise Time t r5 VOL = 0.4 V, VOH = 2.4 V, REF0 2.2 4 ns
1
Fall Time tf5 VOH = 2.4 V, VOL = 0.4 V, REF0 1.8 4 ns
1
Duty Cycle d t5 VT = 1.5 V, REF 45 52 55 %
1
Jitter, Cycle-to-cycle t jcyc-cyc5 VT = 1.5 V, 24, 48MHz 700 1100 ps
Jitter, Cycle-to-cycle1 t jcyc-cyc5 VT = 1.5 V, REF0 500 800 ps
1
Guaranteed by design, not 100% tested in production.

Electrical Characteristics - REF1


TA = 0 - 70 C; VDD = 3.3 V +/-5%, VDDL = 2.5 V +/-5%; CL = 20 pF (unless otherwise stated)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Output High Voltage VOH5 IOH = -14 mA 2.4 2.8 V
Output Low Voltage VOL5 IOL = 6 mA 0.2 0.4 V
Output High Current IOH5 VOH = 2.0 V -28 -20 mA
Output Low Current IOL5 VOL = 0.8 V 10 22 mA
1
Rise Time tr5 VOL = 0.4 V, VOH = 2.4 V, REF1 2.5 4 ns
1
Fall Time tf5 VOH = 2.4 V, VOL = 0.4 V, REF1 2.2 4 ns
1
Duty Cycle dt5 VT = 1.5 V, REF1 45 50 55 %
1
Jitter, Cycle-to-cycle tjcyc-cyc5 VT = 1.5 V, REF1 600 800 ps
1
Guaranteed by design, not 100% tested in production.

0378J05/17/05

13
ICS9250-08

General Layout Precautions: Ferrite


Bead C2 C2
Ferrite
Bead
1) Use a ground plane on the top layer 22F/20V 22F/20V
Tantalum
VDD Tantalum VDD
of the PCB in all areas not used by
traces.

2) Make all power traces and ground


1 56
traces as wide as the via pad for C3
lower inductance. 2 55

3 54

4 53
2.5V Power Route
Notes: C1
5 52
1) All clock outputs should have a 1
series terminating resistor, and a C1
6 51 Clock Load

20pF capacitor to ground between 2


7 50
the resistor and clock pin. Not C3
shown in all places to improve 8 49
readibility of diagram. 9 48

10 47
2) Optional crystal load capacitors
11 46
are recommended. They should be
included in the layout but not 3.3V Power Route 12 45
inserted unless needed. 3.3V Power Route
13 44

14 43

15 42
Component Values: Ground
C1 : Crystal load values determined by user 16 41

C2 : 22F/20V/D case/Tantalum 17 40
Ground
AVX TAJD226M020R 18 39
C3 : 100pF ceramic capacitor
19 38
C4 : 20pF capacitor
20 37
FB = Fair-Rite products 2512066017X1
21 36
All unmarked capacitors are 0.01F ceramic
22 35

23 34

24 33

25 32
Connections to VDD:
26 31

27 30

28 29

= Routed Power
= Ground Connection (component side copper)
= Ground Plane Connection
= Power Route Connection
= Solder Pads
= Clock Load

0378J05/17/05

14
ICS9250-08

SYMBOL COMMON DIMENSIONS VARIATIONS D N


MIN. NOM. MAX. MIN. NOM. MAX.
A .095 .101 .110 AD .720 .725 .730 56
A1 .008 .012 .016
A2 .088 .090 .092
B .008 .010 .0135
C .005 - .010
D See Variations
E .292 .296 .299
e 0.025 BSC
H .400 .406 .410
h .010 .013 .016
L
N
.024 .032
See Variations
.040 SSOP Package
0 5 8
X .085 .093 .100

Ordering Information
ICS9250yFLF-08
Example:
ICS XXXX y F LF - PPP
Pattern Number (2 or 3 digit number for parts with ROM code
patterns)
RoHS Compliant
Package Type
F=SSOP
Revision Designator (will not correlate with datasheet revision)
Device Type (consists of 3 or 4 digit numbers)
Prefix
ICS, AV = Standard Device
0378J05/17/05

15
ICS9250-08

Revision History
Rev. Issue Date Description Page #
J 5/17/2005 Added LF Ordering Information 15

0378J05/17/05

16

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