1SS400T1G,

NSV1SS400T1G

High-Speed
Switching Diode
Features
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• High−Speed Switching Applications
• Lead Finish: 100% Matte Sn (Tin)
• Qualified Maximum Reflow Temperature: 260°C 1 2
• Extremely Small SOD−523 Package CATHODE ANODE

• NSV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant 1

MAXIMUM RATINGS (TA = 25°C) SOD−523

CASE 502
Rating Symbol Max Unit PLASTIC
Reverse Voltage VR 100 V
Forward Current IF 200 mAdc
MARKING DIAGRAM
Peak Forward Surge Current IFM(surge) 500 mAdc
THERMAL CHARACTERISTICS AMG
Characteristic Symbol Max Unit G
1
Total Device Dissipation PD
FR−5 Board (Note 1) @TA = 25°C 200 mW A = Device Code
Derate above 25°C 1.57 mW/°C M = Date Code*
Thermal Resistance, Junction-to-Ambient RJA 635 °C/W G = Pb−Free Package
(Note: Microdot may be in either location)
Junction and Storage Temperature Range TJ, Tstg −55 to °C
+150 *Date Code orientation may vary depending upon
Stresses exceeding those listed in the Maximum Ratings table may damage the manufacturing location.
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−4 @ Minimum Pad.
ORDERING INFORMATION

ELECTRICAL CHARACTERISTICS Device Package Shipping†

Characteristic Symbol Min Max Unit 1SS400T1G SOD−523 3000 / Tape & Reel
(Pb−Free)
OFF CHARACTERISTICS
1SS400T5G SOD−523 8000 / Tape & Reel
Reverse Voltage Leakage Current IR (Pb−Free)
(VR = 80 Vdc) − 0.1 Adc
NSV1SS400T1G SOD−523 3000 / Tape & Reel
Diode Capacitance CD
(VR = 0 V, f = 1.0 MHz) − 3.0 pF (Pb−Free)

Forward Voltage VF †For information on tape and reel specifications,

(IF = 100 mAdc) − 1.2 Vdc including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Reverse Recovery Time trr Brochure, BRD8011/D.
(IF = IR = 10 mAdc) − 4.0 ns

© Semiconductor Components Industries, LLC, 2014 1 Publication Order Number:

June, 2014 − Rev. 8 1SS400T1/D
 1SS400T1G, NSV1SS400T1G

820 
IF
+10 V 2.0 k tr tp t
0.1 F
100 H IF trr t
10%
0.1 F

DUT 90%
iR(REC) = 1.0 mA
50  OUTPUT 50  INPUT IR
PULSE SAMPLING VR
OUTPUT PULSE
GENERATOR OSCILLOSCOPE INPUT SIGNAL (IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)

Notes: 1. A 2.0 k variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr

Figure 1. Recovery Time Equivalent Test Circuit

100 10
TA = 150°C
I F, FORWARD CURRENT (mA)

TA = 85°C I R , REVERSE CURRENT ( A) TA = 125°C

TA = -40°C 1.0
10

TA = 85°C
TA = 25°C 0.1

1.0 TA = 55°C
0.01

TA = 25°C
0.1 0.001
0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50
VF, FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 2. Forward Voltage Figure 3. Leakage Current

0.68
C D , DIODE CAPACITANCE (pF)

0.64

0.60

0.56

0.52
0 2.0 4.0 6.0 8.0
VR, REVERSE VOLTAGE (VOLTS)

Figure 4. Capacitance

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2
 1SS400T1G, NSV1SS400T1G

PACKAGE DIMENSIONS

SOD−523
CASE 502
ISSUE E
−X−
D NOTES:
−Y− 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
E BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
1 2 TRUSIONS, OR GATE BURRS.
2X b
0.08 M X Y MILLIMETERS
DIM MIN NOM MAX
TOP VIEW A 0.50 0.60 0.70
b 0.25 0.30 0.35
c 0.07 0.14 0.20
D 1.10 1.20 1.30
E 0.70 0.80 0.90
A HE 1.50 1.60 1.70
L 0.30 REF
L2 0.15 0.20 0.25

c HE
RECOMMENDED
SIDE VIEW SOLDERING FOOTPRINT*

2X 1.80
2X L 0.48 2X
0.40

PACKAGE
2X L2 OUTLINE DIMENSION: MILLIMETERS

BOTTOM VIEW *For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION

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