Data Concentrator Cape For Beaglebone Black: Ti Designs

TI Designs
Data Concentrator Cape for BeagleBone Black
TI Designs Design Features

TI Designs provide the foundation that you need • Interface to BeagleBone Black
including methodology, testing and design files to • Interface to PLC SOM for FCC, ARIB/Prime, or
quickly evaluate and customize the system. TI Designs CENLEC Frequency Band
help you accelerate your time to market.
• Interface for CC2543, CC2544, or CC2545 RF
Design Resources SOCs
• Compatible with CC112x SOM Modules
TIDA-00225 Tool Folder Containing Design Files
• RS232 DTE Interface
TIDM-SOMPLC-F28M35 Product Folder
• On-Board DC-DC Power Supply for PLC 15 V
CC2543EM Product Folder
TRS3386ECPWR Product Folder • 3-Phase Power Input and Zero Cross Detectors
TPS61093DSK Product Folder
Featured Applications
SN74LV125APWR Product Folder
SN74LVC1G57DBVR Product Folder • Power Line Communication Modem for Electric
Power Utilities to Transfer Vital Information for the
Operation and Protection of the Electric Power Grid
ASK Our Analog Experts • Industrial Automation/AMR (Smart E-Meter: AMR
WEBENCH® Calculator Tools and AMI): The PLC Communication Networks can
be Used to Give Electric Energy Related Services,
such as Meter Reading, Demand Management,
and Remote Billing
• Reading of Flow Meters using RF
• Solar Power Inverters and Micro Inverters
• Remote Data Collection Using Modems
UART
D89
TRS3386ECPWR
Zero Cross 3 Phase

PLC SN74LVC1G57 AC Input
SOM
Interface
Coupling
PLC_TX
Transformers
SN74LV125APWR BeagleBoneBlack
LEDs (Interface)
15 V
RF SOM2
CC2543EM
5V
TPS61093
An IMPORTANT NOTICE at the end of this TI reference design addresses authorized use, intellectual property matters and other
important disclaimers and information.
All trademarks are the property of their respective owners.
TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 1

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Copyright © 2014, Texas Instruments Incorporated
System Description www.ti.com
1 System Description
1.1 Advanced Metering Infrastructure (AMI)

Advanced Metering Infrastructure (AMI) is one of the major applications for data concentrators.
Advanced Metering Infrastructure is a communications service that permits the transfer of data from utility
meters to a utility company’s metering collection system. AMI automates the previously manual process of
reading meters. Also, AMI allows the collection of much more and different types of information to benefit
the utility and customer alike.
Lowered costs can increase the resources available for product development and other needs. Further
detailed data provides better insight into an increasingly complex power market, as well as an opportunity
to differentiate service via various options. These options include on-line daily usage information, outage
status, and customer outage notification.
2 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

www.ti.com System Description
AMI Communications Technologies

AMI technology decisions are dominated by the choice of a communications scheme. Cost is part of the
communications scheme choice.
The following are the choices for an AMI communications scheme:
• Power line communications (PLC) technology uses power lines as media for sending and receiving
low-bandwidth data at very low speed. This option tends to be cost effective for meters served by a
single substation. In the US, this technology has been widely adopted by rural cooperatives.
• Telephone-based technology uses telephone lines (either dedicated or shared with voice
communications) to send and receive meter data. With dial outbound systems, the utility must know
the customer’s phone number to get the data, which can cause administrative problems. This factor,
along with the relatively high prices charged by phone companies for this type of service, has made
this option less attractive. With dial-inbound systems, by contrast, meters are equipped with an
automated dialer that can call the utility at pre-assigned times, when an alarm condition is detected, or
when signaled by the utility.
• Telephone-based systems tend to be cost effective for selected meters that are sparsely spread
throughout a service territory, and are typically used for large commercial and industrial customers.
• Wireless radio-frequency (RF) AMI technologies rely on the use of a transmitter on the meter to
communicate with a receiver that can be handheld, located in a vehicle, or installed at a fixed location.
Wireless approaches tend to be more cost-effective for meters within a clustered geographic area.
Mobile radio systems that use handheld or van-based receivers cannot provide two-way real-time
communications, and are best suited as replacements for manual meter reading, especially where the
cost of manual reading is high. Fixed-network wireless systems, by contrast, can support a wide
variety of applications, including metering, real-time pricing, energy management, and outage or theft
detection. Of course, there is additional cost for these extended features.
The Data Concentrator Cape (called DC-Cape in this document) for BeagleBone Black can interface with
multiple nodes (electricity meter, water meter, and so forth) via power line communication (PLC), low-
power RF, or serially using RS-232.
Data Terminal Equipment (DTE) is typically either a dumb terminal or the serial port on a computer or
workstation. Data Communications Equipment (DCE) is typically a modem, Data Service Unit (DSU),
Channel Service Unit (CSU), or other piece of data communications equipment.

Design Features www.ti.com
2 Design Features
Table 1. Design Features

Processor (CPU) interface 2 x 46-Pin expansion header for interfacing to BeagleBone Black
Power line interface (PLC) 34-Pin interface for PLC SOM modules
AC mains input 3-Phase inputs with Zero Cross
Low power RF Header 10 x 2 , x 2 to mount RF SOC
RS232 serial interface RS232 level shifter for modem interface
Onboard power supply Onboard DC-DC converters for powering PLC
3 Block Diagram
UART
D89
TRS3386ECPWR
Zero Cross 3 Phase

PLC SN74LVC1G57 AC Input
SOM
Interface
Coupling
PLC_TX
Transformers
SN74LV125APWR BeagleBoneBlack
LEDs (Interface)
15 V
RF SOM2
CC2543EM
5V
TPS61093

www.ti.com Highlighted Products
4 Highlighted Products
For more information on each of the devices in Section 4, see the respective product folders at
www.tI.com. See also the links for Product Folders in Design Resources.
4.1 BeagleBone Black

The BeagleBone Black is the newest member of the BeagleBoard family. BeagleBone Black is a lower-
cost, high-expansion focused BeagleBoard. BeagleBone Black uses a low cost Sitara AM3359AZCZ100
Cortex A8 ARM processor from Texas Instruments.
4.2 PLC SOM Interface

The DC-Cape supports power line communication over a three-phase power system. All three phases are
capacitively coupled and routed to the PLC SOM connector for transmit and receive. The PLC SOM acts
as a transceiver (PHY) for all PLC operations.
The processor communicates with the PLC via UART. Two GPIO pins on the processor are used to
control the reset (PLC_RESET) and enable (PLC_EN) signals on the PLC SOM. Each phase can be
configured for CENELEC and FCC band operation or fully disconnected through a series of jumpers. The
board includes a zero-crossing detection circuit for each phase. The output of each zero-crossing circuit is
routed to the PLC SOM connector.
4.3 Low Power RF Interface

The DC-Cape includes an RF daughter cards interface. The daughter card interface consists of a pair of
20-pin connectors. The CC2543EM (evaluation module) contains the RF IC and necessary external
components and matching filters for getting the most out of the radio.
4.4 Serial Communication - RS232 Interface

The DC-Cape provides an RS232 interface for modem or GSM communication. The same UART can also
be used for PLC characterization.
4.5 Power Supply and EEPROM

A DC-DC converter TPS61093 is used to generate the required power supplies for PLC operation. The
board contains a serial EEPROM with the board specific data which allows the processor to automatically
detect which board is connected and the version of the board that is connected. Other hardware specific
data can be stored in this memory as well. An I2C EEPROM is provided to detect the version of the
BeagleBone Black Cape board.

Circuit Design and Component Selection www.ti.com
5 Circuit Design and Component Selection
5.1 BeagleBone Black Features
Table 2. BeagleBone Black Features (1)

FEATURE DETAILS
Sitara AN3357BZCZ100
Processor
1 GHz, 2000 MIPS
Graphics Engine SGX530 3D, 20 M Polygons/S
SDRAM Memory 512 MB DDR3L 800 MHz
Onboard Flash 2 GB, 8-Bit Embedded MMC
PMIC TPS65217C PMIC Regulator and One Additional LDO
Debug Support Optional Onboard 20-Pin CTIJTAG, Serial Header
Power Source MiniUSB, USB, or DC Jack 5-V DC External via Expansion Header
PCB 3.4" x 2.1" 6 Layers
Indicators 1-Power, 2-Ethernet, 4-User Controllable LEDs
HS USB 2.0 Client Port Access to USB0, Client Mode via MiniUSB
HS USB 2.0 Host Port Access to USB1, Type A Socket, 500-mA LS/FS/HS
Serial Port UART0 Access via 6-Pin 3.3-V TTL Header. Header is Populated
Ethernet 10/100, RJ45
SD/MMC Connector MicroSD, 3.3 V
Reset Button
User Input Boot Button
Power Button
16 B HDMI, 1280 x 1024 (MAX)
Video Output 1024 x 768, 1280 x 720, 1440 x 900, 1920 x 1080 at 24 Hz
w/EDID Support
Audio Via HDMI Interface, Stereo
Power 5 V, 3.3 V, VDD_ADC (1.8 V)
3.3 V I/O on All Signals
McASP0, SPI1, I2C, GPIO (69 MAX), LCD, GPMC, MMC1, MMC2, 7
Expansion Connectors
AIN (1.8 V MAX),4 Timers, 4 Serial Ports, CAN0,
EHRPWM (0,2), XDMA Interrupt, Power Button, Expansion Board ID
(Up to 4 Can Be Stacked)
(1)
See Reference #1.

www.ti.com Circuit Design and Component Selection
Two 23 x 2 connectors are used to interface the DC-cape to the BeagleBone Black board. Figure 1 shows the interface connector. The signals not
used by DC-Cape are shown as X (not connected on the DC-Cape).
P1 P2
1 2 DGND 1 2 DGND
3 4 VDD_3V3EXP 3 4 VDD_3V3EXP
5 6 VDD_5V 5 6 VDD_5V
7 8 SYS_5V 7 8 SYS_5V
6 9 10 9 10
TIMER5 TIMER6 7
6 11 12 6 11 12 2,8
GPIO1_13 GPIO1_12 7 UART4_RXD GPIO1_28
13 14 7 6 13 14
GPIO0_26 UART4_TXD
7 15 16 7 6 15 16 2,8
GPIO1_15 GPIO1_14 GPIO1_16 GPIO1_17
7 17 18 3 17 18
GPIO0_27 GPIO2_1
19 20 2,8 19 20 2,8
I2C2_SCL I2C2_SDA
21 22 3 21 22 3
UART2_TXD UART2_RXD
23 24 23 24 8
UART1_TXD
25 26 GPIO1_29 3 25 26
UART1_RXD 8
27 28 27 28 6
SPI1_CS0
29 30 6,7 SPI1_D0 29 30 6,7
SPI1_D1
31 32 6,7 31 32
SPI1_SCLK
33 34 33 34
35 36 35 36
37 38 37 38
39 40 39 40
41 42 41 42
43 44 43 44
45 46 45 46
HEADER 23x2 HEADER 23x2

TSHC-123-D-03-145-GT-LF DGND TSHC-123-D-03-145-GT-LF DGND
DGND DGND
EXPANSION HEADER EXPANSION HEADER

Figure 1. BeagleBone Black Interface Connector on DC-Cape

5.2 PLC SOM Interface
5.2.1 Zero-Crossing Detection

The board includes a zero-crossing detection circuit for each phase. The output of each zero-crossing circuit is routed to the PLC SOM connector.
Zero-crossing detectors can be used to synchronize communications signals to the AC line or sources of noise. Typically, in single-phase
applications, only a single zero-crossing detector is used. In three-phase applications, two or three zero-crossing detectors can be used.
NOTE: A single phase zero cross output is shown in Figure 2. In the DC-Cape , there are three zero cross detectors for three phases.
3V3_EVM
R215 270
C102
0.1uF
LINE_AC_C R6 100K R5 100K R4 100K Q2
24 LINE_AC_C
BC817-40LT1G
DGND
4
LINE_AC_N
ISO2
FOD817BSD 3V3_EVM
R213 D7 U41
3
D6 240K BZV55 C103 R214 0 1 6
DL4148-TP 2 In1 In2 5
3 GND VCC 4
.1uF ZERO_PLC_C 26
In0 Y
R216 SN74LVC1G57DBVR
1.5K 5 % DGND C266
24,25,48 LINE_AC_N
0.1uF
DGND
DGND
Figure 2. PLC SOM Interface Zero-Crossing Detection

5.2.2 AC Power Input

Line coupling circuitry to connect to mains power to the PLC is shown in Figure 3.
25,48 LINE_AC_N
JP4
HDR_2_P1_INCH
2
1
LINE_N_F
25,48 LINE_AC_A
P1
JP3
HDR_2_P1_INCH 1
C5
2
2
1
JP20 L16 15uH
1 2 LINE_AC_A_CON 3
.47uF 400v(ECQ-E4474KF 1 L17 600nH
2 1 2 4
3
HEADER 3 5
JP5
HDR_2_P1_INCH 1777574
25 LINE_AC_B
2
1
JP1 Note Board Markings required

T1 HDR_2_P1_INCH
C1
1 9 HAZZARD MARKING
2
1
JP21 L14 15uH
8 LINE_COMB
1
1 2 LINE_AC_B_CON CURRENT AND VOLTAGE
3 .47uF 400v(ECQ-E4474KF L15 600nH
2 2 1 2
MARKINGS
7 LINE_N_F 3
HEADER 3
4
5 6
WURTH_750510476 25 LINE_AC_C
GND_AC_PWR
JP2
HDR_2_P1_INCH
C2
2
1
JP22 L12 15uH
1 2 LINE_AC_C_CON
SD PART# 103531-0001R .47uF 400v(ECQ-E4474KF 1 L13 600nH
2 1 2
3
HEADER 3
PL_TXRX
PL_TXRX 26
R17
4.7
D10
SM6T7V5CA
C25
2200PF 250V
GND_AC_PWR
GND_AC_PWR
Figure 3. PLC SOM Interface AC Power Input

This design supports single-phase and three-phase power-line communication. To use power-line
communication, connect each phase input and neutral to the power-line communication system as shown
in Table 3. The earth ground input is not connected to any components on the board and can be left
unconnected.
CAUTION
Do not leave the board powered when unattended.
CAUTION
Electric shock possible when connecting board to live wire. Board should
be handled with care by a professional. For safety, use of isolated test
equipment with overvoltage and overcurrent protection is highly recommended.
Table 3. PLC Connector Functions

INPUT FUNCTION
A Phase-A and AC power Input
B Phase-B
C Phase-C
N Neutral
E Earth ground
Table 4 shows the characteristics of a PLC transformer 750510476 designed for PLC modems using TI
Analog Front-End PLC. For more details, refer to PLC Transformer for Texas Instruments AFE030 /
AFE031 / AFE032
Table 4. PLC Transformer Characteristics

Isolation voltage 5000-V AC at 1 second
Operating temperature -40°C to 125°C
Conforms to IEC60950-1, EN60950-1, UL60950-1/CSA60950-1,
Standards
AS.NZS60950.1
RoHS Lead free
Insulation Reinforced
5.2.3 System-on-Module Interface

The SOMPLC-F28M35 is a single-board system-on-module (SOM) for PLC in the ARIB frequency band.
This single hardware design SOMPLC-F28M35 supports several popular PLC industry standards including
G3 and IEEE-1901.2. TI's certified PLC software is available along with the SOMPLC-F28M35. Engineers
can integrate the SOM design into their overall system board. Alternatively, engineers can keep the SOM
design as an add-on board to their application. The only additional hardware required is the AC mains line
coupling circuitry.
This reference design includes hardware schematics and Gerber files to simplify the task for engineers to
add PLC to their end systems. OEMs benefit by having the ability to rapidly evaluate and prototype Power
Line Communications technology in their application.

SOMPLC-F28M35 Features
• Support for ARIB frequency band
• Supports G3 and IEEE-1901.2 PLC industry standards
• Comprehensive two-chip solution with MCU and AFE032-integrated analog front-end
• 34-pin mini header provides flexibility for interfacing to custom board and other TI Designs like the PLC Data Concentrator and TMDSPLCKIT-
V4
Figure 4 shows the SOMPLC-F28M35 interface.
JP23 JP24
HDR_2_P1_INCH HDR_2_P1_INCH
1
2
1
2
P3
2 UART2_TXD R9 NO-POP PLC_RX_B 33 34 PLC_TX_B R11 NO-POP UART2_RXD 2

31 32
2 GPIO2_1 R10 0 PLC_RESET 29 30 PLC_PWM_GPIO04 5
ZERO_PLC_B
27 28
25 26
PLC_LED2 R260 0 23 24 R259 0 PLC_LED1
21 22
5 ZERO_PLC_C PLC_USBDP 19 20
17 18
15 16
R83 10K 13 14 R84 10K
7 UART1_TXD_PLC R14 0 PLC_RX_A 11 12 PLC_TX_A R15 0 UART1_RXD_PLC 7
2 GPIO1_29 R16 0 PLC_EN 9 10 PLC_ZC R17 0 5
ZERO_PLC_A
PLC_15V 7 8 PLC_3V3
5 6
3 4
1 2 4
L1 L2 PL_TXRX
DGND DGND
DGND SFH31-NPPB-D17-SP-BK DGND
GND_AC_PWR
Figure 4. System-on-Module Interface

Table 5 shows the SOM connector pinouts.

(1)
Table 5. PLC SOM Connector Pinout
PIN # SIGNAL PIN # SIGNAL
1 AC GND 2 PLC Signal
3 NC 4 NC
5 Digital GND 6 Digital GND
7 15-V DC 8 3.3-V DC
9 PLC_EN (GPIO2[0]) 10 ZERO_PLC_A
11 UART3_TXD 12 UART3_RXD
13 Pull-down 14 Pull-down
15 NC 16 NC
17 NC 18 Digital GND
19 ZERO_PLC_C 20 Digital GND
21 NC 22 Digital GND
23 PLC_LED2 24 PLC_LED1
25 NC 26 NC
27 NC 28 NC
29 PLC_RESET (GPIO2[1]) 30 ZERO_PLC_B
31 NC 32 NC
33 PLC_SCIB_RXD 34 PLC_SCIB_TXD
(1)
See Reference #2.
5.3 Low Power RF Interface

Different frequency bands can be considered:.
• 2.4 GHz ISM band
• Sub 1GHz ISM bands - 902-928
SOMs for evaluating different frequency bands are available from TI.

5.3.1 SOM - Interface Connector

The DC-Cape includes the RF daughter card interface CC1. The daughter card interface consists of a pair
of 20-pin connectors. The daughter card interface CC1 uses the connector pair P5 and P6.
Table 6 gives the full pin out of each pair of RF interface connectors.
Table 6. CC1 (P5 and P6) Pinout

P6 P5
PIN # SIGNAL PIN # SIGNAL PIN # SIGNAL PIN # SIGNAL
NAME NAME NAME NAME
1 GND 2 NC 1 NC 2 GND
3 VREGEN2 4 NC 3 NC 4 GND
(GPIO1[15])
5 RESET 6 UART2 TX2 5 NC 6 GND
(GPIO0[13])
7 UART2 TX1 8 UART2 RX2 7 3.3-V 8 NC
9 UART2 RX1 10 GPIO1[12] 9 3.3-V 10 NC
11 NC 12 GPIO1[15] 11 NC 12 NC
13 NC 14 SPI1_CS0N3 13 NC 14 NC
15 NC 16 SPI1_CLK3 15 RESET 16 NC
(GPIO0[13]
17 NC 18 SPI1_D0 17 NC 18 GPIO1[13]
(SIMO)3
19 GND 20 SPI1_D1 19 GPIO1[14] 20 NC
(SOMI)3

Figure 5 shows the schematic for the interface connector on DC-Cape.
1 1
P1 ON CC MODULES P2
P5 ON SMART GRID BOARD P6 VDD_3V3EXP
+
R30 NO-POP TP3 C6 C7
R31 NO-POP TP-20RD10 0.1UF 10UF
TP4
TP-20RD10
TP5
TP-20RD10 DGND
P5 P6
1 2 1 2
2 R32 0 CC1_P0.4 3 4 CC1_P1.3 3 4 R33 0
GPIO1_12
2 R34 0 CC1_P0.1 5 6 CC1_P1.0 5 6 R35 0
GPIO0_26
2 R36 0 CC1_P0.2 7 8 R37 0 7 8
UART4_TXD
2 R38 0 CC1_P0.3 9 10 CC1_P2.1 R39 0 2 9 10
UART4_RXD GPIO1_16
CC1_P0.0 11 12 CC1_P2.2 R40 0 11 12 DGND
CC1_P1.1 13 14 CC1_P1.4 R41 0 13 14
CC1_P0.6 15 16 CC1_P1.5 R42 0 2 GPIO1_17 GPIO1_17 R43 0 RESET_CC1 15 16
TP6 CC1_P0.7 17 18 CC1_P1.6 R44 0 17 18 CC1_P0.5 R45 0 2
GPIO1_28
TP-20RD10 19 20 CC1_P1.7 R46 0 2 GPIO1_13 R47 0 CC1_P2.0 19 20
TP7
TP-20RD10 HEADER 10X2 HEADER 10X2
TP8
TP-20RD10
TP9 DGND
TP-20RD10
TIMER5 2
TIMER5
SPI1_CS0_A
VDD_3V3EXP
SPI1_SCLK 2,7
SPI1_SCLK
SPI1_D0 2,7
SPI1_D0
SPI1_D1 SPI1_D1 2,7
R48 R49
10K 10K
JP6
1 SPI1_CS0_A
2 SPI1_CS0 2
3 SPI1_CS0_B
CON3
Figure 5. RF Interface Connector on DC-Cape

5.4 Serial Communication - RS232 DTE Interface

TRS3386ECPWR is the RS232 tranceiver used on the DC-Cape board. The TRS3386ECPWR DB-9 male connector brings out UART pins for
expansion purposes. Table 7 gives the pin outs of the TRS3386ECPWR connector and Figure 6 shows the schematics.
Table 7. P9 DB9 Connector

PIN # SIGNAL NAME
2 RSA_RXD
3 RSA_TXD
8 RSA_CTS
7 RSA_RTS
5 GND
VDD_3V3EXP
VDD_3V3EXP
R68
0 C10
0.1uF
DGND
R69 VDD_3V3EXP U4
NO-POP TRS3386ECPWR
1 19 VDD_3V3EXP
C12 C1+ VCC
0.1uF 2 C13 0.1uF
DGND 3 V+
C1- 6 C14 0.1uF C15
R70 R71 V-
2.2K 2.2K 4 0.1uF
C11 C2+ 18
0.1uF GND DGND
5 12 DGND
C2- VL DGND
UART1_TXD_RS232 7 17 RSA_TXD P9
DIN1 DOUT1
UART1_RTSN 8 16 RSA_RTS 1
2 I2C2_SCL DIN2 DOUT2 6
9 15 RSA_RXD 2 10
DIN3 DOUT3 RSA_RTS 7
RSA_TXD 3
DGND RSA_CTS 8
20 4 11
PWRDOWN 9
5
UART1_RXD_RS232 11 14 RSA_RXD DB-9-MALE DGND

ROUT1 RIN1
UART1_CTSN 10 13 RSA_CTS DGND
2 I2C2_SDA ROUT2 RIN2
Figure 6. RS232 Interface

5.5 Power Supply and EEPROM

TPS61093 is a 1.2-MHz, fixed-frequency boost converter designed for high integration and high reliability. The IC integrates a 20-V power switch,
an input/output isolation switch, and a power diode. When the output current exceeds the overload limit, the IC’s isolation switch opens up to
disconnect the output from the input. The isolation switch protects the IC and input supply. The isolation switch also disconnects the output from
the input during shutdown to minimize leakage current.
Figure 7 shows the Power Supply and EEPROM.
L1 10uH
VDD_5V C18 0.1uF

U5 DGND
R76
2 9 0
VIN SW EVM_15V
C19 0.1uF 3 10 R77 0
R78 CP2 VO
C16 C17 10K 4 8 R79 0
22uF 150uF C20 CP1 OUT
PWR_PAD
10uF 5 7
EN FB R80
6 1 294K C21
SS GND 0.01uF
C22 C23
DGND DGND DGND R81 C24 10uF 100uF
11
200K 1uF TPS61093DSK DGND
R82
10.2K DGND DGND
DGND
DGND
Figure 7. Power Supply and EEPROM
The DC-DC converter converts 5 V to 15 V, which is required for PLC operation.

The board contains a serial EEPROM with the board-specific data, which allows the processor to automatically detect which board is connected
and the version of that board. Other hardware specific data can be stored in the EEPROM memory as well. The part number of the EEPROM
memory device used is CAT24C256W.

www.ti.com Software Description
6 Software Description
6.1 U-Boot
The U-boot on AM335x uses a two-stage approach. The size of the internal RAM in AM335X is 128 KB.
Of the 128 KB, 18 KB at the end is used by the ROM code. Also, 1 KB at the start (0x402f0000 -
0x402f0400) is secure, and cannot be accessed. The reserved RAM places a limit of 109 KB on the size
of the U-Boot binary which the ROM code can transfer to the internal RAM and use as an initial stack
before initialization of DRAM.
Since it is not possible to squeeze in all the functionality that is normally expected from a U-Boot in less
than 110KB (after setting aside some space for stack, heap, and so forth), a two-stage approach has been
adopted. The first stage initializes only the required boot devices (NAND, MMC, I2C, and so forth. The
second full stage installs all other devices (ethernet, timers, clocks, and so forth).
NOTE: In the rest of this document when referring to the binaries, the binary for the first stage is
referred to as SPL and the binary for the second stage is called U-Boot.
6.1.1 Building U-Boot
6.1.1.1 Prerequisite
Verify that SDK 6.00 is installed on the host computer. GNU toolchain for the ARM processor from Arago
is recommended to build U-Boot. Arago toolchain can be found in the linux-devkit directory of the SDK. If
not already done, add this compiler to the path by executing the following code.
$ export PATH="<SDK install dir>/linux-devkit/sysroots/i686-arago-linux/usr/bin : $PATH"
Change to the base of the U-Boot directory.

$ cd ./ti-sdk-am335x-evm-MM.mm.pp.bb/board-support/u-boot-MM.mm.pp.bb
6.1.1.2 U-Boot Patch

The U-boot patch can be found on the SD card in the START_HERE/Software/patches folder. Locate the
U-Boot patch and apply the patch to the U-Boot source.
$ patch -p1 < 0001-Baseline-u-boot-patch-for-EVM-SDC.patch
6.1.1.3 Compile
Below are instructions on how to generate binaries for the memory or peripheral devices. Building into a
separate object directory with the "O=" parameter is strongly recommended.
6.1.1.3.1 UART
Execute the following code.
$ [ -d ./am335x ] && rm -rf ./am335x
$ make O=am335x CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm am335x_evm
In the am335x directory, SPL is spl/u-boot-spl.bin and U-Boot is u-boot.img.
6.1.1.3.2 NAND
$ [ -d ./am335x ] && rm -rf ./am335x
$ make O=am335x CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm am335x_evm
In the am335x directory, SPL is MLO and U-Boot is u-boot.img.

Software Description www.ti.com
6.1.1.3.3 SPI
$ [ -d ./am335x ] && rm -rf ./am335x
$ make O=am335x CROSS_COMPILE=arm-linux-gnueabihf- ARCH=arm am335x_evm_spiboot
In the am335x directory, SPL is MLO.byteswap and U-Boot is u-boot.img.
6.2 Kernel
This section will cover the basic steps for building the Linux kernel and drive modules.
6.2.1 Building Linux Kernel
6.2.1.1 Prerequisite
Verify that SDK 6.00 is installed on the host computer. GNU toolchain for the ARM processor from Arago
is recommended to build the kernel. Arago toolchain can be found in the linux-devkit directory of the SDK.
If not already done, add this compiler to the path by executing the following code.
$ export PATH="<sdk install dir>>/linux-devkit/sysroots/i686-arago-linux/usr/bin/:$PATH"
Change to the base of the Kernel directory.

$ cd ./ti-sdk-am335x-evm-MM.mm.pp.bb/board-support/linux-MM.mm.pp.bb
6.2.1.2 Kernel Patch

The kernel patch can be found on the SD card in the START_HERE/Software/patches folder. Locate the
kernel patch and apply the patch to the kernel source.
$ patch -p1 < 0001-Baseline-kernel-patch-for-EVM-SDC.patch
6.2.1.3 Cleaning the Kernel Sources

Prior to compiling the Linux kernel, it is often a good idea to make sure that the kernel sources are clean
and that there are no remnants left over from a previous build.
NOTE: The next step will delete any saved .config file in the kernel tree as well as the generated
object files. If a previous configuration has already been created, save a copy of the
configuration file before proceeding in order to prevent the loss of the configuration file.
Clean the kernel.

$ make ARCH=arm CROSS_COMPILE=arm-linux-gnueabihf- mrproper
6.2.1.4 Configure the Kernel

Before compiling the Linux kernel, it needs to be configured to select what components will become part of
the kernel image, which components will be built as dynamic modules, and which components will be left
out all together.
Set using the default configuration.
$ make ARCH=arm CROSS_COMPILE=arm-linux-gnueabihf- tisdk_am335x-evm_defconfig
To customize the kernel configuration if desired, run the following command.

$ make ARCH=arm CROSS_COMPILE=arm-linux-gnueabihf- menuconfig

6.2.1.5 Compile
Once the kernel has been configured, it must be compiled to generate the bootable kernel image, as well
as any dynamic kernel modules that were selected.
Build the kernel image. The resulting kernel image file will be located in the arch/arm/boot directory called
uImage.
$ make ARCH=arm CROSS_COMPILE=arm-linux-gnueabihf- uImage
Build the dynamic modules. This will result in .ko (kernel object) files being placed in the kernel tree.
These .ko files are the dynamic kernel modules.
$ make ARCH=arm CROSS_COMPILE=arm-linux-gnueabihf- modules
6.3 Flashing Images
6.3.1 Boot Modes

There are four boot modes supported.
6.3.1.1 eMMC Boot

eMMC Boot is the default boot mode and allows for the fastest boot time. eMMC Boot enables the board
to boot out of the box without having to purchase an SD card or an SD card writer.
6.3.1.2 SD Boot
SD Boot boots from the uSD slot. SD Boot can be used to override what is on the eMMC device. SD Boot
can be used to program the eMMC when used in the manufacturing process or for filed updates.
6.3.1.3 Serial Boot

Serial Boot uses the serial port to allow downloading of the software directly. A separate serial cable is
required to use the serial port.
6.3.1.4 USB Boot

USB Boot supports booting over the USB port.
6.3.2 Boot Mode Switch

A switch is provided to allow switching between modes. Holding the switch down during boot without an
SD card forces the boot source to be the USB port. If nothing is detected on the USB port, the switch will
go to the serial port for download. Without holding the switch, the board boots from eMMC. If eMMC is
empty, then the switch will try booting from the uSD slot, followed by the serial port, and then the USB
port.
6.3.3 U-Boot Network Configuration

In order to download images from the TFTP server, the network settings in U-Boot need to be configured.
When booting for the first time, U-Boot tries to fetch the MAC address from the env space. If MAC address
returns empty, U-Boot looks for the MAC address in the eFuse registers in the Control module space and
sets the "ethaddr" variable in the env appropriately. The ethaddr can also be set using the setenv/saveenv
commands. In such cases, the user-set MAC address will take effect on subsequent reboot only.
To set a different MAC address, use the following command.
U-Boot# set ethaddr <MAC address, e.g. 08:11:23:32:12:77>

Software Description www.ti.com
6.3.3.1 Dynamic IP
Run the dhcp command to obtain the IP address from the DHCP server on the network which the EVM is
connected to.
U-Boot# setenv serverip <tftp server in the network>
U-Boot# dhcp
U-Boot# saveenv
6.3.4 UART Boot

This section describes how to boot from UART using TeraTerm.
1. Turn on EVM with switch settings for UART boot.
2. When "CCCC" characters appear on the TeraTerm window, from the File Menu, select Transfer →
XMODEM → Send (1K mode).
3. Select "u-boot-spl.bin" for the transfer.
4. After the image is successfully downloaded, the ROM will boot the SPL.
5. When "CCCC" characters appear on the TeraTerm window, from the File Menu, select Transfer →
YMODEM → Send (1K mode).
6. Select "u-boot.img" for the transfer.
7. After the image is successfully downloaded, U-Boot will boot.
8. Hit <Enter> and go to the U-Boot prompt "U-Boot#".
Flashing Images to SPI in UART Boot Mode

This section describes how to flash the SPI images from UART boot mode.
1. Boot using UART boot mode. After the U-Boot prompt comes up, the images for the first and second
stages can be flashed to SPI for persistent storage.
2. Configure the U-Boot network settings for either static or dynamic IP.
3. Set the tftp server.
4. Select the SPI flash for SPL and U-Boot images.
U-Boot# sf probe 0
5. Erase the SPI flash.
U-Boot# sf erase 0 +E0000
6. Download SPL from the TFTP server and write to the SPI flash.
7. Execute the following code.
U-Boot# tftp MLO.byteswap
U-Boot# sf write ${loadaddr} 0 ${filesize}
8. Download U-Boot from the TFTP server and write to the SPI flash.
U-Boot# tftp u-boot.img
U-Boot# sf write ${loadaddr} 0x80000 ${filesize}
10. Download the kernel image from the TFTP server, erase, and write to the SPI flash.
U-Boot# tftp uImage
U-Boot# sf erase 0xE0000 0x362000
U-Boot# sf write ${loadaddr} 0xE0000 ${filesize}
13. Set boot switch settings for SPI boot and reboot the board.
14. If no error messages are display and the U-Boot prompt comes up, SPI boot is successful.

6.3.5 Flashing Images to NAND in UART Boot Mode

This section describes how to flash the NAND images from UART boot mode.
1. Boot using UART boot mode. After the U-Boot prompt comes up, the images for the first and second
stages can be flashed to SPI for persistent storage.
2. Configure the U-Boot network settings for either static or dynamic IP.
3. Set the tftp server.
4. 4. Download SPL from the TFTP server, erase, and write image to NAND flash.
U-Boot# tftp MLO
U-Boot# nand erase 0x0 0x20000
U-Boot# nand write ${loadaddr} 0x0 0x20000
7. Download U-Boot from TFTP server, erase, and write image to NAND flash.
U-Boot# tftp u-boot.img
U-Boot# nand erase 0x80000 0x1e0000
U-Boot# nand write ${loadaddr} 0x80000 0x1e0000
10. Download the kernel image from the TFTP server, erase, and write image to NAND flash.
U-Boot# tftp uImage
U-Boot# nand erase 0x280000 0x500000
U-Boot# nand write ${loadaddr} 0x280000 0x500000
13. Set boot switch settings for NAND boot and reboot the board.
14. If no error messages are display and the U-Boot prompt comes up, NAND boot is successful.

Test Data www.ti.com
7 Test Data
• Hardware set
– Tx: DC board
– 15-V Power Supply
– Used WE transformer
• Software set
1. Prime version 7.9.1.0 software tested at the single phase meter and Prime version 3.5.0.0 tested at
the DC side
2. G3 version 7.0.1.2 software tested at the single phase meter and GE version 4.0.0.1 tested at the
DC side
• EVM at room temperature
– 18-dB EVM achieved
– Uncoded D8PSK received without any errors
Table 8. Three Phase Data Concentrator Test Results

TEST NUMBER TEST TYPE TEST DATE TEST RESULT PASS/NO PASS
SUMMARY
1 CENELEC compliance 8/16/2013 CENELEC pass with 3 Pass
with PRIME dB margin
2 PRIME signal injection 8/16/2013 Measured ~1.02 Vrms Pass with 1.02 Vrms
on 2 Ohm load > 1 Vrms on 2-Ohm load
with 100% duty cycle
3 EVM Tests 8/16/2013 18-dB EVM at the room Pass (0 BER with
temp uncoded D8PSK, 18-dB
EVM)
4 Sensitivity tests 8/16/2013 82-dB attenuation for Pass (PRIME Tested at
PRIME BPSK (spec = 83-dB attenuation)
60)
5 Maximum input level 8/16/2013 Max input level of 123 Pass (1.28 Vrms input,
dBuV to receive uncoded D8PSK coding
uncoded 8PSK is ok)
6 ARIB mask 8/16/2013 ARIB conducted Pass
emission passed with 3-
dB margin
110 120
Average Average
100 Quasi-peak 110 Quasi-peak
CENELEC mask (quasi-peak) 100 CENELEC mask (quasi-peak)
90 CENELEC mask (average) CENELEC mask (average)
90
80
Level (dBuV)
Level (dBuV)
80
70
70
60
60
50
50
40 40
30 30
20 20
150 250 350 450 550 650 150 200 250 300 350 400 450 500 550 600 650 700 750
Frequency (Hz) D001
Frequency (Hz) D002
Figure 8. CENELEC Mask (PRIME) External Power Figure 9. CENELEC Mask (PRIME) Onboard Power
Supply Supply

www.ti.com Test Data
120 120
Average CENELEC mask (average)
110 Quasi-peak 110 CENELEC mask (quasi-peak)
100 CENELEC mask (average) 100 Average
CENELEC mask (quasi-peak) Quasi-peak
90 90
Level (dBuV)
Level (dBuV)
80 80
70 70
60 60
50 50
40 40
30 30
20 20
150 250 350 450 550 650 750 150 250 350 450 550 650 750
Frequency (Hz) D003
Frequency (Hz) D004
Figure 10. CENELEC Mask (G3) External Power Supply Figure 11. CENELEC Mask (G3) Onboard Power Supply
120 1x100
Quasi-peak measurments DBP SK
110 Quasi-peak ARIB mask DQP SK
-1
100 1x10 D8P SK
90
1x10-2
Level (dBuV)
80
BER
70 1x10-3
60
50 1x10-4
40
1x10-5
30
20 1x10-6
0.0097 0.2097 0.4097 0.6097 0.8097 1 0 2 4 6 8 10 12
Frequency (Hz) D005 SNR (dB) D006
Figure 12. Conducted Emission For ARIB (G3) Figure 13. BER Measurements

Design Files www.ti.com
8 Design Files
8.1 Schematics
To download the Schematics, see the design files at TIDA-00225.
P1 P2
1 2 DGND 1 2 DGND
3 4 VDD_3V3EXP 3 4 VDD_3V3EXP
5 6 VDD_5V 5 6 VDD_5V
7 8 SYS_5V 7 8 SYS_5V
6 9 10 9 10
TIMER5 TIMER6
6 11 12 6 6 11 12 6
GPIO1_13 GPIO1_12 UART4_RXD GPIO1_28
13 14 6 6 13 14
GPIO0_26 UART4_TXD
15 16 6 15 16 6
GPIO1_15 GPIO1_14 GPIO1_16 GPIO1_17
17 18 3 17 18
GPIO0_27 GPIO2_1
19 20 2,7 19 20 2,7
I2C2_SCL I2C2_SDA
21 22 3 21 22 3
UART2_TXD UART2_RXD
23 24 23 24 7
UART1_TXD
25 26 GPIO1_29 3 25 26 7
UART1_RXD
27 28 27 28 6
SPI1_CS0
29 30 6 SPI1_D0 29 30 6
SPI1_D1
31 32 6 31 32
SPI1_SCLK
33 34 33 34
35 36 35 36
37 38 37 38
39 40 39 40
41 42 41 42
43 44 43 44
45 46 45 46
HEADER 23x2 HEADER 23x2

TSHC-123-D-03-145-GT-LF DGND TSHC-123-D-03-145-GT-LF DGND
DGND DGND
EXPANSION HEADER EXPANSION HEADER
UART4_RXD, UART4_TXD => RF

UART5_RXD, UART5_TXD => RF VDD_3V3EXP
UART1_RTSN (I2C_SCL), UART1_CTSN (I2C_SDA), UART1_RXD, UART1_TXD => PLC (PORTA)
UART2_RXD, UART2_TXD => PLC (PORTB)
SPI1 (CS0, SCLK, D0, D1) => CC1 & CC2
TIMER5 => CC1
TIMER6 => CC2 VDD_3V3EXP
R167 R168 R169
220 220 220
C210
0.1uF
DS1 DS2 DS3
14
VDD_3V3EXP
DGND LED GRN LED GRN LED GRN
U23A
GPIO1_14 2 3 L138_LED1
SN74LV125APWR
1.5K,5%
1.5K,5%
4.75K,5%
4.75K,5%
4.75K,5%
1
7
Expansion Board EEPROM U24B
R3
R4
R5
R6
R7
DGND
GPIO1_15 5 6 L138_LED2
VDD_3V3EXP
U1 SN74LV125APWR
2,7 6 8
I2C2_SCL
4
5 SCL VCC
2,7 I2C2_SDA SDA
SW1 C1
4 0.1uf,16V
1 VSS DGND
2 A0
3 A1 7 WP U24C
A2 WP R8 10K,1%,NO-POP DGND GPIO0_27 9 8 L138_LED3
SW DIP-2 CAT24C256W
SN74LV125APWR
DGND 256KX8
10
DGND
Figure 14. Schematics Page 2 BeagleBone Black Interface Connector on DC-Cape

www.ti.com Design Files
PLC_3V3
R262
10K JP23 JP24
HDR_2_P1_INCH HDR_2_P1_INCH
PLC_RESET
1
2
1
2
R264
P3
NO-POP
2 UART2_TXD R9 NO-POP PLC_RX_B 33 34 PLC_TX_B R11 NO-POP UART2_RXD 2

31 32
2 GPIO2_1 R10 0 PLC_RESET 29 30 PLC_PWM_GPIO04 5
ZERO_PLC_B
27 28
DGND 25 26
PLC_LED2 R260 0 23 24 R259 0 PLC_LED1
21 22
5 ZERO_PLC_C PLC_USBDP 19 20
17 18
PLC_3V3 15 16
R83 10K 13 14 R84 10K
7 UART1_TXD_PLC R14 0 PLC_RX_A 11 12 PLC_TX_A R15 0 UART1_RXD_PLC 7
2 GPIO1_29 R16 0 PLC_EN 9 10 PLC_ZC R17 0 5
ZERO_PLC_A
PLC_15V 7 8 PLC_3V3
R261 5 6
10K 3 4
1 2 4
L1 L2 PL_TXRX
DGND DGND
PLC_EN DGND SFH31-NPPB-D17-SP-BK DGND
VDD_5V
GND_AC_PWR
R263
NO-POP
R258 R256
150 150
DGND
D12 D13
Green LED Green LED
EVM_15V PLC_15V
R18 0
Q4 D Q5 D
G G VDD_3V3EXP PLC_3V3
S S
BSS138 BSS138 R19 0

PLC_LED1
DGND DGND
PLC_LED2
R257 R170
100K 100K
DGND DGND
Figure 15. Schematics Page 3 PLC SOM Connector

5 LINE_AC_N
JP2
HDR_2_P1_INCH
2
1
LINE_N_F
5 LINE_AC_A
P4
JP3
HDR_2_P1_INCH 1
C2
2
2
1
JP20 L16 15uH
1 2 LINE_AC_A_CON 3
.47uF 400v(ECQ-E4474KF 1 L17 600nH
2 1 2 4
3
HEADER 3 5
JP1
HDR_2_P1_INCH 1777574
5 LINE_AC_B
2
1
JP4 Note Board Markings required

T1 HDR_2_P1_INCH
C3
1 9 HAZZARD MARKING
2
1
JP21 L14 15uH
8 LINE_COMB
1
1 2 LINE_AC_B_CON CURRENT AND VOLTAGE
3 .47uF 400v(ECQ-E4474KF L15 600nH
2 2 1 2 MARKINGS
7 LINE_N_F 3
HEADER 3
4
5 6
WURTH_750510476 5 LINE_AC_C
GND_AC_PWR
JP5
HDR_2_P1_INCH
C4
2
1
JP22 L12 15uH
1 2 LINE_AC_C_CON
SD PART# 103531-0001R .47uF 400v(ECQ-E4474KF 1 L13 600nH
2 1 2
3
HEADER 3
PL_TXRX 3
PL_TXRX
R20
4.7
D1
SM6T7V5CA
C5
2200PF 250V
TP1 TP2
GND_AC_PWR
GND_AC_PWR Test Point_0 Test Point_0
DGND
GND_AC_PWR
Figure 16. Schematics Page 4 PLC Interface

VDD_3V3EXP
R222 270
C108
0.1uF
4 LINE_AC_A R269 100K R12 100K R267 100K Q3
LINE_AC_A
BC817-40LT1G
DGND
4
LINE_AC_N
ISO3
FOD817BSD VDD_3V3EXP
R217 D9 U39
3
D8 240K BZV55 C109 R218 0 1 6
DL4148-TP 2 In1 In2 5
3 GND VCC 4
.1uF ZERO_PLC_A 3
In0 Y
SN74LVC1G57DBVR
4,5 R223 DGND C264
LINE_AC_N
1.5K 5 % 0.1uF
DGND
DGND
VDD_3V3EXP
R211 270
C100
0.1uF
4 LINE_AC_B R265 100K R2 100K R1 100K Q1
LINE_AC_B
BC817-40LT1G
DGND
4
LINE_AC_N
ISO1
R209 D2 U40
3
D14 240K BZV55 C101 R210 0 1 6
DL4148-TP 2 In1 In2 5
3 GND VCC 4
.1uF ZERO_PLC_B 3
In0 Y
4,5 1.5K 5 % DGND C265
LINE_AC_N
0.1uF
DGND
DGND
VDD_3V3EXP
R215 270
C102
0.1uF
4 LINE_AC_C R268 100K R270 100K R266 100K Q2
LINE_AC_C
BC817-40LT1G
DGND
4
LINE_AC_N
ISO2
R213 D7 U41
3
D6 240K BZV55 C103 R214 0 1 6
DL4148-TP 2 In1 In2 5
3 GND VCC 4
.1uF ZERO_PLC_C 3
In0 Y
4,5 1.5K 5 % DGND C266
LINE_AC_N
0.1uF
DGND
DGND
Figure 17. Schematics Page 5 Zero Crossing Detector

NOTE: DIMENSIONS AND LOCATIONS OF THESE CONNECTORS MUST MEET SPECIFICATION FOR INTERFACE MODULES
REFERENCE CC2530EMK USER GUIDE (SWRU208) OR SMART GRID EVM DESIGN FILES
Connector P/N: TFM-110-02-SM-D-A-K-TR (Samtec)
1 1
P1 ON CC MODULES P2
P5 ON SMART GRID BOARD P6 VDD_3V3EXP
+
R30 NO-POP TP3 C6 C7
R31 NO-POP TP-20RD10 0.1UF 10UF
TP4
TP-20RD10
TP5
TP-20RD10 DGND
P5 P6
1 2 1 2
2 R32 0 CC1_P0.4 3 4 CC1_P1.3 3 4 R33 0
GPIO1_12
2 R34 0 CC1_P0.1 5 6 CC1_P1.0 5 6 R35 0
GPIO0_26
2 R36 0 CC1_P0.2 7 8 R37 0 7 8
UART4_TXD
2 R38 0 CC1_P0.3 9 10 CC1_P2.1 R39 0 2 9 10
UART4_RXD GPIO1_16
CC1_P0.0 11 12 CC1_P2.2 R40 0 11 12 DGND
CC1_P1.1 13 14 CC1_P1.4 R41 0 13 14
CC1_P0.6 15 16 CC1_P1.5 R42 0 2 GPIO1_17 GPIO1_17 R43 0 RESET_CC1 15 16
TP6 CC1_P0.7 17 18 CC1_P1.6 R44 0 17 18 CC1_P0.5 R45 0 2
GPIO1_28
TP-20RD10 19 20 CC1_P1.7 R46 0 2 GPIO1_13 R47 0 CC1_P2.0 19 20
TP7
TP-20RD10 HEADER 10X2 HEADER 10X2
TP8
TP-20RD10
TP9 DGND
TP-20RD10
TIMER5 2
TIMER5
SPI1_CS0_A
VDD_3V3EXP
SPI1_SCLK 2
SPI1_SCLK
SPI1_D0 2
SPI1_D0
SPI1_D1 SPI1_D1 2
R48 R49
10K 10K
JP6
1 SPI1_CS0_A
2 SPI1_CS0 2
3 SPI1_CS0_B
CON3
Figure 18. Schematics Page 6 CC Interface 1

VDD_3V3EXP
VDD_3V3EXP
R68
0 C10
0.1uF
DGND
R69 VDD_3V3EXP U4
NO-POP TRS3386ECPWR
1 19 VDD_3V3EXP
C12 C1+ VCC
0.1uF 2 C13 0.1uF
DGND 3 V+
C1- 6 C14 0.1uF C15
R70 R71 V-
2.2K 2.2K 4 0.1uF
C11 C2+ 18
0.1uF GND DGND
5 12 DGND
C2- VL DGND
UART1_TXD_RS232 7 17 RSA_TXD P9
DIN1 DOUT1
UART1_RTSN 8 16 RSA_RTS 1
2 I2C2_SCL DIN2 DOUT2 6
9 15 RSA_RXD 2 10
DIN3 DOUT3 RSA_RTS 7
RSA_TXD 3
DGND RSA_CTS 8
20 4 11
PWRDOWN 9
5
UART1_RXD_RS232 11 14 RSA_RXD DB-9-MALE DGND

ROUT1 RIN1
UART1_CTSN 10 13 RSA_CTS DGND
2 I2C2_SDA ROUT2 RIN2
VDD_3V3EXP
R72 R73
10K 10K
JP7
1 UART1_TXD_RS232
2 UART1_TXD 2
3 UART1_TXD_PLC UART1_TXD_PLC3
CON3
VDD_3V3EXP
R74 R75
10K 10K
JP8
1 UART1_RXD_RS232
2 2
UART1_RXD 3 UART1_RXD_PLC
UART1_RXD_PLC 3
CON3
Figure 19. Schematics Page 7 RS232

BeagleBone must supply 5VDC power from external power supply.

Recommended power supply: CUI Inc., 5V/2A, EMMA050200-P5.
L1 10uH
VDD_5V C18 0.1uF

U5 DGND
R76
2 9 0
VIN SW EVM_15V
C19 0.1uF 3 10 R77 0
R78 CP2 VO
C16 C17 10K 4 8 R79 0
22uF 150uF C20 CP1 OUT
PWR_PAD
10uF 5 7
EN FB R80
6 1 294K C21
SS GND 0.01uF
C22 C23
DGND DGND DGND R81 C24 10uF 100uF
11
200K 1uF TPS61093DSK DGND
R82
10.2K DGND DGND
DGND
DGND
2 MTG4
DGND
1 1
MTG5 MTG6
1 1
MTG7 MTG8
1 1
MTG9 MTG10
Figure 20. Schematics Page 8 Power

8.2 Bill of Materials

To download the bill of materials (BOM), see the design files at TIDA-00225.
ITEM QUANTITY DESIGNATOR VALUE MANUFACTURER PARTNUMBER DESCRIPTION

2 3 C2,C3,C4 .47uF 400v(ECQ-E4474KF Panasonic ECQ-E4474KF CAP,MTL POLY,RADIAL,.47uF,400V
3 1 C5 2200PF 250V Kemet Electronics Corporation C0805C103KARACTU CAP,CER,SMT 0805,.01uF,250V,+/-
10%,X7R
4 9 C6,C10,C11,C 0.1uF Kemet Electronics Corporation C0402C104K8PACTU CAP,CER,SMT 0402,.1uF,10V,+/-10%,X5R
12,C13,C14,C1
5,C19,C210
5 1 C7 10UF Kemet Electronics Corporation T491A106M006AT CAP,TANT,SMT 1206,10uF,6.3V
6 1 C16 22uF Kemet Electronics Corporation T491B226K006AT CAP,TANT,SMT 1311,22uF,6.3V
7 1 C17 150uF AVX Corporation TAJC227K006RNJ CAP,TANT,SMT 2312,220uF,6.3V,10%
8 1 C18 0.1uF AVX Corporation 06035C104KAT2A CAP,CER,SMT 0603,.1uF,50V,+/-10%,X7R
9 1 C20 10uF Taiyo Yuden JMK316B7106ML-T CAP,CER,SMT 1206,10uF,6.3V
10 1 C21 0.01uF Kemet Electronics Corporation C0402C103K4RAC CAP,CER,SMT 0402,.01uF,16V,+/-
10%,X7R
11 1 C22 10uF AVX Corporation TAJB106M020R CAP,TANT,SMT 1311,10uF,20V
12 1 C23 100uF Kemet Electronics Corporation T491X107M020AT CAP,TANT,SMT 2816,100uF,20V
13 1 C24 1uF Murata Electronics GRM188R60J105KA01D CAP,CER,SMT 0603,1uF,6.3V,X5R,+/-10%
14 3 C100,C102,C1 0.1uF Yageo CC0805KRX7R9BB104 CAP,CER,SMT 0805,.1uF,50V,+10/-
08 10%,X7R
15 3 C101,C103,C1 .1uF Kemet Electronics Corporation C0402C104K8PACTU CAP,CER,SMT 0402,.1uF,10V,+/-10%,X5R
09
16 3 C264,C265,C2 0.1uF Kemet Electronics Corporation C0402C104K8PACTU CAP,CER,SMT 0402,.1uF,10V,+/-10%,X5R
66
17 3 DS1,DS2,DS3 LED GRN LITEON LTST-C150GKT LED,SMT 1206,GREEN
18 1 D1 SM6T7V5CA ST micro SM6T7V5CA TVS DIODE 6.4VWM 14.5VC SMB
19 3 D2,D7,D9 BZV55 NXP Semiconductors BZV55-C5V6,115 DIODE,SOD80,ZENER,5.6V
20 3 D6,D8,D14 DL4148-TP Microsemi Corp. DL4148-TP DIODE,SMT,SWITCHING
21 2 D12,D13 Green LED LITEON LTST-C170GKT LED,SMT 0805,GREEN
22 3 ISO1,ISO2,ISO FOD817BSD Fairchild Semiconductor FOD817BSD C,SO,OPTOCOUPLER,PHOTOTRANSIST
3 OR
26 1 L1 10uH Sumida Electric Co., Ltd. CDRH5D18NP-100NC INDUCTOR,SMT,10uH,5.7mm SQ.,1.2A
27 3 L12,L14,L16 15uH Coiltronics Incorporated DR1040-150-R INDUCTOR,SMT,15uH,3.1A
28 3 L13,L15,L17 600nH TDK VLCF5020T-2R2N2R6-3
30 w P1,P2 HEADER 23x2 Major League TSHC-123-D-06-240-GT-LF TSHC series 46 position 2.54 mm straight
Thru Hole Connector
31 1 P3 SFH31-NPPB-D17-SP-BK Sullins Electronics, Corp SFH31-NPPB-D17-SP-BK CONN,SMT,VERTICAL,RECEPTACLE,17X
2


32 1 P4 1777574 Pheonix contact 1777574 Fixed Terminal Blocks MKDS 5N HV/5-ZB-
6,35
33 2 P5,P6 HEADER 10X2 Framatome Connectors International 87409-110LF CONN,SMT,VERTICAL,HEADER,10X2,.22
5 HIGH
34 1 P9 DB-9-MALE PI Manufacturing Corp 2100-009P CONN,DB9,MALE,RIGHT ANGLE,.318
35 3 Q1,Q2,Q3 BC817-40LT1G ON Semiconductor BC817-40LT1G TRANSISTOR,SOT23,NPN,GENERAL
36 2 Q4,Q5 BSS138 Zetex, Inc. BSS138TA TRANSISTOR,SOT23,MOSFET,N-
CHANNEL,BSS1
37 9 R1,R2,R12,R2 100K Yageo RC0603JR-07100KL RES,SMT 0603,100K OHM,5%,1/16 WATT
65,R266,R267,
R268,R269,R2
70
38 2 R3,R4 1.5K,5%
39 3 R5,R6,R7 4.75K,5%
42 3 R10,R259,R26 0
0
43 21 R14,R15,R16, 0 Yageo RC0402JR-070RL RES,SMT 0402,0 OHM,1/16 WATT
R17,R32,R33,
R34,R35,R36,
R37,R38,R39,
R40,R41,R42,
R43,R44,R45,
R46,R47,R68
44 2 R18,R19 0 Yageo RC1206JR-070RL RES,SMT 1206,0 OHM,1/4 WATT
45 1 R20 4.7 Yageo RC0805JR-074R7L RES,SMT 0805,4.7 OHM,5%,1/10 WATT
46 7 R48,R49,R72, 10K
R73,R74,R75,
R78
47 2 R70,R71 2.2K Yageo RC0402JR-072K2L RES,SMT 0402,2.2K OHM,5%,1/16 WATT
48 6 R76,R77,R79, 0 Panasonic ERJ-3GEY0R00V RES,SMT 0603,0 OHM,1/16 WATT
R210,R214,
R218
49 1 R80 294K Panasonic ERJ-2RKF2943X RES,SMT 0402,294K,1%,1/16 WATT
50 1 R81 200K Yageo RC0402FR-07200KL RES,SMT 0402,200K OHM,1%,1/16 WATT
51 1 R82 10.2K Panasonic ERJ-2RKF1022X RES,SMT 0402,10.2K OHM,1%,1/16 WATT
52 4 R83,R84,R261, 10K Yageo RC1206JR-070RL RES,SMT 1206,0 OHM,1/4 WATT
R262
53 1 R167 220 Yageo RC0402JR-07220RL RES,SMT 0402,220 OHM,5%,1/16 WATT
54 2 R168,R169 220 Yageo RC0402JR-07360RL RES,SMT 0402,360 OHM,5%,1/16 WATT
55 2 R170,R257 100K Stackpole Electronics RMCF0402FT100K RES 100K OHM 1/16W 1% 0402

56 3 R209,R213,R2 240K Yageo RC0603JR-07240KL RES,SMT 0603,240K OHM,5%,1/16 WATT
17
57 3 R211,R215,R2 270 Panasonic ERJ-3GEYJ271V RES,SMT 0603,270 OHM,5%,1/16 WATT
22
58 3 R212,R216,R2 1.5K 5 % Yageo RC0805JR-071K5L RES,SMT 0805,1.5K OHM,5%,1/10 WATT
23
59 2 R256,R258 150 Stackpole Electronics RMCF0402JT150R RES 150 OHM 1/16W 5% 0402
60 2 R263,R264 NO-POP Yageo RC1206JR-070RL RES,SMT 1206,0 OHM,1/4 WATT
61 1 SW1 SW DIP-2
64 1 T1 WURTH_750510476 WURTH 750510476 PLC Transformer for Texas Instruments
AFE030 / AFE031 / AFE032
65 1 U1 CAT24C256W Catalyst Semiconductor, Inc. CAT24C256WI-G IC,SO8,SERIAL EEPROM,256K-BIT
66 1 U4 TRS3386ECPWR Texas Instruments TRS3386ECPWR IC,TSSOP20,RS-232 TRANSCEIVER
67 1 U5 TPS61093DSK Texas Instruments TPS61093DSKT IC,QFN10,BOOST CONVERTER,LOW
INPUT
68 2 U23,U24 SN74LV125APWR Texas Instruments SN74LV125APWR IC,TSSOP14,QUAD BUS BUFFER
GATE,LOW
69 3 U39,U40,U41 SN74LVC1G57DBVR Texas Instruments SN74LVC1G57DBVR IC,DBV6,CONFIGURABLE MULTIPLE-
FUNCTION

8.3 Layer Plots

To download the layer plots, see the design files at TIDA-00225.
Figure 21. Layer 1 Primary Side Figure 22. Layer 2 Ground Plane 1
Figure 23. Layer 3 Power Figure 24. Layer 4 Secondary Side
Figure 25. Primary Side Soldermask Figure 26. Primary Side Silkscreen

Figure 27. Secondary Side Soldermask Figure 28. Primary Side Solder Stencil
Figure 29. Secondary Side Silkscreen Figure 30. Secondary Side Solder Stencil

8.4 Multilayer Composite Prints

To download the Altium project files for each board, see the design files at TIDA-00225.
Figure 31. Multilayer Composite Print 1
Figure 32. Multilayer Composite Print 2

8.5 Assembly Drawings

To download the Assembly drawings, see the design files at TIDA-00225.
Figure 33. Assembly Drawing 1 Figure 34. Assembly Drawing 2

CAM350 V 10.2.2 : Fri May 16 09:17:00 2014 - (Untitled)
Figure 35. Drill Drawing

8.6 Gerber Files

To download the Gerber files, see the design files at TIDA-00225.
8.7 Software Files

To download the software files for the reference design, see the design files at TIDA-00225
9 References
1. Beagleboard:BeagleBoneBlack (Link: BeagleBone Black)
2. Smart Data Concentrator EVM (TMDSDC3359) Hardware Manual - Key Features (Link:
TMDSDC3359)
10 About the Author

KALLIKUPPA MUNIYAPPA SREENIVASA is a Systems Architect at Texas Instruments, where he is
responsible for developing reference design solutions for the industrial segment. Sreenivasa brings to this
role his experience in high-speed digital and analog systems design. Sreenivasa earned his Bachelor of
Electronics (BE) in Electronics and Communication Engineering (BC-E&C) from VTU, Mysore, India.

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TI Designs

Data Concentrator Cape for BeagleBone Black

TI Designs Design Features

Zero Cross 3 Phase

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TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 1

1.1 Advanced Metering Infrastructure (AMI)

2 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

AMI Communications Technologies

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 3

Table 1. Design Features

Zero Cross 3 Phase

4 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

4.1 BeagleBone Black

4.2 PLC SOM Interface

4.3 Low Power RF Interface

4.4 Serial Communication - RS232 Interface

4.5 Power Supply and EEPROM

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 5

5 Circuit Design and Component Selection

5.1 BeagleBone Black Features

Table 2. BeagleBone Black Features (1)

6 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

HEADER 23x2 HEADER 23x2

EXPANSION HEADER EXPANSION HEADER

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 7

5.2 PLC SOM Interface

5.2.1 Zero-Crossing Detection

Figure 2. PLC SOM Interface Zero-Crossing Detection

8 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

5.2.2 AC Power Input

JP1 Note Board Markings required

Figure 3. PLC SOM Interface AC Power Input

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 9

Do not leave the board powered when unattended.

Table 3. PLC Connector Functions

Table 4. PLC Transformer Characteristics

5.2.3 System-on-Module Interface

10 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

2 UART2_TXD R9 NO-POP PLC_RX_B 33 34 PLC_TX_B R11 NO-POP UART2_RXD 2

DGND SFH31-NPPB-D17-SP-BK DGND

Figure 4. System-on-Module Interface

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 11

Table 5 shows the SOM connector pinouts.

5.3 Low Power RF Interface

12 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

5.3.1 SOM - Interface Connector

Table 6. CC1 (P5 and P6) Pinout

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 13

Figure 5 shows the schematic for the interface connector on DC-Cape.

Figure 5. RF Interface Connector on DC-Cape

14 Data Concentrator Cape for BeagleBone Black TIDU330 – June 2014

5.4 Serial Communication - RS232 DTE Interface

Table 7. P9 DB9 Connector

UART1_RXD_RS232 11 14 RSA_RXD DB-9-MALE DGND

Figure 6. RS232 Interface

TIDU330 – June 2014 Data Concentrator Cape for BeagleBone Black 15

5.5 Power Supply and EEPROM

VDD_5V C18 0.1uF