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    SOT223

    Uploaded by

    X'mix Đreamer
    This document provides information about the SOT223 surface mount plastic package including mechanical data, package outline dimensions, suggested pad layout, packing quantities, tape orientation, and embossed carrier tape specifications.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    SOT223

    Uploaded by

    X'mix Đreamer
    123 views5 pages
    This document provides information about the SOT223 surface mount plastic package including mechanical data, package outline dimensions, suggested pad layout, packing quantities, tape orientation, and embossed carrier tape specifications.

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    This document provides information about the SOT223 surface mount plastic package including mechanical data, package outline dimensions, suggested pad layout, packing quantities, tape orientation, and embossed carrier tape specifications.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    123 views5 pages

    SOT223

    Uploaded by

    X'mix Đreamer
    This document provides information about the SOT223 surface mount plastic package including mechanical data, package outline dimensions, suggested pad layout, packing quantities, tape orientation, and embossed carrier tape specifications.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    SOT223

    PACKAGE INFORMATION

    Mechanical Data Package View


     Surface Mount Package
     Case Material: Molded Plastic,
    UL Flammability Rating 94V-0
     Terminals: Finish - Matte Tin.
    Solderable per MIL-STD-202, Method 208 e3

     Weight: 0.112 grams (Approximate)

    Top View

    Package Outline Dimensions


    SOT223
    D
    b1 Q
    C

    SOT223
    Dim Min Max Typ
    A 1.55 1.65 1.60
    A1 0.010 0.15 0.05
    E E1
    b 0.60 0.80 0.70
    b1 2.90 3.10 3.00
    Gauge
    Plane C 0.20 0.30 0.25
    0.25 D 6.45 6.55 6.50
    Seating E 3.45 3.55 3.50
    Plane
    L
    E1 6.90 7.10 7.00
    e1 b e - - 4.60
    0°
    -1
    e 0° e1 - - 2.30
    L 0.85 1.05 0.95
    Q 0.84 0.94 0.89
    A A1 7° All Dimensions in mm
    7°

    Suggested Pad Layout


    SOT223
    X1

    Y1

    Dimensions Value (in mm)


    C 2.30
    C1 6.40
    X 1.20
    C1 Y2 X1 3.30
    Y 1.60
    Y1 1.60
    Y2 8.00

    X C

    Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
    These dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for
    wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A,
    Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

    Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance
    distances between device Terminals and PCB tracking.

    SOT223 Package Information 1 of 5 March 2017


    Rev. 2017-03-06 www.diodes.com © Diodes Incorporated
    SOT223

    Minimum Packing Quantity


    Quantity Tape Width Part Number Suffix
    Tube 75
    7” Reel 1,000 12mm TA
    13” Reel 2,500 12mm -13
    13" Reel 4,000 12mm TC

    Note: Package quantities given are for minimum packaging quantity only, not minimum order quantity. For minimum order quantity, please contact Sales
    Department.
    Note: No mixed date codes or partial quantity (less than minimum packaging quantity) per packaging is allowed.
    Note: In no case shall there be two or more consecutive components missing from any reel for any reason.

    Device Tape Orientation


    Tape Width Part Number Suffix Tape Orientation

    Pin 1

    -13
    TA
    12mm
    TC

    Direction of feed
    Note: For part marking, refer to product datasheet.
    Note: Tape and package drawings are not to scale and are shown for device tape orientation only.

    Embossed Carrier Tape Specifications

    Tape Width (W) Dimension Value (mm) Dimension Value (mm) Dimension Value (mm)

    B1 8.2 max. F 5.5±0.05 P2 2.0±0.05


    D 1.5+0.10 -0.0 K 4.5 max. t 0.40 max.
    D1 1.5 min. P 8.0±0.10 W 12±0.30
    12mm
    E 1.75±0.10 P0 4.0±0.10
    Determined by component size. The clearance between the component and the cavity must comply
    A0 B0 K0 to the rotational and lateral movement requirement provided in figures in the "Maximum Component
    Movement in Tape Pocket” section.

    SOT223 Package Information 2 of 5 March 2017


    Rev. 2017-03-06 www.diodes.com © Diodes Incorporated
    SOT223

    SOT223 Package Information 3 of 5 March 2017


    Rev. 2017-03-06 www.diodes.com © Diodes Incorporated
    SOT223

    Maximum Component Movement in Tape Pocket

    SOT223 Package Information 4 of 5 March 2017


    Rev. 2017-03-06 www.diodes.com © Diodes Incorporated
    SOT223

    Surface Mount Reel Specifications

    A B Max C D Max N Min G T Max


    Tape Width Reel Size
    (mm) (mm) (mm) (mm) (mm) (mm) (mm)

    7” 178 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 0.2 55 5 12.4 +2.0 -0.0 18.4
    12mm
    13” 330 2 2.0 +0.5 -0 13 +0.5 -0.2 20.5 0.2 100 2 12.4 +2.0 -0.0 18.4

    Tape Leader and Trailer Specifications

    Note: There shall be a leader of at least 230mm which may consist of carrier tape and/or cover tape or a start tape followed by at least 160mm of
    empty carrier tape sealed with cover tape.

    Note: There shall be a trailer of at least 160mm of empty carrier tape sealed with cover tape. The entire carrier tape must release from the reel
    hub as the last portion of the tape unwinds from the reel without damage to the carrier tape and the remaining components in the cavities.

    SOT223 Package Information 5 of 5 March 2017


    Rev. 2017-03-06 www.diodes.com © Diodes Incorporated

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