AMIS-30532

Micro-Stepping Motor
Driver
Introduction
The AMIS−30532 is a micro−stepping stepper motor driver for
bipolar stepper motors. The chip is connected through I/O pins and an www.onsemi.com
SPI interface with an external microcontroller. It has an on−chip
voltage regulator, reset−output and watchdog reset, able to supply
peripheral devices. The AMIS−30532 contains a current−translation
table and takes the next micro−step depending on the clock signal on
the “NXT” input pin and the status of the “DIR” (=direction) register
or input pin. The chip provides a so−called “speed and load angle”
output. This allows the creation of stall detection algorithms and
NQFP−32, 7x7
control loops based on load−angle to adjust torque and speed. It is CASE 560AA
using a proprietary PWM algorithm for reliable current control.
The AMIS−30532 is implemented in I2T100 technology, enabling
both high−voltage analog circuitry and digital functionality on the
MARKING DIAGRAM
same chip. The chip is fully compatible with the automotive voltage
requirements.
The AMIS−30532 is ideally suited for general−purpose stepper
motor applications in the automotive, industrial, medical, and marine
environment. With the on−chip voltage regulator it further reduces the
BOM for mechatronic stepper applications.

Key Features
• Dual H−Bridge for 2−Phase Stepper Motors
• Programmable Peak−Current up to 1.6 A Continuous† (3.0 A Short
Time) using a 5−bit Current DAC
• On−Chip Current Translator
• SPI Interface
• Speed and Load Angle Output
A = Assembly Location
• Seven Step Modes from Full−Step Up to 32 Micro−Steps WL = Wafer Lot
• Fully Integrated Current−Sense YY = Year
WW = Work Week
• PWM Current Control with Automatic Selection of Fast and Slow G = Pb−Free Designator
Decay CCCCC = Country of Assembly
• Low EMC PWM with Selectable Voltage Slopes
• Active Fly−Back Diodes
ORDERING INFORMATION
• Full Output Protection and Diagnosis See detailed ordering and shipping information in the package
• Thermal Warning and Shutdown dimensions section on page 27 of this data sheet.

• Compatible with 5 V and 3.3 V Microcontrollers

• Integrated 5 V Regulator to Supply External Microcontroller
• Integrated Reset Function to Reset External Microcontroller
• Integrated Watchdog Function
• These Devices are Pb−Free and are RoHS Compliant*

†Output current level may be limited by ambient temperature and heat sinking.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

© Semiconductor Components Industries, LLC, 2015 1 Publication Order Number:

March, 2015 − Rev. 2 AMIS−30532/D
 AMIS−30532

Block DIAGRAM

VDD CPN CPP VCP VBB

CLK Timebase Vreg Chargepump

POR EMC MOTXP

CS P
T W
OTP R
DI SPI M
A MOTXN
I−sense
DO N
S
L
NXT A
Logic & Load EMC
T MOTYP
DIR Registers Angle O P
R W
SLA M
Temp . I−sense MOTYN
POR/WD Sense

CLR
Band− AMIS−30532
ERR gap

GND
Figure 1. Block Diagram AMIS−30532

Table 1. PIN LIST AND DESCRIPTION

Equivalent
Name Pin Description Type Schematic
GND 1 Ground Supply
DI 2 SPI Data In Digital Input Type 2
CLK 3 SPI Clock Input Digital Input Type 2
NXT 4 Next Micro−Step Input Digital Input Type 2
DIR 5 Direction Input Digital Input Type 2
ERR 6 Error Output (Open Drain) Digital Output Type 4
SLA 7 Speed Load Angle Output Analog Output Type 5
/ 8 No Function (to be left open in normal operation)
CPN 9 Negative Connection of Charge Pump Capacitor High Voltage
CPP 10 Positive Connection of Charge Pump Capacitor High Voltage
VCP 11 Charge−Pump Filter−Capacitor High Voltage
CLR 12 “Clear” = Chip Reset Input Digital Input Type 1
CS 13 SPI Chip Select Input Digital Input Type 2
VBB 14 High Voltage Supply Input Supply Type 3
MOTYP 15, 16 Negative End of Phase Y Coil Output Driver Output
GND 17, 18 Ground, Heat Sink Supply
MOTYN 19, 20 Positive End of Phase Y Coil Output Driver Output
MOTXN 21, 22 Positive End of Phase X Coil Output Driver Output
GND 23, 24 Ground, Heat Sink Supply
MOTXP 25, 26 Negative End of Phase X Coil Output Driver Output
VBB 27 High Voltage Supply Input Supply Type 3
/ 30 No Function (to be left open in normal operation)
POR/WD 28 Power−On−Reset and Watchdog Reset Output (Open Drain) Digital Output Type 2
TST0 29 Test Pin Input (to be tied to ground in normal operation) Digital Input
DO 31 SPI Data Output (Open Drain) Digital Output Type 4
VDD 32 Logic Supply Output (needs external decoupling capacitor) Supply Type 6

www.onsemi.com
2
 AMIS−30532

PIN DESCRIPTION

POR/WD

MOTXP
MOTXP
TST0
VDD

VBB
DO
32 31 30 29 28 27 26 25

GND 1 24 GND
DI 2 23 GND
CLK 3 22
MOTXN
NXT 4 21 MOTXN
DIR 5
AMIS −30532 20 MOTYN
ERR 6 19
MOTYN
SLA 7 18
GND
8 17 GND

9 10 11 12 13 14 15 16

MOTYP
MOTYP
CPP
VCP
CLR
CS
VBB
CPN

Figure 2. Pin Out AMIS−30532

Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Min Max Unit
VBB Analog DC Supply Voltage (Note 1) −0.3 +40 V

TST Storage Temperature −55 +160 °C

TJ Junction Temperature under bias (Note 2) −50 +175 °C
VESD Electrostatic discharges on component level, All pins (Note 3) −2 +2 kV
VESD Electrostatic discharges on component level, HiV pins (Note 4) −8 +8 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. For limited time < 0.5 s.
2. Circuit functionality not guaranteed.
3. Human Body Model (100 pF via 1.5 kW, according to JEDEC EIA−JESD22−A114−B).
4. HiV = High Voltage Pins MOTxx, VBB, GND; (100 pF via 1.5 kW, according to JEDEC EIA−JESD22−A114−B).

Table 3. THERMAL RESISTANCE

Thermal resistance

Junction – to – Ambient

Package Junction – to – Exposed Pad 1S0P board 2S2P board Unit

NQFP−32 0,95 60 30 K/W

www.onsemi.com
3
 AMIS−30532

EQUIVALENT SCHEMATICS

Following figure gives the equivalent schematics of the user relevant inputs and outputs. The diagrams are simplified
representations of the circuits used.

4K
IN
OUT

Rin
TYPE 1: CLR input TYPE 4: DO and ERRB open drain outputs

4K
IN Rout
SLA

TYPE 2 : CLK , DI, CSB , NXT , DIR inputs TYPE 5: SLA analog output

VDD VBB

VDD VBB

.
TYPE 3: VDD and VBB power supply inputs

Figure 3. In− and Output Equivalent Diagram

PACKAGE THERMAL CHARACTERISTICS

The AMIS−30532 is available in a NQFP32 package. For The Rthja for 2S2P is simulated conform JEDEC
cooling optimizations, the NQFP has an exposed thermal JESD−51 as follows:
pad which has to be soldered to the PCB ground plane. The • A 4−layer printed circuit board with inner power planes
ground plane needs thermal vias to conduct the heat to the and outer (top and bottom) signal layers is used
bottom layer. Figure 3 gives an example for good power • Board thickness is 1.46 mm (FR4 PCB material)
distribution solutions.
• The 2 signal layers: 70 mm thick copper with an area of
For precise thermal cooling calculations the major
5500 mm2 copper and 20% conductivity
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are: • The 2 power internal planes: 36 mm thick copper with
• Static environmental air (via the case) an area of 5500 mm2 copper and 90% conductivity
The Rthja for 1S0P is simulated conform to JEDEC
• PCB board copper area (via the exposed pad) JESD−51 as follows:
The thermal resistances are presented in Table 5: DC
Parameters.
• A 1−layer printed circuit board with only 1 layer
The major thermal resistances of the device are the Rth • Board thickness is 1.46 mm (FR4 PCB material)
from the junction to the ambient (Rthja) and the overall Rth • The layer has a thickness of 70 mm copper with an area
from the junction to exposed pad (Rthjp). In Table 5 below of 5500 mm2 copper and 20% conductivity
one can find the values for the Rthja and Rthjp, simulated
according to JESD−51:

www.onsemi.com
4
 AMIS−30532

ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
NQFP−32

ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏÏ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
Figure 4. Example of NQFP-32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)

ELECTRICAL SPECIFICATION

Recommend Operation Conditions ranges is not guaranteed. Operating outside the

Operating ranges define the limits for functional recommended operating ranges for extended periods of time
operation and parametric characteristics of the device. Note may affect device reliability.
that the functionality of the chip outside these operating
Table 4. OPERATING RANGES
Symbol Parameter Min Max Unit
VBB Analog DC Supply +6 +30 V

TJ Junction Temperature (Note 5) −40 +172 °C

5. No more than 100 cumulative hours in life time above Ttw.

www.onsemi.com
5
 AMIS−30532

Table 5. DC PARAMETERS (The DC parameters are given for VBB and temperature in their operating ranges unless otherwise
specified) Convention: currents flowing in the circuit are defined as positive.

Symbol Pin(s) Parameter Remark/Test Conditions Min Typ Max Unit

SUPPLY AND VOLTAGE REGULATORS

VBB Nominal operating supply range 6 30 V

VBB
IBB Total current consumption (Note 6) Unloaded outputs 8 mA
VDD Regulated output voltage 4.50 5 5.50 V
IINT Internal load current (Note 6) Unloaded outputs 8 mA
ILOAD Max output current (external and 6 V < VBB < 8 V 20 mA
VDD internal loads)
8 V < VBB < 30 V 50 mA
IDDLIM Current limitation Pin shorted to ground 150 mA
ILOAD_PD Output current in powerdown 1 mA
POWER−ON−RESET (POR)
VDDH Internal POR comparator threshold VDD rising 4.0 4.25 4.4 V
VDD
VDDL Internal POR comparator threshold VDD falling 3.68 V
MOTORDRIVER
IMDmax,Peak Max current through motor coil in 3015 mA
normal operation

IMDmax,RMS Max RMS current through coil in 2132 mA

normal operation

IMDabs Absolute error on coil current −10 10 %

IMDrel Error on current ratio Icoilx / Icoily −7 7 %
ISET_TC1 Temperature coefficient of coil cur- −40°C v TJ v 160°C −250 ppm/k
rent set−level, CUR[4:0] = 0...27

ISET_TC2 Temperature coefficient of coil cur- −40°C v TJ v 160°C −460 ppm/k

rent set−level, CUR[4:0] = 28...31
RHS MOTXP On−resistance high−side driver, VBB = 12 V, TJ = 27°C 0.35 W
MOTXN CUR[4:0] = 0...31 (Note 7)
MOTYP VBB = 12 V, TJ = 160°C 0.47 0.70 W
MOTYN
RLS3 On−resistance low−side driver, VBB = 12 V, TJ = 27°C 0.35 W
CUR[4:0] = 23...31 (Note 7)
VBB = 12 V, TJ = 160°C 0.56 0.70 W
RLS2 On−resistance low−side driver, VBB = 12 V, TJ = 27°C 0.65 W
CUR[4:0] = 16...22 (Note 7)
VBB = 12 V, TJ = 160°C 0.9 1.25 W
RLS1 On−resistance low−side driver, VBB = 12 V, TJ = 27°C 1.25 W
CUR[4:0] = 9...15 (Note 7)
VBB = 12 V, TJ = 160°C 1.7 2.5 W
RLS0 On−resistance low−side driver, VBB = 12 V, TJ = 27°C 2.5 W
CUR[4:0] = 0...8 (Note 7)
VBB = 12 V, TJ = 160°C 3.2 5.0 W
IMpd Pulldown current HiZ mode 5.0 mA
DIGITAL INPUTS
Ileak DI, CLK Input leakage (Note 8) TJ = 160°C 1 mA
NXT, DIR
VinL CLR, CS Logic low threshold 0 0.65 V
VinH Logic high threshold 2.35 VDD V
Rpd_CLR CLR Internal pulldown resistor 120 300 kW
Rpd_TST TST0 Internal pulldown resistor 3 9 kW
6. Current with oscillator running, all analogue cells active, SPI communication and NXT pulses applied. No floating inputs. Parameter
guaranteed by design.
7. Characterization Data Only
8. Not valid for pins with internal pulldown resistor.

www.onsemi.com
6
 AMIS−30532

Table 5. DC PARAMETERS (The DC parameters are given for VBB and temperature in their operating ranges unless otherwise
specified) Convention: currents flowing in the circuit are defined as positive.

Symbol Pin(s) Parameter Remark/Test Conditions Min Typ Max Unit

DIGITAL OUTPUTS
VOL DO, ERR, Logic Low level open drain IOL = 5 mA 0.5 V
POR/WD

THERMAL WARNING AND SHUTDOWN

Ttw Thermal warning 138 145 152 °C
Ttsd Thermal shutdown (Notes 9 Ttw + 20 °C
and 10)

CHARGE PUMP
Vcp Output voltage 6 V< VBB < 15 V 2*VBB–1.5 V

VCP 15 V < VBB < 30 V VBB+8 VBB+11.5 VBB+15 V

Cbuffer External buffer capacitor 180 220 470 nF
Cpump CPP CPN External pump capacitor 180 220 470 nF
PACKAGE THERMAL RESISTANCE VALUE
Rthja Thermal Resistance Junction−to− Simulated Conform JEDEC 30 K/W
Ambient JESD−51, (2S2P)
NQFP
Rthjp Thermal Resistance Junction−to− 0.95 K/W
Exposed Pad

SPEED AND LOAD ANGLE OUTPUT

Vout Output Voltage Range 0.2 VDD − V
0.2
Voff Output Offset SLA Pin SLAG = 0 −50 50 mV
SLAG = 1 −30 30 mV
Gsla SLA Gain of SLA Pin = VBEMF/Vcoil SLAG = 0 0.5
SLAG = 1 0.25
Rout Output Resistance SLA Pin 0.23 1.0 kW
CLOAD Load Capacitance SLA Pin 50 pF
9. No more than 100 cumulated hours in life time above Ttw.
10. Thermal shutdown is derived from thermal warning Characterization Data Only.

www.onsemi.com
7
 AMIS−30532

Table 6. AC PARAMETERS (The AC parameters are given for VBB and temperature in their operating ranges)
Symbol Pin(s) Parameter Remark/Test Conditions Min Typ Max Unit
INTERNAL OSCILLATOR

fosc Frequency of internal oscillator 3.6 4.0 4.4 MHz

MOTORDRIVER
fPWM PWM frequency Frequency depends only on 20.8 22.8 24.8 kHz
internal oscillator
MOTxx Double PWM frequency 41.6 45.6 49.6 kHz
fd PWM Jitter depth (Note 11) 10 % fPWM
Tbrise Turn−on voltage slope, 10% to 90% EMC[1:0] = 00 350 V/ms
EMC[1:0] = 01 250 V/ms
MOTxx
EMC[1:0] = 10 200 V/ms
EMC[1:0] = 11 100 V/ms
Tbfall Turn−off voltage slope, 90% to 10% EMC[1:0] = 00 350 V/ms
EMC[1:0] = 01 250 V/ms
MOTxx
EMC[1:0] = 10 200 V/ms
EMC[1:0] = 11 100 V/ms
DIGITAL OUTPUTS
TH2L DO Output fall−time from VinH to VinL Capacitive load 400 pF and 50 ns
ERR pullup resistor of 1.5 kW
CHARGE PUMP
fCP CPN CPP Charge pump frequency 250 kHz
TCPU MOTxx Start−up time of charge pump Spec external components in 5 ms
(Note 12) Table 8

CLR FUNCTION
TCLR CLR Hard reset duration time 100 ms
POWERUP
tPU Powerup time VBB = 12 V, ILOAD = 50 mA, 110 ms
CLOAD = 220 nF
POR /
tPOR WD Reset duration See Figure 16 100 ms
tRF Reset filter time See Figure 16 1.0 ms
WATCHDOG
tWDTO Watchdog time out interval 32 512 ms
POR /
tWDPR WD Prohibited watchdog acknowledge 2.0 ms
delay

NXT FUNCTION
tNXT_HI NXT Minimum, High Pulse Width See Figure 5 2.0 ms
tNXT_HI NXT Minimum, Low Pulse Width See Figure 5 2.0 ms
tDIR_SET NXT NXT Hold Time, Following Change of See Figure 5 0.5 ms
DIR

tDIR_HOLD NXT Hold Time, Before Change of DIR See Figure 5 0.5 ms
11. Characterization Data Only
12. Guaranteed by design

www.onsemi.com
8
 AMIS−30532

tNXT_HI tNXT_LO

0.5 VCC
NXT

tDIR_SET tDIR_HOLD

ÎÎ ÎÎÎÎÎÎÎÎÎÎ
DIR ÎÎ
ÎÎ VALID ÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎ
Figure 5. NXT−Input Timing Diagram

Table 7. SPI TIMING PARAMETERS

Symbol Parameter Min Typ Max Unit
tCLK SPI Clock Period 1 ms

tCLK_HIGH SPI Clock High Time 100 ns

tCLK_LOW SPI Clock Low Time 100 ns
tSET_DI DI Set Up Time, Valid Data Before Rising Edge of CLK 50 ns
tHOLD_DI DI Hold Time, Hold Data After Rising Edge of CLK 50 ns
tCSB_HIGH CS High Time 2.5 ms
tSET_CSB CS Set Up Time, CS Low Before Rising Edge of CLK 100 ns
tSET_CLK CLK Set Up Time, CLK Low Before Rising Edge of CS 100 ns

CS 0. 2 V CC 0 .2 VCC

tSET _CSB tCLK tSET_CLK

0 .8 V CC
CLK 0 .2 VCC 0.2 VCC
tCLK_HI tCLK _LO

ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ
tSET_DI tHOLD_DI

ÎÎÎ 0.8 VCC

ÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎ
DI VALID

Figure 6. SPI Timing

www.onsemi.com
9
 AMIS−30532

TYPICAL APPLICATION SCHEMATIC

D1
100 nF 100 nF 100 nF
VBAT
C2 C1
C4 C3
C5 C6 100 μF
R2 R3 R4
100 nF VDD VBB VBB
220 nF
32 14 27
VCP
11
POR/WD CPN
28 9
C7
DIR
5
NXT
AMIS−3053 210 220 nF
4 CPP
DO 31 MOTXP
25, 26
DI
2
μC CLK
3 21, 22
MOTXN

CS 13 M
CLR MOTYP
12 15, 16
ERR 6 MOTYN
19, 20
SLA
7
R1
C8 1 17 18 23 24 29
TSTO
GND

Figure 7. Typical Application Schematic AMIS−30532

Table 8. EXTERNAL COMPONENTS LIST AND DESCRIPTION

Component Function Typ Value Tolerance Unit
C1 VBB Buffer Capacitor (Note 13) 100 −20 +80% mF

C2, C3 VBB Decoupling Block Capacitor 100 −20 +80% nF

C4 VDD Buffer Capacitor 100 $20% nF
C5 VDD Buffer Capacitor 100 $20% nF
C6 Charge Pump Buffer Capacitor 220 $20% nF
C7 Charge Pump Pumping Capacitor 220 $20% nF
C8 Low Pass Filter SLA 1 $20% nF
R1 Low Pass Filter SLA 5.6 $1% kW
R2, R3, R4 Pullup Resistor Open Drain Output 4.7 $1% kW
D1 Optional Reverse Protection Diode MURD530
13. ESR < 1 W.

www.onsemi.com
10
 AMIS−30532

FUNCTIONAL DESCRIPTION

H−Bridge Drivers transistors will be adapted such that excellent current−sense

A full H−bridge is integrated for each of the two stator accuracy is maintained. The RDS(on) of the high−side
windings. Each H−bridge consists of two low−side and two transistors remain unchanged, see Table 5 DC Parameters
high−side N−type MOSFET switches. Writing logic ‘0’ in for more details.
bit <MOTEN> disables all drivers (high−impedance).
Writing logic ‘1’ in this bit enables both bridges and current PWM Current Control
can flow in the motor stator windings. A PWM comparator compares continuously the actual
In order to avoid large currents through the H−bridge winding current with the requested current and feeds back
switches, it is guaranteed that the top− and bottom−switches the information to a digital regulation loop. This loop then
of the same half−bridge are never conductive generates a PWM signal, which turns on/off the H−bridge
simultaneously (interlock delay). switches. The switching points of the PWM duty−cycle are
A two−stage protection against shorts on motor lines is synchronized to the on−chip PWM clock. The frequency of
implemented. In a first stage, the current in the driver is the PWM controller can be doubled and an artificial jitter
limited. Secondly, when excessive voltage is sensed across can be added (see SPI Control Parameter Overview PWMJ).
the transistor, the transistor is switched−off. The PWM frequency will not vary with changes in the
In order to reduce the radiated/conducted emission, supply voltage. Also variations in motor−speed or
voltage slope control is implemented in the output switches. load−conditions of the motor have no effect. There are no
The output slope is defined by the gate−drain capacitance of external components required to adjust the PWM frequency.
output transistor and the (limited) current that drives the
Automatic Forward and Slow−Fast Decay
gate. There are two trimming bits for slope control (see SPI The PWM generation is in steady−state using a
Control Parameter Overview EMC[1:0]). combination of forward and slow−decay. The absence of
The power transistors are equipped with so−called “active fast−decay in this mode, guarantees the lowest possible
diodes”: when a current is forced trough the transistor switch current−ripple “by design”. For transients to lower current
in the reverse direction, i.e. from source to drain, then the levels, fast−decay is automatically activated to allow
transistor is switched on. This ensures that most of the high−speed response. The selection of fast or slow decay is
current flows through the channel of the transistor instead of completely transparent for the user and no additional
through the inherent parasitic drain−bulk diode of the parameters are required for operation.
transistor.
Depending on the desired current range and the
micro−step position at hand, the RDS(on) of the low−side

Icoil

Set value

Actual value

t
0

TPWM

Forward & Slow Decay Forward & Slow Decay

Fast Decay & Forward

Figure 8. Forward and Slow/Fast Decay PWM

www.onsemi.com
11
 AMIS−30532

Automatic Duty Cycle Adaptation process is completely automatic and requires no additional
In case the supply voltage is lower than 2*Bemf, then the parameters for operation. The over−all current−ripple is
duty cycle of the PWM is adapted automatically to > 50% to divided by two if PWM frequency is doubled (see SPI
maintain the requested average current in the coils. This Control Parameter Overview PWMF).

Icoil
Duty Cycle
< 50% Duty Cycle >50% Duty Cycle < 50%

Actual value
Set value

TPWM

Figure 9. Automatic Duty Cycle Adaptation

Step Translator and Step Mode When remaining in the same step mode, subsequent
The step translator provides the control of the motor by translator positions are all in the same column and increased
means of SPI register Stepmode: SM[2:0], SPI register or decreased with 1. Table 10 lists the output current versus
DIRCNTRL, and input pins DIR and NXT. It is translating the translator position.
consecutive steps in corresponding currents in both motor As shown in Figure 10 the output current−pairs can be
coils for a given step mode. projected approximately on a circle in the (Ix, Iy) plane.
One out of seven possible stepping modes can be selected There are, however, two exceptions: uncompensated half
through SPI−bits SM[2:0] (see SPI Control Parameter step and full step. In these step modes the currents are not
Overview). After power−on or hard reset, the coil−current regulated to a fraction of Imax but are in all intermediate steps
translator is set to the default 1/32 micro−stepping at regulated at 100%. In the (Ix, Iy) plane the current−pairs are
position ‘0’. Upon changing the step mode, the translator projected on a square. Table 9 lists the output current versus
jumps to position 0* of the corresponding stepping mode. the translator position for these cases.

Table 9. SQUARE TRANSLATOR TABLE FOR FULL STEP AND UNCOMPENSATED HALF STEP
Stepmode ( SM[2:0] ) % of Imax

101 110

MSP[6:0] Uncompensated Half−Step Full Step Coil x Coil y

000 0000 0* − 0 100

001 0000 1 1 100 100

010 0000 2 − 100 0
011 0000 3 2 100 −100
100 0000 4 − 0 −100
101 0000 5 3 −100 −100
110 0000 6 − −100 0
111 0000 7 0 −100 100

www.onsemi.com
12
 AMIS−30532

Table 10. CIRCULAR TRANSLATOR TABLE

Stepmode (SM[2:0]) % of Imax

000 001 010 011 100

MSP[6:0] 1/32 1/16 1/8 1/4 1/2 Coil x Coil y

000 0000 ‘0’ 0* 0* 0* 0* 0 100
000 0001 1 − − − − 3.5 98.8
000 0010 2 1 − − − 8.1 97.7
000 0011 3 − − − − 12.7 96.5
000 0100 4 2 1 − − 17.4 95.3
000 0101 5 − − − − 22.1 94.1
000 0110 6 3 − − − 26.7 93
000 0111 7 − − − − 31.4 91.8
000 1000 8 4 2 1 − 34.9 89.5
000 1001 9 − − − − 38.3 87.2
000 1010 10 5 − − − 43 84.9
000 1011 11 − − − − 46.5 82.6
000 1100 12 6 3 − − 50 79
000 1101 13 − − − − 54.6 75.5
000 1110 14 7 − − − 58.1 72.1
000 1111 15 − − − − 61.6 68.6
001 0000 16 8 4 2 1 65.1 65.1
001 0001 17 − − − − 68.6 61.6
001 0010 18 9 − − − 72.1 58.1
001 0011 19 − − − − 75.5 54.6
001 0100 20 10 5 − − 79 50
001 0101 21 − − − − 82.6 46.5
001 0110 22 11 − − − 84.9 43
001 0111 23 − − − − 87.2 38.3
001 1000 24 12 6 3 − 89.5 34.9
001 1001 25 − − − − 91.8 31.4
001 1010 26 13 − − − 93 26.7
001 1011 27 − − − − 94.1 22.1
001 1100 28 14 7 − − 95.3 17.4
001 1101 29 − − − − 96.5 12.7
001 1110 30 15 − − − 97.7 8.1
001 1111 31 − − − − 98.8 3.5
010 0000 32 16 8 4 2 100 0
010 0001 33 − − − − 98.8 −3.5
010 0010 34 17 − − − 97.7 −8.1
010 0011 35 − − − − 96.5 −12.7
010 0100 36 18 9 − − 95.3 −17.4
010 0101 37 − − − − 94.1 −22.1
010 0110 38 19 − − − 93 −26.7
010 0111 39 − − − − 91.8 −31.4
010 1000 40 20 10 5 − 89.5 −34.9
010 1001 41 − − − − 87.2 −38.3
010 1010 42 21 − − − 84.9 −43
010 1011 43 − − − − 82.6 −46.5
010 1100 44 22 11 − − 79 −50
010 1101 45 − − − − 75.5 −54.6
010 1110 46 23 − − − 72.1 −58.1
010 1111 47 − − − − 68.6 −61.6
011 0000 48 24 12 6 3 65.1 −65.1
011 0001 49 − − − − 61.6 −68.6
011 0010 50 25 − − − 58.1 −72.1
011 0011 51 − − − − 54.6 −75.5
011 0100 52 26 13 − − 50 −79
011 0101 53 − − − − 46.5 −82.6
011 0110 54 27 − − − 43 −84.9
011 0111 55 − − − − 38.3 −87.2
011 1000 56 28 14 7 − 34.9 −89.5
011 1001 57 − − − − 31.4 −91.8
011 1010 58 29 − − − 26.7 −93
011 1011 59 − − − − 22.1 −94.1
011 1100 60 30 15 − − 17.4 −95.3
011 1101 61 − − − − 12.7 −96.5
011 1110 62 31 − − − 8.1 −97.7
011 1111 63 − − − − 3.5 −98.8

www.onsemi.com
13
 AMIS−30532

Table 11. CIRCULAR TRANSLATOR TABLE (CONTINUED)

Stepmode (SM[2:0]) % of Imax
000 001 010 011 100

MSP[6:0] 1/32 1/16 1/8 1/4 1/2 Coil x Coil y

100 0000 64 32 16 8 4 0 −100
100 0001 65 − − − − −3.5 −98.8
100 0010 66 33 − − − −8.1 −97.7
100 0011 67 − − − − −12.7 −96.5
100 0100 68 34 17 − − −17.4 −95.3
100 0101 69 − − − − −22.1 −94.1
100 0110 70 35 − − − −26.7 −93
100 0111 71 − − − − −31.4 −91.8
100 1000 72 36 18 9 − −34.9 −89.5
100 1001 73 − − − − −38.3 −87.2
100 1010 74 37 − − − −43 −84.9
100 1011 75 − − − − −46.5 −82.6
100 1100 76 38 19 − − −50 −79
100 1101 77 − − − − −54.6 −75.5
100 1110 78 39 − − − −58.1 −72.1
100 1111 79 − − − − −61.6 −68.6
101 0000 80 40 20 10 5 −65.1 −65.1
101 0001 81 − − − − −68.6 −61.6
101 0010 82 41 − − − −72.1 −58.1
101 0011 83 − − − − −75.5 −54.6
101 0100 84 42 21 − − −79 −50
101 0101 85 − − − − −82.6 −46.5
101 0110 86 43 − − − −84.9 −43
101 0111 87 − − − − −87.2 −38.3
101 1000 88 44 22 11 − −89.5 −34.9
101 1001 89 − − − − −91.8 −31.4
101 1010 90 45 − − − −93 −26.7
101 1011 91 − − − − −94.1 −22.1
101 1100 92 46 23 − − −95.3 −17.4
101 1101 93 − − − − −96.5 −12.7
101 1110 94 47 − − − −97.7 −8.1
101 1111 95 − − − − −98.8 −3.5
110 0000 96 48 24 12 6 −100 0
110 0001 97 − − − − −98.8 3.5
110 0010 98 49 − − − −97.7 8.1
110 0011 99 − − − − −96.5 12.7
110 0100 100 50 25 − − −95.3 17.4
110 0101 101 − − − − −94.1 22.1
110 0110 102 51 − − − −93 26.7
110 0111 103 − − − − −91.8 31.4
110 1000 104 52 26 13 − −89.5 34.9
110 1001 105 − − − − −87.2 38.3
110 1010 106 53 − − − −84.9 43
110 1011 107 − − − − −82.6 46.5
110 1100 108 54 27 − − −79 50
110 1101 109 − − − − −75.5 54.6
110 1110 110 55 − − − −72.1 58.1
110 1111 111 − − − − −68.6 61.6
111 0000 112 56 28 14 7 −65.1 65.1
111 0001 113 − − − − −61.6 68.6
111 0010 114 57 − − − −58.1 72.1
111 0011 115 − − − − −54.6 75.5
111 0100 116 58 29 − − −50 79
111 0101 117 − − − − −46.5 82.6
111 0110 118 59 − − − −43 84.9
111 0111 119 − − − − −38.3 87.2
111 1000 120 60 30 15 − −34.9 89.5
111 1001 121 − − − − −31.4 91.8
111 1010 122 61 − − − −26.7 93
111 1011 123 − − − − −22.1 94.1
111 1100 124 62 31 − − −17.4 95.3
111 1101 125 − − − − −12.7 96.5
111 1110 126 63 − − − −8.1 97.7
111 1111 127 − − − − −3.5 98.8

www.onsemi.com
14
 AMIS−30532

Iy Iy Iy

Start = 0 Step 1 Start = 0 Step 1 Start = 0 Step 1

Step 2
Step 3
Ix Step 2 Ix Ix

Step 3 Step 3 Step 2

1/4th micro step Uncompensated Half Step Full Step

SM[2:0] = 011 SM[2:0] = 101 SM[2:0] = 110
Figure 10. Translator Table: Circular and Square

Direction NXT−polarity bit <NXTP> (see Table 14 SPI Control

The direction of rotation is selected by means of following Parameter Overview), the next step is initiated either on the
combination of the DIR input pin and the SPI−controlled rising edge or the falling edge of the NXT input.
direction bit <DIRCTRL>. (see Table 14 SPI Control
Parameter Overview) Translator Position
The translator position MSP[6:0] can be read in SPI Status
NXT Input Register 3 (See Table 15 SR3). This is a 7−bit number
Changes on the NXT input will move the motor current equivalent to the 1/32th micro−step from Table 10: Circular
one step up/down in the translator table (even when the Translator Table. The translator position is updated
motor is disabled <MOTEN>=0>). Depending on the immediately following a NXT trigger.

NXT

Update Update
Translator Position Translator Position

Figure 11. Translator Position Timing Diagram

Synchronization of Step Mode and NXT Input If the step resolution is decreased at a translator table
When step mode is re−programmed to another resolution position that is shared both by the old and new resolution
(Figure 12), then this is put in effect immediately upon the setting, then the offset is zero and micro−stepping is
first arriving “NXT” input. If the micro−stepping resolution proceeds according to the translator table.
is increased, the coil currents will be regulated to the nearest If the translator position is not shared both by the old and
micro−step, according to the fixed grid of the increased new resolution setting, then the micro−stepping proceeds
resolution. If however the micro−stepping resolution is with an offset relative to the translator table (See Figure 12
decreased, then it is possible to introduce an offset (or phase right hand side).
shift) in the micro−step translator table.

www.onsemi.com
15
 AMIS−30532

Change from lower to higher resolution Change from higher to lower resolution
Iy Iy Iy Iy
DIR DIR DIR DIR
NXT2 NXT1
endpos NXT3 NXT1 endpos startpos

NXT4 startpos NXT2

Ix Ix Ix NXT3
Ix

Halfstep 1/4th step 1/8th step Halfstep

Figure 12. NXT−Step Mode Synchronization

Left: Change from lower to higher resolution. The left−hand side depicts the ending half−step position during which a new
step mode resolution was programmed. The right−hand side diagram shows the effect of subsequent NXT commands on the
micro−step position.
Right: Change from higher to lower resolution. The left−hand side depicts the ending micro−step position during which a new
step mode resolution was programmed. The right−hand side diagram shows the effect of subsequent NXT commands on the
half−step position.
Note: It is advised to reduce the micro−stepping resolution only at micro−step positions that overlap with desired micro−step
positions of the new resolution.

Programmable Peak−Current Overview). Whenever this parameter is changed, the

The amplitude of the current waveform in the motor coils coil−currents will be updated immediately at the next PWM
(coil peak current = Imax) is adjusted by means of an SPI period. Figure 13 presents the Peak−Current and Current
parameter ”CUR[4:0]” (see Table 14 SPI Control Parameter Ratings in conjunction to the Current setting CUR[4:0].

Peak Current
3.02 A

Current Range 3
CUR[ 4:0] = 23 −> 31

1.26 A

Current Range 2
CUR [4:0] = 16 −> 22

654 mA
Current Range 1
CUR[4:0] = 9 −> 15

328 mA

Current Range 0
CUR[4:0] = 0 −> 8

0 8 15 22 31 CUR[4:0]

Figure 13. Programmable Peak−Current Overview

www.onsemi.com
16
 AMIS−30532

Speed and Load Angle Output current zero crossings”. Per coil, two zero−current positions
The SLA−pin provides an output voltage that indicates the exist per electrical period, yielding in total four zero−current
level of the Back−e.m.f. voltage of the motor. This observation points per electrical period.
Back−e.m.f. voltage is sampled during every so−called “coil

I COIL V BEMF

ZOOM
Previous Next
Coil Current Zero Crossing
M icro −step M icr o −step

I COIL Current Decay

Zero Current

V COIL
Voltage Transient
V BB

|V BEMF |

Figure 14. Principle of Bemf Measurement

Because of the relatively high recirculation currents in the of the coil voltage is not visible anymore, this mode
coil during current decay, the coil voltage VCOIL shows a generates smoother Back e.m.f. input for post−processing,
transient behavior. As this transient is not always desired in e.g. by software.
application software, two operating modes can be selected In order to bring the sampled Back e.m.f. to a descent
by means of the bit <SLAT> (see “SLA−transparency” in output level (0 V to 5 V), the sampled coil voltage VCOIL is
see SPI Control Parameter Overview). The SLA pin shows divided by 2 or by 4. This divider is set through an SPI bit
in ”transparent mode” full visibility of the voltage transient <SLAG>. (see SPI Control Parameter Overview)
behavior. This allows a sanity−check of the speed−setting The following drawing illustrates the operation of the
versus motor operation and characteristics and supply SLA−pin and the transparency−bit. “PWMsh” and “ICOIL =
voltage levels. If the bit “SLAT” is cleared, then only the 0” are internal signals that define together with SLAT the
voltage samples at the end of each coil current zero crossing sampling and hold moments of the coil voltage.
are visible on the SLA−pin. Because the transient behavior

www.onsemi.com
17
 AMIS−30532

Ssh Sh
VCOIL div2
div4
buf SLA−pin

Csh Ch

Icoil=0 SLAT
PWMsh NOT(Icoil=0)

PWMsh

Icoil=0

SLAT

VCOIL

SLA−pin last sample

is retained VBEMF
retain last sample

previous output is kept at SLA pin

t
SLAT=1 => SLA−pin is ”transparent” during SLAT=0 => SLA−pin is not ”transparent” during
VBEMF sampling @ Coil Current Zero VBEMF sampling @ Coil Current Zero Crossing.
Crossing. SLA−pin is updated ”real−time”. SLA−pin is updated when leaving current−less state.

Figure 15. Timing Diagram of SLA−pin

Warning, Error Detection and Diagnostics Note: Successive reading the SPI StatusRegisters 1 and 2 in
Feedback case of a short circuit condition, may lead to damage to the
drivers.
Thermal Warning and Shutdown
When junction temperature rises above TTW, the thermal Open Coil/Current Not Reached Detection
warning bit <TW> is set (Table 16 SPI Status registers Open coil detection is based on the observation of 100%
Address SR0). If junction temperature increases above duty cycle of the PWM regulator. If in a coil 100% duty cycle
thermal shutdown level, then the circuit goes in “Thermal is detected for longer than 200 ms then the related driver
Shutdown” mode (<TSD>) and all driver transistors are transistors are disabled (high−impedance) and an
disabled (high impedance) (see Table 16 SPI Status registers appropriate bit in the SPI status register is set (<OPENX> or
Address SR2). The conditions to reset flag <TSD> is to be <OPENY>). (Table 16)
at a temperature lower than TTW and to clear the <TSD> flag When the resistance of a motor coil is very large and the
by reading it using any SPI read command. supply voltage is low, it can happen that the motor driver is
not able to deliver the requested current to the motor. Under
Overcurrent Detection these conditions the PWM controller duty cycle will be
The overcurrent detection circuit monitors the load 100% and after 200 ms the error pin and <OPENX>,
current in each activated output stage. If the load current <OPENY> will flag this situation (motor current is kept
exceeds the overcurrent detection threshold, then the alive). This feature can be used to test if the operating
over−current flag is set and the drivers are switched off to conditions (supply voltage, motor coil resistance) still allow
reduce the power dissipation and to protect the integrated reaching the requested coil−current or else the coil current
circuit. Each driver transistor has an individual detection bit should be reduced.
in (see Table 16 SPI Status registers Address SR1 and SR2:
<OVCXij> and <OVCYij>). Error condition is latched and Charge Pump Failure
the microcontroller needs to clean the status bits to reactivate The charge pump is an important circuit that guarantees
the drivers. low RDS(on) for all drivers, especially for low supply

www.onsemi.com
18
 AMIS−30532

voltages. If supply voltage is too low or external components some low−voltage analog blocks and external circuitry. The
are not properly connected to guarantee RDS(on) of the voltage is derived from an internal bandgap reference. To
drivers, then the bit <CPFAIL> is set (Table 16). Also after calculate the available drive−current for external circuitry,
POR the charge pump voltage will need some time to exceed the specified Iload should be reduced with the consumption
the required threshold. During that time <CPFAIL> will be of internal circuitry (unloaded outputs) and the loads
set to “1”. connected to logic outputs. See Table 5 DC Parameters.

Error Output Power−On Reset (POR) Function

This is a digital output to flag a problem to the external The open drain output pin POR/WD provides an “active
microcontroller. The signal on this output is active low and low” reset for external purposes. At power−up of
the logic combination of: AMIS−30532, this pin will be kept low for some time to reset
NOT(ERRB) = <TW> OR <TSD> OR <OVCXij> OR for example an external microcontroller. A small analog
<OVCYij> OR <OPENi> OR <CPFAIL> filter avoids resetting due to spikes or noise on the VDD
supply.
Logic Supply Regulator
AMIS−30532 has an on−chip 5 V low−drop regulator
with external capacitor to supply the digital part of the chip,

VBB

VDD tPU tPD

VDDH
VDDL
t
< tRF

POR/WD pin

tPOR tRF

Figure 16. Power−on−Reset Timing Diagram

Watchdog Function analog circuits is depending on the reset state of the digital,
The watchdog function is enabled/disabled through charge pump remains active. Logic 0 on CLR pin resumes
<WDEN> bit (Table 13: SPI CONTROL REGISTERS (ALL normal operation again.
SPI control registers have Read/Write Access and default to The voltage regulator remains functional during and after
”0” after power−on or hard reset.)). Once this bit has been set the reset and the POR/WD pin is not activated. Watchdog
to “1” (watchdog enable), the microcontroller needs to function is reset completely.
re−write this bit to clear an internal timer before the
watchdog timeout interval expires. In case the timer is Sleep Mode
activated and WDEN is acknowledged too early (before The bit <SLP> in SPI Control Register 2 (See Table 12)
tWDPR) or not within the interval (after tWDTO), then a reset is provided to enter a so−called “sleep mode”. This mode
of the microcontroller will occur through POR/WD pin. In allows reduction of current−consumption when the motor is
addition, a warm/cold boot bit <WD> is available (see not in operation. The effect of sleep mode is as follows:
Tables 16 and 17) for further processing when the external • The drivers are put in HiZ
microcontroller is alive again. • All analog circuits are disabled and in low−power mode
• All internal registers are maintaining their logic content
CLR Pin (=Hard Reset)
Logic 0 on CLR pin allows normal operation of the chip. • NXT and DIR inputs are forbidden
To reset the complete digital inside AMIS−30532, the input • SPI communication remains possible (slight current
CLR needs to be pulled to logic 1 during minimum time increase during SPI communication)
given by tCLR. (Table 6 AC Parameters). This reset function • Reset of chip is possible through CLR pin
clears all internal registers without the need of a
power−cycle, except in sleep mode. The operation of all

www.onsemi.com
19
 AMIS−30532

• Oscillator and digital clocks are silent, except during leaving sleep mode, this timer continues from the value it
SPI communication had before entering sleep mode.
The voltage regulator remains active but with reduced Normal operation is resumed after writing logic ‘0’ to bit
current−output capability (ILOADSLP). The watchdog timer <SLP>. A start−up time is needed for the charge pump to
stops running and it’s value is kept in the counter. Upon stabilize. After this time, NXT commands can be issued.

VBB

VDD tPU

VDDH

tPOR

POR/WD pin

tDSPI tWDRD tPOR

Enable WD
= tWDPR or = tWDTO
> tWDPR and < tWDTO

Acknowledge WD

t
tWDTO

WD timer t

Figure 17. Watchdog Timing Diagram

Note: tDSPI is the time needed by the external microcontroller to shift−in the <WDEN> bit after a power−up.

The duration of the watchdog timeout interval is programmable through the WDT[3:0] bits (See also Table 13: SPI
CONTROL REGISTERS (ALL SPI control registers have Read/Write Access and default to “0” after power−on or hard reset.).
The timing is given in Table 12 below.

Table 12. WATCHDOG TIMEOUT INTERVAL AS FUNCTION OF WDT[3.0]

Index WDT[3:0] tWDTO (ms) Index WDT[3:0] tWDTO (ms)
0 0000 32 8 1000 288

1 0001 64 9 1001 320

2 0010 96 10 1010 352
3 0011 128 11 1011 384
4 0100 160 12 1100 416
5 0101 192 13 1101 448
6 0110 224 14 1110 480
7 0111 256 15 1111 512

www.onsemi.com
20
 AMIS−30532

SPI INTERFACE

The serial peripheral interface (SPI) allows an external DO signal is the output from the Slave (AMIS−30532), and
microcontroller (Master) to communicate with DI signal is the output from the Master. A chip select line
AMIS−30532. The implemented SPI block is designed to (CS) allows individual selection of a Slave SPI device in a
interface directly with numerous micro−controllers from multiple−slave system. The CS line is active low. If
several manufacturers. AMIS−30532 acts always as a Slave AMIS−30532 is not selected, DO is pulled up with the
and can’t initiate any transmission. The operation of the external pull up resistor. Since AMIS−30532 operates as a
device is configured and controlled by means of SPI Slave in MODE 0 (CPOL = 0; CPHA = 0) it always clocks
registers which are observable for read and/or write from the data out on the falling edge and samples data in on rising
Master. edge of clock. The Master SPI port must be configured in
MODE 0 too, to match this operation. The SPI clock idles
SPI Transfer Format and Pin Signals low between the transferred bytes.
During a SPI transfer, data is simultaneously transmitted The diagram below is both a Master and a Slave timing
(shifted out serially) and received (shifted in serially). A diagram since CLK, DO and DI pins are directly connected
serial clock line (CLK) synchronizes shifting and sampling between the Master and the Slave.
of the information on the two serial data lines (DO and DI).

# CLK cycle 1 2 3 4 5 6 7 8

CS

CLK

ÎÎÎÎ
DI MSB 6 5 4 3 2 1 LSB
ÎÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
DO MSB 6 5 4 3 2 1 LSB

Figure 18. Timing Diagram of an SPI Transfer

NOTE: At the falling edge of the eight clock pulse the data−out shift register is updated with the content of the addressed internal SPI
register. The internal SPI registers are updated at the first rising edge of the AMIS−30532 system clock when CS = High

Transfer Packet
Serial data transfer is assumed to follow MSB first rule.
The transfer packet contains one or more 8−bit characters
(bytes).

BYTE 1 BYTE 2
Command and SPI Register Address Data

MSB LSB MSB LSB

CMD2 CMD1 CMD0 ADDR4 ADDR3 ADDR2 ADDR1 ADDR0 D7 D6 D5 D4 D3 D2 D1 D0

Command SPI Register Address

Figure 19. SPI Transfer Packet

Byte 1 contains the Command and the SPI Register sent from the Master in a WRITE operation, or received
Address and indicates to AMIS−30532 the chosen type of from AMIS−30532 in a READ operation.
operation and addressed register. Byte 2 contains data, or

www.onsemi.com
21
 AMIS−30532

Two command types can be distinguished in the READ command. This READ command contains the
communication between master and AMIS−30532: address of the SPI register to be read out. At the falling edge
• READ from SPI Register with address ADDR[4:0]: of the eight clock pulse the data−out shift register is updated
CMD2 = “0” with the content of the corresponding internal SPI register.
• WRITE to SPI Register with address ADDR[4:0]: In the next 8−bit clock pulse train this data is shifted out via
CMD2 = “1” DO pin. At the same time the data shifted in from DI
(Master) should be interpreted as the following successive
READ Operation command or dummy data.
If the Master wants to read data from Status or Control
Registers, it initiates the communication by sending a

Registers are updated with internal status at the rising

edge of the internal AMIS−30532 clock when CS = 1
CS

COMMAND

DI READ DATA from ADDR 1 COMMAND or DUMMY

DATA from previous command or

NOT VALID after POR or RESET

DATA DATA

DO OLD DATA or NOT VALID DATA from ADDR 1

Figure 20. Single READ Operation where DATA from SPI register with Address 1 is read by the Master

All 4 Status Registers (see SPI Registers) contain 7 data high, the Master should force CS high immediately after the
bits and a parity check bit The most significant bit (D7) READ operation. For the same reason it is recommended to
represents a parity of D[6:0]. If the number of logical ones keep the CS line high always when the SPI bus is idle.
in D[6:0] is odd, the parity bit D7 equals “1”. If the number
of logical ones in D[6:0] is even then the parity bit D7 equals WRITE Operation
“0”. This simple mechanism protects against noise and If the Master wants to write data to a Control Register it
increases the consistency of the transmitted data. If a parity initiates the communication by sending a WRITE
check error occurs it is recommended to initiate an command. This contains the address of the SPI register to
additional READ command to obtain the status again. write to. The command is followed with a data byte. This
Also the Control Registers can be read out following the incoming data will be stored in the corresponding Control
same routine. Control Registers don’t have a parity check. Register after CS goes from low to high! AMIS−30532
The CS line is active low and may remain low between responds on every incoming byte by shifting out via DO the
successive READ commands as illustrated in Figure 22. data stored in the last received address.
There is however one exception. In case an error condition It is important that the writing action (command − address
is latched in one of Status Registers (see SPI Registers) the and data) to the Control Register is exactly 16 bits long. If
ERRB pin is activated. (See Section Error Output). This more or less bits are transmitted the complete transfer packet
signal flags a problem to the external microcontroller. By is ignored.
reading the Status Registers information about the root A WRITE command executed for a read−only register
cause of the problem can be determined. After this READ (e.g. Status Registers) will not affect the addressed register
operation the Status Registers are cleared. Because the and the device operation.
Status Registers and ERRB pin (see SPI Registers) are only Because after a power−on−reset the initial address is
updated by the internal system clock when the CS line is unknown the data shifted out via DO is not valid.

www.onsemi.com
22
 AMIS−30532

The NEW DATA is written into the corresponding

internal register at the rising edge of CS
CS

COMMAND DATA

DI WRITE DATA to ADDR 3 NEW DATA for ADDR 3

DATA from previous command or

NOT VALID after POR or RESET DATA DATA

DO OLD DATA or NOT VALID OLD DATA from ADDR 3

Figure 21. Single WRITE Operation where DATA from the Master is written in SPI register with Address 3

Examples of Combined READ and WRITE by writing a control byte in Control Register at ADDR2.
Operations Note that during the write command the old data of the
In the following examples successive READ and WRITE pointed register is returned at the moment the new data is
operations are combined. In Figure 22 the Master first reads shifted in.
the status from Register at ADDR4 and at ADDR5 followed

Registers are updated with the internal The NEW DATA is written into the
status at the rising edge of the internal correspondinginternal register at
AMIS−30532 clock when CS = 1 the rising edge of CS
CS

COMMAND COMMAND COMMAND DATA

READ DATA READ DATA WRITE DATA NEW DATA

DI from ADDR4 from ADDR5 to ADDR 2 for ADDR2
DATA from previous
command or NOT VALID
after POR or RESET
DATA DATA DATA DATA
OLD DATA DATA DATA OLD DATA
DO from ADDR4
or NOT VALID from ADDR5 from ADDR2

Figure 22. 2 Successive READ Commands Followed by a WRITE Command

After the write operation the Master could initiate a read transmitted. This rule also applies when the master device
back command in order to verify the data correctly written wants to initiate an SPI transfer to read the Status Registers.
as illustrated in Figure 23. During reception of the READ Because the internal system clock updates the Status
command the old data is returned for a second time. Only Registers only when CS line is high, the first read out byte
after receiving the READ command the new data is might represent old status information.

www.onsemi.com
23
 AMIS−30532

Registers are updated with The NEW DATA is written into the
the internal status at the correspondinginternal register at
rising edge of CS the rising edge of CS

CS

COMMAND DATA COMMAND

WRITE DATA NEW DATA READ DATA COMMAND
DI to ADDR2 for ADDR2 from ADDR2 or DUMMY
DATA from previous
command or NOT VALID
after POR or RESET
DATA DATA DATA DATA
OLD DATA OLD DATA OLD DATA NEW DATA
DO
or NOT VALID from ADDR2 from ADDR2 from ADDR2

Figure 23. A WRITE Operation Where DATA from the Master is Written in SPI Register with Address 2 Followed by
a READ Back Operation to Confirm a Correct WRITE Operation

NOTE: The internal data−out shift buffer of AMIS−30532 is updated with the content of the selected SPI register only at the last (every
eight) falling edge of the CLK signal (see SPI Transfer Format and Pin Signals). As a result, new data for transmission cannot be
written to the shift buffer at the beginning of the transfer packet and the first byte shifted out might represent old data.

Table 13. SPI CONTROL REGISTERS (All SPI control registers have Read/Write Access and default to “0” after power−on or
hard reset)

Structure

Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Access R/W R/W R/W R/W R/W R/W R/W R/W

Address Reset 0 0 0 0 0 0 0 0
WR (00h) Data WDEN WDT[3:0] − − −

CR0 (01h) Data SM[2:0] CUR[4:0]

CR1 (02h) Data DIRCTRL NXTP − − PWMF PWMJ EMC[1:0]
CR2 (03h) Data MOTEN SLP SLAG SLAT − − − −
CR2 (08h) Data M[1:0] StrB[1:0] − StrC StrE[1:0]
Where:
R/W Read and Write access
Reset: Status after power-On or hard reset

www.onsemi.com
24
 AMIS−30532

Table 14. SPI CONTROL PARAMETER OVERVIEW

Symbol Description Status Value
<DIR> = 0 <DIRCTRL> = 0 CW motion (Note 15)

Controls the direction of rotation (in combination <DIRCTRL> = 1 CCW motion (Note 15)
DIRCTRL
with logic level on input DIR) <DIR> = 1 <DIRCTRL> = 0 CCW motion (Note 15)
<DIRCTRL> = 1 CW motion (Note 15)
<NXTP> = 0 Trigger on rising edge
NXTP Selects if NXT triggers on rising or falling edge
<NXTP> = 1 Trigger on falling edge
00 Very Fast
Turn On – Turn−off Slopes of motor driver 01 Fast
EMC[1:0]
(Note 14) 10 Slow
11 Very Slow
<SLAT> = 0 SLA is transparent
SLAT Speed load angle transparency bit
<SLAT> = 1 SLA is NOT transparent
<SLAG> = 0 Gain = 0.5
SLAG Speed load angle gain setting
<SLAG> = 1 Gain = 0.25
<PWMF> = 0 Default Frequency
PWMF Enables doubling of the PWM frequency (Note 14)
<PWMF> = 1 Double Frequency
<PWMJ> = 0 Jitter disabled
PWMJ Enables jittery PWM
<PWMJ> = 1 Jitter enabled
000 1/32 Micro − Step
001 1/16 Micro − Step
010 1/8 Micro − Step
011 1/4 Micro − Step
SM[2:0] Stepmode
100 Compensated Half Step
101 Uncompensated Half Step
110 Full Step
111 n.a.
<SLP> = 0 Active mode
SLP Enables sleep mode
<SLP> = 1 Sleep mode
<MOTEN> = 0 Drivers disabled
MOTEN Activates the motor driver outputs
<MOTEN> = 1 Drivers enabled
00 Default PWM control
01 DCMin Mode 1
M[1:0] PWM Mode Control
10 DCMin Mode 2
11 DCMin Mode 3
00 4 PWM clock cycles
PWM Strobe B Control: DON mask comparator 01 8 PWM clock cycles
StrB[1:0]
time (Note 16) 10 12 PWM clock cycles
11 19 PWM clock cycles
PWM Strobe C Control: Switch time top/bottom <StrC> = 0 86% duty cycle PWM regulator
StrC
regulation <StrC> = 1 75% duty cycle PWM regulator
00 4 PWM clock cycles
PWM Strobe E Control: Compensation bridge 01 8 PWM clock cycles
StrE[1:0]
active time (Note 16) 10 12 PWM clock cycles
11 19 PWM clock cycles
14. The typical values can be found in Table 5: DC Parameters and in Table 6: AC parameters
15. Depending on the wiring of the motor connections
16. The duration is depending on the selected PWM frequency

www.onsemi.com
25
 AMIS−30532

CUR[4:0] Selects IMCmax peak. This is the peak or amplitude of the regulated current waveform in the motor coils.

Table 15. SPI CONTROL PARAMETER OVERVIEW CUR[4:0]

Current Range Index Current (mA) Current Range Index Current (mA)
(Note 18) CUR[4:0] (Note 17) (Note 18) CUR[4:0] (Note 17)

0 00000 66 16 10000 735

1 00001 135 17 10001 800

2 00010 189 18 10010 883
3 00011 200 2 19 10011 975
0 4 00100 221 20 10100 1077
5 00101 244 21 10101 1189
6 00110 269 22 10110 1255
7 00111 297 23 10111 1485
8 01000 328 24 11000 1625
9 01001 366 25 11001 1767
10 01010 400 26 11010 1950
11 01011 442 3 27 11011 2153

1 12 01100 488 28 11100 2378

13 01101 538 29 11101 2552
14 01110 594 30 11110 2775
15 01111 654 31 11111 3015
17. Typical current amplitude at TJ = 125°C
18. Reducing the current over different current ranges might trigger overcurrent detection. See dedicated application note for solutions

SPI Status Register Description

All 4 SPI status registers have Read Access and are default to ”0” after power-on or hard reset.

Table 16. SPI STATUS REGISTERS

Structure

Content Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Access R R R R R R R R

Address Reset 0 0 0 0 0 0 0 0
SR0 (04h) Data is not PAR TW CPfail WD OPENX OPENY − −
latched

SR1 (05h) Data is PAR OVCXPT OVCXPB OVCXNT OVCXNB − − −

latched

SR2 (06h) Data is PAR OVCYPT OVCYPB OVCYYNT OVCYNB TSD − −

latched

SR3 (07h) Data is not PAR MSP[6:0]

latched

Where:
R Read only mode access
Reset Status after power-on or hard reset
PAR Parity check

www.onsemi.com
26
 AMIS−30532

Table 17. SPI STATUS FLAGS OVERVIEW

Length Reset
Mnemonic Flag (bit) Related SPI Register Comment State

CPFail Charge pump failure 1 Status Register 0 ‘0’ = no failure ‘0’

‘1’ = failure: indicates that the charge pump does
not reach the required voltage level. Note 1

MSP[6:0] Micro−step position 7 Status Register 3 Translator micro step position ‘0000000’
OPENX OPEN Coil X 1 Status Register 0 ‘1’ = Open coil detected ‘0’
OPENY OPEN Coil Y 1 Status Register 0 ‘1’ = Open coil detected ‘0’
OVCXNB OVer Current on X 1 Status Register 1 ‘0’ = no failure ‘0’
H−bridge; MOTXN ‘1’ = failure: indicates that over current is
terminal; Bottom detected at bottom transistor XN−terminal
tran.
OVCXNT OVer Current on X 1 Status Register 1 ‘0’ = no failure ‘0’
H−bridge; MOTXN ‘1’ = failure: indicates that over current is
terminal; Top detected at top transistor XN−terminal
transist.
OVCXPB OVer Current on X 1 Status Register 1 ‘0’ = no failure ‘0’
H−bridge; MOTXP ‘1’ = failure: indicates that over current is
terminal; Bottom detected at bottom transistor XP−terminal
tran.
OVCXPT OVer Current on X 1 Status Register 1 ‘0’ = no failure ‘0’
H−bridge; MOTXP ‘1’ = failure: indicates that over current is
terminal; Top detected at top transistor XP−terminal
transist.
OVCYNB OVer Current on Y 1 Status Register 2 ‘0’ = no failure ‘0’
H−bridge; MOTYN ‘1’ = failure: indicates that over current is
terminal; Bottom detected at bottom transistor YN−terminal
tran.
OVCYNT OVer Current on Y 1 Status Register 2 ‘0’ = no failure ‘0’
H−bridge; MOTYN ‘1’ = failure: indicates that over current is
terminal; Top detected at top transistor YN−terminal
transist.
OVCYPB OVer Current on Y 1 Status Register 2 ‘0’ = no failure ‘0’
H−bridge; MOTYP ‘1’ = failure: indicates that over current is
terminal; Bottom detected at bottom transistor YP−terminal
tran.
OVCYPT OVer Current on Y 1 Status Register 2 ‘0’ = no failure ‘0’
H−bridge; MOTYP ‘1’ = failure: indicates that over current is
terminal; Top detected at top transistor YP−terminal
transist.
TSD Thermal shutdown 1 Status Register 2 ‘0’
TW Thermal warning 1 Status Register 0 ‘0’
WD Watchdog event 1 Status Register 0 ‘1’ = watchdog reset after time−out ‘0’

NOTE: WD − This bit indicates that the watchdog timer has not been cleared properly. If the master reads that WD is set to “1” after reset,
it means that a watchdog reset occurred (warm boot) instead of POR (cold boot). WD bit will be cleared only when the master
writes “0” to WDEN bit.

Table 18. ORDERING INFORMATION

Temperature
Part No. Peak Current Range Package Shipping†
AMIS30532C5321RG 1600 mA −40°C to 125°C NQFP−32 (7 x 7 mm) Tape & Reel
(Pb−Free)

AMIS30532C5321G 1600 mA −40°C to 125°C NQFP−32 (7 x 7 mm) Tube

(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

www.onsemi.com
27
 AMIS−30532

PACKAGE DIMENSIONS

NQFP−32, 7x7
CASE 560AA
ISSUE O

www.onsemi.com
28
 AMIS−30532

PACKAGE DIMENSIONS

NQFP−32, 7x7
CASE 560AA
ISSUE O

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: www.onsemi.com
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Europe, Middle East and Africa Technical Support: Order Literature: http://www.onsemi.com/orderlit
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Japan Customer Focus Center For additional information, please contact your local
Email: orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative

www.onsemi.com AMIS−30532/D
29