This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 30V
- On-resistance of 9mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 57A
- Maximum power dissipation of 49W at 25°C junction temperature
- Thermal resistance from junction to case of 2.55°C/W
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 30V
- On-resistance of 9mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 57A
- Maximum power dissipation of 49W at 25°C junction temperature
- Thermal resistance from junction to case of 2.55°C/W
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 30V
- On-resistance of 9mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 57A
- Maximum power dissipation of 49W at 25°C junction temperature
- Thermal resistance from junction to case of 2.55°C/W
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include:
- Maximum drain-source voltage of 30V
- On-resistance of 9mΩ at a gate-source voltage of 10V
- Continuous drain current rating of 57A
- Maximum power dissipation of 49W at 25°C junction temperature
- Thermal resistance from junction to case of 2.55°C/W
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS 30 V Gate-Source Voltage VGS ±20 TC= 25 °C 57 Continuous Drain Current ID TC= 100 °C 36 1 A Pulsed Drain Current IDM 160 Avalanche Current IAS 34 Avalanche Energy L=0.1mH EAS 60 mJ TC= 25 °C 49 Power Dissipation PD W TC= 100°C 19 Junction & Storage Temperature Range Tj, Tstg -55 to 150 °C Lead Temperature(1/16” from case for 10 sec) TL 275
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 2.55 °C / W Junction-to-Ambient RqJA 63 1 Pulse width limited by maximum junction temperature.
REV 1.0 1 2014/5/7
P0903BD N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNITS MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1 1.5 3 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±100 nA VDS =24V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS =20V, VGS = 0V, TJ = 125°C 10 On-State Drain Current1 ID(ON) VDS = 10V, VGS = 10V 160 A Drain-Source On-State VGS =4.5V, ID =30A 11 13 RDS(ON) mΩ Resistance1 VGS =10V, ID =30A 7 9 Forward Transconductance1 gfs VDS =15V, ID =17A 60 S DYNAMIC Input Capacitance Ciss 1060 Output Capacitance Coss VGS = 0V, VDS = 15V, f = 1MHz 281 pF Reverse Transfer Capacitance Crss 175 Gate Resistance Rg VGS = 0V, VDS = 0V, f = 1MHz 1.41 Ω Total Gate Charge2 Qg 23 2 VDS = 0.5V(BR)DSS, VGS = 10V, Gate-Source Charge Qgs 4.4 nC ID = 30A 2 Qgd Gate-Drain Charge 5.5 2 td(on) Turn-On Delay Time 16 2 VDS = 15V ,RL = 15Ω Rise Time tr 25 2 ID≌1A, VGS = 10V, RGEN =6Ω nS Turn-Off Delay Time td(off) 60 Fall Time2 tf 16 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 32 A 1 VSD IF = IS, VGS = 0V Forward Voltage 1.3 V Reverse Recovery Time trr IF = 3A, dlF/dt = 100A /ms 40 70 nS Reverse Recovery Charge Qrr 28 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.