TPL9202

8-CHANNEL RELAY DRIVER

WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
www.ti.com
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

1FEATURES APPLICATIONS
• Eight Low-Side Drivers With Internal Clamp for
2
• Electrical Applicances
Inductive Loads and Current Limiting for Self – Air Conditioning Units
Protection – Ranges
– Seven Outputs Rated at 150 mA and – Dishwashers
Controlled Through Serial Interface – Refrigerators
– One Output Rated at 150 mA and – Microwaves
Controlled Through Serial Interface and – Washing Machines
Dedicated Enable Pin • General-Purpose Interface Circuit Allowing
• 5-V ± 5% Regulated Power Supply With Microcontroller Interface to Relays, Electric
200-mA Load Capability at VIN Max of 18 V Motors, LEDs, and Buzzers
• Internal Voltage Supervisory for Regulated
PWP PACKAGE
Output (TOP VIEW)
• Serial Communications for Control of Eight
Low-Side Drivers BO_OUTZ 1 20 BO
OUT1 2 19 VIN
• Enable/Disable Input for OUT1
OUT2 3 18 5VOUT
• 5-V or 3.3-V I/O Tolerant for Interface to OUT3 4 17 SCLK
Microcontroller OUT4 5 16 NCS
• Programmable Power-On Reset Delay Before OUT5 6 15 MOSI
RST Asserted High, Once 5 V Is Within OUT6 7 14 RST
Specified Range (6 ms Typ) OUT7 8 13 RDELAY
• Programmable Deglitch Timer Before RST OUT8 9 12 EN1
Asserted Low (40 µs Typ) GND 10 11 NC

• Programmable Brown-Out Feature NC – No internal connection

• Thermal Shutoff for Self Protection

DESCRIPTION/ORDERING INFORMATION
The power supply provides regulated 5-V output to power the system microcontroller and drive eight low-side
switches. The brown-out detection output (BO_OUTZ) warns the system if there is a temporary drop in the
supply voltage, so the system can prevent potentially hazardous situations.
A serial communications interface controls the eight low-side outputs; each output has an internal snubber circuit
to absorb the inductive load at turn OFF. Alternatively, the system can use a fly-back diode to VIN to help
recirculate the energy in an inductive load at turn OFF.

ORDERING INFORMATION (1)

TA PACKAGE (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
Reel of 2000 TPL9202PWPR
–40°C to 125°C PowerPAD™ – PWP PL202
Tube of 70 TPL9202PWP

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas Copyright © 2006–2008, Texas Instruments Incorporated
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPL9202
8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION www.ti.com
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

PINOUT CONFIGURATION
NO. NAME I/O DESCRIPTION
1 BO_OUTZ O Brown-out indicator
2 OUT1 O Low-side output 1
3 OUT2 O Low-side output 2
4 OUT3 O Low-side output 3
5 OUT4 O Low-side output 4
6 OUT5 O Low-side output 5
7 OUT6 O Low-side output 6
8 OUT7 O Low-side output 7
9 OUT8 O Low-side output 8
10 GND I Ground
11 NC No connection
12 EN1 I Enable/disable for OUT1
13 RDELAY O Power-up reset delay
14 (1) RST I/O Power-on reset output (open drain)
15 MOSI I Serial data input
16 NCS I Chip select
17 SCLK I Serial clock for data synchronization
18 5VOUT O Regulated output
19 VIN I Unregulated input voltage source
20 BO I Brown-out input threshold setting

(1) Terminal 14 can be used as an input or an output.

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8-CHANNEL RELAY DRIVER
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WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

FUNCTIONAL BLOCK DIAGRAM

OUT1
EN1
Enables OUT1
EN1
OUT1
50 kΩ
OUT1 at
150 mA
6V
Gate Control OUT2
for Outputs
OUT2 at 150 mA OUT2
100 kΩ 1 Through 8
OUT3
NCS OUT3 at 150 mA OUT3
NCS OUT4
OUT4 at 150 mA OUT4
Parallel OUT5
Register OUT5 at 150 mA OUT5
OUT6
OUT6 at 150 mA OUT6
SCLK
Serial OUT7
SCLK
Register OUT7 at 150 mA OUT7
100 kΩ
MOSI OUT8
MOSI OUT8 at 150 mA OUT8
20 Ω 100 kΩ
(2 W)10 V VIN
7–18 V
PMOS

Gate Drive 5VOUT

Optional, dependent and Control 5V
on heat-management Bandgap
implementation Ref
(see Note A) Comp
–
GND
GND + Vref 5 kΩ

Voltage RST
Vref Supervisor
RST
Iconst

RDELAY
RDELAY
BO
VIN
Comp BO_OUTZ
1.2 V BO_OUTZ
Recommended

A. The resistor and Zener diode are required if there is insufficient thermal-management allocation.

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8-CHANNEL RELAY DRIVER
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SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

DETAILED DESCRIPTION
The 5-V regulator is powered from VIN, and the regulated output is within 5 V ± 5% over the operating conditions.
The open-drain power-on reset (RST) pin remains low until the regulator exceeds the set threshold, and the timer
value set by the capacitor on the reset delay (RDELAY) pin expires. If both of these conditions are satisfied, RST is
asserted high. This signifies to the microcontroller that serial communications can be initiated to the TPL9202.
The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller. A single register controls all the outputs (one bit per output). The default value is zero (OFF). If
an output requires pulse width modulation (PWM) function, the register must be updated at a rate faster than the
desired PWM frequency. OUT1 can be controlled by serial input from the microcontroller or with the dedicated
enable (EN1) pin. If EN1 is pulled low or left open, the serial input through the shift register controls OUT1. If
EN1 is pulled high, OUT1 always is turned on, and the serial input for OUT1 is ignored.
The brown-out (BO) input is a resistor divided from the input supply and is used to determine if the supply
voltage drops to undesired levels. If the input drops below the programmed value, BO_OUTZ is pulled low, and
all outputs are disabled. Once the input supply line returns to the minimum desired level, the outputs are enabled
to the previous programmed states.
If RST is asserted, all outputs are turned OFF internally, and the input register is reset to all zeroes. The
microcontroller must write to the register to turn the outputs ON again.

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WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

Absolute Maximum Ratings (1)

MIN MAX UNIT
VIN 24
VI(unreg) Unregulated input voltage (2) (3)
V
BO 24
EN1, MOSI, SCLK, and NCS 7
VI(logic) Logic input voltage (2) (3)
V
RST and RDELAY 7
VO Low-side output voltage OUT1–OUT8 16.5 V
OUTn = ON and shorted to VIN
ILIMIT Output current limit (4) 350 mA
with low impedance
θJA Thermal impedance, junction to ambient (5) 33 °C/W
θJC Thermal impedance, junction to top of package (5) 20 °C/W
θJP Thermal impedance, junction to thermal pad (5) 1.4 °C/W
(6)
PD Continuous power dissipation 3.7 W
ESD Electrostatic discharge (7) 2 kV
TA Operating ambient temperature range –40 125 °C
Tstg Storage temperature range –65 125 °C
Tlead Lead temperature Soldering, 10 s 260 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) Absolute negative voltage on these pins must not go below –0.5 V.
(4) Not more than one output should be shorted at a time, and duration of the short circuit should not exceed 1 ms.
(5) The thermal data is based on using 1-oz copper trace with JEDEC 51-5 test board for PWP.
(6) The data is based on ambient temperature of 25°C maximum.
(7) The Human Body Model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

Dissipation Ratings
TA ≤ 25°C DERATING FACTOR TA = 125°C
PACKAGE
POWER RATING ABOVE TA = 25°C POWER RATING
PWP 3787 mW 30.3 mW/°C 757 mW

Recommended Operating Conditions

MIN MAX UNIT
VIN 7 18
VI(unreg) Unregulated input voltage V
BO (as seen by external resistor network) 0 18
VI(logic) Logic input voltage EN1, RST, and RDELAY , MOSI, SCLK, and NCS 0 5.25 V
TA Operating ambient temperature –40 125 °C

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8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION www.ti.com
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

Electrical Characteristics
TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT
Supply Voltage and Current
VIN (2) Input voltage 7 18 V
Enable = low, OUT1–OUT8 = Off 3
IIN Input supply current mA
Enable = high, OUT1–OUT8 = On 5
Logic Inputs (MOSI, NCS, SCLK, and EN1)
VIL Logic input low level IIL = 100 µA 0.8 V
VIH Logic input high level IIL = 100 µA 2.4 V
Reset (RST)
VOL Low-level logic output IOL = 1.6 mA 0.4 V
VOH (3) High-level logic output 5-kΩ pullup to VCC VCC – 0.8 V
VH Disabling reset threshold 5-V regulator ramps up 4.25 4.5 V
VL Enabling reset threshold 5-V regulator ramps down 3.3 3.75 V
VHYS Threshold hysteresis 0.12 0.5 V
Reset Delay (RDELAY)
IOUT Output current 18 28 48 µA
tDW Reset delay timer C = 47 nF 3 6 ms
tUP Reset capacitor to low level C = 47 nF 45 µs
Output (OUT1–OUT8)
VOL Output ON IOUTn = 150 mA 0.4 0.7 V
IOH Output leakage VOH = Max of 16.5 V 2 µA
Regulator Output (5VOUT)
I5VOUT = 5 mA to 200 mA, VIN = 7 V to 18 V,
5VOUT Output supply 4.75 5 5.25 V
C5VOUT = 1 µF
Limit output short circuit
I5Vout 5VOUT = 0 V 200 mA
current
Brown-Out (BO) Input
Threshold for brown-out
BOVthes VIN reduced until BO_OUTZ goes low 1.3 V
detection
Brown-Out Detection Output (BO_OUTZ)
VOL Logic level output IOL = 100 µA 0.4 V
VOH (3) Logic level output Pullup to VCC VCC – 0.8 V
Thermal Shutdown
TSD Thermal shutdown 150 °C
THYS Hysteresis 20 °C

(1) All typical values are at TA = 25°C.

(2) There are external high-frequency noise-suppression capacitors and filter capacitors on VIN.
(3) VCC is the pullup resistor voltage.

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8-CHANNEL RELAY DRIVER
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WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

Output Control Register

MSB LSB

IN8 IN7 IN6 IN5 IN4 IN3 IN2 IN1

0 0 0 0 0 0 0 0
INn = 0 = Output OFF
INn = 1 = Output ON

To operate the output in PWM mode, the output control register must be updated at a rate twice the desired
PWM frequency of the output. Maximum PWM frequency is 5 kHz. The register is updated every 100 µs.

ENABLE TRUTH TABLE

SERIAL INPUT
EN1 OUT1
FOR OUT1
Open H On
Open L Off
L H On
L L Off
H H On
H L On

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8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION www.ti.com
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

Serial Communications Interface

The serial communications are an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller (see Figure 1). A single register controls all the outputs. The signal gives the instruction to control
the output of TPL9202.
The NCS signal enables the SCLK and MOSI data when it is low. After NCS is set to low for T1, synchronization
clock and data begin to transmit and, after the 8-bit data has been transmitted, NCS is set high again to disable
SCLK and MOSI and to transfer the serial data to the control register. SCLK must be held low when NCS is high.

T2

T3 T8

T1 T4 T5 T1

NCS

SCLK 1 2 3 4 5 6 7 8

MSB LSB

MOSI XXX IN8 IN7 IN6 IN5 IN4 IN3 IN2 IN1

T6

T7

Figure 1. Serial Communications

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8-CHANNEL RELAY DRIVER
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WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

Timing Requirements
TA = –40°C to 125°C, VIN = 7 V to 18 V (unless otherwise noted)
MIN TYP MAX UNIT
fSPI SPI frequency 4 MHz
T1 Delay time, NCS falling edge to SCLK rising edge 10 ns
T2 Delay time, NCS falling edge to SCLK falling edge 80 ns
T3 Pulse duration, SCLK high 60 ns
T4 Pulse duration, SCLK low 60 ns
T5 Delay time, last SCLK falling edge to NCS rising edge 80 ns
T6 Setup time, MOSI valid before SCLK edge 10 ns
T7 Hold time, MOSI valid after SCLK edge 10 ns
T8 Time between two words for transmitting 170 ns

Reset Delay (RDELAY)

The RDELAY output provides a constant current source to charge an external capacitor to approximately 6.5 V.
The external capacitor is selected to provide a delay time, based on the current equation for a capacitor,
I = C(Δv/Δt) and a 28-µA typical output current.
Therefore, the user should select a 47-nF capacitor to provide a 6-ms delay at 3.55 V.
I = C(Δv/Δt)
28 µA = C × (3.55 V/6 ms)
C = 47 nF

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8-CHANNEL RELAY DRIVER
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APPLICATION INFORMATION

Buzzer Driver
Relay Driver MOSI
Relay Driver
Relay Driver SCLK
MCU/DSP
Relay Driver
Fan Driver NCS
8 Outputs
Fan Driver
Fan Driver

TPL9202 BO_OUTZ

RST

5VOUT ±5% at 200 mA

Brown Out
EN1

RDELAY
DC Input 7 V to 18 V

GND

Figure 2. Typical Application

Display
(LED/LCD/VFD)

LED LED Keypad

Water
AC Filters Supply Water Softener
Valve Outlet Supply
Volume
M Sensor
Power
Switch
Water-Level
Controller
Sensor
Driver

Optical
Sensor
BO Brown-Out BO_OUTZ
Detect
Temperature
VIN 5VOUT Sensor
Regulator (Optional)
+

~ ~ RST
POR/SYS
-
Cover
Switch

TPL9202

Figure 3. Washing-Machine Application

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SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008

PCB Layout
To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.

Application Using a Multilayer PCB

In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD™ Thermally Enhanced Package Technical Brief, literature number SLMA002).
Solder Pad (Land Pattern)

Package Thermal Pad

Thermal Vias

Package Outline

Figure 4. Package and PCB Land Configuration for a Multilayer PCB

Power Pad

Package Solder Pad Component Traces

1.5038–1.5748-mm
Component Trace
(2-oz Cu)
2 Plane

1.0142–1.0502-mm
Ground Plane
Thermal Via (1-oz Cu)
4 Plane 1.5748 mm

0.5246–0.5606-mm
Power Plane
Thermal Isolation (1-oz Cu)
Power Plane Only

0.0–0.071-mm Board Base

and Bottom Pad

Package Solder Pad

(Bottom Trace)

Figure 5. Multilayer Board (Side View)

Application Using a Single-Layer PCB

In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.

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CAUTION:
If the attachment method is not implemented correctly, the functionality of the
product cannot be ensured. Power-dissipation capability is adversely affected if
the device is incorrectly mounted on the circuit board.

Use as Much Copper Area

as Possible for Heat Spread

Package Thermal Pad

Package Outline

Figure 6. Layout Recommendations for a Single-Layer PCB

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8-CHANNEL RELAY DRIVER
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Recommended Board Layout

6,5 SMOC

5,85
SMOC = Solder Mask Over Copper
SMO = Solder Mask Opening

8)
3 (´
0,3
3,4 SMOC

2,4 SMO
6,92

4,52

1,2 (´20)
0,65
0,27 (´20)

3,7 SMO

Figure 7. Recommended Board Layout for PWP

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 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

TPL9202PWP ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PL202

TPL9202PWPG4 ACTIVE HTSSOP PWP 20 70 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PL202

TPL9202PWPR ACTIVE HTSSOP PWP 20 2000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 PL202

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Feb-2019

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPL9202PWPR HTSSOP PWP 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 26-Feb-2019

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPL9202PWPR HTSSOP PWP 20 2000 350.0 350.0 43.0

Pack Materials-Page 2
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