PIC12F752/HV752: 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC12F752/HV752: 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
PIC12F752/HV752: 8-Pin Flash-Based, 8-Bit CMOS Microcontrollers
Output Generator
Shunt Regulator
Complementary
Self Read/Write
Flash Program
Memory (User)
SRAM (bytes)
Comparators
(words)
8/16-bit
Timers
(COG)
CCP
XLP
I/Os
Device
VDD 1 8 VSS
RA5 2 7 RA0/ICSPDAT
PIC12F752/HV752
RA4 3 6 RA1/ICSPCLK
MCLR/VPP/RA3 4 5 RA2
8-Pin PDIP/SOIC/DFN
Generator (COG)
Complementary
Comparators
Reference
Interrupts
Voltage
Pull-up
Output
Timers
Basic
ADC
CCP
I/O
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
INT
Configuration
13 8 PORTA
Data Bus
Program Counter
Flash RA0
1K X 14 RA1
Program RAM RA2
Memory 8-Level Stack 64 Bytes RA3
(13-Bit) File RA4
Registers RA5
Program
14
Bus RAM Addr 9
Addr MUX
Instruction Reg
FSR Reg
STATUS Reg
8
3
MUX
Instruction Power-up
Decode & Timer
ALU
Control Power-on
Reset 8
CLKIN Timing Watchdog
Timer W Reg Capture/
Generation Compare/
Brown-out PWM
CLKOUT
Reset (CCP)
T1CKI
Timer0 Timer1 Timer2 Complementary
T0CKI Output
Generator
(COG)
Dual Range
DAC Analog Comparator
Fixed Voltage
Reference and Reference
(FVR)
C1OUT/C2OUT
C2IN1-
C1IN1-
C1IN0-/C2IN0-
C1IN0+/C2IN0+
1FFFh
04h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
05h PORTA — — RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --uu uuuu
06h — Unimplemented — —
07h — Unimplemented — —
08h IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 --00 0000 --00 0000
09h — Unimplemented — —
0Ah PCLATH — — — Write buffer for upper 5 bits of program counter ---0 0000 ---0 0000
0Bh INTCON GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF(2) 0000 0000 0000 0000
0Ch PIR1 TMR1GIF ADIF — — — HLTMR1IF TMR2IF TMR1IF 00---000 00---000
0Dh PIR2 — — C2IF C1IF — COG1IF — CCP1IF --00 -0-0 --00 -0-0
0Eh — Unimplemented — —
0Fh TMR1L Holding register for the Least Significant Byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu
10h TMR1H Holding register for the Most Significant Byte of the 16-bit TMR1 xxxx xxxx uuuu uuuu
11h T1CON TMR1CS<1:0> T1CKPS<1:0> Reserved T1SYNC — TMR1ON 0000 00-0 uuuu uu-u
12h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/ T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu
DONE
13h CCPR1L Capture/Compare/PWM Register1 Low Byte xxxx xxxx uuuu uuuu
14h CCPR1H Capture/Compare/PWM Register1 High Byte xxxx xxxx uuuu uuuu
15h CCP1CON — — DC1B<1:0> CCP1M<3:0> --00 0000 --00 0000
16h
to — Unimplemented — —
1Bh
1Ch ADRESL Least Significant 2 bits of the left shifted result or 8 bits of the right shifted result xxxx xxxx uuuu uuuu
1Dh ADRESH Most Significant 8 bits of the left shifted A/D result or 2 bits of right shifted result xxxx xxxx uuuu uuuu
1Eh ADCON0 ADFM VCFG CHS<3:0> GO/DONE ADON 0000 0000 0000 0000
82h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
83h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
84h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
85h TRISA — — TRISA5 TRISA4 TRISA3(3) TRISA2 TRISA1 TRISA0 --11 1111 --11 1111
86h — Unimplemented — —
87h — Unimplemented — —
88h IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 --00 0000 --00 0000
89h — Unimplemented — —
8Ah PCLATH — — — Write buffer for upper 5 bits of program counter ---0 0000 ---0 0000
8Bh INTCON GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF(2) 0000 0000 0000 0000
8Ch PIE1 TMR1GIE ADIE — — — HLTMR1IE TMR2IE TMR1IE 00-- -000 00-- -000
8Dh PIE2 — — C2IE C1IE — COG1IE — CCP1IE --00 -0-0 --00 -0-0
8Eh — Unimplemented — —
8Fh OSCCON — — IRCF<1:0> — HTS LTS — --01 -00- --uu -uu-
90h FVRCON FVREN FVRRDY FVRBUFEN FVRBUFSS — — — — 0000 ---- 0000 ----
91h DACCON0 DACEN DACRNG DACOE — — DACPSS0 — — 000- -0-- 000- -0--
92h DACCON1 — — — DACR<4:0> ---0 0000 ---0 0000
93h
to — Unimplemented — —
9Ah
9Bh CM2CON0 C2ON C2OUT C2OE C2POL C2ZLF C2SP C2HYS C2SYNC 0000 0100 0000 0100
9Ch CM2CON1 C2INTP C2INTN C2PCH<1:0> — — — C2NCH0 0000 ---0 0000 ---0
9Dh CM1CON0 C1ON C1OUT C1OE C1POL C1ZLF C1SP C1HYS C1SYNC 0000 0100 0000 0100
9Eh CM1CON1 C1INTP C1INTN C1PCH<1:0> — — — C1NCH0 0000 ---0 0000 ---0
9Fh CMOUT — — — — — — MC2OUT MC1OUT ---- --00 ---- --00
Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: MCLR and WDT Reset does not affect the previous value data latch. The IOCIF bit will be cleared upon Reset but will set again if the mismatch
exists.
3: TRISA3 always reads ‘1’.
Bank 2
100h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx xxxx xxxx
101h TMR0 Holding Register for the 8-bit Timer0 Register xxxx xxxx uuuu uuuu
102h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
103h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
104h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
105h LATA — — LATA5 LATA4 — LATA2 LATA1 LATA0 --xx -xxx --uu -uuu
106h — Unimplemented — —
107h — Unimplemented — —
108h IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 --00 0000 --00 0000
109h — Unimplemented — —
10Ah PCLATH — — — Write buffer for upper 5 bits of program counter ---0 0000 ---0 0000
10Bh INTCON GIE PEIE T0IE INTE IOCIE T0IF INTF IOCIF(2) 0000 0000 0000 0000
10Ch WPUA — — WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 --00 0000 --00 0000
10Dh SLRCONA — — — — — SLRA2 — SLRA0 ---- -0-0 ---- -0-0
10Eh — Unimplemented — —
10Fh PCON — — — — — — POR BOR ---- --qq ---- --uu
110h TMR2 Holding Register for the 8-bit Timer2 Register 0000 0000 0000 0000
111h PR2 Timer2 Period Register 1111 1111 1111 1111
112h T2CON — TOUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000
113h HLTMR1 Holding Register for the 8-bit Hardware Limit Timer1 Register 0000 0000 0000 0000
114h HLTPR1 Hardware Limit Timer1 Period Register 1111 1111 1111 1111
115h HLT1CON0 — H1OUTPS<3:0> H1ON H1CKPS<1:0> -000 0000 -000 0000
116h HLT1CON1 — — — H1ERS<2:0> H1FEREN H1REREN ---0 0000 ---0 0000
117h
to — Unimplemented — —
11Fh
Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: MCLR and WDT Reset does not affect the previous value data latch. The IOCIF bit will be cleared upon Reset but will set again if the
mismatch exists.
Bank 3
180h INDF Addressing this location uses contents of FSR to address data memory (not a physical register) xxxx xxxx uuuu uuuu
181h OPTION_REG RAPU INTEDG T0CS T0SE PSA PS<2:0> 1111 1111 1111 1111
182h PCL Program Counter's (PC) Least Significant Byte 0000 0000 0000 0000
183h STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 000q quuu
184h FSR Indirect Data Memory Address Pointer xxxx xxxx uuuu uuuu
185h ANSELA — — ANSA5 ANSA4 — ANSA2 ANSA1 ANSA0 --11 -111 --11 -111
186h — Unimplemented — —
187h — Unimplemented — —
188h APFCON — — — T1GSEL — COG1FSEL COG1O1SEL COG1O0SEL ---0 -000 ---0 -000
196h COG1CON1 G1FSIM G1RSIM G1FS<2:0> G1RS<2:0> 0000 0000 0000 0000
197h COG1ASD G1ASDE G1ARSEN G1ASDL1 G1ASDL0 G1ASDSHLT G1ASDSC2 G1ASDSC1 G1ASDSFLT 0000 0000 0000 0000
198h
to — Unimplemented — —
19Fh
Legend: — = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
2: MCLR and WDT Reset does not affect the previous value data latch. The IOCIF bit will be cleared upon Reset but will set again if the mismatch exists.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h-1FFh)
0 = Bank 0, 1 (00h-FFh)
bit 6 RP1: Register Bank Select bit (used for direct addressing)
00 = Bank 0 (00h-7Fh)
01 = Bank 1 (80h-FFh)
10 = Bank 2 (100h-17Fh)
11 = Bank 3 (180h-1FFh)
bit 5 RP0: Register Bank Select bit (used for direct addressing)
1 = Bank 1 (80h-FFh)
0 = Bank 0 (00h-7Fh)
bit 4 TO: Time-Out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-Down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Borrow bit(2) (ADDWF, ADDLW,SUBLW,SUBWF instructions), For Borrow, the polarity is reversed.
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(2) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: The C and DC bits operate as a Borrow and Digit Borrow out bit, respectively, in subtraction. See the SUBLW and SUBWF
instructions for examples.
2: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the second operand.
For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order bit of the source register.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Data
Memory
7Fh 1FFh
Bank 0 Bank 1 Bank 2 Bank 3
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMDATL<7:0>: Eight Least Significant Data bits to Write or Read from Program Memory
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 PMADRL<7:0>: Eight Least Significant Address bits for Program Memory Read/Write Operation
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Flash DATA INSTR (PC) INSTR (PC + 1) PMDATH,PMDATL INSTR (PC + 3) INSTR (PC + 4)
INSTR (PC - 1) BSF PMCON1,RD INSTR (PC + 1) NOP INSTR (PC + 3) INSTR (PC + 4)
Executed here Executed here Executed here Executed here Executed here Executed here
RD bit
PMDATH
PMDATL
Register
PMRHLT
14 14 14 14
Program Memory
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Flash PC + 1 PMADRH,PMADRL PC + 2 PC + 3 PC + 4
ADDR
Flash
Memory
Location
WR bit
PMWHLT
EC Enable
(Figure 4-2)
EC
CLKIN 1
MUX
÷1 11 System Clock
(CPU and
HFINTOSC Enable HFINTOSC Peripherals)
÷2 10
(Figure 4-2) 8 MHz 0
÷8 01
FOSC0
EC Enable
Sleep
FOSC0
IRCF<1:0> 00 HFINTOSC Enable
Sleep
FOSC0
IRCF<1:0> = 00
Sleep LFINTOSC Enable
WDTE
I/O CLKOUT(1)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared u = Bit is unchanged
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Read LATA
TRISA
D Q
Write LATA
Write PORTA
CK VDD
Data Register
Data Bus
I/O pin
Read PORTA
To peripherals
VSS
ANSELA
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Note 1: Writes to any PORTx register are written to the corresponding LATx register. Reads from any PORTx register, return
the value present on that PORTx I/O pins.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Note 1: Writes to any PORTx register are written to the corresponding LATx register. Reads from any PORTx register, return
the value present on that PORTx I/O pins.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Note 1: Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
IOCBNx D Q4Q1
Q
CK Edge
Detect
R
RBx
CK Write IOCBFx CK
IOCIE
R
Q2
From all other
IOCBFx individual IOC Interrupt
Pin Detectors to CPU Core
Q1 Q1 Q1
Q2 Q2 Q2
Q3 Q3 Q3
Q4 Q4 Q4 Q4
Q4Q1 Q4Q1 Q4Q1 Q4Q1
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware
FOSC/4
Data Bus
0
8
1
Sync
1
2 TCY TMR0
Shared Prescale
T0CKI 0
pin 0
T0SE T0CS PSA Set Flag bit T0IF
8-bit
on Overflow
Prescaler
1
PSA
8
PS<2:0> 1
Watchdog
WDT
Timer
Time-out
LFINTOSC
2 0
(Figure 4-1)
PSA
PSA
WDTE
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register.
2: WDTE bit is in the Configuration Word register.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
T1G 00 T1GSPM
Temperature Sense
11
Oscillator Prescaler Synchronize(3)
(1)
1, 2, 4, 8 det
T1CKI 10
2
FOSC T1CKPS<1:0>
Internal 01
Clock FOSC/2
Internal Sleep input
FOSC/4 Clock
Internal 00
Clock
T1CKI
T1CKI
TMR1 enabled
TMR1GE
T1GPOL
T1G_IN
T1CKI
T1GVAL
TMR1GE
T1GPOL
T1GTM
T1G_IN
T1CKI
T1GVAL
TMR1GE
T1GPOL
T1GSPM
Cleared by hardware on
T1GGO/ Set by software falling edge of T1GVAL
DONE
Counting enabled on
rising edge of T1G
T1G_IN
T1CKI
T1GVAL
Cleared by
TMR1GIF Cleared by software Set by hardware on software
falling edge of T1GVAL
TMR1GE
T1GPOL
T1GSPM
T1GTM
Cleared by hardware on
T1GGO/ Set by software falling edge of T1GVAL
DONE Counting enabled on
rising edge of T1G
T1G_IN
T1CKI
T1GVAL
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
TMR1CS<1:0> = 0X
This bit is ignored. Timer1 uses the internal clock when TMR1CS<1:0> = 1X.
bit 1 Unimplemented: Read as ‘0’
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Clears Timer1 gate flip-flop
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
T1GGO/
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GVAL T1GSS<1:0> 59
DONE
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
* Page provides register information.
8.1 Timer2 Operation The Timer2 prescaler is controlled by the T2CKPS bits
in the T2CON register. The Timer2 postscaler is
The clock input to the Timer2 module is the system controlled by the TOUTPS bits in the T2CON register.
instruction clock (FOSC/4). The clock is fed into the The prescaler and postscaler counters are cleared
Timer2 prescaler, which has prescale options of 1:1, when:
1:4 or 1:16. The output of the prescaler is then used to • A write to TMR2 occurs
increment the TMR2 register.
• A write to T2CON occurs
The values of TMR2 and PR2 are constantly compared • Any device Reset occurs (Power-on Reset, MCLR
to determine when they match. TMR2 will increment Reset, Watchdog Timer Reset, or Brown-out
from 00h until it matches the value in PR2. When a Reset)
match occurs, two things happen:
Note: TMR2 is not cleared when T2CON is
• TMR2 is reset to 00h on the next increment cycle written.
• The Timer2 postscaler is incremented
Prescaler Reset
FOSC/4 TMR2 TMR2 Output
1:1, 1:4, 1:16
2 Postscaler
Comparator Sets Flag bit TMR2IF
EQ 1:1 to 1:16
T2CKPS<1:0>
PR2 4
TOUTPS<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
3
H1ERS<2:0>
H1OUTPS<3:0>
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
and Capture
Edge Detect Enable
TMR1H TMR1L
CCP1M<3:0>
System Clock (FOSC)
is considered the off state. The high portion, also known TMR2 = CCPR1H:CCP1CON<5:4>
as the pulse width, can vary in time and is defined in
TMR2 = 0
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The FIGURE 10-4: SIMPLIFIED PWM BLOCK
PWM period is defined as the duration of one complete DIAGRAM
cycle or the total amount of on and off time combined.
CCP1CON<5:4>
Duty Cycle Registers
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher CCPR1L
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
The term duty cycle describes the proportion of the on CCPR1H(2) (Slave)
CCP1
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty Comparator R Q
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied. (1) S
TMR2
Figure 10-3 shows a typical waveform of the PWM TRIS
signal.
Comparator
Clear Timer,
10.3.1 STANDARD PWM OPERATION toggle CCP1 pin and
latch duty cycle
The standard PWM mode generates a Pulse-Width PR2
modulation (PWM) signal on the CCP1 pin with up to
Note 1: The 8-bit timer TMR2 register is concatenated
ten bits of resolution. The period, duty cycle and
with the 2-bit internal system clock (FOSC), or
resolution are controlled by the following registers:
two bits of the prescaler, to create the 10-bit
• PR2 Registers time base.
• T2CON Registers 2: In PWM mode, CCPR1H is a read-only register.
• CCPR1L Registers
• CCP1CON Registers
Figure 10-4 shows a simplified block diagram of PWM
operation.
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCP1 pin.
2: Clearing the CCP1CON register will
relinquish control of the CCP1 pin.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset
‘1’ = Bit is set ‘0’ = Bit is cleared
1000 = Compare mode: initialize CCP1 pin low; set output on compare match (set CCP1IF)
1001 = Compare mode: initialize CCP1 pin high; clear output on compare match (set CCP1IF)
1010 = Compare mode: generate software interrupt only; CCP1 pin reverts to I/O state
1011 = Compare mode: Special Event Trigger (CCP1 resets Timer, sets CCP1IF bit, and starts A/D
conversion if A/D module is enabled)
11xx = PWM mode
HFINTOSC 10
COG_clock
Fosc/4 01
Fosc 00
GxCS<1:0>
GxDBR<3:0> GxOE0
HLTimer1 or COGxFLT 7 GxPH<3:0>
HLTimer1 or CCP1 6 GxOUT0SS COG1OUT0
Dead Band 1
HLTimer1 or C2OUT 5 Rising event source Phase
HLTimer1 or C1OUT 4 Reset Dominates Cnt/R =
Delay 1 0
COGxFLT 3
CCP1 2 Blanking S Q
C2OUT 1 =
Cnt/R 0 GxPOL0
C1OUT 0 R Q
GxBLKF<3:0> GxRSIM
GxRS0<2:0>
COGxFLT
GxASDSFLT
C1OUT
PIC12F752/HV752
GxASDSC1 Auto-shutdown source GxASDE
S Q
C2OUT GxARSEN
GxASDSC2 R
GxEN
HLTimer1 output Set Dominates
GxASDSHLT Write GxASDE Low
COG_clock
Source
CCP1
COGxOUT0
COG_clock
Source
CCP1
COGxOUT0
C1In- hyst
COGOUT
Edge Sensitive
Rising (CCP1)
Falling (C1OUT)
C1In- hyst
COGOUT
T Count
Phase Delay GxPH<3:0>
Rising Dead Band GxDBR<3:0>
Falling Dead Band GxDBF<3:0>
Rising Event Blanking GxBLKR<3:0>
Falling Event Blanking GxBLKF<3:0>
DS40001576D-page 82
1 2 3 4 5
SOURCE
CCP1
GxARSEN
GxASDL0
GxASDL1
COGxOUT0
COGxOUT1
Operating State
NORMAL OUTPUT SHUTDOWN NORMAL OUTPUT SHUTDOWN NORMAL OUTPUT
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
VDD
VCFG = 0
VREF+ VCFG = 1
AN0 0000
AN1/VREF+ 0001
AN2 0010
AN3 0011 A/D
GO/DONE 10
dac_ref 1110
0 = Left Justify
fvr_ref 1111 ADFM
1 = Right Justify
ADON 10
TABLE 12-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
ADC Clock Period (TAD) Device Frequency (FOSC)
TCY to TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11
b9 b8 b7 b6 b5 b4 b3 b2 b1 b0
Conversion Starts
12.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is the ADIF bit in the
PIR1 register. The ADC interrupt enable is the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
Note: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interrupt Service Routine.
ADRESH ADRESL
(ADFM = 0) MSB LSB
bit 7 bit 0 bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
REGISTER 12-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0 (READ-ONLY)
R-x R-x U-0 U-0 U-0 U-0 U-0 U-0
ADRES<1:0> — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
REGISTER 12-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1 (READ-ONLY)
U-0 U-0 U-0 U-0 U-0 U-0 R-x R-x
— — — — — — ADRES<9:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
REGISTER 12-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1 (READ-ONLY)
R-x R-x R-x R-x R-x R-x R-x R-x
ADRES<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
= T AMP + T C + T COFF
= 2µs + T C + Temperature - 25°C 0.05µs/°C
T C = – C HOLD R IC + R SS + R S ln(1/2047)
= – 10pF 1k + 7k + 10k ln(0.0004885)
= 1.37 µs
Therefore:
T ACQ = 2µs + 1.37µs + 50°C- 25°C 0.05µs/°C
= 4.67µs
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
VDD
Sampling
Switch
Vt = 0.6V
Rs ANx Ric 1k SS Rss
VA Cpin I leakage
Vt = 0.6V Chold = 10 pF
5 pF ± 500 nA
Vss/VREF-
6V
5V Rss
Legend: Cpin = Input Capacitance VDD 4V
Vt = Threshold Voltage 3V
I leakage = Leakage current at the pin due to 2V
various junctions
Ric = Interconnect Resistance 5 6 7 8 9 10 11
SS = Sampling Switch Sampling Switch
Chold = Sample/Hold Capacitance (k)
Full-Scale Range
3FFh
3FEh
3FDh
3FCh
ADC Output Code
1 LSB ideal
3FBh
Full-Scale
004h Transition
003h
002h
001h
000h Analog Input Voltage
1 LSB ideal
VDD
5V Shunt
VREF+
Regulator
DACPSS
PIC12HV752 only
DACR<4:0>
DACRNG DAC dac_ref
DACEN EN To ADC, Comparators
C1 and C2.
Vss
dac_ref 0
VDD x1 REFOUT
1 DACOUT
fvr_ref
ref FVRBUFSS
fvr_ref
DACOE
To ADC, Comparators FVRBUFEN
+
C1 and C2.
1.2V
-
12HV752
EN rdy FVRRDY
FVREN
VSS
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
VREF+ 1 VSRC+
VDD 0
R2(31)
DACPSS
11111
DACEN R2(30)
11110
dac_ref
Full Range (to Comparator, FVR
FVR and ADC modules)
R2(2)
00010
00001
DACOUT
1
00000
0
DACR<4:0>
5
DACRNG
R1(31)
DACOE
11111
R1(30)
R2(1) 11110
R1(16)
10000
R1(15)
01111 Limited Range
R2(0)
R1(1)
00001
R1(0)
00000
Note: R2 = 16*R1
DACR 4:0
V OUT = VSRC+ ------------------------------
2
n
VOUT = [5V * (0/32)] = 0V; VOUT = [5V * (31/32)] = 4.84V; VOUT = [5V * (1/32)] = 156 mV
VOUT = [5V * (0/512)] = 0V; VOUT = [5V * (31/512)] = 303 mV; VOUT = [5V * (1/512)] = 9.8 mV
PIC® MCU
DAC
Module R
+
Voltage DACOUT Buffered DAC Output
–
Reference
Output
Impedance
dac_ref 0
x1 REFOUT
1 DACOUT
fvr_ref
FVRBUFSS
DACOE
FVRBUFEN
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Note 1: Refer to Equation 14-1 to calculate the value of the DAC Voltage Output.
CXIN0- 0
MUX Interrupt CxINTN
(2)
CXIN1- 1 det
CXPOL
CxVN 0 CXOUT
- D Q To Data Bus
MCXOUT
Cx ZLF 1
+ Q1 EN
CxVP
CXIN+ 0 CXZLF
CxHYS
To COG Module
dac_ref 1 MUX CxSP
(2)
fvr_ref 2
CXSYNC
3 CXOE
TRIS bit
VSS CxON
CXOUT
0
CXPCH<1:0>
2 D Q 1
(from Timer1)
T1CLK To Timer1
SYNCCXOUT
Note 1: When CxON = 0, the comparator will produce a ‘0’ at the output.
2: When CxON = 0, all multiplexer inputs are disconnected.
Note 1: The CxOE bit of the CMxCON0 register 15.4 Timer1 Gate Operation
overrides the PORT data latch. Setting
The output resulting from a comparator operation can
the CxON bit of the CMxCON0 register
be used as a source for gate control of Timer1. See
has no impact on the port override.
Section 7.5 “Timer1 Gate” for more information. This
2: The internal output of the comparator is feature is useful for timing the duration or interval of an
latched with each instruction cycle. analog event.
Unless otherwise specified, external
It is recommended that the comparator output be
outputs are not latched.
synchronized to Timer1. This ensures that Timer1 does
not increment while a change in the comparator is
occurring.
CPIN ILEAKAGE(1)
VA
5 pF VT 0.6V
Vss
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
C=0 Wf
C=1 Wf
DC = 0 W<3:0> f<3:0>
DC = 1 W<3:0> f<3:0>
These features are: Note: Address 2007h is beyond the user program
memory space. It belongs to the special
• Reset:
configuration memory space
- Power-on Reset (POR) (2000h-3FFFh), which can be accessed
- Power-up Timer (PWRT) only during programming. See
- Brown-out Reset (BOR) “PIC12F752/HV752 Flash Memory
• Interrupts Programming Specification” (DS41561)
for more information.
• Watchdog Timer (WDT)
• Oscillator selection
• Sleep
• Code protection
• ID Locations
• In-Circuit Serial Programming
The Power-up Timer (PWRT), which provides a fixed
delay of 64 ms (nominal) on power-up only, is designed
to keep the part in Reset while the power supply
stabilizes. There is also circuitry to reset the device if a
brown-out occurs, which can use the Power-up Timer
to provide at least a 64 ms Reset. With these
functions-on-chip, most applications need no external
Reset circuitry.
The Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through:
• External Reset
• Watchdog Timer Wake-up
• An interrupt
Oscillator selection options are available to allow the
part to fit the application. The INTOSC options save
system cost, while the External Clock (EC) option
provides a means for specific frequency and accurate
clock sources. Configuration bits are used to select
various options (see Register 17-1).
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
External
Reset
MCLR/VPP pin
Sleep
WDT WDT
Module Time-out
Reset
VDD Rise
Detect
Power-on Reset
VDD
Brown-out(1)
Reset
BOREN
S
PWRT Chip_Reset
On-Chip 11-bit Ripple Counter R Q
RC OSC
Enable PWRT
Internal
Reset 64 ms(1)
VDD
Vbor
Internal < 64 ms
Reset 64 ms(1)
Vdd
Vbor
Internal
Reset 64 ms(1)
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
The following interrupt flags are contained in the Note: The ANSEL register must be initialized to
INTCON register: configure an analog channel as a digital
input. Pins configured as analog inputs
• INT Pin Interrupt
will read ‘0’ and cannot generate an
• Interrupt-On-Change (IOC) Interrupts interrupt.
• Timer0 Overflow Interrupt
The peripheral interrupt flags are contained in the PIR1 17.4.2 TIMER0 INTERRUPT
and PIR2 registers. The corresponding interrupt enable An overflow (FFh 00h) in the TMR0 register will set
bit is contained in the PIE1 and PIE2 registers. the T0IF bit of the INTCON register. The interrupt can
The following interrupt flags are contained in the PIR1 be enabled/disabled by setting/clearing T0IE bit of the
register: INTCON register. See Section 6.0 “Timer0 Module”
for operation of the Timer0 module.
• A/D Interrupt
• Comparator Interrupt
• Timer1 Overflow Interrupt
• Timer2 Match Interrupt
• Enhanced CCP Interrupt
For external interrupt events, such as the INT pin or
PORTA change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
T0IF Wake-up
T0IE (If in Sleep mode)
INTF
Peripheral Interrupts INTE
(TMR1IF) PIR1<0>
IOCIF Interrupt
(TMR1IF) PIR1<0> IOCIE to CPU
PEIE
PIRn<7>
PIEn<7> GIE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN
CLKOUT (3)
(4)
INT pin
(1)
(1)
INTF flag (5) Interrupt Latency (2)
(INTCON reg.)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC PC PC + 1 PC + 1 0004h 0005h
Instruction
Fetched Inst (PC) Inst (PC + 1) — Inst (0004h) Inst (0005h)
FOSC/4
Data Bus
0
8
1
Sync
1
2 TCY TMR0
Shared Prescale
T0CKI 0
pin 0
T0SE T0CS PSA Set Flag bit T0IF
8-bit
on Overflow
Prescaler
1
PSA
8
PS<2:0> 1
Watchdog
WDT
Timer
Time-out
LFINTOSC
2 0
(Figure 4-1)
PSA
PSA
WDTE
Note 1: T0SE, T0CS, PSA, PS<2:0> are bits in the OPTION_REG register.
2: WDTE bit is in the Configuration Word register.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN
CLKOUT TIOSCST
INT pin
INTF flag
(INTCON reg.) Interrupt Latency
GIE bit
(INTCON reg.) Processor in
Sleep
Instruction Flow
PC PC PC + 1 PC + 2 PC + 2 PC + 2 0004h 0005h
Instruction Inst(PC + 1) Inst(PC + 2) Inst(0004h) Inst(0005h)
Fetched Inst(PC) = Sleep
Instruction Sleep Inst(PC + 1) Dummy Cycle Dummy Cycle
Executed Inst(PC – 1) Inst(0004h)
17.9 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during Program/Verify mode.
Only the Least Significant seven bits of the ID locations
are reported when using MPLAB® IDE.
+5V VDD
0V VSS
VPP MCLR/VPP
CLK ICSPCLK
* * *
To Normal
Connections
CBYPASS
ISHUNT
Feedback
18.2 Regulator Considerations
The supply voltage VUNREG and load current are not
VSS constant. Therefore, the current range of the regulator
is limited. Selecting a value for RSER must take these
Device
three factors into consideration.
Since the regulator uses the band gap voltage as the
regulated voltage reference, this voltage reference is
permanently enabled in the PIC12HV752 devices.
The shunt regulator will still consume current when
below operating voltage range for the shunt regulator.
The MPASM Assembler generates relocatable object • Support for the entire device instruction set
files for the MPLINK Object Linker, Intel® standard HEX • Support for fixed-point and floating-point data
files, MAP files to detail memory usage and symbol • Command-line interface
reference, absolute LST files that contain source lines • Rich directive set
and generated machine code, and COFF files for • Flexible macro language
debugging.
• MPLAB X IDE compatibility
The MPASM Assembler features include:
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
5.5
5.0
4.5
VDD (V)
4.0
3.5
3.0
2.5
2.0
0 8 10 20
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
5.0
4.5
VDD (V)
4.0
3.5
3.0
2.5
2.0
0 8 10 20
Frequency (MHz)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
PIC12HV752
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
D001 VDD Supply Voltage
VDDMIN VDDMAX
2.0 — 5.5 V FOSC 8 MHz
3.0 — 5.5 V FOSC 10 MHz
4.5 — 5.5 V FOSC 20 MHz
D001 2.0 — 5.0 V FOSC 8 MHz(2)
3.0 — 5.0 V FOSC 10 MHz(2)
4.5 — 5.0 V FOSC 20 MHz(2)
D002* VDR RAM Data Retention Voltage(1)
1.5 — — V Device in Sleep mode
D002 1.5 — — V Device in Sleep mode
D003* VPOR VDD Start Voltage to ensure internal Power-on Reset signal
— 1.6 — V
D003 — 1.6 — V
D004* SVDD VDD Rise Rate to ensure VDD Rise Rate internal Power-on Reset signal
0.05 — — V/ms See Table 17-1 for details.
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: On the PIC12HV752, VDD is regulated by a Shunt Regulator and is dependent on series resistor
(connected between the unregulated supply voltage and the VDD pin) to limit the current to 50 mA. See
Section “” for design requirements.
PIC12HV752
PIC12HV752
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
VIL Input Low Voltage
I/O PORT:
D030 with TTL buffer — — 0.8 V 4.5V VDD 5.5V
D030A — — 0.15 VDD V 2.0V VDD 4.5V
D031 with Schmitt Trigger buffer — — 0.2 VDD V 2.0V VDD 5.5V
D032 MCLR — — 0.2 VDD V 2.0V VDD 5.5V
VIH Input High Voltage
I/O PORT:
D040 with TTL buffer 2.0 — — V 4.5V VDD 5.5V
D040A 0.25 VDD + 0.8 — — V 2.0V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD — — V 2.0V VDD 5.5V
D042 MCLR 0.8 VDD — — V 2.0V VDD 5.5V
(1)
IIL Input Leakage Current
D060 I/O ports — 0.1 1 A VSS VPIN VDD,
Pin at high-impedance, 85°C
D061 RA3/MCLR(2) — 0.7 5 A VSS VPIN VDD,
Pin at high-impedance, 85°C
D063 — 0.1 5 A EC Configuration
(3)
IPUR Weak Pull-up Current
D070* 50 250 400 A VDD = 5.0V, VPIN = VSS
VOL Output Low Voltage
D080 I/O Ports RA1, RA4 and RA5 — — 0.6 V IOL = 7 mA, VDD = 4.5V
-40°C TA +125°C
— — 0.6 V IOL = 8.5 mA, VDD = 4.5V
-40°C TA +85°C
I/O Ports RA0 and RA2 — — 0.6 V IOL = 14 mA, VDD = 4.5V
-40°C TA +125°C
— — 0.6 V IOL = 17 mA, VDD = 4.5V
-40°C TA +85°C
VOH Output High Voltage
D090 I/O Ports RA1, RA4 and RA5 VDD-0.7 — — V IOH = -2.5 mA, VDD = 4.5V
-40°C TA +125°C
VDD-0.7 — — V IOH = -3 mA, VDD = 4.5V
-40°C TA +85°C
I/O Ports RA0 and RA2 VDD-0.7 — — V IOH = -5 mA, VDD = 4.5V
-40°C TA +125°C
VDD-0.7 — — V IOH = -6 mA, VDD = 4.5V
-40°C TA +85°C
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
3: This specification applies to all weak pull-up pins, including the weak pull-up found on RA3/MCLR. When RA3/MCLR is
configured as MCLR Reset pin, the weak pull-up is always enabled.
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
Capacitive Loading Specs on Output Pins
D101* COSC2 OSC2 pin — — 15 pF
D101A* CIO All I/O pins — — 50 pF
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
3: This specification applies to all weak pull-up pins, including the weak pull-up found on RA3/MCLR. When RA3/MCLR is
configured as MCLR Reset pin, the weak pull-up is always enabled.
Param.
Sym. Characteristic Typ. Units Conditions
No.
TH01 JA Thermal Resistance Junction to Ambient 84.6 °C/W 8-pin PDIP package
149.5 °C/W 8-pin SOIC package
60 °C/W 8-pin DFN 3x3mm package
TH02 JC Thermal Resistance Junction to Case 41.2 °C/W 8-pin PDIP package
39.9 °C/W 8-pin SOIC package
9 °C/W 8-pin DFN 3x3mm package
TH03 TJMAX Maximum Junction Temperature 150 °C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1)
TH06 PI/O I/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD
- VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient temperature; TJ = Junction Temperature
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O Port t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
F Fall P Period
H High R Rise
I Invalid (High-Impedance) V Valid
L Low Z High-Impedance
Load Condition
Pin CL
VSS
Q4 Q1 Q2 Q3 Q4 Q1
CLKIN
OS02
OS04 OS04
OS03
CLKOUT
CLKOUT
(CLKOUT Mode)
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
OS01 FOSC External CLKIN Frequency(1) DC — 20 MHz EC Oscillator mode
OS02 TOSC External CLKIN Period (1)
50 — ns EC Oscillator mode
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing
code. Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected
current consumption. All devices are tested to operate at “min” values with an external clock applied to CLKIN pin.
When an external clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
Param. Freq.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No. Tolerance
OS06 TWARM Internal Oscillator Switch when — — — 2 TOSC
running
OS07 INTOSC Internal Calibrated 1% 3.96 4.0 4.04 MHz VDD = 3.5V, TA = 25°C
INTOSC Frequency(1) 2% 3.92 4.0 4.08 MHz 2.5V VDD 5.5V,
(4 MHz) 0°C TA +85°C
5% 3.80 4.0 4.20 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS08 HFOSC Internal Calibrated 1% 7.92 8 8.08 MHz VDD = 3.5V, TA = 25°C
HFINTOSC Frequency(1) 2% 7.84 8 8.16 MHz 2.5V VDD 5.5V,
0°C TA +85°C
5% 7.60 8 8.40 MHz 2.0V VDD 5.5V,
-40°C TA +85°C (Ind.),
-40°C TA +125°C (Ext.)
OS09 LFOSC Internal LFINTOSC — — 31 — kHz
Frequency
OS10* TIOSC ST HFINTOSC Wake-up from — — 12 24 s VDD = 2.0V -40°C TA +85°C
Sleep Start-up Time — 7 14 s VDD = 3.0V -40°C TA +85°C
— 6 11 s VDD = 5.0V -40°C TA +85°C
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
Q4 Q1 Q2 Q3
FOSC
OS20
CLKOUT OS21
OS19 OS18
OS16
OS13 OS17
I/O pin
(Input)
OS15 OS14
OS18, OS19
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
OS13 TCKL2IOV CLKOUT to Port out valid(1) — — 20 ns
OS14 TIOV2CKH Port input valid before CLKOUT(1) TOSC + 200 ns — — ns
OS15 TOSH2IOV FOSC (Q1 cycle) to Port out valid — 50 70* ns VDD =5.0V
OS16 TOSH2IOI FOSC (Q2 cycle) to Port input invalid 50 — — ns VDD =5.0V
(I/O in setup time)
OS17 TIOV2OSH Port input valid to FOSC(Q2 cycle) 20 — — ns
(I/O in setup time)
OS18* TIOR Port output rise time — 40 72 ns VDD =2.0V
— 15 32 ns VDD =5.0V
OS19* TIOF Port output fall time — 28 55 ns VDD =2.0V
— 15 30 ns VDD =5.0V
OS20* TINP INT pin input high or low time 25 — — ns
OS21* TIOC Interrupt-on-change new input level TCY — — ns
time
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
VDD
MCLR
30
Internal
POR
33
PWRT
Time-out
32
OSC
Start-Up Time
Internal Reset(1)
Watchdog Timer
Reset(1)
31
34
34
I/O pins
VDD
VBOR + VHYST
VBOR
37
Reset
33*
(due to BOR)
* 64 ms delay only if PWRTE bit in the Configuration Word register is programmed to ‘0’.
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
T0CKI
40 41
42
T1CKI
45 46
47 49
TMR0 or
TMR1
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of: — — ns N = prescale
20 or TCY + 40 value
N
45* TT1H T1CKI High Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Time Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Time Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input Synchronous Greater of: — — ns N = prescale
Period 30 or TCY + 40 value
N
Asynchronous 60 — — ns
49* TCKEZT- Delay from External Clock Edge to Timer 2 TOSC — 7 TOSC — Timers in Sync
MR1 Increment mode
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
CCP1
(Capture mode)
CC01 CC02
CC03
Param.
Sym. Characteristic Min. Typ.† Max. Units Conditions
No.
CC01* TccL CCP1 Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCP1 Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCP1 Input Period 3TCY + 40 — — ns N = prescale
N value (1, 4 or
16)
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Param
Symbol Characteristics Min. Typ. Max. Units Comments
No.
VR01 VFVR FVR Voltage Output 1.116 1.2 1.284 V
VR02* TSTABLE FVR Turn On Time — 200 — s
* These parameters are characterized but not tested.
Param.
Symbol Characteristics Min. Typ. Max. Units Comments
No.
SR01 VSHUNT Shunt Voltage 4.75 5 5.5 V
SR02 ISHUNT Shunt Current 1 — 50 mA
SR03* TSETTLE Settling Time — — 150 ns To 1% of final value
SR04 CLOAD Load Capacitance 0.01 — 10 F Bypass capacitor on VDD
pin
SR05 ISNT Regulator operating current — 180 — A Includes band gap
reference current
* These parameters are characterized but not tested.
BSF ADCON0, GO
1 TCY
AD134 (TOSC/2)
AD131
Q4
AD130
A/D CLK
A/D Data 9 8 7 6 3 2 1 0
ADIF 1 TCY
GO DONE
Sampling Stopped
AD132
Sample
60
40
IDD (µA)
Typical
30
20
10
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
450
400 Max
Max: Mean + 3ı (125°C)
350 Typical: Mean (25°C)
300
Typical
IDD (µA)
250
200
150
100
50
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
1400
1000
800
IDD (µA)
600 4 MHz
400
1 MHz
200
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
1800
1400
1200
1000
IDD (µA)
800 4 MHz
600
1 MHz
400
200
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
1400
1000
800
IDD (µA)
4 MHz
600
400 1 MHz
200
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
1800
1400
1200
4 MHz
IDD (µA)
1000
800
1 MHz
600
400
200
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
700
4 MHz
Typical: Mean (25°C)
600
500
IDD (µA)
400
1 MHz
300
200
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
900
4 MHz
800 Max: Mean + 3ı (125°C)
700
600
IDD (µA)
1 MHz
500
400
300
200
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
900
4 MHz
800
Typical: Mean (25°C)
700
600
1 MHz
500
IDD (µA)
400
300
200
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
1400
1000
IDD (µA)
800
1 MHz
600
400
200
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
3.5
Max: Mean + 3ı (125°C)
3.0 Typical: Mean (25°C) Max
2.5
Typical
2.0
IDD (mA)
1.5
1.0
0.5
0.0
4.4 4.5 4.6 4.7 4.8 4.9 5.0 5.1
VDD (V)
10
9 Max125
Max125: Mean + 3ı (125°C)
8 Max 85: Mean + 3ı (85°C)
Typical: Mean (25°C)
7
6
IPD (µA)
2 Max85
1
Typical
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
400
Max: Mean + 3ı (125°C)
350 Typical: Mean (25°C) Max
300
Typical
250
IPD (µA)
200
150
100
50
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
20
Max125
18 Max125: Mean + 3ı (125°C)
Max 85: Mean + 3ı (85°C) Max85
16
14
12
(µA)
IPD (µ
10
Typical
8
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
400
350 Max
Max: Mean + 3ı (125°C)
Typical: Mean (25°C)
300
Typical
250
(µA)
IPD (µA
200
150
100
50
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
600
500 Max125
Max85
400
(µA)
Typical
IPD (µ
300
Max125:
M 125 MMean + 33ı (125°C)
200
Max 85: Mean + 3ı (85°C)
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
900
800 M
Max: M
Mean + 33ı (125°C)
Typical: Mean (25°C) Max
700
600
500 Typical
yp
(µA)
IPD (µA
400
300
200
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
22
16
14
IPD (µA)
12 Max85
10
6 Typical
2
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
400
300
Typical
250
µA)
IPD (µA)
200
150
100
50
2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
25
Max125: Mean + 3ı (125°C)
Max 85: Mean + 3ı (85°C) Max125
20 Typical: Mean (25°C)
15
(µA)
Max85
IPD (µ
10
Typical
0
1 5
1.5 2 0
2.0 2 5
2.5 3 0
3.0 3 5
3.5 4 0
4.0 4 5
4.5 5 0
5.0 5 5
5.5
VDD (V)
400
Max
350 Max: Mean + 3ı (125°C)
Typical: Mean (25°C)
300
Typical
250
(µA)
IPD (µA
200
150
100
50
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
80
50 Typical
(µA)
IPD (µA
40
30
20
10
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
500
450 Max
Max: Mean + 3ı (125°C)
400 Typical: Mean (25°C)
350
Typical
300
(µA)
IPD (µA
250
200
150
100
50
0
15
1.5 2
2.0
0 2
2.5
5 3
3.0
0 3
3.5
5 4
4.0
0 4
4.5
5 5
5.0
0
VDD (V)
140
Max125:
M 125 MMean + 33ı (125°C)
120 Max 85: Mean + 3ı (85°C) Max125
Typical: Mean (25°C)
100
Max85
80
(µA)
IPD (µA
Typical
60
40
20
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
500
450 Max
Max: Mean + 3ı (125°C)
400 Typical: Mean (25°C)
350
Typical
IPD ((µA)
300
250
200
150
100
50
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
400
Max125: Mean + 3ı (125°C) Max125
Max 85: Mean + 3ı (85°C)
350 Typical: Mean (25°C)
Max85
300
(µA)
IPD (µA
250
Typical
200
150
100
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
800
Max
700 Max: Mean + 3ı (125°C)
Typical: Mean (25°C)
600
500
Typical
(µA)
IPD (µA
400
300
200
100
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
12
8
(µA)
IPD (µA
4
Max85
2
Typical
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
400
300
(µA)
Typical
IPD (µA
250
200
150
100
2.5 3.0 3.5 4.0 4.5 5.0
VDD (V)
5.0
Max125: Mean + 3ı (125°C)
4.9 Max 85: Mean + 3ı (85°C)
Typical: Mean (25°C)
4.8 Min: Mean - 3ı (-40°C)
4.7
VOH (V)
4.6
Min
4.5
Typical
4.4
Max85
4.3
Max125
4.2
4.1
-21 -18 -15 -12 -9 -6 -3 0
IOH (mA)
FIGURE 21-31: VOH vs. IOH, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 5.0V
5.2
Max: Mean + 3ı (125°C)
5.0 Typical: Mean (25°C)
Min: Mean - 3ı (-40°C)
4.8
Min
Voh (V)
4.6
Typical
4.4
4.2
Max
4.0
-5.5 -5.0 -4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0
Ioh (mA)
3.0
2.6
VOH (V)
Min
2.4
Typical
Max85
2.2
Max125
2.0
-15 -12 -9 -6 -3 0
IOH (mA)
FIGURE 21-33: VOH vs. IOH, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 3.0V
3.5
3.0
Min
2.5
VOH (V)
Typical
2.0
1.0
-4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0
IOH (mA)
0.7
Max125
0.6
Max125: Mean + 3ı (125°C)
Max 85: Mean + 3ı (85°C) Max85
0.5 Typical: Mean (25°C)
Min: Mean - 3ı (-40°C)
Typical
0.4
VOL (V)
Min
0.3
0.2
0.1
0
0 10 20 30 40
IOL (mA)
FIGURE 21-35: VOL vs. IOL, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 5.0V
0.45
Typical
0.25
0.20
Min
0.15
0.10
0.05
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5
IOL (mA)
1.2
1.1
Max125: Mean + 3ı (125°C) Max125
1.0
Max 85: Mean + 3ı (85°C) Max85
0.9 Typical: Mean (25°C)
Min: Mean - 3ı (-40°C)
0.8
Typical
0.7
VOL (V)
0.6
Min
0.5
0.4
0.3
0.2
0.1
0.0
0 5 10 15 20 25 30 35 40
IOL (mA)
FIGURE 21-37: VOL vs. IOL, RA1/RA4/RA5, OVER TEMPERATURE, VDD = 3.0V
0.8
0.5
VOL (V)
Typical
0.4
0.3
Min
0.2
0.1
0.0
4 5 6 7 8 9 10 11
IOL (mA)
4.0
Min
3.5
Max125: Mean + 3ı (125°C)
Typical
Max85: Mean + 3ı (85°C)
3.0 Typical: Mean (25°C)
Min: Mean - 3ı (-40°C)
2.5
VIN(V)
2.0
Max85
1.5
Max125
1.0
0.5
0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD(V)
FIGURE 21-39: TTL INPUT THRESHOLD, VIN vs. VDD, OVER TEMPERATURE
1.7
Max
1.1
0.9
0.7
0.5
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
5.16
5.14 Max125: Mean + 3ı (125°C) Min
Max85: Mean + 3ı (85°C) Typical
5.12
Shunt Regulator Voltage(V)
FIGURE 21-41: TYPICAL HFINTOSC, START-UP TIMES vs. VDD, OVER TEMPERATURE
16
Max
14 Max: Mean + 3ı (85°C)
Typical: Mean (25°C)
12 Min: Mean - 3ı (-40°C)
Typical
10 Min
Time (us)
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
55
50
Max125: Mean + 3ı (125°C)
45 Max85: Mean + 3ı (85°C)
Typical: Mean (25°C)
40 Min: Mean - 3ı (-40°C)
35
Time (ms)
30
Max125
25 Max85
20
Typical
15
10 Min
5
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
80
75
60
55
50
45
Max
40
Typical
35 Min
30
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
90
70
60
50
Max
40 Typical
Min
30
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
XXXXXXXX 12F752
XXXXXNNN E/P e3 121
YYWW 1109
12F752
ESN1109
NNN 121
Note: In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line, thus limiting the number of available characters for
customer-specific information.
XXXX MFU0
YYWW 1109
NNN 121
PIN 1 PIN 1
Note: In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line, thus limiting the number of available characters for
customer-specific information.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A
N B
E1
NOTE 1
1 2
TOP VIEW
C A A2
PLANE
L c
A1
e eB
8X b1
8X b
.010 C
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DATUM A DATUM A
b b
e e
2 2
e e
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 - -
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB - - .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
== ISO/TS 16949 ==
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.