M27C1001

1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM

Features
■ 5v ± 10% Supply Voltage in Read Operation
■ Access Time: 35ns 32
32
■ Low Power Consumption:
– Active Current: 30 mA at 5 MHz 1
1

– Standby Current: 100 µA FDIP32W (F) PDIP32 (B)

■ Programming Voltage: 12.75V ± 0.25V
■ Programming Time: 100 µs/word
■ Electronic Signature
– Manufacturer Code: 20h
– Device Code: 05h
PLCC32 (C) TSOP32 (N)
■ ECOPACK® packages available 8 x 20 mm

April 2006 Rev 5 1/24

www.st.com 1
Contents M27C1001

Contents

1 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7 Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9 Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10 Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11

3 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4 DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18
5.2 32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19
5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20
5.4 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21

6 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2/24
M27C1001 List of tables

List of tables

Table 1. Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Table 2. Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3. Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 4. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 5. Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 6. Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 7. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 8. AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 9. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 11. Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 12. FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 13. PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 14. PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 15. TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

3/24
List of figures M27C1001

List of figures

Figure 1. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 11. PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 12. PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 13. TSOP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4/24
M27C1001 Summary description

1 Summary description

The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organized as 131,072 words of 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid that enables the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C1001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK®
packages. ECOPACK packages are Lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.
See Figure 1: Logic Diagram and Table 1: Signal Descriptions for a brief overview of the
signals connected to this device.

Figure 1. Logic Diagram

VCC VPP

17 8
A0-A16 Q0-Q7

P M27C1001

VSS
AI00710B

5/24
Summary description M27C1001

Table 1. Signal Descriptions

Signal Description

A0-A16 Address Inputs

Q0-Q7 Data Outputs
E Chip Enable
G Output Enable
P Program
VPP Program Supply
VCC Supply Voltage
VSS Ground
NC Not Connected Internally

Figure 2. DIP Connections

VPP 1 32 VCC
A16 2 31 P
A15 3 30 NC
A12 4 29 A14
A7 5 28 A13
A6 6 27 A8
A5 7 26 A9
A4 8 25 A11
M27C1001
A3 9 24 G
A2 10 23 A10
A1 11 22 E
A0 12 21 Q7
Q0 13 20 Q6
Q1 14 19 Q5
Q2 15 18 Q4
VSS 16 17 Q3
AI00711

6/24
M27C1001 Summary description

Figure 3. LCC Connections

VCC
VPP
A12
A15
A16

NC
P
1 32
A7 A14
A6 A13
A5 A8
A4 A9
A3 9 M27C1001 25 A11
A2 G
A1 A10
A0 E
Q0 Q7
17
Q1
Q2
VSS
Q3
Q4
Q5
Q6
AI00712

Figure 4. TSOP Connections

A11 1 32 G
A9 A10
A8 E
A13 Q7
A14 Q6
NC Q5
P Q4
VCC 8 M27C1001 25 Q3
VPP 9 (Normal) 24 VSS
A16 Q2
A15 Q1
A12 Q0
A7 A0
A6 A1
A5 A2
A4 16 17 A3
AI01151B

7/24
Device description M27C1001

2 Device description

Table 2 lists the operating modes of the M27C1001. A single power supply is required in
Read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature.

Table 2. Operating Modes

Mode E G P A9 VPP Q7-Q0

Read VIL VIL X X VCC or VSS Data Out

Output Disable VIL VIH X X VCC or VSS Hi-Z
Program VIL VIH VIL Pulse X VPP Data In
Verify VIL VIL VIH X VPP Data Out
Program Inhibit VIH X X X VPP Hi-Z
Standby VIH X X X VCC or VSS Hi-Z
Electronic Signature VIL VIL VIH VID VCC Codes

Note: X = VIH or VIL, VID = 12V ± 0.5V.

2.1 Read mode

The M27C1001 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV.

2.2 Standby mode

The M27C1001 has a standby mode which reduces the supply current from 30mA to 100µA.
The M27C1001 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.

2.3 Two-line output control

Because EPROMs are usually used in larger memory arrays, this product features a 2-line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
● the lowest possible memory power dissipation,
● complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This

8/24
M27C1001 Device description

ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.

2.4 System considerations

The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.

2.5 Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C1001 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposition to ultraviolet light (UV EPROM). The
M27C1001 is in the programming mode when VPP input is at 12.75V, E is at VIL and P is
pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be
6.25V ± 0.25V.

2.6 Presto II programming algorithm

Presto II Programming Algorithm allows the whole array to be programmed, with a
guaranteed margin, in a typical time of 13 seconds. Programming with Presto II involves in
applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see
Figure 5). During programming and verify operation, a Margin mode circuit is automatically
activated in order to guarantee that each cell is programmed with enough margin. No
overprogram pulse is applied since the verify in Margin mode provides necessary margin to
each programmed cell.

9/24
Device description M27C1001

Figure 5. Programming Flowchart

VCC = 6.25V, VPP = 12.75V

n=0

P = 100µs Pulse

NO

++n NO
= 25 VERIFY ++ Addr

YES YES

Last NO
FAIL Addr

YES

CHECK ALL BYTES

1st: VCC = 6V
2nd: VCC = 4.2V

AI00715C

2.7 Program Inhibit

Programming of multiple M27C1001s in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C1001 may be
common. A TTL low level pulse applied to a M27C1001's P input, with E low and VPP at
12.75V, will program that M27C1001. A high level E input inhibits the other M27C1001s from
being programmed.

2.8 Program Verify

A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at
12.75V and VCC at 6.25V.

2.9 Electronic Signature

The Electronic Signature (ES) mode enables the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C1001. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C1001, with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode.

10/24
M27C1001 Device description

Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device
identifier code. For the STMicroelectronics M27C1001, these two identifier bytes are given
in Table 3 and can be read-out on outputs Q7 to Q0.

Table 3. Electronic Signature

Identifier A0 Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 Hex Data

Manufacturer’s Code VIL 0 0 1 0 0 0 0 0 20h

Device Code VIH 0 0 0 0 0 1 0 1 05h

2.10 Erasure operation (applies to UV EPROM)

The erasure characteristics of the M27C1001 is such that erasure begins when the cells are
exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Research shows that constant exposure to room level fluorescent lighting could
erase a typical M27C1001 in about 3 years, while it would take approximately 1 week to
cause erasure when exposed to direct sunlight. If the M27C1001 is to be exposed to these
types of lighting conditions for extended periods of time, it is suggested that opaque labels
be put over the M27C1001 window to prevent unintentional erasure. The recommended
erasure procedure for the M27C1001 is exposure to short wave ultraviolet light which has a
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C1001
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.

11/24
Maximum ratings M27C1001

3 Maximum ratings

Table 4. Absolute Maximum Ratings(1)

Symbol Parameter Value Unit

TA Ambient Operating Temperature (2) –40 to 125 °C

TBIAS Temperature Under Bias –50 to 125 °C
TSTG Storage Temperature –65 to 150 °C
VIO (3) Input or Output Voltage (except A9) –2 to 7 V
VCC Supply Voltage –2 to 7 V
(3)
VA9 A9 Voltage –2 to 13.5 V
VPP Program Supply Voltage –2 to 14 V
1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute
Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods
may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality
documents.
2. Depends on range.
3. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than
20ns.
Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than
20ns.

12/24
M27C1001 DC and AC characteristics

4 DC and AC characteristics

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

Table 5. Read Mode DC Characteristics (1)

Symbol Parameter Test Condition Min. Max. Unit

ILI Input Leakage Current 0V ≤ VIN ≤ VCC ±10 µA

ILO Output Leakage Current 0V ≤ VOUT ≤ VCC ±10 µA
E = VIL, G = VIL,
ICC Supply Current 30 mA
IOUT = 0mA, f = 5MHz
ICC1 Supply Current (Standby) TTL E = VIH 1 mA
ICC2 Supply Current (Standby) CMOS E > VCC – 0.2V 100 µA
IPP Program Current VPP = VCC 10 µA
VIL Input Low Voltage –0.3 0.8 V
(2)
VIH Input High Voltage 2 VCC + 1 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
Output High Voltage TTL IOH = –400µA 2.4 V
VOH
Output High Voltage CMOS IOH = –100µA VCC – 0.7V V
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Maximum DC voltage on Output is VCC +0.5V.

TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V

Table 6. Programming Mode DC Characteristics (1)

Symbol Parameter Test Condition Min. Max. Unit

ILI Input Leakage Current VIL ≤ VIN ≤ VIH ±10 µA

ICC Supply Current 50 mA
IPP Program Current E = VIL 50 mA
VIL Input Low Voltage –0.3 0.8 V
VIH Input High Voltage 2 VCC + 0.5 V
VOL Output Low Voltage IOL = 2.1mA 0.4 V
VOH Output High Voltage TTL IOH = –400µA 2.4 V
VID A9 Voltage 11.5 12.5 V
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.

13/24
DC and AC characteristics M27C1001

TA = 25 °C, f = 1 MHz

Table 7. Capacitance (1)

Symbol Parameter Test Condition Min Max Unit

CIN Input Capacitance VIN = 0V 6 pF

COUT Output Capacitance VOUT = 0V 12 pF
1. Sampled only, not 100% tested.

Table 8. AC Measurement Conditions

Parameter High Speed Standard

Input Rise and Fall Times ≤ 10ns ≤ 20ns

Input Pulse Voltages 0 to 3V 0.4V to 2.4V
Input and Output Timing Ref. Voltages 1.5V 0.8V and 2V

Figure 6. AC Testing Input Output Waveform

High Speed

3V

1.5V

0V

Standard

2.4V
2.0V

0.8V
0.4V

AI01822

Figure 7. AC Testing Load Circuit

1.3V

1N914

3.3kΩ

DEVICE
UNDER OUT
TEST
CL

CL = 30pF for High Speed

CL = 100pF for Standard
CL includes JIG capacitance AI01823B

14/24
M27C1001 DC and AC characteristics

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

Table 9. Read Mode AC Characteristics (1)

M27C1001
Test
Symbol Alt Parameter -35 (2) -45 -60 -70 Unit
Condition
Min. Max. Min. Max. Min. Max. Min. Max.

Address Valid to E = VIL,

tAVQV tACC 35 45 60 70 ns
Output Valid G = VIL
Chip Enable Low
tELQV tCE G = VIL 35 45 60 70 ns
to Output Valid
Output Enable
tGLQV tOE Low to Output E = VIL 25 25 30 35 ns
Valid
Chip Enable High
tEHQZ (3) tDF G = VIL 0 25 0 25 0 30 0 30 ns
to Output Hi-Z
Output Enable
tGHQZ
(3) tDF High to Output Hi- E = VIL 0 25 0 25 0 30 0 30 ns
Z
Address Transition
E = VIL,
tAXQX tOH to Output 0 0 0 0 ns
G = VIL
Transition
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Speed obtained with High Speed AC measurement conditions.
3. Sampled only, not 100% tested.

15/24
DC and AC characteristics M27C1001

TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC

Table 10. Read Mode AC Characteristics (1)

M27C1001

Test -12/-15/
Symbol Alt Parameter -80 -90 -10 Unit
Condition -20/-25

Min Max Min Max Min Max Min Max

Address Valid to E = VIL, G =

tAVQV tACC 80 90 100 120 ns
Output Valid VIL
Chip Enable Low
tELQV tCE G = VIL 80 90 100 120 ns
to Output Valid
Output Enable
tGLQV tOE Low to Output E = VIL 40 45 50 60 ns
Valid
Chip Enable High
tEHQZ (2) tDF G = VIL 0 30 0 30 0 30 0 40 ns
to Output Hi-Z
Output Enable
tGHQZ
(2) tDF High to Output E = VIL 0 30 0 30 0 30 0 40 ns
Hi-Z
Address
E = VIL, G =
tAXQX tOH Transition to 0 0 0 0 ns
V
Output Transition IL
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.

Figure 8. Read Mode AC Waveforms

A0-A16 VALID VALID

tAVQV tAXQX

tEHQZ
tGLQV

tELQV tGHQZ

Hi-Z
Q0-Q7

AI00713B

16/24
M27C1001 DC and AC characteristics

TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V

Table 11. Programming Mode AC Characteristics (1)

Symbol Alt Parameter Test Condition Min. Max. Unit

tAVPL tAS Address Valid to Program Low 2 µs

tQVPL tDS Input Valid to Program Low 2 µs
tVPHPL tVPS VPP High to Program Low 2 µs
tVCHPL tVCS VCC High to Program Low 2 µs
tELPL tCES Chip Enable Low to Program Low 2 µs
tPLPH tPW Program Pulse Width 95 105 µs
tPHQX tDH Program High to Input Transition 2 µs
tQXGL tOES Input Transition to Output Enable Low 2 µs
tGLQV tOE Output Enable Low to Output Valid 100 ns
tGHQZ (2) tDFP Output Enable High to Output Hi-Z 0 130 ns
Output Enable High to Address
tGHAX tAH 0 ns
Transition
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.

Figure 9. Programming and Verify Modes AC Waveforms

A0-A16 VALID

tAVPL

Q0-Q7 DATA IN DATA OUT

tQVPL tPHQX

VPP

tVPHPL tGLQV tGHQZ

VCC

tVCHPL tGHAX

tELPL

P
tPLPH tQXGL

PROGRAM VERIFY
AI00714

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Package mechanical data M27C1001

5 Package mechanical data

5.1 32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA)

Figure 10. FDIP32WA package outline

A2 A3 A

A1 L α
B1 B e C
eA
D2
eB
D
S
N

∅ E1 E

1
FDIPW-a

Table 12. FDIP32WA package mechanical data

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 5.72 0.225
A1 0.51 1.40 0.020 0.055
A2 3.91 4.57 0.154 0.180
A3 3.89 4.50 0.153 0.177
B 0.41 0.56 0.016 0.022
B1 1.45 0.057
C 0.23 0.30 0.009 0.012
D 41.73 42.04 1.643 1.655
D2 38.10 1.500
e 2.54 0.100
E 15.24 0.600
E1 13.06 13.36 0.514 0.526
eA 14.99 0.590
eB 16.18 18.03 0.637 0.710
L 3.18 4.10 0.125 0.161
N 32 32
S 1.52 2.49 0.060 0.098
Ø 7.11 0.280
α 4° 11° 4° 11°

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M27C1001 Package mechanical data

5.2 32-pin Plastic DIP, 600 mils width (PDIP32)

Figure 11. PDIP32 package outline

A2 A

A1 L α
b1 b e c
eA
D2

D
S
N

E1 E

1
PDIP-C

Table 13. PDIP32 package mechanical data

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 4.83 0.190
A1 0.38 0.015
A2 3.81 0.150
b 0.41 0.53 0.016 0.021
b1 1.14 1.65 0.045 0.065
c 0.23 0.38 0.009 0.015
D 41.78 42.29 1.645 1.665
D2 38.10 1.500
eA 15.24 0.600
e 2.54 0.100
E 15.24 15.88 0.600 0.625
E1 13.46 13.97 0.530 0.550
S 1.65 2.21 0.065 0.087
L 3.05 3.56 0.120 0.140
α 0° 15° 0° 15°
N 32 32

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Package mechanical data M27C1001

5.3 32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32)

Figure 12. PLCC32 package outline
D A1
D1 A2

1 N
B1
E2

e
E3 E1 E F
B
0.51 (.020) E2

1.14 (.045)

D3 A

R CP

D2 D2
PLCC-A

Table 14. PLCC32 package mechanical data

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 3.18 3.56 0.125 0.140

A1 1.53 2.41 0.060 0.095
A2 0.38 0.015
B 0.33 0.53 0.013 0.021
B1 0.66 0.81 0.026 0.032
CP 0.10 0.004
D 12.32 12.57 0.485 0.495
D1 11.35 11.51 0.447 0.453
D2 4.78 5.66 0.188 0.223
D3 7.62 0.300
E 14.86 15.11 0.585 0.595
E1 13.89 14.05 0.547 0.553
E2 6.05 6.93 0.238 0.273
E3 10.16 0.400
e 1.27 0.050
F 0.00 0.13 0.000 0.005
R 0.89 0.035
N 32 32

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M27C1001 Package mechanical data

5.4 32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32)

Figure 13. TSOP32 package outline
A2

1 N
e

B
N/2

D1 A
D CP

DIE

TSOP-a A1 α L

Table 15. TSOP32 package mechanical data

millimeters inches
Symbol
Min Typ Max Min Typ Max

A 1.200 0.0472
A1 0.050 0.150 0.0020 0.0059
A2 0.950 1.050 0.0374 0.0413
B 0.170 0.250 0.0067 0.0098
C 0.100 0.210 0.0039 0.0083
CP 0.100 0.0039
D 19.800 20.200 0.7795 0.7953
D1 18.300 18.500 0.7205 0.7283
e 0.500 0.0197
E 7.900 8.100 0.3110 0.3189
L 0.500 0.700 0.0197 0.0276
N 32 32
α 0° 5° 0° 5°

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Part numbering M27C1001

6 Part numbering

Table 16. Ordering information scheme

Example: M27C1001 -35 X C 1 TR

Device Type
M27

Supply Voltage
C = 5V

Device Function
1001 = 1 Mbit (128Kb x 8)

Speed
-35 (1) = 35 ns -10 = 100 ns
-45 = 45 ns -12 = 120 ns
-60 = 60 ns -15 = 150 ns
-70 = 70 ns -20 = 200 ns
-80 = 80 ns -25 = 250 ns
-90 = 90 ns

VCC Tolerance
blank = ± 10%
X = ± 5%

Package
F = FDIP32W C = PLCC32
B = PDIP32 N = TSOP32: 8 x 20 mm

Temperature Range
1 = 0 to 70 °C
3 = –40 to 125 °C
6 = –40 to 85 °C

Options
TR = ECOPACK® package, Tape & Reel Packing

1. High Speed, see AC Characteristics section for further information.

For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.

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M27C1001 Revision history

7 Revision history

Table 17. Document revision history

Date Revision Changes

September 1998 1 First Issue

24-Jan-2000 2 35ns speed class addes (Table 8A, Table 16)
20-Sep-2000 3 AN620 Reference removed
PLCC32 Package mechanical data and drawing clarified
04-Jun-2002 4 (Table 14 and Figure 12)
TSOP32 Package mechanical data clarified (Table 15)
Removed LCC32W package and Additional Burn-in option.
12-Apr-2006 5
Converted to new template. Added ECOPACK® information.

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 M27C1001

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