DS8510 07
DS8510 07
DS8510 07
RT8510
AGND 1 12 OVP
Ordering Information COMP 2 11 PGND
GND
RT8510 ISET 3 10 PGND
17
Package Type RT 4 9 LX
5 6 7 8
QW : WQFN-16L 3x3 (W-Type)
PWM
EN
VIN
LX
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
VOUT
23V MAX
L (VOUT depends on DMAX)
VBATT 10µH D1
2.7V to 24V CIN
10µF
RT8510 ROVP2
7 VIN : : : :
5V LX 8, 9 2M
COUT : : : : 10 LED String
C2 : : : :
1µF 12 10µF : : : :
Chip Enable OVP
6 EN
ROVP1
100k 62k
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
+
- 1.2
Regulator
RT OSC S Q
OCP
R Q
OTP
PWM +
PGND
Controller -
+ 0.4V
COMP EA 4
- LED
PWM Detection
CH1
CH2
CH3
CH4
+ + +
:
:
+ 0.6V - - -
-
ISET
AGND
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Electrical Characteristics
(VIN = 4.5V, TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
VCOMP = 0V, no switching 0.7 1 1.5
VIN Quiescent Current IQ mA
VCOMP = 2V, switching 1.6 2 3
VIN Shutdown Current ISHDN VIN = 4.5V, EN = 0V 0.01 -- 10 A
Rising 2.07 2.3 2.53
VIN Under Voltage Lockout UVLO V
Falling 1.98 2.2 2.42
Control Input
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-
thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. θJC is measured at the
exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Guaranteed by design; not subject to production testing.
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
22
60
50 20
CH1
40 CH2
18
30 CH3
CH4
20
16
10
10 x 4 LEDs, fOSC = 1MHz fOSC = 1MHz
0 14
4 8 12 16 20 24 4 9 14 19 24
Input Voltage (V) Input Voltage (V)
24 0.65
LED Current (mA)
22 0.60
VISET (V)
20 0.55
18 0.50
16 0.45
VISET vs. Input Voltage LED Current vs. PWM Duty Cycle
0.8 90
80
0.7 70
LED Current (mA)
60
0.6
VISET (V)
50
PWM = 30kHz
40 PWM = 10kHz
0.5 PWM = 1kHz
30 PWM = 120Hz
0.4 20
10
fOSC = 1MHz 10 x 4 LEDs, fOSC = 1MHz
0.3 0
4 8 12 16 20 24 0 10 20 30 40 50 60 70 80 90 100
Input Voltage (V) Duty Cycle (%)
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
OVP Threshold vs. Input Voltage Switch Off Current vs. Temperature
1.5 1.5
1.3 1.1
1.2 0.9
1.1 0.7
VIN VIN
(5V/Div) (2V/Div)
IOUT IOUT
(50mA/Div) (50mA/Div)
VIN = 11V to 14V, fOSC = 1MHz VIN = 4.5V to 5.5V, fOSC = 1MHz
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
CH4
CH3
CH2
CH1
shielded with a ground trace as close as possible. The
to prevent any noise coupling.
conductivity four-layer test board. The maximum power traces should be wide and
short especially for the high-
16 15 14 13
current loop.
dissipation at TA = 25°C can be calculated as below : GND C3 AGND 1 12 OVP
R3
COMP 2 11 PGND
PD(MAX) = (125°C − 25°C) / (68°C/W) = 1.471W for a ISET 3
GND
10 PGND
WQFN-16L 3x3 package. C4 RT 4 17 9 LX D1 VOUT
5 6 7 8
L1 COUT
R2 CIN
ambient temperature for the fixed TJ(MAX) and the thermal
C2
resistance, θJA. The derating curves in Figure 1 allows
+
the designer to see the effect of rising ambient temperature GND GND
VIN
1.40
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0 25 50 75 100 125
Ambient Temperature (°C)
Figure 8. Derating Curve of Maximum Power Dissipation
Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
SEE DETAIL A
D D2
L
1
E E2
1 1
2 2
e b
A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
www.richtek.com DS8510-07 December 2021
12