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DS8510 07

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®

RT8510

43V 4-CH LED Driver


General Description Features
The RT8510 is a high efficiency driver for white LEDs. It is  Wide Input Voltage : 4.2V to 24V
designed for LCD panels that employ an array of LEDs as  High Output Voltage : Up to 43V
the lighting source. An integrated switch current mode  Adjustable Channel Current : 10mA to 40mA
boost controller drives four strings in parallel and supports  Channel Current Accuracy : ±3%
up to 12 pieces of LED per string. The internal current  Channel Current Matching : ±2%
sinks support a maximum of ±2% current mismatching  PWM Dimming Frequency : 120Hz to 30kHz
for excellent brightness uniformity in each string of LED.  Adjustable Switching Frequency : 500kHz to 2MHz
To provide enough headroom for current sink operation  Built-In Soft-Start
the boost controller monitors the minimum voltage of  Disconnects LED in Shutdown
feedback pins and regulates an optimized output voltage  Open Current Sink Detection
for power efficiency.  Adjustable Over Voltage Protection
 Over Temperature Protection
The RT8510 has a wide input voltage range from 4.2V to
 Current Limit Protection
24V and provide an adjustable 10mA to 40mA LED current.
 Thin 16-Lead WQFN Package
The internal 200mΩ, 43V power switch with current-mode
 RoHS Compliant and Halogen Free
control provides cycle-by-cycle over current protection.
The RT8510 also integrates PWM dimming function for
accurate LED current control. The input PWM dimming
Applications
frequency can operate from 120Hz to 30kHz without  UMPC and Notebook Computer Backlight
inducing any inrush current through the LED or inductor.  GPS, Portable DVD Backlight
The switching frequency of the RT8510 is adjustable from
500kHz to 2MHz, allowing the user flexibility between Pin Configuration
efficiency and component size. (TOP VIEW)
CH4
CH3
CH2
CH1

The RT8510 is available in a WQFN-16L 3x3 package.


16 15 14 13

AGND 1 12 OVP
Ordering Information COMP 2 11 PGND
GND
RT8510 ISET 3 10 PGND
17
Package Type RT 4 9 LX
5 6 7 8
QW : WQFN-16L 3x3 (W-Type)
PWM
EN
VIN
LX

Lead Plating System


G : Green (Halogen Free and Pb Free)
Z : ECO (Ecological Element with WQFN-16L 3x3
Halogen Free and Pb free)
Note :
Richtek products are :
 RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes.

Copyright © 2021 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

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RT8510
Marking Information
HU= : Product Code
YMDNN : Date Code
HU=YM
DNN

Typical Application Circuit


VOUT
L 43V MAX
VIN 10µH D1
4.2V to 24V
CIN R2
10µF 10 RT8510 ROVP2
7 VIN : : : :
LX 8, 9 2M : : : : 10 LED String
C2 : : : :
1µF COUT
12 : : : :
Chip Enable OVP 10µF
6 EN
ROVP1
100k 62k

PWM Dimming 5 PWM CH1 13


2 14
COMP CH2
R3 4
RT CH3 15
C4
1nF
10k 3 ISET CH4 16
RRT
C3 51k PGND AGND
10nF RISET
4.75k 10, 11 1

Figure 1. General Application Circuit

VOUT
23V MAX
L (VOUT depends on DMAX)
VBATT 10µH D1
2.7V to 24V CIN
10µF
RT8510 ROVP2
7 VIN : : : :
5V LX 8, 9 2M
COUT : : : : 10 LED String
C2 : : : :
1µF 12 10µF : : : :
Chip Enable OVP
6 EN
ROVP1
100k 62k

PWM Dimming 5 PWM CH1 13


2 14
COMP CH2
R3 4
RT CH3 15
C4
1nF
10k 3 ISET CH4 16
RRT
C3 51k PGND AGND
10nF RISET
4.75k 10, 11 1

Figure 2. Low Input Voltage Application Circuit

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RT8510
Functional Pin Description
Pin No. Pin Name Pin Function
1 AGND Analog ground of LED driver.
Compensation pin for error amplifier. Connect a compensation network to
2 COMP
ground.
LED current set pin. LED current is set by the value of the resistor RISET
connected from the ISET pin to ground. Do not short the ISET pin. VISET is
typically 0.6V.
3 ISET
95
ILED =
RISET
Frequency adjust pin. This pin allows setting the switching frequency with a
4 RT
resistor to 500kHz to 2MHz.
5 PWM Dimming control input.
Chip enable (Active High). Note that this pin is high impedance. There should be
6 EN
a pull low 100k resistor connected to GND when the control signal is floating.
7 VIN Power supply input.
8, 9 LX Switching pin of boost converter.
10, 11 PGND Power ground of boost converter.
12 OVP Sense input for over voltage protection. The detecting threshold is 1.2V.
13, 14, 15, 16 CH1 to CH 4 Current sink for LED. Leave the pin unconnected, if not used.
The exposed pad must be soldered to a large PCB and connected to GND for
17 (Exposed Pad) GND
maximum power dissipation.

Functional Block Diagram OVP LX EN VIN

+
- 1.2
Regulator

RT OSC S Q

OCP
R Q

OTP
PWM +
PGND
Controller -

+ 0.4V
COMP EA 4
- LED
PWM Detection
CH1
CH2
CH3
CH4
+ + +
:
:

+ 0.6V - - -
-

ISET

AGND

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3
RT8510
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage to GND ------------------------------------------------------------------------------------------- −0.3V to 26.5V
 EN, PWM, ISET, COMP, RT to GND --------------------------------------------------------------------------------- −0.3V to 26.5V
 LX, OVP, CH1, CH2, CH3, CH4 to GND ----------------------------------------------------------------------------- −0.3V to 48V
 Power Dissipation, PD @ TA = 25°C
WQFN-16L 3x3 ------------------------------------------------------------------------------------------------------------ 1.471W
 Package Thermal Resistance (Note 2)
WQFN-16L 3x3, θJA ------------------------------------------------------------------------------------------------------- 68°C/W
WQFN-16L 3x3, θJC ------------------------------------------------------------------------------------------------------ 7.5°C/W
 Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------- 260°C
 Junction Temperature ----------------------------------------------------------------------------------------------------- 150°C
 Storage Temperature Range -------------------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 3)
HBM -------------------------------------------------------------------------------------------------------------------------- 2kV
MM ---------------------------------------------------------------------------------------------------------------------------- 200V

Recommended Operating Conditions (Note 4)


 Supply Input Voltage, VIN ------------------------------------------------------------------------------------------------ 4.2V to 24V
 Junction Temperature Range -------------------------------------------------------------------------------------------- −40°C to 125°C
 Ambient Temperature Range -------------------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = 4.5V, TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
VCOMP = 0V, no switching 0.7 1 1.5
VIN Quiescent Current IQ mA
VCOMP = 2V, switching 1.6 2 3
VIN Shutdown Current ISHDN VIN = 4.5V, EN = 0V 0.01 -- 10 A
Rising 2.07 2.3 2.53
VIN Under Voltage Lockout UVLO V
Falling 1.98 2.2 2.42
Control Input

EN Threshold Logic-High VIH 2 -- --


VIN = 4.2V to 24V V
Voltage Logic-Low VIL -- -- 0.8
PWM Threshold Logic-High VIH 1.5
VIN = 4.2V to 24V
Voltage Logic-Low VIL 0.6
PWM Dimming Frequency f PWM 120 -- 30k Hz
EN, PWM Leakage Current ILKG 2 -- 6 A
EN Shutdown Delay tEN RRT = 51k 28 32 36 ms
Boost Converter
RRT = 25k 1.65 1.94 2.23
Switching Frequency fOSC RRT = 51k 0.94 1.1 1.27 MHz
RRT = 102k 0.48 0.57 0.66

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RT8510
Parameter Symbol Test Conditions Min Typ Max Unit
LX On Resistance (N-MOSFET) RDS(ON)_N VIN > 4.5V 0.18 0.25 0.33 
Minimum ON Time tMON 59 90 121 ns
Maximum Duty DMAX VCOMP = 2V, switching 85 90 95 %
LX Current Limit ILIM 1.5 2 2.7 A
LED Current Programming
2V > CHx > 0.4V calculating
LED Current Matching ILEDM (I(MAX)  I(AVG)) / I(AVG) x 100%, -2 -- 2 %
RISET = 4.75k
2V > CHx > 0.4V calculating
LED Current Accuracy ILEDA (ICH  ISET) / ISET x 100%, -3 3 %
RISET = 4.75k
ISET Pin Voltage VISET 0.56 0.6 0.64 V
LED Current ICHx 2V > CHx > 0.4V, RISET = 4.75k 19.4 20 20.6 mA
Fault Protection
OVP Threshold VOVP 1.16 1.2 1.24 V
OVP Fail Threshold VOVPF 33 55 77 mV
Thermal Shutdown Temperature TSD 145 160 175 °C
LED Pin Under Voltage
VLSD No connection 18 60 100 mV
Threshold
Highest LED string voltage,
Regulated VCHx VCHx 0.3 0.4 0.5 V
RISET = 4.75k

Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured under natural convection (still air) at TA = 25°C with the component mounted on a high effective-
thermal-conductivity four-layer test board on a JEDEC 51-7 thermal measurement standard. θJC is measured at the
exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. Guaranteed by design; not subject to production testing.

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RT8510
Typical Operating Characteristics
Efficiency vs. Input Voltage LED Current vs. Input Voltage
100 26
90
24
80

LED Current (mA)


70
Efficiency (%)

22
60
50 20
CH1
40 CH2
18
30 CH3
CH4
20
16
10
10 x 4 LEDs, fOSC = 1MHz fOSC = 1MHz
0 14
4 8 12 16 20 24 4 9 14 19 24
Input Voltage (V) Input Voltage (V)

LED Current vs. Temperature VISET vs. Temperature


26 0.70

24 0.65
LED Current (mA)

22 0.60
VISET (V)

20 0.55

18 0.50

16 0.45

VIN = 12V, fOSC = 1MHz VIN = 12V, fOSC = 1MHz


14 0.40
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

VISET vs. Input Voltage LED Current vs. PWM Duty Cycle
0.8 90

80
0.7 70
LED Current (mA)

60
0.6
VISET (V)

50
PWM = 30kHz
40 PWM = 10kHz
0.5 PWM = 1kHz
30 PWM = 120Hz

0.4 20

10
fOSC = 1MHz 10 x 4 LEDs, fOSC = 1MHz
0.3 0
4 8 12 16 20 24 0 10 20 30 40 50 60 70 80 90 100
Input Voltage (V) Duty Cycle (%)

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RT8510

OVP Threshold vs. Input Voltage Switch Off Current vs. Temperature
1.5 1.5

Switch Off Current (mA)


1.4 1.3
OVP Threshold (V)

1.3 1.1

1.2 0.9

1.1 0.7

fOSC = 1MHz fOSC = 1MHz, VIN = 4.5V


1.0 0.5
4 8 12 16 20 24 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)

Line Transient Response Line Transient Response

VIN VIN
(5V/Div) (2V/Div)

IOUT IOUT
(50mA/Div) (50mA/Div)
VIN = 11V to 14V, fOSC = 1MHz VIN = 4.5V to 5.5V, fOSC = 1MHz

Time (50ms/Div) Time (50ms/Div)

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RT8510
Application Information
T2 T4
The RT8510 is a general purpose 4-CH LED driver capable T1 T3
of delivering an adjustable 10 to 40mA LED current. The
CLK
IC is a current mode boost converter integrated with a
43V/2A power switch and can cover a wide VIN range from Output of PWM
Comparator
4.2V to 24V. The switching frequency is adjustable by an
PWM
external resistor from 500kHz to 2MHz. The part Pulse
Normal Normal Pulse Normal
integrates built-in soft start, with PWM dimming control; Operation Operation Skipped Operation
moreover, it provides over voltage, over temperature and
Figure 3. Pulse Skip Mode
current limiting protection features.
Setting and Regulation of LED Current
Soft-Start
The LED current can be calculated by the following
The RT8510 equips a built-in soft-start feature to prevent
equation :
high inrush current during start-up. The soft-start function
95
prevents excessive input current and input voltage droop ILED 
RISET
during power on state.
where RISET is the resistor between the ISET pin and GND.
Compensation This setting is the reference for the LED current at channel
The control loop can be compensates by adjusting the 1-4 and represents the sensed LED current for each string.
external components connected to the COMP pin. The The DC/DC converter regulates the LED current according
COMP pin is the output of the internal error amplifier. The to RISET.
compensation capacitors, C3 and C4, will adjust the
integrator zero and pole respectively to maintain stability. Power Sequence
Moreover, the resistor, R3, will adjust the frequency LED Driver is without power sequence concern. Figure 4,
integrator gain for fast transient response. Figure 5 and Figure 6 are different power sequences
respectively. There is no concern in the above condition.
Switching Frequency
VIN
The LED driver switching frequency is able to adjusted as
the following equation :
51k VOUT
fOSC  (MHz)
RRT
EN
LED Connection 1ms
The RT8510 equips 4-CH LED divers with each channel
PWM
supporting up to 12 LEDs. The LED strings are connected
from the output of the boost converter to pins 13, 14, 15 Power On Mode 1
and 16 respectively. If one of the LED channel is not used, Figure 4
the LED pin should be opened directly.

Light Load Mode


When the input voltage is close to the output voltage,
VOUT ripple will increase. The VOUT should be set at higher
than 1.2 x VIN. If duty pulse is close to minimum on-time
and smaller than 120ns, the duty pulse will be skipped.
Figure 3 shows the timing diagram with skipped pulse.
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RT8510
VIN Over Voltage Protection
The RT8510 integrates over voltage protection (OVP)
VOUT
function. When the voltage at the OVP pin reaches the
threshold voltage, the internal switch will be turned off.
EN The internal switch will be turned on again once the voltage
at OVP pin drops below its threshold voltage.
PWM
The OVP threshold voltage is adjustable and can be
Power Off Mode 1-1 clamped at a certain voltage level and it can be calculated
by the following equation :
VIN
 R 
VOUT(OVP)  VOVP   1  OVP2 
 ROVP1 
VOUT
where VOVP = 1.2V (typ.).

EN ROVP1 and ROVP2 are the resistors in the voltage divider


connected to the OVP pin. If at least one string is in normal
PWM operation, the controller will automatically ignore the open
strings and continue to regulate the current for the strings
Power Off Mode 1-2
in normal operation. It is suggested to use 2MΩ for ROVP2
Figure 5
to reduce loading effect.

Current Limit Protection


VIN The RT8510 can limit the peak current to achieve over
UVLO
current protection. The RT8510 senses the inductor
current during the “ON” period that flows through the LX
VOUT
pin. The duty cycle depends on the current signal and
EN
internal slope compensation in comparison with the error
1ms
signal. The internal switch will be turned off when the
PWM current signal is larger than the internal slope
compensation. In the “OFF” period, the inductor current
Power On Mode 2 will be decreased until the internal switch is turned on by
the oscillator.
VIN
UVLO
Brightness Control
The RT8510 brightness dimming control is determined by
VOUT
the signal on the PWM pin with a suggested PWM
EN frequency range from 120Hz to 30kHz. However, the LED
current cannot be 100% proportional to duty cycle
PWM especially for high frequency and low duty ratio because
of physical limitation caused by inductor rising time. Please
Power On Mode 2
refer to Table 1 and Figure 7.
Figure 6

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RT8510
Table 1. where VOUT is the maximum output voltage, VIN is the
Dimming Frequency (Hz) Duty (Min.) Duty (Max.) minimum input voltage, fOSC is the operating frequency
120 < f PWM  500 0.2% 100% and IOUT is the total current from all LED strings.
500 < f PWM  1k 0.4% 100%
The boost converter operates in DCM over the entire input
1k < f PWM  2k 0.8% 100%
voltage range when the inductor value is below this value
2k < f PWM  5k 1.5% 100%
L. When inductance greater is than L, the converter
5k < f PWM  10k 3% 100%
operates in CCM at the minimum input voltage and may
10k < fPWM  30k 10% 100%
be discontinuous at higher voltages.
Note : The minimum duty in Table 1 is based on the application
The inductor must be selected with a saturated current
circuit and does not consider the deviation of current linearity.
rating that is greater than the peak current provided by
LED Current vs. PWM Duty Cycle the following equation :
90 VOUT  IOUT VIN  D  T
IPEAK  
80   VIN 2L
70
where η is the efficiency of the power converter and T is
LED Current (mA)

60 the operating period.


50 PWM = 30kHz
PWM = 10kHz Diode Selection
40
PWM = 1kHz
30
Schottky diodes are recommended for most applications
PWM = 120Hz
because of their fast recovery time and low forward voltage.
20
The power dissipation, reverse voltage rating and pulsating
10
VIN = 12V, VPWM = 0V to 3V peak current are the important parameters for Schottky
0
diode selection. Make sure that the diode's peak current
0 10 20 30 40 50 60 70 80 90 100
rating exceeds IPEAK and reverse voltage rating exceeds
Duty Cycle (%)
the maximum output voltage.
Figure 7
Output Capacitor Selection
Over Temperature Protection
The input capacitor reduces current spikes from the input
The RT8510 has over temperature protection function to supply and minimizes noise injection to the converter. For
prevent the IC from overheating due to excessive power most applications, a 10μF ceramic capacitor is sufficient.
dissipation. The OTP function will shutdown the IC when A value higher or lower may be used depending on the
junction temperature exceeds 160°C . noise level from the input supply and the input current to
the converter.
Inductor Selection
For lower output voltage ripple, a low ESR ceramic
The value of the inductance L can be approximated by the
capacitor is recommended. The output voltage ripple
following equation, where the transition is from
consists of two components: one is the pulsating output
discontinuous conduction mode (DCM) to continuous
ripple current flowing through the ESR, and the other is
conduction mode (CCM) :
D  (1  D)2  VOUT VRIPPLE  VRIPPLE_ESR  VRIPPLE_C
L
2  fOSC  IOUT I V  VIN1 
 IPEAK  RESR  PEAK  AVDD 
The duty cycle can be calculated according to the following COUT1  VAVDD  f  
equation :
V  VIN
D  OUT
VOUT

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10
RT8510
Thermal Considerations Layout Considerations
The junction temperature should never exceed the PCB layout is very important for designing switching power
absolute maximum junction temperature TJ(MAX), listed converter circuits. The following layout guides should be
under Absolute Maximum Ratings, to avoid permanent strictly followed for best performance of the RT8510.
damage to the device. The maximum allowable power  The power components, L1, D1, CIN, COUT must be
dissipation depends on the thermal resistance of the IC placed as close as possible to reduce current loop. The
package, the PCB layout, the rate of surrounding airflow, PCB trace between power components must be as short
and the difference between the junction and ambient and wide as possible.
temperatures. The maximum power dissipation can be
 Place L1 and D1as close as possible to LX pin . The
calculated using the following formula :
trace should be as short and wide as possible.
PD(MAX) = (TJ(MAX) − TA) / θJA
 The compensation circuit should be kept away from
where TJ(MAX) is the maximum junction temperature, TA is the power loops and should be shielded with a ground
the ambient temperature, and θJA is the junction-to-ambient trace to prevent any noise coupling. Place the
thermal resistance. compensation components as close as possible to
For continuous operation, the maximum operating junction COMP pin.
temperature indicated under Recommended Operating  The exposed pad of the chip should be connected to
Conditions is 125°C. The junction-to-ambient thermal ground plane for thermal consideration.
resistance, θJA, is highly package dependent. For a
WQFN-16L 3x3, the thermal resistance, θJA, is 68°°C/W The compensation circuit
should be kept away from the
on a standard JEDEC 51-7 high effective-thermal- power loops and should be Place the power components

CH4
CH3
CH2
CH1
shielded with a ground trace as close as possible. The
to prevent any noise coupling.
conductivity four-layer test board. The maximum power traces should be wide and
short especially for the high-
16 15 14 13
current loop.
dissipation at TA = 25°C can be calculated as below : GND C3 AGND 1 12 OVP
R3
COMP 2 11 PGND
PD(MAX) = (125°C − 25°C) / (68°C/W) = 1.471W for a ISET 3
GND
10 PGND
WQFN-16L 3x3 package. C4 RT 4 17 9 LX D1 VOUT
5 6 7 8

The maximum power dissipation depends on the operating


EN
VIN
LX
PWM

L1 COUT
R2 CIN
ambient temperature for the fixed TJ(MAX) and the thermal
C2
resistance, θJA. The derating curves in Figure 1 allows
+

the designer to see the effect of rising ambient temperature GND GND
VIN

on the maximum power dissipation. Figure 9. PCB Layout Guide


1.60
Four-Layer PCB
Maximum Power Dissipation (W)

1.40

1.20

1.00

0.80

0.60

0.40

0.20

0.00
0 25 50 75 100 125
Ambient Temperature (°C)
Figure 8. Derating Curve of Maximum Power Dissipation

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11
RT8510
Outline Dimension

SEE DETAIL A
D D2

L
1

E E2

1 1

2 2
e b

A DETAIL A
A3 Pin #1 ID and Tie Bar Mark Options
A1
Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 0.800 0.028 0.031
A1 0.000 0.050 0.000 0.002
A3 0.175 0.250 0.007 0.010
b 0.180 0.300 0.007 0.012
D 2.950 3.050 0.116 0.120
D2 1.300 1.750 0.051 0.069
E 2.950 3.050 0.116 0.120
E2 1.300 1.750 0.051 0.069
e 0.500 0.020
L 0.350 0.450 0.014 0.018

W-Type 16L QFN 3x3 Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
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