2A, 23V, 340Khz Synchronous Step-Down Converter: General Description Features

®
RT8284N
2A, 23V, 340kHz Synchronous Step-Down Converter

General Description Features
The RT8284N is a high efficiency, monolithic synchronous ±1.5% High Accuracy Feedback Voltage
step down DC/DC converter that can deliver up to 2A output Input Voltage Range : 4.5V to 23V
current from a 4.5V to 23V input supply. The RT8284N's 2A Output Current
current mode architecture and external compensation Integrated N-MOSFETs
allow the transient response to be optimized over a wide Current Mode Control
range of loads and output capacitors. Cycle-by-cycle 340kHz Fixed Frequency Operation
current limit provides protection against shorted outputs Output Adjustable Voltage Range : 0.923V to 20V
and soft-start eliminates input current surge during start Efficiency Up to 95%
up. The RT8284N also provides under voltage protection Programmable Soft-Start
and thermal shutdown protection. The low current (< 3μA) Stable with Low ESR Ceramic Output Capacitors
shutdown mode provides output disconnection, enabling Cycle-by-Cycle Over Current Protection
easy power management in battery-powered systems. The Input Under Voltage Lockout
RT8284N is a available in a SOP-8 and SOP-8 Output Under Voltage Protection
(Exposed Pad) package. Thermal Shutdown Protection
RoHS Compliant and Halogen Free
Ordering Information
RT8284N Applications
Package Type Wireless AP/Router
S : SOP-8 Set-Top-Box
SP: SOP-8 (Exposed Pad-Option 1) http://www.DataSheet4U.net/
Industrial and Commercial Low Power Systems

Lead Plating System
LCD Monitors and TVs
G : Green (Halogen Free and Pb Free)
Note : Green Electronics/Appliances
Richtek products are : Point of Load Regulation of High-Performance DSPs
` RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020. Pin Configurations
` Suitable for use in SnPb or Pb-free soldering processes. (TOP VIEW)
BOOT 8 SS
Marking Information VIN 2 7 EN
RT8284NGS SW 3 6 COMP
RT8284NGS : Product Number GND 4 5 FB
RT8284N YMDNN : Date Code
GSYMDNN SOP-8
BOOT 8 SS
RT8284NGSP VIN 2 7 EN
GND
SW 3 6 COMP
RT8284NGSP : Product Number 9
GND 4 5 FB
RT8284N YMDNN : Date Code
GSPYMDNN
SOP-8 (Exposed Pad)
Copyright © 2012 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.
DS8284N-03 May 2012 www.richtek.com

1
datasheet pdf - http://www.DataSheet4U.net/

RT8284N
Typical Application Circuit
VIN 2 1
VIN BOOT
4.5V to 23V CIN CBOOT L
10µF RT8284N 10nF 10µH
VOUT
SW 3
3.3V/2A
REN 100k 7 EN R1
26.1k
8 SS COUT
FB 5 22µF x 2
CSS CC RC
3.3nF R2
0.1µF 4, 9 (Exposed Pad) 6 13k 10k
GND COMP
CP
Open
Recommended Component Selection

VOUT (V) R1 (kΩ) R2 (kΩ) RC (kΩ) CC (nF) L (μH) COUT (μF)
8 76.8 10 27 3.3 22 22 x 2
5 45.3 10 20 3.3 15 22 x 2
3.3 26.1 10 13 3.3 10 22 x 2
2.5 16.9 10 9.1 3.3 6.8 22 x 2
1.8 9.53 10 5.6 3.3 4.7 22 x 2
1.2 3 10 3.6 3.3 3.6 22 x 2
Functional Pin Description

Pin No.
SOP-8 Pin Name http://www.DataSheet4U.net/
Pin Function
SOP-8
(Exposed Pad)
Bootstrap for High Side Gate Driver. Connect a 10nF or greater
1 1 BOOT
ceramic capacitor from BOOT to SW pins.
Input Supply Voltage, 4.5V to 23V. Must bypass with a suitably large
2 2 VIN
ceramic capacitor.
3 3 SW Phase Node. Connect this pin to external L-C filter.
4, Ground. The exposed pad must be soldered to a large PCB and
4 GND
9 (Exposed Pad) connected to GND for maximum power dissipation.
Feedback Input Pin. This pin is connected to the converter output. It
is used to set the output of the converter to regulate to the desired
5 5 FB
value via an internal resistive voltage divider. For an adjustable
output, an external resistive voltage divider is connected to this pin.
Compensation Node. COMP is used to compensate the regulation
6 6 COMP control loop. Connect a series RC network from COMP to GND. In
some cases, an additional capacitor from COMP to GND is required.
Enable Input pin. A logic high enables the converter; a logic low
forces the RT8284N into shutdown mode reducing the supply current
7 7 EN
to less than 3μA. Attach this pin to VIN with a 100kΩ pull up resistor
for automatic startup.
Soft-Start Control Input. SS controls the soft-start period. Connect a
8 8 SS capacitor from SS to GND to set the soft-start period. A 0.1μF
capacitor sets the soft-start period to 15.5ms .
www.richtek.com DS8284N-03 May 2012

2

RT8284N
Function Block Diagram
VIN
Internal
Regulator Oscillator
Current Sense
Shutdown Slope Comp Amplifier
VA VCC +
Comparator Foldback VA
1.2V + Control -
-
0.5V + BOOT
Lockout -
S Q 130m Ω
Comparator UV
5k Comparator SW
EN - +
R Q 130m Ω
2.7V + -
3V Current GND
VCC Comparator
6µA
SS +
0.923V +
-
Error Amp
FB COMP
http://www.DataSheet4U.net/

3

RT8284N
Absolute Maximum Ratings (Note 1)
Supply Voltage, VIN ----------------------------------------------------------------------------------------------- −0.3V to 25V
Input Voltage, SW -------------------------------------------------------------------------------------------------- −0.3V to (VIN + 0.3V)
<20ns ----------------------------------------------------------------------------------------------------------------- −3V to (VIN + 3V)
VBOOT − VSW --------------------------------------------------------------------------------------------------------- −0.3V to 6V
Other Pins Voltages ----------------------------------------------------------------------------------------------- −0.3V to 6V
Power Dissipation, PD @ TA = 25°C
SOP-8 ----------------------------------------------------------------------------------------------------------------- 1.111W
SOP-8 (Exposed Pad) -------------------------------------------------------------------------------------------- 1.333W
Package Thermal Resistance (Note 2)
SOP-8, θJA ----------------------------------------------------------------------------------------------------------- 90°C/W
SOP-8 (Exposed Pad), θJA --------------------------------------------------------------------------------------- 75°C
SOP-8 (Exposed Pad), θJC -------------------------------------------------------------------------------------- 15°C
Junction Temperature ---------------------------------------------------------------------------------------------- 150°C
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------ 260°C
Storage Temperature Range ------------------------------------------------------------------------------------- −65°C to 150°C
ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------------------- 2kV
Recommended Operating Conditions (Note 4)

Supply Voltage, VIN ----------------------------------------------------------------------------------------------- 4.5V to 23V
Junction Temperature Range ------------------------------------------------------------------------------------- −40°C to 125°C
Ambient Temperature Range ------------------------------------------------------------------------------------- −40°C to 85°C
Electrical Characteristics
(VIN = 12V, TA = 25°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Shutdown Supply Current VEN = 0V -- 0.5 3 μA
Supply Current ICC VEN = 3 V, VFB = 1V -- 0.8 1.2 mA
Feedback Voltage VFB 4.5V ≤ VIN ≤ 23V 0.909 0.923 0.937 V
Error Amplifier Transconductance GEA ΔIC = ±10μA -- 940 -- μA/V
High Side Switch-On Resistance RDS(ON)1 -- 130 -- mΩ
Low Side Switch-On Resistance RDS(ON)2 -- 130 -- mΩ
High Side Switch Leakage Current VEN = 0V, VSW = 0V -- 0 10 μA
Upper Switch Current Limit Min.Duty Cycle, VBOOT−SW = 4.8V -- 4.3 -- A
Low Switch Current Limit From Drain to Source -- 1.3 -- A
COMP to Current Sense
GCS -- 4 -- A/V
Transconductance
Oscillator Frequency fOSC1 300 340 380 kHz
Short Circuit Oscillation
fOSC2 VFB = 0V -- 100 -- kHz
Frequency

4

RT8284N
Parameter Symbol Test Conditions Min Typ Max Unit
Maximum Duty Cycle DMAX VFB = 0.7V -- 93 -- %
Minimum On-Time tON -- 100 -- ns
EN Input Threshold Logic-High VIH 2.7 -- 5.5
V
Voltage Logic-Low VIL -- -- 0.4
Input Under Voltage Lockout Threshold VUVLO VIN Rising 3.8 4.2 4.5 V
Input Under Voltage Lockout Hysteresis ΔVUVLO -- 320 -- mV
Soft-Start Current ISS VSS = 0V -- 6 -- μA
Soft-Start Period tSS CSS = 0.1μF -- 15.5 -- ms
Thermal Shutdown (Note 5) TSD -- 150 -- °C
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions..
Note 5. Guaranteed by design.

5

RT8284N
Typical Operating Characteristics
Efficiency vs. Output Current Reference Voltage vs. Input Voltage
100 0.940
90 0.935
Reference Voltage (V)

80 VIN = 4.5V
0.930
70 VIN = 12V
VIN = 23V
Efficiency (%)
60 0.925
50 0.920
40 0.915
30
0.910
20
10 0.905
VOUT = 3.3V
0 0.900
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 4 6 8 10 12 14 16 18 20 22 24
Output Current (A) Input Voltage (V)
Reference Voltage vs. Temperature Output Voltage vs. Output Current

0.940 3.36
3.35
0.935
3.34
Reference Voltage (V)
0.930 3.33
Output Voltage (V)
3.32
0.925
3.31
0.920 3.30
3.29 VIN = 4.5V
0.915 http://www.DataSheet4U.net/
VIN = 12V
3.28
VIN = 23V
0.910 3.27
3.26
0.905
3.25
VOUT = 3.3V
0.900 3.24
-50 -25 0 25 50 75 100 125 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Temperature (°C) Output Current (A)
Frequency vs. Input Voltage Frequency vs. Temperature

380 380
370 370
360 360
Frequency (kHz)1
Frequency (kHz)1
350 350
340 340
330 330
320 320
310 310
VOUT = 3.3V, IOUT = 0A VOUT = 3.3V, VIN = 12V, IOUT = 0A
300 300
4 6 8 10 12 14 16 18 20 22 24 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)

6

RT8284N
Current Limit vs. Temperature Load Transient Response

6.0
5.5
VOUT
(100mV/Div)
Current Limit (A)
5.0
4.5
4.0
IOUT
(1A/Div)
3.5
VIN = 12V, VOUT = 3.3V VIN = 12V, VOUT = 3.3V, IOUT = 0A to 2A
3.0
-50 -25 0 25 50 75 100 125 Time (100μs/Div)
Temprature (°C)
Load Transient Response Switching
VOUT
(10mV/Div)
VOUT
(100mV/Div)
IL
(1A/Div)
VSW
(10V/Div)
IOUT
(1A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 1A to 2A VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (100μs/Div) Time (1μs/Div)
Power On from VIN Power Off from VIN
VIN VIN
(5V/Div) (5V/Div)
VOUT VOUT
(2V/Div) (2V/Div)
IL IL
(1A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 2A (1A/Div) VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (10ms/Div) Time (10ms/Div)

7

RT8284N
Power On from EN Power Off from EN
VEN VEN
(2V/Div) (2V/Div)
VOUT VOUT
(2V/Div) (2V/Div)
IOUT
IOUT
(2A/Div)
(2A/Div)
VIN = 12V, VOUT = 3.3V, IOUT = 2A VIN = 12V, VOUT = 3.3V, IOUT = 2A
Time (10ms/Div) Time (10ms/Div)

8

RT8284N
Application Information
The RT8284N is a synchronous high voltage buck converter Soft-Start
that can support the input voltage range from 4.5V to 23V The RT8284N contains an external soft-start clamp that
and the output current can be up to 2A. gradually raises the output voltage. The soft-start timing
can be programmed by the external capacitor between
Output Voltage Setting
SS pin and GND. The chip provides a 6μA charge current
The resistive voltage divider allows the FB pin to sense for the external capacitor. If 0.1μF capacitor is used to
the output voltage as shown in Figure 1. set the soft-start, the period will be 15.5ms (typ.).
VOUT
Chip Enable Operation
R1 The EN pin is the chip enable input. Pulling the EN pin
FB low (<0.4V) will shut down the device. During shutdown
RT8284N R2 mode, the RT8284N quiescent current drops to lower than
GND
3μA. Driving the EN pin high ( > 2.7V, < 5.5V) will turn on
the device again. For external timing control (e.g.RC),
Figure 1. Output Voltage Setting
the EN pin can also be externally pulled high by adding a
The output voltage is set by an external resistive voltage R EN* resistor and C EN* capacitor from the VIN pin
divider according to the following equation : (see Figure 5).
VOUT = VFB ⎛⎜ 1+ R1 ⎞⎟ An external MOSFET can be added to implement digital
⎝ R2 ⎠
where VFB is the feedback reference voltage 0.923V (typ.). control on the EN pin when no system voltage above 2.5V
is available, as shown in Figure 3. In this case, a 100kΩ
External Bootstrap Diode pull-up resistor, REN, is connected between VIN and the
Connect a 10nF low ESR ceramic capacitor between the EN pin. MOSFET Q1 will be under logic control to pull
BOOT pin and SW pin. This capacitor provides the gate down the EN pin.
driver voltage for the high side MOSFET.
2 1
VIN VIN BOOT
CBOOT VOUT
It is recommended to add an external bootstrap diode REN
CIN RT8284N
100k L
between an external 5V and BOOT pin for efficiency 7 EN SW 3
Chip Enable
R1 COUT
improvement when input voltage is lower than 5.5V or duty Q1
ratio is higher than 65% .The bootstrap diode can be a 8 SS FB 5

CSS 4, CC RC R2
low cost one such as IN4148 or BAT54. The external 5V 9 (Exposed Pad) COMP
6
GND CP
can be a 5V fixed input from system or a 5V output of the
RT8284N. Note that the external boot voltage must be
lower than 5.5V Figure 3. Enable Control Circuit for Logic Control with
Low Voltage
5V
To prevent enabling circuit when VIN is smaller than the
VOUT target value, a resistive voltage divider can be placed
BOOT between the input voltage and ground and connected to
RT8284N 10nF the EN pin to adjust IC lockout threshold, as shown in
SW Figure 4. For example, if an 8V output voltage is regulated
from a 12V input voltage, the resistor, REN2, can be
Figure 2. External Bootstrap Diode selected to set input lockout threshold larger than 8V.

9

RT8284N
VIN 2 1 Table 2. Suggested Inductors for Typical
VIN BOOT VOUT
12V CIN
8V
REN1 10µF RT8284N CBOOT Application Circuit
100k L
7 EN SW 3 Component Dimensions
Series
REN2 R1 COUT Supplier (mm)
TDK VLF10045 10 x 9.7 x 4.5
8 SS FB 5
CSS 4, CC RC R2 TDK SLF12565 12.5 x 12.5 x 6.5
6
9 (Exposed Pad) COMP TAIYO
GND CP NR8040 8x8x4
YUDEN
Figure 4. The Resistors can be Selected to Set IC

Lockout Threshold CIN and COUT Selection
The input capacitance, C IN, is needed to filter the
Hiccup Mode
trapezoidal current at the source of the high side MOSFET.
For the RT8284N, Hiccup Mode Under Voltage Protection To prevent large ripple current, a low ESR input capacitor
(UVP) is provided. When the FB voltage, VFB, drops below sized for the maximum RMS current should be used. The
0.5V, the UVP function will be triggered and the RT8284N RMS current is given by :
will shut down for a period of time and then recover V VIN
IRMS = IOUT(MAX) OUT −1
automatically. The Hiccup Mode UVP can reduce input VIN VOUT
current in short-circuit conditions. This formula has a maximum at VIN = 2VOUT, where
IRMS = IOUT / 2. This simple worst-case condition is
Inductor Selection
commonly used for design because even significant
The inductor value and operating frequency determine the deviations do not offer much relief.
ripple current according to a specific input and output
Choose a capacitor rated at a higher temperature than
voltage. The ripple current ΔIL increases with higher VIN
required. Several capacitors may also be paralleled to
and decreases with higher inductance. http://www.DataSheet4U.net/
meet size or height requirements in the design.

ΔIL = ⎡⎢ OUT ⎤⎥ × ⎡⎢1− OUT ⎤⎥
V V
⎣ f ×L ⎦ ⎣ VIN ⎦ For the input capacitor, one 10μF low ESR ceramic
Having a lower ripple current reduces not only the ESR capacitors are recommended. For the recommended
losses in the output capacitors but also the output voltage capacitor, please refer to table 3 for more detail.
ripple. High frequency with small ripple current can achieve The selection of COUT is determined by the required ESR
highest efficiency operation. However, it requires a large to minimize voltage ripple.
inductor to achieve this goal.
Moreover, the amount of bulk capacitance is also a key
For the ripple current selection, the value of ΔIL = 0.24(IMAX) for COUT selection to ensure that the control loop is stable.
will be a reasonable starting point. The largest ripple Loop stability can be checked by viewing the load transient
current occurs at the highest VIN. To guarantee that the response as described in a later section.
ripple current stays below the specified maximum, the
The output ripple, ΔVOUT , is determined by :
inductor value should be chosen according to the following
ΔVOUT ≤ ΔIL ⎡⎢ESR + 1 ⎤
equation : ⎣ 8fCOUT ⎥⎦
⎡ VOUT ⎤ ⎡ VOUT ⎤
L =⎢
f × Δ I ⎥ × ⎢1 − VIN(MAX) ⎥ The output ripple will be highest at the maximum input
⎣ L(MAX) ⎦ ⎣ ⎦
voltage since ΔIL increases with input voltage. Multiple
The inductor's current rating (caused a 40°C temperature
capacitors placed in parallel may be needed to meet the
rising from 25°C ambient) should be greater than the
ESR and RMS current handling requirement. Dry tantalum,
maximum load current and its saturation current should
special polymer, aluminum electrolytic and ceramic
be greater than the short circuit peak current limit. Please
capacitors are all available in surface mount packages.
see Table 2 for the inductor selection reference.

10

RT8284N
Special polymer capacitors offer very low ESR value. Checking Transient Response
However, it provides lower capacitance density than other The regulator loop response can be checked by looking
types. Although Tantalum capacitors have the highest at the load transient response. Switching regulators take
capacitance density, it is important to only use types that several cycles to respond to a step in load current. When
pass the surge test for use in switching power supplies. a load step occurs, VOUT immediately shifts by an amount
Aluminum electrolytic capacitors have significantly higher equal to ΔILOAD (ESR) and COUT also begins to be charge
ESR. However, it can be used in cost-sensitive applications or discharged to generate a feedback error signal for the
for ripple current rating and long term reliability regulator to return VOUT to its steady-state value. During
considerations. Ceramic capacitors have excellent low this recovery time, VOUT can be monitored for overshoot or
ESR characteristics but can have a high voltage coefficient ringing that would indicate a stability problem.
and audible piezoelectric effects. The high Q of ceramic
capacitors with trace inductance can also lead to significant EMI Consideration
ringing. Since parasitic inductance and capacitance effects in PCB
circuitry would cause a spike voltage on SW pin when
Higher values, lower cost ceramic capacitors are now
high-side MOSFET is turned-on/off, this spike voltage on
becoming available in smaller case sizes. Their high ripple
SW may impact on EMI performance in the system. In
current, high voltage rating and low ESR make them ideal
order to enhance EMI performance, there are two methods
for switching regulator applications. However, care must
to suppress the spike voltage. One way is by placing an
be taken when these capacitors are used at input and
R-C snubber between SW and GND and locating them as
output. When a ceramic capacitor is used at the input
close as possible to the SW pin (see Figure 5). Another
and the power is supplied by a wall adapter through long
method is by adding a resistor in series with the bootstrap
wires, a load step at the output can induce ringing at the
capacitor, CBOOT, but this method will decrease the driving
input, VIN. At best, this ringing can couple to the output
capability to the high side MOSFET. It is strongly
and be mistaken as loop instability. At worst, a sudden
recommended to reserve the R-C snubber during PCB
inrush of current through the long wires can potentially

layout for EMI improvement. Moreover, reducing the SW
cause a voltage spike at VIN large enough to damage the
trace area and keeping the main power in a small loop will
part.
be helpful on EMI performance. For detailed PCB layout
guide, please refer to the section Layout Considerations.
RBOOT*
VIN 2 1
VIN BOOT
4.5V to 23V CIN CBOOT
RT8284N L
REN* 10µF 10nF 10µH
VOUT
Chip Enable SW 3
7 EN 3.3V/2A
RS*
CEN* R1 COUT
CS* 26.1k 22µFx2
8 SS
FB 5
CSS 4, CC
0.1µF 9 (Exposed Pad) RC R2
3.3nF 13k
GND 6 10k
COMP
CP
* : Optional NC
Figure 5. Reference Circuit with Snubber and Enable Timing Control

11

RT8284N
Thermal Considerations (Exposed Pad) pad (Figure 6.a), θJA is 75°C/W. Adding
For continuous operation, do not exceed absolute copper area of pad under the SOP-8 (Exposed Pad) (Figure
maximum operation junction temperature 125°C. The 6.b) reduces the θJA to 64°C/W. Even further, increasing
maximum power dissipation depends on the thermal the copper area of pad to 70mm2 (Figure 6.e) reduces the
resistance of IC package, PCB layout, the rate of θJA to 49°C/W.
surroundings airflow and temperature difference between The maximum power dissipation depends on operating
junctions to ambient. The maximum power dissipation can ambient temperature for fixed T J(MAX) and thermal
be calculated by following formula : resistance θJA. The of de-rating curves in Figure 7 allow
PD(MAX) = (TJ(MAX) − TA) / θJA the designer to see the effect of rising ambient temperature
on the maximum power dissipation allowed.
where T J(MAX) is the maximum operation junction
2.2
temperature, TA is the ambient temperature and the θJA Four-Layer PCB
2.0
is the junction to ambient thermal resistance. 1.8 Copper Area
Power Dissipation (W)

70mm2
For recommended operating conditions specification, the 1.6 50mm2
maximum junction temperature is 125°C. The junction to 1.4 30mm2
10mm2
ambient thermal resistance θJA is layout dependent. For 1.2
Min.Layout
1.0 SOP-8
SOP-8 (Exposed Pad) package, the thermal resistance
0.8
θJA is 75°C/W on the standard JEDEC 51-7 four layers
0.6
thermal test board. For SOP-8 package, the thermal
0.4
resistance θJA is 90°C/W on the standard JEDEC 51-7 0.2
four layers thermal test board. The maximum power 0.0
dissipation at TA = 25°C can be calculated by following 0 25 50 75 100 125
formula : Ambient Temperature (°C)
P D(MAX) = (125°C − 25°C) / (75°C/W) = 1.33W

Figure 7. Derating Curve of Maximum Power Dissipation

(min. copper area PCB layout with SOP-8 Exposed Pad)
P D(MAX) = (125°C − 25°C) / (49°C/W) = 2.04W
(70mm2 copper area PCB layout with SOP-8 Exposed
Pad)
P D(MAX) = (125°C − 25°C) / (90°C/W) = 1.11W
(min. copper area PCB layout with SOP-8)
The thermal resistance θJA of SOP-8 (Exposed Pad) is
(a) Copper Area = (2.3 x 2.3) mm2, θJA = 75°C/W
determined by the package architecture design and the
PCB layout design. However, the package architecture
design had been designed. If possible, it's useful to increase
thermal performance by the PCB layout copper design.
The thermal resistance θJA can be decreased by adding
copper area under the exposed pad of SOP-8 (Exposed
Pad) package.
As shown in Figure 6, the amount of copper area to which
(b) Copper Area = 10mm2, θJA = 64°C/W
the SOP-8 (Exposed Pad) is mounted affects thermal
performance. When mounted to the standard SOP-8

12

RT8284N
Layout Considerations
For best performance of the RT8284N, the following layout
guidelines must be strictly followed.
` Input capacitor must be placed as close to the IC as
possible.
(c) Copper Area = 30mm2 , θJA = 54°C/W ` SW should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.
` The feedback components must be connected as close
to the device as possible
Input capacitor must be placed The feedback components

as close to the IC as possible. must be connected as close
to the device as possible.
GND VIN SW GND
CSS
(d) Copper Area = 50mm2 , θJA = 51°C/W CIN
CC
BOOT 8 SS REN VIN
VIN 2 7 EN CP RC
GND
SW 3 6 COMP
RS CS R1
9
GND 4 5 FB
COUT
R2
L1 VOUT
SW should be connected to inductor by
wide and short trace. Keep sensitive
VOUT components away from this trace. GND
Figure 8. PCB Layout Guide
(e) Copper Area = 70mm2 , θJA = 49°C/W

Figure 6. Themal Resistance vs. Copper Area Layout

Design
Table 3. Suggested Capacitors for CIN and COUT

Location Component Supplier Part No. Capacitance (μF) Case Size
CIN MURATA GRM31CR61E106K 10 1206
CIN TDK C3225X5R1E106K 10 1206
CIN TAIYO YUDEN TMK316BJ106ML 10 1206
COUT MURATA GRM31CR60J476M 47 1206
COUT TDK C3225X5R0J476M 47 1210
COUT MURATA GRM32ER71C226M 22 1210
COUT TDK C3225X5R1C22M 22 1210

13
datasheet pdf - http://www.DataS

RT8284N
Outline Dimension
H
A
J B
C
I
D
Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 3.988 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.508 0.013 0.020

F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.050 0.254 0.002 0.010
J 5.791 6.200 0.228 0.244
M 0.400 1.270 0.016 0.050
8-Lead SOP Plastic Package

14

RT8284N
H
A
EXPOSED THERMAL PAD Y

(Bottom of Package)
J X B
C
I
D
Dimensions In Millimeters Dimensions In Inches

Symbol
Min Max Min Max
A 4.801 5.004 0.189 0.197
B 3.810 4.000 0.150 0.157
C 1.346 1.753 0.053 0.069
D 0.330 0.510
0.013 0.020
F 1.194 1.346 0.047 0.053
H 0.170 0.254 0.007 0.010
I 0.000 0.152 0.000 0.006
J 5.791 6.200 0.228 0.244
M 0.406 1.270 0.016 0.050
X 2.000 2.300 0.079 0.091
Option 1
Y 2.000 2.300 0.079 0.091
X 2.100 2.500 0.083 0.098
Option 2
Y 3.000 3.500 0.118 0.138
8-Lead SOP (Exposed Pad) Plastic Package
Richtek Technology Corporation

5F, No. 20, Taiyuen Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789
Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.

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2A, 23V, 340Khz Synchronous Step-Down Converter: General Description Features

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2A, 23V, 340kHz Synchronous Step-Down Converter

Industrial and Commercial Low Power Systems

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Recommended Component Selection

Functional Pin Description

www.richtek.com DS8284N-03 May 2012

datasheet pdf - http://www.DataSheet4U.net/

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Recommended Operating Conditions (Note 4)

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datasheet pdf - http://www.DataSheet4U.net/

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Reference Voltage (V)

Reference Voltage vs. Temperature Output Voltage vs. Output Current

Frequency vs. Input Voltage Frequency vs. Temperature

www.richtek.com DS8284N-03 May 2012

datasheet pdf - http://www.DataSheet4U.net/

Current Limit vs. Temperature Load Transient Response

Load Transient Response Switching

Time (100μs/Div) Time (1μs/Div)

Power On from VIN Power Off from VIN

Time (10ms/Div) Time (10ms/Div)

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Power On from EN Power Off from EN

Time (10ms/Div) Time (10ms/Div)

www.richtek.com DS8284N-03 May 2012

datasheet pdf - http://www.DataSheet4U.net/

ratio is higher than 65% .The bootstrap diode can be a 8 SS FB 5

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Figure 4. The Resistors can be Selected to Set IC

meet size or height requirements in the design.

www.richtek.com DS8284N-03 May 2012

datasheet pdf - http://www.DataSheet4U.net/

inrush of current through the long wires can potentially

Figure 5. Reference Circuit with Snubber and Enable Timing Control

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataSheet4U.net/

Power Dissipation (W)

P D(MAX) = (125°C − 25°C) / (75°C/W) = 1.33W

Figure 7. Derating Curve of Maximum Power Dissipation

www.richtek.com DS8284N-03 May 2012

datasheet pdf - http://www.DataSheet4U.net/

Input capacitor must be placed The feedback components

Figure 8. PCB Layout Guide

(e) Copper Area = 70mm2 , θJA = 49°C/W

Figure 6. Themal Resistance vs. Copper Area Layout

Table 3. Suggested Capacitors for CIN and COUT

DS8284N-03 May 2012 www.richtek.com

datasheet pdf - http://www.DataS

Dimensions In Millimeters Dimensions In Inches

D 0.330 0.508 0.013 0.020

8-Lead SOP Plastic Package

www.richtek.com DS8284N-03 May 2012