Product Profile: Ultrafast Power Diode

BYV29-400
C
20A
-2
TO
Ultrafast power diode

Rev. 3 — 29 May 2012 Product data sheet
1. Product profile
1.1 General description

Ultrafast power diode in a SOD59 (2-lead TO-220AC) plastic package.
1.2 Features and benefits

 Fast switching  Low thermal resistance
 High thermal cycling performance  Soft recovery minimizes
 Low forward volt drop power-consuming oscillations
1.3 Applications
 Discontinuous Current Mode (DCM)  Output rectifiers in high-frequency
Power Factor Correction (PFC) switched-mode power supplies
1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VRRM repetitive peak reverse voltage - - 400 V
IF(AV) average forward current square-wave pulse; δ = 0.5 ; - - 9 A
Tmb ≤ 123 °C; see Figure 1;
see Figure 2
Static characteristics
VF forward voltage IF = 8 A; Tj = 150 °C; see Figure 4 - 0.9 1.03 V
Dynamic characteristics
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 100 A/s; - 50 60 ns
Tj = 25 °C; see Figure 7; see Figure 5
NXP Semiconductors BYV29-400
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode
mb K A
2 A anode 001aaa020
mb mb mounting base; cathode
1 2
SOD59 (TO-220AC)
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BYV29-400 TO-220AC plastic single-ended package; heatsink mounted; 1 mounting SOD59
hole; 2-lead TO-220AC
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse voltage - 400 V
VRWM crest working reverse voltage - 400 V
VR reverse voltage DC - 400 V
IF(AV) average forward current square-wave pulse; δ = 0.5 ; Tmb ≤ 123 °C; - 9 A
see Figure 1; see Figure 2
IFRM repetitive peak forward current square-wave pulse; δ = 0.5 ; tp = 25 µs; - 18 A
Tmb ≤ 123 °C
IFSM non-repetitive peak forward sine-wave pulse; tp = 10 ms; Tj(init) = 25 °C - 100 A
current sine-wave pulse; tp = 8.3 ms; Tj(init) = 25 °C - 110 A
Tstg storage temperature -40 150 °C
Tj junction temperature - 150 °C
BYV29-400 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 3 — 29 May 2012 2 of 11

003aaj587 003aaj588
16 12
δ=1
Ptot a = 1.57
(W) Ptot
(W) 1.9
12 0.5 2.2
8
2.8
0.2
4.0
8
0.1
4
4
0 0
0 4 8 12 16 0 2 4 6 8 10
IF(AV) (A) IF(AV) (A)
Fig 1. Forward power dissipation as a function of Fig 2. Forward power dissipation as a function of
average forward current; square waveform; average forward current; sinusoidal waveform;
maximum values maximum values

5. Thermal characteristics
Table 5. Thermal characteristics
Rth(j-mb) thermal resistance from junction to mounting base see Figure 3 - - 2.5 K/W
Rth(j-a) thermal resistance from junction to ambient free air in free air - 60 - K/W
001aag913
10
Zth(j-mb)
(K/W)
1
10−1 tp
P δ=
T
10−2
tp t
T
10−3
10−6 10−5 10−4 10−3 10−2 10−1 1 10
tp (s)
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width

6. Characteristics
Table 6. Characteristics
Static characteristics
VF forward voltage IF = 8 A; Tj = 150 °C; see Figure 4 - 0.9 1.03 V
IF = 8 A; Tj = 25 °C; see Figure 4 - 1.05 1.25 V
IF = 20 A; Tj = 25 °C; see Figure 4 - 1.2 1.4 V
IR reverse current VR = 400 V; Tj = 25 °C - 2 50 µA
VR = 400 V; Tj = 100 °C - 0.1 0.35 mA
Dynamic characteristics
Qr recovered charge IF = 2 A; VR = 30 V; dIF/dt = 20 A/s; - 40 60 nC
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 100 A/s; - 50 60 ns
IRM peak reverse recovery current IF = 10 A; VR = 30 V; dIF/dt = 50 A/s; - 4 5.5 A
VFRM forward recovery voltage IF = 10 A; dIF/dt = 10 A/s; Tj = 25 °C; - 2.5 - V
see Figure 9
003aaj589
30 dlF
IF
dt
IF
(A)
trr
20
time
(1) (2) (3) 25 %

10 100 %
Qr
IR IRM
003aac562
0
0 0.5 1 1.5 2
VF (V)
Fig 4. Forward current as a function of forward Fig 5. Reverse recovery definitions; ramp recovery
voltage

003aaj590 003aaj591
103 103
(4)
Qr trr
(nC) (ns) (3)
102 (2) 102

(2)
(1)
(1)
10 10
1 1
1 10 102 1 10 102
dIF/dt (A/μs) dIF/dt (A/μs)
Fig 6. Recovered charge as a function of rate of Fig 7. Reverse recovery time as a function of rate of
change of forward current; maximum values change of forward current; maximum values
003aaj592
10 IF
IRM (4)
(A) (3)
time
(2)
(1) VF
10-1
VFRM
VF
10-2
1 10 102 time
dIF/dt (A/μs) 001aab912
Fig 8. Peak reverse recovery current as a function of Fig 9. Forward recovery definitions
rate of change of forward current; maximum
values

7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59
E A
P A1
D1
b1
1 2
b c
0 5 10 mm
Dimensions scale
Unit A A1 b b1(1) c D D1 E e H L P Q q
max 4.7 1.40 0.95 1.7 0.65 15.8 6.8 10.30 16.25 15.0 3.7 2.6 2.9
5.08
mm nom
(REF)
min 4.3 1.15 0.70 1.3 0.45 15.6 6.4 9.65 15.70 12.5 3.5 2.2 2.7
Note
1. Protruded dambar are included in the dimension. sod059_po
Outline References European

Issue date
version IEC JEDEC JEITA projection
09-08-17
SOD59 2-lead TO-220AC
09-08-25
Fig 10. Package outline SOD59 (TO-220AC)

8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BYV29-400 v.3 20120529 Product data sheet - BYV29_SERIES v.2
Modifications: • Type number BYV29-400 separated from data sheet BYV29_SERIES v.2.
• Various changes to content.
BYV29_SERIES v.2 19980901 Product specification - BYV29_SERIES v.1

9. Legal information
9.1 Data sheet status

Document status[1] [2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
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changes to information published in this document, including without
Preview — The document is a preview version only. The document is still limitation specifications and product descriptions, at any time and without
subject to formal approval, which may result in modifications or additions. notice. This document supersedes and replaces all information supplied prior
NXP Semiconductors does not give any representations or warranties as to to the publication hereof.
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with the same product type number(s) and title. A short data sheet is intended Quick reference data — The Quick reference data is an extract of the
for quick reference only and should not be relied upon to contain detailed and product data given in the Limiting values and Characteristics sections of this
full information. For detailed and full information see the relevant full data document, and as such is not complete, exhaustive or legally binding.
sheet, which is available on request via the local NXP Semiconductors sales
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full data sheet shall prevail. products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
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data sheet shall define the specification of the product as agreed between
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Product data sheet. Semiconductors product is suitable and fit for the customer’s applications and
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applications and products.
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source outside of NXP Semiconductors. Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
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punitive, special or consequential damages (including - without limitation - lost
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replacement of any products or rework charges) whether or not such the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damages are based on tort (including negligence), warranty, breach of damage to the device. Limiting values are stress ratings only and (proper)
contract or any other legal theory. operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Notwithstanding any damages that customer might incur for any reason Characteristics sections of this document is not warranted. Constant or
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards repeated exposure to limiting values will permanently and irreversibly affect
customer for the products described herein shall be limited in accordance the quality and reliability of the device.
with theTerms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors product for such automotive applications, use and specifications, and (b)
products are sold subject to the general terms and conditions of commercial whenever customer uses the product for automotive applications beyond
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applying the customer’s general terms and conditions with regard to the standard warranty and NXP Semiconductors’ product specifications.
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construed as an offer to sell products that is open for acceptance or the grant, between the translated and English versions.
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in accordance with automotive testing or application requirements. NXP Ultralight,MoReUse,QLPAK,Silicon
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10. Contact information

For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com

11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .4
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .7
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . .8
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . . .9
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .9
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .10
10 Contact information. . . . . . . . . . . . . . . . . . . . . .10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 May 2012
Document identifier: BYV29-400

Product Profile: Ultrafast Power Diode

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BYV29-400

Ultrafast power diode

1.1 General description

1.2 Features and benefits

1.4 Quick reference data

Product data sheet Rev. 3 — 29 May 2012 2 of 11

Product data sheet Rev. 3 — 29 May 2012 3 of 11

Product data sheet Rev. 3 — 29 May 2012 4 of 11

(1) (2) (3) 25 %

Product data sheet Rev. 3 — 29 May 2012 5 of 11

102 (2) 102

Product data sheet Rev. 3 — 29 May 2012 6 of 11

Outline References European

Fig 10. Package outline SOD59 (TO-220AC)

Product data sheet Rev. 3 — 29 May 2012 7 of 11

Product data sheet Rev. 3 — 29 May 2012 8 of 11

9.1 Data sheet status

Product data sheet Rev. 3 — 29 May 2012 9 of 11

Non-automotive qualified products — Unless this data sheet expressly Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G

10. Contact information

For sales office addresses, please send an email to:salesaddresses@nxp.com

Product data sheet Rev. 3 — 29 May 2012 10 of 11

© NXP B.V. 2012. All rights reserved.

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