2SC4083

High-Frequency Amplifier Transistor (11V, 50mA, 3.2GHz) Datasheet

 Outline
SOT-323
Parameter Value
SC-70

VCEO 11V
IC 50mA
UMT3

 Features Inner circuit

1) High transition frequency.(Typ.fT=3.2GHz)

2)Small rbb'・Cc and high gain.(Typ.4ps)

3)Small NF

 Application
UHF/VHF FREQUENCY CONVERTER, LOCAL OSCILLATOR

 Packaging specifications

Basic
Package Taping Reel size Tape width
Part No. Package ordering Marking
size code (mm) (mm)
unit.(pcs)
SOT-323
2SC4083 2021 T106 180 8 3000 1D
(UMT3)

 Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.

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2SC4083 Datasheet

 Absolute maximum ratings (Ta = 25°C)

Parameter Symbol Values Unit
Collector-base voltage VCBO 20 V
Collector-emitter voltage VCEO 11 V
Emitter-base voltage VEBO 3 V
Collector current IC 50 mA
Power dissipation PD*1 200 mW
Junction temperature Tj 150 ℃
Range of storage temperature Tstg -55 to +150 ℃

 Electrical characteristics (Ta = 25°C)

Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
Collector-base breakdown BVCBO IC = 10μA 20 - - V
voltage
Collector-emitter breakdown BVCEO IC = 1mA 11 - - V
voltage
Emitter-base breakdown voltage BVEBO IE = 10μA 3 - - V
Collector cut-off current ICBO VCB = 10V - - 500 nA
Emitter cut-off current IEBO VEB = 2V - - 500 nA
Collector-emitter saturation voltage VCE(sat) IC = 10mA, IB = 5mA - - 500 mV
DC current gain hFE VCE = 10V, IC = 5mA 56 - 270 -
VCE = 10V, IE = -10mA,
Transition frequency fT 1.4 3.2 - GHz
f = 500MHz

Cob VCB = 10V, IE = 0A,

Output capacitance - 0.8 1.5 pF
f = 1MHz

VCB = 6V, IC = 2mA

Noise figure NF - 3.5 - dB
f = 500MHz, Rg = 50Ω

hFE values are calssified as follows :

rank N P Q - -
hFE 56-120 82-180 120-270 - -

*1 Each terminal mounted on a reference land.

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2SC4083 Datasheet

Electrical characteristic curves(Ta = 25°C)

Fig.1 Ground Emitter Propagation Fig.2 Typical Output Characteristics

Characteristics

Fig.3 DC Current Gain vs. Collector Fig.4 DC Current Gain vs. Collector
Current (I) Current (II)

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2SC4083 Datasheet

Electrical characteristic curves(Ta = 25°C)

Fig.5 Collector-Emitter Saturation Fig.6 Collector-Emitter Saturation

Voltage vs. Collector Current (I) Voltage vs. Collector Current (II)

Fig.7 Base-Emitter Saturation Voltage Fig.8 Gain Bandwidth Product vs.

vs. Collector Current Emitter Current

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© 2015 ROHM Co., Ltd. All rights reserved. 4/6 20150909 - Rev.002
2SC4083 Datasheet

Electrical characteristic curves(Ta = 25°C)

Fig.9 Capacitance vs. Reverse Bias Voltage Fig.10 Collector to base time constance
vs. collector current

Fig.11 Noise factor vs.collector current

characteristics

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© 2015 ROHM Co., Ltd. All rights reserved. 5/6 20150909 - Rev.002
2SC4083 Datasheet

 Dimensions

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© 2015 ROHM Co., Ltd. All rights reserved. 6/6 20150909 - Rev.002
 Datasheet

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CLASSⅢ CLASSⅡb
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residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.001
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 Datasheet

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This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

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 Datasheet

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