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R6046ANZ1

Nch 600V 46A Power MOSFET Datasheet

lOutline
VDSS 600V TO-247
RDS(on) (Max.) 0.09W
ID 46A
PD 120W (1) (2)
(3)

lFeatures lInner circuit


1) Low on-resistance.

e
2) Fast switching speed. (1) Gate
(2) Drain
3) Gate-source voltage (VGSS) guaranteed to be 30V. (3) Source

4) Drive circuits can be simple.

et
*1 BODY DIODE
5) Parallel use is easy.
6) Pb-free lead plating ; RoHS compliant lPackaging specifications
Packaging Tube
Reel size (mm) -
ol
lApplication Tape width (mm) -
Type
Switching Power Supply Basic ordering unit (pcs) 450
Taping code C9
Marking R6046ANZ1

lAbsolute maximum ratings(Ta = 25°C)


bs

Parameter Symbol Value Unit


Drain - Source voltage VDSS 600 V
Tc = 25°C ID *1 46 A
Continuous drain current
Tc = 100°C ID *1 22.3 A
*2
Pulsed drain current ID,pulse 115 A
O

Gate - Source voltage VGSS 30 V


Avalanche energy, single pulse EAS *3 142 mJ
Avalanche energy, repetitive EAR *4 5.4 mJ
Avalanche current IAR *3 23 A
Power dissipation (Tc = 25°C) PD 120 W
Junction temperature Tj 150 °C
Range of storage temperature Tstg -55 to +150 °C
Reverse diode dv/dt dv/dt *5 15 V/ns

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© 2013 ROHM Co., Ltd. All rights reserved. 1/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lAbsolute maximum ratings


Parameter Symbol Conditions Values Unit
VDS = 480V, ID = 46A
Drain - Source voltage slope dv/dt 50 V/ns
Tj = 125°C

lThermal resistance
Values
Parameter Symbol Unit
Min. Typ. Max.

e
Thermal resistance, junction - case RthJC - - 1.04 °C/W

Thermal resistance, junction - ambient RthJA - - 30 °C/W

et
Soldering temperature, wavesoldering for 10s Tsold - - 265 °C

lElectrical characteristics(Ta = 25°C)


Values
Parameter Symbol Conditions Unit
ol
Min. Typ. Max.

Drain - Source breakdown


V(BR)DSS VGS = 0V, ID = 1mA 600 - - V
voltage

Drain - Source avalanche


V(BR)DS VGS = 0V, ID = 23A - 700 - V
bs

breakdown voltage

VDS = 600V, VGS = 0V


Zero gate voltage
IDSS Tj = 25°C - 0.1 100 mA
drain current
Tj = 125°C - - 1000

Gate - Source leakage current IGSS VGS = 30V, VDS = 0V - - 100 nA

Gate threshold voltage VGS (th) VDS = 10V, ID = 1mA 2.5 - 4.5 V
O

VGS = 10V, ID = 23A


Static drain - source
RDS(on) *6 Tj = 25°C - 0.069 0.09 W
on - state resistance
Tj = 125°C - 0.145 -

Gate input resistance RG f = 1MHz, open drain - 2.2 - W

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© 2013 ROHM Co., Ltd. All rights reserved. 2/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristics(Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.

Transconductance gfs *6 VDS = 10V, ID = 23A 19 33 - S

Input capacitance Ciss VGS = 0V - 6000 -

Output capacitance Coss VDS = 25V - 3900 - pF

Reverse transfer capacitance Crss f = 1MHz - 83 -

e
Effective output capacitance,
Co(er) - 188 -
energy related
VGS = 0V
pF
VDS = 0V to 480V
Effective output capacitance,
Co(tr) - 640 -
time related

et
Turn - on delay time td(on) *6 VDD ⋍ 300V, VGS = 10V - 65 -

Rise time tr *6 ID = 23A - 120 -


ns
Turn - off delay time td(off) *6 RL = 13W - 260 520

Fall time tf *6 RG = 10W - 100 200


ol
lGate Charge characteristics(Ta = 25°C)
Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
bs

Total gate charge Qg *6 VDD ⋍ 300V - 150 -

Gate - Source charge Qgs *6 ID = 46A - 35 - nC

Gate - Drain charge Qgd *6 VGS = 10V - 56 -

Gate plateau voltage V(plateau) VDD ⋍ 300V, ID = 46A - 5.9 - V


O

*1 Limited only by maximum temperature allowed.


*2 PW  10ms, Duty cycle  1%

*3 L ⋍ 500mH, VDD = 50V, RG = 25W, starting Tj = 25°C

*4 L ⋍ 500mH, VDD = 50V, RG = 25W, starting Tj = 25°C, f = 10kHz

*5 Reference measurement circuits Fig.5-1.

*6 Pulsed

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© 2013 ROHM Co., Ltd. All rights reserved. 3/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lBody diode electrical characteristics (Source-Drain)(Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.

Inverse diode continuous,


IS *1 - - 46 A
forward current
Tc = 25°C
Inverse diode direct current,
ISM *2 - - 115 A
pulsed

Forward voltage VSD *6 VGS = 0V, IS = 46A - - 1.5 V

e
Reverse recovery time trr *6 - 692 - ns
IS = 46A
Reverse recovery charge Qrr *6 - 15 - mC
di/dt = 100A/ms
Irrm *6

et
Peak reverse recovery current - 45 - A

Peak rate of fall of reverse


dirr/dt Tj = 25°C - 940 - A/ms
recovery current
ol
lTypical Transient Thermal Characteristics
Symbol Value Unit Symbol Value Unit
Rth1 0.055 Cth1 0.0236
Rth2 0.164 K/W Cth2 0.134 Ws/K
bs

Rth3 0.821 Cth3 1.09


O

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© 2013 ROHM Co., Ltd. All rights reserved. 4/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area

120 1000
PW = 100ms
Power Dissipation : PD/PD max. [%]

100
100 PW = 1ms

Drain Current : ID [A]


80
10

e
60
1 Operation in this area
40 is limited by RDS(on)
(VGS = 10V) PW = 10ms

0.1

et
20
Ta=25ºC
Single Pulse
0 0.01
0 50 100 150 200 0.1 1 10 100 1000

Junction Temperature : Tj [°C] Drain - Source Voltage : VDS [V]


ol
Fig.3 Normalized Transient Thermal
Resistance vs. Pulse Width
Normalized Transient Thermal Resistance : r(t)

1000
Ta = 25ºC
100 Single Pulse
bs

Rth(ch-a)(t) = r(t)×Rth(ch-a)
Rth(ch-a) = 30ºC/W
10

0.1

top D = 1
0.01 D = 0.5
D = 0.1
O

0.001 D = 0.05
D = 0.01
D = Single
0.0001
0.0001 0.001 0.01 0.1 1 10 100 1000

Pulse Width : PW [s]

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© 2013 ROHM Co., Ltd. All rights reserved. 5/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.4 Avalanche Current vs Inductive Load Fig.5 Avalanche Power Losses

12 5000

4500 Ta=25ºC

Avalanche Power Losses : PAR [W]


10
4000
Avalanche Current : IAR [A]

3500
8
3000

e
6 2500

2000
4
1500
Ta = 25ºC 1000

et
2 VDD = 50V, RG = 25W
VGF = 10V, VGR = 0V 500
0 0
0.01 0.1 1 10 100 1.0E+04 1.0E+05 1.0E+06

Coil Inductance : L [mH] Frequency : f [Hz]


ol
Fig.6 Avalanche Energy Derating Curve
vs Junction Temperature
120
Avalanche Energy : EAS / EAS max. [%]

bs

100

80

60

40
O

20

0
0 25 50 75 100 125 150 175

Junction Temperature : Tj [ºC]

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© 2013 ROHM Co., Ltd. All rights reserved. 6/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.7 Typical Output Characteristics(I) Fig.8 Typical Output Characteristics(II)

45 30
VGS= 6.0V
Ta=25ºC VGS= 10.0V Ta=25ºC
40 VGS= 10.0V Pulsed
25 VGS= 8.0V Pulsed
VGS= 8.0V
35 VGS= 6.5V
VGS= 6.5V VGS= 6.0V

Drain Current : ID [A]


Drain Current : ID [A]

30 20

25

e
15
20 VGS= 5.0V

15 10
VGS= 5.0V

10

et
5
5 VGS= 4.5V
VGS= 4.5V
0 0
0 10 20 30 40 50 0 1 2 3 4 5

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]
ol
Fig.9 Tj = 150°C Typical Output Fig.10 Tj = 150°C Typical Output
Characteristics(I) Characteristics(II)
30
45 VGS= 10.0V
VGS= 10.0V VGS= 6.0V Ta=150ºC
VGS= 8.0V
40 VGS= 8.0V Pulsed
VGS= 7.0V
bs

Ta=150ºC 25
VGS= 7.0V VGS= 6.5V
35 VGS= 6.5V Pulsed VGS= 6.0V
Drain Current : ID [A]
Drain Current : ID [A]

20 VGS= 5.5V
30 VGS= 5.5V

25 VGS= 5.0V
15
20
VGS= 5.0V
15 10
VGS= 4.5V
10
O

VGS= 4.5V 5
5

0 0
0 10 20 30 40 50 0 1 2 3 4 5

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]

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© 2013 ROHM Co., Ltd. All rights reserved. 7/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.11 Breakdown Voltage Fig.12 Typical Transfer Characteristics


vs. Junction Temperature
Drain - Source Breakdown Voltage : V(BR)DSS [V]

900 100
VDS= 10V
850 Plused
10
800

Drain Current : ID [A]


750 1

e
700
0.1
650 Ta=125ºC
Ta=75ºC
600 Ta=25ºC
0.01

et
Ta= -25ºC
550

500 0.001
-50 -25 0 25 50 75 100 125 150 0 1 2 3 4 5 6 7 8

Junction Temperature : Tj [°C] Gate - Source Voltage : VGS [V]


ol
Fig.13 Gate Threshold Voltage Fig.14 Transconductance vs. Drain Current
vs. Junction Temperature
5 100
VDS= 10V VDS= 10V
Gate Threshold Voltage : VGS(th) [V]

ID= 1mA Plused


bs

4 Plused
Transconductance : gfs [S]

10

1
2 Ta= -25ºC
Ta=25ºC
Ta=75ºC
0.1 Ta=125ºC
1
O

0 0.01
-50 -25 0 25 50 75 100 125 150 0.01 0.1 1 10 100

Junction Temperature : Tj [°C] Drain Current : ID [A]

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© 2013 ROHM Co., Ltd. All rights reserved. 8/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.15 Static Drain - Source On - State Fig.16 Static Drain - Source On - State
Resistance vs. Gate Source Voltage Resistance vs. Junction Temperature
200 0.2
Static Drain - Source On-State Resistance

Static Drain - Source On-State Resistance


Ta=25ºC VGS= 10V
Pulsed Plused

150 0.15
: RDS(on) [mW]

ID = 46A

: RDS(on) [W]

e
100 0.1 ID = 46A
ID = 23A

ID = 23A
50 0.05

0
0 2 4 6

et8 10 12 14 16 18 20

Gate - Source Voltage : VGS [V]


0
-50 -25 0 25 50 75 100 125 150

Junction Temperature : Tj [ºC]


ol
Fig.17 Static Drain - Source On - State
Resistance vs. Drain Current
1
Static Drain - Source On-State Resistance

VGS= 10V
Plused
bs

Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= -25ºC
: RDS(on) [W]

0.1
O

0.01
0.1 1 10 100

Drain Current : ID [A]

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© 2013 ROHM Co., Ltd. All rights reserved. 9/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.18 Typical Capacitance Fig.19 Coss Stored Energy


vs. Drain - Source Voltage
100000 45

40 Ta=25ºC

Coss Stored Energy : EOSS [uJ]


10000 Ciss
35
Capacitance : C [pF]

30
1000
25

e
Coss
20
100
15

10 10

et
Ta=25ºC
f = 1MHz Crss
5
VGS = 0V
1 0
0.01 0.1 1 10 100 1000 0 200 400 600

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]
ol
Fig.20 Switching Characteristics Fig.21 Dynamic Input Characteristics

100000 10
VDD ≒ 300V
VGS = 10V
bs
Gate - Source Voltage : VGS [V]

10000 RG= 10W 8


Ta = 25ºC
Switching Time : t [ns]

Pulsed
td(off)
1000 tf 6

td(on)
100 4

Ta = 25ºC
10 tr 2 VDD= 300V
O

ID= 46A
Pulsed
1 0
0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 160 180 200

Drain Current : ID [A] Total Gate Charge : Qg [nC]

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© 2013 ROHM Co., Ltd. All rights reserved. 10/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lElectrical characteristic curves

Fig.22 Inverse Diode Forward Current Fig.23 Reverse Recovery Time


vs. Source - Drain Voltage vs.Inverse Diode Forward Current
100 10000
VGS=0V
Inverse Diode Forward Current : IS [A]

Pulsed

Reverse Recovery Time : trr [ns]


10 1000

e
1 100
Ta=125ºC
Ta=75ºC
Ta=25ºC
0.1 Ta= -25ºC 10 Ta=25ºC

et
VGS = 0V
di / dt = 100A / ms
Pulsed
0.01 1
0.0 0.5 1.0 1.5 0 1 10 100

Source - Drain Voltage : VSD [V] Inverse Diode Forward Current : IS [A]
ol
bs
O

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© 2013 ROHM Co., Ltd. All rights reserved. 11/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lMeasurement circuits
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms

Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform

e
et
Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform
ol
bs

Fig.4-1 dv/dt Measurement Circuit Fig.4-2 dv/dt Waveform


O

Fig.5-1 di/dt Measurement Circuit Fig.5-2 di/dt Waveform

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© 2013 ROHM Co., Ltd. All rights reserved. 12/13 2013.08 - Rev.A
R6046ANZ1 Data Sheet

lDimensions (Unit : mm)

TO-247

e
et
ol
bs

MILIMETERS INCHES
DIM
MIN MAX MIN MAX
A 4.83 5.21 0.190 0.205
A1 2.29 2.54 0.090 0.100
A2 1.91 2.16 0.075 0.085
b 1.14 1.40 0.045 0.055
b1 1.91 2.20 0.075 0.087
b2 2.92 3.20 0.115 0.126
c 0.61 0.80 0.024 0.031
O

D 20.80 21.34 0.819 0.840


D1 17.43 17.83 0.686 0.702
E 15.75 16.13 0.620 0.635
e 5.45 0.215
N 3.00 3.000
L 19.81 20.57 0.780 0.810
L1 3.81 4.32 0.150 0.170
ΦP 3.55 3.65 0.140 0.144
Q 5.59 6.20 0.220 0.244
S 6.15 0.240
Dimension in mm / inches

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© 2013 ROHM Co., Ltd. All rights reserved. 13/13 2013.08 - Rev.A
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.

Precaution for Mounting / Circuit board design


1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic


This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation


1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.

Precaution for Product Label


A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition


When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act


Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights


1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.

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