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Features
Max transient supply voltage VCC 41V
Operating voltage range VCC 4.5 V to 28 V
Typ on-state resistance (per ch.) RON 25 mΩ PowerSSO-36
Contents
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.2 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.3 Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3.1 Short to VCC and off-state open-load detection . . . . . . . . . . . . . . . . . . . 26
3.4 Maximum demagnetization energy (VCC = 13.5 V) . . . . . . . . . . . . . . . . . 28
5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
List of tables
List of figures
IN1 DRIVER
IN2 VON CH 1
Limitation
Over Current
temp. Limitation
CS_
DIS VSENSEH
CS1 Current
Sense CH 2
OUT2
CS2
Fault
OUT1
OVERLOAD PROTECTION
LOGIC (ACTIVE POWER LIMITATION)
GND
Voltage controlled input pins with hysteresis, CMOS compatible. They controls
IN1,2
output switch state
CS1,2 Analog current sense pins, they deliver a current proportional to the load current
CS_DIS Active high CMOS compatible pin, to disable the current sense pin
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2 Electrical specifications
Electrostatic discharge
(human body model: R = 1.5 KΩ; C = 100 pF)
– IN 4000
VESD – CS 2000 V
– CS_DIS 4000
– OUT 5000
– VCC 5000
VESD Charge device model (CDM-AEC-Q100-011) 750 V
Tj Junction operating temperature -40 to 150 °C
Tstg Storage temperature -55 to 150 °C
Rthj-case Thermal resistance junction-case (with one channel on) 1.4 °C/W
See Figure 35 in the
Rthj-amb Thermal resistance junction-ambient (MAX) °C/W
thermal section
VSENSE < 4 V;
Delay response time from
0.5 A < IOUT < 10 A;
tDSENSE2H rising edge of 70 300 µs
ISENSE = 90 % of ISENSE max
IN pin
(see Figure 4)
DC short-circuit VCC = 13 V 33 47 66 A
IlimH
current 5 V < VCC < 18 V 66
Short-circuit current
IlimL VCC = 13 V; TR < Tj < TTSD 12 A
during thermal cycling
Shutdown
TTSD 150 175 200 °C
temperature
TR Reset temperature TRS + 1 TRS + 5 °C
Thermal reset of
TRS 135 °C
status
Thermal hysteresis
THYST 7 °C
(TTSD - TR)
IOUT = 2 A; VIN = 0 V;
VCC - 39 VCC - 46 VCC - 52 V
Turn-off output voltage L = 6 mH; Tj = -40°C
VDEMAG
clamp I = 2 A; V = 0;
OUT IN VCC - 41 VCC - 46 VCC - 52 V
L = 6 mH; 25°C < Tj < 150°C
IOUT = 0.1 A;
Output voltage drop
VON Tj = -40°C to150°C 25 mV
limitation (see Figure 8)
1. To ensure long term reliability under heavy overload or short-circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
INPUT
CS_DIS
LOAD CURRENT
CURRENT SENSE
tDSENSE2H tDSENSE1L tDSENSE1H tDSENSE2L
VIN
VOUT > VOL
VSENSEH
VCS
tDSTKON
90%
80%
dVOUT/dt(on) dVOUT/dt(off)
tr 10% tf
t
INPUT
td(on) td(off)
Figure 7. Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
VIN
ΔtDSENSE2H
IOUT
IOUTMAX
90% IOUTMAX
ISENSE ISENSEMAX
90% ISENSEMAX
Vcc-Vout
Tj=150oC Tj=25oC
Tj=-40oC
Von
Iout
Von/Ron(T)
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Normal operation
H H Nominal
L L 0
Overtemperature
H L VSENSEH
L L 0
Undervoltage
H L 0
H X Nominal
(no power limitation)
Overload
H Cycling VSENSEH
(power limitation)
Short-circuit to GND L L 0
(Power limitation) H L VSENSEH
short-circuit to VCC
L H VSENSEH
(external pull up
H H < Nominal
disconnected)
Negative output voltage
L L 0
clamp
1. If the VCSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
and external circuit.
5000
1 -75 V -100 V 0.5 s 5s 2 ms, 10 Ω
pulses
5000
2a +37 V +50 V 0.2 s 5s 50 µs, 2 Ω
pulses
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
1 C C
2a C C
3a C C
3b C C
4 C C
(2)(3)
5b C C
1. The above test levels must be considered referred to VCC = 13.5 V except for pulse 5b
2. Valid in case of external load dump clamp: 40 V maximum referred to ground.
3. Suppressed load dump (pulse 5b) is withstood with a minimum load connected as specified in
Table 3: Absolute maximum ratings.
C All functions of the device are performed as designed after exposure to disturbance.
One or more functions of the device are not performed as designed after exposure to
E
disturbance and cannot be returned to proper operation without replacing the device.
2.4 Waveforms
Figure 11. Normal operation
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Figure 16. Off-state output current Figure 17. High-level input current
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Figure 22. On-state resistance vs Tcase Figure 23. On-state resistance vs VCC
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Figure 26. Turn-on voltage slope Figure 27. Turn-off voltage slope
Figure 28. CS_DIS clamp voltage Figure 29. Low-level CS_DIS voltage
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3 Application information
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Equation 1
Calculation example:
For VCCpeak = -1.5 V; Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
A logic level high on CS_DIS pin sets at the same time all the current sense pins of the
device in a high-impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.
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RPD must be selected in order to ensure VOUT < VOLmin unless pulled-up by the external
circuitry:
Equation 2
RPD ≤ 22 kΩ is recommended.
For proper open load detection in off-state, the external pull-up resistor must be selected
according to the following formula:
Equation 3
( R PD ⋅ V PU ) – ( R PU ⋅ R PD ⋅ I L(off2)r )
V OUT = ----------------------------------------------------------------------------------------------- > V OLmax = 4V
Pull-up_ON ( R PU + R PD )
For the values of VOLmin,VOLmax, IL(off2)r and IL(off2)f (see Table 8: Open-load detection
(8 V < VCC < 18 V)).
VIN, IL
1. Layout condition of Rth and Zth measurements (Board finish thickness 1.6 mm +/- 10%; Board double
layer; Board dimension 129 mm x 60 mm; Board Material FR4; Cu thickness 0.070 mm; Thermal vias
separation 1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; Footprint
dimension 4.1 mm x 6.5 mm).
Figure 35. Rthj-amb vs PCB copper area in open box free air condition (one channel
on)
Figure 36. PowerSSO-36 thermal impedance junction ambient single pulse (one
channel on)
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tP/T
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
R1 = R7 (°C/W) 0.3
R2 = R8 (°C/W) 0.9
R3 (°C/W) 5
R4 (°C/W) 8
R5 (°C/W) 18 10 10
R6 (°C/W) 27 23 14
C1 = C7 (W.s/°C) 0.001
C2 = C8 (W.s/°C) 0.005
C3 (W.s/°C) 0.04
C4 (W.s/°C) 0.5
C5 (W.s/°C) 1 2 2
C6 (W.s/°C) 3 6 9
5 Package information
5.1 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
millimeters
Symbol
Min Typ Max
A 2.15 - 2.45
A2 2.15 - 2.35
a1 0 - 0.1
b 0.18 - 0.36
c 0.23 - 0.32
D 10.10 - 10.50
E 7.4 - 7.6
e - 0.5 -
e3 - 8.5 -
F - 2.3 -
G - - 0.1
H 10.1 - 10.5
h - - 0.4
k 0° - 8°
L 0.55 - 0.85
M - 4.3 -
N - - 10°
O - 1.2
Q - 0.8 -
S - 2.9 -
T - 3.65 -
U - 1.0 -
X(1) 4.3 - 5.2
Y(1) 6.9 - 7.5
1. Corresponding to internal variation C.
Base q.ty 49
Bulk q.ty 1225
Tube length (± 0.5) 532
C A 3.5
B B 13.8
C (± 0.1) 0.6
All dimensions are in mm.
REEL DIMENSIONS
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 24
Tape hole spacing P0 (± 0.1) 4
Component spacing P 12
Hole diameter D (± 0.05) 1.55
Hole diameter D1 (min) 1.5
Hole position F (± 0.1) 11.5
Compartment depth K (max) 2.85
Hole spacing P1 (± 0.1) 2
Start
6 Device summary
7 Revision history
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