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W-5200-5 Low Noise Regulated Charge Pump DC-DC Converter: V V V V V V V V V V V V

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W-5200-5

Low Noise Regulated


Charge Pump DC-DC Converter
Description
The:ïareswitchedcapacitorboostconvertersthatdeliver
alownoise,regulatedoutputvoltage.
W-520ïgivesafixedregulated5Voutput.
 The constant frequency 2 MHz charge pump allows small 1ȝF
ceramic capacitorsto be used.
Maximum output loads of up to 100 mA can be supported over a 1
wide range of input supply voltages (2.7 V to 4.5 V) making the device
TSOTï23
ideal for batteryïpowered applications.
A shutdown control input allows the device to be placed in
powerïd own mode, reducing the supply current to less than ȝ$.
In the event of short circuit or overload conditions, the device is
PIN CONFIGURATIONS
fully protected by both foldback current limiting and thermal overload
detection. In addition, a soft start, slew rate control circuit limits inrush
current during powerïup. :ï
SOT23
The:ïisaïOHDG1mmmaxthinSOT23package. 1
OUT CPOS

Features GND IN
v Constant HighFrequency(2 MHz) Operation SHDN CNEG
v 100 mAOutput Current (Top Views)
v Regulated OutputVoltage (5 VFixed
v Low Quiescent Current (1.7 mA Typ.)
v InputVoltageOperation down to 2.7 V
v Soft Start, Slew Rate Control
v Thermal Overload Shutdown Protection
v LowValue External Capacitors (1ȝF)
v Foldback Current Overload Protection
v ShutdownCurrent less than 1ȝA ORDERING INFORMATION
v Low Profile (1 mm Thin)ïl eadTSO7ï2 3 Package Device Package Shipping
v These Devices are PbïFree, Halogen Free/BFR Freeand are RoHS :7',ï*73 TSOT23ï6 3,000 / Tape &
Compliant (Note 1) (PbïFree) Reel

1. NiPdAu Plated Finish (RoH6ïcompliant).

Applications
v 3 V to 5 V Boost Conversion
v White LED Driver
v USB OnïTheïGo 5 V Supply
v Local 5 V Supply from Lower Rail
v Battery Backup Systems
v Handheld Portable Devices

¢ NIDEC COPAL ELECTRONICS CORP. 1 Publication Order Number:


1RYHPEHU,201ï Rev. 1 W-5200/(
W-5200ï5

MARKING DIAGRAMS

VA = W-5200TDI-GT3
Y = Production Year (Last Digit)
VAYM M = Production Month (1-9, A, B, C or O, N, D)
R = Production Revision

Typical Application

1 F
CNEG CPOS 5V VOUT
VIN IN OUT
100 mA
:ï

+ ON OFF SHDN
3.3 V GND
ï 1 F 1 F

VOUT = 5 V
IOUT b 50 mA, for VIN r 2.8 V
IOUT b 90 mA, for VIN r 3 V

Figure 1. Typical Application ï 5 V Output

Table 1. PIN DESCRIPTIONS


Designation Description
OUT Regulatedoutputvoltage.
GND Ground reference for all voltages.
SHDN Shutdown control logic input (Active LOW)
CNEG Negative connection for the flying capacitor.
IN Input power supply.
CPOS Positive connection for the flying capacitor..

Table 2. ABSOLUTE MAXIMUM RATINGS


Parameters Ratings Units
VIN, VOUT, SHDN, CNEG, CPOS Voltage ï0.6 to +6.0 V
VOUT Short Circuit Duration Indefinite
Output Current 200 mA
ESD Protection (HBM) 2000 V
Junction Temperature 150 oC
Storage Temperature Range ï65 to +160 oC
Lead Soldering Temperature (10 sec) 300 oC
Power Dissipation (SOT23ï6) 0.3 W

StressesexceedingMaximumRatingsmaydamagethedevice.MaximumRatingsarestressratingsonly.Functionaloperationabovethe
RecommendedOperatingConditions is not implied. Extendedexposure to stresses above theRecommended OperatingConditions may affect
device reliability.

2
W-5200ï5

Table 3. RECOMMENDED OPERATING CONDITIONS


Parameters Ratings Units
VIN 2.7 to 4.5 V
CIN, COUT, CFLY 1 F
ILOAD 0 to 100 mA
Ambient Temperature Range ï40 to +85 oC

Table 4. ELECTRICAL SPECIFICATIONS


(Recommended operating conditions unless otherwise specified. CIN, COUT, CFLY are 1 F ceramic capacitors and VIN is set to 3.6 V.)
Symbol Parameter Conditions Min Typ Max Units
VOUT Regulated Output ILOAD b 40 mA, VIN r 2.7 V 4.8 5.0 5.2 V
ILOAD b 100 mA, VIN r 3.1 V

VLINE Line Regulation 3.1 V b VIN b 4.5 V, ILOAD = 50 mA 6 mV


VLOAD Load Regulation ILOAD = 10 mA to 100 mA, VIN = 3.6 V 20 mV
FOSC Switching Frequency 1.3 2.0 2.6 MHz
VR Output Ripple Voltage ILOAD = 100 mA 30 mVpïp
W-520ï5 Only

Efficiency ILOAD = 50mA, VIN = 3 V, W-520ï 80 %


IGND Ground Current ILOAD = 0 mA, SHDN = VIN 1.6 4 mA
ISHDN Shutdown Input Current ILOAD = 0 mA, SHDN = 0 V to VIN 1 A
ROL OpenïLoopResistance ILOAD = 100 mA, VIN = 3 V (Note 1) 10
TON VOUTTurnïon time (10% to 90%) ILOAD = 0 mA, VIN = 3 V 0.5 ms
VIHSHDN High Detect Shutdown Threshold 0.8 1.3 V
VILSHDN Low Detect Shutdown Threshold 0.4 V
IROUT Reverse Leakage into OUT pin VOUT = 5 V, Shutdown mode (Note 2) 15 30 A
ISC Shortïcircuit Output VOUT = 0 V 80 mA
TSD Thermal Shutdown 160 oC
THYST ThermalHysteresis 20 oC

1. ROL = (2VIN ï VOUT)/IOUT


2. In the event of a controlled shutdown, the output will be isolated from the input, but will remain connected to the internal resistor feedback
network. This will cause a small level of reverse current to flow back into the device to ground.

3
W-5200ï5

TYPICAL PERFORMANCE CHARACTERISTICS (W-5200ï5)


(TAMB = 25$C, CIN = COUT = CFLY = 1 F, VIN = 3.3 V unless specified otherwise.)

1.2 2.2

1.1
SHUTDOWN THRESHOLD (V)

GROUND CURRENT (mA)


2.0
1.0

0.9 1.8
0.8

0.7 1.6

0.6
1.4
0.5
0.4 1.2
2.7 3.0 3.3 3.6 3.9 4.2 4.5 2.7 3.0 3.3 3.6 3.9 4.2 4.5
INPUT VOLTAGE (V) INPUT VOLTAGE (V)

Figure . Shutdown Input Threshold vs. Figure . Ground Current vs. Supply Voltage
SupplyVoltage (NoLoad)
5.2 5.2
OUTPUT VOLTAGE (V)

OUTPUT VOLTAGE (V)

5.1 5.1

20 mA Load
5.0 5.0 VIN = 3.2 V
100 mA Load

4.9 4.9
VIN = 3.0 V

VIN = 2.7 V
4.8 4.8
2.7 3.0 3.3 3.6 3.9 4.2 4.5 0 50 100 150
INPUTVOLTAGE(V) LOADCURRENT(mA)
Figure.LineRegulation Figure.LoadRegulation

2.6 100
OSCILLATOR FREQUENCY (MHz)

90 VIN = 2.7 V
2.4
80 VIN = 3.2 V
EFFICIENCY (%)

2.2 70 VIN = 3.7 V

60
2.0
50 VIN = 4.5 V
1.8
40

1.6 30
2.7 3.0 3.3 3.6 3.9 4.2 4.5 1 10 100
INPUT VOLTAGE (V) LOADCURRENT(mA)

Figure . Oscillator Frequency vs. Supply Figure . Efficiency vs. Load Current
Voltage

4
W-5200ï5

TYPICAL PERFORMANCE CHARACTERISTICS (W-5200ï5)


(TAMB = 25$C, CIN = COUT = CFLY = 1 F, VIN = 3.3 V unless specified otherwise.)

Figure.SoftStartPowerUp Figure . Load Step Response (3.3 V Input)


(90 mA Load, 3.3 V Input)

250

200
CURRENT LIMIT (mA)

150

100

50

0
2.7 3.0 3.3 3.6 3.9 4.2 4.5
INPUT VOLTAGE (V)

Figure1. Output Ripple Figure 1. Short Circuit Current vs. Supply
(100 mA Load, 3.3 V Input) Voltage

2 4
OUTPUT VOLTAGE CHANGE (%)

FREQUENCY CHANGE (%)

1 2

10 mA Load
0 0

ï1 ï2

ï2 ï4
ï40 ï20 0 20 40 60 80 100 ï40 ï20 0 20 40 60 80 100
TEMPERATURE ($C) TEMPERATURE ($C)

Figure 1. Output Voltage Change vs. Figure 1. Oscillator Frequency Change vs.
Temperature Temperature

5
W-5200ï5

Block Diagram

CNEG CPOS

2 MHz 2VIN
IN Voltage
Doubler
SHDN
EN
+
ï
1.25 V 5V
OUT
300 k 100 mA
100 k
GND

)LJXUH :ï5 5 V Fixed Output

Pin Functions
IN is the power supply. During normal operation the device a low ESR ceramic bypass capacitor (1 F to 4.7 F) in close
draws a supply current which is almost constant. A very proximity to the OUT pin. The ESR of the output capacitor
brief interval of nonïconduction will occur at the switching will directly influence the output ripple voltage.
frequency. The duration of the nonïconduction interval is When the shutdown mode is entered, the output is
set by the internal nonïoverlapping “breakïbeforeïmake” immediately isolated from the input supply, however, the
timing. IN should be bypassed with a 1 F to 4.7 F low output will remain connected to the internal feedback
ESR (Equivalent Series Resistance) ceramic capacitor resistor network (400 k ). The feedback network will result
For filtering, a low ESR ceramic bypass capacitor (1 F) in a reverse current of 10 A to 20 A to flow back through
in close proximity to the IN pin prevents noise from being the device to ground.
injected back into the power supply. Whenever the device is taken out of shutdown mode, the
SHDN is the logic control input (Active LOW) that places output voltage will experience a slew rate controlled
the device into shutdown mode. The internal logic is CMOS powerïup. Full operating voltage is typically achieved in
and the pin does not use an internal pullïdown resistor. The less than 0.5 msec.
SHDN pin should not be allowed to float. GND is the ground reference for all voltages on :ï
CPOS, CNEG are the positive and negative connections devices.
respectively for the charge pump flying capacitor. A low
ESR ceramic capacitor (1 F) should be connected between
these pins. During initial powerïup it may be possible for the
capacitor to experience a voltage reversal and for this reason,
avoid using a polarized (tantalum or aluminum) flying
capacitor.
OUT is the regulated output voltage to power the load.
During normal operation, the device will deliver a train of
current pulses to the pin at a frequency of 2 MHz. Adequate
filtering on the pin can typically be achieved through the use

6
W-5200ï5

Device Operation
The:ïuseaswitchedcapacitorchargepump to The:ïwillcycleinandoutofthermal shutdown
boost the voltage at IN to a regulated output voltage. indefinitely without latchïu p or damage until a
Regulation is achieved by sensing the outputYRODWDJH shortïcircuit on OUT is removed.
throughaninternalresistordivider(:ï and
modulatingthechargepump outputcurrent based onthe
error signal. A 2ïphase nonïoverlapping clock activates the
charge pump switches. The flying capacitor is charged from
the IN voltage on the first phase of the clock. On the second
phase of the clock it is stacked in series with the input voltage
and connected to OUT. The charging and discharging the
flying capacitor continues at a free running frequency of
typically 2 MHz.
In shutdown mode all circuitry is turned off and the
:ï5  draw only leakage current from the VIN
supply.OUTisdisconnectedfromIN.TheSHDNpinis a
CMOS input with a threshold voltage of approximately
0.8V.The:ïisinshutdownwhenalogicLOWis
applied to the SHDN pin. The SHDN pin is a high
impedanceCMOSinput.SHDNdoesnothavean
internal pullïdown resistor and should not be allowed to
float and. It must always be driven with a valid logic level.

ShortïCircuit and Thermal Protection


The :ï have EXLOWïLQ shortïcircuit current
limitingandovertemperatureprotection.Duringoverload
conditions,outputcurrentislimitedtoapproximately225
mA.Athighertemperatures,or if the input voltage is high
enough to cause excessive chip self heating, the thermal
shutdown circuit shuts down the charge pump as the
junction temperature exceeds approximately 160oC. Once
the junction temperature drops back to approximately
140oC,thechargepumpisenabled.

7
W-5200ï5

Application Information Thermal Management


Forhigherinputvoltagesandmaximumoutputcurrent
Ceramic Capacitors therecanbesubstantialpowerdissipationinthe
Ceramic capacitors of different dielectric materials lose :ï. If the junction temperature increases to 160$C,
their capacitance with higher temperature and voltage at the thermal shutdown circuitry will automatically turn off
different rates. For example, a capacitor made of X5R or the output.
X7R material will retain most of its capacitance from – 40$C A good thermal connection to the PC board is
to 85$C whereas a Z5U or Y5V style capacitor will lose recommended to reduce the chip temperature. Connecting
considerable capacitance over that range. theGNDpin(Pin2 toagroundplane,andmaintaininga
Z5U and Y5V capacitors may also have voltage solid ground plane under the device reduces the overall
coefficient causing them to lose 60% or more of their thermal resistance.
capacitance when the rated voltage is applied. When The overall junction to ambient thermal resistance ( JA
comparing different capacitors it is often useful consider the for device power dissipation (PD FRQVLVWVSULPDULO\RIWZo
amount of achievable capacitance for a given case size rather paths in series. The first path is the junction to the case ( JC
than discussing the specified capacitance value. For which is defined by the package style, and the second path
example, over rated voltage and temperature conditions, a is case to ambient ( CA thermal resistance which is
1 F, 10 V, Y5V ceramic capacitor in an 0603 case may not dependent on board layout. The final operating junction
provide any more capacitance than a 0.22 F, 10 V, X7R temperature for any set of conditions can be estimated by the
available in the same 0603 case. For many W-5200/ following thermal equation:
:ï5 applications these capacitors can be considered
TJUNC = TAMB + PD ( JC 3D ( CA
roughly equivalent.
TJUNC = TAMB + PD ( JA
The capacitor manufacturer·s data sheet should be
consulted to determine what value of capacitor is needed to The SOT23 package, when mounted on printed circuit
ensure the desired capacitance at all temperatures and boardwithtwosquareinchesofcopperallocatedfor “heat
voltages. Below is a list of ceramic capacitor spreading”, will result with an overall eJ A of less than
150$C/W.
manufacturers and how to contact them:
For a typical application operating from a 3.8 V input
Table 5. CERAMIC CAPACITOR MANUFACTURERS supply, the maximum power dissipation is 260 mW
(100 mA x 3 9  This would result if a maximum junction
Capacitor
Manufacturer Web Phone temperature of:
Murata www.murata.com 814.237.1431 TJUNC = TAMB + PD ( JA
TJUNC = 85$C + 0.26 W (150$&:
AVX/Kemet www.avxcorp.com 843.448.9411
TJUNC = 85$C + 39$C = 124$C
Vishay www.vishay.com The use of multiïlayer board construction with power
Kemet www.kemet.com 408.986.0424 planes will further enhance the overall thermal performance.
In the event of no dedicated copper area being used for heat
Taiyo Yuden www.tïyuden.com 408.573.4150
spreading,amultiïl ayerboardwilltypicallyprovidethe
with an overall JA of 200$C/W. This level of thermal
conduction would allow up to 200 mW be safely
dissipated within the device.

8
W-5200ï5

Typical Applications
1 F 1 F

4 6 4 6
4 V ) VIN ) 5 V
5 IN OUT 1 5 1
IN OUT
3.3 V ( 10%

3 3
SHDN VOUT SHDN 1 F
1 F VOUT
1 F W-5200ï5 5 V ( 4% 1 F W-5200ï5 5 V ( 4%
100 mA
GND GND
2 2

Figure 1. 3.3 V Supply to 5 V Figure 1. USB Port to Regulated 5 V Power Supply

1 F

4 6
Cï C+
Drive up to 5 LEDs
5 1
IN OUT
+
3 V to 4.4 V 1 F 1 F 100 1 100 1 100 1 100 1 100 1
W-5200ï5
Liïion
Battery

3 2
ON OFF SHDN SGND

Apply PWM Waveform for VSHDN


Adjustable Brightness Control t

Figure . LithiumïI on Battery to 5 V White or Blue LED Driver

9
W-5200ï5

PACKAGE DIMENSIONS

TSOTï23, 6 LEAD
CASE 419AFï01
ISSUE O

SYMBOL MIN NOM MAX


D
A 1.00
e
A1 0.01 0.05 0.10
A2 0.80 0.87 0.90
b 0.30 0.45
c 0.12 0.15 0.20
D 2.90 BSC
E1 E E 2.80 BSC
E1 1.60 BSC
e 0.95 TYP
L 0.30 0.40 0.50
L1 0.60 REF
L2 0.25 BSC
e 0º 8º
TOP VIEW

A2 A

L
b A1 c L2
L1

SIDE VIEW END VIEW

Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-193.

10
W-5200ï5

Example of Ordering Information (Note 5)

Prefix Device # Suffix

W - 5200 TD I ïG T3

Company ID Temperature Range Lead Finish Tape & Reel


(Optional) I = Industrial (ï40oC to +85oC) G: NiPdAu T: Tape & Reel
3: 3,000 Units / Reel
Product Number
5200

Package
TD: TSOTï23
Z: MSOP

3. All packages are RoHSïcompliant (Leadïfree, Halogenïfree).


4. The standard lead finish is NiPdAu.
5. The device used in the above example is a W-5200TDI ïGT3 (TSOTï23, Industrial Temperature, NiPdAu, Tape & Reel, 3,000/Reel).

NIDEC COPAL reserves the right to make changes without further notice to any products herein.
NIDEC COPAL makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does NIDEC COPAL assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in NIDEC COPAL data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.
$OORSHUDWLQJSDUDPHWHUVLQFOXGLQJ´7\SLFDOVµPXVWEHYDOLGDWHGIRUHDFKFXVWRPHUDSSOLFDWLRQE\FXVWRPHU·VWHFKQLFDOH[SHUWV
NIDEC COPAL does not convey any license under its patent rights nor the rights of others.
NIDEC COPAL products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the NIDEC COPAL product could create a situation where personal injury or death may occur.
Should Buyer purchase or use NIDEC COPAL products for any such unintended or unauthorized application, Buyer shall indemnify and hold NIDEC COPAL and its officers,
employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that NIDEC COPAL was negligent regarding the design or
manufacture of the part.

W-5200/(

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