MDD 1051 RH
MDD 1051 RH
MDD 1051 RH
MDD1051
Single N-channel Trench MOSFET 150V, 28A, 46mΩ
Thermal Characteristics
Characteristics Symbol Rating Unit
(1)
Thermal Resistance, Junction-to-Ambient RθJA 50 o
C/W
Thermal Resistance, Junction-to-Case RθJC 1.8
Static Characteristics
Drain-Source Breakdown Voltage BVDSS ID = 250μA, VGS = 0V 150 - -
V
Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250μA 1.2 2.2 3.2
Drain Cut-Off Current IDSS VDS = 120V, VGS = 0V - - 1.0
μA
Gate Leakage Current IGSS VGS = ±20V, VDS = 0V - - ±0.1
Drain-Source ON Resistance RDS(ON) VGS = 10V, ID = 20A - 37.0 46.0 mΩ
Forward Transconductance gfs VDS = 10V, ID = 20A - 30 - S
Dynamic Characteristics
Total Gate Charge Qg - 19.6 -
VDS = 75V, ID = 20A,
Gate-Source Charge Qgs - 5.2 - nC
VGS = 10V
Gate-Drain Charge Qgd - 5.2 -
Input Capacitance Ciss - 1270 -
VDS = 40V, VGS = 0V,
Reverse Transfer Capacitance Crss - 40 - pF
f = 1.0MHz
Output Capacitance Coss - 405 -
Turn-On Delay Time td(on) - 15 -
Rise Time tr VGS = 10V, VDS = 75V, - 10 -
ns
Turn-Off Delay Time td(off) ID = 20A , RG = 3.0Ω - 20 -
Fall Time tf - 5 -
Gate Resistance Rg f=1 MHz - 1.8 - Ω
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = 20A, VGS = 0V - 0.9 1.3 V
Body Diode Reverse Recovery Time trr - 73 ns
IF = 20A, dl/dt = 100A/μs
Body Diode Reverse Recovery Charge Qrr - 245 nC
Note :
1. Surface mounted FR-4 board by JEDEC (jesd51-7). Continuous current at TC=25℃ is silicon limited
2. EAS is tested at starting Tj = 25℃, L = 1.0mH, IAS = 9.0A, VGS = 10V.
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MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product. is a registered trademark of MagnaChip
Semiconductor Ltd.