MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT Switchmode Power Rectifiers
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT Switchmode Power Rectifiers
MBRD620CT, MBRD630CT, MBRD640CT, MBRD650CT, MBRD660CT Switchmode Power Rectifiers
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Extremely Fast Switching Extremely Low Forward Drop Platinum Barrier with Avalanche Guardrings PbFree Packages are Available
Mechanical Characteristics:
Case: Epoxy, Molded Weight: 0.4 Gram (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds Leads are Readily Solderable
4 1 2
MARKING DIAGRAM
YWW B 6x0TG
Y WW B6x0T x G
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
A A A A C C V/ms
iR
1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient: dPD/dTJ < 1/RqJA. 2. Rating applies when surface mounted on the minimum pad size recommended. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
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2
*The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficient below rated VR.
125C 1.0 0.7 0.5 0.3 0.2 75C TC = 25C 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vF, INSTANTANEOUS VOLTAGE (VOLTS)
10 IPK/IAV = 20
SINE WAVE
dc
SQUARE WAVE
TJ = 150C
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
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3
dc
1K
C, CAPACITANCE (pF)
100
TJ = 25C
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4
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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5
E b3 L3
1 4
D
2 3
Z
DETAIL A
L4
b2 e
b 0.005 (0.13)
M
c C L2
GAUGE PLANE
H C L L1 DETAIL A
SEATING PLANE
A1
ROTATED 90 CW 5
SOLDERING FOOTPRINT*
6.20 0.244 3.00 0.118
2.58 0.102
5.80 0.228
1.60 0.063
6.17 0.243
SCALE 3:1
mm inches
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MBRD620CT/D