What Is F-RAM: Micron DDR3
What Is F-RAM: Micron DDR3
What Is F-RAM: Micron DDR3
Figure 2: Write speed comparison *At 25 MHz, F-RAM writes 488 times faster than comparable EEPROM device.
DDR3 SDRAM Part Catalog 1.35V DDR3 Part Catalog DDR3 SDRAM Technical Notes Balancing Power and Performance for Tablet and Thin-Client Computing Tablets and thin-clients are changing the landscape of computingand memory requirements, too. These powerful, highly mobile personal computing devices walk a fine line between memory-performance needs and battery-life limits, not to mention space constraints. Our new 1.35V DDR3Lm specifically targets the light-client market with an optimal combination of high performance, low power usage (with tight IDD6 specs and TCSR enablement), cost efficiency, and footprint size (x32 options)the best of LPDDRx and DDRx technologies, blended into one. Feeding Memory-Hungry Systems If your new hardware design is primed for higher performance, we've got you covered. Our DDR3 is ready for the memory demands of nextgeneration systems. The increased bandwidth is significant, with speeds up to 1600 Mb/s. At peak performance, the data transfer rate is equivalent to transferring a 100,000-page document in about one second.
RLDRAM 2 and 3 Memory Part Catalog RLDRAM Technical Notes RLDRAM 3Meet the New Generation of Our Best Low-Latency Memory Now in its third generation, our best low-latency memory solution gets even better, offering a further increase in density and speed, minimized latency, and reduced power consumption for higher-performing networking applications.
Ultra-high data rate and lower DRAM random access latency: <10ns tRC versus 4652ns for DDR3. Multibank WRITE: Enables random read accesses with 2.5ns or less tRC. Minimal bus turnaround delay: Read-write-read delay of one IDLE cycle versus 15 or more for DDR3. No tFAW, tRRD: No IDLE cycles between cyclic bank accesses versus tFAW of 27 or more cycles for DDR3. Minimum burst lengths: BL2, BL4, and BL8 allow flexible memory access and full data-bus utilization. Weve deliberately designed RLDRAM 3 to be easy to implement and help you better leverage your existing RLDRAM2 and DDR3 PHY. For further technical information or sample requests, please contact us. RLDRAM 2Already Designing in RLDRAM 2? Weve Got Upgrades for You, Too. The introduction of RLDRAM 3 doesnt mean current-generation RLDRAM 2 will be left behind. In fact, our RLDRAM 2 products are migrating to a more advanced 50nm process technology, reducing power consumption across the board and upgrading the current 288Mb device to 1066 Mb/s and 15ns tRC. Weve committed to supporting and improving RLDRAM 2 for many years to come.
576Mb RL2 shrink (SIO/CIO) Main operating currents reduced by 33% to >40% 288Mb RL2 shrink (CIO) Main operating currents reduced by 25% to >40% 288Mb RL2 shrink (SIO) Main operating currents reduced by 10% to >25%
Dramatic Power Savings Our Mobile LPDRAM is built to consume less power without sacrificing performance. It uses a JEDEC-standard 1.8V I/O power supply1.2V for LPDDR2which enables low standby current and low self refresh and extends battery life. To further cut power consumption, Mobile LPDRAM makes use of lower Idd voltages, and we have both temperature-compensated self refresh (TCSR) and partial-array self refresh (PASR) modes on-chip to ensure you dont use up battery power when you dont need to. Design In the Fastest Mobile LPDRAM Our Mobile LPDDR was the first to deliver maximum clock speeds of 200 MHzenabling blazing-fast transfer speeds of 400 Mb/sand now our LPDDR2-1066 part is pushing the benchmark even further, to 533 MHz. Plus, the LPDDR have a low-power 1.2V I/O, so you won't bog down performance or burn up precious battery time.
NAND Flash I/O Drivers NAND Flash ECC Software Please contact your Micron sales representative for more Micron NAND Flash software offerings.
Blunk Microsystems
Blunk Microsystems - Blunk Microsystems' TargetFFS is an embedded flash file system used around the world in cell phones, set-top boxes, routers, satellites, and other demanding applications. It has a UNIX-like API with extensions for embedded programming. Its leading-edge technology includes guaranteed power-fail recovery (even for MLC NAND), read wear leveling, and early block recycles triggered by corrected bit errors. Out-of-the-box support for Microns Serial NAND.
CMX
CMX-FFS software - CMX-FFS is a small, high-performance flash file system for embedded systems developers and includes 100-percent failsafe, multiple volumes, wear-leveling, directories, boot sector support, and an ECC algorithm. It is provided with full source code, no royalties, and 180 days of free technical support and software updates.
Datalight
FlashFX Pro Software Development Kit - FlashFX Pro is a high-performance, multi-threaded flash translation layer for products running any 32-bit operating system that require real-time response from resident Flash memory. Because of its multi-threaded design, FlashFX Pro is able to offer low read latency. FlashFX Pro supports the broadest range of market-leading operating systems right out of the box.
HCC-Embedded
HCC-Embedded's extensive portfolio of file systems and flash translation layers includes high-performance, failsafe FAT systems as well as several failsafe FFS products. HCC has a system for almost any environment, from very limited to very large, for any CPU, any RTOS and any flash arrangement. HCC-Embedded focuses on reliability, performance and product suitability. All HCC products are distributed in full source form on a royaltyfree basis.