bd93942f-e

Datasheet
LED Drivers for LCD Backlights
White LED Driver for large LCD

Panels (DCDC Converter type)
BD93942F
General Description Features
BD93942F is a high efficiency driver for white LEDs and  4ch LED constant current driver and DC/DC converter
designed for large LCDs. These ICs are built-in a boost  Maximum LED Current: 150mA
DCDC converters that employ an array of LEDs as the  LED Feedback Voltage: 0.45V (@ILED=150mA)
light source. BD93942F have some protect function so lower heat. Adjustable Feed Back Voltage
against fault conditions, such as the over-voltage by following LED Current setting.
protection (OVP), the over current limit protection of  2% LED current accuracy (ADIM=2.5V,
DCDC (OCP), the short circuit protection (SCP), the when each LED is set to 100mA)
open detection of LED string. Therefore BD93942F are  Analog current (Linear) dimming at ADIM pin
available for the fail-safe design over a wide range  LED pin rating 60V
output voltage.  Individual detection and individual LED OFF for both
open and short circuits
Key Specification  Built-in ISET pin short-circuit protection circuit
 Operating power supply voltage range: 9.0V to 35.0V  FET’s Gate (N pin) is driven by 5.8V swing
 LED minimum current 30mA  Built-in Vout discharge circuit for shutdown
 LED maximum current: 150mA  Built-in Vout overvoltage protection (OVP) /
 Oscillator frequency: 150kHz (RT=100kΩ) reduced voltage protection (SCP) circuit
 Operating Current: 3.7mA (Typ.)  SOP16 package
 Operating temperature range: -40°C to +85°C
Applications
TV, Computer Display, Notebook, LCD Backlighting
Package W(Typ.) x D(Typ.) x H(Max.)

SOP16 10.00mm x 6.20mm x 1.71mm
Typical Application Circuit Figure 1. SOP16
VIN
VIN Inductor Diode
CIN
COUT REG58
Connector
CREG
RN2
FET ON/OFF
REG58 STB
RVCC
RCS DN RN1 N VCC
CVCC
PGND GND
CS LED4
RRT CLED4
AGND RT LED3
ROVP1 CLED3
COVP
OVP
ROVP2
RFB CFB1
SSFB LED2
CLED2
RISET
ISET LED1
CLED1
ADIM ADIM PWM PWM
Figure 2. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
.www.rohm.com
© 2015 ROHM Co., Ltd. All rights reserved. TSZ02201-0F5F0C100050-1-2
1/26
TSZ22111・14・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Absolute maximum ratings (Ta=25°C)

Parameter Symbol Ratings Unit
Power supply voltage VCC 36 V
STB, ADIM, OVP, PWM terminal voltage STB, ADIM, OVP, PWM 36 V
LED1 to 4 terminal voltage LED1 to 4 60 V
REG58, CS, N,
REG58, CS, N, ISET, SSFB, RT terminal voltage 7 V
ISET, SSFB, RT
Power dissipation (SOP16) Pd 0.62 *1 W
Operating temperature range Topr -40 to +85 °C
Storage temperature range Tstg -55 to +150 °C
Junction temperature Tjmax 150 °C
*1 Ta = 25°C or more, diminished at -5mW/°C in the case of SOP16
(when 1-layer / 70.0 mm x 70.0 mm x 1.6 mm board is mounted)
Operating Ratings
Parameter Symbol Limits Unit
VCC supply voltage VCC 9.0 to 35.0 V
Min. output current of LED1 to 4 ILED_MIN 30 mA *1
mA
Max. output current of LED1 to 4 ILED_MAX 150
*1,2
0.2 to 2.7 (normal op.)
ADIM input voltage1 (use ADIM function) VADIM1 V *3
1.0 to 2.7 (start up)
ADIM input voltage1 (don’t use ADIM function) VADIM2 REG58 to 35.0 V
DC/DC oscillation frequency Fsw 100 to 800 kHz
Min. on-duty time for PWM light modulation PWM_MIN 30 μs
*1 The amount of current per channel.
*2 If LED makes significant variations in its reference voltage, the driver will increase power dissipation, resulting in a rise
in package temperature.
To avoid this problem, design the board with thorough consideration given to heat radiation measures.
*3 To avoid unused LED pin’s misdetection, set ADIM within 1.0V to 2.7V at start up stage. After unused LED pin’s
detection, set ADIM within 0.2V to 2.7V in normal operation.
Pin Configuration
1 REG58 VCC 16
2 CS ADIM 15
3 N RT 14
4 GND SSFB 13
5 OVP ISET 12
6 STB PWM 11
7 LED1 LED4 10
8 LED2 LED3 9
SOP16
Figure 3. Pin Configuration
www.rohm.com
2/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Marking diagram and physical dimension
SOP16
BD93942F
LOT No.
Figure 4. Physical Dimension
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)

Limit
Parameter Symbol Unit Condition
Min. Typ. Max.
[Whole Device]
STB=3V,PWM=3V,
Circuit current while in operation ICC - 3.7 7.4 mA
RT=100kΩ
Circuit current while in standby ISTB - 40 80 μA STB=0V
[REG58 Block]
REG58 Output Voltage REG58 5.742 5.8 5.858 V IO=0mA
REG58 available current IREG58 15 - - mA
[UVLO Block]
UVLO release voltage VUVLO_VCC 6.5 7.5 8.5 V VCC=SWEEP UP
UVLO hysteresis voltage VUHYS_VCC 150 300 600 mV VCC=SWEEP DOWN
[DC/DC Block]
ISET=50kΩ, ADIM=2.5V
Error amp. Reference voltage VLED 0.425 0.450 0.475 V
ILED=150mA
Oscillation frequency fsw 142.5 150.0 157.5 kHz RT=100kΩ
Max. duty cycle per output of N pin DMAX 83 90 97 % RT=100kΩ
On resistance on N pin source side RONH - 4 8 Ω ION=-10mA
On resistance on N pin sink side RONL - 3 6 Ω ION=10mA
SSFB pin source current
ISSSO -13.0 -10.0 -7.0 uA SSFB=2V
(at soft start)
SSFB sink current IFBSI 50 100 150 μA LED=2.0V,SSFB=1.0V
SSFB source current IFBSO -150 -100 -50 μA LED=0V, SSFB=1.0V
Over current detection voltage VCS 0.40 0.45 0.50 V CS=SWEEP UP
www.rohm.com
3/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)

Limit
Parameter Symbol Unit Condition
Min. Typ. Max.
[DC/DC Protection Block]
Overvoltage protection detection
VOVP 2.7 3.0 3.3 V OVP=SWEEP UP
voltage
Overvoltage protection detection
VOVP_HYS 50 100 200 mV OVP=SWEEP DOWN
hysteresis voltage
Short circuit protection detection
VSCP 0.04 0.10 0.25 V OVP=SWEEP DOWN
voltage
[LED Driver Block]
ILED=100mA,
LED pin current accuracy 1 dILED1 -2 - 2 %
(ADIM=2.5V,ISET=75kΩ)
ILED=70mA,
LED pin current accuracy 2 dILED2 -3.2 - 3.2 %
ILED=50mA,
LED pin current accuracy 3 dILED3 -4.6 - 4.6 %
ILED=30mA,
ILED=100mA,
(ADIM=7V,ISET=75kΩ)
LED pin Leakage Current ILLED -2.5 - 2.5 μA LED=60V
LED open detection voltage VOPEN 0.05 0.2 0.285 V LED=SWEEP DOWN
LED short detection voltage VSHORT 4 5 6 V LED=SWEEP UP
ADIM pin Input Current ILADIM -2.5 - 2.5 μA ADIM=3V
[STB Block]
STB pin high-level voltage STBH 2 - 35 V STB=SWEEP UP

STB pin low-level voltage STBL -0.3 - 0.8 V STB=SWEEP DOWN
STB pin pull-down resistance RSTB 500 1000 1500 kΩ STB=3.0V
[PWM Block]
PWM pin high-level voltage PWMH 2 - 35 V PWM=SWEEP UP
PWM pin low-level voltage PWML -0.3 - 0.8 V PWM= SWEEP DOWN
PWM pin pull-down resistance RPWM 180 300 420 kΩ PWM=3.0V
[Failure Indication Block (Open Drain)]
AUTO Timer tAUTO - 0.655 - sec RT=75kΩ
Abnormal Detection Timer tCP 20 ms RT=75kΩ
www.rohm.com
4/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Pin Descriptions (SOP16)

Pin No Pin Name In/Out Function Rating [V]
1 REG58 Out Power supply for N pin -0.3 to 7
2 CS In DC/DC output current detection and OCP detection pin -0.3 to 7
3 N Out DC/DC switching output pin -0.3 to 7
4 GND - Ground pin -
5 OVP In Overvoltage protection detection pin -0.3 to 36
6 STB In Enable pin -0.3 to 36
7 LED1 Out Output pin 1 for LED -0.3 to 60
11 PWM In External PWM light modulation signal input pin for LED1-4 -0.3 to 36
12 ISET Out LED current setting resistor connection pin -0.3 to 7
13 SSFB In/Out Soft start setting, Loop compensation setting pin -0.3 to 7
14 RT Out DC/DC drive frequency setting resistor connection pin. -0.3 to 7
15 ADIM In Analog dimming DC voltage input pin -0.3 to 36
16 VCC In Power supply pin -0.3 to 36
www.rohm.com
5/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Pin ESD Type
REG58 / N /GND/ CS ADIM SSFB
SSFB
ADIM
LED1~4 RT STB
STB
RT
PWM ISET OVP
ISET
Figure 5. Pin ESD Type
www.rohm.com
6/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Block Diagram
Figure 6. Block Diagram
www.rohm.com
7/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Typical Performance Curve
8 1000
STB=3V, VCC=24V
7 Ta=25°C
PWM=3V,
RT=100kΩ
6
N Frequency [MHz]
5
Icc [mA]
4 100
0 10
8 12 16 20 24 28 32 36 10 100 1000
VCC [V] R_RT [kΩ]
Figure 7. Operating Current (ICC) [mA] vs. VCC[V] Figure 8. N Frequency [MHz] vs. R_RT [kΩ]
200 1 40
VCC=24V VCC=24V
180
Ta=25°C 1 20 Ta=25°C
160 RISET=75kΩ RISET=75kΩ
140 ADIM=2.5V 1 00
120
ILED [mA]
80
ILE D [mA]
100
60
80
60 40
40
20
20
0 0
-40 -20 0 20 40 60 80 100 120 140 0 0.5 1 1.5 2 2.5 3 3.5
Temp [℃] ADIM [V]
Figure 9. LED Current (ILED) [mA] vs. Temp [oC] Figure 10. LED Current (ILED) [mA] vs. ADIM[V],
www.rohm.com
8/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Pin Function
○REG58 (1pin)
The REG58 pin is used in the DC/DC converter driver block to output 5.8V power. The maximum operating current is 15mA.
Using the REG58 pin at a current higher than 15mA can affect the N pin output pulse, causing the IC to malfunction and
leading to heat generation of the IC itself. To avoid this problem, it is recommended to make load setting to the minimum
level.
Please place the ceramic capacitor connected to REG58 pin (2.2μF to 10μF) closest to REG58-GND pin.
○CS (2pin)
The CS pin has the following two functions:
1. DC/DC current mode current feedback function
Current flowing through the inductor is converted into voltage by the current sensing resistor RCS connected to the CS pin
and this voltage is compared with voltage set with the error amplifier to control the DC/DC output voltage.
2. Inductor current limit function
The CS pin also incorporates the over current protection (OCP) function. If the CS pin voltage reaches 0.45V (Typ.) or more,
switching operation will be forcedly stopped.
○N (3pin)
The N pin is used to output power to the external NMOS gate driver for the DC/DC converter in the amplitude range of
approx. 0 to REG58. ON resistances is 4.0Ω(typ.) in sorrce (H side), 3.0Ω(typ.) in sink (L side).
Frequency setting can be made with a resistor connected to the RT pin. For details of frequency setting, refer to the
description of the RT pin.
○GND (4pin)
Ground of the IC.
○OVP (5pin)
The OVP pin is an input pin for over-voltage protection and short circuit protection of DC/DC output voltage. If over-voltage
is detected, the OVP pin will stop the DC/DC converter conducting step-up operation. When the short circuit protection
(SCP) function is activated, the DC/DC converter will stop operation, and then the timer will start counting. When the timer
completes counting the preset period of time, the LED drivers are stopped.
The OVP pin is of the high impedance type and involves no pull-down resistor, resulting in unstable potential in the
open-circuited state. To avoid this problem, be sure to make input voltage setting with the use of a resistive divider or
otherwise.
○STB (6pin)
The STB pin is used to make setting of turning ON and OFF the IC and allowed for use to reset the IC from shutdown.
Note: The IC state is switched (i.e., the IC is switched between ON and OFF state) according to voltages input in the STB
pin. Avoid using the STB pin between two states (0.8 to 2.0V).
When STB signal is set to Low or High, change it from Low to High after REG58 output completely discharges.
○LED1 – LED4 (7pin – 10pin)

The LED1 to 4 pins are used to output constant current to LED drivers. Current value setting can be made by connecting a
resistor to the ISET pin.
For the current value setting procedure, refer to the description of “ISET pin”.
If any of the LED pins is put in an erroneous state (e.g. short circuit mode, open circuit mode, or ground short circuit mode),
the relevant protection function will be activated.
This IC is detected automatically that it is an unused channel by asssuming the LED terminal to be connected to GND
before start up.
○PWM (11pin)
The PWM pin is used to turn ON and OFF LED drivers. Light can be modulated by changing the duty cycle through the
direct input of a PWM light modulation signal. The high and low voltage levels of PWM pin is as listed in the table below:
State PWM Voltage
LED ON state PWM= 2.0V to 35V
LED OFF state PWM= -0.3V to 0.8V
www.rohm.com
9/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
○ISET (12pin)
The ISET pin is an output current setting resistor. Output current ILED varies in inverse proportion to resistance.
The relation between output current ILED and the resistance of ISET pin connection resistor RISET is given by the following
equation:
3000
I LED [ mA]   V ADIM [V ] (ADIM=0.2V to2.7V)
R ISET [ kΩ]
7500 (ADIM>4V to 35V)

I LED [mA] 
RISET [kΩ]
Output current setting should be made in the range of 30mA to 150mA.
It prepares automatically to suitable LED feedback voltage that can output LED current set by ISET pin.
In short LED feedback voltage is dropped when the LED current is small and the IC heating is held automatically.
In case of a large current is needed, raise the LED pin feedback voltage. And it adjusts automatically to LED pin voltage
that can be flow large LED current.
The calculation is as below.
VLED  3  I LED [ A] [V ] ( ILED  117 mA)
VLED 0.35[V ](typ ) ( ILED  117 mA)
The LED feedback voltage (VLED) is clamped to 0.35V (typ.) when the LED current (ILED) is less than 117mA.
ADIM input range is from 0V to 35V. And the range which the LED currents change with linearity is from 0.2V to 2.7V.
When it reaches under VISET×0.90V(typ.), the LED current is off to prevent from passing a large current to the LED pin
when the RISET is shorted and the ISET pin is shorted to the GND. And as the ISET pin returns to a normal state, the LED
current returns.
○SSFB (13pin)
The SSFB pin is used to make setting of soft start time and duty for soft start, and DC/DC current mode control error
amplifier. It performs constant current charge of 10uA to the external capacitor connected to SSFB terminal, which enables
soft-start of DC/DC converter.
The SSFB pin detects the voltages of LED pins (1 to 4) and controls inductor current so that the pin voltage of the LED
located in the row with the highest Vf will come to 0.45V(ADIM=2.5V,ISET=50kΩ,ILED=150mA). As a result, the pin
voltages of other LEDs become higher by Vf variation. After completion of soft start, the SSFB pin is put into the
high-impedance state with the PWM signal being in the low state, thus maintaining the SSFB voltage.
Since the LED protection function (OPEN/SHORT detection) works when it turns to the LED feedback mode.
○RT (14pin)
The RT pin is used to connect a DC/DC frequency setting resistor. DC/DC drive frequency is determined by connecting the
RT resistor.
Drive frequency vs. RT resistance (Ideal)

15000
R RT  [ k ]
f SW [ kHz ]
When RT is 100kΩ, Fsw is 150kHz(typ.). However, drive frequency setting should be made in the range of 100 kHz to 800
kHz.
○ADIM (15pin)
ADIM pin is for analog dimming. Output current is proportionality with input voltage. Basically, ADIM pin assumes the
voltage inputted externally using high accuracy of resistive divider and etc., IC internally is in OPEN (High impedance)
condition. Cannot use in an OPEN condition.
If you don't use analog dimming, please connect pull-up resistor to over 5V (for example REG58).
○VCC (16pin)
The VCC pin is used to supply power for the IC in the range of 9 to 35V.
If the VCC pin voltage reaches 7.5V (Typ.) or more, the IC will initiate operation. If it reaches 7.2V (Typ.) or less, the IC will
be shut down.
www.rohm.com
10/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Startup operation and soft start (SSFB) capacitance setting

The following section describes the sequence for the startup of this IC.
① 5V VOUT
10uA
Q D
PWM
STB COMP
Soft-Start(ISS=10uA) IFB(Sink, Source)=±100uA) N
DRIVER
OSC OSC
SSFB CS
ILED
PWM LED_OK LED
N SSFB
②
PWM=L:STOP
RSSFB VLED
VOUT CSSFB
③ PWM
ILED
LED_DRIVER
④
LED_OK
⑥
⑤
Figure 11. Startup waveform Figure 12. Circuit behavior at startup
Description of startup sequence

(1) Set the STB and PWM pin to “ON”.
(2) Set all systems to “ON”, SSFB charge will be initiated.
(3) Since the SSFB pin reach the lower limit of the internal sawtooth wave of the IC, the DC/DC converter operates to
start VOUT voltage rising.
(4) The Vout voltage continues rising to reach a voltage at which LED current starts flowing.
(5) When the LED current reaches the set amount of current, the startup operation is completed.
(6) After that, conduct normal operation following the feedback operation sequence with the LED pins.
If the SSFB pin sink/source current is ±100uA, the LED protection function will be activated.
SSFB capacitance setting procedure

As aforementioned, this IC stops DC/DC converter when the PWM pin is set to Low level and conducts step-up operation
only in the section in which the PWM pin is maintained at High level. Consequently, setting the PWM duty cycle to the
minimum will extend the startup time. The startup time also varies with application settings of output capacitance, LED
current, output voltage, and others.
Startup time at minimum duty cycle can be approximated according to the following method:
Make maeasurement of VOUT startup time with a 100% duty cycle, first. Take this value as “Trise100”.
The startup time “Trise_min” for the relevant application with the minimum duty cycle is given by the following equation.
Trise _100[Sec]
Trise _ min  [Sec]
Min _ Duty [ratio]
However, since this calculation method is just for approximation, use it only as a guide.
Assuming that the SSFB pin voltage is VSSFB, the time is given by the following equation:
CSSFB[ F ]  VSSFB[V ]
TSSFB  [Sec]
10[A]
As a result, it is recommended to make SSFB capacitance setting so that “TSSFB” will be greater than “Trise_min”
www.rohm.com
11/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
About unused LED terminal automatic detecting function

This IC is detected automatically that it is an unused channel by asssuming the LED terminal to be OPEN at starting. It
explains the sequence.
20us
GND
GND
Figure 14. Block diagram
Figure 13. Timming chart
Sequence;
① STB=PWM=ON
② All systems are ON and SSFB starts charging.
③ When the output voltage is boosted enough, and enough current flows through the LED, LED_OK signal is switched
in the IC. PWM=L from the Rise timing of this signal for about 20us
④ During this PWM=L period, LED pins with LED connections' output voltage becomes 0.2V and above, where as
unused LED pins are below 0.2V.
⑤ During this time, determination on whether the LED pins are 0.2V above/below is done.
⑥ After the determination, unused LED pins are pulled up to 5V.
⑦The AUTO timer don’t count.
www.rohm.com
12/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
LED current setting

Setting of LED output current “ILED” can be made by connecting a resistor RISET to the ISET pin.
RISET vs. ILED current relation equation
7500
R ISET  [ k] (ADIM=2.5V)
I LED [ mA]
However, LED current setting should be made in the range of 30mA to 150mA.
[Setting example]
To set ILED current to 100mA, RISET resistance is given by the following equation:
7500 7500
R ISET    75 [k]
I LED [mA] 100[ mA]
DC/DC converter drive frequency setting

DC/DC converter drive frequency is determined by making RT resistance setting.
Drive frequency vs. RT resistance (ideal) relation equation
15000
R RT  [ k ]
f SW [ kHz ]
where fsw  DC/DC converter oscillation frequency [kHz]
This equation has become an ideal equation without any correction item included.
For accurate frequency settings, thorough verification should be performed on practical sets.
[Setting example]
To set DC/DC drive frequency “fsw” to 200 kHz, RRT is given by the following equation:
15000 15000
RRT    75 [ k]
f sw [ kHz ] 200[ kHz ]
www.rohm.com
13/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
OVP/SCP Settings
OVP pin is DC/DC output voltage’s over voltage protection and short circuit protection input pin.
OVP pin is a high impedance pin with no pull down resistor. Thus, at OPEN state please set the voltage
input settings using voltage dividing resistor and such.
Respective OVP pin protection conditions are as below
Protection Detection Detection Cancellation Timer

Protection Type
Name Pin Condition Condition Operations
DCDC stops during

No
OVP OVP OVP>3.0V OVP<2.9V detection
SCP OVP OVP<0.1V OVP>0.1V Yes All latch
○OVP Detection Setting

VOUT abnormally increase、voltage detected by OVP, VOVPDET,
R1,R2 settings are as follows
(VOVPDET [V ]  3.0[V ])
R1  R2[k]  [k]
3.0[V ]
○OVP Cancellation Setting
R1,R2 set from above equation,
OVP cancellation voltage VOVPCAN equals to
( R1[k]  R2[k])
VOVPCAN  2.9V  [V ] Figure 15. OVP/SCP setting example
R2[k]
○SCP Detection Setting
When R1,R2 are set using values obtained above, SCP voltage setting is VSCPDET is as follows
( R1[k]  R2[k])
VSCPDET  0.1V  [V ]
R2[k]
【Setting Example】
VOUT at normal operation 56V、OVP detection voltage VOVPDET=68V、R2=10k, R1 is as follows
(VOVPDET [V ]  3.0[V ]) (68[V ]  3[V ])
R1  R2[k]   10[k]   216.7 [k]
3.0[V ] 3[V ]
When R1, R2 are set at these values, OVP cancellation voltage, VOVPCAN
( R1[k]  R2[k]) 10[k]  216.7[k]
VOVPCAN  2.9[V ]   2.9[V ]  [V ]  65.7 [V ]
R2[k] 10[k]
In addition, at this R1, R2, SCP detection voltage
( R1[k]  R2[k]) 10[k]  216.7[k]

VSCPDET  0.1[V ]   0.1[V ]  [V ]  2.27 [V ]
R2[k] 10[k]
To select DC/DC components, give consideration to IC variations as well as individual component variations,
and then conduct thorough verification on practical systems.
www.rohm.com
14/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Timer Latch Time Setting

This IC has a built-in timer latch counter. Timer latch time is set by counting the clock frequency which is
set at the RT pin. After abnormal detection time passes, AUTO timer starts, it let IC auto-restart after constant setting
time.
Timer Latch Time

When various abnormal conditions happen, counting starts from the timing, latch occurs after below time has passed.
Furthermore, even if PWM=L, if abnormal condition continues, timer count will not reset.
RRT R [k]
LATCHTIME  212   4096 RT 7 [s]
1.5 10 10
1.5 10
RRT R [k]
AUTOTIME  217   131072  RT 7 [s]
1.5 10 10
1.5  10
Here, LATCHTIME = time until latch condition occurs, AUTOTIME = auto restart timer’s time
RRT = Resistor value connected to RT pin
LED1 SHORT Pro.

detect LED1 SHORT Pro.
release
12V
LED1_Voltage 0.4V 0.4V
Oscllator
4094
4095
4096
1
2
(internal IC)
CP COUNTER
0V
CP COUNT UP CP COUNT UP
START END
I_LED1
Current
LED1
LATCH OFF
AUTO
TIMER 131072
LOW count
AUTO
RE-START
Figure 16. Example of LED Short protection timing chart
Timer latch time when RT=75kohm
RRT [k] 75[k]

LATCHTIME  4096  4096   0.02[s]
1.5 107 1.5 107
RRT [k] 75[k]
AUTOTIME  131072  131072  0.655[s]
1.5 10 7
1.5 107
www.rohm.com
15/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
OCP Settings/DCDC Components’ Current Capacity Selection Method

One of the function of CS pin - when its pin voltage>0.45 it stops the DCDC. Thus, RCS resistor value
need to be checked after the peak current flow through the inductor is calculated. Furthermore, DCDC external
components’ current capacity needs to be greater than peak current flowing through this inductor.
（Inductor peak current Ipeak calculation method）

Firstly, ripple voltage which occurs at the CS pin is decided depending on the DCDC application conditions.
The conditions when made as below;
Output voltage=VOUT[V]
LED total current=IOUT[A]
DCDC input voltage=VIN[V]
DCDC efficiency =η[%]
Total required average input current IIN:
VOUT [V ]  I OUT [ A]
I IN  [ A]
VIN [V ] [%]
Inductor ripple current IL[A] which occurs at inductor L[H] during
DCDC drive operation with switching frequency=fsw[Hz] is as follows
(VOUT [V ]  V IN [V ])  V IN [V ]
Δ IL  [ A]
L[ H ]  VOUT [V ]  f SW [ Hz ] Figure 17. DC/DC convertor application circuit
Therefore, IL’s peak current Ipeak can be calculated using below equation
IL[ A]
Ipeak  I IN [ A]  [ A] (1)
2
(Resistor RCS connected to CS pin selection method)

This Ipeak flows in RCS and generates voltage. (refer to time chart
diagram on the right). This voltage value, VCSpeak can be calculated as below
VCS peak  Rcs  Ipeak [V ]
This VCSpeak when reach 0.45V, will stop the DCDC output.
Thus when selecting RCS value, below condition needs to be met.
Rcs [ ]  Ipeak [ A]  0.45[V ]
(DCDC Components’ Current Capacity Selection Method)

When OCP reach detection voltage CS=0.45V, Iocp current
0.45[V ]
I OCP  [ A]  ( 2 ) Figure 18. Inductor current waveform
Rcs[ ]
Ipeak current (1)、IOCP current (2)、and components’ MAX current capacity needs to satisfy the following
I peak  I OCP  Rated current of components
Above condition needs to be satisfied when selecting DCDC application parts eg. FET, inductor, diode etc.
Furthermore, continuous mode is recommended for normal DCDC applications. Inductor’s ripple current MIN limit value,
lmin becoming
IL[ A]
Im in  I IN [ A]  [ A]  0
2
Is a condition to be met. If this is not met, it is called discontinuous mode.
www.rohm.com
16/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Output voltage=VOUT[V]=56V
LED total current=IOUT[A]=100mA×4ch=0.40A
DCDC input voltage=VIN[V]=14V
DCDC efficiency=η[%]=90%
Total required average input current IIN:
VOUT [V ]  I OUT [ A] 56[V ]  0.40[ A]

I IN [ A]    1.78 [ A]
VIN [V ] [%] 14[V ]  90[%]
When, DCDC switching frequency =fsw[Hz]=200kHz
Inductor L[H]=33uH,
Inductor ripple current ΔIL[A]:
(VOUT [V ]  V IN [V ])  V IN [V ] (56[V ]  14[V ])  14[V ]

Δ IL    1.59 [ A]
L[ H ]  VOUT [V ]  f SW [ Hz ] 33  10  6 [ H ]  56[V ]  200  10 3 [ Hz ]
Thus, IL peak current Ipeak becomes
IL[ A] 1.59[ A] …Peak current calculation result

Ipeak  I IN [ A]  [ A]  1.78[ A]   2.58 [ A]
2 2
RCS resistor value when set at 0.1ohm
VCS peak  Rcs  Ipeak  0 . 10 [  ]  2 . 58 [ A ]  0 . 258 [V ]  0 . 45V …RCS resistor consideration
and satisfy the condition.

In addition、OCP detection current IOCP at this time is
0.45[V ]
I OCP   4 . 5 [ A]
0.1[ ]
If parts used (FET,INDUCTOR、DIODE etc)’s current capacity<5A,
I peak  I OCP  Rated current of components

 2.58[ A]  4.5[ A]  5[ A]
…DCDC current capacity consideration
Thus, there is no problem of parts selection as the above condition is satisfied.
In addition、IL ripple current minimum limit Imin is
IL[ A]
Im in  I IN [ A]  [ A]  1.78[ A]  0.795[ A]  0.985[ A]  0
2
Thus、will not become discontinuous mode。
To select DC/DC components, give consideration to IC variations as well as individual component variations, and
then conduct thorough verification on practical systems.
www.rohm.com
17/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Selection of inductor L
The value of inductor has significant influence on the input ripple current. As
shown by Equation (1), the larger the inductor and the higher the switching
frequency, the inductor ripple current ∆IL becomes increasingly lower.
ΔIL (VOUT  V IN )  V IN
ΔIL  [ A] ・・・・・ (1)
L  VOUT  f SW
VIN Expressing efficiency as shown by Equation (2), peak input current is given
as Equation (3).
VOUT  I OUT
 ・・・・・ (2)
IL V IN  I IN
L ΔIL VOUT  I OUT ΔIL
ILMAX  I IN    ・・・・・ (3)
VOUT 2 VIN   2
where, L: Reactance value [H],
VOUT : DC/DC output voltage [V],
VIN: Input voltage [V],
IOUT: Output load current (total output current) [A],
IIN: Input current [A], and
FSW: Oscillation frequency [Hz]
RCS COUT
.
Figure 19. Inductor current waveform and diagram
Note: If a current in excess of the rated current of the inductor applies to the coil, the inductor will cause magnetic
saturation, resulting in efficiency degradation.
Select an inductor with an adequate margin so that peak current will not exceed the rated current of the
inductor.
Note: To reduce power dissipation from and increase efficiency of inductor, select an inductor with low resistance
component (DCR or ACR).
Selection of output capacitor COUT

Select a capacitor on the output side taking into account the stability region
VIN of output voltage and equivalent series resistance necessary to smooth
ripple voltage. Note that higher output ripple voltage may result in a drop in
LED pin voltage, making it impossible to supply set LED current.
The output ripple voltage ∆VOUT is given by Equation (4).
IL
L 1 I OUT 1
ΔVOUT  ILMAX  R ESR    [V ] ・・・・・ (4)
C OUT  f SW
VOUT where RESR  Equivalent series resistance of COUT.
Note: Select capacitor ratings with an adequate margin for output voltage.
RESR Note: To use an electrolytic capacitor, an adequate margin should be
provided for permissible current. Particularly to apply PWM light modulation
RCS to LED, note that a current higher than the set LED current transiently flows.
COUT
Figure 20. Output capacitor diagram,
Selection of switching MOSFET transistors

There will be no problem for switching MOSFET transistors having absolute maximum rating higher than rated current of the
inductor L and VF higher than “COUT breakdown voltage  Rectifier diode”. However, to achieve high-speed switching, select
transistors with small gate capacity (injected charge amount).
Note: Rated current larger than over current protection setting current is recommended.
Note: Selecting transistors with low on resistance can obtain high efficiency.
Selection of rectifier diodes

Select Schottky barrier diodes having current capability higher than the rated current of the inductor L and inverse
breakdown voltage higher that COUT breakdown voltage, particularly having low forward voltage VF.
www.rohm.com
18/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Phase Compensation Setting Procedure

DC/DC converter application for current mode control includes one each of pole fp (phase delay) by CR filer consisting of output
capacitor and output resistor (i.e., LED current) and zero (phase lead) fZ by the output capacitor and capacitor ESR.
Furthermore, the step-up DC/DC converter includes RHP zero “fZRHP” as the second zero. Since the RHP zero has phase delay
(90) characteristics like the pole, the crossover frequency fc should be set to not more than RHP zero
VIN VOUT
L ILED
VOUT
- FB
RESR gm
RCS
+ RFB1 CFB2
COUT
CFB1
Figure 21. Output stage and error amplifier diagram
i. Find pole fp and RHP zero fZRHP of DC/DC converter.
fp 
I LED VOUT  (1  D) 2
[ Hz ] f ZRHP  [ Hz ]
2  VOUT  COUT 2  L  I LED
VOUT  VIN
Where ILED  Total LED current [A], D
VOUT
ii. Find phase compensation to be inserted in the error amplifier. (Set fc to 1/5 of fZRHP.)
f RHZP  RCS  I LED
R FB1  []
5  f p  gm  VOUT  (1  D)
1 5
C FB1   [F ]
2  RFB1  f C 2  RFB1  f ZRHP
where
gm  4.0  10 4 [ S ]
iii. Find zero used to compensate ESR (RESR) of COUT (electrolytic capacitor).
RESR  C OUT
C FB 2  [F ]
RFB1
Note: Even if a ceramic capacitor (RESR of the order of milliohms) for COUT, it is recommended to insert CFB2 for
stable operation.
To improve transient response, it is necessary to increase RFB1 and reduce CFB1. However, this improvement reduces a phase
margin. To avoid this problem, conduct thorough verification, including variations in external components, on practical
systems.
www.rohm.com
19/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Timing Chart
VCC 7.5V
2.0V
STB
0.8V
REG58 2.6V 2.4V
ISET
RT
SSFB
DC/DC
Feed back Soft Start LED Feed back
(ISSFB=10uA) (ISSFB=±100uA)
Mode
VOUT
PWM 2.0V
ILEDｘ
LED_OPEN
Disable Enable Disable
LED_SHORT
ISET_GND_SHORT Disable Enable Disable
REG58_UVLO
VCC_UVLO
OVP
SCP
Figure 22. Timing chart
www.rohm.com
20/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
List of Protect Function (typ condition)
Protection Detection Detection Conditions Cancellation

Timer Protection Type
Name Pin Detection pin PWM LED_OK Conditions
Immediately
Auto-Restart
after detection
After 12
LED OPEN LEDｘ LEDx < 0.2V H LEDx > 0.2V 2 count (Judge
LED_OK
periodically
whether normal
or not)
Immediately
Auto-Restart
after detection
After 12
LED SHORT LEDｘ LEDx > 5V H LEDx < 5V 2 count (Judge
LED_OK
periodically
whether normal
or not)
LEDx < 0.2V LEDx > 0.2V
LED 12 7
LEDｘ and H - or (2 +2 ) count Latch
GND SHORT
SSFB > 4.0V SSFB < 3.6V
ISET Under Above Immediately

ISET - - Auto-Restart
GND SHORT ISET×90% ISET×90% Detect
Immediately
REG58 UVLO REG58 REG58<2.4V - - REG58>2.6V Auto-Restart
Detect
Immediately
VCC UVLO VCC VCC<7.3V - - VCC>7.5V Auto-Restart
Detect
Immediately
OVP OVP OVP>3.0V - - OVP<2.9V Auto-Restart
Detect
12
SCP OVP OVP<0.1V - - OVP>0.1V 2 count Auto-Restart
Immediately
OCP CS OCP>0.45V - - - Pulse-by-Pulse
Detect
To clear the latch type, STB should be set to “L” once, and then to “H”.
Operation after the protection function detected

Protection Function
DC/DC LED Driver Soft-start
Only detected LED ch
LED OPEN Continue to operate Continue to operate
stops after CP count
LED SHORT Continue to operate Continue to operate
Stop Discharge
LED GND SHORT
after (CP+27) count Other LED ch stop operation after (CP+27) count
7
after (CP+2 ) count
ISET GND SHORT Stop immediately Stop immediately Continue to operate
Stop
STB Stop immediately Discharge immediately
(and when REG58<2.4V)
REG58 UVLO Stop immediately Stop immediately Discharge immediately
VCC UVLO Stop immediately Stop immediately Discharge immediately
Stop immediately
OVP Continue to operate Continue to operate
(N pin only)
Stop immediately
SCP Stop after CP count Discharge after CP count
(N pin only)
OCP N pin limits DUTY Continue to operate Continue to operate
* CP= 20ms (RT=75KΩ)
www.rohm.com
21/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Operational Notes
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
9. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
www.rohm.com
22/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Operational Notes – continued
10. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
11. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 23. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
www.rohm.com
23/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Ordering Information
B D 9 3 9 4 2 F - E2
Part Number Packaging and forming specification

E2: Embossed tape and reel
Marking Diagrams
SOP16(TOP VIEW)
Part Number Marking
BD93942F LOT Number
1PIN MARK
www.rohm.com
24/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Physical Dimension, Tape and Reel Information

Package Name SOP16
(Max 10.35 (include.BURR))
(UNIT : mm)
PKG : SOP16
Drawing No. : EX114-5001
<Tape and Reel information>

Tape Embossed carrier tape
Quantity 2500pcs
E2
Direction
The direction is the 1pin of product is at the upper left when you hold
of feed ( reel on the left hand and you pull out the tape on the right hand )
1pin Direction of feed

Reel ∗ Order quantity needs to be multiple of the minimum quantity.
www.rohm.com
25/26
TSZ22111・15・001 12.Aug.2015 Rev.002
BD93942F Datasheet
Revision History
Date Revision Changes
12.Feb.2015 001 New release

p.3 [REG58 Block]
12.Aug.2015 002
Soft start completion voltage -> REG58 available current
www.rohm.com
26/26
TSZ22111・15・001 12.Aug.2015 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Datasheet
Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E Rev.001
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE Rev.001

bd93942f-e

Uploaded by

Copyright:

Available Formats

bd93942f-e

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

bd93942f-e

Uploaded by

Copyright:

Available Formats

Datasheet

LED Drivers for LCD Backlights

White LED Driver for large LCD

Package W(Typ.) x D(Typ.) x H(Max.)

Typical Application Circuit Figure 1. SOP16

Figure 2. Typical Application Circuit

Absolute maximum ratings (Ta=25°C)

Figure 3. Pin Configuration

Marking diagram and physical dimension

Figure 4. Physical Dimension

Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)

Electrical Characteristics (Unless otherwise noted, Ta = 25oC, VCC=24V)

STB pin high-level voltage STBH 2 - 35 V STB=SWEEP UP

Pin Descriptions (SOP16)

Pin ESD Type

REG58 / N /GND/ CS ADIM SSFB

PWM ISET OVP

Figure 5. Pin ESD Type

Figure 6. Block Diagram

Typical Performance Curve

○LED1 – LED4 (7pin – 10pin)

State PWM Voltage

LED ON state PWM= 2.0V to 35V

LED OFF state PWM= -0.3V to 0.8V

7500 (ADIM>4V to 35V)

Drive frequency vs. RT resistance (Ideal)

Startup operation and soft start (SSFB) capacitance setting

Figure 11. Startup waveform Figure 12. Circuit behavior at startup

Description of startup sequence

SSFB capacitance setting procedure

About unused LED terminal automatic detecting function

Figure 14. Block diagram

Figure 13. Timming chart

LED current setting

RISET vs. ILED current relation equation

DC/DC converter drive frequency setting

Drive frequency vs. RT resistance (ideal) relation equation

Protection Detection Detection Cancellation Timer

DCDC stops during

○OVP Detection Setting

( R1[k]  R2[k]) 10[k]  216.7[k]

Timer Latch Time Setting

Timer Latch Time

LED1 SHORT Pro.

LED1_Voltage 0.4V 0.4V

RRT [k] 75[k]

OCP Settings/DCDC Components’ Current Capacity Selection Method

（Inductor peak current Ipeak calculation method）

(Resistor RCS connected to CS pin selection method)

VCS peak  Rcs  Ipeak [V ]

Rcs [ ]  Ipeak [ A]  0.45[V ]

(DCDC Components’ Current Capacity Selection Method)

VOUT [V ]  I OUT [ A] 56[V ]  0.40[ A]

(VOUT [V ]  V IN [V ])  V IN [V ] (56[V ]  14[V ])  14[V ]

Thus, IL peak current Ipeak becomes

IL[ A] 1.59[ A] …Peak current calculation result

VCS peak  Rcs  Ipeak  0 . 10 [  ]  2 . 58 [ A ]  0 . 258 [V ]  0 . 45V …RCS resistor consideration

and satisfy the condition.

I peak  I OCP  Rated current of components

Selection of output capacitor COUT