Comprog 1.1
Comprog 1.1
Comprog 1.1
REGISTERS
Processor
COMPONENTS
Arithmetic Logic Unit (ALU): Performs arithmetic
operations (such as addition, subtraction, multiplication,
and division) and logical operations (such as AND, OR, and
NOT) on data.
Example Examples
includes RAM include ROM,
Flash memory,
and CMOS
MEMORY
Read-Only Memory (ROM) refers to the memory
chips storing permanent data and instructions
Static RAM (SRAM) is a type of computer memory that stores data using flip-
flops, allowing it to retain information without needing periodic refreshing,
resulting in faster access times but higher cost and lower density compared
to DRAM
EXPANSION
CPU RAM SLOT CONNECTO
SLOTS
SOCKET RS
CPU SOCKET - This is where the central processing unit
(CPU) is installed on the motherboard.
• Voltage conversion
• Distribution
• Regulation
• Protection
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COOLING
SYSTEM
Computer cooling systems are
active cooling systems designed
to dissipate excessive heat
generated through a Pc. Proper
and regular heat dissipation from
the systems ensures efficiency
and effectiveness while working
COOLING
SYSTEM
As electronic components such as
the CPU (Central Processing
Unit), GPU (Graphics Processing
Unit), and other integrated
circuits operate, they generate
heat due to the flow of electric
current through them.
COOLING
When itSYSTEM
comes to a PC build,
there are two main options to
safely mitigate heat from your
CPU: air cooling and liquid
cooling.
COOLING
SYSTEM
Air Cooling: This
system uses fans
and heat sinks to
dissipate heat
generated by the
computer's
internal
components.
COOLING
SYSTEM
Liquid Cooling:
Also known as
water cooling,
this system uses a
closed-loop
system to transfer
heat away from
components.
COOLING
SYSTEM
Thermal paste, also known as thermal
compound, is a material used to improve the
transfer of heat between two surfaces,
typically a heat-generating component (such
as a CPU or GPU) and a heat sink. It is not
directly associated with either liquid cooling
or air cooling systems; rather, it is used in
conjunction with both types of cooling
solutions to enhance their effectiveness.
THERMAL PASTE
CASE AND FORM
FACTOR
CASE AND FORM
FACTOR
The case is essential for providing physical
protection and organization to the components
inside a computer system.
It protects delicate internal components from
dust, dirt, moisture, and physical damage.