ICC C35D: Sheath Bonding of Multi-Conductor / Parallel Circuits
ICC C35D: Sheath Bonding of Multi-Conductor / Parallel Circuits
ICC C35D: Sheath Bonding of Multi-Conductor / Parallel Circuits
Sheath Bonding of
Multi-Conductor /
ICC Spring Meeting
Parallel Circuits
Seattle, March 2012
Frdric LESUR
Cigr Electra 128 Publication:
2 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Cigr Technical Brochure 283
3 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Cigr Technical Brochure 347
4 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 Standard
5 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEEE P575/D Draft Guide
6 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Cigr work in progress
7 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Double cable system model: IEEE P575/D11 figures
8 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Equations and Kirchhoff's law
Ground
Phase R Phase S Phase T Sheaths
conductors
Voltages 1 p p+1 2p 2p+1 3p 3p+1 6p 6p+1 6p+q
V1 Z1,1 I1 Z1,2 I2 Z1,3 I3 Z1,4 I4 Z1,5 I5 Z1,6 I6 Z1,7 I7 Z1,8 I8 Z1,9 I9 Z1,10 I10 Z1,11 I11 Z1,12 I12 Z1,13 I13 Z1,14 I14
Ph R
V2 Z2,1 I1 Z2,2 I2 Z2,3 I3 Z2,4 I4 Z2,5 I5 Z2,6 I6 Z2,7 I7 Z2,8 I8 Z2,9 I9 Z2,10 I10 Z2,11 I11 Z2,12 I12 Z2,13 I13 Z2,14 I14
V3 Z3,1 I1 Z3,2 I2 Z3,3 I3 Z3,4 I4 Z3,5 I5 Z3,6 I6 Z3,7 I7 Z3,8 I8 Z3,9 I9 Z3,10 I10 Z3,11 I11 Z3,12 I12 Z3,13 I13 Z3,14 I14
Ph S
V4 Z4,1 I1 Z4,2 I2 Z4,3 I3 Z4,4 I4 Z4,5 I5 Z4,6 I6 Z4,7 I7 Z4,8 I8 Z4,9 I9 Z4,10 I10 Z4,11 I11 Z4,12 I12 Z4,13 I13 Z4,14 I14
V5 Z5,1 I1 Z5,2 I2 Z5,3 I3 Z5,4 I4 Z5,5 I5 Z5,6 I6 Z5,7 I7 Z5,8 I8 Z5,9 I9 Z5,10 I10 Z5,11 I11 Z5,12 I12 Z5,13 I13 Z5,14 I14
Ph T
V6 Z6,1 I1 Z6,2 I2 Z6,3 I3 Z6,4 I4 Z6,5 I5 Z6,6 I6 Z6,7 I7 Z6,8 I8 Z6,9 I9 Z6,10 I10 Z6,11 I11 Z6,12 I12 Z6,13 I13 Z6,14 I14
V7 Z7,1 I1 Z7,2 I2 Z7,3 I3 Z7,4 I4 Z7,5 I5 Z7,6 I6 Z7,7 I7 Z7,8 I8 Z7,9 I9 Z7,10 I10 Z7,11 I11 Z7,12 I12 Z7,13 I13 Z7,14 I14
V8 Z8,1 I1 Z8,2 I2 Z8,2 I2 Z8,4 I4 Z8,5 I5 Z8,6 I6 Z8,7 I7 Z8,8 I8 Z8,9 I9 Z8,10 I10 Z8,11 I11 Z8,12 I12 Z8,13 I13 Z8,14 I14
V9 Z9,1 I1 Z9,2 I2 Z9,3 I3 Z9,4 I4 Z9,5 I5 Z9,6 I6 Z9,7 I7 Z9,8 I8 Z9,9 I9 Z9,10 I10 Z9,11 I11 Z9,12 I12 Z9,13 I13 Z9,14 I14
Sheaths
V10 Z10,1 I1 Z10,2 I2 Z10,3 I3 Z10,4 I4 Z10,5 I5 Z10,6 I6 Z10,7 I7 Z10,8 I8 Z10,9 I9 Z10,10 I10 Z10,11 I11 Z10,12 I12 Z10,13 I13 Z10,14 I14
V11 Z11,1 I1 Z11,2 I2 Z11,3 I3 Z11,4 I4 Z11,5 I5 Z11,6 I6 Z11,7 I7 Z11,8 I8 Z11,9 I9 Z11,10 I10 Z11,11 I11 Z11,12 I12 Z11,13 I13 Z11,14 I14
V12 Z12,1 I1 Z12,2 I2 Z12,3 I3 Z12,4 I4 Z12,5 I5 Z12,6 I6 Z12,7 I7 Z12,8 I8 Z12,9 I9 Z12,10 I10 Z12,11 I11 Z12,12 I12 Z12,13 I13 Z12,14 I14
Ground V13 Z13,1 I1 Z13,2 I2 Z13,3 I3 Z13,4 I4 Z13,5 I5 Z13,6 I6 Z13,7 I7 Z13,8 I8 Z13,9 I9 Z13,10 I10 Z13,11 I11 Z13,12 I12 Z13,13 I13 Z13,14 I14
conductors V14 Z14,1 I1 Z14,2 I2 Z14,3 I3 Z14,4 I4 Z14,5 I5 Z14,6 I6 Z14,7 I7 Z14,8 I8 Z14,9 I9 Z14,10 I10 Z14,11 I11 Z14,12 I12 Z14,13 I13 Z14,14 I14
IS [ ] I3 I4
IT [ ] I5 I6
9 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Methodology
10 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Calculation of impedances
11 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Calculation of inductances
12 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Calculation of loss factor
13 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 1
1,00
-1 0 1 2 3
-1,00
14 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 1
50
T1,T2
40
30
S1s, S2s 20
1,00
-1,00
R1s, R2s -20
-30
-40
S1, S2
-50
15 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 2
1,00
-1 0 1 2 3
Same data as example 1,
phase rotation has been reversed
-1,00
16 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 2
50
S1, S2
40
T1s, T2s
30
20
1,00
-1,00
-20
-40
T1,T2
-50
17 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 3
1,00
-1 0 1 2 3
Trefoil formation
-0,98
18 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 3
50
T1,T2
40
30
20
1,00
Trefoil formation
-10
R1s, R2s
-0,98
-20
-30
-40
S1, S2
-50
19 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 4
1,00
0 1 2 3 4
Same geometry as example 1,
Conductors of one phase placed together
-1,00
20 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
IEC 60287-1-3 example 4
current sharing
between phase
conductors is not equal,
60
20 1,00
S1
-40
S2
-60
21 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
EMF mitigation technique: shields/sheaths make a
passive loop to compensate the magnetic field
Example 1 of IEC 60287-1-3
Shielding factor SF = 1.44
I = 50 A in each cable
0,3
0,25
0,2
0,15
0,1
0,05
0
-9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10 11
x-distance from axis power line (m)
22 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Work in progress
Features IEC 60287-1-3 Current tool
number of circuits in
2 n1
parallel
multiple of 3
number of phases 3 (RST or ABC) (possibility of
independent circuits)
number of ground
0 q0
continuity conductors
3 and 2-phase circuits
no
mixed in parallel
single bonding
other grounding mode (calculation of induced
no
than solid bonding voltages)
23 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices
Further work for next ICC Meeting
Future prospects
Transposed conductors
Crossbonded shields/sheaths
Transposed ground continuity conductors
24 C35D (Sheath Bonding of Multi-Conductor / Parallel Circuits): Cigr, IEC and general practices