Nema Ts-2 Signal Monitor Procurement Specifications Model MMU-16E Malfunction Management Unit
Nema Ts-2 Signal Monitor Procurement Specifications Model MMU-16E Malfunction Management Unit
Nema Ts-2 Signal Monitor Procurement Specifications Model MMU-16E Malfunction Management Unit
Signal Monitor
Procurement Specifications
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Model MMU-16E
Malfunction Management Unit
November 2016
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Table of Contents
Section 1 INTRODUCTION 2
1.1 MONITORING FUNCTIONS ............................................................................................................. 2
1.2 DUAL INDICATION MONITOR ......................................................................................................... 2
1.3 DUAL INDICATION MONITORING ................................................................................................... 2
1.3.1 GY-DUAL INDICATION MONITOR ........................................................................................... 2
1.4 FIELD CHECK MONITORING ........................................................................................................... 3
1.4.1 FIELD CHECK MONITOR ......................................................................................................... 3
1.4.2 FIELD CHECK STATUS ............................................................................................................ 3
1.5 RECURRENT PULSE MONITORING ............................................................................................... 3
1.6 EXTERNAL WATCHDOG MONITOR ............................................................................................... 3
1.7 WALK DISABLE OPTION .................................................................................................................. 4
1.8 TYPE FAULT MONITOR ................................................................................................................... 4
1.9 CONFIGURATION CHANGE MONITOR .......................................................................................... 4
1.10 CVM LOG DISABLE ........................................................................................................................ 4
Section 2 DISPLAY FUNCTIONS 5
2.1 FULL INTERSECTION CHANNEL STATUS DISPLAY .................................................................... 5
2.2 FAULT CHANNEL STATUS DISPLAY .............................................................................................. 5
2.3 FIELD CHECK STATUS DISPLAY .................................................................................................... 5
2.4 RECURRENT PULSE STATUS DISPLAY ........................................................................................ 5
2.5 DISPLAY INDICATORS .................................................................................................................... 5
2.5.1 Type 12 Mode Indicator ............................................................................................................. 5
2.5.2 Dual Indication Indicator ............................................................................................................ 5
2.5.3 Power Indicator .......................................................................................................................... 6
2.5.4 Port 1 Receive Indicator ............................................................................................................ 6
2.5.5 Port 1 Transmit Indicator ........................................................................................................... 6
2.5.6 EIA-232 Receive Indicator ......................................................................................................... 6
2.5.7 Program Card / CF Indicator ..................................................................................................... 6
2.5.8 Y+R Clearance Indicator ........................................................................................................... 6
2.5.9 Field Check Fail Indicator .......................................................................................................... 6
2.6 OPERATING MODES........................................................................................................................ 6
Section 3 HARDWARE 7
3.1 Enclosure ........................................................................................................................................... 7
3.1.1 Size ............................................................................................................................................ 7
3.1.2 Material ...................................................................................................................................... 7
3.2 Electronics ......................................................................................................................................... 7
3.2.1 Microprocesor Monitor ............................................................................................................... 7
3.2.2 RMS Voltage Measurement ...................................................................................................... 7
3.2.3 Sockets ...................................................................................................................................... 7
3.2.4 Battery ....................................................................................................................................... 7
3.2.5 Field Input Terminals ................................................................................................................. 7
3.2.6 Component Temperature Range ............................................................................................... 7
3.2.7 Printed Circuit Boards ................................................................................................................ 8
3.3 FRONT PANEL & CONNECTORS .................................................................................................... 8
3.4 MS CONNECTORS ........................................................................................................................... 8
3.5 EIA-232 Port ...................................................................................................................................... 8
Section 4 EVENT LOGGING FUNCTIONS 10
4.1 EVENT LOGGING ........................................................................................................................... 10
4.2 Monitor Status Report (CS) ............................................................................................................. 10
4.3 Previous Fault Log (PF) ................................................................................................................... 10
4.4 AC Line Event Log (AC) .................................................................................................................. 11
4.5 Monitor Reset Log (MR)................................................................................................................... 11
4.6 Configuration Change Log (CF) ....................................................................................................... 11
4.7 Signal Sequence Log (SSQ) ............................................................................................................ 11
SPECIFICATION
MALFUNCTION MANAGEMENT UNIT
Section 1
INTRODUCTION
This specification sets forth the minimum requirements for a shelf-mountable, sixteen
channel, solid-state Malfunction Management Unit (MMU). The MMU shall meet, as a
minimum, all applicable sections of the NEMA Standards Publication No. TS2-2016.
Where differences occur, this specification shall govern.
When operating in the Type 16 mode with Port 1 communications enabled, Bit #70 (Spare
Bit #4) of the Type #129 response frame shall be set to indicate an External Watchdog
fault has been detected.
Section 2
DISPLAY FUNCTIONS
The following display functions shall be provided in addition to those required by the NEMA
Standard Section 4.
Section 3
HARDWARE
3.1 ENCLOSURE
3.1.1 SIZE
The MMU shall be compact so as to fit in limited cabinet space. It shall be possible to install
on a shelf that is at least 7" deep. Overall dimensions, including mating connectors and
harness, shall not exceed 10.5" x 4.5" x 11" (H x W x D).
3.1.2 MATERIAL
The enclosure shall be constructed of sheet aluminum with a minimum thickness of 0.062",
and shall be finished with an attractive and durable protective coating. Model, serial number,
and program information shall be permanently displayed on the top surface.
3.2 ELECTRONICS
3.2.1 MICROPROCESOR MONITOR
A microprocessor shall be used for all timing and control functions. Continuing operation of
the microprocessor shall be verified by an independent monitor circuit, which shall force the
OUTPUT RELAY to the de-energized "fault" state and illuminate the DIAGNOSTIC indicator
if a pulse is not received from the microprocessor within a defined period not to exceed 500
ms. Only an MMU Power Failure shall reset the DIAGNOSTIC fault state of the monitor.
3.2.2 RMS VOLTAGE MEASUREMENT
High speed sampling techniques shall be used to determine the true RMS value of the AC
field inputs. Each AC input shall be sampled a minimum of 32 times per line cycle. The RMS
voltage measurement shall be insensitive to phase, frequency, and waveform distortion.
3.2.3 SOCKETS
In the interest of reliability, no IC sockets shall be used.
3.2.4 BATTERY
All user programmed configuration settings shall be stored in an electrically erasable
programmable read-only memory (EEPROM). Designs using a battery to maintain
configuration data shall not be acceptable. If a battery is used, it shall provide power only to
the real time clock.
3.2.5 FIELD INPUT TERMINALS
All 120 VAC field terminal inputs shall provide an input impedance of at least 150K ohms
and be terminated with a discrete resistor having a power dissipation rating of 0.5 Watts or
greater.
3.2.6 COMPONENT TEMPERATURE RANGE
All electrical components used in the MMU except the front panel Status LCD shall be rated
by the component manufacturer to operate over the full NEMA temperature range of -34oC
to +74oC.
SPECIFICATION
MALFUNCTION MANAGEMENT UNIT
3.4 MS CONNECTORS
The MS connectors on the MMU shall have a metallic shell and be attached to the chassis
internally. The connectors shall be mounted on the front of the unit in accordance with the
following: Connector A shall intermate with a MS 3116 22-55 SZ, and Connector B shall
intermate with a MS-3116-16-26S.
In the interest of reliability and repairability, printed circuit board mounted MS connectors
shall not be acceptable. Internal MS harness wire shall be a minimum of AWG #22, 19
strands.
7 DSR*
8 CTS*
9 NC
*Jumper options shall be provided to allow the connection of Pin #4 to be made with Pin
#7, and the connection of Pin #8 to be made with Pin #1 and or Pin #6.
SPECIFICATION
MALFUNCTION MANAGEMENT UNIT
Section 4
EVENT LOGGING FUNCTIONS