SAE/J1850/VPW Transceiver: Integrated Circuits
SAE/J1850/VPW Transceiver: Integrated Circuits
SAE/J1850/VPW Transceiver: Integrated Circuits
AU5780A
SAE/J1850/VPW transceiver
Philips Semiconductors Product data
FEATURES DESCRIPTION
• Supports SAE/J1850 VPW standard for in-vehicle class B The AU5780A is a line transceiver being primarily intended for
in-vehicle multiplex applications. It provides interfacing between a
multiplexing
link controller and the physical bus wire. The device supports the
• Bus speed 10.4 kbps nominal SAE/J1850 VPWM standard with a nominal bus speed of 10.4 kbps.
• Drive capability 32 bus nodes
• Low RFI due to output waveshaping with adjustable slew rate PIN CONFIGURATION
• Direct battery operation with protection against +50V load dump,
jump start and reverse battery
• Bus terminals proof against automotive transients up to
BATT 1 8 GND
–200V/+200V
• Thermal overload protection
• Very low bus idle power consumption TX 2 7 BUS_OUT
R/F 3 6 /LB
• 4X mode (41.6 kbps) reception capability
• ESD protected to 9 KV on bus and battery pins RX 4 5 BUS_IN
• 8-pin SOIC SO8
SL01207
ORDERING INFORMATION
DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG #
SO8: 8-pin plastic small outline package –40 to +125°C AU5780AD SOT96-1
BLOCK DIAGRAM
BATTERY (+12V)
BATT
BUS_OUT
TX 2 TX– OUTPUT 7
BUFFER BUFFER
Rb
Rs
R/F 3
/LB 6 INPUT
Rf
BUFFER
Vcc
Rd
4 5 BUS_IN
INPUT
RX FILTER
VOLTAGE
REFERENCE
AU5780
GND
SL01208
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Philips Semiconductors Product data
PIN DESCRIPTION
SYMBOL PIN DESCRIPTION
BATT 1 Battery supply input (12V nom.)
TX 2 Transmit data input; low: transmitter passive; high: transmitter active
R/F 3 Rise/fall slew rate set input
RX 4 Receive data output; low: active bus condition detected; float/high: passive bus condition detected
BUS_IN 5 Bus line receive input
/LB 6 Loop-back test mode control input; low: loop-back mode; high: normal communication mode
BUS_OUT 7 Bus line transmit output
GND 8 Ground
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Philips Semiconductors Product data
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Philips Semiconductors Product data
CHARACTERISTICS
–40°C < Tamb < +125°C; 6V < VBATT< 16V; V/LB> 3V; 0 < VBUS< +8.5V;
RS= 56.2 kW Rd= 10 kW; Rf = 15 kW; Rb= 10W; 300 W< RL< 1.6 kW;
all voltages are referenced to pin 8 (GND); positive currents flow into the IC; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IBATT.id supply current; bus idle TX low; Note 1 220 µA
IBATT.p supply current; passive state TX low 1.5 mA
IBATT.oc supply current; no load TX high 8 mA
IBATT(SB) supply current; bus output short to battery BUS to VBATT; no IBO 10 mA
current, VTX = high
IBATT.sc supply current; bus short to GND TX high, VBO = 0V 60 mA
Tsd Thermal shutdown 155 170 °C
Thys Thermal shutdown hysteresis 5 15 °C
TDTYCY24 Thermal shutdown, transmit duty cycle, at 24 V Bus load, RLOAD = 300 W, 33 %
CLOAD = 16.55 nF,
VBATT = 24 V, T = 128 ms
TDTYCY20 Thermal shutdown, transmit duty cycle, at 20 V Bus load, RLOAD = 300 W, 45 %
CLOAD = 16.55 nF,
VBATT = 20 V, T = 128 ms
Pins TX and /LB
Vih High level input voltage 6 V < VBATT < 24 V 3 V
VILTX Low level input voltage, TX pin 6 V < VBATT < 24 V 0.9 V
VilB Low level input voltage, LB pin 6V t VBATT t 24 V 0.8 V
Vh Input hysteresis 0.4 V
CTX TX input capacitance Intrinsic to part 5 pf
Iih2 TX high level input current Vi = 5V 12 50 µA
Iih6 /LB high level input current Vi = 5V 4 10 µA
Pin RX
Vol Low level output voltage Io = 1.6 mA 0.4 V
Iih High level output leakage Vo = 5V, BUS_IN = low –10 +10 µA
Irx RX output current Vo = 5V 4 20 mA
Pin BUS_OUT
Volb BUS_OUT in loop-back mode; TX high or low /LB low or floating; 0.1 V
0<VBATT < 24V; RL=1.6kΩ
Vol BUS_OUT voltage; passive TX low or floating; 0.075 V
0<VBATT < 24V; RL=1.6kΩ
Voh BUS_OUT voltage; active TX high; Note 2 7.3 8 V
9V<VBATT < 24V;
300Ω < RL<1.6kΩ;
VohLOWB BUS_OUT voltage; low battery TX high; VBATT – 1.7 8 V
6V<VBATT <9V;
300Ω < RL< 1.6kΩ;
Note 2
– IBO.LIM BUS_OUT source current; bus positive TX high; 9V<VBATT<24V 27 50 mA
0V< Vbus <+6.0V
– IBO.LIMn BUS_OUT source current; bus negative TX high; 9V<VBATT<24V 28 55 mA
–17V< Vbus < 0V
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Philips Semiconductors Product data
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Philips Semiconductors Product data
DYNAMIC CHARACTERISTICS
–40°C < Tamb < +125°C; 9V < VBATT< 16V; V/LB > 3V; 0V <VBUS < +8.5V;
RS = 56.2 kW; Rd= 10 kW; Rf= 15 kW; Rb= 10W; BUS_OUT: 300W < RL< 1.6 kW;
1.7 ms < (RL * CL) < 5.2 ms; 2.2 nF < CL < 16.55 nF; RX: CL < 40pF; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Pins TX, RX, /LB
Pin BUS_OUT
tr, tf BUS_OUT transition times, rise and fall, normal Measured between 11 18 µs
battery 1.5 V and (VBATT – 2.75 V),
9 < VBATT < 16 V,
tr tested at an additional bus load
of RLOAD = 400 W and
CLOAD = 22000 pF
tr_hibatt, BUS_OUT transition times, rise and fall, high Measured between 11 18 µs
tf_hibatt battery 1.5 V and 6.25 V,
16 < VBATT < 24 V,
tr tested at an additional bus load
of RLOAD = 400 W and
CLOAD = 22000 pF
tr_lobatt, BUS_OUT transition times, rise and fall, low Measured between (VBATT (VBATT µs
tf_lobatt battery 1.5 V and 6.25 V, – 4.25) – 4.25)
6 < VBATT < 9 V, / 0.43 / 0.264
tr tested at an additional bus load
of RLOAD = 400 W and
CLOAD = 22000 pF
Isr Bus output current slew rate 6V < VBATT< 16V; RS = 56.2 kW 0.90 2.4 mA/µs
RL= 100W; measured at 30% and
70% of waveform, DC offset
0 to –2V
VdB_limit Bus emissions voltage output 0 V < DC_offset < 1 V, –50 dBV
9 V < VBATT < 24 V,
RL = 500 W, CL = 6 nF
VdB_limit–1 Bus emissions voltage output, negative bus –1 V < DC_offset < 0 V, –50 dBV
offset 9 V < VBATT < 24 V,
RL = 500 W, CL = 6 nF
NI Bus noise isolation from battery 250 kHz < f < 200 MHz 17 dB
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Philips Semiconductors Product data
TDRXON; Bus line to RX propagation delay, normal and Measured at VBUSIN_HIGH or 0.4 1.7 µs
tDRXOFF 4x modes VBUSIN_LOW to RX;
6 < VBATT < 24 V; of
RLOAD = 10 kW to 5V
TDRX_∆ Bus line to RX propagation delay mismatch, tDRXOFF –tDRXON –1.3 +1.3 µs
normal and 4x modes
Pin BATT
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Philips Semiconductors Product data
APPLICATION INFORMATION
VPWO VPWI
Rd
+5V 10NF
10k
Cs
2)
Rs, 56.2 kW, 1%
TX RX /LB R/F
BATT +12V
AU5780A
TRANSCEIVER
GND
BUS_IN BUS_OUT
CL
SL01209
NOTES:
1. Value depends, e.g., on type of bus node. Example: primary node RL=1.5kW , secondary node RL=10.7kW.
2. For connection of /LB there are different options, e.g., connect to VCC or to low-active reset or to a port pin.
3. The value of CL is suggested to be in the range 330 pF < CL < 470 pF.
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Philips Semiconductors Product data
SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
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Philips Semiconductors Product data
Objective data Development This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on
the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors Copyright Philips Electronics North America Corporation 2001
811 East Arques Avenue All rights reserved. Printed in U.S.A.
P.O. Box 3409
Sunnyvale, California 94088–3409 Date of release: 06-01
Telephone 800-234-7381
Document order number: 9397 750 08501
2001 Jun 19 12